US902755A - Electrolyte for electroplating. - Google Patents
Electrolyte for electroplating. Download PDFInfo
- Publication number
- US902755A US902755A US36387907A US1907363879A US902755A US 902755 A US902755 A US 902755A US 36387907 A US36387907 A US 36387907A US 1907363879 A US1907363879 A US 1907363879A US 902755 A US902755 A US 902755A
- Authority
- US
- United States
- Prior art keywords
- electrolyte
- alcohol
- aluminum
- metal
- chlorid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003792 electrolyte Substances 0.000 title description 18
- 238000009713 electroplating Methods 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 101100028130 Danio rerio ora1 gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011928 denatured alcohol Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Definitions
- This invention rolalvs to improvements in electrolytes f r i-leoiropluiing, and the object in ⁇ ltW is the hir ng and facilitatcan of eluclroplating pun-oases.
- the object in ⁇ ltW is the hir ng and facilitatcan of eluclroplating pun-oases.
- Iii-carryingout my invention, .5 employ an electrolyic comprising a. solution of a chlorid of a. nn-tal in alcohol, ll alcohol being either ccninuerr-ial ecliyia ilnl. or lnethylalcohol, or denatured alcohol.
- ()ne way of preparing an electrolyte is lhe dissolving of a chlorid of a metal to be plated in the alcohol, and this may be iwil' sidered the normal or prrlcrrul way of tho pre )aratiou of the ci'.* .”i1'ui l(. it if. (he ⁇ unerlying principle of lhrp24 .l inwntiori to restrict the evolution uli hydrogen by restricting the percentag oi ⁇ Yulli in the electrolyte to that small amount of water which exists in cornn'iercial alcohol, any about five per cent. But even a few per cent. more will make little or no practical difference.
- aqueous baths which are at present commonly used have a complicated com p .tion which must be kept up by regeneration. and the current densities er square foot of surface to be plated must we strictly maintained. In the present invention it is not necessary to adhere strictly to certain current densities. No heating of the bath is required.
- the presentimproved method or process cannoi' oc used for silver and lead. [tmight be used for platinum and zinc, but in the case of these two last mentioned metals, I should. prefer the improvedaqueous baths. As far as platinum is concerned the anode does not dissolve and the addition of platinum chlorid must be kept up. Also the platinum deposited is darker than can be obtained otherwise. As to zinc, the same results, or perhaps even better, can be obtained with cheap aqueous solutions. I
- the present method ofler s a variety of Ways of de positing different metals as alloys with each other. above each other, or side by'side in the seine both. This can be done by the addition of new chlorfds, or it can be done moved entirely from the bat entirely 1) suitable manipulation of the anodes an by stopping or starting circulation in the electrolyte. Certain anodes may be moved, or lifted iartiall ,,or re' ing a rod of a different metal as anode close to a certain point of the cathode, 1t 18 POSSI- ble to deposit a different metal on this part of the cathode, while at other places other metals are deposited. In this way copper and zinc may be deposited simultaneously and so also copper and brass; and zinc,
- nickel, cop er and tin may form a variety of colors on t e same cathode.
- the film forms itself immediately, if the aluminum is in air or in water. -This film prevents the electro deposited metal from adhering-to the aluminum. In making the aluminum for a few minutes the anode, I dissolve this film, and it does not form again in alcohol, and therefore when the aluminum becomes the cathode again, the electro deposited metal strikes upon real, bare aluminum and adheres to it.
- An electro-plating bath comprising a solution of a chlorid of a plating metal in alcohol.
- An electro-plating bath comprising a solution of chlorid of a plurality of plating metals in alcohol.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
'ing oi the "airy irr ro Marian, ora1'cnMoNn,vIaGINIA ELECTEOLYTE FOB ELECTROPLATING.
Specification 01 Letters Patent.
latented Nov. a, 1908.
hppimation filed Marsh 22, 1001. Serial No. 863,879.
ful Improvements in. Electrolytes for Electroplating; and I. do hereby declare the following to be a full, clear. and exact descri r ti' n of the invention, su h as will. enable others skilled in the art lo which it upper tuins to make and use ih'e same.
This invention rolalvs to improvements in electrolytes f r i-leoiropluiing, and the object in \ltW is the hir ng and facilitatcan of eluclroplating pun-oases. in the (:arr 'iw i esses herelmon aqueous hail like or lhe cathode ha lurbingg clcmciu lic a tendency repb-iing proc filii lfljyl of an Hon of h drogen at a: hy'ilri ma n the; rim, :siled metal poi? ons, or own coon; this olistaclc and to a w y'hl' met at the cathode arious imp-"ore! baihs are used. All of lhcm have a inoee or less complicated composition, which mus; be lrcpl up by regeneration, and als the current density per square foot oi cailm-ilc surface must be carefully lffiglllillwll l ix-ipir-miy the temperature of the bail: must he l-iiegn 'within certain limits.
Iii-carryingout my invention, .5 employ an electrolyic comprising a. solution of a chlorid of a. nn-tal in alcohol, ll alcohol being either ccninuerr-ial ecliyia ilnl. or lnethylalcohol, or denatured alcohol.
()ne way of preparing an electrolyte is lhe dissolving of a chlorid of a metal to be plated in the alcohol, and this may be iwil' sidered the normal or prrlcrrul way of tho pre )aratiou of the ci'.* ."i1'ui l(. it if. (he \unerlying principle of lhrp24 .l inwntiori to restrict the evolution uli hydrogen by restricting the percentag oi \Yulli in the electrolyte to that small amount of water which exists in cornn'iercial alcohol, any about five per cent. But even a few per cent. more will make little or no practical difference. and therefore a second way of preparing lhc electrolyte is possible and consists of adding one or several per cent; of pure, consent: LL l hydrochloric acid to commercial alcohol and starting electrolysis, usinq the plating metal as an anode. Chlorid oi the plating metal is thus formed in the bath, and the process is a: the most dis.
carried out by the use of the plating metal itself as the anode without a chlorid of metal being in the first instance dissolved in the alcohol. In this Way, alcohol, with the addition of a small amount of pure hydrochloric acid, forms directly, While cold and without further additions, an excellent electrolyte for a number of metals, although not for all metals. Gold, copper, nickel, cobalt, tin, and iron can be deposited in this way to advantage, and in a dense, bright and metallic form.
It is obvious from the foregoing that whether the chlorid of metal isdissolved directly in alcohol in the first instance, or is produced at the anode in the electrolyte, the resultant electrolyte comprising a chlorid of a metal and alcohol is comprehended by the present invention.
From two and one'half to three volts is required for overcoming the resistance of the bath and carrying out the present improved electroplating process by the use of the electrolyte as above described.
When compared with the present welllanown aqueous baths, the readiness with which the present improved electrolyte may be produced and used will be more fully appreciated. The aqueous baths which are at present commonly used have a complicated com p .tion which must be kept up by regeneration. and the current densities er square foot of surface to be plated must we strictly maintained. In the present invention it is not necessary to adhere strictly to certain current densities. No heating of the bath is required.
The presentimproved method or process cannoi' oc used for silver and lead. [tmight be used for platinum and zinc, but in the case of these two last mentioned metals, I should. prefer the improvedaqueous baths. As far as platinum is concerned the anode does not dissolve and the addition of platinum chlorid must be kept up. Also the platinum deposited is darker than can be obtained otherwise. As to zinc, the same results, or perhaps even better, can be obtained with cheap aqueous solutions. I
As the present improved electrolyte is of similar nature for all metals used, the present method oflers a variety of Ways of de positing different metals as alloys with each other. above each other, or side by'side in the seine both. This can be done by the addition of new chlorfds, or it can be done moved entirely from the bat entirely 1) suitable manipulation of the anodes an by stopping or starting circulation in the electrolyte. Certain anodes may be moved, or lifted iartiall ,,or re' ing a rod of a different metal as anode close to a certain point of the cathode, 1t 18 POSSI- ble to deposit a different metal on this part of the cathode, while at other places other metals are deposited. In this way copper and zinc may be deposited simultaneously and so also copper and brass; and zinc,
nickel, cop er and tin may form a variety of colors on t e same cathode.
I have been .unable to deposit aluminum by itself, according to the present improved method or rocess. However, when other metals are eposited, aluminum in the electrolyte will make its appearance at the cathode, and in this case it either changes the looks or character of thedeposit, or it appears in films or patches of aluminum metal. These patches have a tendency to be blackish, but show the color of aluminum when polished.
Another advantage of the present improved electrolyte for electroplatin same is found in connection with p ating upon aluminum, as it has been heretofore practically impossible to electroplate aluminum in the same way as other metals are electrotyped, and various special methods have been proposed to plate aluminum with other metals. With my improved method, aluminum may be plated upon like any other metal, and in the same way. It is only necessary, when starting, to reverse the poles for a few minutes, thus making the aluminum 1 cathode for a few minutes the anode, and then the poles are reversed again and the plating is carried on in the usual manner. The theory of this form of plating on the aluminum is as follows :Alum1num is always covered with a thin film of an oxid. When the surface is scraped, or the metal is cut with a knife, the film forms itself immediately, if the aluminum is in air or in water. -This film prevents the electro deposited metal from adhering-to the aluminum. In making the aluminum for a few minutes the anode, I dissolve this film, and it does not form again in alcohol, and therefore when the aluminum becomes the cathode again, the electro deposited metal strikes upon real, bare aluminum and adheres to it.
What I claim is, a
1. An electro-plating bath, comprising a solution of a chlorid of a plating metal in alcohol.
2. An electro-plating bath comprising a solution of chlorid of a plurality of plating metals in alcohol.
3. In an electrolyte, a solution of chlorid *of copper in alcohol. the
4. In an electrolyte, a solution of chlorid of copper and a chlorid of another metal in alcoho 5. In an electrolyte, a solution of chlorid of copper and chloride of other metals in alcohol.
In testimony whereof I afiix my signature in presence of two witnesses.
OTTO MEYER.
Witnesses:
E. V. FARINHOLT, O. C. RUSSELL.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36387907A US902755A (en) | 1907-03-22 | 1907-03-22 | Electrolyte for electroplating. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36387907A US902755A (en) | 1907-03-22 | 1907-03-22 | Electrolyte for electroplating. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US902755A true US902755A (en) | 1908-11-03 |
Family
ID=2971180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US36387907A Expired - Lifetime US902755A (en) | 1907-03-22 | 1907-03-22 | Electrolyte for electroplating. |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US902755A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2510128A (en) * | 1945-09-24 | 1950-06-06 | Tung Sol Lamp Works Inc | Method of plating metals with zirconium |
| US2521082A (en) * | 1947-07-09 | 1950-09-05 | Burgess Battery Co | Electrolytic production of silver chloride |
| US2713726A (en) * | 1948-09-23 | 1955-07-26 | Northrop Aircraft Inc | Bubble level condition indicator |
| US2905859A (en) * | 1953-10-27 | 1959-09-22 | Raytheon Co | Traveling wave electron discharge devices |
| US2951018A (en) * | 1945-10-29 | 1960-08-30 | Glenn T Seaborg | Electrodeposition of neptunium |
| US3281340A (en) * | 1961-10-19 | 1966-10-25 | London Melvyn | Process of preparing lithographic plates |
| US3335072A (en) * | 1964-06-01 | 1967-08-08 | Martin Marietta Corp | Process of preparing lithographic plates |
| US3772170A (en) * | 1966-10-31 | 1973-11-13 | N Bharucha | Electrodeposition of chromium |
-
1907
- 1907-03-22 US US36387907A patent/US902755A/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2510128A (en) * | 1945-09-24 | 1950-06-06 | Tung Sol Lamp Works Inc | Method of plating metals with zirconium |
| US2951018A (en) * | 1945-10-29 | 1960-08-30 | Glenn T Seaborg | Electrodeposition of neptunium |
| US2521082A (en) * | 1947-07-09 | 1950-09-05 | Burgess Battery Co | Electrolytic production of silver chloride |
| US2713726A (en) * | 1948-09-23 | 1955-07-26 | Northrop Aircraft Inc | Bubble level condition indicator |
| US2905859A (en) * | 1953-10-27 | 1959-09-22 | Raytheon Co | Traveling wave electron discharge devices |
| US3281340A (en) * | 1961-10-19 | 1966-10-25 | London Melvyn | Process of preparing lithographic plates |
| US3335072A (en) * | 1964-06-01 | 1967-08-08 | Martin Marietta Corp | Process of preparing lithographic plates |
| US3772170A (en) * | 1966-10-31 | 1973-11-13 | N Bharucha | Electrodeposition of chromium |
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