US6455121B1 - Cationic and hybrid radiation-curable adhesives for bonding of optical discs - Google Patents
Cationic and hybrid radiation-curable adhesives for bonding of optical discs Download PDFInfo
- Publication number
- US6455121B1 US6455121B1 US09/729,073 US72907300A US6455121B1 US 6455121 B1 US6455121 B1 US 6455121B1 US 72907300 A US72907300 A US 72907300A US 6455121 B1 US6455121 B1 US 6455121B1
- Authority
- US
- United States
- Prior art keywords
- composition
- radiation
- disc
- optical disc
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 125000002091 cationic group Chemical group 0.000 title claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 title claims description 75
- 239000000853 adhesive Substances 0.000 title claims description 73
- 230000003287 optical effect Effects 0.000 title claims description 19
- 239000000203 mixture Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 42
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 35
- 239000003085 diluting agent Substances 0.000 claims description 31
- 150000002009 diols Chemical class 0.000 claims description 27
- -1 triarylsulfonium hexafluoroantimonate salts Chemical class 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002318 adhesion promoter Substances 0.000 claims description 10
- 239000012952 cationic photoinitiator Substances 0.000 claims description 8
- 239000012949 free radical photoinitiator Substances 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 claims description 6
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 5
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 5
- 239000001273 butane Substances 0.000 claims description 5
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 5
- 239000001294 propane Substances 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 34
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 32
- 239000010410 layer Substances 0.000 description 30
- 229920000515 polycarbonate Polymers 0.000 description 26
- 239000004417 polycarbonate Substances 0.000 description 26
- 150000003254 radicals Chemical class 0.000 description 24
- 239000000178 monomer Substances 0.000 description 21
- 230000005855 radiation Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 16
- 239000004721 Polyphenylene oxide Substances 0.000 description 14
- 229920000570 polyether Polymers 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 239000000654 additive Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 238000009472 formulation Methods 0.000 description 10
- 150000002924 oxiranes Chemical class 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- 150000003077 polyols Chemical class 0.000 description 10
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 239000004922 lacquer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000001976 improved effect Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 5
- 229920006397 acrylic thermoplastic Polymers 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229940091853 isobornyl acrylate Drugs 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000003568 thioethers Chemical class 0.000 description 3
- 229960000834 vinyl ether Drugs 0.000 description 3
- ZRKMQKLGEQPLNS-UHFFFAOYSA-N 1-Pentanethiol Chemical compound CCCCCS ZRKMQKLGEQPLNS-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- 239000004821 Contact adhesive Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000006136 alcoholysis reaction Methods 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 230000006353 environmental stress Effects 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005923 long-lasting effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001692 polycarbonate urethane Polymers 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000003930 superacid Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 150000003573 thiols Chemical group 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- GPHWXFINOWXMDN-UHFFFAOYSA-N 1,1-bis(ethenoxy)hexane Chemical compound CCCCCC(OC=C)OC=C GPHWXFINOWXMDN-UHFFFAOYSA-N 0.000 description 1
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- SZBXTBGNJLZMHB-UHFFFAOYSA-N 1-chloro-2,4-diisocyanatobenzene Chemical compound ClC1=CC=C(N=C=O)C=C1N=C=O SZBXTBGNJLZMHB-UHFFFAOYSA-N 0.000 description 1
- NFDXQGNDWIPXQL-UHFFFAOYSA-N 1-cyclooctyldiazocane Chemical compound C1CCCCCCC1N1NCCCCCC1 NFDXQGNDWIPXQL-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical group C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical compound C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical class C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- LJPCNSSTRWGCMZ-UHFFFAOYSA-N 3-methyloxolane Chemical compound CC1CCOC1 LJPCNSSTRWGCMZ-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- VPIAKHNXCOTPAY-UHFFFAOYSA-N Heptane-1-thiol Chemical compound CCCCCCCS VPIAKHNXCOTPAY-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Chemical class 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- LNWBFIVSTXCJJG-UHFFFAOYSA-N [diisocyanato(phenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(N=C=O)(N=C=O)C1=CC=CC=C1 LNWBFIVSTXCJJG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical class [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical group C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- MYWGVEGHKGKUMM-UHFFFAOYSA-N carbonic acid;ethene Chemical compound C=C.C=C.OC(O)=O MYWGVEGHKGKUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- UYFMQPGSLRHGFE-UHFFFAOYSA-N cyclohexylmethylcyclohexane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CCCCC1CC1CCCCC1 UYFMQPGSLRHGFE-UHFFFAOYSA-N 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000012973 diazabicyclooctane Substances 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical class [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/76—Television signal recording
- H04N5/84—Television signal recording using optical recording
- H04N5/85—Television signal recording using optical recording on discs or drums
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/913—Material designed to be responsive to temperature, light, moisture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Definitions
- This invention relates to cationic radiation-curable adhesive formulations and to hybrid cationic and free radical radiation-curable adhesive formulations useful for bonding together surfaces of digital versatile discs.
- the technology behind the compact disc has been improved and expanded to meet the increasing storage needs of the computer and entertainment industries, culminating in the creation of digital versatile discs, or DVDs. While compact discs and digital versatile discs store information in the same general manner, the DVD design exploits CD technology to create a superior product.
- the compact and digital versatile discs composed of a core member around which the information bearing surface is symmetrically arranged, are the same diameter (120 mm), and the same thickness (1.2 mm).
- digital versatile discs are made of two 0.6 mm layers of polycarbonate. This reduces the amount of distance between the surface of the discs and the pits, such that the laser penetrates less plastic in the DVDs than in CDs when accessing information. Consequently, the thinner DVD substrate enhances the read accuracy of the laser.
- the two bonded sides of the DVDs serve to strengthen the discs, preventing warping.
- digital versatile discs have greater capacity and reduced responses to environmental factors than compact discs.
- Digital versatile discs may be created by variations on a few basic processes, as disclosed, for example, by U.S. Pat. No. 4,310,919 and U.S. Pat. No. 4,423,137.
- a master glass disc with the desired information is created, using a laser beam to record data from the center of the master glass disc to the outer edge of the master glass disc in a spiral pattern.
- the master glass disc is developed by spinning a sodium hydroxide solution over the glass surface, revealing the pits created by the laser.
- the developed master glass disc is then metallized with a coating of silver, followed by a coating of nickel.
- the nickel layer is then separated from the silver-coated master glass disc, forming a nickel reverse image of the data, known as the father copy.
- One or more nickel copies of this father may be generated, which can be used as a stamper in an injection molding machine to mass produce discs.
- Molten polycarbonate is then shot into molds containing the stamper, creating polycarbonate discs carrying the desired information.
- the discs are then removed from the molds with the lacquer layer adhered thereto, and a reflective metal, usually aluminum, is evaporated or sputtered on top of the polycarbonate first layer containing the information.
- a protective coating of lacquer is then applied over the reflective layer and dried or cured, forming a single sided disc.
- the stamped side of the single-sided DVD is backed by a dummy layer, onto which graphics may be applied.
- the basic DVD configuration is usually modified to further enhance the capacity of the discs.
- the capacity of a single sided disc may be almost doubled by applying a semi-reflective data layer zero, comprising, for example, gold, over the reflective aluminum layer one.
- the gold layer may be read by the driver laser on a low power setting, while the aluminum layer may be accessed by increasing the power of the laser. This results in a double layer of information on a single side of a disc, imparting the DVD with currently about 8.5 GB of capacity.
- Two of these single sided, dual layer discs may be bonded together back to back with a thick layer of adhesive, creating double sided, double layer digital versatile discs with currently about 17 GB of storage space.
- the first and second disc layers are bonded such that they are parallel to and equidistant from the core member of the disc.
- the adhesive employed must provide high shear strength, while keeping the information layers uniformly equidistant from each other.
- the formulations must provide adhesion between the aluminum and polycarbonate layers, the gold and polycarbonate layers, and the lacquer and the polycarbonate layers, and various combinations thereof.
- the adhesive coatings must have a high cure speed and must wet the substrate. Following cure, these materials must have high dimensional stability and durability.
- acrylate lacquer is placed on the leading edge of a disc, after which a second disc is placed on top, and the pair is spun.
- the weight of the second disc promotes the movement of the lacquer toward the inner edge of the metal layer, while the spinning causes the lacquer to move to the outer edge.
- the adhesive is cured via UV irradiation after the spin coating process is completed.
- the curing process is most effective when one of the substrate layers is semi-transparent or transparent. When both substrates are opaque, high UV energy is required for curing and excess heat is generated in the process. Heat adversely affects the mechanical properties of bonded discs, such as radial tilt, tangential tilt and birefringence.
- acrylates shrink upon cure, often to substantial degrees, thereby preventing the formation of flat discs. This shrinkage may also reduce the environmental stability of bonded discs.
- the adhesive is screened onto both the discs, UV irradiated, and then pressed together.
- the bond strengthens with time due to aging, such that after approximately 24 hrs, the disc halves are permanently attached to each other.
- Screening methods are milder bonding processes than are spin coating techniques.
- the discs produced by screening methods are flatter than with other processes, but cationic UV bonding is often plagued by air entrapment during lamination and undesirable screen textures.
- the cationic adhesive material produces Lewis and Bronsted acids upon exposure to actinic sources, and thus pure cationic adhesives may be corrosive to the bonded recording substrates. Additionally, the cure rate for cationic epoxy adhesives is generally slow, meaning the discs must stay in a curing station for a period to ensure complete bonding prior to stacking, requiring an extra stacker, which increases equipment costs and reduces production efficiency.
- UV-curable pressure sensitive adhesives may also be used to bond disc halves together using screen printing methods.
- the adhesive is “pre-shrunk”, wherein two adhesive coated disc halves are cured prior to lamination and only the adhesive is directly exposed to UV radiation. Lamination is achieved by pressing the two halves together.
- UV-PSA adhesives cure at a faster rate than cationic adhesives. UV-PSA materials form soft adhesives, which lead to highly flexible bonded discs. This flexibility may be problematic, negatively affecting the dimensional stability of the bonded discs under some conditions.
- the nature of radiation curable pressure sensitive adhesives is described by Huber HF, Radiation cure of pressure sensitive adhesives. In: Radiation curing in polymer science and technology -VolumeIV (J. Fouassier and J. Rabek, eds.) pp. 51-71. Elsevier Applied Science, New York, 1993, the entire contents of which are hereby incorporated herein by reference.
- One embodiment of the invention is a hybrid free radical and cationic pressure sensitive adhesive that strongly bonds screen printed opaque substrates together.
- the bonded substrates may be metallized or siliconized polycarbonate substrates, and UV-cured lacquer surfaces. Bonds formed by hybrid PSA are stable following exposure to elevated temperature and humidity, possess excellent mechanical properties, have suitable viscosity, reduced shrinkage and a low degree of volatility post-cure. The result is an adhesive that imparts impact resistance and uperior shear strength to bonded digital versatile discs or to other substrates.
- Another embodiment of the invention is a cationic radiation curable adhesive composition which optionally includes free radical cure components.
- a UV curable hybrid free radical and cationic pressure sensitive composition for use as an adhesive material comprising the combination of the following pre-mixture ingredients:
- the present invention provides for the production of a radiation-curable hybrid cationic and free radical pressure sensitive adhesive for improved bonding of digital versatile discs, methods for bonding disc components together, and discs with improved impact resistance due to the enhanced bonding properties of the hybrid cationic and free radical adhesive compound.
- Other substrates may be used.
- Cationic and pressure sensitive adhesive systems individually are well known in the field of adhesive technology. According to the invention, copolymerization of free radical polymerizable monomers and cationic epoxy resins creates an adhesive material with superior properties to acrylate adhesives lacking the hybrid free radical and cationic PSA system.
- the PSA hybrid system has the cohesive strength of cationic resins combined with the fast cure and mild bonding characteristics of the PSA system.
- the open face cure of the hybrid system reduces the exposure of substrates to UV radiation during cure, particularly opaque substrates, thereby preventing undesirable effects on the mechanical properties of the cured substrates.
- the result is a screen printable adhesive which is initially cured on two halves of, for example, a DVD, and continues to cure via cationic means after the halves are pressed together. Bonds formed under these circumstances are extremely strong without inducing side effects detrimental to the bonded substrates. Because standard adhesive materials do not provide strong, long lasting bonding between, for example, aluminum and polycarbonate substrates, especially under adverse environmental conditions, particularly elevated temperatures and humidity levels, the creation of hybrid pressure sensitive adhesive formulations is a marked improvement over the current methodology.
- hybrid free radical and cationic PSA systems appear to allow copolymerization of epoxy moieties with acrylate moieties, thereby producing graft and block copolymers.
- These hybrid systems preferably include acrylate oligomers and free radical polymerizable acrylate monomers combined with epoxy resins. In the absence of acrylate compounds, cure of pure epoxy resin compositions is relatively slow, due to the slow nature of the cationic-mediated addition of epoxides to each other.
- Hybrid pressure sensitive adhesive (PSA) systems of the invention incorporate cationic cure materials into acrylate adhesive compositions, thereby enhancing the cure speed of the cationic moiety. Incorporation of up to 98% by weight cationic epoxy materials into acrylate compositions reduces shrinkage and markedly improves bond strength of the cured acrylate adhesives. These surprising improvements provide for, amongst other benefits, superior screen printing of DVD substrates.
- One embodiment of the present composition is a novel formulation for synthesizing a hybrid cationic and free radical pressure sensitive adhesive (PSA) with strong bonding properties, particularly for metallic substrates, such as gold and aluminum, ceramics, such as silicon, and polycarbonates.
- PSA cationic and free radical pressure sensitive adhesive
- An important aspect of the first embodiment of the invention is the copolymerization of acrylate oligomers and acrylate monomers with cationic epoxy resin systems. Acrylate monomers are preferred for their high rates of polymerization.
- the hybrid PSA system comprising acrylate monomers and epoxy resins, significantly improves the adhesive properties of acrylate adhesive coatings for use in bonding a variety of substrates.
- Another embodiment of the invention is a cationic radiation curable pressure sensitive adhesive composition which optionally includes free radical cure components.
- a suggested mechanism for photoactivated hybrid PSA addition reactions includes UV absorption by a free radical photoinitiator, which initiates free radical formation via decomposition of the initiator, followed by radical attack of an unsaturated carbon in an acrylate compound, concluding with termination by formation of radical-radical combinations.
- Cationic photoinitiators generate superacids, which catalyze the addition of hydroxyl and epoxide moieties to epoxides promoting cure of epoxy resins in the hybrid system.
- Inclusion of cationic species in acrylate adhesive compositions is advantageous, as upon removal of the actinic radiation, cationic systems continue to polymerize thermally, thus increasing bond strength.
- the adhesive remains in the liquid state after irradiation, and no surface cure is detectable. Cured adhesive compositions solidify within two minutes of UV radiation. The result is a hybrid PSA adhesive that upon cure imparts, for example, impact resistance and superior shear strength to bonded digital versatile discs.
- the protective layer of a first polycarbonate substrate may be bonded to the protective layer of a second polycarbonate substrate by a hybrid free radical and cationic PSA adhesive comprising an acrylic UV resin combined with an epoxy resin.
- Adhesion of, for example, aluminum and polycarbonate layers may also be achieved with hybrid PSA compositions.
- Additives are often included in radiation-curable coatings to modify the properties of the compositions to meet specific needs. Basic additives must be avoided in hybrid PSA systems as bases neutralize the super acid produced by cationic initiators, thereby slowing cationic cure.
- hybrid PSA systems are radiation-cured on a substrate, such as a polycarbonate surface, the final result is a product with pronounced adhesion and good bonding strength.
- compositions can comprise at least one radiation-curable acrylate oligomer, at least one radiation-curable reactive diluent, at least one photoinitiator, at least one epoxy compound, at least one diol and optional additives.
- the weight ratio of the cationic component to the PSA component of the composition may be from about 99:1 to about 80:20, to as low as about 40:50, and preferably is from about 60:40 to about 50:50. Additives will bring the total weight value to 100% in each case.
- the composition may be tailored to maximize the adhesiveness, reduce the viscosity, shorten cure speed, and the like of the cured material.
- radical polymerizable monomers and optionally silane compounds may be added at varying effective concentrations to achieve improved viscosity and adhesion, respectively.
- other desirable properties may be promoted, such as high optical transparency, hardness, chemical resistance, and abrasion resistance.
- compositions may vary, depending upon the other components of the composition and the light sources used to cure the composition. Components should be excluded from the formulation which, prior to cure, cause insoluble salts to form, which may impair the optical properties of the bonded disc.
- the radiation-curable compositions can be cured by conventional means.
- the radiation source can be a conventional light source, such as, for example, UV lamps available from Fusion Systems Corp.
- low-, medium- and high-pressure mercury lamps, superactinic fluorescent tubes or pulse lamps are suitable.
- Radiation-cure is preferably by actinic radiation and more preferably by UV radiation.
- proper control of light intensity is important to help control shrinkage of the polymerized material.
- the radiation-curable oligomer can be any radiation-curable oligomer used in radiation-curable, adhesive coating compositions.
- An example of a suitable radiation-curable oligomer includes an urethane oligomer having a molecular weight of at least about 500 and containing at least one ethylenically unsaturated group that can be polymerized through actinic radiation.
- the ethylenically unsaturated group can be the reactive terminus of the oligomer to which the reactive diluent is bound when the composition is cured.
- the oligomer has two terminal radiation-curable functional groups, one at each end of the oligomer. Oligomers with low glass transition values are preferred.
- oligomers are disclosed in, for example, U.S. Pat. No. 4,932,750, which is hereby incorporated by reference.
- the radiation-curable oligomer is preferably present in an amount of about 0% to about 70% by weight, and more preferably, about 30 wt. % to about 40% wt. %.
- Suitable radiation-curable functional groups which can be present on the oligomer include ethylenically unsaturated groups including (meth)acrylate or vinylether groups.
- (meth)acrylate as used herein, means methacrylate, acrylate, or mixtures thereof.
- the radiation-curable group in the oligomer is a (meth)acrylate or vinylether group.
- the oligomer contains at least two ethylenically unsaturated groups which are bound to an oligomer backbone.
- ethylenically unsaturated groups can be present at each end of the oligomer backbone as reactive termini.
- the oligomer backbone can be, for example, based on a polyether, polyolefin, polyester, polycarbonate, acrylic, hydrocarbon, polyolefin, or copolymers thereof.
- the oligomer backbone comprises repeating urethane units
- the radiation-curable oligomer can be an acrylic oligomer comprising at least one radiation-curable (meth)acrylate group, and preferably, at least one acrylate group. These are known in the art as acrylated acrylics.
- acrylated acrylic oligomer or any other oligomer, is prepared.
- Oligomer synthetic routes for acrylated acrylics can, for example, involve an esterification of a hydroxyl-functional acrylic oligomer with (meth)acrylic acid, or the reaction of an epoxy-functional acrylic oligomer with (meth)acrylic acid.
- These acrylated acrylics can include urethane linkages.
- Preferred acrylated acrylic oligomers include species of at least Mn 5,000.
- Preferred acrylated urethane acrylics are described in U.S. application Ser. No. 08/740,725, the entire disclosure of which is hereby incorporated by reference.
- Acrylated acrylics can be prepared by known synthetic methods including, for example, (1) partial esterification of acrylic polymers having pendant carboxylic acid group with hydroxyethyl acrylate or glycidyl methacrylate, or in the alternative, acrylation of glycidyl methacrylate terpolymer with acrylic acid, or (2) polymerization of monomers which already have acrylate groups such as, for example, allyl methacrylate or N,N-dimethylaminoethyl methacrylate.
- the acrylic oligomer typically will have a copolymeric backbone.
- the glass transition temperature (Tg) of the oligomer can be lowered by decreasing the content of methyl methacrylate.
- the oligomer backbone can comprise one or more oligomeric blocks coupled with each other via, for example, urethane linkages.
- one or more types of polyol prepolymers can be linked by methods known in the art.
- the oligomer backbone is a polyether, the resulting adhesives can have a low glass transition temperature and good mechanical properties. If the oligomer backbone is a polyolefin, the resulting adhesives can have a further improved water resistance. Polycarbonate-based oligomers can provide for good stability.
- Oligomers with repeating urethane units can be, for example, prepared by reaction of (i) an oligomer polyol, (ii) a di-or poly-isocyanate and (iii) a hydroxy functional ethylenically unsaturated monomer such as, for example hydroxyalkyl(meth)acrylate.
- an oligomer backbone polyol preferably it has on average at least about two hydroxyl groups.
- the oligomer backbone polyol may have, on average, more than two hydroxyl groups.
- Examples of such an oligomer diol include polyether diols, polyolefin diols, polyester diols, polycarbonate diols, and mixtures thereof. Polyether and polycarbonate diols, or combinations thereof, are preferred.
- the polyether is a substantially non-crystalline polyether.
- the polyether comprises repeating units of one or more of the following monomer units:
- polyether polyol that can be used is the polymerization product of 20 percent by weight of 3-methyltetrahydrofuran and 80 percent by weight of tetrahydrofuran, both of which have undergone a ring opening polymerization.
- This polyether copolymer contains both branched and non-branched oxyalkylene repeating units and is marketed as PTGL 1000TM (Hodogaya Chemical Company of Japan).
- PTGL 1000TM Hodogaya Chemical Company of Japan
- Another example of a polyether in this series which can be used is PTGL 2000TM (Hodogaya Chemical Company).
- Another example of a polyether which can be used is polyarylicdiol.
- polycarbonate diols are those conventionally produced by the alcoholysis of diethylene carbonate with a diol.
- the diol can be, for example, an alkylene diol having about 2 to about 12 carbon atoms, such as, 1,4-butane diol, 1,6-hexane diol, 1,12-dodecane diol, and the like. Mixtures of these diols can also be utilized.
- the polycarbonate diol can contain ether linkages in the backbone in addition to carbonate groups.
- polycarbonate copolymers of alkylene oxide monomers and the previously described alkylene diols can be used. Admixtures of the polycarbonate diols and polycarbonate copolymers can also be utilized.
- Polycarbonate diols include, for example, DURACARB 122TM (PPG Industries) and PERMANOL KM10-1733TM (Permuthane, Inc., Ma.).
- DURACARB 122TM is produced by the alcoholysis of diethylcarbonate with hexane diol.
- a product is obtained which is end-capped with the reaction product from the isocyanate/ethylenically unsaturated monomer reaction on at least one end of the molecule.
- End-capped means that a functional group caps one of the two ends of the oligomer diol.
- the isocyanate/hydroxy functional monomer reaction product attaches to the oligomer backbone (i) diol via a urethane linkage.
- the urethane reactions can take place in the presence of a catalyst.
- Catalysts for the urethane reaction include, for example, dibutyl-tin dilaurate, diazabicyclooctane crystals and the like.
- the polyisocyanate (ii) is a diisocyanate.
- diisocyanates (ii) include isophorone diisocyanate (IPDI), tetramethylxylene diisocyanate (TMXDI), toluene diisocyanate (TDI), diphenylmethylene diisocyanate, hexamethylene diisocyanate, cyclohexylene diisocyanate, methylene dicyclohexane diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, m-phenylene diisocyanate, 4-chloro-1,3-phenylene diisocyanate, 4,4′-biphenylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate, 1,10-decamethylene diisocyanate, 1,4-cyclohex
- the compound providing a reactive terminus (iii) contains a functional group which can polymerize under the influence of actinic radiation, and the compound contains a functional group which can react with the diisocyanate.
- Hydroxy functional ethylenically unsaturated monomers are preferred. More preferably, the hydroxy functional ethylenically unsaturated monomer contains acrylate, (meth)acrylate or vinyl ether functionality.
- the composition according to the invention may comprise at least one reactive diluent.
- Reactive diluents can be used to adjust the viscosity of the adhesive composition.
- the reactive diluent can be a low viscosity monomer containing at least one functional group capable of polymerization when exposed to actinic radiation.
- vinyl reactive diluents and acrylate monomer diluents may be used.
- Cationic diluents, such as cycloaliphatic epoxides or epoxy alkanes may also be suitable.
- Vinyl ethers and polyols may serve as reactive diluents.
- the reactive diluent is preferably added in such an amount that the viscosity of the coating composition is greater than 500 cps, and preferably greater than 1,000 cps.
- the viscosity of the composition should be greater than 1,000 cps to avoid screen leakage during the screen printing process.
- Suitable amounts of the reactive diluents have been found to be about 1 wt % to about 70 wt %, and more preferably about 10 wt. % to about 50 wt. %.
- the reactive diluents preferably have a molecular weight of not more than about 550 or a viscosity at room temperature of less than about 500 mPas (measured as 100% diluent).
- the functional group present on the reactive diluent may be of the same nature as that used in the radiation-curable oligomer or epoxy resin.
- the radiation-curable functional group present in the reactive diluent is capable of copolymerizing with the radiation-curable functional group present on the radiation-curable oligomer.
- the reactive diluent system comprises monomers having an acrylate and vinyl ether functionality and an C 4 -C 20 alkyl or polyether moiety.
- Examples of such reactive diluents are:
- N-vinylpyrrolidone N-vinylpyrrolidone and the like.
- the reactive diluents preferably contain two groups capable of polymerization using actinic radiation.
- a diluent having three or more of such reactive groups can be present as well. Examples of such monomers include:
- Ethylene glycol, aliphatic vinyl ethers and aromatic vinyl ethers are suitable.
- the oligomer and the at least one radical polymerizable monomer diluent each contain an acrylate group as a radiation-curable group.
- the composition contains at least one cationic cured epoxy resin, preferably present in an amount from about 10 wt. % to about 99 wt. %.
- Suitable epoxy resins include bisphenol-A, cycloaliphatic epoxides, bisphenol-F, and mixtures thereof.
- Preferred epoxy resins include mixed cycloaliphatic epoxides, bis-(3,4-epoxycyclohexyl) adipate, bisphenol-A epoxide and bisphenol-F epoxide.
- Bisphenol-A epoxide is known to give good surface cure. Excellent through cure is achievable with bisphenol-F epoxide, and is most preferred.
- the composition may optionally further comprise at least two photoinitiators, which are required for fast UV cure.
- photoinitiators can be used.
- free radical photoinitiators include benzophenones, acetophenone derivatives, such as alpha-hydroxyalkylphenylketones, benzoin alkyl ethers and benzil ketals, monoacylphosphine oxides, and bisacylphosphine oxides.
- a preferred photoinitiator is 1-hydroxycyclohexyl phenylketone(IRGACURE 184TM, Ciba Geigy).
- Another preferred example is 2,2-dimethoxy-2-phenyl acetophenone (IRGACURE 651TM, Ciba Geigy).
- Suitable photoinitiators include mercaptobenzothiazoles, mercaptobenzooxazoles and hexaryl bisimidazole.
- Cationic photoinitiators include onium salts of antimony and phosphate, such as mixed triarylsulfonium hexafluoroantimonate salts and mixed triarylsulfonium hexafluorophosphate salts. Hexafluorophosphate salts are faster at initiating cure in the hybrid PSA system of the invention than hexafluoroantimonate salts. Mixtures of cationic and free radical photoinitiators provide a suitable balance of properties in hybrid PSA adhesive systems.
- Free radical photoinitiators may be present in amounts ranging from about 0 wt. % to about 15 wt. %.
- Cationic photoinitiators may be present in the composition of the invention in amounts ranging from about 0.5 wt. % to about 15 wt. %.
- Additional compounds are commonly included in radiation-curable coatings, including adhesive coatings, and can be used in effective amounts.
- Thiol compounds can be used in UV-curable acrylate oligomer compositions to enhance the bonding properties of the adhesives.
- the radical polymerizable monomer forms thioether linkages during radiation-cure.
- Such thioether linkages can form by thiol-ene reactions.
- Thiol-ene systems are the result of combining thiol moieties, such as mercapto silanes, and vinyl components, such as N-vinyl pyrrolidone during radiation cure.
- Aliphatic thiol compounds such as C 5 -C 30 , preferably C 5 -C 20 alkanethiol compounds, are suitable reactants.
- alkanethiols examples include 1-pentanethiol, 1-heaxanethiol, 1-heptanethiol, 1-octanethiol, 1-decanethiol, 1-dodecanethiol, and the like.
- Compounds comprising a plurality of mercapto groups can be used, including di- and tri-mercapto compounds.
- Preferred examples of thiol compounds are ⁇ -mercaptopropyltrimethoxysilane and ⁇ -mercaptopropyltriethoxysilane.
- Thioethers are also preferred. Such thiol-ene systems, when copolymerized with acrylates, provide for compositions with superior adhesive qualities.
- additives may be included in the formulations. Minor amounts of UV absorbers, typically those of the benzotriazole, benzophenone or oxanilide type, or sterically hindered amine type (HALS) may be added as light stabilizers. Further customary additives as used in the art include fillers, chain transfer agents, plasticizers, wetting agents, stabilizers, adhesion promoters or leveling agents. For example, alcohols and polyols behave as chain transfer agents with epoxides, improving cure speed of cationic formulations. Suitable polyols include ⁇ -caprolactone triol crosslinking agents of viscosities at 55° C. ranging from 2250 cP to 2700 cP.
- Diols such as ethylene glycol, butane glycol and propane glycol outperform other polyols, and are preferred. Ethylene glycol is most preferred. Glycols may be present in the hybrid adhesive composition in a range of from about 0 wt. % to about 20 wt. %.
- Mercaptosilanes as described above, are preferred adhesion promoters. When thiol compounds other than mercaptosilanes are used, silane adhesion promoters are preferred. Such silane adhesion promoters are known in the art.
- Examples include isocyanotoalkyltrialkoxysilanes, methacrylylalkyltrialkoxysilanes, amino alkyltrialkoxysilanes and epoxyalkyltrialkoxy silanes.
- the alkyl group generally is propyl, and as the alkoxy group, methoxy or ethoxy is preferred.
- Another suitable silane adhesion promoter is vinyltrimethoxysilane.
- Mercaptosilanes such as mercaptopropyltrimethoxysilane and mercaptopropyltriethoxysilane, are particularly preferred.
- Thermal antioxidants may be used to improve thermal and oxidative stability. Thickeners, leveling agents, antifoam agents, thixotropic agents and tackifying agents are preferred additives. Other polymers and oligomers can be added to the compositions as needed.
- Cure speed can be measured by dose-modulus curves as known in the art. Cure speed can be taken as the dose required to effect 95% of the maximum modulus.
- UV cure speed is preferably about 1.0 J/cm 2 , more preferably about 0.3 J/cm 2 or less at 95% of maximum attainable modulus.
- density at 25° C. is about 1.02 g/ml.
- the adhesive composition preferably has a viscosity of about 100 to about 30,000 mPas at 25° C. Elongation is preferably at least 2% or more.
- the shrinkage upon cure should be ⁇ 7%, with respect to the density of cured material.
- Bond strength is preferably rated about 4 to about 5. Shear strength is preferably about 10 lbs to about 50 lbs.
- Cured adhesive bonds are preferably stable under exposure to about 85° C. at about 85% relative humidity for at least 96 hrs.
- This invention provides an improved method for addressing the above-mentioned formulation difficulties.
- UV-curable compositions with good adherence to plastic, metallic, ceramic substrates, and cured CD lacquer.
- the compositions may therefore be useful for bonding single-sided digital versatile discs together or for bonding the individual layers comprising a single-sided disc.
- the hybrid free radical and cationic adhesives of the invention are particularly suitable for open face bonding of opaque substrates, thereby avoiding exposure of the substrates to high intensity UV radiation. Other substrates may also be bonded by the adhesive composition. Unexpectedly superior adhesiveness is achieved with this composition, providing an excellent material to meet adhesion requirements for digital versatile disc manufacture.
- the compounds forming the radiation curable adhesive compositions are combined to form a thixotropic mixture and coated on, for example, one surface of each of two polycarbonate substrates forming the DVD, which surfaces are already coated with an aluminum, gold or other layer encoded with audio, video or other information and protected by a UV curable lacquer.
- the adhesive is coated on the substrates by screen printing or other suitable method known in the art.
- the adhesive on the substrates is then cured with ultraviolet radiation at a dose of about 0.2-1.0 J/ cm 2 , preferably about 0.4 J/cm 2 .
- Radiation-cure may be effected using a fusion lamp equipped with a “H” bulb or a “D” bulb from Fusion Curing Systems, Rockville, Maryland, or the equivalent thereof, in an air atmosphere.
- the cured adhesive coated substrates are superimposed on each other with the adhesive bonding the substrate layers together, thereby forming a single DVD having one or preferably two layers of encoded audio or video information which may be read in a DVD player.
- Substrate layers which may be bonded by the invention in various combinations comprise plastics, metallics and ceramics.
- the adhesive composition are preferably applied to the disc layers by screen printing.
- optical disc adhesives are discussed in, for example, U.S. Pat. Nos. 4,861,637, 4,906,675 5,360,652, 5,663,211, 5,227,213 and 5,213,947 which are hereby incorporated in their entirety by reference.
- Optical disc production is described in, for example, Network Formation by Chain Crosslinking Photopolymerization and its Applications in Electronics, by J. G. Kloosterboer in ADV. POLYM. SCI ., 1988, 84, pp. 1-61, the complete disclosure of which is hereby incorporated by reference.
- Example I Production of a Hybrid Pressure Sensitive Urethane Acrylate Radiation-Curable Adhesive
- a solution containing a polycarbonate urethane diacrylate oligomer (Tg 14° C. Desotech); isobornylacrylate (IBOA), a vinyl ether diluent (DVE-3TM, ISP), mixed cycloaliphatic epoxides (UVR-6100TM, Union Carbide, Conn.) photoinitiators IRGACURE 184TM (Ciba Geigy) and mixed triarylsulfonium hexafluorophosphate salts (UVI 6990TM, Union Carbide, Conn.), the thiol additive adhesion promoter ⁇ -mercaptotrimethoxysilane and a tackifier (Sylvatac 1100TM, Hercules, N.C.) was prepared utilizing the proportions listed in Table 1.
- the reagents were, heated for 1 hr at 60° C., after which the components were mixed by shaking until homogeneous.
- the resulting material had a viscosity of 685 mPas, as measured by a PhysicaTM LC3 viscometer.
- the polymer having a distinct tackiness, was subsequently tested for adhesive properties on DVDs.
- An aluminum disc was spin coated with a protective coating at 5,000 rpm for 5s, then cured at 0.3 J/cm 2 using a Fusion H lamp.
- the protected aluminum disc was screen printed with an adhesive layer composed of the reagents of Table 1.
- a polycarbonate disc was likewise coated with an adhesive layer and cured. The two substrate discs were pressed together, avoiding the inclusion of any air bubbles.
- the adhesive between the discs was allowed to “dark” cure in the absence of additional UV radiation for 24 hours prior to testing.
- Impact resistance (bond strength) of the bonded discs when dropped onto concrete from a height of 75 cm was measured before and after the adhered discs were exposed to environmental stress (85° C. at 85% relative humidity(RH) for 500 hrs). Bond stress of bonded DVD were measured by comparing disc impact resistance before and after environmental stress exposure. The results of these tests are presented in Table 2
- Example II and III were tested according to the methodology for Example I.
- the compositions and test results of Example II and Example III are listed in Table 3.
- the polyurethane acrylated acrylic is characterized by Mn 1,000 and Tg ⁇ 10° C.
- Example II Components (Wt. %) (Wt. %) Acrylated acrylic oligomer 39 23.63 Isobornyl acrylate 15 20.7 Free radical initiator 1.8 2 Mixed cycloaliphatic epoxides 27.61 Bis-(3,4-epoxycyclohexyl) adipate 30.16 13.8 Vinyl ether diluent 3 2.42 Polyol 8 4.44 Antimonate salt cationic initiator 1.6 Phosphate salt cationic initiator 2 ⁇ -mercaptopropyltrimethoxysilane 1.2 1 CAB3B1-0.1 Thickener 2.2 Foam blast additive FB20F 0.24 0.2 Viscosity (cps @25° C.) 2530 1015 Texture Tacky Tacky Bond strength @ 25° C./40% RH 5 5 Bond strength @ 85° C./85% RH 5 5 (96 hrs)
- Cationic cure adhesive compositions may be formulated according to the second embodiment of the invention, providing a bisphenol-F epoxy resin is used. Accordingly, the components of Table 4 were combined, and used to bond DVD substrates as previously described. The properties and test results for the cationic cure adhesive are presented below.
- the viscosity was measured using a PHYSICA MC10 Viscometer. The test samples were examined and if an excessive amount of bubbles was present, steps were taken to remove most of the bubbles. Not all bubbles need to be removed at this stage, because the act of sample loading introduces some bubbles.
- the instrument was set up for the conventional Z3 system, which was used.
- the samples were loaded into a disposable aluminum cup by using the syringe to measure out 17 cc. Samples in the cup were examined for excessive amounts of bubbles, which if noted, were removed by a direct means such as centrifugation. Alternatively, enough time was allowed to elapse so as to let the bubbles escape from the bulk of the liquid. Bubbles at the top surface of the liquid were acceptable.
- the bob was gently lowered into the liquid in the measuring cup, and the cup and bob were installed in the instrument.
- the sample temperature was allowed to equilibrate with the temperature of the circulating liquid by waiting five minutes. Then, the rotational speed was set to a desired value which produced the desired shear rate.
- the desired value of the shear rate is easily determined by one of ordinary skill in the art from an expected viscosity range of the sample.
- the instrument panel read out a viscosity value, and if the viscosity value varied only slightly (less than 2% relative variation) for 15 seconds, the measurement was complete. If the reading varied, the temperature may not have reached an equilibrium value, or the material may have changed due to shearing. In the latter case, further testing at different shear rates is needed to define the sample's viscous properties. The results reported are the average viscosity values of three test samples.
- the bond strength of bonded digital versatile discs bonded with a cured adhesive was measured via a drop testing method.
- the cured, bonded discs were dropped a vertical distance of 3 feet to a concrete surface, such that the outer edges of the bonded discs impacted the concrete.
- the impact resistance of cured sample adhesive compositions was qualitatively rated as noted hereinbelow.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
| TABLE 1 | |||
| Example I | |||
| Components | wt. % | ||
| Polycarbonate urethane diacrylate | 21.6 | |
| oligomer | ||
| Isobornylacrylate diluent | 18.9 | |
| Free radical initiator | 1.35 |
| Epoxy resin | 330 pas |
| Vinyl ether diluent | 2.25 | |
| Diol | 4.41 | |
| Cationic initiator | 0.93 | |
| γ-mercaptopropyltrimethoxysilane | 0.9 | |
| Tackifier | 10 |
| Viscosity (@25° C.) | 685 cps | ||
| Texture | Tacky | ||
| TABLE 2 | |||
| Bonded Digital Versatile Discs | Values | ||
| Bond strength, @25° C./40% RH | 5 | ||
| (500 hrs) | |||
| Bond strength, @85° C./85% RH | 5 | ||
| (500 hrs) | |||
| TABLE 3 | ||||
| Example II | Example III | |||
| Components | (Wt. %) | (Wt. %) | ||
| Acrylated acrylic oligomer | 39 | 23.63 | |
| Isobornyl acrylate | 15 | 20.7 | |
| Free radical initiator | 1.8 | 2 | |
| Mixed cycloaliphatic epoxides | 27.61 | ||
| Bis-(3,4-epoxycyclohexyl) adipate | 30.16 | 13.8 | |
| Vinyl ether diluent | 3 | 2.42 | |
| Polyol | 8 | 4.44 | |
| Antimonate salt cationic initiator | 1.6 | ||
| Phosphate salt cationic initiator | 2 | ||
| γ-mercaptopropyltrimethoxysilane | 1.2 | 1 | |
| CAB3B1-0.1 Thickener | 2.2 | ||
| Foam blast additive FB20F | 0.24 | 0.2 | |
| Viscosity (cps @25° C.) | 2530 | 1015 |
| Texture | Tacky | Tacky |
| Bond strength @ 25° C./40% RH | 5 | 5 | ||
| Bond strength @ 85° C./85% RH | 5 | 5 | ||
| (96 hrs) | ||||
| TABLE 4 | |||
| Component | Values | ||
| Bisphenol-F epoxy resin | 5 | ||
| Sulfonium phosphate cationic | 5 | ||
| photoinitiator | |||
| Viscosity @25° C. | 3,000 cps | ||
| Bond Strength, @85° C./85% RH | 5 | ||
| (500 hrs) | |||
Claims (22)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/729,073 US6455121B1 (en) | 1998-06-01 | 2000-12-05 | Cationic and hybrid radiation-curable adhesives for bonding of optical discs |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/087,923 US6180200B1 (en) | 1998-06-01 | 1998-06-01 | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| US09/729,073 US6455121B1 (en) | 1998-06-01 | 2000-12-05 | Cationic and hybrid radiation-curable adhesives for bonding of optical discs |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/087,923 Continuation US6180200B1 (en) | 1998-06-01 | 1998-06-01 | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US6455121B1 true US6455121B1 (en) | 2002-09-24 |
Family
ID=22208077
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/087,923 Expired - Fee Related US6180200B1 (en) | 1998-06-01 | 1998-06-01 | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| US09/729,073 Expired - Fee Related US6455121B1 (en) | 1998-06-01 | 2000-12-05 | Cationic and hybrid radiation-curable adhesives for bonding of optical discs |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/087,923 Expired - Fee Related US6180200B1 (en) | 1998-06-01 | 1998-06-01 | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6180200B1 (en) |
| EP (1) | EP1093499A1 (en) |
| JP (1) | JP2002517541A (en) |
| KR (1) | KR20010052464A (en) |
| CN (1) | CN1303423A (en) |
| WO (1) | WO1999063017A1 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030000634A1 (en) * | 2000-02-22 | 2003-01-02 | Martin Eichlseder | Method and device for producing a dvd |
| US6645595B2 (en) * | 1999-08-23 | 2003-11-11 | Sony Chemicals Corp. | Optical medium |
| US6663935B1 (en) * | 1999-05-17 | 2003-12-16 | Sony Corporation | Disk-like multilayer information recording medium and production method thereof |
| US20050072519A1 (en) * | 2003-10-03 | 2005-04-07 | David Johnson | Photocurable compositions for articles having stable tensile properties |
| US20050256219A1 (en) * | 2002-03-11 | 2005-11-17 | Hideaki Takase | Photocurable resin composition and optical component |
| US20070065624A1 (en) * | 2005-09-15 | 2007-03-22 | Kabushiki Kaisha Toshiba | Optical recording medium |
| US20070092733A1 (en) * | 2005-10-26 | 2007-04-26 | 3M Innovative Properties Company | Concurrently curable hybrid adhesive composition |
| US20110201717A1 (en) * | 2007-12-28 | 2011-08-18 | E. I. Du Pont De Nemours And Company | Actinically curable adhesive composition |
| US9109142B2 (en) | 2008-06-06 | 2015-08-18 | Nitto Denko Corporation | Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| WO2015164095A2 (en) | 2014-04-21 | 2015-10-29 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| WO2016077984A1 (en) * | 2014-11-18 | 2016-05-26 | Henkel (China) Company Limited | Photo-curable adhesive composition, preparation and use thereof |
| EP3134445A4 (en) * | 2014-04-21 | 2018-01-10 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| CN111748312A (en) * | 2020-06-22 | 2020-10-09 | 江苏泰特尔新材料科技有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| WO2021083632A1 (en) | 2019-10-31 | 2021-05-06 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Composition curable cationically in a moisture-induced manner, use of the composition and method of joining, encapsulating and coating substrates |
| WO2023147993A1 (en) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Cationically polymerisable flame-retardant materials |
| DE102022106647A1 (en) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Low-temperature curing compounds based on glycidyl ethers |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6406770B1 (en) * | 1997-12-26 | 2002-06-18 | Dainippon Ink And Chemicals, Inc. | Optical disk and method of manufacturing optical disk |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| EP1083557A4 (en) * | 1999-03-23 | 2005-04-13 | Dainippon Ink & Chemicals | DEVICE FOR PRODUCING OPTICAL PLATES |
| JP2001093197A (en) * | 1999-09-27 | 2001-04-06 | Matsushita Electric Ind Co Ltd | Optical recording medium manufacturing equipment |
| JP4164722B2 (en) * | 1999-12-08 | 2008-10-15 | Dic株式会社 | Optical disc and ultraviolet curable composition for optical disc |
| US6579914B1 (en) * | 2000-07-14 | 2003-06-17 | Alcatel | Coating compositions for optical waveguides and optical waveguides coated therewith |
| US6800371B2 (en) * | 2001-03-07 | 2004-10-05 | 3M Innovative Properties Company | Adhesives and adhesive compositions containing thioether groups |
| CN1248212C (en) | 2001-05-17 | 2006-03-29 | 日本化药株式会社 | Adhesive for optical disk and optical disk |
| US6949297B2 (en) * | 2001-11-02 | 2005-09-27 | 3M Innovative Properties Company | Hybrid adhesives, articles, and methods |
| EP1375617A1 (en) * | 2002-06-19 | 2004-01-02 | 3M Innovative Properties Company | Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive |
| US6884315B2 (en) * | 2002-08-20 | 2005-04-26 | Ucb, S.A. | Method for bonding DVD layers |
| US6887917B2 (en) * | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
| US7700151B2 (en) | 2003-04-11 | 2010-04-20 | Henkel Ag & Co. Kgaa | Process for making pressure sensitive adhesive tapes from cationic cure adhesives |
| US7927703B2 (en) * | 2003-04-11 | 2011-04-19 | 3M Innovative Properties Company | Adhesive blends, articles, and methods |
| MXPA06001812A (en) * | 2003-08-20 | 2006-05-17 | Koninkl Philips Electronics Nv | Non-leaching adhesive system and its use in a liquid immersion objective. |
| US7081545B2 (en) * | 2003-12-31 | 2006-07-25 | 3M Innovative Properties Company | Process for preparing fluorochemical monoisocyanates |
| US7255920B2 (en) * | 2004-07-29 | 2007-08-14 | 3M Innovative Properties Company | (Meth)acrylate block copolymer pressure sensitive adhesives |
| KR101192776B1 (en) | 2005-06-30 | 2012-10-18 | 엘지디스플레이 주식회사 | A adhesive for mold and a method for bonding the mold using the same |
| US20070197362A1 (en) * | 2006-02-02 | 2007-08-23 | Bridgestone Corporation | Conductive elastic roller and image forming apparatus comprising the same |
| US7491287B2 (en) * | 2006-06-09 | 2009-02-17 | 3M Innovative Properties Company | Bonding method with flowable adhesive composition |
| WO2010140442A1 (en) * | 2009-06-01 | 2010-12-09 | 日東電工株式会社 | Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| JP5716881B2 (en) * | 2008-10-04 | 2015-05-13 | スリーボンドファインケミカル株式会社 | Photocurable adhesive composition |
| CN101592859B (en) * | 2009-06-24 | 2011-12-28 | 广州机械科学研究院 | Stereolithography rapid prototyping photosensitive resin, preparation method and application thereof |
| CN102086372B (en) * | 2009-12-03 | 2013-08-28 | 上海康达化工新材料股份有限公司 | Radiation curing adhesive and preparation method thereof |
| CN102781911B (en) | 2010-02-24 | 2015-07-22 | 巴斯夫欧洲公司 | Latent acids and their use |
| JP5711767B2 (en) | 2010-03-09 | 2015-05-07 | ヘンケル ユーエス アイピー エルエルシー | Cationic UV cross-linked acrylic polymer for pressure sensitive adhesives |
| DE102010037592A1 (en) * | 2010-09-16 | 2012-03-22 | Steinemann Technology Ag | Process for producing a laminate and associated sheet laminating machine |
| KR101072371B1 (en) * | 2010-09-20 | 2011-10-11 | 주식회사 엘지화학 | Adhesive for polarizing plate and polarizing plate comprising same |
| CN103298898B (en) * | 2010-11-08 | 2015-11-25 | Lg化学株式会社 | pressure sensitive adhesive composition |
| CN102199402A (en) * | 2011-03-18 | 2011-09-28 | 武汉大学 | Ultraviolet curing adhesive for transfer printing film |
| KR101898753B1 (en) | 2011-04-04 | 2018-09-13 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Optical stack comprising adhesive |
| CN103087640A (en) * | 2011-11-08 | 2013-05-08 | 汉高股份有限公司 | Dual-curing adhesive composition and application thereof and method for bonding substrates |
| CN102585755A (en) * | 2012-02-28 | 2012-07-18 | 常州天合光能有限公司 | Solar component package material capable of being cured through ultraviolet |
| JP5335126B1 (en) * | 2012-03-30 | 2013-11-06 | 日新製鋼株式会社 | Composite in which painted metal base material and molded body of thermoplastic resin composition are joined, and method for producing the same |
| CN102952503B (en) * | 2012-11-29 | 2015-11-25 | 明尼苏达矿业制造特殊材料(上海)有限公司 | High temperature resistant pressure sensitive adhesive composition and high temperature resistant pressure sensitive adhesive band |
| CN104277720B (en) | 2013-07-08 | 2017-07-21 | 三星Sdi株式会社 | Adhesive composition, binder film, polarization plates and display device |
| JP6273103B2 (en) * | 2013-07-08 | 2018-01-31 | サムスン エスディアイ カンパニー,リミテッドSamsung Sdi Co.,Ltd. | Adhesive composition for polarizing plate |
| US9580621B2 (en) | 2013-09-09 | 2017-02-28 | Dymax Corporation | High temperature resistance, radiation curable maskant for metal substrates |
| US10928563B2 (en) | 2013-10-02 | 2021-02-23 | 3M Innovative Properties Company | Microstructured diffuser comprising first microstructured layer and coating, optical stacks, and method |
| US9850405B2 (en) | 2013-10-02 | 2017-12-26 | 3M Innovative Properties Company | Article comprising polyacrylate pressure sensitive primer and adhesive comprising polyacrylate component |
| US10113089B2 (en) | 2013-10-02 | 2018-10-30 | 3M Innovative Properties Company | Articles and methods comprising polyacrylate primer with nitrogen-containing polymer |
| CN103937303B (en) * | 2014-03-21 | 2017-06-06 | 中国科学院化学研究所 | A kind of cationic polymerization hydrophilic coating materials and its application in printing plate preparation |
| JP6370086B2 (en) * | 2014-04-23 | 2018-08-08 | 株式会社ディスコ | Resin composition and plate fixing method |
| JP6292400B2 (en) * | 2014-06-06 | 2018-03-14 | 東亞合成株式会社 | Active energy ray-curable adhesive composition for plastic film or sheet |
| JP6384234B2 (en) * | 2014-09-25 | 2018-09-05 | デクセリアルズ株式会社 | Radical polymerization type adhesive composition and method for producing electrical connector |
| KR102537349B1 (en) | 2015-02-02 | 2023-05-26 | 바스프 에스이 | Potential Acids and Their Uses |
| TWI586780B (en) | 2015-03-23 | 2017-06-11 | 阿科瑪法國公司 | Pressure sensitive adhesives |
| WO2017048984A1 (en) | 2015-09-15 | 2017-03-23 | G3 Enterprises, Inc. | Apparatus and methods for alternative coatings applicable to metal |
| KR101819306B1 (en) | 2015-12-23 | 2018-01-17 | 주식회사 포스코 | Ink composition for print steel plate having superior adhesion, method for producing print steel plate using the same, and print steel plate prepared thereby |
| CN105441001A (en) * | 2015-12-24 | 2016-03-30 | 深圳市浩力新材料技术有限公司 | High-performance adhesive for optical communication devices and preparation method thereof |
| CN105602460B (en) * | 2016-01-18 | 2018-05-25 | 厦门百安兴新材料有限公司 | One kind can rapid curing two ingredient elastic gap filler and preparation method thereof |
| CN105647400B (en) * | 2016-01-18 | 2018-08-31 | 佛山市佳密特防水材料有限公司 | A kind of two ingredient elastic gap filler and preparation method thereof |
| JP6983457B2 (en) | 2016-11-25 | 2021-12-17 | エルジー・ケム・リミテッド | Curable composition |
| US11707763B2 (en) * | 2018-11-20 | 2023-07-25 | G3 Enterprises, Inc. | Apparatus and methods using coatings for metal applications |
| WO2020172417A1 (en) * | 2019-02-20 | 2020-08-27 | Adhesives Research, Inc. | Uv light curable adhesive and device with uv light curable adhesive |
| CN111592836B (en) * | 2019-02-21 | 2022-11-04 | 3M创新有限公司 | UV (ultraviolet) debonding pressure-sensitive adhesive composition and pressure-sensitive adhesive tape |
| EP3976724A4 (en) * | 2019-05-28 | 2023-06-14 | 3M Innovative Properties Company | CURABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION, CURABLE PRESSURE SENSITIVE TAPE AND BATTERY PACK |
| CN112011293B (en) * | 2019-05-28 | 2022-10-04 | 3M创新有限公司 | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape and battery pack |
| EP4097189A4 (en) * | 2020-01-27 | 2024-02-21 | Henkel AG & Co. KGaA | LOW MODULE, HIGH CREEP RECOVERY POLYMER SYSTEMS AND PREPARATION PROCESSES THEREOF |
| CN112778913B (en) * | 2020-12-30 | 2022-11-08 | 东莞市派乐玛新材料技术开发有限公司 | A kind of UV curable glue and its preparation method and application |
| CN113214768A (en) * | 2021-05-17 | 2021-08-06 | 南京中贝新材料科技有限公司 | UV curing adhesive and preparation method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4694029A (en) | 1985-04-09 | 1987-09-15 | Cook Paint And Varnish Company | Hybrid photocure system |
| US5227213A (en) | 1987-11-30 | 1993-07-13 | Sunstar Giken Kabushiki Kaisha | Hot melt adhesive crosslinkable by ultraviolet irradiation, optical disc using the same and process for preparing thereof |
| US5252694A (en) | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
| US5360652A (en) | 1991-11-18 | 1994-11-01 | Pioneer Electronic Corporation | Optical recording disc |
| US5491193A (en) | 1991-10-07 | 1996-02-13 | Shell Oil Company | Crosslinked epoxy functionalized polydiene block polymers and adhesives |
| US5595824A (en) | 1993-06-30 | 1997-01-21 | Imation Corp. | Magnetic recording media incorporating a polyisocyanate crosslinking agent system comprising two difunctional and one trifunctional diisocyanate adducts |
| US5663211A (en) | 1994-06-27 | 1997-09-02 | Sony Chemicals Corporation | Ultraviolet curing resin having low primary irritation index for optical disk |
| US5721289A (en) | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| WO1998036325A1 (en) | 1997-02-13 | 1998-08-20 | Dsm N.V. | Photocurable resin composition |
| US5897727A (en) | 1996-09-20 | 1999-04-27 | Minnesota Mining And Manufacturing Company | Method for assembling layers with a transfer process using a crosslinkable adhesive layer |
| US6017603A (en) | 1995-04-28 | 2000-01-25 | Nippon Kayaku Kabushiki Kaisha | Ultraviolet-curing adhesive composition and article |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
-
1998
- 1998-06-01 US US09/087,923 patent/US6180200B1/en not_active Expired - Fee Related
-
1999
- 1999-05-31 KR KR1020007013519A patent/KR20010052464A/en not_active Withdrawn
- 1999-05-31 WO PCT/NL1999/000335 patent/WO1999063017A1/en not_active Ceased
- 1999-05-31 EP EP99925468A patent/EP1093499A1/en not_active Withdrawn
- 1999-05-31 JP JP2000552215A patent/JP2002517541A/en active Pending
- 1999-05-31 CN CN99806848A patent/CN1303423A/en active Pending
-
2000
- 2000-12-05 US US09/729,073 patent/US6455121B1/en not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4694029A (en) | 1985-04-09 | 1987-09-15 | Cook Paint And Varnish Company | Hybrid photocure system |
| US5227213A (en) | 1987-11-30 | 1993-07-13 | Sunstar Giken Kabushiki Kaisha | Hot melt adhesive crosslinkable by ultraviolet irradiation, optical disc using the same and process for preparing thereof |
| US5491193A (en) | 1991-10-07 | 1996-02-13 | Shell Oil Company | Crosslinked epoxy functionalized polydiene block polymers and adhesives |
| US5360652A (en) | 1991-11-18 | 1994-11-01 | Pioneer Electronic Corporation | Optical recording disc |
| US5252694A (en) | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
| US5399637A (en) | 1992-01-22 | 1995-03-21 | Minnesota Mining And Manufacturing Company | Energy-polymerizable adhesive, coating, and film |
| US5595824A (en) | 1993-06-30 | 1997-01-21 | Imation Corp. | Magnetic recording media incorporating a polyisocyanate crosslinking agent system comprising two difunctional and one trifunctional diisocyanate adducts |
| US5663211A (en) | 1994-06-27 | 1997-09-02 | Sony Chemicals Corporation | Ultraviolet curing resin having low primary irritation index for optical disk |
| US5721289A (en) | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| US6017603A (en) | 1995-04-28 | 2000-01-25 | Nippon Kayaku Kabushiki Kaisha | Ultraviolet-curing adhesive composition and article |
| US5897727A (en) | 1996-09-20 | 1999-04-27 | Minnesota Mining And Manufacturing Company | Method for assembling layers with a transfer process using a crosslinkable adhesive layer |
| WO1998036325A1 (en) | 1997-02-13 | 1998-08-20 | Dsm N.V. | Photocurable resin composition |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
Non-Patent Citations (2)
| Title |
|---|
| J.P. Fouassier and J.F. Rabek, "Radiation Curing in Polymer Science and Technology", Practical Aspects and Applications, vol. IV. |
| Union Carbide Chemicals and Plastics Company, Inc., Cyracure, "Cycloaliphatic Epoxides", Cationinc UV Cure, pp. 1-24. |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6663935B1 (en) * | 1999-05-17 | 2003-12-16 | Sony Corporation | Disk-like multilayer information recording medium and production method thereof |
| US6645595B2 (en) * | 1999-08-23 | 2003-11-11 | Sony Chemicals Corp. | Optical medium |
| US20030000634A1 (en) * | 2000-02-22 | 2003-01-02 | Martin Eichlseder | Method and device for producing a dvd |
| US20050256219A1 (en) * | 2002-03-11 | 2005-11-17 | Hideaki Takase | Photocurable resin composition and optical component |
| US20050072519A1 (en) * | 2003-10-03 | 2005-04-07 | David Johnson | Photocurable compositions for articles having stable tensile properties |
| US7232850B2 (en) * | 2003-10-03 | 2007-06-19 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
| US20070256781A1 (en) * | 2003-10-03 | 2007-11-08 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
| US7718111B2 (en) * | 2003-10-03 | 2010-05-18 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
| US20070065624A1 (en) * | 2005-09-15 | 2007-03-22 | Kabushiki Kaisha Toshiba | Optical recording medium |
| US20070092733A1 (en) * | 2005-10-26 | 2007-04-26 | 3M Innovative Properties Company | Concurrently curable hybrid adhesive composition |
| US20110201717A1 (en) * | 2007-12-28 | 2011-08-18 | E. I. Du Pont De Nemours And Company | Actinically curable adhesive composition |
| US9109142B2 (en) | 2008-06-06 | 2015-08-18 | Nitto Denko Corporation | Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| WO2015164095A2 (en) | 2014-04-21 | 2015-10-29 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| US10808072B2 (en) | 2014-04-21 | 2020-10-20 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| WO2015164095A3 (en) * | 2014-04-21 | 2016-12-08 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| US11505645B2 (en) | 2014-04-21 | 2022-11-22 | Henkel Ag & Co., Kgaa | Curable adhesive compositions and use thereof |
| EP3134445A4 (en) * | 2014-04-21 | 2018-01-10 | Henkel IP & Holding GmbH | Curable adhesive compositions and use thereof |
| US10717907B2 (en) | 2014-11-18 | 2020-07-21 | Henkel Ag & Co. Kgaa | Photo-curable adhesive composition, preparation and use thereof |
| WO2016077984A1 (en) * | 2014-11-18 | 2016-05-26 | Henkel (China) Company Limited | Photo-curable adhesive composition, preparation and use thereof |
| US20170253780A1 (en) * | 2014-11-18 | 2017-09-07 | Henkel Ag & Co. Kgaa | Photo-curable adhesive composition, preparation and use thereof |
| WO2021083632A1 (en) | 2019-10-31 | 2021-05-06 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Composition curable cationically in a moisture-induced manner, use of the composition and method of joining, encapsulating and coating substrates |
| CN111748312A (en) * | 2020-06-22 | 2020-10-09 | 江苏泰特尔新材料科技有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| CN111748312B (en) * | 2020-06-22 | 2022-04-29 | 江苏泰特尔新材料科技股份有限公司 | Cationic free radical dual-curing adhesive and preparation method thereof |
| WO2023147993A1 (en) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Cationically polymerisable flame-retardant materials |
| DE102022102650A1 (en) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Cationically polymerizable flame-retardant masses |
| DE102022106647A1 (en) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Low-temperature curing compounds based on glycidyl ethers |
| WO2023180035A1 (en) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Low-temperature-curing compounds based on glycidyl ethers |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010052464A (en) | 2001-06-25 |
| JP2002517541A (en) | 2002-06-18 |
| US6180200B1 (en) | 2001-01-30 |
| EP1093499A1 (en) | 2001-04-25 |
| CN1303423A (en) | 2001-07-11 |
| WO1999063017A1 (en) | 1999-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6455121B1 (en) | Cationic and hybrid radiation-curable adhesives for bonding of optical discs | |
| US6472451B2 (en) | Radiation curable adhesive for digital versatile disc | |
| EP0889465B1 (en) | A photo-curing resin composition for DVD | |
| JP3775760B2 (en) | UV curable adhesive composition, cured product, article and bonding method | |
| KR100491543B1 (en) | UV Curing Adhesive Composition | |
| US20110033650A1 (en) | Ultraviolet-curable composition for light-transmission layer and optical disk | |
| JP2003263780A (en) | Optical information media | |
| EP1082398A1 (en) | Radiation curable adhesive for digital versatile disc | |
| US6645596B1 (en) | Optical disk and ultraviolet-curing composition for optical disk | |
| US20030175618A1 (en) | Method of recording/reproducing with blue-purple laser light and information recording medium suitable for the same | |
| JP3888485B2 (en) | UV curable composition | |
| JPH107751A (en) | Resin composition, its cured item, and its article | |
| KR20060079793A (en) | UV curable resin composition and cured product thereof | |
| EP1906400B1 (en) | Ultraviolet-curable resin composition and optical information recording medium | |
| JPH10182779A (en) | Ultraviolet light curable type composition | |
| JPH05132534A (en) | UV curable resin composition | |
| JP2006257342A (en) | Ultraviolet curable composition for optical disc and optical disc using the same | |
| JP3886956B2 (en) | UV curable adhesive composition, cured product, article and bonding method | |
| JP2000345073A (en) | UV curable composition and optical disk using the same | |
| JPS61139954A (en) | Optical information recording medium | |
| JPH10245467A (en) | UV curable composition | |
| JPH02292745A (en) | Optical disk | |
| HK1145046A (en) | Ultraviolet-curable composition for light-transmitting layer and optical disk |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: DSM N.V., NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HA, CHAU THI MINH;SULLIVAN, MICHAEL G.;REEL/FRAME:011326/0559;SIGNING DATES FROM 19980806 TO 19980807 |
|
| AS | Assignment |
Owner name: DSM IP ASSETS B.V., NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DSM N.V.;REEL/FRAME:014863/0133 Effective date: 20031208 |
|
| REMI | Maintenance fee reminder mailed | ||
| LAPS | Lapse for failure to pay maintenance fees | ||
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
| FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20060924 |