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US20180031328A1 - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
US20180031328A1
US20180031328A1 US15/482,042 US201715482042A US2018031328A1 US 20180031328 A1 US20180031328 A1 US 20180031328A1 US 201715482042 A US201715482042 A US 201715482042A US 2018031328 A1 US2018031328 A1 US 2018031328A1
Authority
US
United States
Prior art keywords
heat
tank
heat dissipation
dissipation apparatus
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/482,042
Other languages
English (en)
Inventor
Cheng-Yu Cheng
Wen-Neng Liao
Cheng-Wen Hsieh
Jau-Han Ke
Yung-Chih Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acer Inc
Original Assignee
Acer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acer Inc filed Critical Acer Inc
Assigned to ACER INCORPORATED reassignment ACER INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHENG-YU, HSIEH, CHENG-WEN, KE, JAU-HAN, LIAO, WEN-NENG, WANG, YUNG-CHIH
Publication of US20180031328A1 publication Critical patent/US20180031328A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling

Definitions

  • the present invention generally relates to a heat dissipation apparatus, in particular, to a heat dissipation apparatus disposed in a portable electronic apparatus.
  • a single circulation of a general heat dissipation apparatus is referred to disposing a heat source below a tank, after flowing into the tank, a working fluid in a liquid state is heated by the heat source and boiled into its gaseous state, then flows out of the tank. While the working fluid in the gaseous state flows to the condenser, it is condensed to its liquid state again, then flows back to the tank, in order to complete the single circulation.
  • the temperature generated by the heat source is excessively high, the working fluid in the liquid state has been boiled into its gaseous state before flowing back to the tank, which leads to failure in completing the single circulation, so that the heat dissipation apparatus fails in effectively dissipating heat.
  • the working fluid flows in a closed loop composed by the tank and a pipe merely by its phase transformation, which results in unsatisfactory flowing condition, and there may not be sufficient amount of the working fluid to perform such reaction, so the dissipation efficiency of the heat dissipation apparatus is limited.
  • the present invention provides a heat dissipation apparatus, which has an improved heat dissipation efficiency.
  • the heat dissipation apparatus of the present invention is suited for dissipating heat of a heat source.
  • the heat dissipation apparatus comprises a tank, a heat-insulation unit and a pipe.
  • the tank has an outlet end, an inlet end and an accommodating space, wherein the tank is suited for receiving heat of the heat source from above.
  • the heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit comprises a heat-insulation nozzle.
  • the heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates the inlet end, and the second opening communicates the accommodating space, and the neck portion is near the second opening.
  • the pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.
  • a working fluid enters the heat-insulation unit through the inlet end of the tank, and flows to the neck portion through the first opening of the heat-insulation nozzle, and is accelerated via the neck portion, so that the working fluid ejects to the accommodating space through the second opening.
  • the working fluid in the accommodating space absorbs heat of the heat source and transforms to a gaseous state form a liquid state, and enters the pipe through the outlet end.
  • orthogonal projections of the heat source and the heat-insulation unit on a horizontal plane do not completely overlap.
  • the heat dissipation apparatus further comprises a condenser, disposed below the pipe, to assist the working fluid in the pipe with condensing into the liquid state and flowing back to the inlet end.
  • the heat dissipation apparatus further comprises a plurality of channels, disposed in the accommodating space of the tank, and communicate the second opening of the heat-insulation nozzle.
  • the heat dissipation apparatus further comprises: a plurality of bosses, disposed dispersively in the accommodating space of the tank, orthogonal projections of the bosses and the heat-insulation unit on a horizontal plane do not overlap.
  • a material of the pipe is metal.
  • a material of the heat-insulation unit comprises bakelite, plastics, glass fiber, ceramics or Teflon.
  • the tank comprises a first locking portion
  • the heat-insulation unit further comprises a second locking portion, the first locking portion and the second locking portion are locked to each other to fix the heat-insulation unit in the tank.
  • the working fluid is a coolant.
  • the heat source comprises a heat pipe, a chip or a processor.
  • the heat dissipation apparatus of the present invention has the heat-insulation unit, and the heat-insulation unit has an effect of heat insulation, the working fluid can be avoided from being vaporized while entering the inlet end of the tank, which hinder the working fluid from entering the tank, so that the resistance on circulative flow of the working fluid can be reduced, which means circulation efficiency and heat dissipation efficiency can be raised.
  • the heat-insulation nozzle of the present invention is nozzle-shaped since it has the neck portion, thus the working fluid can exist the heat-insulation unit with acceleration then enter the accommodating space and fully disperse in the tank via the design of the neck portion.
  • the heat dissipation apparatus of the present invention can effectively avoid the working fluid from being vaporized via the heat generated by the heat source before entering the tank, and can ensure that the tank has sufficient working fluid therein.
  • the heat dissipation apparatus of the present invention can have an improved heat dissipation efficiency, and is suited for high wattage electronic products.
  • FIG. 1A is a schematic top view illustrating a heat dissipation apparatus according an exemplary embodiment of the present invention.
  • FIG. 1B is a three-dimensional schematic view illustrating a tank and a heat-insulation unit of the heat dissipation apparatus shown in FIG. 1A .
  • FIG. 2 is a top schematic view illustrating a heat dissipation apparatus according to another exemplary embodiment of the present invention.
  • FIG. 3 is a top schematic view illustrating a heat dissipation apparatus according to yet another exemplary embodiment of the present invention.
  • FIG. 1A is a schematic top view illustrating a heat dissipation apparatus according an exemplary embodiment of the present invention.
  • FIG. 1B is a three-dimensional schematic view illustrating a tank and a heat-insulation unit of the heat dissipation apparatus shown in FIG. 1A .
  • a heat dissipation apparatus 100 A of the present exemplary embodiment is suited for dissipating heat of a heat source 10 , wherein the heat source 10 is a heat generating device, such as a chip in an electronic apparatus or a processor, or a heat pipe, which is capable of absorbing heat from the other heat generating devices and transmitting heat to the heat dissipation apparatus of the present invention.
  • the heat source 10 is a heat generating device, such as a chip in an electronic apparatus or a processor, or a heat pipe, which is capable of absorbing heat from the other heat generating devices and transmitting heat to the heat dissipation apparatus of the present invention.
  • the heat dissipation apparatus 100 A of the present exemplary embodiment is suited for electronic apparatus, such as a portable electronic apparatus like a notebook computer, and the heat dissipation apparatus 100 A can be disposed in a casing of the electronic apparatus. Heat generated by the heat source 10 in the electronic apparatus can be transmitted to the casing according to an effect of structurally thermal contact, and thus it can be dissipated, in order to attain an effect of heat dissipation.
  • the heat dissipation apparatus 100 A of the present exemplary embodiment includes a tank 110 , a heat-insulation unit 120 and a pipe 130 .
  • the tank 110 has an outlet end 112 , an inlet end 114 and an accommodating space 116 , wherein the heat source 10 is disposed below the tank 110 , so that the tank 110 is suited for absorbing heat of the heat source 10 from above.
  • the heat-insulation unit 120 is disposed in the accommodating space 116 of the tank 110 , and the heat-insulation unit 120 includes a heat-insulation nozzle 122 .
  • the heat-insulation nozzle 122 has a first opening 121 , a second opening 123 and a neck portion 125 , wherein the first opening 121 communicates the inlet end 114 , and the second opening 123 communicates the accommodating space 116 , and the neck portion 125 is near the second opening 123 .
  • the cross-section area of the neck portion 125 is less than the cross-section areas of the first opening 121 and the second opening 123 , respectively.
  • the second opening can be closely adjacent to the neck portion, thus the second opening has a cross-section area similar to or the same as the cross-section area of the neck portion.
  • the pipe 130 communicates the outlet end 112 and the inlet end 114 and forms a closed circulating loop with the tank 110 (as shown by the arrows in FIG. 1A ).
  • a working fluid enters the heat-insulation unit 120 through the inlet end 114 of the tank 110 , and flows to the neck portion 125 through the first opening 121 of the heat-insulation nozzle 122 , and is accelerated via the neck portion 125 , so that the working fluid ejects to the accommodating space 116 through the second opening 123 .
  • the working fluid in the accommodating space 116 transforms to a gaseous state form a liquid state because of absorbing heat of the heat source, and enters the pipe 130 through the outlet end 112 .
  • the heat source 10 is located right below the tank 110 and directly contacted to the tank 110 , wherein orthogonal projections of the heat source 10 and the heat-insulation unit 120 on a horizontal plane do not completely overlap.
  • the orthogonal projections of the heat source 10 and the heat-insulation unit 120 can absolutely not overlap (as shown in FIG. 1A ) or partially overlap (not shown), which is not limited hereto.
  • a material of the heat-insulation unit 120 is such as an insulating material with low thermal conductivity, such as bakelite, plastics, glass fiber, ceramics or Teflon.
  • the heat dissipation apparatus 100 A of the present exemplary embodiment has the heat-insulation unit 120 , wherein the heat-insulation unit 120 has an effect of heat insulation, the working fluid can be avoided from being excessively heated near the inlet end and vaporized instantly, so that the working fluid has maintained in the liquid state before entering the tank 110 .
  • the tank 110 of the present exemplary embodiment further includes a first locking portion 118
  • the heat-insulation unit 120 further includes a second locking portion 124 , wherein the first locking portion 118 and the second locking portion 124 are locked to each other, to fix the heat-insulation unit 120 in the tank 110
  • the heat dissipation apparatus 110 A of the present exemplary embodiment can further include a condenser 140 , such as a metal fin, disposed below the pipe 130 , to assist with heat dissipation.
  • the working fluid in the gaseous state in the pipe 130 is condensed into the liquid state and flows back to the inlet end 114 .
  • the material of the pipe 130 is such as metal, like copper, and the working fluid is such as a coolant.
  • the tank 110 and the pipe 130 communicate to each other to form a closed circulating loop (as shown by the arrows in FIG. 1A ), and the working fluid is filled in the closed circulating loop.
  • the heat generated by the heat source 10 is transmitted to the tank 110 , it can heat the working fluid therein, which thus transforms to the gaseous state from the liquid state.
  • the working fluid flows in the closed circulating loop.
  • the working fluid in the gaseous state flows through the pipe 130 and the condenser 140 via the manner of being propelled by the vapor pressure, it is condensed and transformed to the liquid state, and flows back to the inlet end 114 of the tank 110 along the closed circulating loop.
  • the working fluid can generate circulative phase transformation in the closed circulating loop (which is referred to transforming to the gaseous state from the liquid state, and then transforming to the liquid state from the gaseous state), so that the heat dissipation apparatus 100 A of the present exemplary embodiment can dissipate heat of the heat source 10 according to the design described above.
  • the heat-insulation unit 120 of the present exemplary embodiment has the heat-insulation nozzle 122 , wherein the heat-insulation nozzle 122 has the neck portion 125 , while the working fluid entering the heat-insulation nozzle 122 through the first opening 121 flows to the neck portion 125 , the working fluid can be squeezed by the design of the neck portion 125 , and exist with an accelerated manner from the heat-insulation nozzle 122 through the second opening 123 , and enter the accommodating space 116 .
  • the working fluid in the liquid state can be fully dispersed in the accommodating space 116 , so that the tank 110 has a sufficient amount of the working fluid therein, which reduces or avoids partial regions in the tank from occurring a phenomenon of drying out. Furthermore, flow velocity of the working fluid is increased because of the neck portion 125 of the heat-insulation nozzle 122 , thus while the working fluid absorbs the heat generated by the heat source 10 and transforms to the gaseous state from the liquid state, it can flow to the pipe 130 in only one direction. As a result, a property of the working fluid being propelled in only one direction in the closed circulating loop can be maintained.
  • the heat dissipation apparatus 100 A of the present exemplary embodiment has the heat-insulation unit 120 , and the heat-insulation unit 120 has the effect of heat insulation, heating the working fluid near the inlet end 114 by the heat source 10 can be reduce or avoided, so that the working fluid has maintained in the liquid state before entering the tank 110 .
  • the heat-insulation nozzle 122 of the heat-insulation unit 120 of the present exemplary embodiment has the neck portion 125 , thus the working fluid can exist the heat-insulation unit 120 with acceleration, then enter the accommodating space 116 and fully disperse in the tank 110 via the design of the neck portion 125 , in order to increase or maintain the contact area between the tank 110 and the working fluid.
  • the heat dissipation apparatus 100 A of the present exemplary embodiment can increase the heat dissipation efficiency effectively, and is suited for high wattage electronic products.
  • FIG. 2 is a top schematic view illustrating a heat dissipation apparatus according to another exemplary embodiment of the present invention.
  • a heat dissipation apparatus 100 B of the present exemplary embodiment is similar to the heat dissipation apparatus 100 A as shown in FIG. 1A , a major difference between the two is: the heat dissipation apparatus 100 B of the present exemplary embodiment further includes a plurality of channels 150 , wherein the channels 150 are disposed in the accommodating space 116 of the tank 110 , and are separated by a plurality of ribs in the tank 110 .
  • the channels 150 are distributed and communicated to the second opening 123 of the heat-insulation nozzle 122 and the outlet end 112 of the tank, and diverges from the second opening 123 , while converges toward the outlet end 112 at each end of the channels 150 .
  • disposing the channel 150 is aimed for allowing the working fluid in the tank 110 to have a larger heat exchange area, and for guiding the working fluid to converge toward the outlet end. Thus, the heat dissipation efficiency is raised.
  • FIG. 3 is a top schematic view illustrating a heat dissipation apparatus according to another exemplary embodiment of the present invention.
  • a heat dissipation apparatus 100 C of the present exemplary embodiment is similar to the heat dissipation apparatus 100 A as shown in FIG. 1A , a major difference between the two is: the heat dissipation apparatus 100 C of the present exemplary embodiment further includes a plurality of bosses 160 , disposed dispersively in the accommodating space 116 of the tank 110 , and orthogonal projections of the bosses 160 and the heat-insulation unit 120 on a horizontal plane do not overlap.
  • disposing the bosses 160 is aimed for allowing the working fluid in the tank 110 to have a larger heat exchange area, thus the time of heat exchange is prolonged. Thus the heat dissipation efficiency is raised.
  • the heat dissipation apparatus of the present invention has the heat-insulation unit, and the heat-insulation unit has the effect of heat insulation, the working fluid can be avoided from being heated directly by the heat source, which attains an effect of lowering the temperature of the working fluid.
  • the heat-insulation nozzle of the heat-insulation unit of the present invention has the neck portion, thus the working fluid can exist the heat-insulation unit with acceleration via the design of the neck portion, then enter the accommodating space and fully disperse in the tank, which can ensure that the tank has a sufficient amount of the working fluid.
  • the heat dissipation apparatus of the present invention can effectively avoid the working fluid from being vaporized by the heat generated by the heat source before entering the tank, and can ensure that the tank has a sufficient amount of the working fluid therein.
  • the heat dissipation apparatus of the present invention can have an improved heat dissipation efficiency, and is suited for high wattage electronic products.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US15/482,042 2016-07-28 2017-04-07 Heat dissipation apparatus Abandoned US20180031328A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105123891 2016-07-28
TW105123891A TWI616636B (zh) 2016-07-28 2016-07-28 散熱裝置

Publications (1)

Publication Number Publication Date
US20180031328A1 true US20180031328A1 (en) 2018-02-01

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Application Number Title Priority Date Filing Date
US15/482,042 Abandoned US20180031328A1 (en) 2016-07-28 2017-04-07 Heat dissipation apparatus

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US (1) US20180031328A1 (zh)
TW (1) TWI616636B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10563926B2 (en) * 2016-09-02 2020-02-18 Acer Incorporated Lattice boiler evaporator
US11206773B2 (en) * 2018-01-18 2021-12-28 Isaac Wilcox Modular aeroponic garden system
US20240361083A1 (en) * 2023-04-26 2024-10-31 Auras Technology Co., Ltd. Loop heat pipe one-way circulation device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725422B (zh) * 2018-05-31 2021-04-21 技嘉科技股份有限公司 液冷導熱裝置、液冷循環系統以及漏液偵測方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
US20120024499A1 (en) * 2010-07-30 2012-02-02 Asia Vital Components Co., Ltd. Loop type pressure-gradient-drien low-pressure thermosiphon device
US20120285663A1 (en) * 2011-05-10 2012-11-15 Chun-Ming Wu Condensing device and thermal module using same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201420987A (zh) * 2012-11-29 2014-06-01 Wei-Keng Lin 環路型傳熱結構
TWI573975B (zh) * 2014-02-18 2017-03-11 Liquid - air split - type heat exchange chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
US20120024499A1 (en) * 2010-07-30 2012-02-02 Asia Vital Components Co., Ltd. Loop type pressure-gradient-drien low-pressure thermosiphon device
US20120285663A1 (en) * 2011-05-10 2012-11-15 Chun-Ming Wu Condensing device and thermal module using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10563926B2 (en) * 2016-09-02 2020-02-18 Acer Incorporated Lattice boiler evaporator
US11402157B2 (en) 2016-09-02 2022-08-02 Acer Incorporated Lattice boiler evaporator
US11206773B2 (en) * 2018-01-18 2021-12-28 Isaac Wilcox Modular aeroponic garden system
US20240361083A1 (en) * 2023-04-26 2024-10-31 Auras Technology Co., Ltd. Loop heat pipe one-way circulation device

Also Published As

Publication number Publication date
TW201804124A (zh) 2018-02-01
TWI616636B (zh) 2018-03-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ACER INCORPORATED, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHENG, CHENG-YU;LIAO, WEN-NENG;HSIEH, CHENG-WEN;AND OTHERS;REEL/FRAME:041931/0949

Effective date: 20170406

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION