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US20190204019A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20190204019A1
US20190204019A1 US15/860,666 US201815860666A US2019204019A1 US 20190204019 A1 US20190204019 A1 US 20190204019A1 US 201815860666 A US201815860666 A US 201815860666A US 2019204019 A1 US2019204019 A1 US 2019204019A1
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US
United States
Prior art keywords
face
main body
heat dissipation
dissipation device
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/860,666
Inventor
Han-Min Liu
Xiao-Xiang Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Shenzhen Co Ltd
Original Assignee
Asia Vital Components Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Shenzhen Co Ltd filed Critical Asia Vital Components Shenzhen Co Ltd
Priority to US15/860,666 priority Critical patent/US20190204019A1/en
Assigned to ASIA VITAL COMPONENTS (CHINA) CO., LTD. reassignment ASIA VITAL COMPONENTS (CHINA) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZHOU, Xiao-xiang, LIU, Han-min
Publication of US20190204019A1 publication Critical patent/US20190204019A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/086—Heat exchange elements made from metals or metal alloys from titanium or titanium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels

Definitions

  • the present invention relates generally to a heat dissipation device.
  • a capillary structure is formed on titanium material by means of laser processing.
  • a vapor chamber is an often seen heat dissipation device applied in heat dissipation field.
  • the vapor chamber is often made of copper, aluminum, stainless steel or the like. In manufacturing, such material is easy to cause potential difference, which will lead to corrosion.
  • the conventional vapor chamber made of copper, aluminum or stainless steel is applied to a large-scale industrial apparatus, the vapor chamber often has a large volume and very heavy weight for achieving sufficient strength.
  • the vapor chamber is applied to a handheld device such as an intelligent mobile phone or a tablet, the vapor chamber needs to be extremely thinned. Under such circumstance, the thickness of the vapor chamber will be too thin to have sufficient strength. Therefore, in recent years, some manufacturers have in advance employed titanium material to manufacture the heat dissipation device applied in the heat dissipation field.
  • Titanium is a lightweight metal material having high structural strength and anticorrosion property. Therefore, titanium has been widely used in various fields. Titanium has many advantages. However, titanium has high structural strength so that it is hard to process titanium.
  • Titanium cannot be processed in the conventional processing manner. Titanium necessitates a special or nontraditional processing method to process. As a result, titanium cannot be applied to all situations.
  • Some manufacturers employ discharging method or wet etching method to process titanium and remove a part of the material. However, the processing speed of the discharging method is too slow to apply to a mass-production situation that needs to remove a great amount of material. With respect to wet etching method, it is hard to control the depth of the channels formed by the processing. In addition, the solvent and gas used in the processing are toxic and apt to cause contamination of environment. Moreover, it is quite hard to reduce the oxide produced from titanium in a high-temperature environment.
  • the heat dissipation device is made of titanium material.
  • a capillary structure is formed on the titanium material by means of laser processing.
  • the heat dissipation device of the present invention includes a main body and a tubular body.
  • the main body has a chamber.
  • a capillary structure is formed on an inner surface of the chamber by means of laser processing.
  • a working fluid is contained in the chamber.
  • One face of the main body is a condensation face, while the other face of the main body is a heat absorption face.
  • the capillary structure is disposed corresponding to the heat absorption face.
  • the heat absorption face of the main body is made of titanium material.
  • the condensation face is made of titanium material or metal material.
  • the tubular body is correspondingly inserted in the main body.
  • the vapor chamber is made of titanium material instead of copper or aluminum so that the lifetime of the vapor chamber is prolonged.
  • the titanium material can be processed by laser to form the capillary structure. This solves the problem of the conventional vapor chamber that the titanium material is difficult to process.
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention.
  • FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention.
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention.
  • FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention.
  • the heat dissipation device 1 of the present invention includes a main body 11 and a tubular body 12 .
  • the main body 11 has a chamber 111 .
  • a capillary structure 112 is formed on an inner surface of the chamber 111 by means of laser processing.
  • a working fluid 2 is contained in the chamber 111 .
  • One face of the main body 11 is a condensation face 113 , while the other face of the main body 11 is a heat absorption face 114 .
  • the capillary structure 112 is disposed corresponding to the heat absorption face 114 .
  • the heat absorption face 114 of the main body 11 is made of titanium material.
  • the titanium material is commercial pure titanium or titanium alloy.
  • the condensation face 113 is made of titanium material, metal material or ceramic material.
  • the metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel.
  • the tubular body 12 is correspondingly inserted in the main body 11 in communication with the internal chamber 111 of the main body 11 .
  • the main body 11 has an upper plate 11 a and a lower plate 11 .
  • the condensation face 113 is positioned on one face of the upper plate 11 a, while the heat absorption face 114 is positioned on one face of the lower plate 11 b.
  • the upper and lower plate bodies 11 a, 11 b are mated with each other to define the chamber 111 together with the tubular body 12 .
  • the capillary structure 112 is disposed on the other face of the lower plate 11 b opposite to the heat absorption face 114 .
  • the capillary structure 112 is, but not limited to, a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals. In this embodiment, the capillary structure 112 is a micro-channeled structure for illustration purposes.
  • the tubular body 12 is disposed between the upper and lower plate bodies 11 a, 11 b. After the upper and lower plate bodies 11 a, 11 b are overlapped and mated with each other, the periphery is sealed. At the same time, the tubular body 12 is connected with the upper and lower plate bodies 11 a, 11 b to keep the main body 11 airtight.
  • the capillary structure is mainly formed by means of laser processing.
  • the vapor chamber is made of titanium material instead of other material so that the titanium material can be processed by laser to solve the problems that the titanium material is difficult to process and the oxide is produced at high temperature and is uneasy to reduce.
  • the heat dissipation device of the present invention is not limited to the vapor chamber.
  • the heat dissipation device of the present invention can be a flat-plate heat pipe or other heat dissipation device that employs titanium material as the material of the base seat and needs to be processed to form the capillary structure.
  • the titanium material is selectively employed to eliminate the shortcomings of the conventional vapor chamber that the other material is employed and is easy to corrode and the structural strength is poor and the vapor chamber is too heavy.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device is disclosed. The heat dissipation device includes a main body and a tubular body. The main body has a chamber. A capillary structure is formed on an inner surface of the chamber by means of laser processing. A working fluid is contained in the chamber. One face of the main body is a condensation face, while the other face of the main body is a heat absorption face. The capillary structure is disposed corresponding to the heat absorption face. The heat absorption face of the main body is made of titanium material. The condensation face is made of titanium material or metal material. The tubular body is correspondingly inserted in the main body. The capillary structure is formed by means of laser processing. This not only solves the problem that the titanium material is difficult to process, but also can enhance the production efficiency.

Description

    BACKGROUND OF THE INVENTION 1. Field of the Invention
  • The present invention relates generally to a heat dissipation device. In the heat dissipation device, a capillary structure is formed on titanium material by means of laser processing.
    • 2. Description of the Related Art
  • A vapor chamber is an often seen heat dissipation device applied in heat dissipation field. The vapor chamber is often made of copper, aluminum, stainless steel or the like. In manufacturing, such material is easy to cause potential difference, which will lead to corrosion. In addition, in case the conventional vapor chamber made of copper, aluminum or stainless steel is applied to a large-scale industrial apparatus, the vapor chamber often has a large volume and very heavy weight for achieving sufficient strength. In case the vapor chamber is applied to a handheld device such as an intelligent mobile phone or a tablet, the vapor chamber needs to be extremely thinned. Under such circumstance, the thickness of the vapor chamber will be too thin to have sufficient strength. Therefore, in recent years, some manufacturers have in advance employed titanium material to manufacture the heat dissipation device applied in the heat dissipation field.
  • Titanium is a lightweight metal material having high structural strength and anticorrosion property. Therefore, titanium has been widely used in various fields. Titanium has many advantages. However, titanium has high structural strength so that it is hard to process titanium.
  • Titanium cannot be processed in the conventional processing manner. Titanium necessitates a special or nontraditional processing method to process. As a result, titanium cannot be applied to all situations. Some manufacturers employ discharging method or wet etching method to process titanium and remove a part of the material. However, the processing speed of the discharging method is too slow to apply to a mass-production situation that needs to remove a great amount of material. With respect to wet etching method, it is hard to control the depth of the channels formed by the processing. In addition, the solvent and gas used in the processing are toxic and apt to cause contamination of environment. Moreover, it is quite hard to reduce the oxide produced from titanium in a high-temperature environment.
  • It is therefore tried by the applicant to provide a heat dissipation device and a manufacturing method thereof, in which titanium is employed as the material of the vapor chamber and is easy to process to form the capillary structure so as to solve the above problems existing in the conventional vapor chamber.
    • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the present invention to provide a heat dissipation device. The heat dissipation device is made of titanium material. A capillary structure is formed on the titanium material by means of laser processing.
  • To achieve the above and other objects, the heat dissipation device of the present invention includes a main body and a tubular body.
  • The main body has a chamber. A capillary structure is formed on an inner surface of the chamber by means of laser processing. A working fluid is contained in the chamber. One face of the main body is a condensation face, while the other face of the main body is a heat absorption face. The capillary structure is disposed corresponding to the heat absorption face. The heat absorption face of the main body is made of titanium material. The condensation face is made of titanium material or metal material. The tubular body is correspondingly inserted in the main body.
  • In the heat dissipation device of the present invention, the vapor chamber is made of titanium material instead of copper or aluminum so that the lifetime of the vapor chamber is prolonged. Moreover, the titanium material can be processed by laser to form the capillary structure. This solves the problem of the conventional vapor chamber that the titanium material is difficult to process.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention; and
  • FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 1 and 2. FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention. FIG. 2 is a sectional assembled view of the first embodiment of the heat dissipation device of the present invention. According to the first embodiment, the heat dissipation device 1 of the present invention includes a main body 11 and a tubular body 12.
  • The main body 11 has a chamber 111. A capillary structure 112 is formed on an inner surface of the chamber 111 by means of laser processing. A working fluid 2 is contained in the chamber 111. One face of the main body 11 is a condensation face 113, while the other face of the main body 11 is a heat absorption face 114. The capillary structure 112 is disposed corresponding to the heat absorption face 114. The heat absorption face 114 of the main body 11 is made of titanium material. The titanium material is commercial pure titanium or titanium alloy. The condensation face 113 is made of titanium material, metal material or ceramic material. The metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel. The tubular body 12 is correspondingly inserted in the main body 11 in communication with the internal chamber 111 of the main body 11.
  • The main body 11 has an upper plate 11 a and a lower plate 11. The condensation face 113 is positioned on one face of the upper plate 11 a, while the heat absorption face 114 is positioned on one face of the lower plate 11 b. The upper and lower plate bodies 11 a, 11 b are mated with each other to define the chamber 111 together with the tubular body 12. The capillary structure 112 is disposed on the other face of the lower plate 11 b opposite to the heat absorption face 114. The capillary structure 112 is, but not limited to, a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals. In this embodiment, the capillary structure 112 is a micro-channeled structure for illustration purposes. The tubular body 12 is disposed between the upper and lower plate bodies 11 a, 11 b. After the upper and lower plate bodies 11 a, 11 b are overlapped and mated with each other, the periphery is sealed. At the same time, the tubular body 12 is connected with the upper and lower plate bodies 11 a, 11 b to keep the main body 11 airtight.
  • In the heat dissipation device of the present invention, the capillary structure is mainly formed by means of laser processing. The vapor chamber is made of titanium material instead of other material so that the titanium material can be processed by laser to solve the problems that the titanium material is difficult to process and the oxide is produced at high temperature and is uneasy to reduce.
  • The heat dissipation device of the present invention is not limited to the vapor chamber. Alternatively, the heat dissipation device of the present invention can be a flat-plate heat pipe or other heat dissipation device that employs titanium material as the material of the base seat and needs to be processed to form the capillary structure.
  • The titanium material is selectively employed to eliminate the shortcomings of the conventional vapor chamber that the other material is employed and is easy to corrode and the structural strength is poor and the vapor chamber is too heavy.
  • The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (5)

1. A heat dissipation device comprising:
a main body having a chamber, a capillary structure being formed on an inner surface of the chamber by means of laser processing, a working fluid being contained in the chamber, one face of the main body being a condensation face, while the other face of the main body being a heat absorption face, the capillary structure being disposed corresponding to the heat absorption face, the heat absorption face of the main body being made of titanium material, the condensation face being made of titanium material, metal material or ceramic material; and
a tubular body correspondingly inserted in the main body.
2. The heat dissipation device as claimed in claim 1, wherein the capillary structure is a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals.
3. The heat dissipation device as claimed in claim 1, wherein the titanium material is commercial pure titanium or titanium alloy.
4. The heat dissipation device as claimed in claim 1, wherein the metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel.
5. The heat dissipation device as claimed in claim 1, wherein the main body has an upper plate and a lower plate, the condensation face being positioned on one face of the upper plate, while the heat absorption face being positioned on one face of the lower plate, the upper and lower plate bodies being mated with each other to together define the chamber, the capillary structure being disposed on the other face of the lower plate opposite to the heat absorption face.
US15/860,666 2018-01-03 2018-01-03 Heat dissipation device Abandoned US20190204019A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112996346A (en) * 2020-01-14 2021-06-18 荣耀终端有限公司 High-strength vapor chamber, preparation method thereof and electronic equipment
US11092383B2 (en) * 2019-01-18 2021-08-17 Asia Vital Components Co., Ltd. Heat dissipation device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060081360A1 (en) * 2004-08-18 2006-04-20 Delta Electronics, Inc. Heat dissipation apparatus and manufacturing method thereof
US20130048252A1 (en) * 2011-08-29 2013-02-28 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
US20170227297A1 (en) * 2016-02-05 2017-08-10 Yeh-Chiang Technology Corp. Heat conduction device and manufacturing method thereof
US20180010861A1 (en) * 2015-03-26 2018-01-11 Murata Manufacturing Co., Ltd. Sheet-shaped heat pipe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060081360A1 (en) * 2004-08-18 2006-04-20 Delta Electronics, Inc. Heat dissipation apparatus and manufacturing method thereof
US20130048252A1 (en) * 2011-08-29 2013-02-28 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
US20180010861A1 (en) * 2015-03-26 2018-01-11 Murata Manufacturing Co., Ltd. Sheet-shaped heat pipe
US20170227297A1 (en) * 2016-02-05 2017-08-10 Yeh-Chiang Technology Corp. Heat conduction device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11092383B2 (en) * 2019-01-18 2021-08-17 Asia Vital Components Co., Ltd. Heat dissipation device
CN112996346A (en) * 2020-01-14 2021-06-18 荣耀终端有限公司 High-strength vapor chamber, preparation method thereof and electronic equipment
US12245402B2 (en) 2020-01-14 2025-03-04 Honor Device Co., Ltd. Mobile terminal, vapor chamber and preparation method thereof, and electronic device

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