US3290234A - Electrodeposition of palladium - Google Patents
Electrodeposition of palladium Download PDFInfo
- Publication number
- US3290234A US3290234A US319661A US31966163A US3290234A US 3290234 A US3290234 A US 3290234A US 319661 A US319661 A US 319661A US 31966163 A US31966163 A US 31966163A US 3290234 A US3290234 A US 3290234A
- Authority
- US
- United States
- Prior art keywords
- palladium
- solution
- bath
- chelate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 89
- 229910052763 palladium Inorganic materials 0.000 title claims description 44
- 238000004070 electrodeposition Methods 0.000 title description 4
- 239000000243 solution Substances 0.000 claims description 22
- 239000013522 chelant Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 230000001376 precipitating effect Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- RNMCCPMYXUKHAZ-UHFFFAOYSA-N 2-[3,3-diamino-1,2,2-tris(carboxymethyl)cyclohexyl]acetic acid Chemical compound NC1(N)CCCC(CC(O)=O)(CC(O)=O)C1(CC(O)=O)CC(O)=O RNMCCPMYXUKHAZ-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cis-cyclohexene Natural products C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 3
- -1 cyclohexene diamine tetraacetic acid salt Chemical class 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 2
- VYTBPJNGNGMRFH-UHFFFAOYSA-N acetic acid;azane Chemical compound N.N.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O VYTBPJNGNGMRFH-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 2
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 150000002941 palladium compounds Chemical class 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000003275 alpha amino acid group Chemical group 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004697 chelate complex Chemical class 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- OOXWYYGXTJLWHA-UHFFFAOYSA-N cyclopropene Chemical compound C1C=C1 OOXWYYGXTJLWHA-UHFFFAOYSA-N 0.000 description 1
- 125000004980 cyclopropylene group Chemical group 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical group O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
Definitions
- the present invention relates to the electrodeposition of palladium and, more particularly, to the preparation of palladium electroplates possessing bright, smooth, and lustrous surfaces even at heavy thicknesses.
- a bath containing palladium in the form of a complex in solution in the concentration in the range of 2-10 grams of metal per liter of solution in the form of a complex of a cyclic-alkylenemoiety diamine tetraacetic acid, for example, selected from the group consisting of cyclopropylene, cyclobutene, cyclopentene and cyclohexane, N,N -tetraacetic acid.
- the acetic acid moiety can be replaced by propionic acid moiety.
- the chelate complex may be defined as follows:
- X is a cyclic aliphatic moiety having Ns on adjacent carbon atoms as the diamine wherein acetic acid moieties replace hydrogens to form the amino acid chelating compound.
- the palladium metal concentration in this bath may be varied over wide limits, but a practical range for clean, mirror bright plates is 2 to 10 grams of metal per liter.
- the temperature of this novel bath may be varied from to 65 C. It has been found, however, that room temperature operation is a facile manner to obtain bright, stress-free deposits.
- the pH of this bath is not critical between the limits I of 4.0 and 12.0.
- a neutral bath with a pH range of 6 per, iron and the like appear in the bath as a result of drag-in, etc. Too much contamination by such metal ions in solution will ruin the usefulness of the bath be cause the contaminating metal'will plate out.
- the strong complex of palladium, acid pH, and soluble phosphate in solution without other acids having good complexing properties, contaminating metals are precipitated as they reach the plating bath.
- Cathode current efficiences are quite high which tends to eliminate any stress due to hydrogen embrittlement.
- a current efiiciency approaching may be obtained at a current density of 10 amperes per square foot.
- Higher metal concentrations permit the use of higher current densities.
- a similar result may also be obtained with the aid of agitation.
- Insoluble anodes of stainless steel, platinum, or carbon may be used. It is important to avoid anodes of any kind which, because of the chemistry of the solution, are likely to contribute undesirable ions in the plating bath.
- the palladium metal concentration may be maintained on the basis of ampere hours of use of the bath and by the addition of palladium as oxide or cyclohexene diamine tetraacetic acid salt to replace losses. With the removal of substantial amounts of palladium from the bath, it is possible to avoid accumulation of excess free chelating agent in the bath by the addition of palladium oxide to be dissolved and to form the chelate.
- Example I 5 grams of palladium as the palladium chelate of N,N
- This bath when used at 50 C. and a current density of 5 ASP will produce a brilliant palladium electrodeposit.
- Example 11 10 grams of palladium as the palladium chelate of Nb
- cyclohexane-diamine tetra-acetic acid 40 grams of mono-potassium phosphate 30 grams of citric acid 3 Water to one liter.
- Example 111 Using the fomulae of Examples -1 and II, the chelate of cyclopropylene diamine tetra-acetic acid is useful.
- Example IV Using the formulae of Examples I and II, the palladium chelate of cyclobutene N-N diamine tetra-acetic acid is useful.
- a palladium concentration in the range of about 2 grams to about grams of the palladium metal per liter of solution is most useful.
- this bath automatically corrects such contamination conditions, because by maintaining the palladium in platable condition in the form of the highly selective chelates described and maintaining acid conditions in the bath at a level such that the phosphates of iron, copper, nickel and the like are directly precipitated as such, the contaminants are automatically precipitated.
- the bath for all practical purposes, is a bath of pure palladium chelate. For good operating technique, it is desirable occasionally to filter the bath.
- a bath for electro-plating palladium consisting essentially of the palladium chelate of an N,N -cyclic alkylene diamine tetraacetic acid dissolved in water with a phosphate conductor, and a buffer to hold pH at a given level in the range about 4-12.
- a method of electro-plating palladium to form heavy, clean, stress-free, bright plates which comprises providing an aqueous solution of palladium in the form of a chelate stable under plating conditions, the said chelate consisting essentially of palladium chelates of cyclic aliphatic N,N -diamine tetraacetic compounds in the presence of anions in said solution suitable for precipitating contaminating metal but insuflficient to precipitate the palladium, said solution being maintained at a pH in the range from 4-12, and passing an electric current through said solution from an anode to a cathode to be coated.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
United States Patent 3,290,234 ELECTRODEPOSITION 0F PALLADIUM Edward -A. Parker, Cranston, R.I., and Alfred M. Weisberg, Chicago, Ill., assignors to Technic, Inc., Cranston,
R.I., a corporation of Rhode Island N0 Drawing. Filed Oct. 29, 1963, Ser. No. 319,661 4 Claims. (Cl. 204-47) The present invention relates to the electrodeposition of palladium and, more particularly, to the preparation of palladium electroplates possessing bright, smooth, and lustrous surfaces even at heavy thicknesses.
The known methods of depositing palladium from bath used in the prior art suffer various difliculties. Among these may be mentioned instability of the bath, buildup of deleterious side-products, hazy deposits in all but thin coatings, and low deposition rates.
It is therefore a primary object of the present invention to provide a solution from which. palladium may be electrically deposited in a convenient maner whereby a plate is produced which is bright, smooth, and lustrous.
It is a further object of the present invention to provide a solution from which palladium may be electrically deposited at room temperature.
' It is another object of the present invention to provide a solution from which palladium may be electrically deposited in thick smooth plates at relatively rapid rates.
It is still another object of this invention to, provide a process for the aqueous electrodeposition of palladium from a neutral solution. I
Other objects, advantages, and results of the present invention will be apparent to anyone skilled in the knowledge of this art.
We have discovered that these several advantages can be secured by electroplating from a bath containing palladium in the form of a complex in solution in the concentration in the range of 2-10 grams of metal per liter of solution in the form of a complex of a cyclic-alkylenemoiety diamine tetraacetic acid, for example, selected from the group consisting of cyclopropylene, cyclobutene, cyclopentene and cyclohexane, N,N -tetraacetic acid. Also, it should be understood that the acetic acid moiety can be replaced by propionic acid moiety. More generally stated, the chelate complex may be defined as follows:
wherein the X is a cyclic aliphatic moiety having Ns on adjacent carbon atoms as the diamine wherein acetic acid moieties replace hydrogens to form the amino acid chelating compound.
The advantage of these cyclic moieties is that the chelate formed with palladium is strong enough to hold the palladium in solution. In other forms of chelate it is not stable and is reduced to the elemental state.
It is known that palladium forms very strong chelates with aminopolycarboxylic acids. With common ligands of this type, such as ethylenediamine tetraacetic acid, the reducing power of the amino acid moiety is sufiicient to reduce aqueous solutions of the palladium chelate to the elemental state. It has been found that this reduction reaction is accelerated by a low pH.
We have discovered, however, that the aqueous solution of a palladium N,N cyclohexanediamine tetraacetic acid chelate is stable over the pH range of 4 to 12. Below pH 4 the limited solublity of the chelate 3,290,234 Patented Dec. 6, 1966 practically precludes its use as an effective electroplating solution.
Similarly, other diamines having a cyclic moiety between the nitrogens are stable in the broad pH range and are responsive to electric currents so that our fundamental conditions are preserved, namely, the palladium is kept in solution and is electro-deposited, and contaminating metal ions are precipitated.
The palladium metal concentration in this bath may be varied over wide limits, but a practical range for clean, mirror bright plates is 2 to 10 grams of metal per liter.
The temperature of this novel bath may be varied from to 65 C. It has been found, however, that room temperature operation is a facile manner to obtain bright, stress-free deposits.
The pH of this bath is not critical between the limits I of 4.0 and 12.0. A neutral bath with a pH range of 6 per, iron and the like appear in the bath as a result of drag-in, etc. Too much contamination by such metal ions in solution will ruin the usefulness of the bath be cause the contaminating metal'will plate out. Under the conditions we maintain, particularly, the strong complex of palladium, acid pH, and soluble phosphate in solution, without other acids having good complexing properties, contaminating metals are precipitated as they reach the plating bath.
Cathode current efficiences are quite high which tends to eliminate any stress due to hydrogen embrittlement. A current efiiciency approaching may be obtained at a current density of 10 amperes per square foot. Higher metal concentrations permit the use of higher current densities. A similar result may also be obtained with the aid of agitation.
Insoluble anodes of stainless steel, platinum, or carbon may be used. It is important to avoid anodes of any kind which, because of the chemistry of the solution, are likely to contribute undesirable ions in the plating bath. The palladium metal concentration may be maintained on the basis of ampere hours of use of the bath and by the addition of palladium as oxide or cyclohexene diamine tetraacetic acid salt to replace losses. With the removal of substantial amounts of palladium from the bath, it is possible to avoid accumulation of excess free chelating agent in the bath by the addition of palladium oxide to be dissolved and to form the chelate.
The following examples illustrate the application of these principles to the bath composition and operation, and the exemplification which follows should not be construed as limiting the invention but merely illustrates its spirit and scope.
Example I 5 grams of palladium as the palladium chelate of N,N
cyclohexane-diamine tetra-acetic acid 60 grams of mono-potassium phosphate.
Water to one liter.
This bath when used at 50 C. and a current density of 5 ASP will produce a brilliant palladium electrodeposit.
Example 11 10 grams of palladium as the palladium chelate of Nb",
cyclohexane-diamine tetra-acetic acid 40 grams of mono-potassium phosphate 30 grams of citric acid 3 Water to one liter.
When this solution is adjusted to pH 5.0, pure, mirror bright palladium electrodeposits may be obtained at room temperature with a current density of 5 ASP.
Example 111 Using the fomulae of Examples -1 and II, the chelate of cyclopropylene diamine tetra-acetic acid is useful.
Example IV Using the formulae of Examples I and II, the palladium chelate of cyclobutene N-N diamine tetra-acetic acid is useful.
Generally, a palladium concentration in the range of about 2 grams to about grams of the palladium metal per liter of solution is most useful.
In carrying out plating operations using these baths, it is to be noted that good plating technique is to be followed. That is, ampere hours of use of the bath are measured, the temperature of the bath is controlled reasonably closely to the recommended levels, it is agitated, pH of the bath is followed and adjustment within reasonable tolerance of recommended levels is made and, generally, clean plating techniques are followed. Regardless of the care with which plating operations are carried on in a working installation, it may be noted that when a base'metal such as iron ha been plated with copper and nickel, whether the article he costume jewelry or a piece of scientific apparatus, the best techniques will still produce situations in which the plating baths become contaminated with iron, copper, nickel, etc. Since it is not the desire of the operator to plate palladium alloys, this bath automatically corrects such contamination conditions, because by maintaining the palladium in platable condition in the form of the highly selective chelates described and maintaining acid conditions in the bath at a level such that the phosphates of iron, copper, nickel and the like are directly precipitated as such, the contaminants are automatically precipitated. Hence, the bath, for all practical purposes, is a bath of pure palladium chelate. For good operating technique, it is desirable occasionally to filter the bath.
The foregoing examples illustrating working formulas for the deposition of bright palladium coatings specifically indicate an operating pH of 5. It is to be understood that operable pH within the range of 4-12 can be used with the palladium chelate solutions identified but the preferred range is slightly on the acid side, 567.
One of the reasons for the acid pH operation is to maintain conditions in the bath such that contaminating metal ions will he precipitated as their phosphates, Accordingly, all of the examples may be actually read as pH operation 4-12, preferred being 56-7. Similarly, where the specific examples show the cyclohexene diamine acetic acid compound as the chelating agent, it should 'be understood that substantially the same results are obtained when the cyclopropene, cyclobutene, cyclopentene are used, because the stability of these compounds is of the same order of magnitude as the cyclohexene.
What is claimed is:
1. A bath for electro-plating palladium consisting essentially of the palladium chelate of an N,N -cyclic alkylene diamine tetraacetic acid dissolved in water with a phosphate conductor, and a buffer to hold pH at a given level in the range about 4-12.
2. A bath in accordance with claim 1 in which the palladium compound is the palladium chelate of cyclo hexane diamine tetraacetic acid and the bath is buttered to a pH in the range from about 4 to about 12.
3. A bath in accordance with claim 2 in which the concentration of palladium compound maintained in the solution is in the range from about 2 grams to about 10 grams of metal per liter.
4. A method of electro-plating palladium to form heavy, clean, stress-free, bright plates which comprises providing an aqueous solution of palladium in the form of a chelate stable under plating conditions, the said chelate consisting essentially of palladium chelates of cyclic aliphatic N,N -diamine tetraacetic compounds in the presence of anions in said solution suitable for precipitating contaminating metal but insuflficient to precipitate the palladium, said solution being maintained at a pH in the range from 4-12, and passing an electric current through said solution from an anode to a cathode to be coated.
References Cited by the Examiner UNITED STATES PATENTS 2,335,821 11/1943 Wise et al. 204-47 2,452,308 10/1948 Lambros 20447 2,984,595 5/1961 Schumpelt et al. 204-47 JOHN H. MACK, Primary Examiner.
G. KAPLAN, Assistant Examiner.
Claims (1)
- 4. A METHOD OF ELECTRO-PLATING PALLADIUM TO FORM HEAVY, CLEAN, STRESS-FREE, BRIGHT PLATES WHICH COMPRISES PROVIDING AN AQUEOUS SOLUTION OF PALLADIUM IN THE FORM OF A CHELATE STABLE UNDER PLATING CONDITIONS, THE SAID CHELATE CONSISTING ESSENTIALLY OF PALLADIUM CHELATES OF CYCLIC ALIPHATIC N,N1-DIAMINE TERAACETIC COMPOUNDS IN THE PRESENCE OF ANIONS IN SAID SOLUTION SUITABLE FOR PRECIPITATING CONTAMINATING METALS BUT INSUFFICIENT TO PRECIPITATE THE PALLADIUM, SAID SOLUTION BEING MAINTAINED AT A PH IN THE RANGE FROM 4-12, AND PASSING AN ELECTRIC CURRENT THROUGH SAID SOLUTION FROM AN ANODE TO A CATHODE TO BE COATED.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US319661A US3290234A (en) | 1963-10-29 | 1963-10-29 | Electrodeposition of palladium |
| GB4187/64A GB1014045A (en) | 1963-10-29 | 1964-01-31 | Electrodeposition of palladium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US319661A US3290234A (en) | 1963-10-29 | 1963-10-29 | Electrodeposition of palladium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3290234A true US3290234A (en) | 1966-12-06 |
Family
ID=23243177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US319661A Expired - Lifetime US3290234A (en) | 1963-10-29 | 1963-10-29 | Electrodeposition of palladium |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3290234A (en) |
| GB (1) | GB1014045A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3376206A (en) * | 1964-06-30 | 1968-04-02 | Ibm | Electrolyte for the electrodeposition of palladium |
| US3530049A (en) * | 1968-10-02 | 1970-09-22 | Technic | Gold and ruthenium plating baths |
| US3530050A (en) * | 1964-06-12 | 1970-09-22 | Johnson Matthey Co Ltd | Electrodeposition of palladium |
| US3637474A (en) * | 1967-09-08 | 1972-01-25 | Sel Rex Corp | Electrodeposition of palladium |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2657925A1 (en) | 1976-12-21 | 1978-06-22 | Siemens Ag | AMMONIA-FREE, AQUATIC BATH FOR GALVANIC DEPOSITION OF PALLADIUM OR. PALLADIUM ALLOYS |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2335821A (en) * | 1940-05-20 | 1943-11-30 | Int Nickel Co | Palladium plating bath |
| US2452308A (en) * | 1946-02-28 | 1948-10-26 | George C Lambros | Process of plating palladium and plating bath therefor |
| US2984595A (en) * | 1956-06-21 | 1961-05-16 | Sel Rex Precious Metals Inc | Printed circuit manufacture |
-
1963
- 1963-10-29 US US319661A patent/US3290234A/en not_active Expired - Lifetime
-
1964
- 1964-01-31 GB GB4187/64A patent/GB1014045A/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2335821A (en) * | 1940-05-20 | 1943-11-30 | Int Nickel Co | Palladium plating bath |
| US2452308A (en) * | 1946-02-28 | 1948-10-26 | George C Lambros | Process of plating palladium and plating bath therefor |
| US2984595A (en) * | 1956-06-21 | 1961-05-16 | Sel Rex Precious Metals Inc | Printed circuit manufacture |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3530050A (en) * | 1964-06-12 | 1970-09-22 | Johnson Matthey Co Ltd | Electrodeposition of palladium |
| US3376206A (en) * | 1964-06-30 | 1968-04-02 | Ibm | Electrolyte for the electrodeposition of palladium |
| US3637474A (en) * | 1967-09-08 | 1972-01-25 | Sel Rex Corp | Electrodeposition of palladium |
| US3530049A (en) * | 1968-10-02 | 1970-09-22 | Technic | Gold and ruthenium plating baths |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1014045A (en) | 1965-12-22 |
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