US2501737A - Solution for plating metals with gold - Google Patents
Solution for plating metals with gold Download PDFInfo
- Publication number
- US2501737A US2501737A US696380A US69638046A US2501737A US 2501737 A US2501737 A US 2501737A US 696380 A US696380 A US 696380A US 69638046 A US69638046 A US 69638046A US 2501737 A US2501737 A US 2501737A
- Authority
- US
- United States
- Prior art keywords
- solution
- gold
- nickel
- distilled water
- acetic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 17
- 239000002184 metal Substances 0.000 title claims description 17
- 238000007747 plating Methods 0.000 title claims description 14
- 150000002739 metals Chemical class 0.000 title claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title description 19
- 239000010931 gold Substances 0.000 title description 19
- 229910052737 gold Inorganic materials 0.000 title description 19
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 239000012153 distilled water Substances 0.000 claims description 17
- 239000004615 ingredient Substances 0.000 claims description 12
- 238000004090 dissolution Methods 0.000 claims description 11
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 claims description 11
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 11
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 9
- 238000007654 immersion Methods 0.000 claims description 6
- 229940001496 tribasic sodium phosphate Drugs 0.000 claims description 4
- 239000000243 solution Substances 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 8
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 7
- -1 for example Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Definitions
- This invention relates to the plating of metals by mere immersion without heat or electrolytic action, and more especially to the plating of base metals with gold in this manner.
- metals have been plated with gold by electrolysis, a method which requires the heating of the solution.
- the heating of the solution causes evaporation, which results in reducing the plating efiiciency thereof.
- An electrolytic solution is weakened, also, by the transposition of gold from "the gold anode thereof to the solution because the gold transposed from the anode to the solution does not enter into composition with the gold chloride solution.
- Our method in addition to being more economical than the electrolytic method, produces a more even coating of gold, which eliminates the necessity for vbufiing. No gold anode is required and the plating process is carried out with a cold solution.
- Our process and solution may also be used in plating the interior surface of a hypodermic needle, which is about two-hundredths of an inch in diameter, without clogging, thereby prolonging the useful life of the needle, the inner surfaces of which frequently corrode and cause clogging.
- the solution which we prefer at the present time comprises distilled water, gold chloride, so-
- nickel chloride nickel carbonate
- Gold chloride 3.9 grams; nickel chloride or carbonate, when used, 3.9 grams; sodium phosphate, tribasic, 47.5 grams; potassium cyanide 47.5 grams; acetic acid, 18 cubic centimeters, i. e., 18.88 grams.
- the quantities of the ingredients prior to their dissolution in 375 cubic centimeters of distilled water are substantially as follows:
- Gold chloride 3.9 grams; sodium phosphate 47.5 grams; potassium cyanide 47.5 grams; acetic acid 18.0 cubic centimeters, i. e., 18.88 grams.
- the ingredients preferably are mixed as follows, to wit: first, the gold chloride is completely dissolved in the distilled water; next, the sodium phosphate (tribasic) is added and thoroughly dissolved; then, the potassium cyanide is dissolved therein; and finally, the acetic acid is added to the solution, slowly and without agitation or stirring. After the evolution of a negligible quantity of gas caused by the addition of the acetic acid has ceased, it is advisable to stir the solution to effect the thorough dissolution of the ingredients and to insure uniformity throughout. The acetic acid co-ordinates the other ingredients into a solution that will give the desired result.
- the metal to be plated is nickel
- the above procedure is followed down to and including the addition to the solution of potassium cyanide, then the nickel chloride (or nickel carbonate) is added and thoroughly dissolved, and, finally, as before, the acetic acid is added in the manner above set forth.
- nickel chloride or nickel carbonate
- the solution must be stirred to effect the thorough dissolution of the same, but when nickel carbonate is used, there will be a violent evolution of gas which will effect the thorough dissolution of the nickel carbonate.
- nickel carbonate is the full chemical equivalent of nickel chloride, insofar as the present invention is concerned.
- the nickel salt is necessary only when the metal to be plated with gold is nickel.
- the solution containing nickel chloride (carbonate) metals other than nickel can be plated with gold, e. g., tungsten and molybdenum, which frequently are used for the side bars or supports of radio tubes and other electron discharge devices.
- the grid wire, or other metallic member to be plated is placed in the solution above described, and after remaining therein a short period of time, for example, 15 seconds for a small grid, to about two minutes for a larger article, is removed by nonmetallic means, for example, glass pliers.
- the solution is stable and will not deteriorate with lapse of time if enclosed within asealed container.
- Acetic acid belongs to the class of so-called weak acids because only a small portion of a given quantity thereof breaks up into hydrogen ions or cations, and anions, upon the complete dissolution of such quantity in water. It is for this reason, as we believe, that acetic acid is the best acid for use as the acid element of our solution.
- a solution for plating metals with gold by immersion only comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79 nickel chloride .79%, tribasic sodium phosphate 9.57%, potassium cyanide 9.57%, acetic acid 3.78%, and distilled water 75.50%.
- a solution for plating metals with gold by immersion only comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79%, nickel carbonate .79%, tribasic sodium phosphate 9.57%, potassium cyanide 9.57 acetic acid 3.78%, and distilled water 75.50%.
- a solution for plating metals with gold by immersion only comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79%, tribasic sodium phosphate 9.63%, potassium cyanide 9.63%, acetic acid 3.82%, and distilled water 76.13%.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Mar. 28, 1950 SOLUTION FOR PLATING METALS WIT-H GOLD Ralph W. Porter, J12, Cambridge, and Clifford M. Jones, Chelsea, Mass.
No Drawing. Application September 11, 1946, Serial No. 696,380
3 Claims.
This invention relates to the plating of metals by mere immersion without heat or electrolytic action, and more especially to the plating of base metals with gold in this manner.
Heretofore, metals have been plated with gold by electrolysis, a method which requires the heating of the solution. The heating of the solution causes evaporation, which results in reducing the plating efiiciency thereof. An electrolytic solution is weakened, also, by the transposition of gold from "the gold anode thereof to the solution because the gold transposed from the anode to the solution does not enter into composition with the gold chloride solution.
Our method, in addition to being more economical than the electrolytic method, produces a more even coating of gold, which eliminates the necessity for vbufiing. No gold anode is required and the plating process is carried out with a cold solution.
One of the uses to which our invention may be put is the plating of grids of radio tubes and other electron discharge devices. It has long been the practice to plate the grids of radio tubes electrolytically to reduce the absorption of air by the grid and diminish the secondary emission therefrom due to molecular bombardment. It has been the experience of tube makers that when tubes having gold-plated grids are bombed, the gold particles fiy on" the grids, which usually are made of molybdenum or tungsten and are supported by nickel .side rods. However, when the grids are plated by our composition andprocess, the plating will remain intact under the bombing process.
Our process and solution may also be used in plating the interior surface of a hypodermic needle, which is about two-hundredths of an inch in diameter, without clogging, thereby prolonging the useful life of the needle, the inner surfaces of which frequently corrode and cause clogging.
We have found that various metals, for example, nickel, tungsten, and molybdenum, can be plated with gold by mere immersion in our solution and without the use of electrolysis or heat.
The solution which we prefer at the present time comprises distilled water, gold chloride, so-
dium phosphate, potassium cyanide, and acetic acid, and, when the metal to be plated is nickel, nickel chloride (nickel carbonate) is included.
The quantities of the ingredients of our solution having a water content of 375 cubic centimeters (375 grams) of distilled water, which we have found to be the minimum practicable solution, are substantially as follows, prior to dissolving them in 375 cubic centimeters of distilled water:
Gold chloride 3.9 grams; nickel chloride or carbonate, when used, 3.9 grams; sodium phosphate, tribasic, 47.5 grams; potassium cyanide 47.5 grams; acetic acid, 18 cubic centimeters, i. e., 18.88 grams.
Expressed in percentages, the quantitative relation of the ingredients prior to dissolution in 375 cubic centimeters of distilled water, may be defined substantially as follows:
Gold chloride .79% by weight; nickel chloride (carbonate), when used, 79% by weight; sodium phosphate, tribasic, 9.57% by weight; potassium cyanide 9.57% by weight; acetic acid 3.78% by weight (18 cubic centimeters); distilled water 75.50% by weight.
When the metal to be plated is other than nickel, and the water content of the solution is 375 cubic centimeters, (375 grams), the quantities of the ingredients prior to their dissolution in 375 cubic centimeters of distilled water are substantially as follows:
Gold chloride 3.9 grams; sodium phosphate 47.5 grams; potassium cyanide 47.5 grams; acetic acid 18.0 cubic centimeters, i. e., 18.88 grams.
Expressed in percentages, the quantitative relation of the ingredients when nickel chloride (or nickel carbonate) is omitted, prior to dissolution in 375 cubic centimeters of distilled water, may be defined substantially as follows:
Gold chloride 79% by weight; sodium phosphate 9.63% by weight; potassium cyanide 9.63% by weight; acetic acid 3.82% by weight (18 cubic centimeters); distilled water 76.13% by weight.
Our experience has been that the maximum practicable solution is one having a water content of about 4500 cubic centimeters.
It is to be understood that while we have stated specifically the exact quantities which we have found to be useful, practicable, and efficient, we do not limit ourselves thereto, because the proportions are capable of variations. We have found that the rate of increase of each ingredient with respect to the water content is substantially linear.
The ingredients preferably are mixed as follows, to wit: first, the gold chloride is completely dissolved in the distilled water; next, the sodium phosphate (tribasic) is added and thoroughly dissolved; then, the potassium cyanide is dissolved therein; and finally, the acetic acid is added to the solution, slowly and without agitation or stirring. After the evolution of a negligible quantity of gas caused by the addition of the acetic acid has ceased, it is advisable to stir the solution to effect the thorough dissolution of the ingredients and to insure uniformity throughout. The acetic acid co-ordinates the other ingredients into a solution that will give the desired result.
When the metal to be plated is nickel, the above procedure is followed down to and including the addition to the solution of potassium cyanide, then the nickel chloride (or nickel carbonate) is added and thoroughly dissolved, and, finally, as before, the acetic acid is added in the manner above set forth. When nickel chloride is used, the solution must be stirred to effect the thorough dissolution of the same, but when nickel carbonate is used, there will be a violent evolution of gas which will effect the thorough dissolution of the nickel carbonate. understood, of course, that nickel carbonate is the full chemical equivalent of nickel chloride, insofar as the present invention is concerned. The nickel salt is necessary only when the metal to be plated with gold is nickel. By the solution containing nickel chloride (carbonate) metals other than nickel can be plated with gold, e. g., tungsten and molybdenum, which frequently are used for the side bars or supports of radio tubes and other electron discharge devices.
The grid wire, or other metallic member to be plated, is placed in the solution above described, and after remaining therein a short period of time, for example, 15 seconds for a small grid, to about two minutes for a larger article, is removed by nonmetallic means, for example, glass pliers.
The solution is stable and will not deteriorate with lapse of time if enclosed within asealed container.
We are aware that various solutions have been proposed for gilding metals with gold. Our solution, however, is not to be confused with such gilding solutions because the film of gold formed by them on other metals is readily removed by scouring or even by handling, while by our solution the metals immersed therein are plated with gold even more firmly than by electrolytic deposition, as shown by the fact that when grids of radio tubes are plated by our solution, the plating remains process.
As at present advised, it is our belief that the acetic acid when dissolved in water breaks up into hydrogen ions or cations, which carry posi- It is to be intact under the bombing tive charges, and anions, which are ions carrying negative charges.
Acetic acid belongs to the class of so-called weak acids because only a small portion of a given quantity thereof breaks up into hydrogen ions or cations, and anions, upon the complete dissolution of such quantity in water. It is for this reason, as we believe, that acetic acid is the best acid for use as the acid element of our solution.
Having thus described illustrative embodiments of our invention, without, however, limiting the same thereto, what we claim and desire to secure by Letters Patent is:
1. A solution for plating metals with gold by immersion only, comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79 nickel chloride .79%, tribasic sodium phosphate 9.57%, potassium cyanide 9.57%, acetic acid 3.78%, and distilled water 75.50%.
2. A solution for plating metals with gold by immersion only, comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79%, nickel carbonate .79%, tribasic sodium phosphate 9.57%, potassium cyanide 9.57 acetic acid 3.78%, and distilled water 75.50%.
3. A solution for plating metals with gold by immersion only, comprising before the dissolution thereof in distilled water, the following ingredients in substantially the proportions by weight hereinafter stated, to wit, gold chloride .79%, tribasic sodium phosphate 9.63%, potassium cyanide 9.63%, acetic acid 3.82%, and distilled water 76.13%.
RALPH W. PORTER, JR. CLIFFORD M. JONES.
REFERENCES CITED The following references file of this patent:
UNITED STATES PATENTS are of record in the Number Name Date 744,170 Darlay Nov. 17, 1903 1,208,507 Dalby Dec. 12, 1916 OTHER REFERENCES
Claims (1)
- 3. A SOLUTION FOR PLATING METALS WITH GOLD BY IMMERSION ONLY, COMPRISING BEFORE THE DISSOLUTION THEREOF IN DISTILLED WATER, THE FOLLOWING INGREDIENTS IN SUBSTANTIALLY THE PROPORTIONS BY WEIGHT HEREINAFTER STATED, TO WIT, GOLD CHLORIDE .79%, TRIBASIC SODIUM PHOSPHATE 9.63%, POTASSIUM CYANIDE 9.63%, ACETIC ACID 3.82%, AND DISTILLED WATER 76.13%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US696380A US2501737A (en) | 1946-09-11 | 1946-09-11 | Solution for plating metals with gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US696380A US2501737A (en) | 1946-09-11 | 1946-09-11 | Solution for plating metals with gold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2501737A true US2501737A (en) | 1950-03-28 |
Family
ID=24796822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US696380A Expired - Lifetime US2501737A (en) | 1946-09-11 | 1946-09-11 | Solution for plating metals with gold |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2501737A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2654701A (en) * | 1950-06-08 | 1953-10-06 | Edwin R Calderon | Plating aluminum |
| US2834724A (en) * | 1956-04-26 | 1958-05-13 | Mendes Abraham Piza | Method of electroplating plastic articles |
| US2836510A (en) * | 1953-05-21 | 1958-05-27 | Gen Motors Corp | Nickel plating by chemical reduction |
| US2836515A (en) * | 1953-04-30 | 1958-05-27 | Westinghouse Electric Corp | Gold immersion solution for treating silver and method of applying same |
| US2865376A (en) * | 1956-03-27 | 1958-12-23 | American Cyanamid Co | Gold plating surgical needles |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
| US3266929A (en) * | 1962-12-17 | 1966-08-16 | Shipley Co | Gold plating by immersion |
| US3958045A (en) * | 1971-12-09 | 1976-05-18 | Coleman Charles M | Method of making an automatic volume control pipet |
| DE3219665A1 (en) * | 1981-06-02 | 1982-12-16 | Hooker Chemicals Plastics Corp | BATH FOR ELECTRIC DEPOSIT OF GOLD AND METHOD FOR DEPOSIT GOLD ON A SUBSTRATE USING THIS BATH |
| US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US744170A (en) * | 1899-08-26 | 1903-11-17 | Andre Darlay | Process of depositing metallic coatings on metallic objects. |
| US1208507A (en) * | 1916-07-22 | 1916-12-12 | Agnes Dalby | Preparation for silvering or gilding metal articles. |
-
1946
- 1946-09-11 US US696380A patent/US2501737A/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US744170A (en) * | 1899-08-26 | 1903-11-17 | Andre Darlay | Process of depositing metallic coatings on metallic objects. |
| US1208507A (en) * | 1916-07-22 | 1916-12-12 | Agnes Dalby | Preparation for silvering or gilding metal articles. |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2654701A (en) * | 1950-06-08 | 1953-10-06 | Edwin R Calderon | Plating aluminum |
| US2836515A (en) * | 1953-04-30 | 1958-05-27 | Westinghouse Electric Corp | Gold immersion solution for treating silver and method of applying same |
| US2836510A (en) * | 1953-05-21 | 1958-05-27 | Gen Motors Corp | Nickel plating by chemical reduction |
| US2865376A (en) * | 1956-03-27 | 1958-12-23 | American Cyanamid Co | Gold plating surgical needles |
| US2834724A (en) * | 1956-04-26 | 1958-05-13 | Mendes Abraham Piza | Method of electroplating plastic articles |
| US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US3266929A (en) * | 1962-12-17 | 1966-08-16 | Shipley Co | Gold plating by immersion |
| US3958045A (en) * | 1971-12-09 | 1976-05-18 | Coleman Charles M | Method of making an automatic volume control pipet |
| DE3219665A1 (en) * | 1981-06-02 | 1982-12-16 | Hooker Chemicals Plastics Corp | BATH FOR ELECTRIC DEPOSIT OF GOLD AND METHOD FOR DEPOSIT GOLD ON A SUBSTRATE USING THIS BATH |
| US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
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