USD1100867S1 - Vertical flow control ring - Google Patents
Vertical flow control ringInfo
- Publication number
- USD1100867S1 USD1100867S1 US29/900,995 US202329900995F USD1100867S US D1100867 S1 USD1100867 S1 US D1100867S1 US 202329900995 F US202329900995 F US 202329900995F US D1100867 S USD1100867 S US D1100867S
- Authority
- US
- United States
- Prior art keywords
- flow control
- control ring
- vertical flow
- view
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
Claims (1)
- The ornamental design for a vertical flow control ring as shown and described.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/900,995 USD1100867S1 (en) | 2023-08-28 | 2023-08-28 | Vertical flow control ring |
| TW113300782F TWD237992S (en) | 2023-08-28 | 2024-02-20 | Vertical flow control ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/900,995 USD1100867S1 (en) | 2023-08-28 | 2023-08-28 | Vertical flow control ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1100867S1 true USD1100867S1 (en) | 2025-11-04 |
Family
ID=95605328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/900,995 Active USD1100867S1 (en) | 2023-08-28 | 2023-08-28 | Vertical flow control ring |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1100867S1 (en) |
| TW (1) | TWD237992S (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA152633A (en) * | 1913-01-25 | 1913-12-23 | George Wallace Grant | Dental pliers |
| GB2083147A (en) * | 1980-08-26 | 1982-03-17 | Teves Gmbh Alfred | Brake booster |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1063595S1 (en) * | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1066275S1 (en) * | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1071887S1 (en) * | 2023-01-31 | 2025-04-22 | Valqua, Ltd. | Composite seal for semiconductor manufacturing device |
| USD1082729S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor cover |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD802634S1 (en) | 2015-10-23 | 2017-11-14 | Flow International Corporation | Contour follower for a fluid jet cutting machine |
-
2023
- 2023-08-28 US US29/900,995 patent/USD1100867S1/en active Active
-
2024
- 2024-02-20 TW TW113300782F patent/TWD237992S/en unknown
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA152633A (en) * | 1913-01-25 | 1913-12-23 | George Wallace Grant | Dental pliers |
| GB2083147A (en) * | 1980-08-26 | 1982-03-17 | Teves Gmbh Alfred | Brake booster |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD1051867S1 (en) * | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1066275S1 (en) * | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1082729S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor cover |
| USD1071887S1 (en) * | 2023-01-31 | 2025-04-22 | Valqua, Ltd. | Composite seal for semiconductor manufacturing device |
| USD1063595S1 (en) * | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Non-Patent Citations (2)
| Title |
|---|
| Pool Pump Hose Seal Ring, date posted May 14, 2023, data retrieved from the internet at https://www.amazon.in/11228-11412-L-Shape-Gasket-Replacement/dp/B0C4N8FDJD (Year: 2023). * |
| V-Seals, date posted Jan. 27, 2013, data retrieved from the internet at https://web.archive.org/web/20130127085042/https://www.hitechseals.com/products/v-seals.asp?lang= (Year: 2013). * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD237992S (en) | 2025-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |