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USD1013746S1 - Laser processing machine - Google Patents

Laser processing machine Download PDF

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Publication number
USD1013746S1
USD1013746S1 US29/760,852 US202029760852F USD1013746S US D1013746 S1 USD1013746 S1 US D1013746S1 US 202029760852 F US202029760852 F US 202029760852F US D1013746 S USD1013746 S US D1013746S
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US
United States
Prior art keywords
laser processing
processing machine
view
lines
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/760,852
Inventor
Junji Okuma
Takeshi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Assigned to HAMAMATSU PHOTONICS K.K. reassignment HAMAMATSU PHOTONICS K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKUMA, JUNJI, SAKAMOTO, TAKESHI
Application granted granted Critical
Publication of USD1013746S1 publication Critical patent/USD1013746S1/en
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Description

FIG. 1 is a front view of a laser processing machine of the present invention;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, top and left side perspective view thereof;
FIG. 8 is a rear, bottom and right side perspective view thereof;
FIG. 9 is a sectional view thereof with inner mechanism is omitted taken along the line 9-9 in FIG. 3 ;
FIG. 10 is an enlarged sectional view thereof with inner mechanism is omitted taken along the line 10-10 in FIG. 3 of the portion defined by the lines 1001-1001 in FIGS. 3 and 1002-1002 in FIG. 6 ; and,
FIG. 11 is an enlarged view thereof defined by the lines 1101-1101 and 1102-1102 in FIG. 6 .
The dash dot dash broken lines define the bounds of the claimed design and form no part thereof.
The broken lines depict portions of a laser processing machine that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a laser processing machine, as shown and described.
US29/760,852 2020-06-08 2020-12-04 Laser processing machine Active USD1013746S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-011297D 2020-06-08
JPD2020-11297F JP1682061S (en) 2020-06-08 2020-06-08

Publications (1)

Publication Number Publication Date
USD1013746S1 true USD1013746S1 (en) 2024-02-06

Family

ID=75158616

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/760,852 Active USD1013746S1 (en) 2020-06-08 2020-12-04 Laser processing machine

Country Status (3)

Country Link
US (1) USD1013746S1 (en)
JP (1) JP1682061S (en)
TW (1) TWD218103S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053916S1 (en) * 2023-02-16 2024-12-10 Asteroid Trading Limited Laser cutter
USD1068876S1 (en) * 2024-11-02 2025-04-01 Shanghai Hengsi electronic Commerce Co., LTD Laser engraver
USD1077873S1 (en) * 2023-09-15 2025-06-03 Shenzhen Xiyang Technology Co., Ltd. Miniature engraving machine
USD1081736S1 (en) * 2022-03-30 2025-07-01 Shenzhen Creality 3D Technology Co., Ltd. Laser engraving device
USD1108506S1 (en) * 2024-08-29 2026-01-06 Shanghai Oceania International Co., Ltd. Laser engraving machine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD622760S1 (en) * 2008-03-19 2010-08-31 Seiko Epson Corporation Printer
USD730978S1 (en) * 2013-04-15 2015-06-02 Seiko Epson Corporation Printer
USD798349S1 (en) * 2016-06-08 2017-09-26 Shenzhen Triumph Industrial Co., LTD Laser engraving machine
USD802632S1 (en) * 2016-06-08 2017-11-14 Shenzhen Triumph Industrial Co., LTD Laser engraving machine
JP1629891S (en) 2018-10-31 2019-04-22
JP1629892S (en) 2018-10-31 2019-04-22
USD917585S1 (en) * 2018-10-31 2021-04-27 Hamamatsu Photonics K.K. Wafer processing machine for producing semiconductors
USD920398S1 (en) * 2018-10-31 2021-05-25 Hamamatsu Photonics K.K. Laser processing machine

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD622760S1 (en) * 2008-03-19 2010-08-31 Seiko Epson Corporation Printer
USD730978S1 (en) * 2013-04-15 2015-06-02 Seiko Epson Corporation Printer
USD798349S1 (en) * 2016-06-08 2017-09-26 Shenzhen Triumph Industrial Co., LTD Laser engraving machine
USD802632S1 (en) * 2016-06-08 2017-11-14 Shenzhen Triumph Industrial Co., LTD Laser engraving machine
JP1629891S (en) 2018-10-31 2019-04-22
JP1629892S (en) 2018-10-31 2019-04-22
USD917585S1 (en) * 2018-10-31 2021-04-27 Hamamatsu Photonics K.K. Wafer processing machine for producing semiconductors
USD918276S1 (en) * 2018-10-31 2021-05-04 Hamamatsu Photonics K.K. Laser processing machine
USD920398S1 (en) * 2018-10-31 2021-05-25 Hamamatsu Photonics K.K. Laser processing machine
USD920397S1 (en) * 2018-10-31 2021-05-25 Hamamatsu Photonics K.K. Laser processing machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1081736S1 (en) * 2022-03-30 2025-07-01 Shenzhen Creality 3D Technology Co., Ltd. Laser engraving device
USD1053916S1 (en) * 2023-02-16 2024-12-10 Asteroid Trading Limited Laser cutter
USD1077873S1 (en) * 2023-09-15 2025-06-03 Shenzhen Xiyang Technology Co., Ltd. Miniature engraving machine
USD1108506S1 (en) * 2024-08-29 2026-01-06 Shanghai Oceania International Co., Ltd. Laser engraving machine
USD1068876S1 (en) * 2024-11-02 2025-04-01 Shanghai Hengsi electronic Commerce Co., LTD Laser engraver

Also Published As

Publication number Publication date
JP1682061S (en) 2021-03-29
TWD218103S (en) 2022-04-11

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