US20180356739A1 - Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method - Google Patents

Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method Download PDF

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Publication number: US20180356739A1
Authority: US; United States
Prior art keywords: section; substrate; heads; mask; scales
Prior art date: 2015-09-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

US15/763,818

Other languages

English (en)

Inventor

Yasuo Aoki

Atsushi Hara

Takachika SHIMOYAMA

Toru Kawaguchi

Katsuhiro SHIMATAKE

Iori NODA

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nikon Corp

Original Assignee

Nikon Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-09-30

Filing date

2016-09-29

Publication date

2018-12-13

2016-09-29 Application filed by Nikon Corp filed Critical Nikon Corp

2018-08-21 Assigned to NIKON CORPORATION reassignment NIKON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMATAKE, Katsuhiro, AOKI, YASUO, NODA, Iori, HARA, ATSUSHI, SHIMOYAMA, Takachika, KAWAGUCHI, TORU

2018-12-13 Publication of US20180356739A1 publication Critical patent/US20180356739A1/en

Status Abandoned legal-status Critical Current

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Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/34746—Linear encoders

Definitions

the present invention relates to exposure apparatuses, manufacturing methods of flat-panel displays, device manufacturing methods and exposure methods, and more particularly to an exposure apparatus and an exposure method for exposing an object with an illumination light, and a manufacturing method of flat-panel displays or a device manufacturing method using the exposure apparatus.
a lithography process for manufacturing electronic devices such as liquid crystal display devices and semiconductor devices (integrated circuits and the like
exposure apparatuses such as an exposure apparatus of a step-and-scan method (a so-called scanning stepper (which is also called a scanner)) that, while synchronously moving a mask (a photomask) or a reticle (hereinafter, generically referred to as a “mask”) and a glass plate or a wafer (hereinafter, generically referred to as a “substrate”) along a predetermined scanning direction (a scan direction), transfers a pattern formed on the mask onto the substrate using an energy beam.
a step-and-scan method a so-called scanning stepper (which is also called a scanner)
a mask a photomask
a reticle hereinafter, generically referred to as a “mask”
substrate glass plate or a wafer
such an exposure apparatus is known that is equipped with an optical interferometer system that obtains the position information of a substrate serving as an exposure target, within a horizontal plane, using a bar mirror (a long mirror) that a substrate stage device has (e.g., refer to PTL 1).
an exposure apparatus that exposes an object with an illumination light via a projection optical system
the apparatus comprising: a holding section that holds the object; a position measurement section that includes a measuring section and a measured section, and acquires position information of the holding section based on an output of the measuring section; and a first drive section that relatively moves one of the measuring section and the measured section on the holding section, with respect to the other of the measuring section and the measured section.
a manufacturing method of a flat-panel display comprising: exposing the object using the exposure apparatus related to the first aspect; and developing the object that has been exposed.
a device manufacturing method comprising: exposing the object using the exposure apparatus related to the first aspect; and developing the object that has been exposed.
an exposure method of exposing an object with an illumination light via a projection optical system comprising: acquiring position information of a holding section that holds the object, based on an output of a measuring section of a position measurement section that includes the measuring section and a measured section; and relatively moving one of the measuring section and the measured section on the holding member with respect to the other of the measuring section and the measured section, using a first drive section.
FIG. 1 is a view schematically showing a configuration of a liquid crystal exposure apparatus related to a first embodiment.
FIG. 2A is a view schematically showing a configuration of a mask encoder system equipped in the liquid crystal exposure apparatus shown in FIG. 1
FIG. 2B is an enlarged view of a part (an A part shown in FIG. 2A ) of the mask encoder system.
FIGS. 3A to 3E are views (No. 1 to No. 5) used to explain the linkage processing of head outputs in the mask encoder system and a substrate encoder system.
FIGS. 4A and 4B are concept views (a side view and a plan view, respectively) of the substrate encoder system related to the first embodiment, and FIG. 4C is a view showing a specific example of the substrate encoder system.
FIGS. 5A and 5B are enlarged views of a part (a B part shown in FIG. 4C ) of the substrate encoder system.
FIG. 6 is a concept view of the substrate encoder system.
FIG. 7 is a block diagram showing the input/output relationship of a main controller that centrally configures a control system of the liquid crystal exposure apparatus.
FIG. 8A is a view (No. 1) showing an operation of the mask encoder system at the time of exposure operation
FIG. 8B is a view (No. 1) showing an operation of the substrate encoder system at the time of exposure operation.
FIG. 9A is a view (No. 2) showing an operation of the mask encoder system at the time of exposure operation
FIG. 9B is a view (No. 2) showing an operation of the substrate encoder system at the time of exposure operation.
FIG. 10A is a view (No. 3) showing an operation of the mask encoder system at the time of exposure operation
FIG. 10B is a view (No. 3) showing an operation of the substrate encoder system at the time of exposure operation.
FIGS. 11A and 11B are concept views (a side view and a plan view, respectively) of a substrate encoder system related to a second embodiment, and FIG. 11C is a view showing a specific example of the substrate encoder system.
FIG. 12 is a view showing a modified example of the substrate encoder system of the first embodiment.
FIG. 13 is a view showing a modified example of the substrate encoder system of the second embodiment.
FIGS. 14A and 14B are views (No. 1 and No. 2) used to explain a configuration of a measurement system for obtaining a distance between a pair of heads.
FIGS. 15A and 15B are views (No. 1 and No. 2) used to explain a configuration of a measurement system for obtaining a tilt amount of a Y slide table.
FIG. 16 is a view showing irradiation points of measurement beams on an encoder scale.
FIGS. 1 to 10 B A first embodiment will be described below, using FIGS. 1 to 10 B.
FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 related to the first embodiment.
Liquid crystal exposure apparatus 10 is a projection exposure apparatus of a step-and-scan method, which is a so-called scanner, with a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in, for example, a liquid crystal display device (a flat-panel display) or the like, serving as an object to be exposed.
Liquid crystal exposure apparatus 10 has: an illumination system 12 ; a mask stage device 14 to hold a mask M on which patterns such as a circuit pattern are formed; a projection optical system 16 ; an apparatus main body 18 ; a substrate stage device 20 to hold substrate P whose surface (a surface facing the +Z side in FIG. 1 ) is coated with resist (sensitive agent); a control system thereof; and the like.
a direction in which mask M and substrate P are each scanned relative to projection optical system 16 at the time of exposure is an X-axis direction
a direction orthogonal to the X-axis within a horizontal plane is a Y-axis direction
a direction orthogonal to the X-axis and the Y-axis is a Z-axis direction
rotation directions around the X-axis, the Y-axis and the Z-axis are a ⁇ x direction, a ⁇ y direction and a ⁇ z direction, respectively.
the positions in the X-axis direction, the Y-axis direction and the Z-axis direction are an X-position, a Y-position and a Z-position, respectively.
Illumination system 12 is configured similarly to an illumination system disclosed in, for example, U.S. Pat. No. 5,729,331 and the like. Illumination system 12 irradiates mask M with light emitted from a light source (not illustrated) (e.g. a mercury lamp), as illumination light for exposure (illumination light) IL, via a reflection mirror, a dichroic mirror, a shutter, a wavelength selecting filter, various types of lenses and the like (none of which are illustrated).
a light source not illustrated
illumination light for exposure (illumination light) IL via a reflection mirror, a dichroic mirror, a shutter, a wavelength selecting filter, various types of lenses and the like (none of which are illustrated).
illumination light IL light such as, for example, an i-line (with wavelength of 365 nm), a g-line (with wavelength of 436 nm), and an h-line (with wavelength of 405 nm) (or synthetic light of the i-line, the g-line and the h-line described above) is used.
Mask stage device 14 includes: a mask holder 40 that holds mask M by, for example, vacuum adsorption; a mask driving system 91 (not illustrated in FIG. 1 , see FIG. 7 ) for driving mask holder 40 with a predetermined long stroke in the scanning direction (the X-axis direction), and also finely driving mask holder 40 in the Y-axis direction and the ⁇ z direction as needed; and a mask position measurement system for obtaining the position information within the XY plane (including also rotation amount information in the ⁇ z direction, the same applying hereinafter) of mask holder 40 .
Mask holder 40 is made up of a frame-like member in which an opening section with a rectangular shape in planar view is formed, as disclosed in, for example, U.S.
Mask holder 40 is placed, for example, via air bearings (not illustrated), on a pair of mask guides 42 fixed to an upper mount section 18 a that is a part of apparatus main body 18 .
Mask driving system 91 includes, for example, a linear motor (not illustrated).
the mask position measurement system is equipped with a mask encoder system 48 that includes: a pair of encoder head units 44 (hereinafter, simply referred to as head units 44 ) that are fixed to upper mount section 18 a via encoder bases 43 ; and a plurality of encoder scales 46 (the scales overlap each other in the depth direction of the page surface in FIG. 1 , see FIG. 2A ) that are disposed on the lower surface of mask holder 40 , corresponding to the pair of head units 44 referred to above.
head units 44 that are fixed to upper mount section 18 a via encoder bases 43 ; and a plurality of encoder scales 46 (the scales overlap each other in the depth direction of the page surface in FIG. 1 , see FIG. 2A ) that are disposed on the lower surface of mask holder 40 , corresponding to the pair of head units 44 referred to above.
the configuration of mask encoder system 48 will be described in detail later.
Projection optical system 16 is disposed below mask stage device 14 .
Projection optical system 16 is a so-called multi-lens type projection optical system having a configuration similar to a projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775 and the like, and projection optical system 16 is equipped with a plurality (e.g. eleven in the present embodiment, see FIG. 2A ) of optical systems that are, for example, both-side telecentric unmagnification systems, and form erected normal images.
liquid crystal exposure apparatus 10 when an illumination area on mask M is illuminated with illumination light IL from illumination system 12 , by the illumination light that has passed through mask M, a projected image (a partial erected image) of a circuit pattern of mask M within the illumination area is formed, via projection optical system 16 , on an irradiation area (an exposure area) of the illumination light, on substrate P, that is conjugate with the illumination area. Then, mask M is moved relative to the illumination area (illumination light IL) in the scanning direction and also substrate P is moved relative to the exposure area (illumination light IL) in the scanning direction, and thereby the scanning exposure of one shot area on substrate P is performed and the pattern formed on mask M is transferred onto the shot area.
illumination area illumination light IL
substrate P is moved relative to the exposure area (illumination light IL) in the scanning direction
Apparatus main body 18 supports mask stage device 14 and projection optical system 16 described above, and is installed on a floor 11 of a clean room via a plurality of vibration isolating devices 19 .
Apparatus main body 18 is configured similarly to an apparatus main body as disclosed in, for example, U.S. Patent Application Publication No. 2008/0030702, and apparatus main body 18 has: upper mount section 18 a (which is also referred to as an optical surface plate) that supports projection optical system 16 described above; a lower mount section 18 b; and a pair of middle mount sections 18 c.
Substrate stage device 20 is a device for performing the high accuracy positioning of substrate P relative to projection optical system 16 (illumination light IL), and substrate stage device 20 drives substrate P with a predetermined long stroke along the horizontal plane (the X-axis direction and the Y-axis direction), and also finely drives substrate P in directions of six degrees of freedom.
the configuration of substrate stage device 20 is not particularly limited, it is preferable to use a stage device having a so-called coarse-fine movement configuration that includes a gantry type two-dimensional coarse movement stage and a fine movement stage that is finely driven relative to the two-dimensional coarse movement stage, as disclosed in, for example, U.S. Patent Application Publication No. 2008/0129762 or U.S. Patent Application Publication No. 2012/0057140, and the like.
Substrata stage device 20 is equipped with a Y coarse movement stage 22 Y, an X coarse movement stage 22 X and a substrate holder 34 .
Y coarse movement stage 22 Y is driven with a predetermined long stroke relative to projection optical system 16 in the Y-axis direction via, for example, a Y actuator or the like.
X coarse movement stage 22 x is driven with a predetermined long stroke in the X-axis direction on Y coarse movement stage 22 Y via, for example, an X actuator or the like.
X coarse movement stage 22 X is moved integrally with Y coarse movement stage 22 Y in Y-axis direction.
Substrate holder 34 is made up of a plate-like member with a rectangular shape in planar view and substrate p is placed on the upper surface of substrate holder 34 .
Substrate holder 34 is driven with a predetermined long stroke integrally with X coarse movement stage 22 X relative to projection optical system 16 in the X-axis direction and/or the Y-axis direction and is also finely driven in the directions of six degrees of freedom, by a plurality of fine movement actuators (e.g. voice coil motors).
the Y actuator, the X actuator and the fine movement actuators referred to above configure a part of a substrate driving system 93 (see FIG. 7 ).
liquid crystal exposure apparatus 10 has a substrate position measurement system for obtaining the position information of substrate holder 34 (i.e. substrate P) in the directions of six degrees of freedom.
the substrate position measurement system includes a Z-tilt position measurement system 98 for obtaining the position information of substrate P in the Z-axis direction, the ⁇ x direction and the ⁇ y direction (hereinafter, referred to as Z-tilt directions), and a substrate encoder system 50 for obtaining the position information of substrate P within the XY plane.
Z-tilt position measurement system 98 is not particularly limited, such a measurement system can be used that obtains the position information of substrate P in the Z-tilt directions with apparatus main body 18 (e.g.
lower mount section 18 b serving as a reference, using a plurality of sensors attached to a system including substrate holder 34 , as disclosed in, for example, U.S. Patent Application Publication No. 2010/0018950.
the configuration of substrate encoder system 50 will be described later.
FIGS. 2A and 2B the configuration of mask encoder system 48 will be described using FIGS. 2A and 2B .
a plurality of encoder scales 46 (hereinafter, simply referred to as scales 46 ) are disposed in each of an area on the +Y side and an area on the ⁇ Y side of mask M (to be more detailed, an opening section (not illustrated) for accommodating mask M) on mask holder 40 .
the plurality of scales 46 are illustrated in solid lines and illustrated as if they are disposed on the upper surface of mask holder 40 in FIG.
the plurality of scales 46 are disposed on the lower surface side of mask holder 40 so that the Z-position of the lower surface of each of the plurality of scales 46 and the Z-position of the lower surface (the pattern surface) of mask M coincide with each other, as illustrated in FIG. 1 .
scales 46 are disposed at a predetermined spacing in the X-axis direction, in each of the area on the +Y side and the area on the ⁇ Y side of mask M. That is, mask holder 40 has, for example, a total of six scales 46 .
the plurality of scales 46 are substantially the same except that scales 46 on the +Y side and scales 46 on the ⁇ Y side are disposed vertically symmetric on the page surface.
Scale 46 is made up of a plate-like (band-like) member formed of quartz glass and having a rectangular shape in planar view extending in the X-axis direction.
Mask holder 40 is, for example, formed of ceramic, and the plurality of scales 46 are fixed to mask holder 40 .
an X scale 47 x is formed in an area on one side in the width direction (on the ⁇ Y side in FIG. 2B ) on the lower surface (the surface facing the ⁇ Z side in the present embodiment) of scale 46 .
a Y scale 47 y is formed in an area on the other side in the width direction (on the +Y side in FIG. 2B ) on the lower surface of scale 46 .
X scale 47 x is configured of a reflective diffraction grating (an X grating) having a plurality of grid lines formed at predetermined pitch in the X-axis direction (with the X-axis direction serving as a period direction) and extending in the Y-axis direction.
Y scale 47 y is configured of a reflective diffraction grating (a Y grating) having a plurality of grid lines formed at predetermined pitch in the Y-axis direction (with the Y-axis direction serving as a period direction) and extending in the X-axis direction.
the plurality of grid lines are formed with a spacing of, for example, 10 nm or less. Note that, in FIGS. 2A and 2B , the spacing (the pitch) between the gratings is illustrated remarkably wider than the actual one, for the sake of convenience in illustration. The same applies to the other drawings.
a pair of encoder bases 43 are fixed on the upper surface of upper mount section 18 a.
One of the pair of encoder bases 43 is disposed on the ⁇ X side of mask guide 42 on the +X side, while the other is disposed on the +X side of mask guide 42 on the ⁇ X side (i.e. in an area between the pair of mask guides 42 ).
a part of projection optical system 16 described above is disposed between the pair of encoder bases 43 .
encoder base 43 is made up of a member extending in the X-axis direction.
Encoder head unit 44 (hereinafter, simply referred to as head unit 44 ) is fixed to the central part in the longitudinal direction of each of the pair of encoder bases 43 . That is, head unit 44 is fixed to apparatus main body 18 (see FIG. 1 ) via encoder base 43 . Since the pair of head units 44 are substantially the same except that head unit 44 on the +Y side of mask M and head unit 44 on the ⁇ Y side of mask M are disposed vertically symmetric on the page surface, only one of them (on the ⁇ Y side) will be described below.
head unit 44 has a unit base 45 made up of a plate-like member with a rectangular shape in planar view.
a pair of X heads 49 x disposed spaced apart in the X-axis direction and a pair of Y heads 49 y disposed spaced apart in the X-axis direction are fixed to unit base 45 .
mask encoder system 48 has, for example, four X heads 49 x and also has, for example, four Y heads 49 y. Note that, although one of X heads 49 x and one of Y heads 49 y are accommodated in one housing, and the other of X heads 49 x and the other of Y heads 49 y are accommodated in another housing in FIG.
the pair of X heads 49 x and the pair of Y heads 49 y described above may be disposed independently from each other. Further, the pair of X heads 49 x and the pair of Y heads 49 y are illustrated as if they are disposed above (on the +Z side) of scale 46 in FIG. 2B , in order to facilitate the understanding. In actuality, however, the pair of X heads 49 x and the pair of Y heads 49 y are disposed below X scale 47 y and below Y scale 47 y, respectively (see FIG. 1 ).
unit base 45 itself is formed of a material with a thermal expansion coefficient lower than (or equal to) that of scale 46 so that the distance between the pair of X heads 49 x and the distance between the pair of Y heads 49 y are prevented from changing due to, for example, a change in temperature or the like.
X heads 49 x and Y heads 49 y are encoder heads of a so-called diffraction interference method, like those disclosed in, for example, U.S. Patent Application Publication No. 2008/0094592, and supply displacement amount information of mask holder 40 (i.e. mask M, see FIG. 2A ) to a main controller 90 (see FIG. 7 ), by irradiating the corresponding scales (X scales 47 x and Y scales 47 y ) with measurement beams and receiving the beams from the scales.
the four X heads 49 x and X scales 47 x (which differ depending on the X-position of mask holder 40 ) that face these X heads 49 x configure, for example, four X linear encoders 92 x (not illustrated in FIG. 2B , see FIG. 7 ) for obtaining the position information of mask M in the X-axis direction
the four Y heads 49 y and Y scales 47 y (which differ depending on the X-position of mask holder 40 ) that face these Y heads 49 y configure, for example, four Y linear encoders 92 y (not illustrated in FIG. 2B , see FIG. 7 ) for obtaining the position information of mask M in the Y-axis direction.
Main controller 90 obtains the position information of mask holder 40 (see FIG. 2A ) in the X-axis direction and the Y-axis direction with, for example, a resolution of 10 nm or less, on the basis of the outputs of, for example, the four X linear encoder 92 x and, for example, the four Y linear encoders 92 y, as illustrated in FIG. 7 . Further, main controller 90 obtains the ⁇ z position information (the rotation amount information) of mask holder 40 , on the basis of the outputs of at least two of, for example, the four X linear encoders 92 x (or of, for example, the four Y linear encoders 92 y ). Main controller 90 controls the position of mask holder 40 within the XY plane using mask driving system 91 , on the basis of the position information of mask holder 40 within the XY plane that has been obtained from the measurement values of mask encoder system 48 described above.
mask encoder system 48 at least one of the pair of X heads 49 x constantly faces X scale 47 x, and at least one of the pair of Y heads 49 y constantly faces Y scale 47 y. Consequently, mask encoder system 48 can supply the position information of mask holder 40 (see FIG. 2A ) to main controller 90 (see FIG. 7 ) without interruption.
mask encoder system 48 undergoes transition in the order of the following states: a first state (a state illustrated in FIG. 2B ) where both of the pair of X heads 49 x face X scale 47 x on the +X side of a pair of X scales 47 x adjacent to each other; a second state where X head 49 x on the ⁇ X side faces an area between the forgoing pair of X scales 47 x adjacent to each other (does not face any one of X scales 47 x ) and X head 49 x on the +X side faces the forgoing X scale 47 x on the +X side; a third state where X head 49 x on the ⁇ X side faces X scale 47 x on the ⁇ X side and also X head 49 x on the +X side faces X scale 47 x on the +X side; a fourth state where X head 49 x on
Main controller 90 obtains the X-position information of mask holder 40 on the basis of the average value of the outputs of the pair of X heads 49 x in the first state, the third state and the fifth state described above. Further, main controller 90 obtains the X-position information of mask holder 40 on the basis of only the output of X head 49 x on the +X side in the second state described above, and obtains the X-position information of mask holder 40 on the basis of only the output of X head 49 x on the ⁇ X side in the fourth state described above. Consequently, the measurement values of mask encoder system 48 are not interrupted.
the linkage processing of the outputs of the heads is performed, when the transition is made between: the first, the third and the fifth states described above, i.e., the states where both of the pair of heads face the scale and the output is supplied from each of the pair of heads; and the second and the fourth states described above, i.e., the states where only one of the pair of heads faces the scale and the output is supplied from the only one head.
the linkage processing of the heads will be described below, using FIGS. 3A and 3E .
a two-dimensional grating (a grating) is assumed to be formed on scale 46 in FIGS. 3A to 3E . Further, the outputs of each of heads 49 X and 49 Y are assumed to show the ideal values. Further, in the description below, although the linkage processing regarding a pair of X heads 49 X adjacent to each other (referred to as heads 49 X 1 and 49 X 2 for the sake of convenience) will be described, the similar linkage processing is also performed between a pair of Y heads 49 Y adjacent to each other (referred to as heads 49 Y 1 and 49 Y 2 for the sake of convenience).
each of the pair of X heads 49 X 1 and 49 X 2 obtains the X-position information of mask holder 40 (see FIG. 2A ) using scale 46 2 on the +X side, the pair of X heads 49 X 1 and 49 X 2 both output X-coordinate information.
the outputs of the pair of X heads 49 X 1 and 49 X 2 show the same value.
X head 49 X 1 faces scale 46 1 on the ⁇ X side.
X head 49 X 1 outputs the X-position information of mask holder 40 .
the counting of the output of X head 49 X 1 is resumed from an undefined value (or zero)
the X-position information of X head 49 X 1 cannot be used in computation of the X-position information of mask holder 40 . Consequently, in this state, the linkage processing of the respective outputs of the pair of X heads 49 X 1 and 49 X 2 is needed.
the linkage processing the processing of correcting the output of X head 49 X 1 that shows the undefined value (or zero) using the output of X head 49 X 2 (e.g., so that the outputs show the same value) is performed.
the linkage processing is completed before mask holder 40 is moved further to the +X direction and X head 49 X 2 is out of the measurement range of scale 46 2 , as illustrated in FIG. 3D .
mask holder 40 is moved further to the +X direction, and immediately after each of the pair of X heads 49 X 1 and 49 X 2 comes into a state capable of performing a measurement operation using scale 46 1 , the linkage processing using the output of X head 49 X 1 is performed with respect to X head 49 X 2 . After that, the X-position information of mask holder 40 is obtained on the basis of the output of each of the pair of X heads 49 X 1 and 49 X 2 .
substrate encoder system 50 Next, the configuration of substrate encoder system 50 will be described.
FIGS. 4A and 4B the concept views of substrate encode system 50 are shown.
mask encoder system 48 see FIG. 2A
substrate holder 40 holding a plurality of scales 46 is moved relative to the pair of head units 44 whose positions are fixed
substrate stage device 20 substrate holder 34 in the present embodiment
the pair of head units 60 are capable of being relatively driven with a predetermined stroke with respect to substrate holder 34 (see arrows in FIG. 4B ), by an actuator for head unit driving 68 (see FIG. 7 ) provided at substrate holder 34 .
the type of actuator for head unit driving 68 is not particularly limited, and for example, a linear motor, a feed screw device or the like can be used.
the relative movement of the pair of head units 60 with respect to substrate holder 34 in the X-axis direction is, for example, mechanically restricted. Consequently, when substrate holder 34 is moved with a long stroke in the X-axis direction, the pair of head units 60 are moved with a long stroke integrally with substrate holder 34 in the X-axis direction. However, even when head units 60 and substrate holder 34 are moved integrally with a long stroke in the X-axis direction, the relative movement of the pair of head units 60 with respect to substrate holder 34 in the Y-axis direction is not blocked.
a plurality of scales 56 (which overlap in the depth direction of the page surface in FIG. 1 ) are fixed on the lower surface of upper mount section 18 a.
scale 56 is made up of a member extending in the X-axis direction.
head unit 60 has a plurality of encoder heads (the details of the encoder heads will be described later), similarly to head unit 44 in mask encoder system 48 described above.
main controller 90 controls the Y-positions of head units 60 so that the facing state between head units 60 and scales 56 is maintained.
head units 60 When substrate holder 34 is moved in the X-axis direction in this facing state, head units 60 are also integrally moved in the X-axis direction, and therefore, the facing state between head units 60 and scales 56 is maintained. Consequently, the facing state between head units 60 and scales 56 is maintained irrespective of the position of substrate holder 34 within the XY plane. Head units 60 obtain the position information of head units 60 relative to upper mount section 18 a (see FIG. 1 ) within the XY plane, by a part (the upward heads) of the plurality of encoder heads, using the plurality of scales 56 (see FIG. 4A ).
a pair of recessed sections 36 are formed at substrate holder 34 , and the pair of head units 60 described above are disposed inside the pair of recessed sections 36 , respectively.
a plurality of encoder scales 52 (hereinafter, simply referred to as scales 52 ) are fixed on the bottom surfaces of recessed sections 36 .
Head units 60 obtain the position information of head units 60 themselves relative to substrate holder 34 within the XY plane, by the other part (the downward heads) of the plurality of encoder heads (see FIG. 4A ), using the plurality of scales 52 .
Main controller 90 (see FIG. 7 ) obtains the position information of substrate holder 34 within the XY plane with upper mount section 18 a (see FIG. 1 ) serving as a reference, on the basis of the outputs of the upward heads described above and the outputs of the downward heads described above.
substrate stage device 20 of the present embodiment for example, four scales 52 are disposed at a predetermined spacing in the Y-axis direction, in each of an area on the +X side and an area on the ⁇ X side of substrate P. That is, substrate stage device 20 has, for example, a total of eight scales 52 .
a plurality of scales 52 are substantially the same except that scales 52 on the +X side of substrate P and scales 52 on the ⁇ X side of substrate P are laterally symmetrically disposed on the page surface.
Scale 52 is made up of a plate-like (band-like) member formed of quartz glass and having a rectangular shape in planar view extending in the Y-axis direction, similarly to scale 46 of mask encoder system 48 describe above (see FIG. 2A for each of them).
the position where the plurality of scales 52 are disposed is not limited thereto, and for example, the plurality of scales 52 may be disposed on the outer side of substrate holder 34 , separately from the substrate holder with a predetermined gap in between (however, in a manner such that the plurality of scales 52 are moved integrally with substrate holder 34 in the directions of six degrees of freedom).
an X scale 53 x is formed in an area on one side in a width direction (on the ⁇ X side in FIG. 5A ) on the upper surface of scale 52 .
a Y scale 53 y is formed in an area on the other side in the width direction (on the +X side in FIG. 5A ) on the upper surface of scale 52 . Since the configurations of X scale 53 x and Y scale 53 y are the same as the configurations of X scale 47 x and Y scale 47 y (see FIG. 2B for each of them), respectively, formed on scale 46 of mask encoder system 48 described above (see FIG. 2A for each of them), the description thereof will be omitted.
a plurality of encoder scales 56 (hereinafter, simply referred to as scales 56 ) are fixed.
the Y-positions of scales 56 roughly coincide with the center position of projection optical system 16 in the Y-axis direction, as illustrated in FIG. 1 .
four scales 56 are disposed in an area on the further +X side than projection optical system 16 and, for example, four scales 56 are disposed in an area on the further ⁇ X side than projection optical system 16 , spaced apart from each other in the X-axis direction.
Scale 56 is made up of a plate-like (band-like) member with a rectangular shape in planar view extending in the X-axis direction, and is formed of, for example, quartz glass, which is similar to scales 52 disposed on substrate stage device 20 .
the plurality of scales 56 are illustrated in solid lines and the grating surfaces are illustrated upward (facing the +Z direction) in FIGS. 4C and 5B in order to facilitate the understanding, the grating surfaces of the plurality of scales 56 face downward (the ⁇ Z side) in actuality.
an X scale 57 x is formed in an area on one side in a width direction (on the ⁇ Y side in FIG. 5B ) on the lower surface of scale 56 .
a Y scale 57 y is formed in an area on the other side in the width direction (on the +Y side in FIG. 3C ) on the lower surface of scale 56 . Since the configurations of X scale 57 x and Y scale 57 y are the same as the configurations of X scale 47 x and Y scale 47 y (see FIG. 2B for each of them), respectively, formed on scale 46 of mask encoder system 48 described above (see FIG. 2A for each of them), the description thereof will be omitted.
head unit 60 is equipped with a Y slide table 62 , a pair of X heads 64 x and a pair of Y heads 64 y (see FIG. 5B for each of them), and a pair of X heads 66 x and a pair of Y heads 66 y (see FIG. 5A for each of them).
Y slide table 62 is made up of a plate-like member with a rectangular shape in planar view, and is attached to substrate holder 34 (see FIG. 4C ) via, for example, a mechanical Y linear guide device (not illustrated).
Each of X heads 64 x, Y heads 64 y (see FIG. 5B ), X heads 66 x and Y heads 66 y (see FIG. 5A ) is an encoder head of a so-called interference method, which is similar to X heads 49 x and Y heads 49 y that mark encoder system 48 described above has (see FIG. 2B for each of them), and is fixed to Y slide table 62 .
the pair of Y heads 64 y, the pair of X heads 64 x, the pair of Y heads 66 y and the pair of X heads 66 x are each fixed to Y slide table 62 so that a distance between the pair of Y heads 64 y, a distance between the pair of X heads 64 x, a distance between the pair of Y heads 66 y and a distance between the pair of X heads 66 x are prevented from changing due to, for example, vibration or the like.
Y slide table 62 itself is formed of a material with a thermal expansion coefficient lower than that of scales 52 and 56 (or equal to that of scales 52 and 56 ) so that the distances between the pair of Y heads 64 y, between the pair of X heads 64 x, between the pair of Y heads 66 y and between the pair of X heads 66 x are prevented from changing due to, for example, a change in temperature.
the pair of X heads 64 x (the upward heads) respectively irradiate two places (two points) spaced apart from each other in the X-axis direction on X scale 57 x with measurement beams
the pair of Y heads 64 y (the upward heads) respectively irradiate two places (two points) spaced apart from each other in the X-axis direction on Y scale 57 y with measurement beams.
X heads 64 x and Y heads 64 y described above receive the beams from the corresponding scales, thereby supplying displacement amount information of Y slide table 62 (not illustrated in FIG. 6 , see FIGS. 4 and 5 ) to main controller 90 (see FIG. 7 ).
substrate encoder system 50 for example, four (two by two) X heads 64 x and X scales 57 x (which differ depending on the X-position of Y slide tables 62 ) that face the X heads 64 x configure, for example, four X linear encoders 94 x (see FIG. 7 ) for obtaining the position information in the X-axis direction of each of a pair of Y slide tables 62 (i.e. the pair of head units 60 (see FIG. 4C )) relative to projection optical system 16 (see FIG.
Y heads 64 y and Y scales 57 y which differ depending on the X-position of Y slide tables 62 ) that face the Y heads 64 y configure, for example, four Y linear encoders 94 y (see FIG. 7 ) for obtaining the position information in the Y-axis direction of each of the pair of Y slide tables 62 relative to projection optical system 16 .
main controller 90 obtains the position information of each of the pair of head units 60 (see FIG. 4C ) in the X-axis direction and the Y-axis direction with, for example, a resolution of 10 nm or less, on the basis of the outputs of, for example, the four X linear encoders 94 x and, for example, the four Y linear encoders 94 y. Further, on the basis of the outputs of, for example, the two X linear encoders 94 x (or for example, the two Y linear encoders 94 y ) corresponding to one head unit 60 , main controller 90 obtains the ⁇ z position information (the rotation amount information) of that head unit 60 . On the basis of the position information of each of the pair of head units 60 within the XY plane, main controller 90 controls the position of head units 60 within the XY plane using actuator for head unit driving 68 (see FIG. 7 ).
FIG. 4C for example, four scales 56 are disposed at a predetermined spacing in the X-axis direction in each of an area on the +X side and an area on the ⁇ X side of projection optical system 16 .
a spacing between the pair of X heads 64 x and a spacing between the pair of Y heads 64 y that one head unit 60 has are set wider than a spacing between scales 56 adjacent to each other, as illustrated in FIG. 5B .
substrate encoder system 50 at least one of the pair of X heads 64 x constantly faces X scale 57 x, and at least one of the pair of Y heads 64 y constantly faces Y scale 57 y.
substrate encoder system 50 can obtain the position information of Y slide table 62 without interrupting the measurement values. Therefore, also in this case, the linkage processing of the head outputs (see FIGS. 3A to 3E ), similar to the linkage processing of the head outputs in mask encoder system 48 described above, is performed.
the pair of X heads 66 x (the downward heads) irradiate two places (two points) spaced apart from each other in the Y-axis direction on X scale 53 x with measurement beams, respectively
the pair of Y heads 66 y (the downward heads) irradiate two places (two points) spaced apart from each other in the Y-axis direction on Y scale 53 y with measurement beams, respectively.
X heads 66 x and Y heads 66 y described above receive the beams from the corresponding scales, thereby supplying the relative displacement amount information between head unit 60 and substrate holder 34 (not illustrated in FIG. 6 , see FIG. 1 ) to main controller 90 (see FIG. 7 ).
substrate encoder system 50 for example, four (two by two) X heads 66 x and X scales 53 x (which differ depending on the Y-position of substrate holder 34 ) that face the X heads 66 x configure, for example, four X linear encoders 96 x (not illustrated in FIG. 6 , see FIG.
main controller 90 obtains the position information of substrate holder 34 (see FIG. 1 ) relative to apparatus main body 18 (see FIG. 1 ) in the X-axis direction and the Y-axis direction with a resolution of, for example, 10 nm or less, on the basis of the outputs of, for example, the four X linear encoders 94 x and, for example, of the four Y linear encoders 94 y, and the outputs of the four X linear encoders 96 x described above and, for example, the four Y linear encoders 96 y, i.e., on the basis of the computation result of the position information of each of the pair of head units 60 relative to projection optical system 16 (see FIG.
main controller 90 obtains the relative position information (rotation amount information) in the ⁇ z direction between head units 60 and substrate holder 34 , on the basis of the outputs of at least two of, for example, the four X linear encoders 94 x (or, for example, the four Y linear encoders 94 y ).
Main controller 90 controls the position of substrate holder 34 within the XY plane using substrate driving system 93 , on the basis of the position information of substrate holder 34 within the XY plane obtained from the measurement value of substrate encoder system 50 described above.
substrate holder 34 for example, four scales 52 are disposed at predetermined spacing in each of an area on the +X side and an area on the ⁇ X side of substrate P, as described above. And, similarly to mask encoder system 48 described above, a spacing between the pair of X heads 66 x and a spacing between the pair of Y heads 66 y that one head unit 60 has are set wider than a spacing between scales 52 adjacent to each other, as illustrated in FIG. 5A . Accordingly, in substrate encoder system 50 , at least one of the pair of X heads 66 x constantly faces X scale 53 x and also at least one of the pair of Y heads 66 y constantly faces Y scale 53 y.
the linkage processing of the head outputs (see FIGS. 3A to 3E ), similar to the linkage processing of the head outputs in mask encoder system 48 described above, is performed.
FIG. 7 a block diagram is illustrated that shows the input/output relationship of main controller 90 that centrally configures the control system of liquid crystal exposure apparatus 10 (see FIG. 1 ) and performs the overall control of the respective constituents.
Main controller 90 includes a workstation (or a microcomputer) and the like, and performs the overall control of the respective constituents of liquid crystal exposure apparatus 10 .
liquid crystal exposure apparatus 10 configured as described above, under the control of main controller 90 (see FIG. 7 ), mask M is loaded onto mask stage device 14 by a mask loader (not illustrated) and also substrate P is loaded onto substrate stage device 20 (substrate holder 34 ) by a substrate loader (not illustrated).
main controller 90 implements alignment measurement using an alignment detection system (not illustrated), and after the alignment measurement is finished, the exposure operations of a step-and-scan method are sequentially performed with respect to a plurality of shot areas set on substrate P.
FIGS. 8A to 15B an example of operations of mask stage device 14 and substrate stage device 20 at the time of exposure operation will be described using FIGS. 8A to 15B .
the case where four shot areas are set on one substrate P the so-called case of preparing four areas
the number and the arrangement of the shot areas set on one substrate P can be changed as needed.
Mask stage device 14 after an alignment operation has been completed is illustrated in FIG. 8A
substrate stage device 20 after an alignment operation has been completed is illustrated in FIG. 8B
the exposure processing is performed from a first shot area S 1 set on the ⁇ Y side on the +X side of substrate P.
the positioning of mask M is performed on the basis of the output of mask encoder system 48 (see FIG. 7 ) so that the +X side end of mask M is slightly on the further ⁇ X side than the illumination area irradiated with illumination light IL from illumination system 12 (see FIG. 1 for each of them) (however, in the state illustrated in FIG. 8A , illumination light IL has not yet been irradiated on mask M).
the +X side end of a pattern area of mask M is located on the ⁇ X side with respect to the illumination area, by a run-up distance necessary for performing scanning exposure at a predetermined velocity (i.e., an acceleration distance necessary for attaining the predetermined velocity), and scales 46 are provided so that the position of mask M can be measured by mask encoder system 48 in such a location.
Main controller 90 (see FIG. 7 ) also performs the position control of mask holder 40 in a range where at least three heads (at least three of the four heads 49 x and the four heads 49 y ) do not move off from scales 46 (do not move out of a measurable range).
substrate stage device 20 as illustrated in FIG. 8B , the positioning of substrate P is performed on the basis of the output of substrate encoder system 50 (see FIG. 7 ) so that the +X side end of the first shot area S 1 is slightly on the further ⁇ X side than the exposure area irradiated with illumination light IL from projection optical system 16 (see FIG. 1 ) (however, in the state illustrated in FIG. 8B , illumination light IL has not yet been irradiated on substrate P).
the +X side end of the first shot area S 1 of substrate P is located on the ⁇ X side with respect to the exposure area, by a run-up distance necessary for performing scanning exposure at a predetermined velocity (i.e., an acceleration distance necessary for attaining the predetermined velocity), and scales 52 are provided so that the position of substrate P can be measured by substrate encoder system 50 in such a location.
Main controller 90 (see FIG. 7 ) also performs the position control of substrate holder 34 in a range where at least three heads (at least three of the four heads 64 x and the four heads 64 y ) do not move off from scales 56 (do not move out of a measurable range). Note that, in FIG.
head unit 60 on the +X side does not face scales 56 , but the position within the XY plane of head unit 60 on the +X side can be controlled by driving head unit 60 on the +X side synchronously with head unit 60 on the ⁇ X side.
scale(s) 56 may be additionally provided so that the pair of head units 60 never move off from scales 56 .
scales 46 and 56 are provided so that the positions of mask M and substrate P can be measured by mask encoder system 48 and substrate encoder system 50 , respectively, until mask M and substrate P are further moved by a deceleration distance necessary for decelerating mask M and substrate P from the velocity at the time of scanning exposure to a predetermined velocity.
the positions of mask M and substrate P may each be measured by another measurement system that is different from mask encoder system 48 and substrate encoder system 50 .
mask holder 40 is driven (accelerated, driven at a constant speed, and decelerated) to the +X direction, as illustrated in FIG. 9A , and synchronously with mask holder 40 , substrate holder 34 is also driven (accelerated, driven at a constant speed, and decelerated) to the +X direction, as illustrated in FIG. 9B .
main controller 90 (see FIG. 7 ) performs position control of mask M on the basis of the output of mask encoder system 48 (see FIG. 7 ), and also performs position control of substrate P on the basis of the output of substrate encoder system 50 (see FIG. 7 ).
the pair of head units 60 are not relatively moved with respect to substrate holder 34 (are in a static state with respect to substrate holder 34 ), but are moved integrally with substrate holder 34 in the X-axis direction. That is, the position control related to the scan direction of substrate holder 34 (substrate P) and the pair of head units 60 (a plurality of heads 64 x, 64 y, 66 x and 66 y ) is performed by a common drive system (substrate driving system 93 ) (see FIG. 7 )).
substrate driving system 93 substrate driving system
substrate holder 34 is driven to the ⁇ Y direction (Y-step) by a predetermined distance (a distance that is substantially a half of a width direction size of substrate P) on the basis of the output of substrate encoder system 50 (see FIG. 7 ), for the exposure operation to a second shot area S 2 set on the +Y side of the first shot area S 1 .
mask holder 40 is, as illustrated in FIG. 10A , static in a state where the ⁇ X side end of mask M is located on the slightly further +X side than the illumination area (however, in the state shown in FIG. 10A , mask M is not illuminated).
the pair of head units 60 are driven relative to mask holder 40 to the +Y direction (i.e., a direction opposite to substrate holder 34 ) by a distance that is the same as a distance along which mask holder 40 is driven, on the basis of the output of Y linear encoder 96 y (see FIG. 7 ).
head units 60 are not moved in the Y-axis direction relative to projection optical system 16 . Consequently, the facing state between head units 60 and scales 56 is maintained.
mask holder 40 is driven to the ⁇ X direction on the basis of the output of mask encoder system 48 (see FIG. 7 ), and synchronously with mask holder 40 , substrate holder 34 is driven to the ⁇ X direction on the basis of the output of substrate encoder system 50 (see FIG. 7 ). Accordingly, the mask pattern is transferred onto the second shot area S 2 . Also on this occasion, for example, four head units 60 are in a static state. After that, the scan operation of mask holder 40 , the Y-step operation of substrate holder 34 and the scan operation of substrate holder 34 described above are repeated as needed, and thereby the mask pattern is sequentially transferred onto the plurality of shot areas on substrate P.
the pair of head units 60 are driven by the same distance in a direction opposite to substrate holder 34 so that the facing state with scales 56 is maintained.
Y scale 53 y has a plurality of grid lines extending in the X-axis direction. Further, as illustrated in FIG. 16 , an irradiation point 66 y (to be described using the same reference sign as the Y head for the sake of convenience) of the measurement beam irradiated from Y head 66 y onto Y scale 53 y has an oval shape with the Y-axis direction serving as a long axis direction.
Y linear encoder 94 y see FIG.
main controller 90 controls the positions in the stepping direction (the Y-position) of head units 60 so that Y head 66 y that head unit 60 (see FIG. 4B ) has does not cross a plurality of grid lines that form Y scale 53 y, i.e., so that the output from Y head 66 y is not changed (the change is zero).
the Y-position of Y head 66 y is measured by a sensor with a resolution higher than the pitch between the grid lines that configure Y scale 53 y, and immediately before the irradiation point of the measurement beam from the Y head 66 y is about to cross the grid lines (the output of Y head 66 y is about to be changed), the Y-position of Y head 66 y is controlled via head unit driving system 86 (see FIG. 6 ).
the drive control of Y head 66 y may be performed in response, thereby substantially preventing the output from Y head 66 y from being changed.
the sensor to measure the Y-position of Y head 66 y is unnecessary.
the exchange of substrate P is performed at a predetermined substrate exchange position.
the substrate exchange position is set in a location spaced apart from an area directly under projection optical system 16 so that the substrate exchange is not blocked by projection optical system 16 , and therefore, when substrate holder 34 is moved to the substrate exchange position, there is a risk that X heads 64 x and Y heads 64 y attached to head unit 60 move off from (come into a non-facing state with) scales 56 fixed to apparatus main body and the output of substrate encoder system 50 is discontinued.
a scale (a mark) for the plate exchange time is provided at apparatus main body 18 .
liquid crystal exposure apparatus 10 related to the present embodiment, in each of mask encoder system 48 for obtaining the position information of mask M within the XY plane and substrate encoder system 50 for obtaining the position information of substrate P within the XY plane (see FIG. 1 for each of them), the optical path lengths of the measurement beams irradiated to the corresponding scales are short, and therefore, the influence of air fluctuation can be reduced, for example, compared with a conventional interferometer system. Consequently, the positioning accuracy of mask M and substrate P is improved. Further, since the influence of air fluctuation is small, a partial air conditioning equipment that is essential in the case of using the conventional interferometer system can be omitted, which allows the cost to be reduced.
a large and heavy bar mirror needs to be equipped in mask stage device 14 and substrate stage device 20 .
a system including mask holder 40 and a system including substrate holder 34 are each downsized and lightened and also the better weight balance is obtained, and accordingly the position controllability of mask M and substrate P is improved.
the points to be adjusted can be decreased, compared with the case of using the interferometer systems, which leads to the cost reduction of mask stage device 14 and substrate stage device 20 and further leads to the improved maintainability.
the adjustment at the time of assembly becomes easier (or unnecessary).
substrate encoder system 50 since the facing state between head units 60 and scales 56 is maintained by driving the pair of head units 60 in a direction opposite to substrate P along the Y-axis direction, a plurality of encoder heads need not be disposed along the Y-axis direction on substrate holder 34 (or scales 56 on the apparatus main body 18 side need not be formed with a broad width). Consequently, the configuration of the substrate position measurement system can be simple, which allows the cost to be reduced.
mask encoder system 48 since a configuration is employed in which the position information of mask holder 40 within the XY plane is obtained while switching, as needed, the outputs of a pair of encoder heads (X heads 49 x, Y heads 49 y ) adjacent to each other depending on the X-position of mask holder 40 , the position information of mask holder 40 can be obtained without interruption even if the plurality of scales 46 are disposed at a predetermined spacing (spaced apart from each other) in the X-axis direction.
mask encoder system 48 is especially suitable for liquid crystal exposure apparatus 10 using mask M with a large size as in the present embodiment.
the plurality of scales 52 are disposed in the Y-axis direction and the plurality of scales 56 are disposed in the X-axis direction, each at a predetermined spacing, and therefore, a scale with a length equivalent to the movement stroke of substrate P needs not be prepared, and thus, substrate encoder system 50 is especially suitable for liquid crystal exposure apparatus 10 using substrate P with a large size.
FIGS. 11A to 11C a liquid crystal exposure apparatus related to a second embodiment will be described using FIGS. 11A to 11C .
the configuration of the liquid crystal exposure apparatus related to the second embodiment is the same as that in the first embodiment described above except that the configuration of a substrate encoder system 150 is different. Therefore, only the differences will be described below, and elements that have the same configurations and functions as those in the first embodiment described above will be provided with the same reference signs as those in the first embodiment described above, and the description thereof will be omitted.
a configuration is employed in which the step movement of the pair of head units 60 , that substrate stage device 20 (substrate holder 34 ) has, in a direction opposite to substrate P is performed at the time the Y-step operation of substrate P, and the pair of head units 60 are moved integrally with substrate P in the scan direction
a configuration is employed in which the Y-step operation of the pair of head units 60 integrally with substrate P is performed at the time of the Y-step operation of substrate P and the pair of head units 60 are moved with a long stroke in a direction opposite to substrate P at the time of the scan exposure operation of substrate P, which is reverse to the first embodiment described above. Consequently, the arrangement, in which head units 60 , scales 52 and scales 56 and the like that configure substrate encoder system 50 are rotated around the Z-axis, for example, at an angle of 90 degrees with respect to the first embodiment described above, is employed.
FIGS. 11A and 11B the concept views of substrate encoder system 150 of the second embodiment are shown.
Recessed sections 36 formed at substrate holder 34 extend in the X-axis direction, and on the bottom surfaces of the recessed sections, scales 52 extending in the X-axis direction are fixed.
head units 60 are disposed in recessed sections 36 , and are movable with a predetermined long stroke relative to substrate holder 34 in the X-axis direction.
scales 56 extending in the Y-axis direction are fixed to apparatus main body 18 (see FIG. 1 ), on the +Y side and the ⁇ Y side of projection optical system 16 (see FIG. 11C ).
each of an area on the +Y side and an area on the ⁇ Y side of substrate holder 34 for example, five scales 52 are disposed at a predetermined spacing in the X-axis direction, and in each of an area on the +Y side and an area on the ⁇ Y side of projection optical system 16 , on the lower surface of apparatus main body 18 (see FIG. 1 ), for example, two scales 56 are disposed at a predetermined spacing. Since the second embodiment is similar to the first embodiment described above in that X scales 53 x and Y scales 53 y (see FIG. 6 ) are formed on scales 52 , and X scales 57 x and Y scales 57 y (see FIG.
the second embodiment is similar to the first embodiment described above also in that the linkage processing is performed between a pair of heads adjacent to each other because a plurality of scales are disposed spaced apart from each other.
the pair of head units 60 are driven along the X-axis direction in a direction opposite to substrate P and yet by the same distance as substrate P so that visually the X-positions of the pair of head units 60 are not changed. That is, head units 60 are relatively moved with respect to substrate P in the X direction. Accordingly, since the pair of head units 60 are prevented from moving off from the corresponding scales 56 , the measurement values of substrate encoder system 150 are not interrupted.
substrate holder 34 and the pair of head units 60 are integrally movable with a long stroke in the Y-axis direction by a common drive system (substrate driving system 93 (see FIG. 7 )).
each of the first embodiment and the second embodiment described so far is an example, and can be changed as needed.
the pair of head units 60 are provided at substrate holder 34 , and substrate holder 34 also has the actuator for driving head units 60 in the first embodiment described above, this is not intended to be limiting, and for example, as illustrated in FIG. 12 , head units 60 may be supported in a suspended manner by upper mount section 18 a of apparatus main body 18 .
head units 60 are attached to apparatus main body 18 via guide devices 256 that straightly guide head units 60 in the X-axis direction.
a substrate stage device 220 is configured such that Y coarse movement stage 22 y is placed on X coarse movement stage 22 X.
scales 52 are disposed on the outer side of substrate holder 34 in FIG. 12 , scales 52 may be disposed on substrate holder 34 (or in substrate holder 34 ) similarly to the first embodiment described above.
the pair of head units 60 are moved integrally with X coarse movement stage 22 X relative to the projection optical system in the X-axis direction, via arm members 222 .
substrate holder 34 and the pair of head units 60 are driven by a common drive system (the X actuator configuring a part of substrate driving system 93 (see FIG. 7 )).
head units 60 of the present modified example are the same as those in the first embodiment described above. According to the present modified example, since actuators exclusively used for driving head units 60 are not necessary, the heat generation or the dust generation in the vicinity of substrate P can be suppressed.
the pair of head units 60 are provided at substrate holder 34 and substrate holder 34 also has the actuator for driving head units 60 , but this is not intended to be limiting, and as illustrated in FIG. 13 , head units 60 may be supported in a suspended manner by upper mount section 18 a of apparatus main body 18 .
head units 60 are attached to apparatus main body 18 via guide devices 256 .
X coarse movement stage 22 X is placed on Y coarse movement stage 22 Y
the pair of arm members 222 connected to the pair of head units 60 are connected to Y coarse movement stage 22 Y.
scales 52 may be disposed on substrate holder (or in substrate holder 34 ).
the pair of head units 60 are moved integrally with Y coarse movement stage 22 Y relative to the projection optical system in the Y-axis direction, via arm members 222 .
substrate holder 34 and the pair of head units 60 are driven by a common drive system (the Y actuator configuring a part of substrate driving system 93 (see FIG. 7 )).
head units 60 in the present modified example are the same as those in the second embodiment described above. According to the present modified example, since actuators exclusively used for driving head units 60 are not necessary, the heat generation or the dust generation in the vicinity of substrate P can be suppressed.
the distances between the respective pairs of encoder heads that head unit 60 has may be measured by sensors 164 and 166 , and the output of substrate encoder system 50 may be corrected using the measurement values.
the type of sensors 164 and 166 is not particularly limited, and for example, a laser interferometer or the like can be used.
Y slide table 62 to which the heads are attached is made of, for example, a material less affected by thermal expansion or the like.
the position information of substrate P can be obtained with high accuracy by measuring the distances between the encoder heads as in the present modified example, even if Y slide table 62 is deformed (the distance between a pair of encoder heads is changed).
the distances between the respective pairs of encoder heads may be measured, and the output of mask encoder system 48 may be corrected using the measurement values.
heads 49 x and 49 y of mask encoder system 48 may be measured, and the relative positional relationships between all (e.g. a total of eight in the present embodiment) of the heads (the pairs of downward heads 66 x and 66 y, and the pairs of upward heads 64 x and 64 y ) may be each measured, and the measurement values may be corrected.
a calibration operation may be performed in which the distances between the respective pairs of encoder heads that head unit 60 has (i.e., the respective distances between a pair of X heads 64 x, between a pair of X heads 66 x, between a pair of Y heads 64 y and between a pair of Y heads 66 Y) are measured as needed (e.g., at every substrate exchange). Further, separately from a calibration point for performing the foregoing measurement of the distances between the heads, another calibration point for performing the positioning of the origins of the respective outputs of mask encoder system 48 and substrate encoder system 50 may be provided.
positioning marks for performing the positioning of the origins may be disposed on the extended lines of (on the outer side of) the plurality of scales 46 and 52 , or may be disposed between a pair of scales 46 adjacent to each other and a pair of scales 52 adjacent to each other, or may be formed in scales 46 and 52 .
the amount of tilt (inclination in the ⁇ x direction and the ⁇ y direction) of Y slide table 62 , to which each of encoder heads 64 x, 64 y, 66 x and 66 y is attached, with respect to the horizontal plane may be obtained, and the output of substrate encoder system 50 may be corrected in accordance with the tilt amount (the inclined amount of the optical axis of each of heads 64 x, 64 y, 66 x and 66 y ).
a measurement system as illustrated in FIG. 15A , a measurement system in which a plurality of Z sensors 64 z are attached to Y slide table 62 and the tilt amount of Y slide table 62 is obtained with upper mount section 18 a serving as a reference can be used.
a biaxial laser interferometer 264 may be provided at substrate holder 34 (see FIG. 1 ), and the tilt amount (the inclination amount in the ⁇ x direction and the ⁇ y direction) and the rotation amount (the rotation amount in the ⁇ z direction) of Y slide table 62 may be obtained. Further, the tilt amount of each of encoder heads 64 x, 64 y, 66 x and 66 y may be individually measured.
X linear encoders 92 x and Y linear encoders 92 y for obtaining the position information of mask holder 40 may have a configuration in which the encoder heads are attached to mask holder 40 and the scales are attached to encoder base 43 .
the scales may be attached to Y slide table 62 and the encoder heads may be attached to substrate holder 34 .
the encoder heads attached to substrate holder 34 should be disposed at a plurality of positions along the Y-axis direction (in the case of the first embodiment) or the X-axis direction (in the case of the second embodiment), and should be configured capable of performing the switching operation mutually.
the scales may be attached to Y slide table 62 and the encoder heads may be attached to apparatus main body 18 .
the encoder heads attached to encoder base 54 should be disposed at a plurality of positions along the X-axis direction (in the case of the first embodiment) or the Y-axis direction (in the case of the second embodiment), and should be configured capable of performing the switching operation mutually.
the scales fixed to Y slide table 62 may be shared.
the three scales 46 are disposed spaced apart in the X-axis direction in mask encoder system 48
the four scales 52 are disposed spaced apart in the Y-axis direction
the four scales 56 are disposed spaced apart in the X-axis direction in substrate encoder system 50 of the first embodiment.
the number of the scales is not limited thereto, and can be changed as needed, depending on, for example, the size of mask M, the size of substrate P or the movement strokes.
the plurality of scales need not necessarily be disposed spaced apart, and for example, one longer scale (in the embodiments described above, for example, a scale about three times longer than scale 46 , a scale about four times longer than scale 52 , and a sale about four times longer than scale 56 ) may be used.
the respective lengths of the scales may be different from one another.
the length of the scales extending in the X-axis direction is set longer than the length of a shot area in the X-axis direction, and thereby the linkage processing at the time of the scanning exposure operation can be avoided.
a scale disposed on one side of projection optical system 16 and a scale disposed on the other side may have the respective lengths different from each other. And, both the scales may be disposed relatively shifted in the X-axis direction.
the X scales (the grating patterns for X-axis direction measurement illustrated in the drawings) and the Y scales (the grating patterns for Y-axis direction measurement illustrated in the drawings) are provided at members for scales that are independent from each other (e.g., a plurality of scale members disposed on the encoder base).
the plurality of grating patterns may be divided into groups of grating patterns and the groups of grating patterns may be separately formed on the same long member for scales. Further, the grating patterns may be successively formed on the same long member for scales.
the positions of the gaps of the predetermined spacing described above may be disposed not to overlap in the X-axis direction among the plurality of scale rows.
the length of one scale (a pattern for X-axis measurement) in the X-axis direction may be set to a length with which the measurement of only the length of one shot area can be continuously performed (a length along which a device pattern is formed on a substrate by being irradiated when scan exposure is performed while moving the substrate on a substrate holder in the X-axis direction).
the transfer control of heads with respect to a plurality of scales does not have to be performed during the scan exposure of one shot area, and therefore the position measurement (the position control) of substrate P (the substrate holder) during the scan exposure can be performed easily.
the scales with the same length are arranged in line in the embodiments described above, but the scales with lengths different from each other may be arranged in line.
the length in the X-axis direction of scales disposed in the central part may be set physically longer than the length in the X-axis direction of scales disposed near both ends in the X-axis direction (scales disposed at the respective ends in a scale row).
a scale group (a scale row) on substrate holder 34 , in which a plurality of scales are arranged in line via a gap of a predetermined spacing in the X-axis direction
the distance between the plurality of scales in other words, the length of the gap
the length of one scale and two heads that are relatively moved with respect to that scale row are disposed so that the relationship of “the length of one scale>the distance between the heads disposed facing each other>the distance between the scales” is satisfied.
This relationship is satisfied not only between the scales provided on substrate holder 34 and the corresponding heads 60 but also between scales 56 and the corresponding heads 60 .
a given head 60 and a scale row corresponding thereto (a scale row in which a plurality of scales are arranged in line via a predetermined gap in a predetermined direction) are being relatively moved in the X-axis direction
a given set of heads in head 60 e.g. X head 66 x and Y head 66 y in FIG. 6
simultaneously face the gap between the foregoing scales and then simultaneously face another scale (i.e., in the case where heads 66 x and 66 y transfer to another scale)
the initial measurement values of the heads that have transferred need to be computed.
the initial values on the transfer of the heads that have transferred may be computed.
the foregoing yet-another head may be either of a head for position measurement in the X-axis direction or a head for position measurement in the Y-axis direction.
heads 60 are moved synchronously with substrate holder 34 , this means that heads 60 are moved in a state of roughly maintaining the relative positional relationship with substrate holder 34 , and is not limited to the case where heads 60 and substrate holder 34 are moved in a state where the positional relationship between heads 60 and substrate holder 34 , their movement directions, and their movement velocities strictly coincide with each other.
the X scale and the Y scale are independently formed on the surface of each of scales 46 , 52 and 56 , this is not intended to be limiting, and for example, an XY two-dimensional scale may be used.
the encoder head an XY two-dimensional head can be used.
the other encoder such as an encoder of a so-called pick-up method and an encoder of a magnetic method can be used, and a so-called scan encoder that is disclosed in, for example, U.S. Pat. No. 6,639,686 and the like can also be used.
the position information of Y slide table 62 may be obtained by a measurement system (e.g. an optical interferometer system) other than the encoder system.
a plurality of scales 56 are configured to be pasted directly on the lower surface of upper mount section 18 a (the optical surface plate), this is not intended to be limiting, and a predetermined base member may be disposed in a suspended manner in a state spaced apart from the lower surface of upper mount section 18 a, and the plurality of scales 56 may be pasted to the base member.
substrate stage device 20 only has to drive substrate P with a long stroke at least along the horizontal plane, and the fine positioning in the directions of six degrees of freedom needs not be performed according to the circumstances.
the substrate encoder system related to each of the embodiments described above can be suitably applied to such a two-dimensional stage device.
the illumination light may be ultraviolet light such as an ArF excimer laser beam (with a wavelength of 193 nm) or a KrF excimer laser beam (with a wavelength of 248 nm), or vacuum ultraviolet light such as an F 2 laser beam (with a wavelength of 157 nm).
a harmonic wave which is obtained by amplifying a single-wavelength laser beam in the infrared or visible range emitted by, for example, a DFB semiconductor laser or a fiber laser, with a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium), and by converting the wavelength into ultraviolet light using a nonlinear optical crystal, may also be used.
a solid laser (with a wavelength: 355 nm and 266 nm) or the like may be used.
projection optical system 16 is a projection optical system of a multi-lens method equipped with a plurality of optical systems
the number of the projection optical systems is not limited thereto, and one or more of the projection optical systems have only to be provided.
the projection optical system is not limited to the projection optical system of a multi-lens method, but may be a projection optical system using an Offner-type large mirror or the like.
projection optical system 16 may be a magnifying system or a reduction system.
the use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal display devices that transfers a liquid crystal display device pattern onto a square-shaped glass plate, but can be widely applied also to, for example, an exposure apparatus for manufacturing organic EL (Electro-Luminescence) panels, an exposure apparatus for manufacturing semiconductor devices, and an exposure apparatus for manufacturing thin-film magnetic heads, micromachines, DNA chips or the like.
an exposure apparatus for manufacturing organic EL (Electro-Luminescence) panels an exposure apparatus for manufacturing semiconductor devices
an exposure apparatus for manufacturing thin-film magnetic heads, micromachines, DNA chips or the like can be widely applied also to, for example, an exposure apparatus for manufacturing organic EL (Electro-Luminescence) panels, an exposure apparatus for manufacturing semiconductor devices, and an exposure apparatus for manufacturing thin-film magnetic heads, micromachines, DNA chips or the like.
organic EL Electro-Luminescence
each of the embodiments described above can also be applied to an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer or the like, not only when producing microdevices such as semiconductor devices, but also when producing a mask or a reticle used in an exposure apparatus such as an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, or an electron beam exposure apparatus.
an object serving as an exposure target is not limited to a glass plate, but may be other objects such as, for example, a wafer, a ceramic substrate, a film member, or a mask blank.
the thickness of the substrate is not particularly limited, and for example, a film-like member (a sheet-like member with flexibility) is also included. Note that the exposure apparatus of the present embodiments is especially effective in the case where a substrate having a side or a diagonal line with a length of 500 mm or greater is an object to be exposed.
Electronic devices such as liquid crystal display devices (or semiconductor devices) are manufactured through the steps such as: a step in which the function/performance design of a device is performed; a step in which a mask (or a reticle) based on the design step is manufactured; a step in which a glass substrate (or a wafer) is manufactured; a lithography step in which a pattern of the mask (the reticle) is transferred onto the glass substrate with the exposure apparatus in each of the embodiments described above and the exposure method thereof; a development step in which the glass substrate that has been exposed is developed; an etching step in which an exposed member of the other section than a section where resist remains is removed by etching; a resist removal step in which the resist that is no longer necessary when etching is completed is removed; a device assembly step; and an inspection step.
the exposure method described previously is implemented using the exposure apparatus in the embodiments described above and a device pattern is formed on the glass substrate, and therefore, the devices with a high integration degree
the exposure apparatus and the exposure method of the present invention are suitable for exposing objects with illumination light. Further, the manufacturing method of flat-panel displays of the present invention is suitable for production of flat-panel displays. Further, the device manufacturing method of the present invention is suitable for production of microdevices.

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Engineering & Computer Science (AREA)
Environmental & Geological Engineering (AREA)
Epidemiology (AREA)
Public Health (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
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Length Measuring Devices By Optical Means (AREA)

US15/763,818 2015-09-30 2016-09-29 Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method Abandoned US20180356739A1 (en)

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JPWO2017057577A1 (ja)	2018-07-26
CN111650818A (zh)	2020-09-11
US20200183291A1 (en)	2020-06-11
US11126094B2 (en)	2021-09-21
CN111650818B (zh)	2024-03-15
KR20180058734A (ko)	2018-06-01
TWI744251B (zh)	2021-11-01
HK1248832A1 (zh)	2018-10-19
TW201723671A (zh)	2017-07-01
CN108139688A (zh)	2018-06-08
WO2017057577A1 (ja)	2017-04-06
JP6958355B2 (ja)	2021-11-02

Publication	Publication Date	Title
US11126094B2 (en)	2021-09-21	Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method
US11169448B2 (en)	2021-11-09	Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and movable body drive method
US11392048B2 (en)	2022-07-19	Exposure apparatus, flat panel display manufacturing method, and device manufacturing method
US11009799B2 (en)	2021-05-18	Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method
US10935894B2 (en)	2021-03-02	Movable body apparatus, exposure apparatus, manufacturing method of flat-panel display and device manufacturing method, and movement method of object
US10732517B2 (en)	2020-08-04	Exposure apparatus and exposure method, and flat panel display manufacturing method
US20180341183A1 (en)	2018-11-29	Exposure apparatus and exposure method, and flat panel display manufacturing method
JP6855008B2 (ja)	2021-04-07	露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP6744588B2 (ja)	2020-08-19	露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法

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