US20190361506A1 - Expansion module system - Google Patents
Expansion module system Download PDFInfo
- Publication number
- US20190361506A1 US20190361506A1 US15/987,752 US201815987752A US2019361506A1 US 20190361506 A1 US20190361506 A1 US 20190361506A1 US 201815987752 A US201815987752 A US 201815987752A US 2019361506 A1 US2019361506 A1 US 2019361506A1
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- United States
- Prior art keywords
- expansion module
- board
- expansion
- shared
- modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/732—Printed circuits being in the same plane
Definitions
- the present disclosure relates generally to information handling systems, and more particularly to connecting expansion module(s) to information handling systems.
- An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information.
- information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated.
- the variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications.
- information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- M.2 expansion cards and/or other expansion modules known in the art.
- the M.2 specification which was formerly known as the Next Generation Form Factor (NGFF), defines internally mounted expansion cards and their associated connectors, and was provided to replace the mini Serially Advanced Technology Attachment (mSATA) standard that utilized the Peripheral Component Interconnect express (PCIe) mini card physical card layout and connectors.
- NGFF Next Generation Form Factor
- mSATA Serially Advanced Technology Attachment
- PCIe Peripheral Component Interconnect express
- the M.2 specification is flexible, allowing different M.2 module widths and lengths and providing relatively advanced interfacing features that provide particular benefits in small computing devices such as ultrabooks (i.e., relatively small laptop/notebook computing devices), tablet devices, and/or other computing devices known in the art.
- the M.2 specification raises some issues with the mounting, power delivery, and data transmission ability of M.2 modules in computing devices.
- M.2 modules are typically coupled to a board in the computing devices via an M.2 connector and a coupling feature on the board. That coupling feature is conventionally provided by a hole defined in the board, and a standoff mounted to the board immediately adjacent the hole.
- a first end of the M.2 module may be coupled to the M.2 connector, and a second end of the M.2 module that is opposite the first end is then supported by the standoff, with a screw or other coupling device provided in the standoff and/or hole and engaged with the M.2 module to secure the M.2 module on the board and in the M.2 connector.
- a respective hole and standoff is provided on that board in order to secure that M.2 module on the board and to its M.2 connector, which utilizes board space for holes and standoff mounting locations that could otherwise provide traces in the board and/or mounting locations for other components on the board, and generally provides for inefficient M.2 module placement on the board.
- M.2 module and the board are also limited by the bandwidth of the M.2 module/M.2 connector connections (i.e., power delivery is limited by the power bandwidth of the power connection between the M.2 module and the M.2 connector, and data transmission is limited by the data bandwidth of the data connection between the M.2 module and the M.2 connector.)
- an Information Handling System includes a board; a plurality of expansion modules connectors mounted to the board; and a shared expansion module coupling feature provided on the board and including a coupling member that is configured to engage each of a plurality of expansion modules when those expansion modules are each connected to a respective one of the plurality of expansion module connectors.
- FIG. 1 is a schematic view illustrating an embodiment of an information handling system.
- FIG. 2A is a top schematic view illustrating an embodiment of an expansion module.
- FIG. 2B is a side schematic view illustrating an embodiment of the expansion module of FIG. 2A .
- FIG. 3 is a top schematic view illustrating an embodiment of a conventional board including a conventional expansion module connector and a conventional expansion module coupling feature.
- FIG. 4 is a top schematic view illustrating an embodiment of conventional expansion modules coupled to a conventional board with conventional expansion module connectors and conventional expansion module coupling features.
- FIG. 5A is a top schematic view illustrating an embodiment of a board including expansion module connectors and a shared expansion module coupling feature of the present disclosure.
- FIG. 5B is a side schematic view illustrating an embodiment of the board of FIG. 5A including the expansion module connectors and the shared expansion module coupling feature of the present disclosure.
- FIG. 6 is a side schematic view illustrating an embodiment of a board having a board supplemental power delivery/data transmission subsystem.
- FIG. 7 is a side schematic view illustrating an embodiment of the expansion module of FIG. 2A having a module supplemental power delivery/data transmission system.
- FIG. 8 is a flow chart illustrating an embodiment of a method for mounting expansion modules to a board.
- FIG. 9A is a top schematic view illustrating an embodiment of the board of FIGS. 5A and 5B with expansion cards of FIG. 2A coupled to respective expansion module connectors and secured using the shared expansion module coupling feature.
- FIG. 9B is a side schematic view illustrating an embodiment of the board of FIGS. 5A and 5B with expansion cards of FIG. 2A coupled to respective expansion module connectors and secured using the shared expansion module coupling feature.
- FIG. 10 is a flow chart illustrating an embodiment of a method for providing supplemental power/data to expansion modules on a board.
- FIG. 11 is a side schematic view illustrating an embodiment of a conventional expansion module coupled to the board of FIG. 6 having the board supplemental power delivery/data transmission subsystem.
- FIG. 12 is a side schematic view illustrating an embodiment of the expansion module of FIG. 7 coupled to the board of FIG. 6 having the board supplemental power delivery/data transmission subsystem.
- an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, calculate, determine, classify, process, transmit, receive, retrieve, originate, switch, store, display, communicate, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, or other purposes.
- an information handling system may be a personal computer (e.g., desktop or laptop), tablet computer, mobile device (e.g., personal digital assistant (PDA) or smart phone), server (e.g., blade server or rack server), a network storage device, or any other suitable device and may vary in size, shape, performance, functionality, and price.
- the information handling system may include random access memory (RAM), one or more processing resources such as a central processing unit (CPU) or hardware or software control logic, ROM, and/or other types of nonvolatile memory. Additional components of the information handling system may include one or more disk drives, one or more network ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, touchscreen and/or a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components.
- RAM random access memory
- processing resources such as a central processing unit (CPU) or hardware or software control logic
- ROM read-only memory
- Additional components of the information handling system may include one or more disk drives, one or more network ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, touchscreen and/or a video display.
- I/O input and output
- the information handling system may also include one or more buses operable to transmit communications between the various
- IHS 100 includes a processor 102 , which is connected to a bus 104 .
- Bus 104 serves as a connection between processor 102 and other components of IHS 100 .
- An input device 106 is coupled to processor 102 to provide input to processor 102 .
- Examples of input devices may include keyboards, touchscreens, pointing devices such as mouses, trackballs, and trackpads, and/or a variety of other input devices known in the art.
- Programs and data are stored on a mass storage device 108 , which is coupled to processor 102 . Examples of mass storage devices may include hard discs, optical disks, magneto-optical discs, solid-state storage devices, and/or a variety other mass storage devices known in the art.
- IHS 100 further includes a display 110 , which is coupled to processor 102 by a video controller 112 .
- a system memory 114 is coupled to processor 102 to provide the processor with fast storage to facilitate execution of computer programs by processor 102 .
- Examples of system memory may include random access memory (RAM) devices such as dynamic RAM (DRAM), synchronous DRAM (SDRAM), solid state memory devices, and/or a variety of other memory devices known in the art.
- RAM random access memory
- DRAM dynamic RAM
- SDRAM synchronous DRAM
- solid state memory devices solid state memory devices
- a chassis 116 houses some or all of the components of IHS 100 . It should be understood that other buses and intermediate circuits can be deployed between the components described above and processor 102 to facilitate interconnection between the components and the processor 102 .
- the expansion module 200 is an M.2 expansion card provided according to the M.2 specification, although other expansion cards and/or modules may benefit from the teachings of the present disclosure and thus will fall within its scope as well.
- the expansion module 200 includes an expansion board 202 having a top surface 202 a , a bottom surface 202 b located opposite the expansion board 202 from the top surface 202 a , a front edge 202 c extending between the top surface 202 a and the bottom surface 202 b , a rear edge 202 d extending between the top surface 202 a and the bottom surface 202 b and located opposite the board 202 from the front edge 202 c , and a pair of opposing side edges 202 e and 202 f extending between the top surface 202 a , the bottom surface 202 b , the front edge 202 c , and the rear edge 202 d , and located opposite the board 202 from each other.
- a connector edge 206 is included on the board 202 immediately adjacent the front edge 202 c , and includes a plurality of connector pads 206 a , 206 b , and 206 c .
- the connector pads 206 a and 206 b may provide an “M key” edge connector
- the connector pads 206 b and 206 c may provide a “B key” edge connector
- the connector pads 206 a , 206 b , and 206 c may provide a “B & M key” edge connector.
- An expansion device 208 is mounted to the expansion board 202 , and includes a power coupling 210 to power connector pad(s) on the connector edge 206 , and a ground coupling 212 to a ground connector pad 214 that is included in the board 202 adjacent he bottom surface 202 b .
- the board 202 defines an expansion module securing feature 216 that extends into the board 202 from the rear surface 202 d , although one of skill in the art in possession of the present disclosure will recognize that other securing features provided according to the teachings of the present disclosure may fall within its scope as well.
- the board 300 is a motherboard, although other board may benefit from the teachings of the present disclosure and thus will fall within its scope as well.
- the board 300 includes a top surface 300 a , a front edge 300 b , a rear edge 300 c located opposite the board 202 from the front edge 300 b , and a pair of opposing side edges 300 d and 300 e extending between the top surface 300 a , the front edge 300 b , and the rear edge 300 c , and located opposite the board 300 from each other.
- a conventional expansion module connector 302 is mounted to the board 300 adjacent the front edge 300 a , defines an expansion module connector slot 302 a , and includes a plurality of connector pads 304 a , 304 b , and 304 c .
- the connector pads 304 a and 304 b may provide a socket for an “M key” edge connector
- the connector pads 206 b and 206 c may provide a socket for a “B key” edge connector
- the connector pads 206 a , 206 b , and 206 c may provide a socket for a “B & M key” edge connector.
- the board 300 includes a conventional expansion module coupling feature 306 that includes a hole 306 a that is defined by the board 300 and that extends into (and in many cases, through) the board 300 , and a standoff 306 b that is mounted to the board 300 adjacent the hole 306 a.
- a board 400 includes conventional expansion module connectors 302 with respective conventional expansion module coupling features (e.g., not illustrated, but substantially similar to the conventional expansion module coupling feature 306 discussed above with reference to FIG.
- the board 400 also includes a device 402 (e.g., a processing system, memory system, and/or other computing device component known in the art) and connectors 404 that are mounted to the board 400 , any or all of which may be coupled to the connectors 302 through the board 400 (e.g., via traces in the board 400 .)
- a respective conventional expansion module 200 is connected to each conventional expansion module connector 302 (e.g., via the positioning of the connector edge 206 on each conventional expansion module 200 in the expansion module connector slot 302 a on its respective conventional expansion module connector 302 ), and secured to that conventional expansion module connector 302 and the board 400 via a coupling member 406 (e.g., a screw in the illustrated embodiment) that engages the standoff 306 b and the hole 306 a (e.g., threads defined by the standoff 306 b and the hole 306 a ) provided by the conventional expansion module coupling feature 306 .
- a coupling member 406 e.g., a screw
- a conventional expansion module coupling feature 306 is provided for each of the conventional expansion module connectors 302 , and the inventors of the present disclosure have found that doing so provides for inefficient expansion module placement on the board 400 , as well as uses up area on the board 400 (e.g., for defining the hole 306 a and mounting the standoff 206 b ) that could otherwise be used for other board or computing device components.
- the board 500 includes expansion module connectors 302 that each define the expansion module connector slots 302 a discussed above with reference to FIG. 3 . While not illustrated, each of the expansion module connectors 302 may include the plurality of connector pads 304 a , 304 b , and 304 c as well.
- the board 500 also includes a device 502 (e.g., a processing system, memory system, and/or other computing device component known in the art) and connectors 504 and 506 that are mounted to the board 500 , any or all of which may be coupled to the connectors 502 through the board 500 (e.g., via traces in the board 500 .)
- the expansion module connectors 302 are oriented on the board 500 such that their expansion module connector slots 302 a face each other (i.e., a first expansion module connector slot 302 a defined by a first expansion module connector 302 faces a second expansion module connector slot 302 a defined by a second expansion module connector 302 .)
- a shared expansion module coupling feature 508 is provided on the board 500 and between the expansion module connectors 302 , and includes a hole 508 a that is defined by the board 500 and that extends through the board 500 , and a standoff 508 b that is mounted to the board 500 adjacent the hole 508 a .
- the standoff 508 b defines a threaded hole that is substantially coaxial with the hole 508 a .
- the standoff 508 b is electrically coupled to ground connector pads 510 that may be grounded, as illustrated, using a variety of techniques known in the art.
- ground connector pads 510 may be grounded, as illustrated, using a variety of techniques known in the art.
- the shared expansion module coupling feature may utilize different components, and/or the orientation of the expansion module connectors may be modified, while remaining within the scope of the present disclosure.
- the board 600 includes similar features as the board 500 discussed above with reference to FIGS. 5A and 5B , and thus common element numbers are used to identify similar features.
- the supplemental power delivery/data transmission features are illustrated and discussed below as provided, at least in part, using the shared expansion module coupling feature 508 of the embodiment of FIGS. 5A and 5B , one of skill in the art in possession of the present disclosure will recognize that those supplemental power delivery/data transmission features may be provided in the board 300 (e.g., utilizing, at least in part, the expansion module coupling feature 306 of FIG. 3 ) while remaining within the scope of the present disclosure as well.
- a supplemental power delivery/data transmission coupling feature 602 is mounted to the board 600 opposite the board 600 from the shared expansion module coupling feature 508 .
- the supplemental power delivery/data transmission coupling feature 602 defines a threaded hole that is substantially coaxial with the hole 508 a defined by the board 600 .
- the supplemental power delivery/data transmission coupling feature 602 is connected to power delivery/data transmission lines 604 that are further connected to a power source/data communication subsystem 606 that may be provided by, for example, a power subsystem in a computing device that utilizes the teachings of the present disclosure (e.g., that delivers power to a processor and/or other components in the computing device), a data communication subsystem in a computing device that utilizes the teachings of the present disclosure (e.g., that provides for data communications from the processor or other components coupled to the processor), and/or a variety of other power sources and/or data transmission subsystems that would be apparent to one of skill in the art in possession of the present disclosure.
- a power subsystem in a computing device that utilizes the teachings of the present disclosure
- a data communication subsystem in a computing device that utilizes the teachings of the present disclosure (e.g., that provides for data communications from the processor or other components coupled to the processor)
- supplemental power delivery subsystems and the supplemental data transmission subsystems are discussed interchangeably herein, as those subsystems may be utilized to deliver power, transmit data, or both.
- power delivery lines and ground lines, data transmission lines and ground lines, and/or combinations thereof may be utilized to enable the supplemental power delivery/data transmission functionality of the present disclosure. While a specific power delivery/data transmission feature has been illustrated and described, one of skill in the art in possession of the present disclosure will recognize that power delivery/data transmission features according to the teachings of the present disclosure may vary while remaining within its scope as well.
- an embodiment of an expansion module 700 that may utilize the supplemental power delivery/data transmission features provided in the board 600 of FIG. 6 is illustrated.
- the expansion module 700 includes similar features as the expansion module 200 discussed above with reference to FIGS. 2A and 2B , and thus common element numbers are used to identify similar features.
- the expansion module 700 is also provided with a power delivery line 702 that is located adjacent the top surface 202 a of the expansion module 700 and that is connected to the expansion device 208 . While a specific power delivery/data transmission feature on the expansion module 700 has been illustrated and described, one of skill in the art in possession of the present disclosure will recognize that power delivery/data transmission features according to the teachings of the present disclosure may vary while remaining within its scope as well.
- FIG. 8 an embodiment of a method 800 for mounting expansion modules to a board is illustrated.
- the systems and methods of the present disclosure provide a shared expansion module coupling feature on a board for use in supporting and engaging a plurality of expansion modules that are coupled to expansion module connectors on the board, which allows for single hole in the board and/or a single standoff mounted to the board to support and secure the plurality of expansion modules.
- a pair of expansion modules connectors may be oriented on the board such that they face each other, with the shared expansion module coupling feature located between the pair of expansion module connectors, which allows a first expansion module and a second expansion module to be connected to respective ones of the pair of expansion module connectors, and a single coupling member to engage each of the first and second expansion modules, along with the shared expansion module coupling feature, to secure the first and second expansion modules to the board and in their respective expansion module connectors.
- a two expansion module enabled system may be provided using a single hole and/or single standoff mounted to the board, providing for more efficient positioning of the expansion modules on the board (i.e., using up less board space relative to conventional systems), and using less of the board that may then be utilized to route traces, mount components, and/or provide other board elements that would be apparent to one of skill in the art in possession of the present disclosure.
- the method 800 begins at block 802 where expansion modules are connected to respective expansion module connectors on a board.
- a respective expansion module 200 of FIGS. 2A and 2B may be connected to each of the expansion module connectors 302 on the board 500 of FIG. 5 .
- the connector edge 206 on a first expansion module 200 may be positioned adjacent a first expansion module connector slot 302 a on a first expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards the first expansion module connector 302 such that the connector edge 206 on the first expansion module 200 enters the first expansion module connector slot 302 a on the first expansion module connector 302 to engage the connector pads 206 a , 206 b , and 206 c with the connector pads 304 a , 304 b , and 304 c .
- the connector edge 206 on a second expansion module 200 may be positioned adjacent a second expansion module connector slot 302 a on a second expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards the second expansion module connector 302 such that the connector edge 206 on the second expansion module 200 enters the second expansion module connector slot 302 a on the second expansion module connector 302 to engage the connector pads 206 a , 206 b , and 206 c with the connector pads 304 a , 304 b , and 304 c.
- each respective expansion module 200 that was connected to each of the expansion module connectors 302 on the board 500 of FIG. 5 at block 802 is then engaged with the shared expansion module coupling feature 508 .
- the portion of the first expansion module 200 adjacent the expansion module securing feature 216 may be positioned adjacent the shared expansion module coupling feature 508 and in engagement with a portion of the standoff 508 b (e.g., rotated from the coupling angle used to connect to the expansion module connector 302 , towards the board 500 , and into engagement with the standoff 508 b , as is known in the art for some expansion module/expansion module connector connections).
- the portion of the second expansion module 200 adjacent the expansion module securing feature 216 may be positioned adjacent the shared expansion module coupling feature 508 and in engagement with a portion of the standoff 508 b (e.g., rotated from the coupling angle used to connect to the expansion module connector 302 , towards the board 500 , and into engagement with the standoff 508 b , as is known in the art for some expansion module/expansion module connector connections).
- each of the expansion modules 200 may be connected to respective expansion module connectors 302 , in engagement with the standoff 508 b on the shared expansion module coupling feature 508 , and oriented substantially parallel to the board 500 .
- the method 800 then proceeds to block 806 where the portion of each expansion module is engaged by a coupling member on the shared expansion module coupling feature to secure the expansion modules in the expansion module connectors.
- a coupling member 900 may be engaged with the shared expansion module coupling feature 508 and the portion of each of the expansion modules 200 that is located adjacent the shared expansion module coupling feature 508 .
- the coupling member 900 may be provided by a screw that may be threaded with threads provided in the standoff 508 b and/or the hole 508 a until a top portion of that screw engages the portions of the first expansion module and the second expansion module adjacent the shared expansion module coupling feature 508 to secure those portions of the first expansion module and the second expansion module between the standoff 508 b and the top portion of the screw, as illustrated in FIGS. 9A and 9B .
- a pair of M.2 card connectors may be oriented on the board such that they face each other, with the shared M.2 card coupling feature located between the pair of M.2 card connectors, which allows a first M.2 card and a second M.2 card to be connected to respective ones of the pair of M.2 card connectors, and a single coupling member to engage each of the first and second M.2 cards, along with the shared M.2 card coupling feature, to secure the first and second M.2 cards to the board and in their respective M.2 card connectors.
- a two M.2 card enabled system may be provided using a single hole and/or single standoff mounted to the board, providing for more efficient positioning of the M.2 cards on the board (i.e., using up less board space relative to conventional systems), and using less of the board that may then be utilized to route traces, mount components, and/or provide other board elements that would be apparent to one of skill in the art in possession of the present disclosure.
- a board with which the expansion module is utilized may include an expansion module coupling feature that includes a hole that extends through the board, and a standoff that is located adjacent the hole.
- a supplemental power delivery/data transmission feature may be mounted to the board adjacent the hole and opposite the board from the standoff, and electrically coupled to a power source or data communication subsystem.
- supplemental power delivery/data transmission may be enabled by utilizing an supplemental power delivery/data transmission coupling member that engages the expansion module (and a power delivery/data transmission line provided on the expansion module), along with the supplemental power delivery/data transmission feature, and without engaging the standoff.
- Engagement of the supplemental power delivery/data transmission coupling member with each of the power delivery/data transmission line on the expansion module and the supplemental power delivery/data transmission feature creates a power delivery/data transmission channel for providing the additional power/data between the expansion module and the power source or data communication subsystem.
- a conventional coupling member may be utilized to secure the expansion module via engagement of the expansion module and the standoff, without engaging the supplemental power delivery/data transmission feature.
- the method 1000 begins at block 1002 where an expansion module is connected to an expansion module connector on a board.
- the expansion module 200 of FIGS. 2A and 2B or the expansion module 700 of FIG. 7 may be connected to the expansion module connector 302 on the board 600 of FIG. 6 .
- the connector edge 206 on the expansion module 200 / 700 may be positioned adjacent the expansion module connector slot 302 a on the expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards the expansion module connector 302 such that the connector edge 206 on the expansion module 200 / 700 enters the expansion module connector slot 302 a on the expansion module connector 302 to engage the connector pads 206 a , 206 b , and 206 c with the connector pads 304 a , 304 b , and 304 c.
- the method 1000 then proceeds to block 1004 where the expansion module engages an expansion module coupling feature on the board.
- the expansion module 200 / 700 that was connected to the expansion module connector 302 on the board 600 of FIG. 6 at block 1002 is then engaged with the expansion module coupling feature 508 .
- the portion of the first expansion module 200 adjacent the expansion module securing feature 216 may be positioned adjacent the shared expansion module coupling feature 508 and in engagement with a portion of the standoff 508 b (e.g., rotated from the coupling angle used to connect to the expansion module connector 320 , towards the board 500 , and into engagement with the standoff 508 b , as is known in the art for some expansion module/expansion module connector connections).
- the method 1000 then proceeds to decision block 1006 where it is determined whether supplemental power delivery/data transmission is desired.
- a user may determine whether supplemental power delivery/data transmission is desired, and may configure the system accordingly.
- the user may select the conventional coupling member discussed below if the supplemental power delivery/data transmission is not desired, and may select the supplemental power delivery/data transmission coupling member discussed below if the supplemental power delivery/data transmission is desired.
- the user may select the expansion module 200 and couple that expansion module 200 to the board 500 at blocks 1002 and 1004 if the supplemental power delivery/data transmission is not desired, and may select the expansion module 700 and couple that expansion module 700 to the board 500 at blocks 1002 and 1004 if the supplemental power delivery/data transmission is not desired.
- a conventional coupling member engages the expansion module and a standoff on the expansion module coupling feature.
- a conventional coupling member 1100 may be engaged with the shared expansion module coupling feature 508 and the portion of the expansion module 200 that is located adjacent the shared expansion module coupling feature 508 .
- the conventional coupling member 1100 may be provided by a first sized screw that may be threaded with threads provided in the standoff 508 b (and in some cases, the hole 508 a ) until a top portion of that screw engages the portion of the expansion module 200 adjacent the shared expansion module coupling feature 508 to secure that portion of the expansion module 200 between the standoff 508 b and the top portion of the screw, as illustrated in FIG. 11 .
- the ground connector pad 214 in the expansion module 200 is connected to the ground connector pad 510 in the board 500 through the standoff 508 b in order to ground the expansion device 208 on the expansion module 200 .
- the expansion module 200 may only receive power and transmit data conventionally via the power delivery channels and data transmission channels in the expansion module connector 302 . It is noted that the conventional coupling member 1100 does not engage the supplemental power delivery/data transmission feature 602 .
- a supplemental power delivery/data transmission coupling member engages the expansion module and an supplemental power delivery/data transmission coupling feature.
- a supplemental power delivery/data transmission coupling member 1200 may be engaged with the supplemental power delivery/data transmission coupling feature 302 and the portion of the expansion module 700 that is located adjacent the shared expansion module coupling feature 508 .
- the supplemental power delivery/data transmission coupling member 1200 may be provided by a second sized screw (e.g., with a smaller diameter first sized screw utilized for the conventional coupling member 1100 in the example above) that may be threaded with threads provided in the supplemental power delivery/data transmission feature 602 until a top portion of that screw engages the portion of the expansion module 700 adjacent the shared expansion module coupling feature 508 to secure that portion of the expansion module 700 between the standoff 508 b and the top portion of the screw, as illustrated in FIG. 12 .
- a second sized screw e.g., with a smaller diameter first sized screw utilized for the conventional coupling member 1100 in the example above
- threads provided in the supplemental power delivery/data transmission feature 602 until a top portion of that screw engages the portion of the expansion module 700 adjacent the shared expansion module coupling feature 508 to secure that portion of the expansion module 700 between the standoff 508 b and the top portion of the screw, as illustrated in FIG. 12 .
- the ground connector pad 214 in the expansion module 200 is connected to the ground connector pad 510 in the board 600 through the standoff 508 b in order to ground the expansion device 208 on the expansion module 700 .
- the supplemental power delivery/data transmission coupling member 1200 engages the supplemental power delivery/data transmission feature 602 to couple the power delivery/data transmission line 702 in the expansion module 700 to the power source 606 via the power delivery/data transmission line 604 in the board 600 .
- the expansion module 700 may receive power and transmit data conventionally via the power delivery channels and data transmission channels in the expansion module connector 302 , and may receive additional power and/or transmit additional data between the device 208 and the power source/data communication subsystem 606 via the connection of the power delivery/data transmission line 702 in the expansion module 700 , the supplemental power delivery/data transmission coupling member 1200 , the supplemental power delivery/data transmission feature 602 , and the power delivery/data transmission line 604 in the board 600 . It is noted that the supplemental power delivery/data transmission coupling member 1200 does not engage the standoff 508 b (which is grounded as discussed above.)
- a board with which the M.2 card is utilized may include an M.2 card coupling feature that includes a hole that extends through the board, and a standoff that is located adjacent the hole.
- a supplemental power delivery/data transmission feature may be mounted to the board adjacent the hole and opposite the board from the standoff, and may be electrically coupled to a power source or data communication subsystem.
- supplemental power delivery/data transmission may be enabled by utilizing an supplemental power delivery/data transmission coupling member that engages the M.2 card (and a power delivery/data transmission line provided on the M.2 card), along with the supplemental power delivery/data transmission feature, and without engaging the standoff. Engagement of the supplemental power delivery/data transmission coupling member with each of the power delivery/data transmission line on the M.2 card and the supplemental power delivery/data transmission feature creates a power delivery/data transmission channel for providing the additional power/data between the M.2 card and the power source or data communication subsystem.
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Abstract
Description
- The present disclosure relates generally to information handling systems, and more particularly to connecting expansion module(s) to information handling systems.
- As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- Many information handling systems utilize expansion modules such as, for example, M.2 expansion cards and/or other expansion modules known in the art. The M.2 specification, which was formerly known as the Next Generation Form Factor (NGFF), defines internally mounted expansion cards and their associated connectors, and was provided to replace the mini Serially Advanced Technology Attachment (mSATA) standard that utilized the Peripheral Component Interconnect express (PCIe) mini card physical card layout and connectors. The M.2 specification is flexible, allowing different M.2 module widths and lengths and providing relatively advanced interfacing features that provide particular benefits in small computing devices such as ultrabooks (i.e., relatively small laptop/notebook computing devices), tablet devices, and/or other computing devices known in the art. However, the M.2 specification raises some issues with the mounting, power delivery, and data transmission ability of M.2 modules in computing devices.
- For example, M.2 modules are typically coupled to a board in the computing devices via an M.2 connector and a coupling feature on the board. That coupling feature is conventionally provided by a hole defined in the board, and a standoff mounted to the board immediately adjacent the hole. As such, a first end of the M.2 module may be coupled to the M.2 connector, and a second end of the M.2 module that is opposite the first end is then supported by the standoff, with a screw or other coupling device provided in the standoff and/or hole and engaged with the M.2 module to secure the M.2 module on the board and in the M.2 connector. Thus, for each M.2 module conventionally provided on the board, a respective hole and standoff is provided on that board in order to secure that M.2 module on the board and to its M.2 connector, which utilizes board space for holes and standoff mounting locations that could otherwise provide traces in the board and/or mounting locations for other components on the board, and generally provides for inefficient M.2 module placement on the board. Furthermore, the power delivery from the board to the M.2 module and data transmission between the M.2. module and the board are also limited by the bandwidth of the M.2 module/M.2 connector connections (i.e., power delivery is limited by the power bandwidth of the power connection between the M.2 module and the M.2 connector, and data transmission is limited by the data bandwidth of the data connection between the M.2 module and the M.2 connector.)
- Accordingly, it would be desirable to provide an improved expansion module system.
- According to one embodiment, an Information Handling System (IHS) includes a board; a plurality of expansion modules connectors mounted to the board; and a shared expansion module coupling feature provided on the board and including a coupling member that is configured to engage each of a plurality of expansion modules when those expansion modules are each connected to a respective one of the plurality of expansion module connectors.
-
FIG. 1 is a schematic view illustrating an embodiment of an information handling system. -
FIG. 2A is a top schematic view illustrating an embodiment of an expansion module. -
FIG. 2B is a side schematic view illustrating an embodiment of the expansion module ofFIG. 2A . -
FIG. 3 is a top schematic view illustrating an embodiment of a conventional board including a conventional expansion module connector and a conventional expansion module coupling feature. -
FIG. 4 is a top schematic view illustrating an embodiment of conventional expansion modules coupled to a conventional board with conventional expansion module connectors and conventional expansion module coupling features. -
FIG. 5A is a top schematic view illustrating an embodiment of a board including expansion module connectors and a shared expansion module coupling feature of the present disclosure. -
FIG. 5B is a side schematic view illustrating an embodiment of the board ofFIG. 5A including the expansion module connectors and the shared expansion module coupling feature of the present disclosure. -
FIG. 6 is a side schematic view illustrating an embodiment of a board having a board supplemental power delivery/data transmission subsystem. -
FIG. 7 is a side schematic view illustrating an embodiment of the expansion module ofFIG. 2A having a module supplemental power delivery/data transmission system. -
FIG. 8 is a flow chart illustrating an embodiment of a method for mounting expansion modules to a board. -
FIG. 9A is a top schematic view illustrating an embodiment of the board ofFIGS. 5A and 5B with expansion cards ofFIG. 2A coupled to respective expansion module connectors and secured using the shared expansion module coupling feature. -
FIG. 9B is a side schematic view illustrating an embodiment of the board ofFIGS. 5A and 5B with expansion cards ofFIG. 2A coupled to respective expansion module connectors and secured using the shared expansion module coupling feature. -
FIG. 10 is a flow chart illustrating an embodiment of a method for providing supplemental power/data to expansion modules on a board. -
FIG. 11 is a side schematic view illustrating an embodiment of a conventional expansion module coupled to the board ofFIG. 6 having the board supplemental power delivery/data transmission subsystem. -
FIG. 12 is a side schematic view illustrating an embodiment of the expansion module ofFIG. 7 coupled to the board ofFIG. 6 having the board supplemental power delivery/data transmission subsystem. - For purposes of this disclosure, an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, calculate, determine, classify, process, transmit, receive, retrieve, originate, switch, store, display, communicate, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, or other purposes. For example, an information handling system may be a personal computer (e.g., desktop or laptop), tablet computer, mobile device (e.g., personal digital assistant (PDA) or smart phone), server (e.g., blade server or rack server), a network storage device, or any other suitable device and may vary in size, shape, performance, functionality, and price. The information handling system may include random access memory (RAM), one or more processing resources such as a central processing unit (CPU) or hardware or software control logic, ROM, and/or other types of nonvolatile memory. Additional components of the information handling system may include one or more disk drives, one or more network ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, touchscreen and/or a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components.
- In one embodiment, IHS 100,
FIG. 1 , includes aprocessor 102, which is connected to abus 104.Bus 104 serves as a connection betweenprocessor 102 and other components of IHS 100. Aninput device 106 is coupled toprocessor 102 to provide input toprocessor 102. Examples of input devices may include keyboards, touchscreens, pointing devices such as mouses, trackballs, and trackpads, and/or a variety of other input devices known in the art. Programs and data are stored on a mass storage device 108, which is coupled toprocessor 102. Examples of mass storage devices may include hard discs, optical disks, magneto-optical discs, solid-state storage devices, and/or a variety other mass storage devices known in the art. IHS 100 further includes adisplay 110, which is coupled toprocessor 102 by avideo controller 112. Asystem memory 114 is coupled toprocessor 102 to provide the processor with fast storage to facilitate execution of computer programs byprocessor 102. Examples of system memory may include random access memory (RAM) devices such as dynamic RAM (DRAM), synchronous DRAM (SDRAM), solid state memory devices, and/or a variety of other memory devices known in the art. In an embodiment, achassis 116 houses some or all of the components ofIHS 100. It should be understood that other buses and intermediate circuits can be deployed between the components described above andprocessor 102 to facilitate interconnection between the components and theprocessor 102. - Referring now to
FIGS. 2A and 2B , an embodiment of aconventional expansion module 200 is illustrated. In an embodiment, theexpansion module 200 is an M.2 expansion card provided according to the M.2 specification, although other expansion cards and/or modules may benefit from the teachings of the present disclosure and thus will fall within its scope as well. In the illustrated embodiment, theexpansion module 200 includes anexpansion board 202 having atop surface 202 a, abottom surface 202 b located opposite theexpansion board 202 from thetop surface 202 a, afront edge 202 c extending between thetop surface 202 a and thebottom surface 202 b, arear edge 202 d extending between thetop surface 202 a and thebottom surface 202 b and located opposite theboard 202 from thefront edge 202 c, and a pair of opposing side edges 202 e and 202 f extending between thetop surface 202 a, thebottom surface 202 b, thefront edge 202 c, and therear edge 202 d, and located opposite theboard 202 from each other. Aconnector edge 206 is included on theboard 202 immediately adjacent thefront edge 202 c, and includes a plurality of 206 a, 206 b, and 206 c. For example, in embodiments in which theconnector pads expansion module 200 is an M.2 expansion card, the 206 a and 206 b may provide an “M key” edge connector, theconnector pads 206 b and 206 c may provide a “B key” edge connector, and theconnector pads 206 a, 206 b, and 206 c may provide a “B & M key” edge connector. Anconnector pads expansion device 208 is mounted to theexpansion board 202, and includes apower coupling 210 to power connector pad(s) on theconnector edge 206, and aground coupling 212 to aground connector pad 214 that is included in theboard 202 adjacent hebottom surface 202 b. In the illustrated embodiment, theboard 202 defines an expansionmodule securing feature 216 that extends into theboard 202 from therear surface 202 d, although one of skill in the art in possession of the present disclosure will recognize that other securing features provided according to the teachings of the present disclosure may fall within its scope as well. - Referring now to
FIG. 3 , an embodiment of aconventional board 300 is illustrated. In an embodiment, theboard 300 is a motherboard, although other board may benefit from the teachings of the present disclosure and thus will fall within its scope as well. In the illustrated embodiment, theboard 300 includes atop surface 300 a, afront edge 300 b, arear edge 300 c located opposite theboard 202 from thefront edge 300 b, and a pair of opposing side edges 300 d and 300 e extending between thetop surface 300 a, thefront edge 300 b, and therear edge 300 c, and located opposite theboard 300 from each other. A conventionalexpansion module connector 302 is mounted to theboard 300 adjacent thefront edge 300 a, defines an expansionmodule connector slot 302 a, and includes a plurality of 304 a, 304 b, and 304 c. For example, in embodiments in which theconnector pads expansion module connector 302 is an M.2 card connector, the 304 a and 304 b may provide a socket for an “M key” edge connector, theconnector pads 206 b and 206 c may provide a socket for a “B key” edge connector, and theconnector pads 206 a, 206 b, and 206 c may provide a socket for a “B & M key” edge connector. In the illustrated embodiment, theconnector pads board 300 includes a conventional expansionmodule coupling feature 306 that includes ahole 306 a that is defined by theboard 300 and that extends into (and in many cases, through) theboard 300, and astandoff 306 b that is mounted to theboard 300 adjacent thehole 306 a. - With reference to
FIG. 4 , an embodiment of conventional expansion modules (e.g., M.2 expansion cards in the illustrated embodiment) coupled to a conventional board with conventional expansion module connectors (e.g., M.2 expansion card connectors) and conventional expansion module coupling features (e.g., M.2 expansion card coupling features) is illustrated. In the illustrated embodiment, aboard 400 includes conventionalexpansion module connectors 302 with respective conventional expansion module coupling features (e.g., not illustrated, but substantially similar to the conventional expansionmodule coupling feature 306 discussed above with reference toFIG. 3 .) Theboard 400 also includes a device 402 (e.g., a processing system, memory system, and/or other computing device component known in the art) andconnectors 404 that are mounted to theboard 400, any or all of which may be coupled to theconnectors 302 through the board 400 (e.g., via traces in theboard 400.) A respectiveconventional expansion module 200 is connected to each conventional expansion module connector 302 (e.g., via the positioning of theconnector edge 206 on eachconventional expansion module 200 in the expansionmodule connector slot 302 a on its respective conventional expansion module connector 302), and secured to that conventionalexpansion module connector 302 and theboard 400 via a coupling member 406 (e.g., a screw in the illustrated embodiment) that engages thestandoff 306 b and thehole 306 a (e.g., threads defined by thestandoff 306 b and thehole 306 a) provided by the conventional expansionmodule coupling feature 306. As can be seen, a conventional expansionmodule coupling feature 306 is provided for each of the conventionalexpansion module connectors 302, and the inventors of the present disclosure have found that doing so provides for inefficient expansion module placement on theboard 400, as well as uses up area on the board 400 (e.g., for defining thehole 306 a and mounting thestandoff 206 b) that could otherwise be used for other board or computing device components. - Referring now to
FIGS. 5A and 5B , an embodiment of aboard 500 provided according to the teachings of the present disclosure is illustrated. In the illustrated embodiment, theboard 500 includesexpansion module connectors 302 that each define the expansionmodule connector slots 302 a discussed above with reference toFIG. 3 . While not illustrated, each of theexpansion module connectors 302 may include the plurality of 304 a, 304 b, and 304 c as well. Theconnector pads board 500 also includes a device 502 (e.g., a processing system, memory system, and/or other computing device component known in the art) and 504 and 506 that are mounted to theconnectors board 500, any or all of which may be coupled to theconnectors 502 through the board 500 (e.g., via traces in theboard 500.) As can be seen in the illustrated embodiment, theexpansion module connectors 302 are oriented on theboard 500 such that their expansionmodule connector slots 302 a face each other (i.e., a first expansionmodule connector slot 302 a defined by a firstexpansion module connector 302 faces a second expansionmodule connector slot 302 a defined by a secondexpansion module connector 302.) A shared expansionmodule coupling feature 508 is provided on theboard 500 and between theexpansion module connectors 302, and includes ahole 508 a that is defined by theboard 500 and that extends through theboard 500, and astandoff 508 b that is mounted to theboard 500 adjacent thehole 508 a. In the illustrated embodiment, thestandoff 508 b defines a threaded hole that is substantially coaxial with thehole 508 a. Thestandoff 508 b is electrically coupled toground connector pads 510 that may be grounded, as illustrated, using a variety of techniques known in the art. However, while a specific shared expansion module coupling feature and orientation of the expansion module connectors have been illustrated and described, one of skill in the art in possession of the present disclosure will recognize that the shared expansion module coupling feature may utilize different components, and/or the orientation of the expansion module connectors may be modified, while remaining within the scope of the present disclosure. - Referring now to
FIG. 6 , an embodiment of aboard 600 provided according to the teachings of the present disclosure is illustrated. In the illustrated embodiment, theboard 600 includes similar features as theboard 500 discussed above with reference toFIGS. 5A and 5B , and thus common element numbers are used to identify similar features. However, while the supplemental power delivery/data transmission features are illustrated and discussed below as provided, at least in part, using the shared expansionmodule coupling feature 508 of the embodiment ofFIGS. 5A and 5B , one of skill in the art in possession of the present disclosure will recognize that those supplemental power delivery/data transmission features may be provided in the board 300 (e.g., utilizing, at least in part, the expansionmodule coupling feature 306 ofFIG. 3 ) while remaining within the scope of the present disclosure as well. As can be seen, a supplemental power delivery/datatransmission coupling feature 602 is mounted to theboard 600 opposite theboard 600 from the shared expansionmodule coupling feature 508. In the illustrated embodiment, the supplemental power delivery/datatransmission coupling feature 602 defines a threaded hole that is substantially coaxial with thehole 508 a defined by theboard 600. Furthermore, the supplemental power delivery/datatransmission coupling feature 602 is connected to power delivery/data transmission lines 604 that are further connected to a power source/data communication subsystem 606 that may be provided by, for example, a power subsystem in a computing device that utilizes the teachings of the present disclosure (e.g., that delivers power to a processor and/or other components in the computing device), a data communication subsystem in a computing device that utilizes the teachings of the present disclosure (e.g., that provides for data communications from the processor or other components coupled to the processor), and/or a variety of other power sources and/or data transmission subsystems that would be apparent to one of skill in the art in possession of the present disclosure. Thus, while the power source/data communication subsystem 606 is illustrated as separate from theboard 600, that power source/data communication subsystem 606 may be integrated with theboard 600 while remaining within the scope of the present disclosure as well. - One of skill in the art in possession of the present disclosure will recognize that the supplemental power delivery subsystems and the supplemental data transmission subsystems are discussed interchangeably herein, as those subsystems may be utilized to deliver power, transmit data, or both. As such, power delivery lines and ground lines, data transmission lines and ground lines, and/or combinations thereof may be utilized to enable the supplemental power delivery/data transmission functionality of the present disclosure. While a specific power delivery/data transmission feature has been illustrated and described, one of skill in the art in possession of the present disclosure will recognize that power delivery/data transmission features according to the teachings of the present disclosure may vary while remaining within its scope as well.
- Referring not to
FIG. 7 , an embodiment of anexpansion module 700 that may utilize the supplemental power delivery/data transmission features provided in theboard 600 ofFIG. 6 is illustrated. In the illustrated embodiment, theexpansion module 700 includes similar features as theexpansion module 200 discussed above with reference toFIGS. 2A and 2B , and thus common element numbers are used to identify similar features. However, theexpansion module 700 is also provided with apower delivery line 702 that is located adjacent thetop surface 202 a of theexpansion module 700 and that is connected to theexpansion device 208. While a specific power delivery/data transmission feature on theexpansion module 700 has been illustrated and described, one of skill in the art in possession of the present disclosure will recognize that power delivery/data transmission features according to the teachings of the present disclosure may vary while remaining within its scope as well. - Referring now to
FIG. 8 , an embodiment of amethod 800 for mounting expansion modules to a board is illustrated. As discussed below, the systems and methods of the present disclosure provide a shared expansion module coupling feature on a board for use in supporting and engaging a plurality of expansion modules that are coupled to expansion module connectors on the board, which allows for single hole in the board and/or a single standoff mounted to the board to support and secure the plurality of expansion modules. In a specific examples, a pair of expansion modules connectors may be oriented on the board such that they face each other, with the shared expansion module coupling feature located between the pair of expansion module connectors, which allows a first expansion module and a second expansion module to be connected to respective ones of the pair of expansion module connectors, and a single coupling member to engage each of the first and second expansion modules, along with the shared expansion module coupling feature, to secure the first and second expansion modules to the board and in their respective expansion module connectors. As such, a two expansion module enabled system may be provided using a single hole and/or single standoff mounted to the board, providing for more efficient positioning of the expansion modules on the board (i.e., using up less board space relative to conventional systems), and using less of the board that may then be utilized to route traces, mount components, and/or provide other board elements that would be apparent to one of skill in the art in possession of the present disclosure. - The
method 800 begins atblock 802 where expansion modules are connected to respective expansion module connectors on a board. In an embodiment, atblock 802, arespective expansion module 200 ofFIGS. 2A and 2B may be connected to each of theexpansion module connectors 302 on theboard 500 ofFIG. 5 . For example, theconnector edge 206 on afirst expansion module 200 may be positioned adjacent a first expansionmodule connector slot 302 a on a first expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards the firstexpansion module connector 302 such that theconnector edge 206 on thefirst expansion module 200 enters the first expansionmodule connector slot 302 a on the firstexpansion module connector 302 to engage the 206 a, 206 b, and 206 c with theconnector pads 304 a, 304 b, and 304 c. Similarly, theconnector pads connector edge 206 on asecond expansion module 200 may be positioned adjacent a second expansionmodule connector slot 302 a on a second expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards the secondexpansion module connector 302 such that theconnector edge 206 on thesecond expansion module 200 enters the second expansionmodule connector slot 302 a on the secondexpansion module connector 302 to engage the 206 a, 206 b, and 206 c with theconnector pads 304 a, 304 b, and 304 c.connector pads - The
method 800 then proceeds to block 804 where a portion of each expansion module is positioned adjacent a shared expansion module coupling feature on the board. In an embodiment, atblock 804, eachrespective expansion module 200 that was connected to each of theexpansion module connectors 302 on theboard 500 ofFIG. 5 atblock 802 is then engaged with the shared expansionmodule coupling feature 508. For example, the portion of thefirst expansion module 200 adjacent the expansionmodule securing feature 216 may be positioned adjacent the shared expansionmodule coupling feature 508 and in engagement with a portion of thestandoff 508 b (e.g., rotated from the coupling angle used to connect to theexpansion module connector 302, towards theboard 500, and into engagement with thestandoff 508 b, as is known in the art for some expansion module/expansion module connector connections). Similarly, the portion of thesecond expansion module 200 adjacent the expansionmodule securing feature 216 may be positioned adjacent the shared expansionmodule coupling feature 508 and in engagement with a portion of thestandoff 508 b (e.g., rotated from the coupling angle used to connect to theexpansion module connector 302, towards theboard 500, and into engagement with thestandoff 508 b, as is known in the art for some expansion module/expansion module connector connections). Thus, followingblock 804, each of theexpansion modules 200 may be connected to respectiveexpansion module connectors 302, in engagement with thestandoff 508 b on the shared expansionmodule coupling feature 508, and oriented substantially parallel to theboard 500. - The
method 800 then proceeds to block 806 where the portion of each expansion module is engaged by a coupling member on the shared expansion module coupling feature to secure the expansion modules in the expansion module connectors. With reference toFIGS. 9A and 9B , in an embodiment ofblock 806, acoupling member 900 may be engaged with the shared expansionmodule coupling feature 508 and the portion of each of theexpansion modules 200 that is located adjacent the shared expansionmodule coupling feature 508. For example, thecoupling member 900 may be provided by a screw that may be threaded with threads provided in thestandoff 508 b and/or thehole 508 a until a top portion of that screw engages the portions of the first expansion module and the second expansion module adjacent the shared expansionmodule coupling feature 508 to secure those portions of the first expansion module and the second expansion module between thestandoff 508 b and the top portion of the screw, as illustrated inFIGS. 9A and 9B . - Thus, systems and methods have been described that provide a shared expansion module coupling feature on a board that supports and engages a plurality of expansion modules that are coupled to respective expansion module connectors on the board, which allows for single hole in the board and/or a single standoff mounted to the board to support and secure the plurality of expansion modules. In a specific examples, a pair of M.2 card connectors may be oriented on the board such that they face each other, with the shared M.2 card coupling feature located between the pair of M.2 card connectors, which allows a first M.2 card and a second M.2 card to be connected to respective ones of the pair of M.2 card connectors, and a single coupling member to engage each of the first and second M.2 cards, along with the shared M.2 card coupling feature, to secure the first and second M.2 cards to the board and in their respective M.2 card connectors. As such, a two M.2 card enabled system may be provided using a single hole and/or single standoff mounted to the board, providing for more efficient positioning of the M.2 cards on the board (i.e., using up less board space relative to conventional systems), and using less of the board that may then be utilized to route traces, mount components, and/or provide other board elements that would be apparent to one of skill in the art in possession of the present disclosure.
- Referring now to
FIG. 10 , an embodiment of amethod 1000 for providing supplemental power delivery and/or data transmission for expansion modules is illustrated. As discussed below, the systems and methods of the present disclosure provide for the delivery of additional power and/or the transmission of additional data to an expansion module via a secondary power delivery channel and/or secondary data transmission channel that is separate from the primary power delivery channel and primary data transmission channel provided by its expansion module connector. In a specific example, a board with which the expansion module is utilized may include an expansion module coupling feature that includes a hole that extends through the board, and a standoff that is located adjacent the hole. A supplemental power delivery/data transmission feature may be mounted to the board adjacent the hole and opposite the board from the standoff, and electrically coupled to a power source or data communication subsystem. When the expansion module is coupled to an expansion module connector on the board and engaged with the expansion module coupling feature, supplemental power delivery/data transmission may be enabled by utilizing an supplemental power delivery/data transmission coupling member that engages the expansion module (and a power delivery/data transmission line provided on the expansion module), along with the supplemental power delivery/data transmission feature, and without engaging the standoff. Engagement of the supplemental power delivery/data transmission coupling member with each of the power delivery/data transmission line on the expansion module and the supplemental power delivery/data transmission feature creates a power delivery/data transmission channel for providing the additional power/data between the expansion module and the power source or data communication subsystem. If supplemental power delivery/data transmission is not desired, a conventional coupling member may be utilized to secure the expansion module via engagement of the expansion module and the standoff, without engaging the supplemental power delivery/data transmission feature. - The
method 1000 begins atblock 1002 where an expansion module is connected to an expansion module connector on a board. In an embodiment, atblock 1002, theexpansion module 200 ofFIGS. 2A and 2B or theexpansion module 700 ofFIG. 7 may be connected to theexpansion module connector 302 on theboard 600 ofFIG. 6 . For example, theconnector edge 206 on theexpansion module 200/700 may be positioned adjacent the expansionmodule connector slot 302 a on the expansion module connector 302 (e.g., at an angle, as is known in the art for some expansion module/expansion module connector connections), and then moved towards theexpansion module connector 302 such that theconnector edge 206 on theexpansion module 200/700 enters the expansionmodule connector slot 302 a on theexpansion module connector 302 to engage the 206 a, 206 b, and 206 c with theconnector pads 304 a, 304 b, and 304 c.connector pads - The
method 1000 then proceeds to block 1004 where the expansion module engages an expansion module coupling feature on the board. In an embodiment, atblock 1004, theexpansion module 200/700 that was connected to theexpansion module connector 302 on theboard 600 ofFIG. 6 atblock 1002 is then engaged with the expansionmodule coupling feature 508. For example, the portion of thefirst expansion module 200 adjacent the expansionmodule securing feature 216 may be positioned adjacent the shared expansionmodule coupling feature 508 and in engagement with a portion of thestandoff 508 b (e.g., rotated from the coupling angle used to connect to the expansion module connector 320, towards theboard 500, and into engagement with thestandoff 508 b, as is known in the art for some expansion module/expansion module connector connections). - The
method 1000 then proceeds to decision block 1006 where it is determined whether supplemental power delivery/data transmission is desired. In an embodiment, at decision block 1006, a user may determine whether supplemental power delivery/data transmission is desired, and may configure the system accordingly. In particular, the user may select the conventional coupling member discussed below if the supplemental power delivery/data transmission is not desired, and may select the supplemental power delivery/data transmission coupling member discussed below if the supplemental power delivery/data transmission is desired. Furthermore, as will be appreciated by one of skill in the art in possession of the present disclosure, the user may select theexpansion module 200 and couple thatexpansion module 200 to theboard 500 at 1002 and 1004 if the supplemental power delivery/data transmission is not desired, and may select theblocks expansion module 700 and couple thatexpansion module 700 to theboard 500 at 1002 and 1004 if the supplemental power delivery/data transmission is not desired.blocks - If, at decision block 1006, it is determined that supplemental power delivery/data transmission is not desired, the
method 1000 proceeds to block 1008 where a conventional coupling member engages the expansion module and a standoff on the expansion module coupling feature. With reference toFIG. 11 , in an embodiment ofblock 1008, aconventional coupling member 1100 may be engaged with the shared expansionmodule coupling feature 508 and the portion of theexpansion module 200 that is located adjacent the shared expansionmodule coupling feature 508. For example, theconventional coupling member 1100 may be provided by a first sized screw that may be threaded with threads provided in thestandoff 508 b (and in some cases, thehole 508 a) until a top portion of that screw engages the portion of theexpansion module 200 adjacent the shared expansionmodule coupling feature 508 to secure that portion of theexpansion module 200 between thestandoff 508 b and the top portion of the screw, as illustrated inFIG. 11 . With that portion of theexpansion module 200 secured between thestandoff 508 b and theconventional coupling member 1100, theground connector pad 214 in theexpansion module 200 is connected to theground connector pad 510 in theboard 500 through thestandoff 508 b in order to ground theexpansion device 208 on theexpansion module 200. As such, theexpansion module 200 may only receive power and transmit data conventionally via the power delivery channels and data transmission channels in theexpansion module connector 302. It is noted that theconventional coupling member 1100 does not engage the supplemental power delivery/data transmission feature 602. - If, at decision block 1006, it is determined that supplemental power delivery/data transmission is desired, the
method 1000 proceeds to block 1010 where a supplemental power delivery/data transmission coupling member engages the expansion module and an supplemental power delivery/data transmission coupling feature. With reference toFIG. 12 , in an embodiment ofblock 1010, a supplemental power delivery/datatransmission coupling member 1200 may be engaged with the supplemental power delivery/datatransmission coupling feature 302 and the portion of theexpansion module 700 that is located adjacent the shared expansionmodule coupling feature 508. For example, the supplemental power delivery/datatransmission coupling member 1200 may be provided by a second sized screw (e.g., with a smaller diameter first sized screw utilized for theconventional coupling member 1100 in the example above) that may be threaded with threads provided in the supplemental power delivery/data transmission feature 602 until a top portion of that screw engages the portion of theexpansion module 700 adjacent the shared expansionmodule coupling feature 508 to secure that portion of theexpansion module 700 between thestandoff 508 b and the top portion of the screw, as illustrated inFIG. 12 . With that portion of theexpansion module 700 secured between thestandoff 508 b and the supplemental power delivery/datatransmission coupling member 1200, theground connector pad 214 in theexpansion module 200 is connected to theground connector pad 510 in theboard 600 through thestandoff 508 b in order to ground theexpansion device 208 on theexpansion module 700. In addition, the supplemental power delivery/datatransmission coupling member 1200 engages the supplemental power delivery/data transmission feature 602 to couple the power delivery/data transmission line 702 in theexpansion module 700 to thepower source 606 via the power delivery/data transmission line 604 in theboard 600. As such, theexpansion module 700 may receive power and transmit data conventionally via the power delivery channels and data transmission channels in theexpansion module connector 302, and may receive additional power and/or transmit additional data between thedevice 208 and the power source/data communication subsystem 606 via the connection of the power delivery/data transmission line 702 in theexpansion module 700, the supplemental power delivery/datatransmission coupling member 1200, the supplemental power delivery/data transmission feature 602, and the power delivery/data transmission line 604 in theboard 600. It is noted that the supplemental power delivery/datatransmission coupling member 1200 does not engage thestandoff 508 b (which is grounded as discussed above.) - Thus, systems and methods have been described that provide for the delivery of additional power and/or the transmission of additional data to an M.2 card via a secondary power delivery channel and/or secondary data transmission channel that is separate from the primary power delivery channel and primary data transmission channel provided by its M.2 card connector. In a specific example, a board with which the M.2 card is utilized may include an M.2 card coupling feature that includes a hole that extends through the board, and a standoff that is located adjacent the hole. A supplemental power delivery/data transmission feature may be mounted to the board adjacent the hole and opposite the board from the standoff, and may be electrically coupled to a power source or data communication subsystem. When the M.2 card is coupled to an M.2 card connector on the board and engaged with the M.2 card coupling feature, supplemental power delivery/data transmission may be enabled by utilizing an supplemental power delivery/data transmission coupling member that engages the M.2 card (and a power delivery/data transmission line provided on the M.2 card), along with the supplemental power delivery/data transmission feature, and without engaging the standoff. Engagement of the supplemental power delivery/data transmission coupling member with each of the power delivery/data transmission line on the M.2 card and the supplemental power delivery/data transmission feature creates a power delivery/data transmission channel for providing the additional power/data between the M.2 card and the power source or data communication subsystem.
- Although illustrative embodiments have been shown and described, a wide range of modification, change and substitution is contemplated in the foregoing disclosure and in some instances, some features of the embodiments may be employed without a corresponding use of other features. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the embodiments disclosed herein.
Claims (20)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/987,752 US10488893B1 (en) | 2018-05-23 | 2018-05-23 | Expansion module system |
| US16/692,806 US11093010B2 (en) | 2018-05-23 | 2019-11-22 | Expansion module system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/987,752 US10488893B1 (en) | 2018-05-23 | 2018-05-23 | Expansion module system |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| US16/692,806 Continuation US11093010B2 (en) | 2018-05-23 | 2019-11-22 | Expansion module system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US10488893B1 US10488893B1 (en) | 2019-11-26 |
| US20190361506A1 true US20190361506A1 (en) | 2019-11-28 |
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| US16/692,806 Active 2038-10-09 US11093010B2 (en) | 2018-05-23 | 2019-11-22 | Expansion module system |
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| Application Number | Title | Priority Date | Filing Date |
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| US16/692,806 Active 2038-10-09 US11093010B2 (en) | 2018-05-23 | 2019-11-22 | Expansion module system |
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Cited By (2)
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|---|---|---|---|---|
| US11191149B2 (en) * | 2018-11-27 | 2021-11-30 | Giga-Byte Technology Co., Ltd. | Heat dissipation assembly of M.2 expansion card and electronic device |
| US20230121074A1 (en) * | 2021-10-18 | 2023-04-20 | Hewlett-Packard Development Company, L.P. | Electronic component mounting |
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| US10838902B2 (en) * | 2017-06-23 | 2020-11-17 | Facebook, Inc. | Apparatus, system, and method for performing hardware acceleration via expansion cards |
| US10488893B1 (en) * | 2018-05-23 | 2019-11-26 | Dell Products L.P. | Expansion module system |
| US11971758B2 (en) * | 2020-12-16 | 2024-04-30 | Samsung Electronics Co., Ltd. | Insertable electronic device and method for the same |
| US12184001B2 (en) | 2020-12-24 | 2024-12-31 | Intel Corporation | Ultra slim module form factor and connector architecture for inline connection |
| US12249793B2 (en) * | 2021-04-20 | 2025-03-11 | Intel Corporation | M2 connector with increased ampacity |
| US12267959B2 (en) * | 2022-07-22 | 2025-04-01 | Dell Products L.P. | System and method for reversible connection of interchangeable components |
| CN115173107A (en) * | 2022-08-03 | 2022-10-11 | 珠海格力电器股份有限公司 | Network interface expansion device, bus module and network interface expansion method thereof |
| US20250390150A1 (en) * | 2024-06-20 | 2025-12-25 | Dell Products L.P. | Computing device card system |
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| US7335032B1 (en) * | 2006-10-18 | 2008-02-26 | T-Conn Precision Corp. | Interface card securing device including grounding element |
| TW200847894A (en) * | 2007-05-30 | 2008-12-01 | T Conn Prec Corp | Improved structure of interface card fixation device |
| WO2016018326A1 (en) * | 2014-07-30 | 2016-02-04 | Hewlett-Packard Development Company, L.P. | Retention assembly |
| US20160259754A1 (en) * | 2015-03-02 | 2016-09-08 | Samsung Electronics Co., Ltd. | Hard disk drive form factor solid state drive multi-card adapter |
| CN106647956B (en) * | 2015-10-30 | 2020-05-19 | 鸿富锦精密电子(天津)有限公司 | Connecting assembly |
| US9899358B2 (en) * | 2016-05-24 | 2018-02-20 | Intel Corporation | Module stacking mechanism with integrated ground |
| US9778708B1 (en) * | 2016-07-18 | 2017-10-03 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Dual sided latching retainer for computer modules |
| US10103466B1 (en) * | 2017-05-17 | 2018-10-16 | General Electric Company | Double-threaded connector |
| US10488893B1 (en) * | 2018-05-23 | 2019-11-26 | Dell Products L.P. | Expansion module system |
-
2018
- 2018-05-23 US US15/987,752 patent/US10488893B1/en active Active
-
2019
- 2019-11-22 US US16/692,806 patent/US11093010B2/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11191149B2 (en) * | 2018-11-27 | 2021-11-30 | Giga-Byte Technology Co., Ltd. | Heat dissipation assembly of M.2 expansion card and electronic device |
| US20230121074A1 (en) * | 2021-10-18 | 2023-04-20 | Hewlett-Packard Development Company, L.P. | Electronic component mounting |
| US11877414B2 (en) * | 2021-10-18 | 2024-01-16 | Hewlett-Packard Development Company, L.P. | Electronic component mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| US11093010B2 (en) | 2021-08-17 |
| US10488893B1 (en) | 2019-11-26 |
| US20200089289A1 (en) | 2020-03-19 |
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