US20180317325A1

US20180317325A1 - Circuit board and method for manufacturing the same

Info

Publication number: US20180317325A1
Application number: US15/636,790
Authority: US
Inventors: Ke-Jian Wu; Fang-Bo Xu; Peng Wu; Jian-Quan Shen
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2017-04-28
Filing date: 2017-06-29
Publication date: 2018-11-01
Also published as: US20190289723A1; CN108811354A; US11582872B2

Abstract

A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer along a direction perpendicular to the circuit board and a projection of the second conductive wiring layer totally cover each other.

Description

FIELD

The subject matter herein generally relates to a circuit board and a method for manufacturing the circuit board.

BACKGROUND

Circuit boards are widely used in various kinds of electronic devices. The circuit board may have a thick copper layer, which can provide an improved conductivity between electronic elements. However, a copper substrate needs to be etched for a long time to form the thick copper layer, which may also cause the copper substrate to be etched laterally. Thus, a line space and a line width of the thick copper layer need to be increased. However, the circuit board with a large line space and a large line width is not desirable. Improvement in the art is preferred.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.

FIG. 1 is a flowchart of an exemplary embodiment of a method for manufacturing a circuit board.

FIG. 2 is a diagram of a metal substrate, a first dry film, and a second dry film used in the method of FIG. 1.

FIG. 3 is a diagram showing the first dry film and the second dry film being formed on the metal substrate of FIG. 2.

FIG. 4 is a diagram showing the first dry film and the second dry film of FIG. 3 being treated by an exposure process.

FIG. 5 is a diagram showing the first dry film of FIG. 4 being treated by a development process to form a hollow pattern.

FIG. 6 is a diagram showing a first conductive wiring layer being formed in the hollow pattern of FIG. 5.

FIG. 7 is a diagram showing the first dry film and the second dry film of FIG. 6 being removed.

FIG. 8 is a diagram showing a first cover film being formed on the first conductive wiring layer of FIG. 7.

FIG. 9 is a diagram showing a third dry film being formed on the metal substrate of FIG. 8.

FIG. 10 is a diagram showing third dry film of FIG. 9 being treated by an exposure process.

FIG. 11 is a diagram showing a second conductive wiring layer being formed on the third dry film of FIG. 10.

FIG. 12 is a diagram showing a second cover film being formed on the second conductive wiring layer of FIG. 11 to form a circuit board.

DETAILED DESCRIPTION

It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
Referring to FIG. 1, a method for manufacturing a circuit board 100 (see FIG. 12) is presented in accordance with an exemplary embodiment. The method for manufacturing the circuit board 100 is provided by way of example, as there are a variety of ways to carry out the method. The exemplary method can begin at block 201.
At block 101, referring to FIG. 2, a metal substrate 10, a first dry film 20, and a second dry film 30 are provided. The metal substrate 10 comprises a first surface 12 and a second surface 14 facing away from the first surface 12.
In at least one exemplary embodiment, the metal substrate 10 is made of metal or metal alloy, and can be made by cutting a copper block. The metal substrate 10 has a thickness of about 50 μm to about 80 μm. In at least one exemplary embodiment, the metal substrate 10 has a thickness of about 70 μm.
In at least one exemplary embodiment, the first dry film 20 and the second dry film 30 have a similar structure. Each of the first dry film 20 and the second dry film 30 comprises a polyester layer, a photoresist layer, and a polyethylene layer (not shown) stacked together. The first dry film 20 has a thickness greater than a thickness of the second dry film 30. In at least one exemplary embodiment, the first dry film 20 has a thickness of about 75 μm. The second dry film 30 has a thickness of about 15 μm.
At block 102, referring to FIG. 3, the first dry film 20 and the second dry film 30 are respectively formed on the first surface 12 and the second surface 14.
At block 103, referring to FIG. 4, the first dry film 20 and the second dry film 30 are treated by an exposure process.
In at least one exemplary embodiment, the exposure can be carried out by covering a photo mask (not shown) on the first dry film 20 facing away from the metal substrate 10, and exposing the first dry film 20 and the second dry film 30 to ultraviolet radiation, thereby causing the second dry film 30 and an uncovered portion of the first dry film 20 to be exposed under the ultraviolet radiation and be solidified.
At block 104, referring to FIG. 5, the first dry film 20 and the second dry film 30 after the exposure process are treated by a development process, thereby forming a hollow pattern 22 in the first dry film 20 towards the first surface 12.
In at least one exemplary embodiment, the development can be carried out by removing the photo mask, and etching a remaining portion of the first dry film 20 that is not exposed, thereby forming the hollow pattern 22 in the first dry film 20. In at least one exemplary embodiment, the first dry film 20 is etched by a sodium hydroxide solution having a mass concentration of about 1%.
At block 105, referring to FIG. 6, the metal substrate 10 is electroplated to form a first conductive wiring layer 24 in the hollow pattern 22.
In at least one exemplary embodiment, the first conductive wiring layer 24 has a thickness of about 60 μm to about 70 μm. The electroplating can be panel plating that does not require any lead wire and has a simplified process.
At block 106, referring to FIG. 7, the first dry film 20 and the second dry film 30 are removed, thereby exposing a remaining portion of the first surface 12.
The cross-sectional shape of the first conductive wiring layer 24 can be varied as needed. In at least one exemplary embodiment, the cross-sectional shape of the first conductive wiring layer 24 is substantially rectangular.
At block 107, referring to FIG. 8, a first cover film 40 is covered on and fills in gaps of the first conductive wiring layer 24.
In at least one exemplary embodiment, the first cover film 40 comprises a first cover layer 42 and a first adhesive layer 44 connected to the first cover layer 42. The first adhesive layer 44 is between the first cover layer 42 and the first conductive wiring layer 24 and fills in gaps of the first conductive wiring layer 24. The first cover film 40 can be made of liquid crystal polymer (LCP).
At block 108, referring to FIG. 9, a third dry film 50 is covered on the second surface 14.
The third dry film 50 can have a similar structure as the first dry film 20 and the second dry film 30. In at least one exemplary embodiment, the third dry film 50 has a thickness the same as that of the second dry film 30.
At block 109, referring to FIG. 10, the third dry film 50 is treated by an exposure process to form patterns corresponding to the first conductive wiring layer 24.
At block 110, referring to FIG. 11, the metal substrate 10 is treated by a development process through the patterned third dry film 50, thereby completely etching a portion of the metal substrate 10 from the second surface 14 to the first surface 12, to form a second conductive wiring layer 16. Then the third dry film 50 is removed.
The second conductive wiring layer 16 is directly and electrically connected to the first conductive wiring layer 24. A projection of the first conductive wiring layer 24 along a direction perpendicular to the circuit board 100 and a projection of the second conductive wiring layer 16 totally cover each other. The first conductive wiring layer 24 and the second conductive wiring layer 16 cooperatively form a conductive wiring 52. In at least one exemplary embodiment, the second conductive wiring layer 16 has a thickness of about 70 μm. A cross-sectional shape of the second conductive wiring layer 16 is substantially trapezoidal.
At block 111, referring to FIG. 12, a second cover film 60 is covered on and fills in gaps of the second conductive wiring layer 16, thereby forming the circuit board 100.
In at least one exemplary embodiment, the second cover film 60 comprises a second cover layer 62 and a second adhesive layer 64 connected to the second cover layer 62. The second adhesive layer 64 is positioned between the second cover layer 62 and the second conductive wiring layer 16 and fills in gaps of the second conductive wiring layer 16. The second cover film 60 can be made of a material the same as that of the first cover film 40.
In other exemplary embodiments, the first dry film 20, the second dry film 30, and the third dry film 50 can be replaced by liquid photo resist films or fiber resin films, which are made of a photoresisting material.
Referring to FIG. 12, the circuit board 11 comprises a conductive wiring 52. The conductive wiring 52 comprises a first conductive wiring layer 24 and a second conductive wiring layer 16. The first conductive wiring layer 24 is formed by electroplating. The second conductive wiring layer 16 is formed by etching a metal substrate 10. The first conductive wiring layer 24 and the second conductive wiring layer 16 are in direct contact and electrically connected to each other. A projection of the first conductive wiring layer 24 along a direction perpendicular to the circuit board 100 and a projection of the second conductive wiring layer 16 totally cover each other.
The circuit board 100 further comprises a first cover film 40 covering and filling in gaps of the first conductive wiring layer 24, and a second cover film 60 covering and filling in gaps of the second conductive wiring layer 16.
With the above configuration, the second conductive wiring layer 16 is directly formed by etching the metal substrate 10 having a suitable thickness, thereby avoiding under etching during the etching process. Furthermore, the first conductive wiring layer 24 and the second conductive wiring layer 16 are in direct contact and electrically connected to each other to form the conductive wiring 52. A projection of the first conductive wiring layer 24 along a direction perpendicular to the circuit board 100 and a projection of the second conductive wiring layer 16 totally cover each other. Thus, a line space and a line width of the conductive wiring 52 can be decreased.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.

Claims

What is claimed is:

1. A method for manufacturing a circuit board comprising:

providing a metal substrate comprising a first surface and a second surface facing away from the first surface;

electroplating the metal substrate to form a first conductive wiring layer on the first surface; and

completely etching a portion of the metal substrate from the second surface to the first surface, thereby forming a second conductive wiring layer; the first conductive wiring layer and the second conductive wiring layer being direct contact to each other, the first conductive wiring layer and the second conductive wiring layer cooperatively forming a conductive wiring, thereby forming the circuit board;

wherein a projection of the first conductive wiring layer along a direction perpendicular to the circuit board and a projection of the second conductive wiring layer totally cover each other.

2. The method of claim 1, wherein the step of electroplating the metal substrate to form a first conductive wiring layer on the first surface, further comprising:

forming a first dry film and a second dry film on the first surface and the second surface, respectively;

treating the first dry film and the second dry film by an exposure and development process, thereby forming a hollow pattern in the first dry film towards the first surface;

removing the first dry film and the second dry film; and

electroplating the metal substrate to form the first conductive wiring layer in the hollow pattern.

3. The method of claim 2, wherein the step of treating the first dry film and the second dry film by an exposure and development process, further comprising:

covering a photo mask on the first dry film facing away from the metal substrate, and exposing the first dry film and the second dry film to ultraviolet radiation, thereby causing the second dry film and an uncovered portion of the first dry film to be exposed under the ultraviolet radiation;

removing the photo mask and etching a remaining unexposed portion of the first dry film, thereby forming the hollow pattern in the first dry film.

4. The method of claim 2, the first dry film has a thickness greater than a thickness of the second dry film.

5. The method of claim 4, wherein the first dry film has a thickness of about 75 μm, and the second dry film has a thickness of about 15 μm.

6. The method of claim 1, wherein the metal substrate has a thickness of about 50 μm to about 80 μm.

7. The method of claim 1, wherein the first conductive wiring layer has a thickness of about 60 μm to about 70 μm, a cross-sectional shape of the first conductive wiring layer is rectangular.

8. The method of claim 1, further comprising:

covering a first cover film on the first conductive wiring layer and filling the first cover film in gaps of the first conductive wiring layer.

9. The method of claim 8, wherein the first cover film comprises a first cover layer and a first adhesive layer connected to the first cover layer, the first adhesive layer is between the first cover layer and the first conductive wiring layer and fills in the gaps of the first conductive wiring layer.

10. The method of claim 1, wherein the step of completely etching a portion of the metal substrate from the second surface to the first surface, further comprising:

covering a third dry film on the second surface;

treating the third dry film by an exposure process to form patterns corresponding to the first conductive wiring layer;

treating the metal substrate by a development process through the patterned third dry film, thereby completely etching the portion of the metal substrate from the second surface to the first surface to form the second conductive wiring layer; and

removing the third dry film.

11. The method of claim 10, wherein the second conductive wiring layer has a thickness of about 70 μm, and a cross-sectional shape of the second conductive wiring layer is trapezoidal.

12. The method of claim 1, further comprising:

covering a second cover film on the second conductive wiring layer which fills in gaps of the second conductive wiring layer.

13. The method of claim 12, wherein the second cover film comprises a second cover layer and a second adhesive layer connected to the second cover layer, the second adhesive layer is positioned between the second cover layer and the second conductive wiring layer and fills in the gaps of the second conductive wiring layer.

14. A circuit board comprising:

a conductive wiring comprising:

a first conductive wiring layer; and

a second conductive wiring layer;

wherein the first conductive wiring layer and the second conductive wiring layer are in direct contact to each other, a projection of the first conductive wiring layer along a direction perpendicular to the circuit board and a projection of the second conductive wiring layer totally cover each other.

15. The circuit board of claim 14, further comprising a first cover film covering and filling in gaps of the first conductive wiring layer.

16. The circuit board of claim 14, further comprising a second cover film covering and filling in gaps of the second conductive wiring layer.