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US8621925B2 - Device and method for producing a device - Google Patents

Device and method for producing a device Download PDF

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Publication number
US8621925B2
US8621925B2 US12/998,800 US99880009A US8621925B2 US 8621925 B2 US8621925 B2 US 8621925B2 US 99880009 A US99880009 A US 99880009A US 8621925 B2 US8621925 B2 US 8621925B2
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United States
Prior art keywords
housing
structural element
carrier element
intermediate housing
region
Prior art date
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US12/998,800
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US20110290016A1 (en
Inventor
Volker Dietrich
Martin Schuerer
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Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
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Publication date
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Assigned to ROBERT BOSCH GMBH reassignment ROBERT BOSCH GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHUERER, MARTIN, DIETRICH, VOLKER
Publication of US20110290016A1 publication Critical patent/US20110290016A1/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Definitions

  • the present invention relates to a sensor device.
  • Such sensor devices are generally known. From published German patent application document DE 10 2005 040 781 A1, for example, a sensor device is known which has a molded housing having a micromechanical sensor element and a carrier element, the sensor element being situated in a hollow space in the molded housing and on the carrier element, the carrier element being completely situated in the molded housing and the evaluation element being decoupled from the molded housing by a passivating gel.
  • the device according to the present invention and the method according to the present invention have the advantage over the related art that the structural element is protected by the intermediate housing during the production of the housing, and consequently, damage to the structural element is prevented during the molding process.
  • This is particularly necessary in the development of the structural element as sensor element, and preferably as pressure sensor element, since in this case the danger of damage of the structural element and preferably of pressure-sensitive areas (diaphragms) of the pressure sensor element is comparatively high because of the injection pressure and/or the high temperatures during the molding process.
  • An effective protection is achieved in that the intermediate housing is developed as a premold housing, and is consequently already cured at the accommodation of the structural element and at the production of the housing.
  • the intermediate housing makes possible an improved positioning of the device in the production process of the housing, since, based on the rigid intermediate housing, a firm clamping of the device into an injection molding tool is made possible for producing the housing.
  • the structural element is decoupled from the housing, so that no thermal stresses of the housing are transmitted to the structural element, but are absorbed by the intermediate housing.
  • This is of advantage especially in the production process of the housing, since damage to the structural element by mechanical stress during the curing of the molding compound is prevented.
  • a further advantage is that influence on the injection molding quality occurs, during production of the housing, via the shaping of the intermediate housing. For instance, if the intermediate housing is developed to be spherical, a housing having fewer weld lines may be implemented.
  • the housing is comparatively flexibly developed in the molding process, so that a variable adaptation of the housing is made possible in a simple way with respect to the application of the device.
  • the structural element be completely enclosed by the intermediate housing and/or that the carrier element be partially enclosed by the intermediate housing, so that, in an advantageous manner, the structural element is completely protected by the intermediate housing against outer influences, and at the same time electrical contacting of the structural element is made possible via the carrier element from outside the housing.
  • the intermediate housing and/or the housing is formed in an outer region of the carrier element, preferably as a socket, so that the carrier element includes the plug contacts in this outer region, and thus comparatively simple contacting of the carrier element may be implemented by a simple plug contact.
  • the carrier element particularly includes a leadframe or a metallic insertion part (MIP).
  • the intermediate housing include a first housing region and a second housing region, the first and the second housing region preferably being provided to be adhered to each other, welded to each other and/or latched into each other.
  • the first and the second housing regions include two half shells which together form the intermediate housing.
  • the decoupling means include particularly an elastomer. Consequently, the housing is advantageously decoupled from the structural element, so that mechanical influences on the housing, such as impacts and the like, are not transmitted to the structural element, or only negligibly so.
  • the decoupling means are also used preferably for passivating the structural element.
  • the intermediate housing and/or the housing have an inlet channel.
  • the inlet channel is advantageously used to conduct a measuring medium to the sensor element through the housing and through the intermediate housing.
  • the inlet channel is preferably sealed from the intermediate housing and/or from the housing.
  • the structural element include a pressure sensor that is connected to a pressure medium via the inlet channel, so that, in an advantageous manner, an outer pressure is conducted to a pressure-sensitive region of the pressure sensor.
  • One more subject matter of the present invention is a method for producing a device, in a first method step the structural element being positioned together with the carrier element in the intermediate housing and in a second method step the intermediate housing being injection molded around using a molding compound to produce the housing. Because of the situation of the structural element, and at least partially of the carrier element, inside the intermediate housing, protection of the structural element is particularly advantageously achieved during the second method step (as was stated in detail above), so that damage of the structural element by the injection pressure during injection of the molding compound, by an increase in temperature during the molding process and/or by thermal stresses during the curing of the molding compound after the molding process, is advantageously avoided, and a variable and cost-effective development of the housing is achievable by using a molding process. Moreover, decoupling of the structural element from the housing is achieved by having the intermediate housing.
  • the structural element in a first method step, is first situated, together with the carrier element, in a first housing region and then the second housing region is fastened on the first housing region, so that advantageously the structural element is able to be positioned comparatively simply and cost-effectively in the intermediate housing that is developed as the premold housing.
  • the carrier element in a third method step, time-wise before the first method step, is produced by a stamping method in a grid, the structural element being subsequently positioned on the carrier element of the grid, and in a fourth method step, time-wise after the first method step, the carrier element is cut apart from the grid. Consequently, the device is especially advantageously and particularly cost-effectively producible in comparatively large piece numbers.
  • FIGS. 1 a and 1 b show a first precursor structure for producing a device according to a first specific embodiment of the present invention and a device according to the first specific embodiment of the present invention.
  • FIGS. 2 a and 2 b show a second precursor structure for producing a device according to a second specific embodiment of the present invention and a device according to the second specific embodiment of the present invention.
  • FIGS. 1 a and 1 b show a first precursor structure 1 ′ for producing a device 1 according to a first specific embodiment of the present invention, and a device 1 according to the first specific embodiment of the present invention, a first and a third method step being illustrated schematically with the aid of a first precursor structure 1 ′ shown in FIG. 1 a .
  • a structural element 2 which includes a sensor element, is positioned on a carrier element 3 .
  • Carrier element 3 especially includes a leadframe, which is produced in a stamping process.
  • structural element 2 and at least partially carrier element 3 are positioned in a first housing region 4 ′ of an intermediate housing 4 , a second housing region 4 ′′ of intermediate housing 4 being subsequently situated on first housing region 4 ′.
  • First and second housing region 4 ′, 4 ′′ are welded, adhered and/or clipped to each other, in particular, carrier element 3 being preferably clamped in by housing regions 4 ′, 4 ′′.
  • Structural element 2 is completely enclosed by intermediate housing 4 , and is able to be electrically contacted via carrier element 3 from outside intermediate housing 4 .
  • Carrier element 3 has an outer region 3 ′, that projects from intermediate housing 4 .
  • first precursor structure 1 ′ is injection molded using a molding compound, to form housing 5 , intermediate housing 4 being surrounded essentially completely by housing 5 and structural element 2 being completely insulated and decoupled because of intermediate housing 4 by the molding compound.
  • a decoupling means 7 which acts to decouple structural element 2 from intermediate housing 4 .
  • decoupling means 7 includes passivating means, so that preferably carrier element 3 is passivated by the decoupling means when there is direct contact between a measuring medium and a sensitive region of structural element 2 , and/or the sensitive region is damped with respect to an excessive mechanical stress.
  • FIG. 1 b shows device 1 according to the first specific embodiment, in the area of outer region 3 ′, housing 5 has the shape of a plug housing, so that outer region 3 ′ of carrier element 3 forms plug contacts, and carrier element 3 is able to be contacted by a simple plug contact.
  • FIGS. 2 a and 2 b show a second precursor structure 1 ′′ for producing a device 1 according to a second specific embodiment of the present invention and a device 1 according to the second specific embodiment of the present invention
  • second precursor structure 1 ′′ shown in FIG. 2 a being essentially identical to first precursor structure 1 ′ shown in FIG. 1 a
  • device 1 shown in FIG. 2 b according to the second specific embodiment being essentially identical to device 1 according to the first specific embodiment shown in FIG. 1 b
  • intermediate housing 4 having an inlet channel 6 which projects from housing 5 , and leads a pressure medium to a pressure-sensitive region of structural element 2 . Consequently, structural element 2 functions as a pressure sensor element for measuring pressure in a pressure medium.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

A sensor device has a structural element, a carrier element and a housing, the structural element being situated on the carrier element, and the structural element and the carrier element being situated at least partially within the housing. The sensor device also has an intermediate housing, which is situated essentially between the housing and the structural element, the intermediate housing including a premold housing.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention The present invention relates to a sensor device.
2. Description of Related Art
Such sensor devices are generally known. From published German patent application document DE 10 2005 040 781 A1, for example, a sensor device is known which has a molded housing having a micromechanical sensor element and a carrier element, the sensor element being situated in a hollow space in the molded housing and on the carrier element, the carrier element being completely situated in the molded housing and the evaluation element being decoupled from the molded housing by a passivating gel.
BRIEF SUMMARY OF THE INVENTION
The device according to the present invention and the method according to the present invention have the advantage over the related art that the structural element is protected by the intermediate housing during the production of the housing, and consequently, damage to the structural element is prevented during the molding process. This is particularly necessary in the development of the structural element as sensor element, and preferably as pressure sensor element, since in this case the danger of damage of the structural element and preferably of pressure-sensitive areas (diaphragms) of the pressure sensor element is comparatively high because of the injection pressure and/or the high temperatures during the molding process. An effective protection is achieved in that the intermediate housing is developed as a premold housing, and is consequently already cured at the accommodation of the structural element and at the production of the housing. Furthermore, the intermediate housing makes possible an improved positioning of the device in the production process of the housing, since, based on the rigid intermediate housing, a firm clamping of the device into an injection molding tool is made possible for producing the housing. In addition, the structural element is decoupled from the housing, so that no thermal stresses of the housing are transmitted to the structural element, but are absorbed by the intermediate housing. This is of advantage especially in the production process of the housing, since damage to the structural element by mechanical stress during the curing of the molding compound is prevented. A further advantage is that influence on the injection molding quality occurs, during production of the housing, via the shaping of the intermediate housing. For instance, if the intermediate housing is developed to be spherical, a housing having fewer weld lines may be implemented. The housing is comparatively flexibly developed in the molding process, so that a variable adaptation of the housing is made possible in a simple way with respect to the application of the device.
According to one preferred refinement, it is provided that the structural element be completely enclosed by the intermediate housing and/or that the carrier element be partially enclosed by the intermediate housing, so that, in an advantageous manner, the structural element is completely protected by the intermediate housing against outer influences, and at the same time electrical contacting of the structural element is made possible via the carrier element from outside the housing. The intermediate housing and/or the housing is formed in an outer region of the carrier element, preferably as a socket, so that the carrier element includes the plug contacts in this outer region, and thus comparatively simple contacting of the carrier element may be implemented by a simple plug contact. The carrier element particularly includes a leadframe or a metallic insertion part (MIP).
According to one additional refinement, it is provided that the intermediate housing include a first housing region and a second housing region, the first and the second housing region preferably being provided to be adhered to each other, welded to each other and/or latched into each other. Especially advantageously, the first and the second housing regions include two half shells which together form the intermediate housing. Thus it is particularly advantageous to position the structural element and the carrier element in the intermediate housing in a simple manner.
According to a further preferred refinement, it is provided that between the structural element and the intermediate housing, between the carrier element and the intermediate housing and/or between the housing and the intermediate housing decoupling means be situated. The decoupling means include particularly an elastomer. Consequently, the housing is advantageously decoupled from the structural element, so that mechanical influences on the housing, such as impacts and the like, are not transmitted to the structural element, or only negligibly so. The decoupling means are also used preferably for passivating the structural element.
According to a further preferred refinement, it is provided that the intermediate housing and/or the housing have an inlet channel. In the case in which the structural element includes a sensor element, the inlet channel is advantageously used to conduct a measuring medium to the sensor element through the housing and through the intermediate housing. The inlet channel is preferably sealed from the intermediate housing and/or from the housing.
According to yet another preferred refinement, it is provided that the structural element include a pressure sensor that is connected to a pressure medium via the inlet channel, so that, in an advantageous manner, an outer pressure is conducted to a pressure-sensitive region of the pressure sensor.
One more subject matter of the present invention is a method for producing a device, in a first method step the structural element being positioned together with the carrier element in the intermediate housing and in a second method step the intermediate housing being injection molded around using a molding compound to produce the housing. Because of the situation of the structural element, and at least partially of the carrier element, inside the intermediate housing, protection of the structural element is particularly advantageously achieved during the second method step (as was stated in detail above), so that damage of the structural element by the injection pressure during injection of the molding compound, by an increase in temperature during the molding process and/or by thermal stresses during the curing of the molding compound after the molding process, is advantageously avoided, and a variable and cost-effective development of the housing is achievable by using a molding process. Moreover, decoupling of the structural element from the housing is achieved by having the intermediate housing.
According to still another refinement, it is provided that, in a first method step, the structural element is first situated, together with the carrier element, in a first housing region and then the second housing region is fastened on the first housing region, so that advantageously the structural element is able to be positioned comparatively simply and cost-effectively in the intermediate housing that is developed as the premold housing. By the subsequent adhesion, latching and/or welding of the first and second housing regions, especially using laser transmission welding or ultrasound welding, a mechanically firm and tight connection is achieved between the first and the second housing region to form the intermediate housing.
According to one more preferred refinement, it is provided that, in a third method step, time-wise before the first method step, the carrier element is produced by a stamping method in a grid, the structural element being subsequently positioned on the carrier element of the grid, and in a fourth method step, time-wise after the first method step, the carrier element is cut apart from the grid. Consequently, the device is especially advantageously and particularly cost-effectively producible in comparatively large piece numbers.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1 a and 1 b show a first precursor structure for producing a device according to a first specific embodiment of the present invention and a device according to the first specific embodiment of the present invention.
FIGS. 2 a and 2 b show a second precursor structure for producing a device according to a second specific embodiment of the present invention and a device according to the second specific embodiment of the present invention.
 DETAILED DESCRIPTION OF THE INVENTION
FIGS. 1 a and 1 b show a first precursor structure 1′ for producing a device 1 according to a first specific embodiment of the present invention, and a device 1 according to the first specific embodiment of the present invention, a first and a third method step being illustrated schematically with the aid of a first precursor structure 1′ shown in FIG. 1 a. In the third method step, a structural element 2, which includes a sensor element, is positioned on a carrier element 3. Carrier element 3 especially includes a leadframe, which is produced in a stamping process. In a subsequent first method step, structural element 2 and at least partially carrier element 3 are positioned in a first housing region 4′ of an intermediate housing 4, a second housing region 4″ of intermediate housing 4 being subsequently situated on first housing region 4′. First and second housing region 4′, 4″ are welded, adhered and/or clipped to each other, in particular, carrier element 3 being preferably clamped in by housing regions 4′, 4″. Structural element 2 is completely enclosed by intermediate housing 4, and is able to be electrically contacted via carrier element 3 from outside intermediate housing 4. Carrier element 3, on the other hand, has an outer region 3′, that projects from intermediate housing 4. In a second method step, first precursor structure 1′ is injection molded using a molding compound, to form housing 5, intermediate housing 4 being surrounded essentially completely by housing 5 and structural element 2 being completely insulated and decoupled because of intermediate housing 4 by the molding compound. In the area of first housing region 4′ there is also situated a decoupling means 7, which acts to decouple structural element 2 from intermediate housing 4. Alternatively, decoupling means 7 includes passivating means, so that preferably carrier element 3 is passivated by the decoupling means when there is direct contact between a measuring medium and a sensitive region of structural element 2, and/or the sensitive region is damped with respect to an excessive mechanical stress.
FIG. 1 b shows device 1 according to the first specific embodiment, in the area of outer region 3′, housing 5 has the shape of a plug housing, so that outer region 3′ of carrier element 3 forms plug contacts, and carrier element 3 is able to be contacted by a simple plug contact.
FIGS. 2 a and 2 b show a second precursor structure 1″ for producing a device 1 according to a second specific embodiment of the present invention and a device 1 according to the second specific embodiment of the present invention, second precursor structure 1″ shown in FIG. 2 a being essentially identical to first precursor structure 1′ shown in FIG. 1 a, and device 1 shown in FIG. 2 b according to the second specific embodiment being essentially identical to device 1 according to the first specific embodiment shown in FIG. 1 b, intermediate housing 4 having an inlet channel 6 which projects from housing 5, and leads a pressure medium to a pressure-sensitive region of structural element 2. Consequently, structural element 2 functions as a pressure sensor element for measuring pressure in a pressure medium.

Claims (8)

What is claimed is:
1. A sensor device, comprising:
a carrier element;
a structural element situated on the carrier element;
a housing, wherein the structural element and the carrier element are situated at least partially within the housing, and wherein the housing is a molded housing; and
an intermediate housing situated essentially between the housing and the structural element, wherein the intermediate housing is a premold housing defining an enclosed cavity in which the structural element is situated;
wherein the intermediate housing includes a first housing region and a second housing region configured to be connected to each other.
2. The device as recited in claim 1, wherein at least one of (i) the structural element is completely enclosed by the intermediate housing, and (ii) the carrier element is enclosed partially by the intermediate housing.
3. The device as recited in claim 1, further comprising:
a decoupling arrangement situated at least one of (i) between the structural element and the intermediate housing, (ii) between the carrier element and the intermediate housing, and (iii) between the housing and the intermediate housing.
4. The device as recited in claim 3, wherein at least one of the intermediate housing and the housing has an inlet channel.
5. The device as recited in claim 4, wherein the structural element includes a pressure sensor connected to a pressure medium via the inlet channel.
6. A method for producing a sensor device, comprising:
positioning a structural element together with a carrier element in an enclosed cavity of an intermediate housing; and
injection molding, using a molding compound, a further housing around the intermediate housing;
wherein the intermediate housing includes a first housing region and a second housing region configured to be connected to each other.
7. The method as recited in claim 6, wherein the structural element is first positioned in the first housing region together with the carrier element, and then the second housing region is fastened on the first housing region.
8. The method as recited in claim 7, wherein the carrier element is first produced in a grid by a stamping method, and the structural element is subsequently positioned on the carrier element of the grid, and after positioning the structural element together with the carrier element in the intermediate housing, the carrier element is cut apart from the grid.
US12/998,800 2008-12-16 2009-10-30 Device and method for producing a device Active 2029-12-18 US8621925B2 (en)

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DE102008054743A DE102008054743A1 (en) 2008-12-16 2008-12-16 Apparatus and method for manufacturing a device
DE102008054743.3 2008-12-16
DE102008054743 2008-12-16
PCT/EP2009/064394 WO2010072455A1 (en) 2008-12-16 2009-10-30 Device and method for producing a device

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US8621925B2 true US8621925B2 (en) 2014-01-07

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EP (1) EP2379998A1 (en)
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WO (1) WO2010072455A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260071B2 (en) 2014-03-11 2016-02-16 Trw Automotive U.S. Llc Apparatus for snap mounting a crash sensor
US9470595B2 (en) * 2014-08-29 2016-10-18 Trw Automotive U.S. Llc Apparatus for dry side mounting a crash pressure sensor
US20180246001A1 (en) * 2017-02-27 2018-08-30 Hyundai Mobis Co., Ltd. Pressure sensing apparatus for vehicle
US20220407275A1 (en) * 2019-09-30 2022-12-22 Siemens Aktiengesellschaft Housing of an electronic module and production thereof

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8914183B2 (en) * 2010-09-20 2014-12-16 Joshua Forwerck Enhanced electronic assembly
DE102011102768B4 (en) * 2011-05-28 2019-10-17 Audi Ag Pressure storage device for a fuel supply device
JP5949672B2 (en) 2013-06-10 2016-07-13 日立金属株式会社 Detection device and method of manufacturing detection device
DE102014200936A1 (en) * 2014-01-20 2015-07-23 Leoni Bordnetz-Systeme Gmbh electronics assembly
DE102014013356A1 (en) * 2014-09-08 2016-03-10 Wabco Gmbh Support for a sensor element, component group and speed sensor
FR3040213B1 (en) * 2015-08-18 2017-09-15 Continental Automotive France METHOD FOR MANUFACTURING A MEASURING SENSOR FOR A MOTOR VEHICLE
DE102015225159A1 (en) * 2015-12-14 2017-06-14 Continental Automotive Gmbh Magnetic field sensor with a plug socket
JP6160940B2 (en) * 2016-06-07 2017-07-12 日立金属株式会社 Detection device and method of manufacturing detection device
JP7035680B2 (en) 2018-03-22 2022-03-15 日立金属株式会社 Cable with resin molded body

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059746A (en) 1989-05-01 1991-10-22 Amp Incorporated Housing assembly for electronic components
US5462622A (en) * 1994-06-09 1995-10-31 Illinois Tool Works Inc. Molding an electrical element within a premold element and an overmold element to provide a one-piece component
JPH07294353A (en) 1994-04-28 1995-11-10 Matsushita Electric Works Ltd Pressure sensor
US5926952A (en) * 1993-10-15 1999-07-27 Sumitomo Wiring Systems, Ltd. Method of fabricating a connector using a pre-molded connector structure
JP2001050838A (en) 1999-06-25 2001-02-23 Robert Bosch Gmbh Method of manufacturing a pressure sensor
WO2002079743A1 (en) 2001-03-29 2002-10-10 Hitachi, Ltd. Semiconductor pressure sensor
WO2006000212A1 (en) 2004-06-25 2006-01-05 Conti Temic Microelectronic Gmbh Electrical subassembly comprising a protective sheathing
EP1634687A1 (en) * 2004-09-13 2006-03-15 Hans Huonker GmbH Method for producing hybrid parts
CN1897288A (en) 2005-07-15 2007-01-17 鸿富锦精密工业（深圳）有限公司 Image sensed-measuring chip packing structure
US20070044558A1 (en) * 2005-08-30 2007-03-01 Denso Corporation Angular velocity mount arrangement
DE102005040781A1 (en) 2005-08-29 2007-03-22 Robert Bosch Gmbh Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing
US7380458B1 (en) 2007-03-02 2008-06-03 Autoliv Asp, Inc. Pressure sensor port
EP2090873A1 (en) 2008-02-14 2009-08-19 Elmos Advanced Packaging B.V. Integrated circuit package
DE102008040155A1 (en) * 2008-07-03 2010-01-07 Robert Bosch Gmbh Sensor housing cover and method of making such a sensor housing cover
JP2010021225A (en) 2008-07-09 2010-01-28 Sharp Corp Electronic component and fabrication process therefor, and electronic apparatus equipped with electronic component
US7905131B2 (en) * 2007-06-19 2011-03-15 Denso Corporation Apparatus and method for detecting resin leak
US20120009816A1 (en) * 2009-07-14 2012-01-12 Yuji Hiraoka Vehicle condition detection device and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH029388U (en) * 1988-06-30 1990-01-22
WO2000000212A1 (en) 1998-06-26 2000-01-06 Nutracorp Scientific, Inc. Promoting nitric oxide and cyclic gmp activity
JP2000329632A (en) * 1999-05-17 2000-11-30 Toshiba Chem Corp Pressure sensor module and method of manufacturing pressure sensor module
JP2005109027A (en) * 2003-09-29 2005-04-21 Aisin Seiki Co Ltd Device housing

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059746A (en) 1989-05-01 1991-10-22 Amp Incorporated Housing assembly for electronic components
US5926952A (en) * 1993-10-15 1999-07-27 Sumitomo Wiring Systems, Ltd. Method of fabricating a connector using a pre-molded connector structure
JPH07294353A (en) 1994-04-28 1995-11-10 Matsushita Electric Works Ltd Pressure sensor
US5462622A (en) * 1994-06-09 1995-10-31 Illinois Tool Works Inc. Molding an electrical element within a premold element and an overmold element to provide a one-piece component
JP2001050838A (en) 1999-06-25 2001-02-23 Robert Bosch Gmbh Method of manufacturing a pressure sensor
US6300169B1 (en) 1999-06-25 2001-10-09 Robert Bosch Gmbh Method for manufacturing a pressure sensor
WO2002079743A1 (en) 2001-03-29 2002-10-10 Hitachi, Ltd. Semiconductor pressure sensor
WO2006000212A1 (en) 2004-06-25 2006-01-05 Conti Temic Microelectronic Gmbh Electrical subassembly comprising a protective sheathing
US20090097222A1 (en) * 2004-06-25 2009-04-16 Wilfried Babutzka Electrical Subassembly Comprising a Protective Sheathing
EP1634687A1 (en) * 2004-09-13 2006-03-15 Hans Huonker GmbH Method for producing hybrid parts
US20060061010A1 (en) * 2004-09-13 2006-03-23 Hans-Georg Huonker Process for manufacturing hybrid components as well as components manufactured according to this process
DE102004044614A1 (en) 2004-09-13 2006-03-30 Hans Huonker Gmbh Process for the production of hybrid components and components produced by this process
CN1897288A (en) 2005-07-15 2007-01-17 鸿富锦精密工业（深圳）有限公司 Image sensed-measuring chip packing structure
DE102005040781A1 (en) 2005-08-29 2007-03-22 Robert Bosch Gmbh Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing
US20070044558A1 (en) * 2005-08-30 2007-03-01 Denso Corporation Angular velocity mount arrangement
DE102006040564A1 (en) 2005-08-30 2007-03-01 Denso Corp., Kariya Attachment arrangement for angular speed sensor includes circuit framework having extending segment that can swing in first axial direction
US7380458B1 (en) 2007-03-02 2008-06-03 Autoliv Asp, Inc. Pressure sensor port
US7905131B2 (en) * 2007-06-19 2011-03-15 Denso Corporation Apparatus and method for detecting resin leak
EP2090873A1 (en) 2008-02-14 2009-08-19 Elmos Advanced Packaging B.V. Integrated circuit package
US8049290B2 (en) * 2008-02-14 2011-11-01 Sencio B.V. Integrated circuit package
DE102008040155A1 (en) * 2008-07-03 2010-01-07 Robert Bosch Gmbh Sensor housing cover and method of making such a sensor housing cover
US20110174071A1 (en) * 2008-07-03 2011-07-21 Ronny Ludwig Sensor housing cover and method for manufacturing such a sensor housing cover
JP2010021225A (en) 2008-07-09 2010-01-28 Sharp Corp Electronic component and fabrication process therefor, and electronic apparatus equipped with electronic component
US20120009816A1 (en) * 2009-07-14 2012-01-12 Yuji Hiraoka Vehicle condition detection device and method for manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260071B2 (en) 2014-03-11 2016-02-16 Trw Automotive U.S. Llc Apparatus for snap mounting a crash sensor
US9470595B2 (en) * 2014-08-29 2016-10-18 Trw Automotive U.S. Llc Apparatus for dry side mounting a crash pressure sensor
US20180246001A1 (en) * 2017-02-27 2018-08-30 Hyundai Mobis Co., Ltd. Pressure sensing apparatus for vehicle
US10571353B2 (en) * 2017-02-27 2020-02-25 Hyundai Mobis Co., Ltd. Collision pressure sensor having an elastic pressing unit
US20220407275A1 (en) * 2019-09-30 2022-12-22 Siemens Aktiengesellschaft Housing of an electronic module and production thereof
US12113324B2 (en) * 2019-09-30 2024-10-08 Siemens Aktiengesellschaft Housing of an electronic module and production thereof

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