USD1013746S1 - Laser processing machine - Google Patents
Laser processing machine Download PDFInfo
- Publication number
- USD1013746S1 USD1013746S1 US29/760,852 US202029760852F USD1013746S US D1013746 S1 USD1013746 S1 US D1013746S1 US 202029760852 F US202029760852 F US 202029760852F US D1013746 S USD1013746 S US D1013746S
- Authority
- US
- United States
- Prior art keywords
- laser processing
- processing machine
- view
- lines
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The dash dot dash broken lines define the bounds of the claimed design and form no part thereof.
The broken lines depict portions of a laser processing machine that form no part of the claimed design.
Claims (1)
- The ornamental design for a laser processing machine, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-011297D | 2020-06-08 | ||
| JPD2020-11297F JP1682061S (en) | 2020-06-08 | 2020-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1013746S1 true USD1013746S1 (en) | 2024-02-06 |
Family
ID=75158616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/760,852 Active USD1013746S1 (en) | 2020-06-08 | 2020-12-04 | Laser processing machine |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1013746S1 (en) |
| JP (1) | JP1682061S (en) |
| TW (1) | TWD218103S (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1053916S1 (en) * | 2023-02-16 | 2024-12-10 | Asteroid Trading Limited | Laser cutter |
| USD1068876S1 (en) * | 2024-11-02 | 2025-04-01 | Shanghai Hengsi electronic Commerce Co., LTD | Laser engraver |
| USD1077873S1 (en) * | 2023-09-15 | 2025-06-03 | Shenzhen Xiyang Technology Co., Ltd. | Miniature engraving machine |
| USD1081736S1 (en) * | 2022-03-30 | 2025-07-01 | Shenzhen Creality 3D Technology Co., Ltd. | Laser engraving device |
| USD1108506S1 (en) * | 2024-08-29 | 2026-01-06 | Shanghai Oceania International Co., Ltd. | Laser engraving machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD622760S1 (en) * | 2008-03-19 | 2010-08-31 | Seiko Epson Corporation | Printer |
| USD730978S1 (en) * | 2013-04-15 | 2015-06-02 | Seiko Epson Corporation | Printer |
| USD798349S1 (en) * | 2016-06-08 | 2017-09-26 | Shenzhen Triumph Industrial Co., LTD | Laser engraving machine |
| USD802632S1 (en) * | 2016-06-08 | 2017-11-14 | Shenzhen Triumph Industrial Co., LTD | Laser engraving machine |
| JP1629891S (en) | 2018-10-31 | 2019-04-22 | ||
| JP1629892S (en) | 2018-10-31 | 2019-04-22 | ||
| USD917585S1 (en) * | 2018-10-31 | 2021-04-27 | Hamamatsu Photonics K.K. | Wafer processing machine for producing semiconductors |
| USD920398S1 (en) * | 2018-10-31 | 2021-05-25 | Hamamatsu Photonics K.K. | Laser processing machine |
-
2020
- 2020-06-08 JP JPD2020-11297F patent/JP1682061S/ja active Active
- 2020-12-04 US US29/760,852 patent/USD1013746S1/en active Active
- 2020-12-07 TW TW109306874F patent/TWD218103S/en unknown
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD622760S1 (en) * | 2008-03-19 | 2010-08-31 | Seiko Epson Corporation | Printer |
| USD730978S1 (en) * | 2013-04-15 | 2015-06-02 | Seiko Epson Corporation | Printer |
| USD798349S1 (en) * | 2016-06-08 | 2017-09-26 | Shenzhen Triumph Industrial Co., LTD | Laser engraving machine |
| USD802632S1 (en) * | 2016-06-08 | 2017-11-14 | Shenzhen Triumph Industrial Co., LTD | Laser engraving machine |
| JP1629891S (en) | 2018-10-31 | 2019-04-22 | ||
| JP1629892S (en) | 2018-10-31 | 2019-04-22 | ||
| USD917585S1 (en) * | 2018-10-31 | 2021-04-27 | Hamamatsu Photonics K.K. | Wafer processing machine for producing semiconductors |
| USD918276S1 (en) * | 2018-10-31 | 2021-05-04 | Hamamatsu Photonics K.K. | Laser processing machine |
| USD920398S1 (en) * | 2018-10-31 | 2021-05-25 | Hamamatsu Photonics K.K. | Laser processing machine |
| USD920397S1 (en) * | 2018-10-31 | 2021-05-25 | Hamamatsu Photonics K.K. | Laser processing machine |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1081736S1 (en) * | 2022-03-30 | 2025-07-01 | Shenzhen Creality 3D Technology Co., Ltd. | Laser engraving device |
| USD1053916S1 (en) * | 2023-02-16 | 2024-12-10 | Asteroid Trading Limited | Laser cutter |
| USD1077873S1 (en) * | 2023-09-15 | 2025-06-03 | Shenzhen Xiyang Technology Co., Ltd. | Miniature engraving machine |
| USD1108506S1 (en) * | 2024-08-29 | 2026-01-06 | Shanghai Oceania International Co., Ltd. | Laser engraving machine |
| USD1068876S1 (en) * | 2024-11-02 | 2025-04-01 | Shanghai Hengsi electronic Commerce Co., LTD | Laser engraver |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1682061S (en) | 2021-03-29 |
| TWD218103S (en) | 2022-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |