US3702448A - Impedance matched ultrasonic delay line wherein electrodes consist of bismuth and indium - Google Patents
Impedance matched ultrasonic delay line wherein electrodes consist of bismuth and indium Download PDFInfo
- Publication number
- US3702448A US3702448A US115219A US3702448DA US3702448A US 3702448 A US3702448 A US 3702448A US 115219 A US115219 A US 115219A US 3702448D A US3702448D A US 3702448DA US 3702448 A US3702448 A US 3702448A
- Authority
- US
- United States
- Prior art keywords
- bismuth
- indium
- glass
- delay line
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 10
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 229910052797 bismuth Inorganic materials 0.000 title claims abstract description 9
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 25
- 239000013078 crystal Substances 0.000 claims description 11
- 239000010453 quartz Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 239000011888 foil Substances 0.000 description 5
- 239000004568 cement Substances 0.000 description 2
- 238000002592 echocardiography Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 240000005020 Acaciella glauca Species 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000003499 redwood Nutrition 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
Definitions
- an acoustic matching system is employed in a delay line so that the third path signal (i.e., the signal which has been reflected first by the receiver and then again by the sender) is more than 60 dB down. Obviously the fifth and higher order path signals are even more greatly attenuated.
- the objects of the present invention are achieved by employing a zero temperature coefficient glass together with an AC cut quartz crystal which matches the acoustic impedance of the glass with electrodes on the quartz crystals which consist of essentially equal parts of bismuth and indium.
- the glass, transducer and electrodes are all carefully matched in acoustic impedance so that there is a maximum transmission of the desired signal and a maximum attenuation of the reflected signal.
- FIG. 1 is a side view of an ultrasonic delay line embodying the present invention.
- FIG. 2 is a perspective view in section on an enlarged scale of the delay line shown in FIG. 1.
- the delay element itself consists of a sheet of glass 3 which preferably has a zero acoustic temperature coefficient.
- quartz transducers 5 and 7 mounted on each side of the glass are quartz transducers 5 and 7 and these are preferably of the AC cut which operate in a shear mode. Although other quartz transducers might be used, these particular cuts give the best sonic impedance match with the glass.
- thin foils 9 and 13 of a bismuth-indium alloy are mounted on each side of a bismuth-indium alloy. These thin foils serve as one of the electrodes on each of the quartz transducers and, by the selection of this particular alloy, make an almost perfect match between the glass and the quartz.
- each of the quartz plates is a relatively heavy block of metal 15 and 17.
- These metal blocks are also made of the same indium-bismuth alloy and serve as the outer electrodes for the quartz crystal and also, because of their composition and relatively large size, absorb any signal which might be reflected into them.
- the second path signal does not cause any problem if it can be effectively absorbed and prevented from becom min th'd th' l.
- Th' t li couldb mea n of t he lz lmd ll t rs l9 t l l 3 5nd b o k II while the output signal is coupled by means of connectors 21 to the foil 9 and block 15.
- the various parts can be cemented together and it is not necessary that the cement be matched acoustically since it can be made so thin that it is acoustically invisible.
- an epoxy resin was used to cement the parts together but the thickness of the resin was only from 5 to 10 microinches which is two to three orders of magnitude smaller than the acoustic wavelength.
- a delay line having a l microsecond delay was made utilizing a glass layer 0.1 inches thick.
- the foil layer on each side of the glass was I mil in thickness while the crystals were 1.2 mils in thickness.
- the outer blocks were onesixteenth inch in thickness. This structure had an absorption less than 1.3 dB per inch at 20 MHz and the third path reflection signal was more than 60 dB down.
- the glass have a zero acoustic temperature coefficient and that the crystals be quartz with an AC cut.
- the alloy itself, both for the foil and for the blocks can vary from 48 to 52 percent bismuth and 52 to 48 percent indium.
- An ultrasonic delay line which includes a piece of glass as a sonic delay element with transducers on each side of the glass, said transducers consisting of piezoelectric crystals with electrodes thereon, wherein the improvement comprises electrodes of an alloy consisting of about equal parts of bismuth and indium, by weight.
- electrodes are from 48 to 52 percent bismuth and 52 -48 percent indium, by weight.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
A sonic delay line wherein electric impulses are converted to acoustic impulses passed through glass and reconverted to electrical impulses, wherein the acoustic impedance of the transducer is matched to that of glass utilizing an alloy of approximately equal parts of bismuth and indium, by weight.
Description
ilu l a e ilnited Sta,
SEAR Cl-I R o-0 Boblett 1 Nov. 7, 1972 [54] IMPEDANCEMATCHED ULTRASONIC [56] References Cited DELAY LINE WHEREIN ELECTRODES CONSIST 0F BISMUTH AND INDIUM UNITED STATES PATENTS I t E v B u L Krause [72] or 2 0 e 0s 8 3,252,722 5/1966 Allen ..333/30 3,517,345 6/1970 Krause ..333/30 [73] Assignee: Ampex Corporation, Redwood City,
Cahf- Primary Examiner-Paul L. Gensler 22 Filed: Feb. 16, 1971 Attorney-Robe" Clay [21] Appl. No.: 115,219 7 v ABSTRACT I sonic delay line wherein electric impulses are con- [52] US. Cl ..333/30 R, 310/8, 333/32, verted to acoustic impulses passed through glass and 340/8 MM reconvened to electrical impulses, wherein the Cl -H03h 9/30 H04r17/00 7/38 acoustic impedance of the transducer is matched to [58] Flew Search "333/30 R1 32; 29/4731 that of glass utilizing an alloy of approximately equal parts of bismuth and indium, by weight.
5 Claims, 2 Drawing Figures PATENTED 7 1973 3. 702,448
I P s I l g N UT I OUTPUT INVENTOR.
EM/L V. BOBLETT F113- .2. W
ATTORNE V IMPEDANCE MATCHED ULTRASONIC DELAY LINE WHEREIN ELECTRODES CONSIST OF BISMUTH AND INDIUM SUMMARY OF THE INVENTION In the construction of bulk ultrasonic delay lines it is important to avoid reflections which result in unwanted echoes. In other words, although there may be a satisfactory delay of the main signal component, if a small portion of the signal is reflected back to the sender and again reflected back to the receiver, an echo will be produced which may be unacceptable in magnitude. In accordance with the present invention an acoustic matching system is employed in a delay line so that the third path signal (i.e., the signal which has been reflected first by the receiver and then again by the sender) is more than 60 dB down. Obviously the fifth and higher order path signals are even more greatly attenuated. I
In the past, such sonic delay lines have caused multiple echoes and an unacceptable degradation of the main signal. i
In general the objects of the present invention are achieved by employing a zero temperature coefficient glass together with an AC cut quartz crystal which matches the acoustic impedance of the glass with electrodes on the quartz crystals which consist of essentially equal parts of bismuth and indium. Thus'the glass, transducer and electrodes are all carefully matched in acoustic impedance so that there is a maximum transmission of the desired signal and a maximum attenuation of the reflected signal.
BRIEF DESCRIPTION OF THE DRAWING FIG. 1 is a side view of an ultrasonic delay line embodying the present invention.
FIG. 2 is a perspective view in section on an enlarged scale of the delay line shown in FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to the drawing by reference characters the delay element itself consists of a sheet of glass 3 which preferably has a zero acoustic temperature coefficient. Mounted on each side of the glass are quartz transducers 5 and 7 and these are preferably of the AC cut which operate in a shear mode. Although other quartz transducers might be used, these particular cuts give the best sonic impedance match with the glass. Mounted on each side of the glass are thin foils 9 and 13 of a bismuth-indium alloy. These thin foils serve as one of the electrodes on each of the quartz transducers and, by the selection of this particular alloy, make an almost perfect match between the glass and the quartz.
Mounted on the outside of each of the quartz plates is a relatively heavy block of metal 15 and 17. These metal blocks are also made of the same indium-bismuth alloy and serve as the outer electrodes for the quartz crystal and also, because of their composition and relatively large size, absorb any signal which might be reflected into them. It will be understood, of course, that the second path signal does not cause any problem if it can be effectively absorbed and prevented from becom min th'd th' l.Th' t li couldb mea n of t he lz lmd ll t rs l9 t l l 3 5nd b o k II while the output signal is coupled by means of connectors 21 to the foil 9 and block 15.
The various parts can be cemented together and it is not necessary that the cement be matched acoustically since it can be made so thin that it is acoustically invisible. In one practical embodiment of the invention, an epoxy resin was used to cement the parts together but the thickness of the resin was only from 5 to 10 microinches which is two to three orders of magnitude smaller than the acoustic wavelength.
In one practical embodiment of the invention a delay line having a l microsecond delay was made utilizing a glass layer 0.1 inches thick. The foil layer on each side of the glass was I mil in thickness while the crystals were 1.2 mils in thickness. The outer blocks were onesixteenth inch in thickness. This structure had an absorption less than 1.3 dB per inch at 20 MHz and the third path reflection signal was more than 60 dB down.
Various glasses and crystal configurations can be used without departing from the spirit of this invention but it is preferred that the glass have a zero acoustic temperature coefficient and that the crystals be quartz with an AC cut. However other glasses and other piezoelectric elements can be employed. The alloy itself, both for the foil and for the blocks can vary from 48 to 52 percent bismuth and 52 to 48 percent indium.
I claim:
1. An ultrasonic delay line which includes a piece of glass as a sonic delay element with transducers on each side of the glass, said transducers consisting of piezoelectric crystals with electrodes thereon, wherein the improvement comprises electrodes of an alloy consisting of about equal parts of bismuth and indium, by weight.
2. The structure of claim 1 wherein the glass is temperature coefficient glass.
3. The structure of claim 1 wherein the electrodes between the crystals and the glass consist of a thin film of said bismuth-indium alloy while the outer electrodes consist of thick blocks of bismuth-indium alloy.
4. The structure of claim 1 wherein the crystals are quartz, have an AC cut and operate in a shear mode.
5. The structure of claim 1 wherein the electrodes are from 48 to 52 percent bismuth and 52 -48 percent indium, by weight.
* l t II!
Claims (4)
- 2. The structure of claim 1 wherein the glass is a zero temperature coefficient glass.
- 3. The structure of claim 1 wherein the electrodes between the crystals and the glass consist of a thin film of said bismuth-indium alloy while the outer electrodes consist of thick blocks of bismuth-indium alloy.
- 4. The structure of claim 1 wherein the crystals are quartz, have an AC cut and operate in a shear mode.
- 5. The structure of claim 1 wherein the electrodes are from 48 to 52 percent bismuth and 52 -48 percent indium, by weight.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11521971A | 1971-02-16 | 1971-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3702448A true US3702448A (en) | 1972-11-07 |
Family
ID=22359988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US115219A Expired - Lifetime US3702448A (en) | 1971-02-16 | 1971-02-16 | Impedance matched ultrasonic delay line wherein electrodes consist of bismuth and indium |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3702448A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4798990A (en) * | 1986-09-11 | 1989-01-17 | Bengt Henoch | Device for transmitting electric energy to computers and data nets |
| RU2162273C2 (en) * | 1999-01-10 | 2001-01-20 | Государственное предприятие Ульяновский механический завод | Reverberating ultrasonic delay line |
| US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
| US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
| US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
| US3517345A (en) * | 1966-12-14 | 1970-06-23 | Bell Telephone Labor Inc | Composite delay line structure |
| US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
-
1971
- 1971-02-16 US US115219A patent/US3702448A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
| US3517345A (en) * | 1966-12-14 | 1970-06-23 | Bell Telephone Labor Inc | Composite delay line structure |
| US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4798990A (en) * | 1986-09-11 | 1989-01-17 | Bengt Henoch | Device for transmitting electric energy to computers and data nets |
| RU2162273C2 (en) * | 1999-01-10 | 2001-01-20 | Государственное предприятие Ульяновский механический завод | Reverberating ultrasonic delay line |
| US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
| US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
| US6722379B2 (en) | 1999-08-27 | 2004-04-20 | Product Systems Incorporated | One-piece cleaning tank with indium bonded megasonic transducer |
| US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
| US6904921B2 (en) | 2001-04-23 | 2005-06-14 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
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