US20240426562A1

US20240426562A1 - Thermal management module

Info

Publication number: US20240426562A1
Application number: US18/641,387
Authority: US
Inventors: Evangelos Papoulis; Chao Zhang; Nicos Agathocleous; Amey Sawant; Kenneth Belford; Robert Sorensen
Original assignee: Hanon Systems Corp
Current assignee: Hanon Systems Corp
Priority date: 2023-06-22
Filing date: 2024-04-21
Publication date: 2024-12-26
Also published as: WO2024262864A1

Abstract

A thermal management module comprising a heat exchanger and an expansion valve assembly is disclosed. The heat exchanger includes a plurality of first plates and a plurality of second plates disposed between two end plates. The first and second plates are alternatingly arranged in a stacked relationship. A divider plate is disposed between one of the first plates and an adjacent one of the second plates to divide the heat exchanger into a first portion (e.g., internal heat exchanger) and a second portion (e.g., chiller). When in the stacked relationship, the plates define at least a first flow path for a relatively high-pressure, high-temperature first fluid from a first circuit (e.g., a liquid refrigerant), a second flow path for a relatively low-pressure, low-temperature first fluid from the first circuit (e.g., liquid refrigerant), and a third flow path for a second fluid from a second circuit (e.g., coolant).

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional Patent Application Ser. No. 63/509,713, filed Jun. 22, 2023, the entirety of which is herein incorporated by reference.

FIELD

The disclosure relates to a thermal management system, and more particularly to a thermal management module used in the thermal management system.

BACKGROUND

Conventional air-conditioning and thermal management systems include a heat exchanger, for example, a plate heat exchanger. Plate type heat exchangers consist of stacked plates in which a refrigerant and/or a coolant flows through intermediate spaces between adjacent plates, wherein the refrigerant flows from a first side of the plate heat exchanger to the opposite second side of the plate heat exchanger, while the coolant flows parallel to the refrigerant or in the opposite direction from the same end but opposite side or the opposite end to the first end of the plate heat exchanger. The length of the flow channels in the plate heat exchanger corresponds here essentially to the length of the plate heat exchanger from the first end to the second end. The outer dimensions of the plate heat exchanger and the position of the connections of the plate heat exchanger are therefore defining the length of the flow channels in the plate heat exchanger.
Typically, the air-conditioning and thermal management systems further include a compressor, a water-cooled condenser, chillers, internal heat exchanger, and an economizer. The pressure drop resulting from the separate components, particularly on a refrigerant side, limits the operating range of the compressor and affects the efficiency of the system. Additionally, these separate components take up useful space, in particular in a vehicle having an electric motor.
It is therefore desirable to provide a thermal management module for a thermal management system to reduce package space and cost, while avoiding pressure drop loss that can result from using multiple components.

SUMMARY

In concordance and agreement with the present disclosure, a thermal management module for a thermal management system to reduce package space and cost, while avoiding pressure drop loss that can result from using multiple components, has surprisingly been designed.
In one embodiment, a thermal management module, comprises: a heat exchanger in fluid communication with a first circuit having a first fluid therein and a second circuit having a second fluid therein, wherein the heat exchanger comprises: a plurality of first plates; a plurality of second plates, wherein the first plates and the second plates are alternatingly arranged in a stacked relationship; and a divider plate disposed between one of the first plates and an adjacent one of the second plates, wherein the plates cooperate to form at least a first flow path, a second flow path, and a third flow path for at least one of the fluids, and wherein the fluids are in thermal energy exchange relationship with one another.
In another embodiment, a method of managing thermal energy, comprises: providing a thermal management module comprising a heat exchanger in fluid communication with a first circuit and a second circuit, wherein the heat exchanger comprises: a plurality of first plates; a plurality of second plates, wherein the first plates and the second plates are alternatingly arranged in a stacked relationship; and a divider plate disposed between one of the first plates and an adjacent one of the second plates, wherein the plates cooperate to form at least a first flow path for receiving a first fluid from the first circuit, a second flow path for receiving the first fluid from the first circuit, and a third flow path for receiving a second fluid from the second circuit; supplying at least one of the first fluid from the first circuit and the second fluid from the second circuit to the heat exchanger; and exchanging thermal energy between the first fluid in the second flow path and at least one of the first fluid in the first flow path and the second fluid in the third flow path.
As aspects of some embodiments, the first flow path receives therein a relatively high-pressure, high-temperature first fluid from the first circuit.
As aspects of some embodiments, the second flow path receives therein a relatively low-pressure, low-temperature first fluid from the first circuit.
As aspects of some embodiments, the third flow path receives therein the second fluid from the second circuit.
As aspects of some embodiments, the divider plate divides the heat exchanger into a first portion and a second portion.
As aspects of some embodiments, the first portion is in fluid communication with the first circuit.
As aspects of some embodiments, the second portion is in fluid communication with the second circuit.
As aspects of some embodiments, the first portion is an internal heat exchanger.
As aspects of some embodiments, the second portion is a chiller.
As aspects of some embodiments, the first flow path is located entirely in the first portion of the heat exchanger.
As aspects of some embodiments, the second flow path is located in at least one of the first portion and the second portion of the heat exchanger.
As aspects of some embodiments, the third flow path is located entirely in the second portion of the heat exchanger.
As aspects of some embodiments, the thermal management module further comprises an expansion valve assembly fluidly connected to the heat exchanger, wherein the expansion valve assembly is in fluid communication with the first circuit.
As aspects of some embodiments, the expansion valve assembly is in fluid communication with at least one of the first flow path and the second flow path.
As aspects of some embodiments, the expansion valve assembly includes an expansion valve for changing a relatively high-pressure, high-temperature first fluid from the first circuit into a relatively low-pressure, low-temperature first fluid.
As aspects of some embodiments, the second flow path receives the relatively low-pressure, low-temperature first fluid from the expansion valve assembly.
As aspects of some embodiments, the relatively high-pressure, high-temperature first fluid from the first circuit is in thermal energy exchange relationship with the relatively low-pressure, low temperature first fluid from the expansion valve assembly.
As aspects of some embodiments, the relatively low-pressure, low temperature first fluid from the expansion valve assembly is in thermal energy exchange relationship with the second fluid from the second circuit.
As aspects of some embodiments, the thermal management module is integrated into a thermal management system of a vehicle, and wherein the thermal management system further includes at least one of a compressor and a condenser in the first circuit.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 is a perspective view of a thermal management module according to an embodiment of the present disclosure, wherein the thermal management module comprises a combination heat exchanger and an expansion valve assembly;

FIG. 2 is a perspective view of the combination heat exchanger of the thermal management module of FIG. 1 ;

FIG. 3 an exploded perspective view of the combination heat exchanger of the thermal management module of FIGS. 1 and 2 ;

FIG. 4 is an exploded perspective view of an A-B plate assembly of the combination heat exchanger of the thermal management module of FIGS. 1-3 ;

FIG. 5 are cross-sectional perspective views of the combination heat exchanger shown in FIG. 2 take along section lines transverse to inlet and outlet ports thereof, and schematically depicting a flow of a first fluid through a first flow path A and a second flow path B, and a flow of a second fluid through a third flow path C;

FIG. 6A is a perspective view of the thermal management module of FIG. 1 , schematically depicting the flow of the first fluid through the first flow path A and the second flow path B and the flow of the second fluid through the third flow path C;

FIG. 6B is a cross-sectional view of the thermal management module of FIG. 1 taken along section line 6B in FIG. 6A, schematically depicting the flow of the first fluid through the first flow path A and the second flow path B and the flow of the second fluid through the third flow path C;

FIG. 7 is a schematic flow diagram illustrating a thermal management system including a thermal management module according to an embodiment of the present disclosure;

FIG. 8 is a perspective view of a thermal management module according to another embodiment of the present disclosure, wherein the thermal management module comprises two combination heat exchangers and two expansion valve assemblies bundled together.

DETAILED DESCRIPTION

The following description of technology is merely exemplary in nature of the subject matter, manufacture and use of one or more disclosures, and is not intended to limit the scope, application, or uses of any specific disclosure claimed in this application or in such other applications as may be filed claiming priority to this application, or patents issuing therefrom. Regarding methods disclosed, the order of the steps presented is exemplary in nature, and thus, the order of the steps can be different in various embodiments. “A” and “an” as used herein indicate “at least one” of the item is present; a plurality of such items may be present, when possible. Except where otherwise expressly indicated, all numerical quantities in this description are to be understood as modified by the word “about” and all geometric and spatial descriptors are to be understood as modified by the word “substantially” in describing the broadest scope of the technology. “About” when applied to numerical values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by “about” and/or “substantially” is not otherwise understood in the art with this ordinary meaning, then “about” and/or “substantially” as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters.
All documents, including patents, patent applications, and scientific literature cited in this detailed description are incorporated herein by reference, unless otherwise expressly indicated. Where any conflict or ambiguity may exist between a document incorporated by reference and this detailed description, the present detailed description controls.
Although the open-ended term “comprising,” as a synonym of non-restrictive terms such as including, containing, or having, is used herein to describe and claim embodiments of the present technology, embodiments may alternatively be described using more limiting terms such as “consisting of” or “consisting essentially of.” Thus, for any given embodiment reciting materials, components, or process steps, the present technology also specifically includes embodiments consisting of, or consisting essentially of, such materials, components, or process steps excluding additional materials, components or processes (for consisting of) and excluding additional materials, components or processes affecting the significant properties of the embodiment (for consisting essentially of), even though such additional materials, components or processes are not explicitly recited in this application. For example, recitation of a composition or process reciting elements A, B and C specifically envisions embodiments consisting of, and consisting essentially of, A, B and C, excluding an element D that may be recited in the art, even though element D is not explicitly described as being excluded herein.
As referred to herein, all compositional percentages are by weight of the total composition, unless otherwise specified. Disclosures of ranges are, unless specified otherwise, inclusive of endpoints and include all distinct values and further divided ranges within the entire range. Thus, for example, a range of “from A to B” or “from about A to about B” is inclusive of A and of B. Disclosure of values and ranges of values for specific parameters (such as amounts, weight percentages, etc.) are not exclusive of other values and ranges of values useful herein. It is envisioned that two or more specific exemplified values for a given parameter may define endpoints for a range of values that may be claimed for the parameter. For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that Parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if Parameter X is exemplified herein to have values in the range of 1-10, or 2-9, or 3-8, it is also envisioned that Parameter X may have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, 3-9, and so on.
When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
FIGS. 1-6B illustrate a thermal management module 2 according to an embodiment of the present disclosure. The thermal management module 2 may be employed in various air-conditioning or thermal management systems, for example, the thermal management system 100, shown in FIG. 7 . The thermal management system 100 may comprise more or less components and devices than shown as necessary for operation. The thermal management system 100 may be employed in a vehicle (not depicted). The vehicle may be a hybrid vehicle or a pure electric vehicle, with a battery that is to be cooled by the thermal management system 100. It is understood, however, that the thermal management module 10 may be used in various applications including, but not limited to, commercial, industrial, automotive, and residential applications.
The thermal management module 2 comprises a combination heat exchanger 10 and an expansion valve assembly 11. The combination heat exchanger 10 is depicted as a plate heat exchanger, however, it is understood that the combination heat exchanger 10 may be other various types of heat exchangers if desired. The combination heat exchanger 10 may be in communication (e.g., fluid communication) with a first circuit 12 (shown in FIG. 7 ) for a first fluid (e.g., a refrigerant, coolant, etc.) and a second circuit 14 (shown in FIG. 7 ) for a second fluid (e.g. a refrigerant, a coolant, etc.). It should be appreciated that each of the fluids may have any desired pressure. For example, the first fluid may be a relatively high-pressure, high-temperature fluid upon entering the combination heat exchanger 10 and the second fluid may be a relatively low-pressure, low-temperature fluid upon entering the combination heat exchanger 10. The circuits 12, 14 may be part or components of the thermal management system 100, shown in FIG. 7 , for example.
The combination heat exchanger 10 being integrated into the first circuit 12 and the second circuit 14 permits thermal energy transfer between the first fluid and the second fluid. In some embodiments, the combination heat exchanger 10 may function as an internal heat exchanger and/or a chiller in at least one of the first and second circuits 12, 14 of the thermal management system 100. In preferred embodiments, the combination heat exchanger 10 permits the first fluid (e.g., liquid refrigerant) to be cooled by the first fluid (e.g., liquid refrigerant) and/or the first fluid (e.g., liquid refrigerant) to be cooled by the second fluid (e.g., coolant).
FIG. 2 illustrates the combination heat exchanger 10 without the expansion valve assembly 11. The combination heat exchanger 10 may be formed by a plurality of plates and one or more heat exchange elements, such as fins. In some instances, the combination heat exchanger 10 may be formed by a one or more different plate types, alternating between one plate type and another if desired. The plates may be disposed adjacent one another, with each plate directly abutting another. The formation of the plates and their openings create one or more flow paths through the combination heat exchanger 10, via the openings of each plate, creating fluid engagement between each plate in the combination heat exchanger.
In an exemplary embodiment, the combination heat exchanger 10 comprises a plurality of first plates 40 (i.e., A-plates) and a plurality of second plates 41 (i.e., B-plates) alternatingly arranged one adjacent to each other in a stacked relationship forming at least one A-B plate assembly 39 between opposing end plates 42, 44. It is understood that one or more of the end plates 42, 44 may be part of a housing of the combination heat exchanger 10 if desired. In a particular embodiment, the combination heat exchanger 10 includes fourteen (14) of the first plates 40 and fourteen (14) of the second plates 41 in stacked relationship between the end plates 42, 44. It is understood, however, that the combination heat exchanger 10 may include any number of the plates 40, 41 as desired.
Inlet ports 46, 48 and corresponding outlet ports 56, 58 for the first circuit 12 are formed in the end plate 42 and an inlet port 43 and a corresponding outlet port 53 for the second circuit 14 are formed in the end plate 44. In some embodiments, the inlet ports 43, 46, 48, and the outlet ports 53, 56, 58, are integrally formed with the associated one of the end plates 42, 44, yet in other embodiments they are formed as separate and distinct components that are coupled to the associated one of the end plates 42, 44. As more clearly shown in FIGS. 6B, the inlet port 48 and the outlet port 56 of the end plate 42 are fluidly connected to the expansion valve assembly 11 to permit the flow of the first fluid of the first circuit 12 therethrough.
FIGS. 3-5 show the first plates 40, the second plates 41, the end plates 42, 44, and a divider plate 45 of the combination heat exchanger 10 in accordance with an embodiment of the present disclosure. The divider plate 45 is disposed between one of the second plates 41 and an adjacent one of the first plates 40 to generally divide the combination heat exchanger 10 into separate first and second portions 50, 60, respectively. In some circumstances, the first portion 50 of the combination heat exchanger 10 may function as an internal heat exchanger and the second portion 60 thereof may function as a chiller. Each of the first and second plates 40, 41, each of the end plates 42, 44, and/or the divider plate 45 may be substantially elongate and rectangular. In some embodiments, each of the first and second plates 40, 41 and the divider plate 45 may have a thickness of about 0.48 mm and each of the end plates 42, 44 may have a thickness of about 2.0 mm. However, it is understood that the first and second plates 40, 41, the end plates 42, 44, and the divider plate 45 may have various shapes, sizes, thicknesses, and configurations as desired.
As best seen in FIGS. 5, 6A, and 6B, the plates 40, 41, 45 may be configured to define one or more first flow paths A (depicted schematically by arrows A) for the relatively high-pressure, high-temperature first fluid within the first portion 50 of the combination heat exchanger 10, a second flow path B (depicted schematically by arrows B) for the relatively low-pressure, low-temperature first fluid within the first and second portions 50, 60 of the combination heat exchanger 10, and a third flow path C (depicted schematically by arrows C) for the second fluid within the second portion 60 of the combination heat exchanger 10.
In preferred embodiments, the first plate 40 includes an inflow opening 64 and an outflow opening 66 formed therein and the second plate 41 includes an inflow opening 86 and an outflow opening 88 formed therein. The inflow openings 64, 86 located on a first side of the divider plate 45 may be fluidly connected to each other and the inlet port 46 and the outflow openings 66, 88 located on the same first side of the divider plate 45 may be fluidly connected to each other and the outlet port 56 to form the first flow path A for the relatively high-pressure, high-temperature first fluid of the first circuit 12 prior to entry into the expansion valve assembly 11. The inflow openings 64, 86 and the outflow openings 66, 88 may be diagonally, opposed being located in diagonally, opposite corners of the respective first and second plates 40, 41. Accordingly, the relatively high-pressure, high-temperature first fluid may flow from the inlet port 46, through the inflow openings 64, 86, and a substantial portion or an entirety of the first portion 50 of the combination heat exchanger 10 via the first flow path A, and through the outflow openings 66, 88, to the outlet port 56, thereby a distance from the inlet port 46 to the outlet port 56 that the relatively high-pressure, high-temperature first fluid has to travel may be maximized.
In the embodiment shown, each of the first plates 40 may further include one or more shaped sections 63 formed therein. Each of the shaped sections 63 surrounds a periphery of inflow and outflow openings 64, 66 formed in the first plate 40 and abuts a first surface 67 of the second plate 41 and/or the divider plate 45 to form the first flow path A and militate against leakage of the relatively high-pressure, high-temperature first fluid into the second and third flow paths B, C, respectively, and/or the second fluid into the first and second flow paths A, B, respectively.
In preferred embodiments, the first plate 40 further includes an inflow opening 72 and an outflow opening 74 formed therein and the second plate 41 further includes an inflow opening 90 and an outflow opening 92 formed therein. Additionally, the divider plate 45 includes an inflow opening 47 and an outflow opening 49 formed therein. The inflow openings 72, 90, 47 of the respective plates 40, 41, 45 may be fluidly connected to each other and the inlet port 48, and the outflow openings 74, 92, 49 thereof may be fluidly connected to each other and the outlet port 58 to form the second flow path B for the relatively low-pressure, low-temperature first fluid of the first circuit 12 after exit from the expansion valve assembly 11. In preferred embodiments, the inflow openings 72, 90, 47 and the outflow opening 74, 92, 49 may be diagonally, opposed being located in diagonally, opposite corners of the respective plates 40, 41, 45. Accordingly, the relatively low-pressure, low-temperature first fluid may flow from the inlet port 48, through the inflow openings 72, 90, 47 and a substantial portion or an entirety of the first and second portions 50, 60 of the combination heat exchanger 10 via the second flow path B, and through the outflow openings 74, 92, 49 to the outlet port 58, thereby a distance from the inlet port 48 to the outlet port 58 that the relatively low-pressure, low-temperature first fluid has to travel within the first and second portions 50, 60 of the combination heat exchanger 10 is maximized.
In the embodiment shown, each of the second plates 41 may further include one or more shaped section 93 formed therein and the divider plate 45 may further include one or more shaped sections 51 formed therein. Each of the shaped sections 93 surrounds a periphery of inflow and outflow openings 90, 92 formed in the second plate 41 and each of the shaped sections 51 surrounds a periphery of inflow and outflow openings 47, 49. The shaped sections 51, 93 abut a first surface 65 of the first plate 40, the divider plate 45, and/or the end plate 44 to form the second flow path B and militate against leakage of the relatively low-pressure, low-temperature first fluid into the first and third flow paths A, C, respectively, and the second fluid into the first and second flow paths A, B, respectively.
In preferred embodiments, the inflow openings 64, 86 located on an opposite second side of the divider plate 45 may be fluidly connected to each other and the inlet port 43 of the end plate 44 and the outflow openings 66, 88 located on the same second side of the divider plate 45 may be fluidly connected to each other and the outlet port 53 of the end plate 44 to form the third flow path C for the second fluid of the second circuit 14. As discussed hereinabove, the inflow openings 64, 86 and the outflow openings 66, 88 may be diagonally, opposed being located in diagonally, opposite corners of the respective first and second plates 40, 41. Accordingly, the second fluid may flow from the inlet port 43, through the inflow openings 64, 86, and a substantial portion or an entirety of the second portion 60 of the combination heat exchanger 10 via the third flow path C, and through the outflow openings 66, 88, to the outlet port 53, thereby a distance from the inlet port 43 to the outlet port 53 that the second fluid has to travel may be maximized.
In the embodiment shown, each of the shaped sections 63 surrounds a periphery of inflow and outflow openings 64, 66 formed in the first plate 40 and abuts a first surface 67 of the second plate 41 and/or the end plate 44 to form the third flow path C and militate against leakage of the second fluid into the first and second flow paths A, B, respectively, and/or the first fluid into the second and third flow paths B, C, respectively.
As best shown in FIGS. 5 and 6B, the first flow path A, the second flow path B, and third flow path C are formed alternately between the plates 40, 41, the end plates 42, 44, and/or the divider plate 45. Particularly, the first flow path A and the second flow path B are formed alternately between the plates 40, 41 in the first portion 50 of the combination heat exchanger 10 and the second flow path B and the third flow path C are formed alternately between the plates 40, 41 in the second portion 60 of the combination heat exchanger 10.
It is understood that each of the inflow openings 47, 64, 72, 86, 90, the outflow openings 49, 66, 74, 88, 92, the inlet ports 43, 46, 48, and the outlet ports 53, 56, 58 may be located elsewhere in the associated plates 40, 41, 42, 44, 45 to achieve a desired thermal energy exchange between the relatively high-pressure, high-temperature first fluid, the relatively low-pressure, low-temperature first fluid, and/or the second fluid.
At least one thermal energy transfer device (e.g., fins) may be disposed in at least a portion of at least one of the first flow path A, the second flow path B, and the third flow path C, to enhance and improve a rate of thermal energy transfer between the first fluid and the second fluid within the combination heat exchanger 10. For example, the combination heat exchanger 10 may include one or more thermal energy transfer devices disposed between the first and second plates 40, 41 in the first portion 50 and/or the second portion 60 thereof. The thermal energy transfer devices may include one or more openings formed therein to accommodate the shaped sections 51, 63, 93 of the respective plates 45, 40, 41.
As shown more clearly in FIGS. 6A and 6B, the expansion valve assembly 8 includes at least one expansion valve 98 provided in a passage way formed in a manifold block 99. The manifold block 99 may be affixed to the end plate 42 in any manner appropriate. The passageway of the expansion valve assembly 8 fluidly connects the outlet port 56 and the inlet port 48 of the end plate 42. The passageway facilities a flow of the relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant) through the at least one expansion valve 98, which causes an expansion thereof and results in a relatively low-pressure, low-temperature first fluid (e.g., a liquid refrigerant). The expansion valve 98 may take any form, which is deemed appropriate to achieve its functionality.
During operation, in accordance with the thermal management system 100 depicted in FIG. 7 , the relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant) flows from the condenser into the first flow path A of the thermal management module 2 and exchanges thermal energy with the relatively low-pressure, low-temperature first fluid (e.g., liquid refrigerant) in the second flow path B from the expansion valve assembly 11. Then, relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant) cooled by the relatively low-pressure, low-temperature first fluid from the expansion valve assembly 11, flows through the expansion valve 98, where it is turned into the relatively low-pressure, low-temperature first fluid (e.g., liquid refrigerant). The relatively low-pressure, low-temperature first fluid (e.g., liquid refrigerant) from the expansion valve assembly 11 is then diverted into the second flow path B located in either the first portion 50 (e.g., internal heat exchanger) and/or the second portion 60 (e.g., chiller) of the combination heat exchanger 10.
In the first portion 50 of the combination heat exchanger 10, the relatively low-pressure, low-temperature first fluid (e.g., liquid refrigerant) flowing through the second flow path B exchanges thermal energy with the relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant) from the condenser flowing through the first flow path A. Additionally, in the second portion 60 of the combination heat exchanger 10, the relatively low-pressure, low-temperature first fluid (e.g., liquid refrigerant) flowing through the second flow path B exchanges thermal energy with the second fluid (e.g., coolant) from the second circuit 14 flowing through the third flow path C, to be further cooled. The first fluid in the second flow path B then exits both the first and second portions 50, 60 of the combination heat exchanger 10 and flows from the thermal management module 2 to the compressor, where it is compressed into a relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant). It is understood that the first fluid flowing through the second flow path B in the second portion 60 may combine with the first fluid flowing through the second flow path B in the first portion 50 prior to exiting the combination heat exchanger 10. The relatively high-pressure, high-temperature first fluid (e.g., a liquid refrigerant) exits the compressor and then flows to the condenser, where it is cooled, turning it back into the relatively high-pressure, high-temperature first fluid (e.g., liquid refrigerant) received into the thermal management module 2.
Additionally, the second fluid (e.g., coolant) of the second circuit 14 flows into the inlet port 43, through the associated third flow paths C defined by the plates 40, 41 in the second portion 60 of the combination heat exchanger 10, where an exchange of thermal energy occurs between the relatively low-pressure, low-temperature first fluid and the second fluid, and then flows from the outlet port 53 back into the second circuit 14.
The flow of the first fluid through the first circuit 12 and the flow of the second fluid through the second circuit 14 continues and results in minimum pressure drop of the first fluid due to the condensed and integrated nature of the components, in particular the thermal management module 2.
It should be appreciated that the flow configuration of the fluids through the thermal management module 2 is not restricted to the present embodiment, and may consist of any flow configuration as desired.
Performance of the combination heat exchanger 10 of the thermal management module 2 may be optimized in various ways. For example, the combination heat exchanger 10 may be optimized by adjusting locations of at least one of the inlet ports 43, 46, 48; at least one of the outlet ports 53, 56, 58; at least one of the inlet openings 47, 64, 72, 86, 90; and/or at least one of the outlet openings 49, 66, 74, 88, 92; by providing different flow resistance (i.e., more of less thermal energy transfer devices disposed in the flow paths A, B, C); and/or by varying a cross-sectional flow area of at least one of the flow paths A, B, C.
FIG. 8 illustrates a thermal management module 2′ comprising two combination heat exchangers 10′ and two expansion valve assemblies 11′ bundled together in accordance with another embodiment of the present disclosure. The structure and operation of the thermal management module 2′ is the same or substantially similar to that of the thermal management module 2, shown in FIGS. 1-7 , and, for simplicity, are not repeated herein.
Example embodiments are provided so that this disclosure will be thorough, and willfully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Equivalent changes, modifications and variations of some embodiments, materials, compositions and methods can be made within the scope of the present technology, with substantially similar results.

Claims

What is claimed is:

1. A thermal management module, comprising:

a heat exchanger in fluid communication with a first circuit having a first fluid therein and a second circuit having a second fluid therein, wherein the heat exchanger comprises:

a plurality of first plates;

a plurality of second plates, wherein the first plates and the second plates are alternatingly arranged in a stacked relationship; and

a divider plate disposed between one of the first plates and an adjacent one of the second plates, wherein the plates cooperate to form at least a first flow path, a second flow path, and a third flow path for at least one of the fluids, and wherein the fluids are in thermal energy exchange relationship with one another.

2. The thermal management module of claim 1, wherein the first flow path receives therein a relatively high-pressure, high-temperature first fluid from the first circuit.

3. The thermal management module of claim 1, wherein the second flow path receives therein a relatively low-pressure, low-temperature first fluid from the first circuit.

4. The thermal management module of claim 1, wherein the third flow path receives therein the second fluid from the second circuit.

5. The thermal management module of claim 1, wherein the divider plate divides the heat exchanger into a first portion and a second portion.

6. The thermal management module of claim 5, wherein the first portion is in fluid communication with the first circuit.

7. The thermal management module of claim 5, wherein the second portion is in fluid communication with the second circuit.

8. The thermal management module of claim 5, wherein the first portion is an internal heat exchanger.

9. The thermal management module of claim 5, wherein the second portion is a chiller.

10. The thermal management module of claim 5, wherein the first flow path is located entirely in the first portion of the heat exchanger.

11. The thermal management module of claim 5, wherein the second flow path is located in at least one of the first portion and the second portion of the heat exchanger.

12. The thermal management module of claim 5, wherein the third flow path is located entirely in the second portion of the heat exchanger.

13. A thermal management module of claim 1, further comprising an expansion valve assembly fluidly connected to the heat exchanger, wherein the expansion valve assembly is in fluid communication with the first circuit.

14. The thermal management module of claim 13, wherein the expansion valve assembly is in fluid communication with at least one of the first flow path and the second flow path.

15. The thermal management module of claim 13, wherein the expansion valve assembly includes an expansion valve for changing a relatively high-pressure, high-temperature first fluid from the first circuit into a relatively low-pressure, low-temperature first fluid.

16. The thermal management module of claim 15, wherein the second flow path receives the relatively low-pressure, low-temperature first fluid from the expansion valve assembly.

17. The thermal management module of claim 15, wherein the relatively high-pressure, high-temperature first fluid from the first circuit is in thermal energy exchange relationship with the relatively low-pressure, low temperature first fluid from the expansion valve assembly.

18. The thermal management module of claim 15, wherein the relatively low-pressure, low temperature first fluid from the expansion valve assembly is in thermal energy exchange relationship with the second fluid from the second circuit.

19. A thermal management module of claim 1, wherein the thermal management module is integrated into a thermal management system of a vehicle, and wherein the thermal management system further includes at least one of a compressor and a condenser in the first circuit.

20. A method of managing thermal energy, comprising:

providing a thermal management module comprising a heat exchanger in fluid communication with a first circuit and a second circuit, wherein the heat exchanger comprises:

a plurality of first plates;

a divider plate disposed between one of the first plates and an adjacent one of the second plates, wherein the plates cooperate to form at least a first flow path for receiving a first fluid from the first circuit, a second flow path for receiving the first fluid from the first circuit, and a third flow path for receiving a second fluid from the second circuit;

supplying at least one of the first fluid from the first circuit and the second fluid from the second circuit to the heat exchanger; and

exchanging thermal energy between the first fluid in the second flow path and at least one of the first fluid in the first flow path and the second fluid in the third flow path.