US20180120149A1 - Image capturing apparatus - Google Patents
Image capturing apparatus Download PDFInfo
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- US20180120149A1 US20180120149A1 US15/826,711 US201715826711A US2018120149A1 US 20180120149 A1 US20180120149 A1 US 20180120149A1 US 201715826711 A US201715826711 A US 201715826711A US 2018120149 A1 US2018120149 A1 US 2018120149A1
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- image capturing
- capturing apparatus
- sensor
- disposed
- transparent substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0059—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/117—Identification of persons
- A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
- A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0437—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using masks, aperture plates, spatial light modulators, spatial filters, e.g. reflective filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/06—Restricting the angle of incident light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4228—Photometry, e.g. photographic exposure meter using electric radiation detectors arrangements with two or more detectors, e.g. for sensitivity compensation
-
- G01S17/026—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/04—Systems determining the presence of a target
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/36—Systems for automatic generation of focusing signals using image sharpness techniques, e.g. image processing techniques for generating autofocus signals
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/18—Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
- A61B2562/185—Optical shielding, e.g. baffles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/005—Diaphragms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/02—Diaphragms
- G03B9/06—Two or more co-operating pivoted blades, e.g. iris type
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/161—Detection; Localisation; Normalisation
- G06V40/165—Detection; Localisation; Normalisation using facial parts and geometric relationships
Definitions
- the invention relates to an optoelectronic apparatus and particularly relates to an image capturing apparatus.
- an identification apparatus for biological characteristics may be categorized into optical, capacitive, ultrasonic and thermal types.
- an optical identification apparatus for biological characteristics includes a light source, a light guide element and a sensor. Light beams emitted by the light source radiates on an object to be identified that is pressed on the light guide element. The sensor receives the light beams reflected by the object to be identified to identify the biological characteristics. During the process of capturing images by the sensor, the light beams reflected by the fingerprints tend to be transmitted to the sensor in a disorganized manner, leading to the captured images of poor quality and influencing the result of identification. Despite some technologies aimed at improving the quality of the captured images, it is still difficult to address the problem of crosstalk effectively through advances in the current technology.
- the invention provides an image capturing apparatus having a good identification capability.
- the image capturing apparatus includes a cover plate, a light source, a sensor and a collimator.
- the sensor is disposed next to the light source.
- the light source and the sensor are located on the same side of the cover plate.
- the collimator is disposed between the cover plate and the sensor and includes a plurality of collimating elements overlapping with each other.
- Each of the collimating elements includes a transparent substrate and a light absorbing layer disposed on the transparent substrate.
- the light absorbing layer includes a plurality of light passing openings.
- the light passing openings expose a plurality of sensing areas of the sensor. Spacing between the light passing openings is S.
- a width of each of the light passing openings is W, and W ⁇ S.
- a transparent substrate thickness of a first collimating element in the collimating elements is T 1
- a transparent substrate thickness of a second collimating element in the collimating elements is T 2
- the image capturing apparatus satisfies:
- a plurality of indentations are formed on a surface of the transparent substrate, and the light absorbing layer is disposed in the indentations of the transparent substrate.
- the image capturing apparatus satisifes:
- the image capturing apparatus satisfies:
- the first collimating element is disposed between the second collimating element and the sensor.
- the second collimating element is disposed between the first collimating element and the sensor.
- the second collimating element includes n transparent substrates overlapping with each other, a thickness of each of the n transparent substrates is less than T 1 , and a total thickness of the n transparent substrates is T 2 .
- the image capturing apparatus further includes a display panel that is disposed between the cover plate and the collimator.
- the image capturing apparatus further includes a band-pass filter layer that is disposed between the display panel and the sensor, and a light emitting spectrum of the light source falls within a transmission spectrum of the band-pass filter layer.
- the display panel is an organic light emitting diode display panel.
- the image capturing apparatus further includes an adhesion layer that is disposed between the n transparent substrates.
- FIG. 1 is a sectional view of an image capturing apparatus according to a first embodiment of the invention.
- FIG. 2 is a top view of a collimator illustrated in FIG. 1 .
- FIGS. 3 to 5 are sectional views of an image capturing apparatus according to second to fourth embodiments of the invention.
- FIG. 1 is a sectional view of an image capturing apparatus according to a first exemplary embodiment of the invention.
- FIG. 2 is a top view of a collimator illustrated in FIG. 1 .
- an image capturing apparatus 100 according to the first exemplary embodiment of the invention is adapted to capture the biological characteristics of an object to be identified 10 .
- the object to be identified 10 is a finger, and biological characteristics are fingerprints or veins, but the object to be identified 10 and the biological characteristics are not limited thereto.
- the object to be identified 10 may be a palm, and the biological characteristics may be palm prints.
- the image capturing apparatus 100 includes a cover plate 110 , a light source 120 , a sensor 130 and a collimator 140 .
- the sensor 130 is disposed next to the light source 120 .
- the light source 120 and the sensor 130 are on the same side of the cover plate 110 .
- the collimator 140 is disposed between the cover plate 110 and the sensor 130 and may be fixed between the cover plate 110 and the sensor 130 through an adhesion layer (not illustrated) or a fixing mechanism (not illustrated).
- the cover plate 110 is adapted to protect elements disposed below, and the cover plate 110 may be a glass substrate or a plastic substrate.
- the glass substrate may be chemically or physically strengthened or not strengthened at all.
- the plastic substrate may be made from polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), or polyimide (PI) or the like, but is not limited thereto.
- the cover plate 110 includes an inner surface SI and an outer surface SO that is opposite to the inner surface SI.
- the inner surface SI of the cover plate 110 is a surface of the cover plate 100 facing toward the sensor 130
- the outer surface SO of the cover plate 110 is a contact surface of the object to be identified 10 .
- the object to be identified 10 contacts the outer surface SO of the cover plate 110 to identify the biological characteristics.
- the light source 120 is adapted to provide a light beam B radiating the object to be identified 10 .
- the light source 120 may include a plurality of light emitting elements 122 . Each of the light emitting elements 122 emits the light beam B toward the object to be identified 10 .
- the light emitting elements 122 may include a light emitting diode, a laser diode or a combination thereof.
- the light beam B may include visible light, invisible light or a combination thereof. Invisible light may be infrared light, but is not limited thereto.
- the sensor 130 is adapted to receive a portion of the light beam B reflected by the object to be identified 10 (i.e. a light beam B 1 with information on fingerprint patterns).
- the sensor 130 may include a charge coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) or other suitable types of image detection elements.
- CCD charge coupled device
- CMOS complementary metal-oxide semiconductor
- the senor 130 may be integrated with a pulse-width modulation circuit.
- the pulse-width modulation circuit controls light emitting time of the light emitting elements 122 and image capturing time of the sensor 130 , so that the light emitting time of the light emitting elements 122 is synchronized with image capturing time of the sensor 130 to achieve accurate control, but the exemplary embodiment is not limited thereto.
- the collimator 140 is adapted to collimate the portion of the light beam B that is reflected by the object to be identified 10 and transmitted toward the sensor 130 .
- the collimator 140 includes a plurality of collimating elements overlapping with each other.
- the collimator 140 includes two collimating elements such as a first collimating element 142 and a second collimating element 144 , and the first collimating element 142 is disposed between the second collimating element 144 and the sensor 130 .
- the number of the collimating elements and the relative location relationship between the collimating elements may vary based on demand, and are not limited to what is illustrated in FIG. 1 .
- Each of the collimating elements includes a transparent substrate and a light absorbing layer disposed on the transparent substrate.
- the first collimating element 142 includes a transparent substrate 1421 and a light absorbing layer 1422 that is disposed on a surface S 1421 S of the transparent substrate 1421 facing toward the sensor 130 and located between the transparent substrate 1421 and the sensor 130 .
- the second collimating element 144 includes a transparent substrate 1441 , a light absorbing layer 1442 and a light absorbing layer 1443 .
- the light absorbing layer 1442 is disposed on a surface S 1441 S of the transparent substrate 1441 facing toward the sensor 130 and located between the transparent substrate 1441 and the transparent substrate 1421
- the light absorbing layer 1443 is disposed on a surface S 1441 C of the transparent substrate 1441 facing toward the cover plate 110 and located between the cover plate 110 and the transparent substrate 1441 .
- the numbers of the transparent substrates and the light absorbing layers, the relative location relationship between the transparent substrate and the light absorbing layer and a method of forming the light absorbing layer can vary based on demand, but are not limited to what is illustrated in FIG. 1 .
- a plurality of indentations C are formed on the surface S 1441 S of the transparent substrate 1441 , and the light absorbing layer 1442 is disposed in the indentations C of the transparent substrate 1441 , allowing an outer surface T 1442 of the light absorbing layer 1442 to line up with a portion of the surface S 1441 S without the indentations C.
- the method of forming the light absorbing layer 1442 may include the following steps: Firstly, the indentations C are formed on the surface S 1441 S of the transparent substrate 1441 ; secondly, light absorbing materials are formed in the indentations C; and afterwards, the light absorbing layer 1442 is formed by curing the light absorbing materials.
- the transparent substrate 1441 and the indentations C may be formed through mold casting with the formation of the indentations C omitted.
- the transparent substrates (such as the transparent substrate 1421 and the transparent substrate 1441 ) provide bearing surfaces for the light absorbing layers (such as the light absorbing layer 1422 , the light absorbing 1442 and the light absorbing layer 1443 ), and the transparent substrates may be glass substrates or plastic substrates.
- the light absorbing layers are configured to absorb large-angle light beams (such as a light beam B 2 or a light beam B 3 ) of the light beam B that are reflected by the object to be identified 10 to collimate the light beams transmitted to the sensor 130 .
- the light absorbing layer exhibits high absorptance and low reflectance to reduce the proportion of the light beams that are transmitted to and reflected by the light absorbing layer and the frequency of the light beams reflected by the light absorbing layer, further effectively reducing the proportion of the large-angle light beams received by the sensor 130 .
- the low reflectance means the reflectance is less than 10% in visible and infrared bands.
- the light absorbing layer may be made from ink with low reflectance, but is not limited thereto.
- the light absorbing layer includes a plurality of light passing openings O.
- the light passing openings O expose a plurality of sensing areas 132 of the sensor 130 .
- the light passing openings O of the light absorbing layer 1422 , the light absorbing layer 1442 and the light absorbing layer 1443 are disposed relative to the sensing areas 132 of the sensor 130 .
- the sensing areas 132 may be places where a plurality of charge coupled devices are located or a plurality of pixel areas of a complementary metal-oxide semiconductor.
- a width of each of the light passing openings O is W, and W ⁇ S.
- a transparent substrate thickness of the first collimating element 142 is T 1
- a transparent substrate thickness of the second collimating element 144 is T 2
- the image capturing apparatus 100 satisfies:
- the transparent substrate thickness of the collimating element refers to a total thickness of all the transparent substrates in the collimating element.
- the first collimating element 142 includes only one transparent substrate (i.e. the transparent substrate 1421 )
- the second collimating element 144 includes only one transparent substrate (i.e. the transparent substrate 1441 ). Therefore, the transparent substrate thickness T 1 of the first collimating element 142 is a thickness of the transparent substrate 1421 , and the transparent substrate thickness T 2 of the second collimating element 144 is a thickness of the transparent substrate 1441 .
- the large-angle light beams i.e. the light beam B 2 and the light beam B 3
- the large-angle light beams are reflected several times between the collimating elements and absorbed by the light absorbing layer to effectively address the problem of crosstalk and enable the image capturing apparatus 100 to have a good identification capability.
- the image capturing apparatus 100 satisfies the condition
- the proportion of the large-angle light beams received by the sensor 130 may be further reduced, and a signal-to-noise ratio increases effectively to help a back end recognize a signal and noise, and thus raise possibilities of successful identification.
- the image capturing apparatus 100 satisfies the condition
- the signal-to-noise ratio may be close to 0.
- FIGS. 3 to 5 illustrate other embodiments of the image capturing apparatus where the same device is denoted by the same reference numeral. Redundant descriptions are not repeated here.
- FIGS. 3 to 5 are sectional views of the image capturing apparatus according to the second to fourth exemplary embodiments of the invention respectively.
- the second collimating element 144 is disposed between the first collimating element 142 and the sensor 130 . Further, the light absorbing layer 1422 of the first collimating element 142 is disposed on a surface S 1421 C of the transparent substrate 1421 facing toward the cover plate 110 and located between the transparent substrate 1421 and the cover plate 110 . The light absorbing layer 1442 of the second collimating element 144 is disposed on the surface S 1441 C of the transparent substrate 1441 facing toward the cover plate 110 and located between the transparent substrate 1441 and the transparent substrate 1421 .
- the light absorbing layer 1443 of the second collimating element 144 is disposed on the surface S 1441 S of the transparent substrate 1441 facing toward the sensor 130 and located between the sensor 130 and the transparent substrate 1441 .
- the indentations C are formed on the surface S 1441 C of the transparent substrate 1441 , and the light absorbing layer 1442 is disposed in the indentations C of the transparent substrate 1441 , allowing the outer surface T 1442 of the light absorbing layer 1442 to line up with a portion of the surface S 1441 C that does not have the indentations C.
- the second collimating element 144 in addition to the transparent substrate 1441 , the light absorbing layer 1442 and the light absorbing layer 1443 , the second collimating element 144 further includes a transparent substrate 1444 and a light absorbing layer 1445 .
- the transparent substrate 1444 is located between the transparent substrate 1441 and the cover plate 110
- the light absorbing layer 1443 is located between the transparent substrate 1441 and the transparent substrate 1444
- the light absorbing layer 1443 and the light absorbing layer 1445 are located on opposite surfaces of the transparent substrate 1444 respectively.
- the indentations C are formed on a surface S 1444 S of the transparent substrate 1444 facing toward the sensor 130 , and the light absorbing layer 1443 is disposed in the indentations C of the transparent substrate 1444 , allowing an outer surface T 1443 of the light absorbing layer 1443 to line up with a portion of the surface S 1444 S that does not have the indentations C.
- a thickness T 2 A of the transparent substrate 1441 and a thickness T 2 B of the transparent substrate 1444 are less than T 1 , and a total thickness of the thickness T 2 A and the thickness T 2 B is T 2 .
- T 2 A+T 2 B T 2 .
- the thickness T 2 A and the thickness T 2 B may be identical or different.
- the second collimating element 144 may include two layers or more of the transparent substrates and three layers or more of the light absorbing layers.
- the first collimating element 142 may include one layer or more of the transparent substrates and two layers or more of the light absorbing layers, and the transparent substrate thickness T 1 of the first collimating element 142 is a total thickness of the one layer or more of the transparent substrates.
- the second collimating element 144 of the image capturing apparatus 200 in FIG. 3 may also improve in the same way as described in the exemplary embodiment. Redundant descriptions are not repeated here.
- the image capturing apparatus 400 further includes a display panel 410 and a band-pass filter layer 420 .
- the display panel 410 is disposed between the cover plate 110 and the collimator 140 and adapted to provide images.
- the display panel 410 may be a thin film transistor liquid crystal display panel (TFT-LCD panel), a micro light emitting diode display panel (Micro LED display panel) or an organic light emitting diode display panel (OLED display panel), but is not limited thereto.
- the band-pass filter layer 420 is disposed between the collimator 140 and the sensor 130 (not illustrated) or between the display panel 410 and the collimator 140 and is configured to let light beams from the light source 120 go through and filter out other light beams to prevent intervention caused by environmental light beams or light beams from the display panel 410 transmitted to the sensor 130 , enhancing the identification capability of the image capturing apparatus 400 .
- the band-pass filter layer 420 may be an infrared band-pass filter layer through which light beams with a wavelength of between 800 nm and 900 nm go through and which filters out other light beams without a wavelength of between 800 nm and 900 nm.
- the light source 120 is an infrared light source with a wavelength of between 800 nm and 900 nm.
- the band-pass filter layer 420 may be a band-pass filter layer 420 through which light beams with a wavelength of between 840 nm and 860 nm or between 890 nm and 990 nm go through, and the light source 120 may be an infrared light source with a wavelength between 840 nm and 860 nm or between 890 nm and 990 nm, but the invention is not limited thereto.
- the image capturing apparatus 200 in FIG. 3 and the image capturing apparatus 300 in FIG. 4 may also further include the display panel 410 and the band-pass filter layer 420 . Redundant descriptions are not repeated here.
- the collimating elements may be fixed to each other through an adhesion layer (not illustrated) or a fixing mechanism (not illustrated).
- the adhesion layer may be formed between the transparent substrates of the collimating elements, so the collimating elements are firmly fixed to each other, but the invention is not limited thereto.
- the adhesion layer may be an optical clear adhesive (OCA) or a die attach film (DAF), but is not limited thereto.
- the image capturing apparatus may further include the display panel and thus provides a biological characteristic identification function and a display function.
- the light source of the image capturing apparatus may be an infrared light source, and the image capturing apparatus may include the infrared band-pass filter layer to prevent intervention caused by the environmental light beams or the light beams from the display panel transmitted to the sensor, enhancing the identification ability of the electronic apparatus.
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Abstract
Description
- This application is a continuation-in-part application of and claims the priority benefit of a prior application serial no. 15/239,842, filed on Aug. 18, 2016, now pending, which claims the priority benefits of U.S. provisional application Ser. No. 62/266,002, filed on Dec. 11, 2015, and Taiwan application serial no. 105122567, filed on Jul. 18, 2016. This application also claims the priority benefits of U.S. provisional application Ser. No. 62/533,632, filed on Jul. 17, 2017 and China application serial no. 201710852899.3, filed on Sep. 20, 2017. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- The invention relates to an optoelectronic apparatus and particularly relates to an image capturing apparatus.
- The type of biometrics includes identification of faces, voices, iris, retina patterns, veins, palm prints and fingerprints. According to different detection methods, an identification apparatus for biological characteristics may be categorized into optical, capacitive, ultrasonic and thermal types. In general, an optical identification apparatus for biological characteristics includes a light source, a light guide element and a sensor. Light beams emitted by the light source radiates on an object to be identified that is pressed on the light guide element. The sensor receives the light beams reflected by the object to be identified to identify the biological characteristics. During the process of capturing images by the sensor, the light beams reflected by the fingerprints tend to be transmitted to the sensor in a disorganized manner, leading to the captured images of poor quality and influencing the result of identification. Despite some technologies aimed at improving the quality of the captured images, it is still difficult to address the problem of crosstalk effectively through advances in the current technology.
- The invention provides an image capturing apparatus having a good identification capability.
- The image capturing apparatus includes a cover plate, a light source, a sensor and a collimator. The sensor is disposed next to the light source. The light source and the sensor are located on the same side of the cover plate. The collimator is disposed between the cover plate and the sensor and includes a plurality of collimating elements overlapping with each other. Each of the collimating elements includes a transparent substrate and a light absorbing layer disposed on the transparent substrate. The light absorbing layer includes a plurality of light passing openings. The light passing openings expose a plurality of sensing areas of the sensor. Spacing between the light passing openings is S. A width of each of the light passing openings is W, and W<S. A transparent substrate thickness of a first collimating element in the collimating elements is T1, a transparent substrate thickness of a second collimating element in the collimating elements is T2, and the image capturing apparatus satisfies:
-
- According to an embodiment of the invention, a plurality of indentations are formed on a surface of the transparent substrate, and the light absorbing layer is disposed in the indentations of the transparent substrate.
- According to an embodiment of the invention, the image capturing apparatus satisifes:
-
- According to an embodiment of the invention, the image capturing apparatus satisfies:
-
- According to an embodiment of the invention, the first collimating element is disposed between the second collimating element and the sensor.
- According to an embodiment of the invention, the second collimating element is disposed between the first collimating element and the sensor.
- According to an embodiment of the invention, the second collimating element includes n transparent substrates overlapping with each other, a thickness of each of the n transparent substrates is less than T1, and a total thickness of the n transparent substrates is T2.
- According to an embodiment of the invention, the image capturing apparatus further includes a display panel that is disposed between the cover plate and the collimator.
- According to an embodiment of the invention, the image capturing apparatus further includes a band-pass filter layer that is disposed between the display panel and the sensor, and a light emitting spectrum of the light source falls within a transmission spectrum of the band-pass filter layer.
- According to an embodiment of the invention, the display panel is an organic light emitting diode display panel.
- According to an embodiment of the invention, the image capturing apparatus further includes an adhesion layer that is disposed between the n transparent substrates.
- In view of the foregoing, for the image capturing apparatus according to the embodiments of the invention, the design of
-
- makes the large-angle light beams reflected several times between the collimating elements and absorbed by the light absorbing layer, addressing the problem of crosswalk effectively and allowing the image capturing apparatus to have a good identification capability.
- In order to make the aforementioned and other features and advantages of the invention comprehensible, several exemplary embodiments accompanied with figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1 is a sectional view of an image capturing apparatus according to a first embodiment of the invention. -
FIG. 2 is a top view of a collimator illustrated inFIG. 1 . -
FIGS. 3 to 5 are sectional views of an image capturing apparatus according to second to fourth embodiments of the invention. - Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.
- Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIG. 1 is a sectional view of an image capturing apparatus according to a first exemplary embodiment of the invention.FIG. 2 is a top view of a collimator illustrated inFIG. 1 . Referring toFIGS. 1 and 2 , animage capturing apparatus 100 according to the first exemplary embodiment of the invention is adapted to capture the biological characteristics of an object to be identified 10. For example, the object to be identified 10 is a finger, and biological characteristics are fingerprints or veins, but the object to be identified 10 and the biological characteristics are not limited thereto. In one exemplary embodiment of the invention, the object to be identified 10 may be a palm, and the biological characteristics may be palm prints. - The
image capturing apparatus 100 includes acover plate 110, alight source 120, asensor 130 and acollimator 140. Thesensor 130 is disposed next to thelight source 120. Thelight source 120 and thesensor 130 are on the same side of thecover plate 110. Thecollimator 140 is disposed between thecover plate 110 and thesensor 130 and may be fixed between thecover plate 110 and thesensor 130 through an adhesion layer (not illustrated) or a fixing mechanism (not illustrated). - The
cover plate 110 is adapted to protect elements disposed below, and thecover plate 110 may be a glass substrate or a plastic substrate. The glass substrate may be chemically or physically strengthened or not strengthened at all. The plastic substrate may be made from polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), or polyimide (PI) or the like, but is not limited thereto. - The
cover plate 110 includes an inner surface SI and an outer surface SO that is opposite to the inner surface SI. The inner surface SI of thecover plate 110 is a surface of thecover plate 100 facing toward thesensor 130, and the outer surface SO of thecover plate 110 is a contact surface of the object to be identified 10. In other words, the object to be identified 10 contacts the outer surface SO of thecover plate 110 to identify the biological characteristics. - The
light source 120 is adapted to provide a light beam B radiating the object to be identified 10. Thelight source 120 may include a plurality oflight emitting elements 122. Each of thelight emitting elements 122 emits the light beam B toward the object to be identified 10. Thelight emitting elements 122 may include a light emitting diode, a laser diode or a combination thereof. Besides, the light beam B may include visible light, invisible light or a combination thereof. Invisible light may be infrared light, but is not limited thereto. - The
sensor 130 is adapted to receive a portion of the light beam B reflected by the object to be identified 10 (i.e. a light beam B1 with information on fingerprint patterns). Thesensor 130 may include a charge coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) or other suitable types of image detection elements. - In one exemplary embodiment of the invention, the
sensor 130 may be integrated with a pulse-width modulation circuit. The pulse-width modulation circuit controls light emitting time of thelight emitting elements 122 and image capturing time of thesensor 130, so that the light emitting time of thelight emitting elements 122 is synchronized with image capturing time of thesensor 130 to achieve accurate control, but the exemplary embodiment is not limited thereto. - The
collimator 140 is adapted to collimate the portion of the light beam B that is reflected by the object to be identified 10 and transmitted toward thesensor 130. Thecollimator 140 includes a plurality of collimating elements overlapping with each other. In the exemplary embodiment, thecollimator 140 includes two collimating elements such as afirst collimating element 142 and asecond collimating element 144, and thefirst collimating element 142 is disposed between thesecond collimating element 144 and thesensor 130. However, for thecollimator 140, the number of the collimating elements and the relative location relationship between the collimating elements may vary based on demand, and are not limited to what is illustrated inFIG. 1 . - Each of the collimating elements includes a transparent substrate and a light absorbing layer disposed on the transparent substrate. For instance, the
first collimating element 142 includes atransparent substrate 1421 and alight absorbing layer 1422 that is disposed on a surface S1421S of thetransparent substrate 1421 facing toward thesensor 130 and located between thetransparent substrate 1421 and thesensor 130. Thesecond collimating element 144 includes atransparent substrate 1441, alight absorbing layer 1442 and alight absorbing layer 1443. The lightabsorbing layer 1442 is disposed on a surface S1441S of thetransparent substrate 1441 facing toward thesensor 130 and located between thetransparent substrate 1441 and thetransparent substrate 1421, and thelight absorbing layer 1443 is disposed on a surface S1441C of thetransparent substrate 1441 facing toward thecover plate 110 and located between thecover plate 110 and thetransparent substrate 1441. - For each of the collimating elements, the numbers of the transparent substrates and the light absorbing layers, the relative location relationship between the transparent substrate and the light absorbing layer and a method of forming the light absorbing layer can vary based on demand, but are not limited to what is illustrated in
FIG. 1 . A plurality of indentations C are formed on the surface S1441S of thetransparent substrate 1441, and thelight absorbing layer 1442 is disposed in the indentations C of thetransparent substrate 1441, allowing an outer surface T1442 of thelight absorbing layer 1442 to line up with a portion of the surface S1441S without the indentations C. The method of forming thelight absorbing layer 1442 may include the following steps: Firstly, the indentations C are formed on the surface S1441S of thetransparent substrate 1441; secondly, light absorbing materials are formed in the indentations C; and afterwards, thelight absorbing layer 1442 is formed by curing the light absorbing materials. In one exemplary embodiment, thetransparent substrate 1441 and the indentations C may be formed through mold casting with the formation of the indentations C omitted. - In each of the collimating elements, the transparent substrates (such as the
transparent substrate 1421 and the transparent substrate 1441) provide bearing surfaces for the light absorbing layers (such as thelight absorbing layer 1422, the light absorbing 1442 and the light absorbing layer 1443), and the transparent substrates may be glass substrates or plastic substrates. The light absorbing layers are configured to absorb large-angle light beams (such as a light beam B2 or a light beam B3) of the light beam B that are reflected by the object to be identified 10 to collimate the light beams transmitted to thesensor 130. The light absorbing layer exhibits high absorptance and low reflectance to reduce the proportion of the light beams that are transmitted to and reflected by the light absorbing layer and the frequency of the light beams reflected by the light absorbing layer, further effectively reducing the proportion of the large-angle light beams received by thesensor 130. The low reflectance means the reflectance is less than 10% in visible and infrared bands. For instance, the light absorbing layer may be made from ink with low reflectance, but is not limited thereto. - In addition, in order to allowed the portion of the light beam B that is reflected by the object to be identified 10 (such as the light beam B1) to be received by the
sensor 130, the light absorbing layer includes a plurality of light passing openings O. The light passing openings O expose a plurality ofsensing areas 132 of thesensor 130. Specifically, the light passing openings O of thelight absorbing layer 1422, thelight absorbing layer 1442 and thelight absorbing layer 1443 are disposed relative to thesensing areas 132 of thesensor 130. Thesensing areas 132 may be places where a plurality of charge coupled devices are located or a plurality of pixel areas of a complementary metal-oxide semiconductor. - Spacing between the light passing openings O is S. A width of each of the light passing openings O is W, and W<S. A transparent substrate thickness of the
first collimating element 142 is T1, a transparent substrate thickness of thesecond collimating element 144 is T2, and theimage capturing apparatus 100 satisfies: -
- The transparent substrate thickness of the collimating element refers to a total thickness of all the transparent substrates in the collimating element. In the exemplary embodiment, the
first collimating element 142 includes only one transparent substrate (i.e. the transparent substrate 1421), and thesecond collimating element 144 includes only one transparent substrate (i.e. the transparent substrate 1441). Therefore, the transparent substrate thickness T1 of thefirst collimating element 142 is a thickness of thetransparent substrate 1421, and the transparent substrate thickness T2 of thesecond collimating element 144 is a thickness of thetransparent substrate 1441. - Under the design of
-
- the large-angle light beams (i.e. the light beam B2 and the light beam B3) are reflected several times between the collimating elements and absorbed by the light absorbing layer to effectively address the problem of crosstalk and enable the
image capturing apparatus 100 to have a good identification capability. In one exemplary embodiment, if theimage capturing apparatus 100 satisfies the condition -
- the proportion of the large-angle light beams received by the
sensor 130 may be further reduced, and a signal-to-noise ratio increases effectively to help a back end recognize a signal and noise, and thus raise possibilities of successful identification. In another exemplary embodiment, if theimage capturing apparatus 100 satisfies the condition -
- the signal-to-noise ratio may be close to 0.
-
FIGS. 3 to 5 illustrate other embodiments of the image capturing apparatus where the same device is denoted by the same reference numeral. Redundant descriptions are not repeated here.FIGS. 3 to 5 are sectional views of the image capturing apparatus according to the second to fourth exemplary embodiments of the invention respectively. - Referring to
FIG. 3 , the main difference between animage capturing apparatus 200 according to the second exemplary embodiment of the invention and theimage capturing apparatus 100 illustrated inFIG. 1 is presented below. In theimage capturing apparatus 200, thesecond collimating element 144 is disposed between thefirst collimating element 142 and thesensor 130. Further, thelight absorbing layer 1422 of thefirst collimating element 142 is disposed on a surface S1421C of thetransparent substrate 1421 facing toward thecover plate 110 and located between thetransparent substrate 1421 and thecover plate 110. The lightabsorbing layer 1442 of thesecond collimating element 144 is disposed on the surface S1441C of thetransparent substrate 1441 facing toward thecover plate 110 and located between thetransparent substrate 1441 and thetransparent substrate 1421. The lightabsorbing layer 1443 of thesecond collimating element 144 is disposed on the surface S1441S of thetransparent substrate 1441 facing toward thesensor 130 and located between thesensor 130 and thetransparent substrate 1441. The indentations C are formed on the surface S1441C of thetransparent substrate 1441, and thelight absorbing layer 1442 is disposed in the indentations C of thetransparent substrate 1441, allowing the outer surface T1442 of thelight absorbing layer 1442 to line up with a portion of the surface S1441C that does not have the indentations C. - Referring to
FIG. 4 , the main difference between animage capturing apparatus 300 according to the third exemplary embodiment of the invention and theimage capturing apparatus 100 illustrated inFIG. 1 is presented below. In theimage capturing apparatus 300, in addition to thetransparent substrate 1441, thelight absorbing layer 1442 and thelight absorbing layer 1443, thesecond collimating element 144 further includes a transparent substrate 1444 and alight absorbing layer 1445. In the exemplary embodiment, the transparent substrate 1444 is located between thetransparent substrate 1441 and thecover plate 110, thelight absorbing layer 1443 is located between thetransparent substrate 1441 and the transparent substrate 1444, and thelight absorbing layer 1443 and thelight absorbing layer 1445 are located on opposite surfaces of the transparent substrate 1444 respectively. The indentations C are formed on a surface S1444S of the transparent substrate 1444 facing toward thesensor 130, and thelight absorbing layer 1443 is disposed in the indentations C of the transparent substrate 1444, allowing an outer surface T1443 of thelight absorbing layer 1443 to line up with a portion of the surface S1444S that does not have the indentations C. - A thickness T2A of the
transparent substrate 1441 and a thickness T2B of the transparent substrate 1444 are less than T1, and a total thickness of the thickness T2A and the thickness T2B is T2. In other words, T2A+T2B=T2. In addition, the thickness T2A and the thickness T2B may be identical or different. In another exemplary embodiment, thesecond collimating element 144 may include two layers or more of the transparent substrates and three layers or more of the light absorbing layers. - Likewise, the
first collimating element 142 may include one layer or more of the transparent substrates and two layers or more of the light absorbing layers, and the transparent substrate thickness T1 of thefirst collimating element 142 is a total thickness of the one layer or more of the transparent substrates. - In addition, the
second collimating element 144 of theimage capturing apparatus 200 inFIG. 3 may also improve in the same way as described in the exemplary embodiment. Redundant descriptions are not repeated here. - Referring to
FIG. 5 , the main difference between animage capturing apparatus 400 according to a fourth exemplary embodiment of the invention and theimage capturing apparatus 100 illustrated inFIG. 1 is presented below. Theimage capturing apparatus 400 further includes adisplay panel 410 and a band-pass filter layer 420. Thedisplay panel 410 is disposed between thecover plate 110 and thecollimator 140 and adapted to provide images. For instance, thedisplay panel 410 may be a thin film transistor liquid crystal display panel (TFT-LCD panel), a micro light emitting diode display panel (Micro LED display panel) or an organic light emitting diode display panel (OLED display panel), but is not limited thereto. - The band-
pass filter layer 420 is disposed between thecollimator 140 and the sensor 130 (not illustrated) or between thedisplay panel 410 and thecollimator 140 and is configured to let light beams from thelight source 120 go through and filter out other light beams to prevent intervention caused by environmental light beams or light beams from thedisplay panel 410 transmitted to thesensor 130, enhancing the identification capability of theimage capturing apparatus 400. For instance, the band-pass filter layer 420 may be an infrared band-pass filter layer through which light beams with a wavelength of between 800 nm and 900 nm go through and which filters out other light beams without a wavelength of between 800 nm and 900 nm. Correspondingly, thelight source 120 is an infrared light source with a wavelength of between 800 nm and 900 nm. In other exemplary embodiments, the band-pass filter layer 420 may be a band-pass filter layer 420 through which light beams with a wavelength of between 840 nm and 860 nm or between 890 nm and 990 nm go through, and thelight source 120 may be an infrared light source with a wavelength between 840 nm and 860 nm or between 890 nm and 990 nm, but the invention is not limited thereto. - The
image capturing apparatus 200 inFIG. 3 and theimage capturing apparatus 300 inFIG. 4 may also further include thedisplay panel 410 and the band-pass filter layer 420. Redundant descriptions are not repeated here. - In the above embodiment, the collimating elements may be fixed to each other through an adhesion layer (not illustrated) or a fixing mechanism (not illustrated). For instance, the adhesion layer may be formed between the transparent substrates of the collimating elements, so the collimating elements are firmly fixed to each other, but the invention is not limited thereto. The adhesion layer may be an optical clear adhesive (OCA) or a die attach film (DAF), but is not limited thereto.
- In view of the foregoing, for the image capturing apparatus according to the embodiments of the invention, the design of
-
- makes the large-angle light beams reflected several times between the collimating elements and absorbed by the light absorbing layer to address the problem of crosswalk effectively and enable the image capturing apparatus to exhibit a good identification capability. In an exemplary embodiment, the image capturing apparatus may further include the display panel and thus provides a biological characteristic identification function and a display function. In another exemplary embodiment, the light source of the image capturing apparatus may be an infrared light source, and the image capturing apparatus may include the infrared band-pass filter layer to prevent intervention caused by the environmental light beams or the light beams from the display panel transmitted to the sensor, enhancing the identification ability of the electronic apparatus.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (20)
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| US15/942,386 US10122899B2 (en) | 2015-12-11 | 2018-03-30 | Image capturing apparatus |
| US16/008,037 US10460188B2 (en) | 2014-08-26 | 2018-06-14 | Bio-sensing apparatus |
| US16/571,207 US11310402B2 (en) | 2015-08-25 | 2019-09-16 | Image capturing device and fingerprint image capturing device |
| US16/996,883 US20200381470A1 (en) | 2014-08-26 | 2020-08-18 | Image capture device |
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| US201562266002P | 2015-12-11 | 2015-12-11 | |
| TW105122567A TWI597512B (en) | 2015-12-11 | 2016-07-18 | Fingerprint sensing module |
| TW105122567A | 2016-07-18 | ||
| TW105122567 | 2016-07-18 | ||
| US15/239,842 US10049256B2 (en) | 2015-12-11 | 2016-08-18 | Fingerprint sensing module |
| US201762533632P | 2017-07-17 | 2017-07-17 | |
| CN201710852899 | 2017-09-20 | ||
| CN201710852899.3 | 2017-09-20 | ||
| CN201710852899 | 2017-09-20 | ||
| US15/826,711 US9964436B1 (en) | 2015-12-11 | 2017-11-30 | Image capturing apparatus |
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| US16/008,037 Continuation-In-Part US10460188B2 (en) | 2014-08-26 | 2018-06-14 | Bio-sensing apparatus |
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