US2543678A - Method of producing rectifier elements - Google Patents
Method of producing rectifier elements Download PDFInfo
- Publication number
- US2543678A US2543678A US54231A US5423148A US2543678A US 2543678 A US2543678 A US 2543678A US 54231 A US54231 A US 54231A US 5423148 A US5423148 A US 5423148A US 2543678 A US2543678 A US 2543678A
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- plate
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- rectifier elements
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- 238000000034 method Methods 0.000 title description 12
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 14
- 239000007772 electrode material Substances 0.000 description 9
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 229910052711 selenium Inorganic materials 0.000 description 7
- 239000011669 selenium Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
- H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/107—Punching and bonding pressure application by punch
Definitions
- This invention relates to an improved method and apparatus for efficiently and rapidly producing rectifier elements in multiple.
- Fig. is a transverse sectional view showing a further process step.
- Fig. 16 is a plan view illustrating a further step in the process.
- Fig. 1'! is a plan view of a completed assembly of rectifiers.
- Fig. 18 is a plan view of a completed rectifier section.
- Fig. 19 is a transverse sectional view on the line 19-49 of Fig. 18.
- Fig. 6 is a vertical sectional view on the line 6-6 of Fig. 5.
- Fig. 7 is a vertical sectional view on the line 1-1 of Fig. 6.
- Figs. 8 through 12 are partial vertical sectional views illustrating successive steps of the methods.
- Fig. 13 is a plan view 01' a base plate after processing in the apparatus of Fig. 1.
- Fig. 14 is a transverse sectional view on the line l4l4 of Fig. 13.
- a relatively heavy, substantially square base plate 23 is mounted on shelf 2i. and secured to plate 23 are a pair of horizontally spaced, inverted L-shaped parallel Strips 24 secured to the extended portions-of rails 25 act as extensions of the bearing surface 23.
- Bolts 26 act as outer stops for rails 25, and a third inverted L-shaped member 21 extends across the inner ends of the rails and has, near one end, a bore 28 for a purpose to be described.
- ! is provided, and includes a plate 3
- has a reduced extension 33 carrying an operating handle 34 for reciprocating slide 30 between a loading position at the outer ends of rails 25 and an operating position at the inner ends of the rails.
- carries a finger 36 projectable through bar 23 to engage the operator 3! of a microswitch mounted on plate 23.
- Switch 35 is connected by conductors 33 to an electronic timer (not shown) which controls the operation of the mechanism.
- the upper surface of plate 32 has four angle straps 41, one at each corner, which serve as location fixers for the metal plate 40 on which the rectifiers are formed. In the example shown, twenty-five individual rectifiers are to be formed on plate 40 in five rows of five sections each.
- a relatively thick, substantially square block 42 rests on rails 25 and has twenty-five vertical bores 43 each having a bearing bushing 44 therein. Each bore is centered with respect to a rectifier section of plate 40. Resting on the upper surface of block 42 is a plate 46, with its lower surface recessed to form a slit 41 opening transversely of the direction of movement of slide 30. Plate 45 has twenty-five apertures 48 each aligned with a bore 43.
- Slit or passage 41 extends beyond the outer rows of apertures 48, and is arranged to receive a sheet 50 of masking material, preferably paper, from a roll 5! mounted on a shaft 52 supported in bearings 53.
- Bearings 53 are mounted on the horizontal leg of an L-shaped bracket secured on the Side of frame 20.
- a support roller 56 may be mounted in bearings 51 between roll 5
- Paper insulating discs 60 which also serve as masks in the piercing step later described, are punched from adhesive coated insulation sheet 50 by means of punches 58 on a vertically reciprocable ram 55 having guides 6
- Slide 30 is pulled to the left (Fig. 2) and a metal sheet 40 is located thereon by angles 4
- Sheet 50 which is coated with an adhesive on its under surface, is pulled from roll 5
- Slide 30 is then pushed to the right (Fig. 3), whereupon pin or plunger 36 passes through bore 28 and engages operator 3'! to activate switch 35. This starts the electronic timer, which controls the reciprocating mechanism for ram 55.
- Ram 55 moves down (Fig. 10) and punches 58 punch discs or masks 60 from strip 50, carrying them down through bushings 44 against plate 40.
- the timer maintains the ram in the down position, with punches -58 forcing discs 60 against plate 40, for a time sufiicient to assure firm adherence of the discs against the plate.
- the ram then ascends to the position of Figs. 8 and 9 and the perforated strip 50 is withdrawn.
- Slide 30 is moved to the left to the loading position and plate 40, with twenty-five discs or masks 60 adhered thereto (Figs. 13 and 14) is removed.
- the masked plate is next sprinkled with 9. rectifying material 6
- such as selenium
- the selenium or the like is then pressed firmly into adherence with the plate surface and the discs or masks 60, forming a continuous coating, after which the assembly is annealed in the usual manner.
- Barrier layer liquid is then applied to the annealed selenium surface to form a continuous coating.
- a grid 65 having a series of cross bars bounding openings 66, defining the location and area of the counter-electrode layer for the respective individual rectifier elements, is placed on the treated surface of the plate and counter-electrode material applied to each surface within the zones of the openings of the grid, thereby forming a series of spaced layers of counter-electrode material which are greater in area than the discs aforesaid,
- the grid 65 is then removed and the coated base plate may be fed through a shear which cuts the same into strips along and centrally of the parallel margins 6'! from which counter-electrode material has been masked by the cross bars bounding the openings 66 as aforesaid, or the base plate may be fed through a combined punch and shear which severs the individual rectifiers 10 along the center line of the cross bar masked margins 61 and simultaneously punches apertures 68 through masking discs 60 and plate 40.
- the punching operation leaves an annular insulation disc 69 around the aperture, between the coatings and the base, and prevents contact of rough edges of such coatings, particularly the counterelectrode material, with the base plate at the aperture; since the counter-electrode in no event extends up to the severing line, no problem of short-circuiting can exist at the external peripheral edges of the severed individual rectifier elements.
- the completed rectifiers may then be electroformed, and assembled on a rod in the usual manner.
- the described method and apparatus provide a rectifier in which the semi-conductor and counter-electrode are in contact throughout their areas, but separated from the base at the zone of the insulator disc.
- a method of manufacturing a plurality of selenium or the like rectifiers each of which incorporates as a base a section from a metal plate which is later sub-divided comprising applying discs of insulating material to the surface of the plate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over the barrier layer in laterally spaced layers, each of which is superimposed over and is greater in area than the insulating disc, severing the thus treated plate in the spaces between the counter-electrode layers to form individual rectifier sections, and piercing the individual sections at their centers to provide an insulating ring on the base, bounding a formed aperture.
- a method of manufacturing a plurality of selenium or the like rectifiers eachof which incorporates as a base a section from a metal plate which is later subdivided comprising adheringly applying discs of insulating materialto the surface of the plate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over the barrier layer in laterally spaced layers, each of which is superimposed over ,and is greater in area than the adhering insulating disc, severing the thus treated plate in the spaces between the counter-electrode layers to form individual rectifier sections,,and piercing the individual sections at their centers to provide an insulating ring on the base, bounding a formed aperture.
- a method of manufacturing a plurality of selenium ,or the like rectifiers each of which incorporates as a base a section from a metal plate which is later subdivided comprisin adheringly applying discs of insulating material to the sur-- face of the,p1ate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over. the barrier layer in laterally spaced layers, each of which is superimposed over and is greater in area than the adhering insulating disc, severing the .thus
- a continuous coating'Of semi-conductive material applying to such one surface a continuous coating'Of semi-conductive material, applying a continuous barrier layer to the coating, mounting on the barrier layer a masking grid having openings delineating the areas of the counter-electrode for the individual sections, ,applying a coating of counter-electrode material over the barrier layer within the grid openings, removin the grid, severing the individual rectifier sections along the zones masked by the grid, and simultaneously with such severing piercing the sections at their centers toprovide an insulating ring on the base around the formed aperture.
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
Feb. 27, 1951 s. TUMULO ma'moo 0F PRODUCING RECTIFIER ELEMENTS 5 Sheets-Sheet 1 Filed Oct. 13, 1948 INVENTOR.
A m'mnmyr -dm u M m a F m Feb. 27, 1951 e. TUMULO METHOD OF PRODUCING RECTIFIER ELEMENTS 3 She ets-She'et 2 Filed Oct. 13, 1948 INVENTOR.
HT'PORNL'Y Feb. 27, 1951 a. TUMULO 2,543,678
METHOD OF PRODUCING RECTIFIER ELEMENTS Filed Oct. 13, 1948 s Sheets-Sheet s Patented F eb. 27, 1951 METHOD OF PRODUCING RECTIFIER ELEMENTS Gerald 'l umulo, nmimawr, N. Y., assignor to Radio Receptor Co. Inc., New York, N. Y., a
corporation of New York Application October 13, 1948, Serial No. 54,231
Claims.
This invention relates to an improved method and apparatus for efficiently and rapidly producing rectifier elements in multiple.
Broadly, it is an object of this invention to,
provide a method and apparatus for producing rectifier elements in multiple from a base plate which is later subdivided; wherein a series of coatings or layers developing the rectifier effect are superimposed over an enlarged base plate on which there is adheringly mounted a series of insulating discs, which later serve as masking elements during the layer application and as insulating elements in the end product.
Specifically, it is an object of this invention to provide a method of and apparatus for producing rectifier elements in multiple from a base plate which comprises successively adheringly mounting a plurality of insulating discs in spaced relationship on the surface of a base plate successively coating the same with continuous layers of semi-conductive material and barrier liquid and discontinuous or spaced areas of counterelectrode material, the respective margins between the layers of counter-electrode material serving as the severing zone defining the individual rectifier elements being formed.
Fig. is a transverse sectional view showing a further process step.
Fig. 16 is a plan view illustrating a further step in the process.
Fig. 1'! is a plan view of a completed assembly of rectifiers.
Fig. 18 is a plan view of a completed rectifier section. I
Fig. 19 is a transverse sectional view on the line 19-49 of Fig. 18.
Referring to Figs. 1' through '7. the apparatus for adheringly mounting inmultiple on the base plate masks which serve as insulating discs, in-
, cludes a frame having an upper horizontal rails which extend beyond plate 23.
It is accordingly the object of this invention I to provide a new method and apparatus for manufacturing rectifiers, and especially adapted to mass production.
This, and other objects, advantages and novel 3 on the of the apparatus of Fig. 1.
Fig. 6 is a vertical sectional view on the line 6-6 of Fig. 5.
Fig. 7 is a vertical sectional view on the line 1-1 of Fig. 6.
Figs. 8 through 12 are partial vertical sectional views illustrating successive steps of the methods. Fig. 13 is a plan view 01' a base plate after processing in the apparatus of Fig. 1.
Fig. 14 is a transverse sectional view on the line l4l4 of Fig. 13.
shelf 2| supported on legs 22. A relatively heavy, substantially square base plate 23 is mounted on shelf 2i. and secured to plate 23 are a pair of horizontally spaced, inverted L-shaped parallel Strips 24 secured to the extended portions-of rails 25 act as extensions of the bearing surface 23. Bolts 26 act as outer stops for rails 25, and a third inverted L-shaped member 21 extends across the inner ends of the rails and has, near one end, a bore 28 for a purpose to be described.
A slide 3|! is provided, and includes a plate 3|, engaging plate 23 and strips 24, andan upper plate 32 secured to plate 3| and fitting between rails 25. Plate 3| has a reduced extension 33 carrying an operating handle 34 for reciprocating slide 30 between a loading position at the outer ends of rails 25 and an operating position at the inner ends of the rails. At its inner end, plate 3| carries a finger 36 projectable through bar 23 to engage the operator 3! of a microswitch mounted on plate 23. Switch 35 is connected by conductors 33 to an electronic timer (not shown) which controls the operation of the mechanism.
The upper surface of plate 32 has four angle straps 41, one at each corner, which serve as location fixers for the metal plate 40 on which the rectifiers are formed. In the example shown, twenty-five individual rectifiers are to be formed on plate 40 in five rows of five sections each.
A relatively thick, substantially square block 42 rests on rails 25 and has twenty-five vertical bores 43 each having a bearing bushing 44 therein. Each bore is centered with respect to a rectifier section of plate 40. Resting on the upper surface of block 42 is a plate 46, with its lower surface recessed to form a slit 41 opening transversely of the direction of movement of slide 30. Plate 45 has twenty-five apertures 48 each aligned with a bore 43.
3 Slit or passage 41 extends beyond the outer rows of apertures 48, and is arranged to receive a sheet 50 of masking material, preferably paper, from a roll 5! mounted on a shaft 52 supported in bearings 53. Bearings 53 are mounted on the horizontal leg of an L-shaped bracket secured on the Side of frame 20. A support roller 56 may be mounted in bearings 51 between roll 5| and slit 41.
The operation of the apparatus will now be described. Slide 30 is pulled to the left (Fig. 2) and a metal sheet 40 is located thereon by angles 4|. Sheet 50, which is coated with an adhesive on its under surface, is pulled from roll 5| and fed through slit or passage 41 (Fig. 9). Slide 30 is then pushed to the right (Fig. 3), whereupon pin or plunger 36 passes through bore 28 and engages operator 3'! to activate switch 35. This starts the electronic timer, which controls the reciprocating mechanism for ram 55.
Ram 55 moves down (Fig. 10) and punches 58 punch discs or masks 60 from strip 50, carrying them down through bushings 44 against plate 40. The timer maintains the ram in the down position, with punches -58 forcing discs 60 against plate 40, for a time sufiicient to assure firm adherence of the discs against the plate. The ram then ascends to the position of Figs. 8 and 9 and the perforated strip 50 is withdrawn. Slide 30 is moved to the left to the loading position and plate 40, with twenty-five discs or masks 60 adhered thereto (Figs. 13 and 14) is removed.
The masked plate is next sprinkled with 9. rectifying material 6| such as selenium, covering both the surface of the plate and the discs or masks 60 (Fig. 15). The selenium or the like is then pressed firmly into adherence with the plate surface and the discs or masks 60, forming a continuous coating, after which the assembly is annealed in the usual manner.
Barrier layer liquid is then applied to the annealed selenium surface to form a continuous coating. Thereafter a grid 65 having a series of cross bars bounding openings 66, defining the location and area of the counter-electrode layer for the respective individual rectifier elements, is placed on the treated surface of the plate and counter-electrode material applied to each surface within the zones of the openings of the grid, thereby forming a series of spaced layers of counter-electrode material which are greater in area than the discs aforesaid,
The grid 65 is then removed and the coated base plate may be fed through a shear which cuts the same into strips along and centrally of the parallel margins 6'! from which counter-electrode material has been masked by the cross bars bounding the openings 66 as aforesaid, or the base plate may be fed through a combined punch and shear which severs the individual rectifiers 10 along the center line of the cross bar masked margins 61 and simultaneously punches apertures 68 through masking discs 60 and plate 40. The punching operation leaves an annular insulation disc 69 around the aperture, between the coatings and the base, and prevents contact of rough edges of such coatings, particularly the counterelectrode material, with the base plate at the aperture; since the counter-electrode in no event extends up to the severing line, no problem of short-circuiting can exist at the external peripheral edges of the severed individual rectifier elements. The completed rectifiers may then be electroformed, and assembled on a rod in the usual manner.
The described method and apparatus provide a rectifier in which the semi-conductor and counter-electrode are in contact throughout their areas, but separated from the base at the zone of the insulator disc.
While a specific embodiment of the invention has been shown and described in detail to illustrate the application of the principles thereof, it will be understood that such embodiment is exemplary only and that the invention may be otherwise embodied without departing from such principles.
I claim:
1. A method of manufacturing a plurality of selenium or the like rectifiers each of which incorporates as a base a section from a metal plate which is later sub-divided, comprising applying discs of insulating material to the surface of the plate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over the barrier layer in laterally spaced layers, each of which is superimposed over and is greater in area than the insulating disc, severing the thus treated plate in the spaces between the counter-electrode layers to form individual rectifier sections, and piercing the individual sections at their centers to provide an insulating ring on the base, bounding a formed aperture.
2. A method of manufacturing a plurality of selenium or the like rectifiers eachof which incorporates as a base a section from a metal plate which is later subdivided, comprising adheringly applying discs of insulating materialto the surface of the plate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over the barrier layer in laterally spaced layers, each of which is superimposed over ,and is greater in area than the adhering insulating disc, severing the thus treated plate in the spaces between the counter-electrode layers to form individual rectifier sections,,and piercing the individual sections at their centers to provide an insulating ring on the base, bounding a formed aperture.
3. A method of manufacturing a plurality of selenium ,or the like rectifiers each of which incorporates as a base a section from a metal plate which is later subdivided, comprisin adheringly applying discs of insulating material to the sur-- face of the,p1ate in the zone of the center of each section, applying to such one surface a continuous coating of semi-conductive material, applying a continuous barrier layer to the coating, applying a counter-electrode material over. the barrier layer in laterally spaced layers, each of which is superimposed over and is greater in area than the adhering insulating disc, severing the .thus
' treated plate in the spaces between the counterplate in the zone of the center of each section,
applying to such one surfacea continuous coating of semi-conductive material, applyin a ntin.. uous barrier layer to the coating, mounting over the barrier layer a masking grid having openings delineating ,the areas of the counter-electrode for the individual sections, applyin a coating of a counter-electrode material over the barrier layer within the grid openings,,removing the grid, severing the individual rectifier sections along the zones masked by the grid, and piercing the sections at their centers to provide aninsulating ring on the base around the formed aperture.
5. a. method of manufacturing a plurality of selenium or the like rectifiers each of which incorporates as a base a section from a metal plate which is later subdivided, comprisin applying discs of insulating material to the surfaceoi the plate in the zone of the center 01' each section. applying to such one surface a continuous coating'Of semi-conductive material, applying a continuous barrier layer to the coating, mounting on the barrier layer a masking grid having openings delineating the areas of the counter-electrode for the individual sections, ,applying a coating of counter-electrode material over the barrier layer within the grid openings, removin the grid, severing the individual rectifier sections along the zones masked by the grid, and simultaneously with such severing piercing the sections at their centers toprovide an insulating ring on the base around the formed aperture.
GERALD 'I'UMULO.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS 2,446,473 Skihker July 6, 1948
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54231A US2543678A (en) | 1948-10-13 | 1948-10-13 | Method of producing rectifier elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54231A US2543678A (en) | 1948-10-13 | 1948-10-13 | Method of producing rectifier elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2543678A true US2543678A (en) | 1951-02-27 |
Family
ID=21989639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US54231A Expired - Lifetime US2543678A (en) | 1948-10-13 | 1948-10-13 | Method of producing rectifier elements |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2543678A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2933661A (en) * | 1953-08-05 | 1960-04-19 | Fansteel Metallurgical Corp | Rectifier and method of making same |
| US3170218A (en) * | 1961-10-31 | 1965-02-23 | Siemens Ag | Method of producing tablets of semiconductor material, particularly selenium |
| DE1208822B (en) * | 1961-10-31 | 1966-01-13 | Siemens Ag | Process for the production of selenium rectifier tablets with an active area which is small in relation to their total area |
| US4279682A (en) * | 1978-11-02 | 1981-07-21 | Sumitomo Metal Mining Company Limited | Apparatus for securing tape to leads of semiconductor lead frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2033736A (en) * | 1932-12-30 | 1936-03-10 | Scholl Mfg Co Inc | Machine for making corn plasters |
| US2296575A (en) * | 1940-10-24 | 1942-09-22 | Union Switch & Signal Co | Manufacture of alternating current rectifiers |
| US2320092A (en) * | 1940-10-23 | 1943-05-25 | Scholl Mfg Co Inc | Machine for making adhesive pads |
| US2444473A (en) * | 1943-10-26 | 1948-07-06 | Standard Telephones Cables Ltd | Method of making rectifiers |
-
1948
- 1948-10-13 US US54231A patent/US2543678A/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2033736A (en) * | 1932-12-30 | 1936-03-10 | Scholl Mfg Co Inc | Machine for making corn plasters |
| US2320092A (en) * | 1940-10-23 | 1943-05-25 | Scholl Mfg Co Inc | Machine for making adhesive pads |
| US2296575A (en) * | 1940-10-24 | 1942-09-22 | Union Switch & Signal Co | Manufacture of alternating current rectifiers |
| US2444473A (en) * | 1943-10-26 | 1948-07-06 | Standard Telephones Cables Ltd | Method of making rectifiers |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2933661A (en) * | 1953-08-05 | 1960-04-19 | Fansteel Metallurgical Corp | Rectifier and method of making same |
| US3170218A (en) * | 1961-10-31 | 1965-02-23 | Siemens Ag | Method of producing tablets of semiconductor material, particularly selenium |
| DE1208822B (en) * | 1961-10-31 | 1966-01-13 | Siemens Ag | Process for the production of selenium rectifier tablets with an active area which is small in relation to their total area |
| DE1209210B (en) * | 1961-10-31 | 1966-01-20 | Siemens Ag | Process for the production of selenium rectifier tablets with an active area which is small in relation to their total area |
| US4279682A (en) * | 1978-11-02 | 1981-07-21 | Sumitomo Metal Mining Company Limited | Apparatus for securing tape to leads of semiconductor lead frame |
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