[go: up one dir, main page]

US3360349A - Copper layer bonded to a non-conductive layer by means of a copper alloy - Google Patents

Copper layer bonded to a non-conductive layer by means of a copper alloy Download PDF

Info

Publication number
US3360349A
US3360349A US444849A US44484965A US3360349A US 3360349 A US3360349 A US 3360349A US 444849 A US444849 A US 444849A US 44484965 A US44484965 A US 44484965A US 3360349 A US3360349 A US 3360349A
Authority
US
United States
Prior art keywords
copper
electrodeposited
aluminum
copper alloy
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US444849A
Inventor
Alfred A Adomines
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Sperry Rand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Rand Corp filed Critical Sperry Rand Corp
Priority to US444849A priority Critical patent/US3360349A/en
Priority to GB12837/66A priority patent/GB1095080A/en
Priority to BE678387A priority patent/BE678387A/xx
Priority to FR54834A priority patent/FR1471982A/en
Priority to DE19661521006 priority patent/DE1521006B2/en
Priority to CH470566A priority patent/CH468475A/en
Priority to NL6604397A priority patent/NL6604397A/xx
Application granted granted Critical
Publication of US3360349A publication Critical patent/US3360349A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/938—Vapor deposition or gas diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Definitions

  • this invention relates to structures containing electrodeposited copper and an inert, non-conductive substrate and to improving the adhesion of electrodeposited copper to selected substrate materials, particularly inert, non-conductive substrate materials, such as glass, alumina, ceramic materials, organic plastic materials, e.g., Mylar film, and the like. This is accomplished by using a particular alloy containing copper.
  • Another object of this invention is to provide structures containing electrodeposited copper which exhibits excellent and improved adhesion to the underlying material.
  • Still another object of this invention is to provide an improved method of preparing structures containing electrodeposited copper.
  • an improved structure containing electrodeposited copper is provided by a structure made up of an inert, non-conductive substrate, vapor deposited material chemically similar to copper deposited thereon and an electrodeposited copper deposited upon said vapor deposited material.
  • vapor deposited materials which are useful for improving and increasing the adhesion of electrodeposited copper include substantially all materials chemically similar to copper and capable of volatilization and vapor deposition upon the inert, non-conductive substrate materials.
  • vapor-deposited materials useful in accordance with the practice of this invention for improving the adhesion of electrodeposited copper include the various copper alloys, particularly the bronzes, such as the aluminum bronzes and chromium bronzes. Copper 3,360,349 Patented Dec. 26, 1967 alloys capable of volatilization and vapor deposition in accordance with the practice of this invention and analyzing 20-95% copper and higher and 805% other alloying metal or metals, such as aluminum and chromium, have been found to be suitable.
  • a tungsten boat charged with a mixture comprising about -80% by Weight copper and 20-25% by weight aluminum was placed in a vacuum system.
  • a substrate material such as a glass plate or slide, the glass plate or slide being separated from the tungsten boat by a shutter.
  • the system was then evacuated to a low pressure, about l 10 mm. Hg.
  • the copper and aluminum in the tungsten boat were slowly heated to the melting point and the glass substrate material was heated by suitable means to a temperature of about 300 C.
  • the shutter between the tungsten boat and the glass substrate material was removed for a desired period of time with the result that there was deposited by vapor deposition onto the glass substrate material a layer of aluminum-copper metallic material of about 4,000 A. thickness.
  • This aluminum-copper material thus vapor deposited on the heated glass substrate analyzed 92% by weight copper and 8% by weight aluminum,
  • the shutter was closed and the system shut down and permitted to cool under vacuum for approximately 4 hours or to about room temperature.
  • the resulting copper-aluminum coated glass substrate material was removed from the system and a layer of copper was electroplated thereon, such as a layer of copper of about 1 mil in thickness.
  • the electrodeposited copper exhibited superior and excellent adhesion to the aluminum-copper coated glass substrate material.
  • the electrodeposited copper layer could not be removed or peeled by the conventional test methods, such as peeling with Scotch tape or scraping with a razor or scribing and prying at the edges with a razor.
  • the layers thus deposited on the glass substrate material i.e., the copper-aluminum vapor de posited layer and the electrodeposited copper layer, were easily etched by conventional copper etchant solutions, such as ferric chloride copper etching solution, and this combination of layers showed no obvious difference from pure copper except for the superior and excellent adhesion of the electrodeposited copper to the underlying substrate material.
  • a vapor deposited film such as aluminum bronze or chromium bronze or other metallic materials chemically similar to copper
  • the electrodeposited copper film is extremely bright and suitable for electrodeposition thereon of an additional metallic film, such as a magnetic nickel-iron film. Therefore, the practice of this invention is particularly suitable for the preparation of a firm, well-adhering copper base layer for integrated circuit mountings and as a sub-layer in an electroplated memory structure.
  • a structure comprising an inert, non-conductive substrate, copper alloy material analyzing -95% copper and 805% of a metal selected from the group consisting of aluminum and chromium deposited on the surface of said substrate and copper electrodeposited on said copper alloy material.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 5-80% aluminum and 95-20% copper.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 580% chromium and 95-20% copper.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material having the composition 92% by weight copper and 8% by weight aluminum and a thickness of approximately 4,000 A. and said electrodeposited copper having a thickness of about 1 mil.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)

Description

United States Patent COPPER LAYER BONDED TO A NON-CONDUC- TIV E LAYER BY MEANS OF A COPPER ALLOY Alfred A. Adomines, Wayne, Pa., assignor to Sperry Rand Corporation, New York, N.Y., a corporation of Delaware No Drawing. Filed Apr. 1, 1965, Ser. No. 444,849 8 Claims. (Cl. 29-195) ABSTRACT OF THE DISCLOSURE This invention relates to structures containing electrodeposited copper. More particularly, this invention relates to structures containing electrodeposited copper and an inert, non-conductive substrate and to improving the adhesion of electrodeposited copper to selected substrate materials, particularly inert, non-conductive substrate materials, such as glass, alumina, ceramic materials, organic plastic materials, e.g., Mylar film, and the like. This is accomplished by using a particular alloy containing copper.
To obtain satisfactory adhesion of electrodeposited copper to an inert, non-conductive substrate material, such as glass, it has been necessary heretofore to subject the substrate material to intensive cleaning. This intensive cleaning of the substrate material prior to electrodeposition of copper thereon in order to obtain good adhesion of the electrodeposited copper has been time consuming and expensive. Even then in many instances the adhesion of the electrodeposited copper would be less than desired.
Accordingly, it is an object of this invention to provide a method of preparing structures containing electrodeposited copper whereby the intensive cleaning of the substrate surfaces prior to the electrodeposition of copper thereon in order to obtain good adhesion is substantially eliminated or greatly reduced.
Another object of this invention is to provide structures containing electrodeposited copper which exhibits excellent and improved adhesion to the underlying material.
Still another object of this invention is to provide an improved method of preparing structures containing electrodeposited copper.
How these and other objects of this invention are accomplished will become apparent in the light of-the accompanying disclosure. In at least one embodiment of this invention at least one of the foregoing objects will be achieved.
In accordance with this invention it has been discovered that in structures containing electrodeposited copper improved adhesion of the electrodeposited copper is obtained by electrodepositing the copper onto vapor deposited material Which is chemically similar to copper. More particularly, in accordance with one embodiment of this invention an improved structure containing electrodeposited copper, as evidenced by the improved adhesion of the electrodeposited copper, is provided by a structure made up of an inert, non-conductive substrate, vapor deposited material chemically similar to copper deposited thereon and an electrodeposited copper deposited upon said vapor deposited material.
Those vapor deposited materials which are useful for improving and increasing the adhesion of electrodeposited copper include substantially all materials chemically similar to copper and capable of volatilization and vapor deposition upon the inert, non-conductive substrate materials. Examples of vapor-deposited materials useful in accordance with the practice of this invention for improving the adhesion of electrodeposited copper include the various copper alloys, particularly the bronzes, such as the aluminum bronzes and chromium bronzes. Copper 3,360,349 Patented Dec. 26, 1967 alloys capable of volatilization and vapor deposition in accordance with the practice of this invention and analyzing 20-95% copper and higher and 805% other alloying metal or metals, such as aluminum and chromium, have been found to be suitable.
In accordance with one embodiment of the practice of this invention it has been found that improved adhesion is obtained by efiecting the deposition of the vapor deposited material, such as copper-containing alloy, onto a heated substrate, such as glass, alumina ceramic surface and the like, maintained at a substantially elevated temperature in the range 200-400 C., more or less, during the vapor deposition operation. Satisfactory results, however, are also obtained While carrying out the vapor deposition operation at substantially room temperature conditions with respect to the temperature of the substrate material. This type of operation is particularly useful when the inert, non-conductive substrate material comprises a thermally decomposable material, such as organic polymer material, e.g., Mylar, polyethylene, polypropylene, cellophane and the like.
The following is illustrative of the practice of this invention. A tungsten boat charged with a mixture comprising about -80% by Weight copper and 20-25% by weight aluminum was placed in a vacuum system. There was also placed in the system a substrate material, such as a glass plate or slide, the glass plate or slide being separated from the tungsten boat by a shutter.
The system was then evacuated to a low pressure, about l 10 mm. Hg. The copper and aluminum in the tungsten boat were slowly heated to the melting point and the glass substrate material was heated by suitable means to a temperature of about 300 C. The shutter between the tungsten boat and the glass substrate material was removed for a desired period of time with the result that there was deposited by vapor deposition onto the glass substrate material a layer of aluminum-copper metallic material of about 4,000 A. thickness. This aluminum-copper material thus vapor deposited on the heated glass substrate analyzed 92% by weight copper and 8% by weight aluminum,
After the desired amount of the aluminum bronze material, i.e., the copper-aluminum-containing material analyzing 92% copper and 8% aluminum, had been vapor deposited the shutter was closed and the system shut down and permitted to cool under vacuum for approximately 4 hours or to about room temperature. The resulting copper-aluminum coated glass substrate material was removed from the system and a layer of copper was electroplated thereon, such as a layer of copper of about 1 mil in thickness.
The electrodeposited copper exhibited superior and excellent adhesion to the aluminum-copper coated glass substrate material. For example, the electrodeposited copper layer could not be removed or peeled by the conventional test methods, such as peeling with Scotch tape or scraping with a razor or scribing and prying at the edges with a razor. Further, the layers thus deposited on the glass substrate material, i.e., the copper-aluminum vapor de posited layer and the electrodeposited copper layer, were easily etched by conventional copper etchant solutions, such as ferric chloride copper etching solution, and this combination of layers showed no obvious difference from pure copper except for the superior and excellent adhesion of the electrodeposited copper to the underlying substrate material.
Excellent results with respect to the adhesion of the electrodeposited copper were also obtained by means of other vapor deposited copper-aluminum films or layers, even those analyzing up to about by weight aluminum. Also, excellent results were obtained in accordance with this invention by means of vapor deposited copper 3 chromium layers, particularly a copper-chromium layer analyzing about by weight chromium. Also, tests carried out showed that the advantages of this invention were also obtainable on substrates maintained at about room or ambient temperature during the vapor deposition operation.
The advantages in accordance with the practice of this invention of employing a vapor deposited film, such as aluminum bronze or chromium bronze or other metallic materials chemically similar to copper, in addition to improving the adhesion of the electrodeposited copper include the fact that the vapor deposited material does not contaminate the copper plating bath during the copper electrodeposition operation. Further, by following the practices of this invention the electrodeposited copper film is extremely bright and suitable for electrodeposition thereon of an additional metallic film, such as a magnetic nickel-iron film. Therefore, the practice of this invention is particularly suitable for the preparation of a firm, well-adhering copper base layer for integrated circuit mountings and as a sub-layer in an electroplated memory structure.
As will be apparent to those skilled in the art in the light of the foregoing disclosure, many substitutions, alterations and modifications are possible in the practice of this invention without departing from the spirit or scope thereof.
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:
1. A structure comprising an inert, non-conductive substrate, copper alloy material analyzing -95% copper and 805% of a metal selected from the group consisting of aluminum and chromium deposited on the surface of said substrate and copper electrodeposited on said copper alloy material.
2. A structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 5-80% aluminum and 95-20% copper.
3. A structure in accordance with claim 1 wherein said copper alloy material comprises 92% copper and 8% aluminum.
4. A structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 580% chromium and 95-20% copper.
5. A structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material comprising about copper and 10% chromium.
6. A structure in accordance with claim 1 wherein said copper alloy material has a thickness in the range of 500-50,000 A.
7. A structure in accordance with claim 1 wherein said copper alloy material has a thickness of about 4,000 A.
8. A structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material having the composition 92% by weight copper and 8% by weight aluminum and a thickness of approximately 4,000 A. and said electrodeposited copper having a thickness of about 1 mil.
References Cited UNITED STATES PATENTS 2,482,178 9/1949 Harris 29l95 2,966,427 12/1960 Breining 1l7l07.2 2,988,630 6/1961 Moore 29-199 3,206,325 9/1965 Averbach 117107.2 3,294,654 12/1966 Norman 20438 HYLAND BIZOT, Primary Examiner.

Claims (1)

1. A STRUCTURE COMPRISING AN INERT, NON-CONDUCTIVE SUBSTRATE, COPPER ALLOY MATERIAL ANALYZING 20-95% COPPER AND 80-5% OF A METAL SELECTED FROM THE GROUP CONSISTING OF ALUMINUM AND CHROMIUM DEPOSITED ON THE SURFACE OF SAID SUBSTRATE AND COPPER ELECTRODEPOSITED ON SAID COPPER ALLOY MATERIAL.
US444849A 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy Expired - Lifetime US3360349A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US444849A US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy
GB12837/66A GB1095080A (en) 1965-04-01 1966-03-23 Preparation of a non-conductive material for electroplating with copper
BE678387A BE678387A (en) 1965-04-01 1966-03-24
FR54834A FR1471982A (en) 1965-04-01 1966-03-24 Process for preparing a substrate of non-conductive material to receive a layer of copper deposited by electrolysis
DE19661521006 DE1521006B2 (en) 1965-04-01 1966-03-26 PROCESS FOR PRE-TREATMENT OF NON-CONDUCTIVE SUBSTRATES FOR THE GALVANIC APPLICATION OF GOOD COPPER LAYERS FOR ELECTRICAL CIRCUITS
CH470566A CH468475A (en) 1965-04-01 1966-03-31 Process for preparing a base made of a non-conductive material for receiving electrolytically deposited copper
NL6604397A NL6604397A (en) 1965-04-01 1966-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US444849A US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy

Publications (1)

Publication Number Publication Date
US3360349A true US3360349A (en) 1967-12-26

Family

ID=23766608

Family Applications (1)

Application Number Title Priority Date Filing Date
US444849A Expired - Lifetime US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy

Country Status (6)

Country Link
US (1) US3360349A (en)
BE (1) BE678387A (en)
CH (1) CH468475A (en)
DE (1) DE1521006B2 (en)
GB (1) GB1095080A (en)
NL (1) NL6604397A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512946A (en) * 1967-04-17 1970-05-19 Lash Mfg Inc Composite material for shielding electrical and magnetic energy
DE2001515A1 (en) * 1969-01-15 1970-08-27 Ibm Improved metallization on a monolith
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
CH675323A5 (en) * 1987-12-24 1990-09-14 Contraves Ag
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US20100091414A1 (en) * 2008-09-26 2010-04-15 Kabushiki Kaisha Toshiba Method for manufacturing a magneto-resistance effect element and magnetic recording and reproducing apparatus
US20110205669A1 (en) * 2010-02-22 2011-08-25 Kabushiki Kaisha Toshiba Method for manufacturing magneto-resistance effect element, magnetic head assembly, and magnetic recording and reproducing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2966427A (en) * 1958-11-07 1960-12-27 Union Carbide Corp Gas plating of alloys
US2988630A (en) * 1957-09-06 1961-06-13 Ici Ltd Method of inert-gas metal arc-welding
US3206325A (en) * 1961-09-14 1965-09-14 Alloyd Corp Process for producing magnetic product
US3294654A (en) * 1965-07-28 1966-12-27 Ethyl Corp Metal plating process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2988630A (en) * 1957-09-06 1961-06-13 Ici Ltd Method of inert-gas metal arc-welding
US2966427A (en) * 1958-11-07 1960-12-27 Union Carbide Corp Gas plating of alloys
US3206325A (en) * 1961-09-14 1965-09-14 Alloyd Corp Process for producing magnetic product
US3294654A (en) * 1965-07-28 1966-12-27 Ethyl Corp Metal plating process

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512946A (en) * 1967-04-17 1970-05-19 Lash Mfg Inc Composite material for shielding electrical and magnetic energy
DE2001515A1 (en) * 1969-01-15 1970-08-27 Ibm Improved metallization on a monolith
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
CH675323A5 (en) * 1987-12-24 1990-09-14 Contraves Ag
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US20100091414A1 (en) * 2008-09-26 2010-04-15 Kabushiki Kaisha Toshiba Method for manufacturing a magneto-resistance effect element and magnetic recording and reproducing apparatus
US20110205669A1 (en) * 2010-02-22 2011-08-25 Kabushiki Kaisha Toshiba Method for manufacturing magneto-resistance effect element, magnetic head assembly, and magnetic recording and reproducing apparatus

Also Published As

Publication number Publication date
CH468475A (en) 1969-02-15
NL6604397A (en) 1966-10-03
GB1095080A (en) 1967-12-13
DE1521006A1 (en) 1970-08-20
DE1521006B2 (en) 1971-03-18
BE678387A (en) 1966-09-01

Similar Documents

Publication Publication Date Title
US3360349A (en) Copper layer bonded to a non-conductive layer by means of a copper alloy
US4159909A (en) Cathode target material compositions for magnetic sputtering
US4190474A (en) Method of making a printed circuit board having mutually etchable copper and nickel layers
US2446349A (en) Electrodeposition of aluminum
US3141744A (en) Wear-resistant nickel-aluminum coatings
US3057048A (en) Protection of niobium
EP0362535A1 (en) Aluminum plating substance for anodizing
US4454014A (en) Etched article
US3868229A (en) Decorative electroplates for plastics
US2658266A (en) Laminated coating
US4311768A (en) Printed circuit board having mutually etchable copper and nickel layers
NL8203757A (en) COMPOSITE ELECTROPLATED ARTICLE AND METHOD FOR MANUFACTURING THAT.
US2805192A (en) Plated refractory metals
US3009236A (en) Protective and decorative coatings containing nickel
US3615281A (en) Corrosion-resistant chromium-plated articles
US3634209A (en) Electro deposited magnetic films
US4260449A (en) Method of forming a printed circuit
US3251712A (en) Metal plating with a heated hydrocarbon solution of a group via metal carbonyl
US2805986A (en) Method of making fine mesh screens
US2834724A (en) Method of electroplating plastic articles
US3108931A (en) Etching of chromium alloys
US3904488A (en) True replication of soft substrates
US2928169A (en) Electroplated articles having molybdenum base metal
US3799793A (en) Formation of star tracking reticles
Behrndt Influence of the deposition conditions on growth and structure of evaporated films