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US20190047116A1 - Processing apparatus - Google Patents

Processing apparatus Download PDF

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Publication number
US20190047116A1
US20190047116A1 US16/053,181 US201816053181A US2019047116A1 US 20190047116 A1 US20190047116 A1 US 20190047116A1 US 201816053181 A US201816053181 A US 201816053181A US 2019047116 A1 US2019047116 A1 US 2019047116A1
Authority
US
United States
Prior art keywords
processing
transmission window
workpiece
wall
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/053,181
Other languages
English (en)
Inventor
Masaki Kakefuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Assigned to DISCO CORPORATION reassignment DISCO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAKEFUDA, MASAKI
Publication of US20190047116A1 publication Critical patent/US20190047116A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H10P72/06—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
    • H10P72/0406—
    • H10P72/0428—

Definitions

  • the present invention relates to a processing apparatus for processing a plate-shaped workpiece.
  • a processing apparatus which includes a spindle (rotary shaft) on which a processing tool such as, for example, a grinding wheel, a polishing pad or the like is to be mounted.
  • a processing tool such as, for example, a grinding wheel, a polishing pad or the like is to be mounted.
  • a cover that covers an end portion of a spindle is provided on a processing apparatus as described above, then processing waste adheres and gradually accumulates on an inner wall of the cover. If the processing waste accumulated on the inner wall of the cover drops from some reason and enters a gap between the processing tool and the workpiece, then the workpiece will get big scratches. Therefore, it is necessary to clean the inner wall of the cover at an appropriate timing.
  • timing for cleaning is determined, for example, on the basis of experience or the like of an operator, the frequency of cleaning sometimes becomes unnecessarily high, resulting in degradation of the operating rate of the processing apparatus.
  • processing waste may drop from the inner wall of the cover and enter a gap between the processing tool and the workpiece, resulting in big scratches to the workpiece.
  • a processing apparatus including a chuck table configured to hold a plate-shaped workpiece thereon, a processing unit including a spindle having an end portion at which a processing tool for grinding or polishing the workpiece held on the chuck table is to be mounted, a processing room surrounded by a wall and configured to accommodate the chuck table and the end portion of the spindle therein, and a dirty situation indication unit configured to indicate a degree of adhesion of processing waste, which is generated by grinding or polishing of the workpiece, to the wall, in which the dirty situation indication unit includes a transmission window made of a member that passes visible rays therethrough and configuring part of the wall, and a color sample indication unit provided in an overlapping relationship with the transmission window or adjacent the transmission window and indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window.
  • the processing apparatus includes the dirty situation indication unit that in turn includes the transmission window made of a member that passes visible rays therethrough and the color sample indication unit indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window, by visually comparing the transmission window and the color sample indication unit with each other, the degree of adhesion of the processing waste to the wall surrounding the processing room can be decided appropriately.
  • FIG. 1 is a perspective view schematically depicting an example of a configuration of a polishing apparatus
  • FIG. 2 is a plan view schematically depicting an example of a configuration of a dirty situation indication unit.
  • FIG. 1 is a perspective view schematically depicting an example of a configuration of a polishing apparatus (processing apparatus) 2 according to the present embodiment.
  • the polishing apparatus 2 includes a base 4 that supports the components thereof.
  • a wall-shaped support structure 6 is provided at a rear end of the base 4 .
  • An opening 4 a is formed at a front portion of an upper face of the base 4 , and a transport unit 8 for transporting a plate-shaped workpiece 11 is disposed in the opening 4 a.
  • the workpiece 11 is, for example, a disk-shaped wafer made of a material such as silicon (Si).
  • a material such as silicon (Si).
  • Si silicon
  • a substrate made of a material such as a different semiconductor, a ceramics, a resin, a metal or the like can be used for the workpiece 11 .
  • cassettes 10 a and 10 b for accommodating workpieces 11 are placed. Behind the region in which the cassette 10 a is to be placed, a centering mechanism 12 is provided.
  • the centering mechanism 12 adjusts the position of the center of a workpiece 11 transmitted, for example, from the cassette 10 a by the transport unit 8 .
  • a loading unit 14 that pivots with a workpiece 11 held thereon is provided behind the centering mechanism 12 . Behind the loading unit 14 , another opening 4 b is formed. In this opening 4 b , an X-axis moving table 16 , an X-axis moving unit (not depicted) for moving the X-axis moving table 16 in an X-axis direction (forward and rearward direction) and a dustproof drip-proof cover 18 that covers the X-axis moving unit are disposed.
  • the X-axis moving unit includes a pair of X-axis guide rails (not depicted) extending in parallel to each other in the X-axis direction, and the X-axis moving table 16 is mounted for sliding movement on the X-axis guide rails.
  • a nut portion (not depicted) is provided on a lower face side of the X-axis moving table 16 , and an X-axis ball screw (not depicted) extending in parallel to the X-axis guide rails is held in meshing engagement with the nut portion.
  • An X-axis stepping motor (not depicted) is connected to one end portion of the X-axis ball screw.
  • the X-axis stepping motor rotates the X-axis ball screw to move the X-axis moving table 16 in the X-axis direction along the X-axis guide rails.
  • a chuck table 20 for sucking and holding a workpiece 11 is provided on an upper face of the X-axis moving table 16 .
  • the chuck table 20 is connected to a rotational driving source (not depicted) such as a motor such that it rotates around an axis of rotation extending substantially in parallel to the Z-axis direction (vertical direction). Further, the chuck table 20 is moved, by the X-axis moving unit described above, between a loading/unloading region on the front side into and from which a workpiece 11 is loaded and unloaded and a polishing region on the rear side in which the workpiece 11 is polished. An upper face of the chuck table 20 serves as a holding face to and on which a workpiece 11 is sucked and held.
  • This holding face is connected to a suction source (not depicted) through a flow path (not depicted) formed in the inside of the chuck table 20 .
  • a workpiece 11 loaded onto the chuck table 20 by the loading unit 14 is sucked and held by a negative pressure of the suction source acting on the holding face.
  • the Z-axis moving unit 22 includes a pair of Z-axis guide rails 24 extending in parallel to the Z-axis direction, and a Z-axis moving plate 26 is attached for sliding movement to the Z-axis guide rails 24 .
  • a nut portion (not depicted) is provided on a rear face side (back face side) of the Z-axis moving plate 26 , and a Z-axis ball screw 28 extending in parallel to the Z-axis guide rails 24 is held in meshing engagement with the nut portion.
  • a Z-axis stepping motor 30 is connected to one end portion of the Z-axis ball screw 28 . The Z-axis stepping motor 30 rotates the Z-axis ball screw 28 to move the Z-axis moving plate 26 in the Z-axis direction along the Z-axis guide rails 24 .
  • a polishing unit (processing unit) 32 for polishing a workpiece 11 is provided on a front face (surface) of the Z-axis moving plate 26 .
  • the polishing unit 32 includes a tubular spindle housing 34 fixed to the Z-axis moving plate 26 .
  • a spindle 36 serving as a rotary shaft is accommodated in the inside of the spindle housing 34 .
  • a disk-shaped mount 38 is fixed to an end portion (lower end portion) of the spindle 36 that is exposed from the spindle housing 34 , and a polishing pad (processing tool) 40 of a diameter substantially equal to that of the mount 38 is mounted on a lower face of the mount 38 .
  • the polishing pad 40 for dry polishing for which polishing liquid such as slurry is not used is used.
  • a polishing pad 40 for wet polishing may be used instead.
  • a rotational driving source such as a motor is connected such that the polishing pad 40 is rotated by force transmitted from the rotational driving source. Further, the polishing unit 32 is moved down by the Z-axis moving unit 22 described hereinabove to press the polishing pad 40 against an upper face (polishing object face) of a workpiece 11 held on the chuck table 20 .
  • an unloading unit 42 that pivots with a workpiece 11 held thereon is provided.
  • a washing unit 44 for washing a workpiece 11 after polished is disposed in front of the unloading unit 42 but behind the region in which the cassette 10 b is placed.
  • the workpiece 11 washed by the washing unit 44 is transported by the transport unit 8 and is accommodated, for example, into the cassette 10 b .
  • an operation panel 46 for inputting a condition for polishing and so forth is installed.
  • polishing apparatus 2 When a workpiece 11 is to be polished by the polishing apparatus 2 , in a state in which the workpiece 11 is sucked to and held by the chuck table 20 , the chuck table 20 and the polishing pad 40 are rotated relative to each other and the polishing pad 40 is pressed against the upper face of the workpiece 11 . Consequently, the workpiece 11 can be polished. It is to be noted that, although, in the present embodiment, polishing liquid such as slurry is not used, polishing liquid may otherwise be used.
  • the polishing apparatus 2 of the present embodiment includes a cover 52 that covers the chuck table 20 and an end portion (polishing pad 40 ) of the spindle 36 .
  • a processing room (polishing room) in which a workpiece 11 is to be polished is formed by the cover 52 .
  • the processing room is surrounded by a wall 52 a that configures the cover 52 .
  • the chuck table 20 and an end portion of the spindle 36 are accommodated in the processing room.
  • There is no special restriction to the material, shape and so forth of the cover 52 for example, metal such as stainless steel, aluminum or the like can be used to form the cover 52 .
  • An exhaust port (not depicted) extending through the cover 52 between the inside and the outside is formed in part of the wall 52 a of the cover 52 .
  • An exhaust duct 54 disposed outside the cover 52 is connected at one end thereof to the exhaust port.
  • a suction source 56 is connected to the other end of the exhaust duct 54 .
  • the suction source 56 is connected to the exhaust port through the exhaust duct 54 .
  • the suction source 56 has a control switch 58 for controlling generation of suction force. By operating the control switch 58 , it is possible to allow the exhaust port to be acted upon by suction force of the suction source 56 .
  • the suction force of the suction source 56 is caused to act upon the exhaust port such that air including processing waste. (dust) in the processing room is exhausted to the outside of the cover 52 .
  • processing waste generated upon polishing stays in the processing room and does not scatter to the outside of the cover 52 . Meanwhile, on the inner side face of the wall 52 a that configures the cover 52 , processing waste adheres and gradually accumulates. If the processing waste accumulating on the wall 52 a of the cover 52 drops from some reason and enters the gap between the polishing pad 40 and the workpiece 11 , the workpiece 11 will get big scratches.
  • FIG. 2 is a plan view schematically depicting an example of a configuration of the dirty situation indication unit 60 .
  • the dirty situation indication unit 60 includes a transmission window 62 that is a member such as a glass plate or the like that passes visible rays therethrough.
  • the transmission window 62 is fitted in an opening extending through the cover 52 between the inner side and the outer side and configures part of the wall 52 a .
  • processing waste In a situation in which processing waste adheres and accumulates on the inner side face of the wall 52 a , processing waste similarly adheres and accumulates also on the inner side face of the transmission window 62 . If processing waste adheres and accumulates on the inner side face of the transmission window 62 , then the transmittance of the transmission window 62 drops. Therefore, if the state of the transmission window 62 is confirmed, then it can be decided to what degree adhesion and accumulation of processing waste on the wall 52 a proceed.
  • a color sample indication unit 64 that indicates a relationship between the amount of processing waste adhering and accumulating on the transmission window 62 and the color (transmittance) of the transmission window 62 is provided. Further, adjacent the color sample indication unit 64 , a comment 66 according to the amount of processing waste adhering and accumulating on the transmission window 62 is applied. However, the comment 66 may be omitted.
  • the color sample indication unit 64 includes a first indication portion 64 a indicative of a color corresponding to the color of the transmission window 62 in a state in which no processing waste adheres and accumulates, and a second indication portion 64 b indicative of a color corresponding to the color of the transmission window 62 in a state in which processing waste adheres and accumulates a little.
  • the color sample indication unit 64 further includes a third indication portion 64 c indicative of a color corresponding to the color of the transmission window 62 in a state in which much processing waste adheres and accumulates, and a fourth indication portion 64 d indicative of a color corresponding to the color of the transmission window 62 in a state in which very much processing waste adheres and accumulates.
  • a comment 66 is applied alongside of each of the first indication portion 64 a , second indication portion 64 b , third indication portion 64 c and fourth indication portion 64 d .
  • the comment 66 of “OK” indicating that there is no necessity to perform cleaning as yet is applied.
  • the comment 66 of “Now is cleaning time” indicating that it is desirable to perform cleaning now is applied.
  • the comment 66 of “Cleaning as early as possible is desirable” indicating that cleaning is required is applied.
  • the comment 66 of “Clean immediately” indicating that processing waste adhering and accumulating on the wall 52 a may cause a problem with high possibility.
  • the color of the transmission window 62 is close to the color of the first indication portion 64 a , it can be recognized that little processing waste adheres and accumulates on the wall 52 a .
  • the color of the transmission window 62 is close to the color of the second indication portion 64 b , it can be recognized that a little processing waste adheres and accumulates on the wall 52 a .
  • the color of the transmission window 62 is close to the color of the third indication portion 64 c or the fourth indication portion 64 d , it can be recognized that much processing waste adheres and accumulates on the wall 52 a .
  • the operator can consider the comment 66 or the like applied alongside the color sample indication unit 64 to determine a timing at which the cover 52 is to be cleaned.
  • the polishing apparatus (processing apparatus) 2 of the present embodiment includes the dirty situation indication unit 60 that in turn includes the transmission window 62 that is a member that passes visible rays therethrough and the color sample indication unit 64 indicative of a relationship between the amount of processing waste adhering on the transmission window 62 and the color of the transmission window 62 , by visually comparing the transmission window 62 and the color sample indication unit 64 with each other, the degree of adhesion of processing waste on the wall 52 a surrounding the processing room can be decided appropriately.
  • the present invention is not limited to the description of the embodiment and so forth but can be carried out in various modified manners.
  • the embodiment described above is directed to the polishing apparatus 2 that polishes a plate-shaped workpiece 11
  • the processing apparatus of the present invention may be a grinding apparatus that grinds a plate-shaped workpiece 11 .
  • a grinding wheel (processing tool) including a grindstone is mounted on a disk-shaped mount fixed to an end portion of a spindle.
  • the color sample indication unit 64 is configured from the first indication portion 64 a , second indication portion 64 b , third indication portion 64 c and fourth indication portion 64 d for indicating four different states
  • the color sample indication unit in the present invention may be configured otherwise by an indication unit that indicates two, three, five or more different states.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
US16/053,181 2017-08-10 2018-08-02 Processing apparatus Abandoned US20190047116A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017155243A JP2019034347A (ja) 2017-08-10 2017-08-10 加工装置
JP2017-155243 2017-08-10

Publications (1)

Publication Number Publication Date
US20190047116A1 true US20190047116A1 (en) 2019-02-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US16/053,181 Abandoned US20190047116A1 (en) 2017-08-10 2018-08-02 Processing apparatus

Country Status (6)

Country Link
US (1) US20190047116A1 (zh)
JP (1) JP2019034347A (zh)
KR (1) KR20190017671A (zh)
CN (1) CN109382766A (zh)
SG (1) SG10201806315WA (zh)
TW (1) TW201910059A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111805393A (zh) * 2020-06-12 2020-10-23 宁波职业技术学院 一种自动化抛光装置
US20210101254A1 (en) * 2019-10-04 2021-04-08 Disco Corporation Dust collecting treatment apparatus
USD943649S1 (en) * 2020-08-05 2022-02-15 Mao Shan Machinery Industrial Co., Ltd. Dust collection cover of drum sander
US11484985B2 (en) * 2019-05-16 2022-11-01 Disco Corporation Processing apparatus
CN116038499A (zh) * 2023-01-30 2023-05-02 湖南展通通信科技有限公司 一种光纤连接器端面研磨装置

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CN111844400B (zh) * 2020-08-04 2021-08-06 江西建工集团新型材料科技有限公司 一种装配式混凝土预制墙体制作加工机械及加工工艺
JP7592361B2 (ja) * 2020-11-11 2024-12-02 株式会社ディスコ 加工装置
CN112770619B (zh) * 2021-01-05 2022-07-12 北京华迅通信技术有限公司 一种5g射频前端的组装设备及其组装方法

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11484985B2 (en) * 2019-05-16 2022-11-01 Disco Corporation Processing apparatus
US20210101254A1 (en) * 2019-10-04 2021-04-08 Disco Corporation Dust collecting treatment apparatus
US11712780B2 (en) * 2019-10-04 2023-08-01 Disco Corporation Dust collecting treatment apparatus
CN111805393A (zh) * 2020-06-12 2020-10-23 宁波职业技术学院 一种自动化抛光装置
USD943649S1 (en) * 2020-08-05 2022-02-15 Mao Shan Machinery Industrial Co., Ltd. Dust collection cover of drum sander
CN116038499A (zh) * 2023-01-30 2023-05-02 湖南展通通信科技有限公司 一种光纤连接器端面研磨装置

Also Published As

Publication number Publication date
JP2019034347A (ja) 2019-03-07
SG10201806315WA (en) 2019-03-28
KR20190017671A (ko) 2019-02-20
CN109382766A (zh) 2019-02-26
TW201910059A (zh) 2019-03-16

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