[go: up one dir, main page]

USD1070795S1 - Stamp component for transferring microstructure - Google Patents

Stamp component for transferring microstructure Download PDF

Info

Publication number
USD1070795S1
USD1070795S1 US29/835,030 US202229835030F USD1070795S US D1070795 S1 USD1070795 S1 US D1070795S1 US 202229835030 F US202229835030 F US 202229835030F US D1070795 S USD1070795 S US D1070795S
Authority
US
United States
Prior art keywords
stamp component
microstructure
transferring
transferring microstructure
stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/835,030
Inventor
Yoshinori Ogawa
Kazunori Kondo
Nobuaki Tomura
Nobuaki Matsumoto
Akira Sakamoto
Taichi KITAGAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021022438F external-priority patent/JP1718080S/en
Priority claimed from JP2021022443F external-priority patent/JP1724476S/en
Priority claimed from JP2021022455F external-priority patent/JP1724477S/en
Priority claimed from JP2021022439F external-priority patent/JP1718123S/en
Priority claimed from JP2021022445F external-priority patent/JP1727914S/en
Priority claimed from JP2021022437F external-priority patent/JP1724565S/en
Assigned to SHIN-ETSU CHEMICAL CO., LTD. reassignment SHIN-ETSU CHEMICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITAGAWA, Taichi, KONDO, KAZUNORI, MATSUMOTO, NOBUAKI, OGAWA, YOSHINORI, SAKAMOTO, AKIRA, TOMURA, NOBUAKI
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to US29/845,673 priority Critical patent/USD1070796S1/en
Priority to US29/992,624 priority patent/USD1096678S1/en
Publication of USD1070795S1 publication Critical patent/USD1070795S1/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being identical;
FIG. 3 is a left side elevational view thereof, the right side elevational view being identical;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is an enlarged portion view labeled, “6,” in FIG. 1 ; and,
FIG. 7 is an enlarged portion view labeled, “7,” in FIG. 2 .
The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 6 and 7 in FIGS. 1, 2, 6 and 7 and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a stamp component for transferring microstructure, as shown and described.
US29/835,030 2021-10-15 2022-04-15 Stamp component for transferring microstructure Active USD1070795S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/845,673 USD1070796S1 (en) 2021-10-15 2022-07-08 Stamp component for transferring microstructure
US29/992,624 USD1096678S1 (en) 2021-10-15 2025-03-10 Stamp component for transferring microstructure

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
JP2021-022437D 2021-10-15
JP2021-022438D 2021-10-15
JP2021-022443D 2021-10-15
JP2021-022455D 2021-10-15
JP2021022458 2021-10-15
JP2021022439F JP1718123S (en) 2021-10-15 2021-10-15 Stamp parts for transferring microstructures
JP2021022455F JP1724477S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
JP2021022437F JP1724565S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
JP2021022445F JP1727914S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
JP2021-022458D 2021-10-15
JP2021-022457D 2021-10-15
JP2021022457 2021-10-15
JP2021-022445D 2021-10-15
JP2021022438F JP1718080S (en) 2021-10-15 2021-10-15 Stamp parts for transferring microstructures
JP2021022443F JP1724476S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
JP2021-022439D 2021-10-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/845,673 Continuation USD1070796S1 (en) 2021-10-15 2022-07-08 Stamp component for transferring microstructure

Publications (1)

Publication Number Publication Date
USD1070795S1 true USD1070795S1 (en) 2025-04-15

Family

ID=95338535

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/835,030 Active USD1070795S1 (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure
US29/845,673 Active USD1070796S1 (en) 2021-10-15 2022-07-08 Stamp component for transferring microstructure
US29/992,624 Active USD1096678S1 (en) 2021-10-15 2025-03-10 Stamp component for transferring microstructure

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/845,673 Active USD1070796S1 (en) 2021-10-15 2022-07-08 Stamp component for transferring microstructure
US29/992,624 Active USD1096678S1 (en) 2021-10-15 2025-03-10 Stamp component for transferring microstructure

Country Status (1)

Country Link
US (3) USD1070795S1 (en)

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2547487A (en) * 1947-04-10 1951-04-03 Penney Frederic Houghton Separate and individual pressure adhesive pieces with means of application and attachment of same
US3158096A (en) * 1961-09-14 1964-11-24 Parker Brothers Inc Stamp assembly
US3403623A (en) * 1967-03-01 1968-10-01 William R. Blackwood Method and apparatus for marking symbols and other subject matter on charts, graphs and the like
US4205548A (en) * 1978-07-03 1980-06-03 Plessey, Inc. Stamping tools
USD290469S (en) * 1984-09-28 1987-06-23 Boehringer Laboratories Ink stamp
US6143412A (en) * 1997-02-10 2000-11-07 President And Fellows Of Harvard College Fabrication of carbon microstructures
US20030068519A1 (en) * 2001-09-28 2003-04-10 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
JP2008227107A (en) 2007-03-12 2008-09-25 Yokohama National Univ Method for moving microstructure
US20080261039A1 (en) * 2004-10-14 2008-10-23 Maiko Tanaka Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
TWD147913S (en) 2011-01-31 2012-07-01 日本電波工業股份有限公司 Crystal unit
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD816763S1 (en) * 2016-09-29 2018-05-01 Tsukineko Co., Ltd. Combined stamp pad and case
USD831736S1 (en) * 2017-06-22 2018-10-23 Sun Same Enterprises Co., Ltd. Die plate for printing plate of stamp
USD831737S1 (en) * 2017-06-22 2018-10-23 Sun Same Enterprises Co., Ltd. Die plate for printing plate of stamp
USD834088S1 (en) * 2017-01-26 2018-11-20 Sun Same Enterprises Co., Ltd. Ink stamp
WO2019065398A1 (en) 2017-09-29 2019-04-04 信越化学工業株式会社 Uv curable silicone adhesive composition and cured product thereof
US20190112186A1 (en) * 2016-04-08 2019-04-18 Global Frontier Center for Multiscale Energy Hierarchical microstructure, mold for manufacturing same, and method for manufacturing same mold
TWD199840S (en) 2019-01-14 2019-09-21 晶元光電股份有限公司 Power semiconductor device
US20190299266A1 (en) * 2018-03-28 2019-10-03 Csem Centre Suisse D'electronique Et De Microtechnique Sa Method for producing a metal stamp for embossing a nano-and/or microstructure on a metal device as well as uses thereof and devices made therewith
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device
WO2020166184A1 (en) 2019-02-12 2020-08-20 信越化学工業株式会社 Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component
TWD209201S (en) 2019-10-25 2021-01-01 日商昭和電工材料股份有限公司 Film for manufacturing semiconductor device
TWD213602S (en) 2021-03-09 2021-08-21 台灣脈動股份有限公司 Ethernet control automation technology control card circuit board
US20220221732A1 (en) * 2019-05-30 2022-07-14 Microtau Ip Pty Ltd Systems and methods for fabricating microstructures
USD960968S1 (en) * 2020-09-11 2022-08-16 Da Han Industrial Co., Ltd. Marking press
US20220315418A1 (en) * 2019-08-27 2022-10-06 Shin-Etsu Chemical Co., Ltd. Method for transferring microstructures, and method for mounting microstructures
US20240047243A1 (en) * 2020-12-24 2024-02-08 Shin-Etsu Chemical Co., Ltd. Microstructure-transfer stamp component

Patent Citations (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2547487A (en) * 1947-04-10 1951-04-03 Penney Frederic Houghton Separate and individual pressure adhesive pieces with means of application and attachment of same
US3158096A (en) * 1961-09-14 1964-11-24 Parker Brothers Inc Stamp assembly
US3403623A (en) * 1967-03-01 1968-10-01 William R. Blackwood Method and apparatus for marking symbols and other subject matter on charts, graphs and the like
US4205548A (en) * 1978-07-03 1980-06-03 Plessey, Inc. Stamping tools
USD290469S (en) * 1984-09-28 1987-06-23 Boehringer Laboratories Ink stamp
US6143412A (en) * 1997-02-10 2000-11-07 President And Fellows Of Harvard College Fabrication of carbon microstructures
US20030068519A1 (en) * 2001-09-28 2003-04-10 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US20080261039A1 (en) * 2004-10-14 2008-10-23 Maiko Tanaka Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
JP2008227107A (en) 2007-03-12 2008-09-25 Yokohama National Univ Method for moving microstructure
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD690278S1 (en) * 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) * 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
TWD147913S (en) 2011-01-31 2012-07-01 日本電波工業股份有限公司 Crystal unit
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
US20190112186A1 (en) * 2016-04-08 2019-04-18 Global Frontier Center for Multiscale Energy Hierarchical microstructure, mold for manufacturing same, and method for manufacturing same mold
USD816763S1 (en) * 2016-09-29 2018-05-01 Tsukineko Co., Ltd. Combined stamp pad and case
USD834088S1 (en) * 2017-01-26 2018-11-20 Sun Same Enterprises Co., Ltd. Ink stamp
USD831736S1 (en) * 2017-06-22 2018-10-23 Sun Same Enterprises Co., Ltd. Die plate for printing plate of stamp
USD831737S1 (en) * 2017-06-22 2018-10-23 Sun Same Enterprises Co., Ltd. Die plate for printing plate of stamp
WO2019065398A1 (en) 2017-09-29 2019-04-04 信越化学工業株式会社 Uv curable silicone adhesive composition and cured product thereof
US20200270481A1 (en) 2017-09-29 2020-08-27 Shin-Etsu Chemical Co., Ltd. Uv curable silicone adhesive composition and cured product thereof
US20190299266A1 (en) * 2018-03-28 2019-10-03 Csem Centre Suisse D'electronique Et De Microtechnique Sa Method for producing a metal stamp for embossing a nano-and/or microstructure on a metal device as well as uses thereof and devices made therewith
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device
TWD199840S (en) 2019-01-14 2019-09-21 晶元光電股份有限公司 Power semiconductor device
US20220124949A1 (en) * 2019-02-12 2022-04-21 Shin-Etsu Chemical Co., Ltd. Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
WO2020166184A1 (en) 2019-02-12 2020-08-20 信越化学工業株式会社 Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component
JP2020129638A (en) 2019-02-12 2020-08-27 信越化学工業株式会社 Microstructure transfer device, stamp head unit, microstructure transfer stamp part, and microstructure integrated part transfer method
US20220221732A1 (en) * 2019-05-30 2022-07-14 Microtau Ip Pty Ltd Systems and methods for fabricating microstructures
US20220315418A1 (en) * 2019-08-27 2022-10-06 Shin-Etsu Chemical Co., Ltd. Method for transferring microstructures, and method for mounting microstructures
TWD209201S (en) 2019-10-25 2021-01-01 日商昭和電工材料股份有限公司 Film for manufacturing semiconductor device
USD960968S1 (en) * 2020-09-11 2022-08-16 Da Han Industrial Co., Ltd. Marking press
US20240047243A1 (en) * 2020-12-24 2024-02-08 Shin-Etsu Chemical Co., Ltd. Microstructure-transfer stamp component
TWD213602S (en) 2021-03-09 2021-08-21 台灣脈動股份有限公司 Ethernet control automation technology control card circuit board

Non-Patent Citations (51)

* Cited by examiner, † Cited by third party
Title
3D integration of heterogeneous MEMS structures by stamping transfer,https://www.semanticscholar.org/paper/3D-integration-of-heterogeneous-MEMS-structures-by-Onoe-Iwase/0dd8d4632f3944b5a2ee0282c379672c8b6259a2, 2024. (Year: 2024). *
Apr. 12, 2022 Notification of Reasons for Refusal issued in Japanese Patent Application No. 2021-022455.
Apr. 12, 2022 Notification of Reasons for Refusal issued in Japanese Patent Application No. 2021-022457.
Apr. 12, 2022 Notification of Reasons for Refusal issued in Japanese Patent Application No. 2021-022458.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301229.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301381.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301382.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301385.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301386.
Apr. 29, 2023 Search Report issued in Taiwanese Application No. 112301388.
Apr. 29, 2023 Search Report issued in Taiwanese Patent Application No. 112301231.
Apr. 4, 2023 Decision on Appeal issued in Japanese Patent Application No. 2021-022457.
Apr. 4, 2023 Decision on Appeal issued in Japanese Patent Application No. 2021-022458.
Dec. 20, 2022 Office Action issued in Japanese Patent Application No. 2021-022457.
Dec. 20, 2022 Office Action issued in Japanese Patent Application No. 2021-022458.
Dec. 22, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 112301384.
English Translation of Abstract of JP 2013-237583 A.
Feb. 19, 2024 Decision of Refusal issued in Taiwanese Patent Application No. 111305395.
Jan. 25, 2024 Office Action issued in Israeli Patent Application No. 68592.
Jan. 25, 2024 Office Action issued in Israeli Patent Application Nos. 68593 and 68594.
Jan. 26, 2025 Decision on Appeal issued in Israeli Patent Application Nos. 68593 and 68594.
Jul. 12, 2022 Decision of Refusal issued in Japanese Patent Application No. 2021-022457.
Jul. 12, 2022 Decision of Refusal issued in Japanese Patent Application No. 2021-022458.
Jul. 23, 2024 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864.
Jul. 23, 2024 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864D02.
Jun. 12, 2024 Office Action and Search Report issued in Taiwanese Patent Application No. 112304689.
Jun. 18, 2024 Office Action and Search Report issued in Taiwanese Patent Application No. 112304690.
Jun. 27, 2022 Office Action and Search Report issued in Taiwanese Patent Application No. 111301800D05.
Jun. 27, 2022 Office Action and Search Report issued in Taiwanese Patent Application No. 111301800D06.
Jun. 27, 2022 Office Action and Search Report issued in Taiwanese Patent Application No. 111301800D07.
Jun. 27, 2022 Search Report issued in Taiwanese Patent Application No. 111301800.
Jun. 27, 2022 Search Report issued in Taiwanese Patent Application No. 111301800D01.
Jun. 27, 2022 Search Report issued in Taiwanese Patent Application No. 111301800D02.
Jun. 27, 2022 Search Report issued in Taiwanese Patent Application No. 111301800D03.
Jun. 27, 2022 Search Report issued in Taiwanese Patent Application No. 111301800D04.
Jun. 28, 2023 Search Report issued in Taiwanese Patent Application No. 111304906.
Jun. 30, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864.
Jun. 30, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864D01.
Jun. 30, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864D02.
Jun. 30, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 111304864D03.
Mar. 20, 2024 Office Action issued in Israeli Patent Application No. 68593.
Mar. 20, 2024 Office Action issued in Israeli Patent Application No. 68594.
Mar. 3, 2023 Decision of Refusal issued in Korean Patent Application No. 30-2022-0014838(M007).
May 6, 2024 Office Action issued in Israeli Patent Application No. 68593.
May 6, 2024 Office Action issued in Israeli Patent Application No. 68594.
Nov. 4, 2022 Office Action issued in Korean Patent Application No. 2022-0014838(M007).
Nov. 4, 2022 Office Action issued in Korean Patent Application No. 2022-0014838(M008).
Oct. 30, 20214 Decision of Refusal issued in Taiwanese Patent Application No. 112304689.
Oct. 30, 20214 Decision of Refusal issued in Taiwanese Patent Application No. 112304690.
Sep. 20, 2023 Office Action issued in Israeli Patent Application Nos. 68592, 68593 and 68594.
Sep. 28, 2023 Office Action and Search Report issued in Taiwanese Patent Application No. 111305395.

Also Published As

Publication number Publication date
USD1070796S1 (en) 2025-04-15
USD1096678S1 (en) 2025-10-07

Similar Documents

Publication Publication Date Title
USD903639S1 (en) Earphone
USD897322S1 (en) Earphone
USD897998S1 (en) Earphones
USD896207S1 (en) Earphone
USD924852S1 (en) Earphones
USD914646S1 (en) Earphone
USD924848S1 (en) Earphone
USD924849S1 (en) Earphone
USD918579S1 (en) Case for earphones
USD968368S1 (en) Earphone
USD914647S1 (en) Earphone
USD956720S1 (en) Earphone
USD975839S1 (en) Airway adapter
USD936037S1 (en) Earphone
USD941805S1 (en) Earphone
USD942529S1 (en) Tripod
USD892048S1 (en) Adapter
USD922987S1 (en) Ear tip with three layer sleeves
USD957373S1 (en) Prompter
USD976871S1 (en) Earphone
USD907011S1 (en) Earphones
USD968366S1 (en) Headphones
USD1012844S1 (en) Charging station
USD899492S1 (en) Tripod
USD929971S1 (en) Earphone

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY