US3729393A - Electrodeposition of copper - Google Patents
Electrodeposition of copper Download PDFInfo
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- US3729393A US3729393A US00132236A US3729393DA US3729393A US 3729393 A US3729393 A US 3729393A US 00132236 A US00132236 A US 00132236A US 3729393D A US3729393D A US 3729393DA US 3729393 A US3729393 A US 3729393A
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- Prior art keywords
- brightener
- copper
- heterocyclic
- auxiliary
- electrolyte
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 11
- 239000010949 copper Substances 0.000 title description 11
- 229910052802 copper Inorganic materials 0.000 title description 11
- 238000004070 electrodeposition Methods 0.000 title description 6
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 abstract description 12
- 239000002253 acid Substances 0.000 abstract description 10
- 238000005282 brightening Methods 0.000 abstract description 10
- 150000007513 acids Chemical class 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 4
- 239000002243 precursor Substances 0.000 abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 3
- 239000001257 hydrogen Substances 0.000 abstract description 3
- 239000005864 Sulphur Chemical group 0.000 abstract description 2
- 150000003230 pyrimidines Chemical class 0.000 abstract description 2
- 150000004867 thiadiazoles Chemical class 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 abstract 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 description 25
- 125000000623 heterocyclic group Chemical group 0.000 description 16
- 239000000654 additive Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- -1 alkali metal copper pyrophosphate Chemical class 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 9
- 229910052783 alkali metal Inorganic materials 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 235000011180 diphosphates Nutrition 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical class SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 150000001879 copper Chemical class 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- ZFRKEVMBGBIBGT-UHFFFAOYSA-N ethenyl benzenesulfonate Chemical compound C=COS(=O)(=O)C1=CC=CC=C1 ZFRKEVMBGBIBGT-UHFFFAOYSA-N 0.000 description 4
- GPUMPJNVOBTUFM-UHFFFAOYSA-N naphthalene-1,2,3-trisulfonic acid Chemical compound C1=CC=C2C(S(O)(=O)=O)=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC2=C1 GPUMPJNVOBTUFM-UHFFFAOYSA-N 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 4
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 3
- 125000002373 5 membered heterocyclic group Chemical group 0.000 description 3
- 125000004070 6 membered heterocyclic group Chemical group 0.000 description 3
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical class SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 3
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 3
- JJJPTTANZGDADF-UHFFFAOYSA-N thiadiazole-4-thiol Chemical class SC1=CSN=N1 JJJPTTANZGDADF-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000001768 cations Chemical group 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical group [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- SQAINHDHICKHLX-UHFFFAOYSA-N 1-naphthaldehyde Chemical class C1=CC=C2C(C=O)=CC=CC2=C1 SQAINHDHICKHLX-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- HWGBHCRJGXAGEU-UHFFFAOYSA-N Methylthiouracil Chemical compound CC1=CC(=O)NC(=S)N1 HWGBHCRJGXAGEU-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- OMNSJWQRKOCQOJ-UHFFFAOYSA-N ethenyl benzenesulfonate;potassium Chemical group [K].C=COS(=O)(=O)C1=CC=CC=C1 OMNSJWQRKOCQOJ-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- BGHJOVPDUCMEAT-UHFFFAOYSA-M potassium;phenylmethanesulfonate Chemical compound [K+].[O-]S(=O)(=O)CC1=CC=CC=C1 BGHJOVPDUCMEAT-UHFFFAOYSA-M 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 235000011044 succinic acid Nutrition 0.000 description 1
- 150000003444 succinic acids Chemical class 0.000 description 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 description 1
- RHZZVWTVJHZKAH-UHFFFAOYSA-K trisodium;naphthalene-1,2,3-trisulfonate Chemical group [Na+].[Na+].[Na+].C1=CC=C2C(S([O-])(=O)=O)=C(S([O-])(=O)=O)C(S(=O)(=O)[O-])=CC2=C1 RHZZVWTVJHZKAH-UHFFFAOYSA-K 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- Brightening compositions for copper pyrophosphate electroplating solutions comprising a heterocycllc brightener of the type which consists of a group contained in a 5 or 6 membered heterocyclic ring system where Q represents nitrogen or sulphur and M is hydrogen or a cation (such as mercapto thiazoles, thiadiazoles or pyrimidines), or a precursor thereof; and an auxiliary brightener selected from aryl or alkaryl-sulphonic acids having at least 7 carbon atoms.
- the present invention relates to improvements in the electrodeposition of copper.
- a characteristic feature of these plating solutions is that in conjunction with suitable brightening additives they may be used to form highly specular mirror bright finishes which do not require subsequent mechanical polishing. In this they differ from the conventional acid copper plating systems and from copper cyanide systems, which produce matt finishes. Brighteners used in the former solutions are intended to improve the specularity of the bright finish whereas those used in the latter systems are designed to make the matt finish more amenable to mechanical polish-
- Various heterocyclic compounds have been proposed as brightener additives for alkaline pyrophosphate electroplating compositions and some of these have found particular favour in the art.
- a group of these heterocyclic compounds is characterized by the presence of the groupmg:
- the invention therefore provides a brightening composition for use in the electrodeposition of copper from a copper pyrophosphate electrolyte, which composition comprises a primary brightener which is a mercaptoheterocyclic compound containing the group:
- ii-SM contained in a 5- or 6-membered heterocyclic ring, where Q represents a nitrogen or sulphur atom and M is hydrogen or a cation such that the compound is water-soluble; and an auxiliary brightener selected from polycarboxylic or alkaryl sulphonic acids having at least 7 carbon atoms; malonic acid, 4,S-imidazole-dicarboxylic acid, imino-diacetic acid, water-soluble ammonium or alkali metal salts and anhydrides of the aforesaid acids, and hydroxyethyl cellulose.
- an auxiliary brightener selected from polycarboxylic or alkaryl sulphonic acids having at least 7 carbon atoms; malonic acid, 4,S-imidazole-dicarboxylic acid, imino-diacetic acid, water-soluble ammonium or alkali metal salts and anhydrides of the aforesaid acids, and hydroxyethyl cellulose.
- the invention further provides an aqueous electrolyte for copper plating having dissolved therein a copper salt, an alkali metal pyrophosphate in an amount at least sufficient to form the complex X Cu(P O where X represents an alkali metal, and a minor proportion of a brightening composition according to the invention.
- the invention also provides a process for the electrodeposition of copper using an aqueous electrolyte of the invention.
- heterocyclic brighteners for present use are examplified: by the mercapto-thiazole compounds described in specification No. 940,282, for example 2-mercapto-1, 3- thiazole and Z-mercapto-benthiazole; by the Z-mercapto- 1, 3,4-thiadiazole compounds described in specification No. 939,997, for example 2,5-dimercapto-1,3,4-thiadiazole, 2- mercapto-S-methylmercapto-1,3,4-thiadiazole and 2- mer capto-S-n-butylmercapto-1,3,4-thiadiazole; and by the 2- mercapto-iminazole and Z-mercapto pyrimidines described in specification No.
- 1,051,150 for example Z-mercapto-lmethyliminazole, Z-mercaptopyrimidine, 6-hydroXy-2 mercaptopyrimidine and 6-hydroxy-2-mercapto-4-methylpyrimidine.
- precursors of the compounds described above By precursor is meant herein a compound which when dissolved in the copper pyrophosphate electrolyte provides in solution a compound containing the structure(II).
- auxiliary brighteners for present use are for the most part acids which will normally be used as sodium, potassium or ammonium salts.
- acids which will normally be used as sodium, potassium or ammonium salts.
- alkaryl sulphonates wherein the salt has less than carbon atoms in each alkyl chain and preferably less than 5 aliphatic carbon atoms per sulphonate group.
- Alkaryl sulphonates with longer alkyl groups generally are insufiiciently efiective to be of commercial value for present purposes.
- Suitable salts include potassium toluene sulphonate, sodium xylene sulphonate, salts of sulphonated naphthalene-formaldehyde condensates, for example methylene bis-(naphthalene-sulphonates), and salts of sulphonated polystyrenes.
- organic diand polycarboxylic acids or anhydrides thereof having more than 7 carbon atoms there may also be used, usually in the form of watersoluble salts, organic diand polycarboxylic acids or anhydrides thereof having more than 7 carbon atoms.
- these compounds there can be mentioned suberic acid, azelaic acid, and sebacic acid as well as adducts of the type formed when a dienophilic carboxylic acid such as maleic anhydride is condensed with a conjugally unsaturated hydrocarbon such as polyiso-butylene, for example the alkylor alkenyl-substituted succinic acids and anhydrides wherein the alkyl or alkenyl group contains from 30-150 carbon atoms.
- the heterocyclic brightening agent is employed in a proportion of at least 0.001 gram per litre of the total weight of electrolyte and preferably from 1 to mg. per litre.
- the optimum concentration may vary from 2 to 4 mg. per litre depending upon the nature of the auxiliary brightener present.
- the auxiliary brightener is employed in a proportion of from 1 p.p.m. to saturation, preferably from 2 to 100 p.p.m., for example 3 to 6 p.p.m.
- the copper plating electrolytes of the invention have a similar constitution with respect to the concentration of copper salt and pyrophosphate as those conventionally employed, for example as described in the above-mentioned specifications.
- These electrolytes may contain other additives that are conventionally em ployed in this type of electrolyte in addition to the heterocyclic brighteners.
- the electrolyte may be employed for plating metal articles in accordance with known procedures.
- Standard solutions were made by using 3 heterocyclic brighteners, namely 2,S-dimercapto-l,3,4- thiadiazole, 2-mercaptobenzimidazole and Z-mercaptobenzthiazole. The solutions were obtained at a pH of 8.8 at a temperature of 55 C.
- Plating was carried out on brass panels with a current density of 30 amps per sq. ft. under air agitation.
- auxiliary brightener provided improved brightening and levelling action without skip plating.
- An improved process for electrodepositing copper from an aqueous copper pyrophosphate electrolyte wherein copper is electrodeposited from electrolyte consisting essentially of an alkaline aqueous solution containing dissolved therein a copper salt and an alkali metal pyrophosphate in an amount at least sufficient to form the complex salt X Cu(P O and from one part per million to saturation of a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles and mercaptopyrimidines, the improvement comprising admixing in said electrolyte between two part per million and saturations of an auxiliary brightener selected from (i) alkylaryl sulphonic acids having at least 7 carbon atoms and containing less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinyl benzene sulphonate
- auxiliary brightener is sodium xylene sulphonate.
- auxiliary brightener is sodium toluene sulphonate.
- auxiliary brightener is vinyl benzene sulphonate.
- auxiliary brightener is methylene bisnaphthylene sulphonate.
- auxillessnessy brightener is added in a concentration of from 1 to parts per million.
- An improved copper pyrophosphate electroplating electrolyte consisting essentially of an alkaline aqueous solution containing dissolved therein a copper salt and an alkali metal pyrophosphate in an amount at least sufi'icient to form the complex salt X Cu(P O and from one part per million to saturation of a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles and mercapto-pyrimidines, the improvement wherein said electrolyte also contains an auxiliary brightener selected from (i) alkylaryl sulphonic acids having at least 7 carbon atoms and containing less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinylbenzene sulphonate, (iii) naphthalene trisulphonate, and (iv) polysty
- An electrolyte according to claim 12 wherein the heterocyclic brightner is present in a concentration of from 1 to 10 parts per million.
- An electrolyte according to claim 12 containing from 2 to 100 parts per million of the auxiliary brightener.
- An additive for use in aqueous copper pyrophosphate electroplating solutions consisting essentially of (a) a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles, and mercaptopyrimidines and (b) an auxiliary brightener selected from (i) alkyaryl sulphonic acids having at least 7 carbon atoms, and contining less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinylbenzene sulphonate, (iii) naphthalene trisulphonate, and (iv) polystyrene sulphonate.
- a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles, and
- auxiliary brightner is sodium xylene sulphonate.
- auxiliary brightner is sodium toluene sulphonate.
- auxiliary brightener is sodium naphthalene trisulphonate.
- auxiliary brightner is potassium vinyl benzene sulphonate.
- auxiliary brightner is sodium methylene bisnaphthylene sulphonate.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
BRIGHTENING COMPOSITIONS FOR COPPER PYROPHOSPHATE ELECTROPLATING SOLUTIONS COMPRISING A HETEROCYCLIC BRIGHTENER OF THE TYPE WHICH CONSISTS OF A
-N=C(-S-M)-Q-
GROUP CONTAINED IN A 5 OR 6 MEMBERED HETEROCYCLICRING SYSTEM WHERE Q REPRESENTS NITROGEN OR SULPHUR ANDM IS HYDROGEN OR A CATION (SUCH AS MERCAPTO THIAZOLES, THIADIAZOLES OR PYRIMIDINES), OR A PRECURSOR THEREOF, AD AN AUXILLIARY BRIGHTENER SELECTED FROM ARYL OR ALKARYL-SULPHONIC ACIDS HAVING AT LEAST 7 CARBON ATOMS.
-N=C(-S-M)-Q-
GROUP CONTAINED IN A 5 OR 6 MEMBERED HETEROCYCLICRING SYSTEM WHERE Q REPRESENTS NITROGEN OR SULPHUR ANDM IS HYDROGEN OR A CATION (SUCH AS MERCAPTO THIAZOLES, THIADIAZOLES OR PYRIMIDINES), OR A PRECURSOR THEREOF, AD AN AUXILLIARY BRIGHTENER SELECTED FROM ARYL OR ALKARYL-SULPHONIC ACIDS HAVING AT LEAST 7 CARBON ATOMS.
Description
United States Patent 3,729,393 ELECTRODEPOSITION OF COPPER Derek Martin Lyde, Stourbridge, England, assignor to Albright & Wilson Limited, Oldbnry, Worcestershire, England No Drawing. Original application Apr. 25, 1968, Ser. No. 724,225. Divided and this application Apr..7, 1971, Ser. No. 132,236 Claims priority, application Great Britain, May 1, 1967, 19,989/67 Int. C1. C23!) 5/18 US. Cl. 20452 R 22 Claims ABSTRACT OF THE DISCLOSURE Brightening compositions for copper pyrophosphate electroplating solutions comprising a heterocycllc brightener of the type which consists of a group contained in a 5 or 6 membered heterocyclic ring system where Q represents nitrogen or sulphur and M is hydrogen or a cation (such as mercapto thiazoles, thiadiazoles or pyrimidines), or a precursor thereof; and an auxiliary brightener selected from aryl or alkaryl-sulphonic acids having at least 7 carbon atoms.
This application is a division of application S.N. 724,225, filed Apr. 25, 1968, now abandoned.
The present invention relates to improvements in the electrodeposition of copper.
It is known to carry out the electrodeposition of copper from alkaline solutions containing an alkali metal copper pyrophosphate complex of the Formula X Cu(P O where X represents an alkali metal.
A characteristic feature of these plating solutions is that in conjunction with suitable brightening additives they may be used to form highly specular mirror bright finishes which do not require subsequent mechanical polishing. In this they differ from the conventional acid copper plating systems and from copper cyanide systems, which produce matt finishes. Brighteners used in the former solutions are intended to improve the specularity of the bright finish whereas those used in the latter systems are designed to make the matt finish more amenable to mechanical polish- Various heterocyclic compounds have been proposed as brightener additives for alkaline pyrophosphate electroplating compositions and some of these have found particular favour in the art. A group of these heterocyclic compounds is characterized by the presence of the groupmg:
( i-SH contained in a 5- or 6-membered heterocyclic ring system where Q represents a nitrogen atom (either as a=N- or -N- grouping) or a sulphur atom. Examples of these mercapto-heterocyclic compounds are described in UK. specifications Nos. 939,997; 940,282 and 1,051,150.
Some of the aforementioned specifications refer to the optional presence in the electroplating composition of other organic compounds, such as simple aliphatic or hydroxy-aliphatic carboxylic acids. These are stated, for example in specification No. 1,051,150, to improve the grain refinement of the electrodeposited material and to reduce the anodic polarisation.
lce
We have now discovered that it is possible to use increased concentrations of the heterocyclic brightener without loss in levelling efliciency if an auxiliary brightener is added to the composition. In an attempt to discover suitable auxiliary brighteners we have investigated the effect of adding a wide variety of organic compounds of copper pyrophosphate electrolytes containing the above-mentioned heterocyclic brightener additives. Although the majority are either ineffective or deleterious we have found several Which improve the electrolyte because they enable higher concentrations of the heterocyclic brightener to be employed and so reduce the risk of uneven plating. Thus the optimum concentration range for the heterocyclic brightener is markedly increased. This is a quite different effect for many mentioned for the lower aliphatic and hydroxy-aliphatic acids in specification No. 1,051,150, and in general the auxiliary brighteners, which we have found to be effective, possess a greater molecular weight than those compounds previously specifically mentioned for addition to copper pyrophosphate electrolytes, albeit for different purposes.
The invention therefore provides a brightening composition for use in the electrodeposition of copper from a copper pyrophosphate electrolyte, which composition comprises a primary brightener which is a mercaptoheterocyclic compound containing the group:
ii-SM contained in a 5- or 6-membered heterocyclic ring, where Q represents a nitrogen or sulphur atom and M is hydrogen or a cation such that the compound is water-soluble; and an auxiliary brightener selected from polycarboxylic or alkaryl sulphonic acids having at least 7 carbon atoms; malonic acid, 4,S-imidazole-dicarboxylic acid, imino-diacetic acid, water-soluble ammonium or alkali metal salts and anhydrides of the aforesaid acids, and hydroxyethyl cellulose.
The invention further provides an aqueous electrolyte for copper plating having dissolved therein a copper salt, an alkali metal pyrophosphate in an amount at least sufficient to form the complex X Cu(P O where X represents an alkali metal, and a minor proportion of a brightening composition according to the invention. The invention also provides a process for the electrodeposition of copper using an aqueous electrolyte of the invention.
The heterocyclic brighteners for present use are examplified: by the mercapto-thiazole compounds described in specification No. 940,282, for example 2-mercapto-1, 3- thiazole and Z-mercapto-benthiazole; by the Z-mercapto- 1, 3,4-thiadiazole compounds described in specification No. 939,997, for example 2,5-dimercapto-1,3,4-thiadiazole, 2- mercapto-S-methylmercapto-1,3,4-thiadiazole and 2- mer capto-S-n-butylmercapto-1,3,4-thiadiazole; and by the 2- mercapto-iminazole and Z-mercapto pyrimidines described in specification No. 1,051,150, for example Z-mercapto-lmethyliminazole, Z-mercaptopyrimidine, 6-hydroXy-2 mercaptopyrimidine and 6-hydroxy-2-mercapto-4-methylpyrimidine. Also included among the classes of brighteners are precursors of the compounds described above. By precursor is meant herein a compound which when dissolved in the copper pyrophosphate electrolyte provides in solution a compound containing the structure(II). For example there may be used heterocyclic disulphides containing the grouping:
-Q Q- (III) The auxiliary brighteners for present use are for the most part acids which will normally be used as sodium, potassium or ammonium salts. There can be particularly mentioned the alkaryl sulphonates wherein the salt has less than carbon atoms in each alkyl chain and preferably less than 5 aliphatic carbon atoms per sulphonate group. Alkaryl sulphonates with longer alkyl groups generally are insufiiciently efiective to be of commercial value for present purposes. Suitable salts include potassium toluene sulphonate, sodium xylene sulphonate, salts of sulphonated naphthalene-formaldehyde condensates, for example methylene bis-(naphthalene-sulphonates), and salts of sulphonated polystyrenes.
There may also be used, usually in the form of watersoluble salts, organic diand polycarboxylic acids or anhydrides thereof having more than 7 carbon atoms. As examples of these compounds there can be mentioned suberic acid, azelaic acid, and sebacic acid as well as adducts of the type formed when a dienophilic carboxylic acid such as maleic anhydride is condensed with a conjugally unsaturated hydrocarbon such as polyiso-butylene, for example the alkylor alkenyl-substituted succinic acids and anhydrides wherein the alkyl or alkenyl group contains from 30-150 carbon atoms.
Normally the heterocyclic brightening agent is employed in a proportion of at least 0.001 gram per litre of the total weight of electrolyte and preferably from 1 to mg. per litre. The optimum concentration may vary from 2 to 4 mg. per litre depending upon the nature of the auxiliary brightener present. Normally the auxiliary brightener is employed in a proportion of from 1 p.p.m. to saturation, preferably from 2 to 100 p.p.m., for example 3 to 6 p.p.m.
It is preferred that the copper plating electrolytes of the invention have a similar constitution with respect to the concentration of copper salt and pyrophosphate as those conventionally employed, for example as described in the above-mentioned specifications. These electrolytes may contain other additives that are conventionally em ployed in this type of electrolyte in addition to the heterocyclic brighteners. The electrolyte may be employed for plating metal articles in accordance with known procedures.
The invention is illustrated by the following examples wherein there were employed electrolytes of the following constitution:
Copper pyrophosphate 94 g./l., potassium pyrophosphate 300 g./l., ammonia 1 g./l., primary brightener as specified 2 p.p.m. Standard solutions were made by using 3 heterocyclic brighteners, namely 2,S-dimercapto-l,3,4- thiadiazole, 2-mercaptobenzimidazole and Z-mercaptobenzthiazole. The solutions were obtained at a pH of 8.8 at a temperature of 55 C. Plating was carried out on brass panels with a current density of 30 amps per sq. ft. under air agitation.
Tests were repeated wth the three standard electrolytes containing the following auxiliary brighteners at a concentration of 10 p.p.m.;
In each example the auxiliary brightener provided improved brightening and levelling action without skip plating.
We claim:
1. An improved process (for electrodepositing copper from an aqueous copper pyrophosphate electrolyte wherein copper is electrodeposited from electrolyte consisting essentially of an alkaline aqueous solution containing dissolved therein a copper salt and an alkali metal pyrophosphate in an amount at least sufficient to form the complex salt X Cu(P O and from one part per million to saturation of a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles and mercaptopyrimidines, the improvement comprising admixing in said electrolyte between two part per million and saturations of an auxiliary brightener selected from (i) alkylaryl sulphonic acids having at least 7 carbon atoms and containing less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinyl benzene sulphonate, (iii) naphthalene trisulphonate, and (iv) polystyrene sulphonate.
2. A process according to claim 1 wherein the electrolyte contains from l to 10 parts per million of the heterocyclic brightener.
3. A process according to claim 1 wherein the electrolyte contains from 2 to 4 parts per million of the heterocyclic brightener.
4. A process according to claim 1 wherein the copper salt is copper pyrophosphate and the alkali metal pyrophosphate is potassium pyrophosphate.
5. A process according to claim 1 wherein the auxiliary brightener is sodium xylene sulphonate.
6. A process according to claim 1 wherein the auxiliary brightener is sodium toluene sulphonate.
"7. A process according to claim 1 wherein the auxiliary brightener is naphthalene trisulphonate.
8. A process according to claim 1 wherein the auxiliary brightener is vinyl benzene sulphonate.
9. A process according to claim 1 wherein the auxiliary brightener is methylene bisnaphthylene sulphonate.
'10. A process according to claim 1 wherein the auxil iary brightener is added in a concentration of from 1 to parts per million.
11. A process according to claim 1 wherein the auxiliary brightner is added in a concentration of from 2 to 4 parts per million.
12. An improved copper pyrophosphate electroplating electrolyte consisting essentially of an alkaline aqueous solution containing dissolved therein a copper salt and an alkali metal pyrophosphate in an amount at least sufi'icient to form the complex salt X Cu(P O and from one part per million to saturation of a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles and mercapto-pyrimidines, the improvement wherein said electrolyte also contains an auxiliary brightener selected from (i) alkylaryl sulphonic acids having at least 7 carbon atoms and containing less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinylbenzene sulphonate, (iii) naphthalene trisulphonate, and (iv) polystyrene sulphonate, in a concentration of from 2 parts per million to saturation.
13. An electrolyte according to claim 12 wherein the heterocyclic brightner is present in a concentration of from =1 to 10 parts per million.
14. An electrolyte according to claim 12 wherein the heterocyclic brightner is present in a concentration of of from 2 to 4 parts per million.
I15. An electrolyte according to claim 12 wherein the copper salt is copper pyrophosphate and the alkali metal pyrophosphate is potassium pyrophosphate.
16. An electrolyte according to claim 12 containing from 2 to 100 parts per million of the auxiliary brightener.
17. An additive for use in aqueous copper pyrophosphate electroplating solutions consisting essentially of (a) a known heterocyclic brightening additive selected from mercaptothiazoles, mercaptobenzthiazoles, mercaptothiadiazoles, mercaptoiminazoles, and mercaptopyrimidines and (b) an auxiliary brightener selected from (i) alkyaryl sulphonic acids having at least 7 carbon atoms, and contining less than 5 carbon atoms in each alkyl chain and less than five aliphatic carbon atoms per sulphonate group, (ii) vinylbenzene sulphonate, (iii) naphthalene trisulphonate, and (iv) polystyrene sulphonate.
18. An additive according to claim 17 wherein the auxiliary brightner is sodium xylene sulphonate.
19. An additive according to claim 17 wherein the auxiliary brightner is sodium toluene sulphonate.
20. An additive according to claim 17 wherein the auxiliary brightener is sodium naphthalene trisulphonate.
21. An additive according to claim 17 wherein the auxiliary brightner is potassium vinyl benzene sulphonate.
22. An additive according to claim 17 wherein the auxiliary brightner is sodium methylene bisnaphthylene sulphonate.
References Cited UNITED STATES PATENTS 2,090,049 8/1937 Hull 204- Y 2,195,409 4/ 1940 Flett 20446 2,437,865 3/1948 Stareck 20452 R 2,700,019 1/1955 Jernstedt 204-52 R 3,161,575 12/1964 Wells et a1. 20452 3,341,433 9/1967 Passal 20449 2,250,556 7/11941 Stareck 20452 R 3,296,101 1/ 1967 Crain 20444 3,373,095 3/1968 Abbott 20452 R FOREIGN PATENTS 774,424 5/1957 Great Britain 20452 940,282 10/ 1963 Great Britain 20452 1,051,150 12/ 1966 Great Britain 20452 FREDERICK C. EDMUNDSON, Primary Examiner
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB09989/67A GB1235101A (en) | 1967-05-01 | 1967-05-01 | Improvements relating to electrodeposition of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3729393A true US3729393A (en) | 1973-04-24 |
Family
ID=10138480
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US63954A Expired - Lifetime US3674660A (en) | 1967-05-01 | 1970-08-14 | Electrodeposition of copper |
| US00132236A Expired - Lifetime US3729393A (en) | 1967-05-01 | 1971-04-07 | Electrodeposition of copper |
| US00209004A Expired - Lifetime US3784454A (en) | 1967-05-01 | 1971-12-16 | Additive for the electrodeposition of copper |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US63954A Expired - Lifetime US3674660A (en) | 1967-05-01 | 1970-08-14 | Electrodeposition of copper |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00209004A Expired - Lifetime US3784454A (en) | 1967-05-01 | 1971-12-16 | Additive for the electrodeposition of copper |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US3674660A (en) |
| BE (1) | BE714454A (en) |
| DE (1) | DE1771228C3 (en) |
| ES (1) | ES353094A1 (en) |
| FR (1) | FR1564283A (en) |
| GB (1) | GB1235101A (en) |
| NL (1) | NL6805947A (en) |
| SE (1) | SE332744B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070007489A1 (en) * | 2003-12-25 | 2007-01-11 | Hiroshi Egawa | Heat transfer medium composition |
| US20110210007A1 (en) * | 2008-11-11 | 2011-09-01 | Yuken Industry Co., Ltd. | Zincate zinc plating bath |
| US8187763B2 (en) | 2003-07-11 | 2012-05-29 | Honda Motor Co., Ltd. | Cooling liquid composition for fuel cell |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167234A (en) * | 1974-12-09 | 1976-06-10 | Hitachi Ltd | PIRORINSANDOMETSUKIZEIKAHIMAKUBOSHIHO |
| US4134803A (en) * | 1977-12-21 | 1979-01-16 | R. O. Hull & Company, Inc. | Nitrogen and sulfur compositions and acid copper plating baths |
| US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
| US4877518A (en) * | 1988-05-02 | 1989-10-31 | Phillips Petroleum Company | Ore flotation employing dimercaptothiadiazoles |
| US4966688A (en) * | 1988-06-23 | 1990-10-30 | Phillips Petroleum Company | Ore flotation employing amino mercaptothiadiazoles |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| DE69006479T2 (en) * | 1990-02-16 | 1994-09-01 | Furukawa Circuit Foil | Process for the electrolytic production of copper foil. |
| US5314756A (en) * | 1991-11-27 | 1994-05-24 | Hitachi Metals, Ltd. | Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
| WO1997049549A1 (en) * | 1996-06-26 | 1997-12-31 | Park Electrochemical Corporation | A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US6709564B1 (en) * | 1999-09-30 | 2004-03-23 | Rockwell Scientific Licensing, Llc | Integrated circuit plating using highly-complexed copper plating baths |
| KR100845189B1 (en) * | 2000-12-20 | 2008-07-10 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | Electrolytic copper plating solution and method for controlling the same |
| WO2010092579A1 (en) * | 2009-02-12 | 2010-08-19 | Technion Research & Development Foundation Ltd. | A process for electroplating of copper |
| CN103173812B (en) * | 2013-03-21 | 2015-12-09 | 山东金宝电子股份有限公司 | A kind ofly eliminate the mixed additive of electrolytic copper foil internal stress and the method for the production of low-stress Copper Foil |
| SE545031C2 (en) * | 2021-07-15 | 2023-03-07 | Seolfor Ab | Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2195409A (en) * | 1936-07-31 | 1940-04-02 | Nat Aniline & Chem Co Inc | Electrodeposition |
| US2437865A (en) * | 1943-09-25 | 1948-03-16 | United Chromium Inc | Method of electrodepositing copper and baths and compositions therefor |
| US2700019A (en) * | 1951-07-05 | 1955-01-18 | Westinghouse Electric Corp | Acid copper plating |
| NL267368A (en) * | 1960-07-23 | |||
| US3341433A (en) * | 1964-05-01 | 1967-09-12 | M & T Chemicals Inc | Electrodeposition of nickel |
-
1967
- 1967-05-01 GB GB09989/67A patent/GB1235101A/en not_active Expired
-
1968
- 1968-04-24 ES ES353094A patent/ES353094A1/en not_active Expired
- 1968-04-24 DE DE1771228A patent/DE1771228C3/en not_active Expired
- 1968-04-26 NL NL6805947A patent/NL6805947A/xx unknown
- 1968-04-30 BE BE714454D patent/BE714454A/xx not_active IP Right Cessation
- 1968-04-30 SE SE05888/68A patent/SE332744B/xx unknown
- 1968-04-30 FR FR1564283D patent/FR1564283A/fr not_active Expired
-
1970
- 1970-08-14 US US63954A patent/US3674660A/en not_active Expired - Lifetime
-
1971
- 1971-04-07 US US00132236A patent/US3729393A/en not_active Expired - Lifetime
- 1971-12-16 US US00209004A patent/US3784454A/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8187763B2 (en) | 2003-07-11 | 2012-05-29 | Honda Motor Co., Ltd. | Cooling liquid composition for fuel cell |
| US20070007489A1 (en) * | 2003-12-25 | 2007-01-11 | Hiroshi Egawa | Heat transfer medium composition |
| US20110210007A1 (en) * | 2008-11-11 | 2011-09-01 | Yuken Industry Co., Ltd. | Zincate zinc plating bath |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1771228A1 (en) | 1973-04-26 |
| ES353094A1 (en) | 1969-10-01 |
| US3784454A (en) | 1974-01-08 |
| DE1796337A1 (en) | 1974-02-28 |
| DE1771228B2 (en) | 1974-01-24 |
| US3674660A (en) | 1972-07-04 |
| BE714454A (en) | 1968-09-16 |
| FR1564283A (en) | 1969-04-18 |
| NL6805947A (en) | 1968-11-04 |
| DE1796337B2 (en) | 1976-09-02 |
| GB1235101A (en) | 1971-06-09 |
| SE332744B (en) | 1971-02-15 |
| DE1771228C3 (en) | 1974-08-22 |
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