US20170354030A1 - High frequency signal transmission structure and method for same - Google Patents
High frequency signal transmission structure and method for same Download PDFInfo
- Publication number
- US20170354030A1 US20170354030A1 US15/275,481 US201615275481A US2017354030A1 US 20170354030 A1 US20170354030 A1 US 20170354030A1 US 201615275481 A US201615275481 A US 201615275481A US 2017354030 A1 US2017354030 A1 US 2017354030A1
- Authority
- US
- United States
- Prior art keywords
- silver
- layer
- conductive layer
- insulating sheet
- copper conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000008054 signal transmission Effects 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 40
- 229910052709 silver Inorganic materials 0.000 claims abstract description 94
- 239000004332 silver Substances 0.000 claims abstract description 94
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000010949 copper Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- -1 ester ions Chemical class 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 125000004185 ester group Chemical group 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000002203 pretreatment Methods 0.000 claims description 5
- 239000012670 alkaline solution Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims 3
- 238000007740 vapor deposition Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000417 polynaphthalene Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910000898 sterling silver Inorganic materials 0.000 description 1
- 239000010934 sterling silver Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the subject matter herein generally relates to a multifunction sensing devices.
- Metal copper is generally used to manufacturing conductive wire layer. However, when the conductive wire layer is used to transmit a high frequency signal, a large loss is generated.
- FIG. 1 is a flowchart of a method for manufacturing a high frequency signal transmission structure in accordance with a first embodiment.
- FIG. 2 is a diagrammatic view of an insulating sheet of the structure of FIG. 1 in accordance with a first embodiment.
- FIG. 3 is a diagrammatic view of a silver bottom layer formed on the insulating sheet of FIG. 2 .
- FIG. 4 is a diagrammatic view of a dry film formed on the silver bottom layer of FIG. 3 .
- FIG. 5 is a diagrammatic view of the dry film being exposed to a lithographic method of FIG. 4 .
- FIG. 6 is a diagrammatic view of the dry film being developed through a lithographic method of FIG. 5 .
- FIG. 7 is a diagrammatic view of forming of a copper conductive layer on the silver bottom layer of FIG. 6 .
- FIG. 8 is a diagrammatic view showing removal of the dry film of FIG. 6 .
- FIG. 9 is a diagrammatic view showing the silver bottom layer is etched to form a silver conductive layer on the insulating sheet.
- FIG. 10 is a diagrammatic view of a silver covering layer being formed on the copper conductive layer of FIG. 8 to obtain a high frequency signal transmission structure.
- substantially is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact.
- substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.
- comprising when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
- the references “a plurality of” and “a number of” mean “at least two.”
- FIG. 10 illustrates a high frequency signal transmission structure 100 according to a first embodiment.
- the high frequency signal transmission structure 100 includes an insulating sheet 10 and a conductive wiring layer 40 formed on the insulating sheet 10 .
- a material of the insulation layer 10 is selected from the group consisting of polynaphthalene dicarboxylic acid glycol ester (PEN), polyimide (PI), and polyterephthalate (PET).
- the conductive wiring layer 40 includes a silver conductive layer 22 formed on the insulating sheet 10 , a copper conductive layer 20 formed on the silver conductive layer 22 , and a silver covering layer 30 covering a top surface and side surfaces of the copper conductive layer 20 .
- the copper conductive layer 20 is sandwiched between the silver conductive layer 22 and the silver covering layer 30 .
- a thickness of the silver conductive layer 22 is about 0.1 ⁇ 2 nanometers.
- a thickness of the silver conductive layer 22 is same with a thickness of the silver covering layer 30 .
- FIG. 1 illustrates a flowchart in accordance with a second embodiment.
- the example method 200 for manufacturing the high frequency signal transmission structure 100 (shown in FIG. 10 ) is provided by way of an example, as there are a variety of ways to carry out the method. Additionally, the illustrated order of blocks is by example only and the order of the blocks can change.
- the method 200 can begin at block 201 .
- an insulating sheet 10 is provided and is pre-treated using a plasma method to strength a silver bottom layer 12 combine with the insulating sheet 10 .
- the insulating sheet 10 is made from polyester polymer, thus the insulating sheet 10 comprised of ester group (—COOR).
- the pre-treatment method includes steps of first hydrolyzing ester group (—COOR) comprised in the polyester polymer into carboxyl (—COOH), the carboxyl (—COOH) then being changed into ester (—COO ⁇ ) in a slightly alkaline environment.
- a silver bottom layer 12 is formed on the insulating sheet 10 using a method of vacuum evaporation. Specifically, under a vacuum condition, the insulating sheet 10 is used as a substrate, a metallic silver piece is arranged toward the insulating sheet 10 as a target source. The target source is heated to under a high temperature, the metallic silver piece evaporates to silver ions, and the metal silver ions are gradually deposited on the insulating substrate 10 . Silver ions and ester group (—COO ⁇ ) on a surface of the insulating sheet 10 form ionic bonds (—COO—Ag), and such ionic bonds can reach about 150-400 kJ/mole. The silver ions can thus adhere to the insulating sheet 10 , and the silver bottom layer 12 is thus formed.
- the heating method can include resistance heating, electron beam heating, laser beam heating, or plasma spray column heating.
- a copper conductive layer 20 is formed on the silver bottom layer 12 .
- One portion of the silver bottom layer 12 is covered by the copper conductive layer 20 , and the other portion is exposed by the copper conductive layer 20 .
- the copper conductive layer 20 is formed using electroplating method, rather than by a traditional wet etching process. Using an electroplating method to form the copper conductive layer 12 reduces use of copper liquids, and is more environmentally friendly.
- a method for forming the copper conductive layer 20 on the silver bottom layer 12 comprises:
- a dry film 14 is formed on the silver bottom layer 22 .
- the dry film 14 is exposed through a lithographic method to a pattern defined on the copper conductive layer 20 . After the step of exposure and development, the dry film 14 then protects the silver bottom layer 12 , and the portion of the silver bottom layer 12 exposed by the dry film 14 can be electroplated with a layer of copper (see next step).
- a copper layer is electroplated onto the silver bottom layer 12 , and the layer of copper becomes the copper conductive layer 20 , and one portion of the silver bottom layer 12 is covered by the copper conductive layer 20 .
- the dry film 14 is removed, and the copper conductive layer 20 is in finished form on the silver bottom layer 12 .
- a fast vertical etching method is used to remove the silver bottom layer 12 exposed by the copper conductive layer 20 . Only the silver bottom layer 12 sandwiched between the insulating sheet 10 and the copper conductive layer 20 is retained. The silver bottom layer 12 sandwiched between the insulating sheet 10 and the copper conductive layer 20 constitute the silver conductive layer 22 .
- the silver bottom layer 12 is etched using an alkaline solution. Using an alkaline solution to fast-etch the silver bottom layer 12 means that etching only takes place along a direction perpendicular to a surface of the insulating sheet 10 . Any etching which is done to a side of the copper conductive layer 20 can be ignored, so the reliability of the copper conductive layer 20 is high, and cracks or breaks in the copper conductive layer 20 are reduced.
- a silver covering layer 30 is formed on a top surface and side surfaces of the copper conductive layer 20 . That is to say, the copper conductive layer 20 is sandwiched between the silver covering layer 30 and the silver conductive layer 22 . The silver conductive layer 22 , the copper conductive layer 20 and the silver covering layer 30 together form the conductive wiring layer 40 .
- the silver covering layer 30 is formed using a sterling silver method. That is to say, in a silver solution, silver ion in the silver solution is replaced with copper comprised in the copper conductive layer 20 , namely 2Ag + +Cu ⁇ 2Ag+Cu 2+ . A silver covering layer 30 is gradually formed on the copper conductive layer 20 , in this way, a thickness of the conductive wiring layer 40 can be better controlled. A high frequency signal transmission structure 100 is thereby obtained.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/577,062 US10874016B2 (en) | 2016-06-07 | 2019-09-20 | Method of manufacturing physical structure for high frequency signal transmission |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610397198.0A CN107484330A (zh) | 2016-06-07 | 2016-06-07 | 高频铜银混合导电线路结构及其制作方法 |
| CN201610397198.0 | 2016-06-07 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/577,062 Division US10874016B2 (en) | 2016-06-07 | 2019-09-20 | Method of manufacturing physical structure for high frequency signal transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20170354030A1 true US20170354030A1 (en) | 2017-12-07 |
Family
ID=60482907
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/275,481 Abandoned US20170354030A1 (en) | 2016-06-07 | 2016-09-26 | High frequency signal transmission structure and method for same |
| US16/577,062 Active US10874016B2 (en) | 2016-06-07 | 2019-09-20 | Method of manufacturing physical structure for high frequency signal transmission |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/577,062 Active US10874016B2 (en) | 2016-06-07 | 2019-09-20 | Method of manufacturing physical structure for high frequency signal transmission |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20170354030A1 (zh) |
| CN (1) | CN107484330A (zh) |
| TW (1) | TWI640235B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3842573A1 (en) * | 2019-12-26 | 2021-06-30 | Toyota Jidosha Kabushiki Kaisha | Method for manufacturing wiring board, and wiring board |
| US12446163B2 (en) * | 2021-12-16 | 2025-10-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182737B (zh) * | 2018-11-13 | 2021-08-03 | 上海和辉光电股份有限公司 | 柔性线路板及其制造方法 |
| CN112020229A (zh) * | 2019-05-28 | 2020-12-01 | 庆鼎精密电子（淮安）有限公司 | 电路板的制作方法 |
| CN110831343B (zh) * | 2019-11-04 | 2020-10-02 | 上海申和热磁电子有限公司 | 一种dbc基板选择性化学沉银的表面处理方法 |
| JP2022039765A (ja) * | 2020-08-28 | 2022-03-10 | キオクシア株式会社 | プリント配線板、メモリシステム、およびプリント配線板の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4392013A (en) * | 1979-12-27 | 1983-07-05 | Asahi Kasei Kogyo Kabushiki Kaisha | Fine-patterned thick film conductor structure and manufacturing method thereof |
| US20020180557A1 (en) * | 2000-04-13 | 2002-12-05 | Raytheon Company, A Delaware Corporation | Suspended transmission line with embedded signal channeling device |
| US20140252399A1 (en) * | 2013-03-11 | 2014-09-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same |
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|---|---|---|---|---|
| US4866008A (en) * | 1987-12-11 | 1989-09-12 | Texas Instruments Incorporated | Methods for forming self-aligned conductive pillars on interconnects |
| KR920005701B1 (ko) * | 1989-07-20 | 1992-07-13 | 현대전자산업 주식회사 | 반도체 집적회로 내의 소자 연결용 금속배선층 및 그 제조방법 |
| WO2006011299A1 (ja) * | 2004-07-29 | 2006-02-02 | Mitsui Mining & Smelting Co., Ltd. | プリント配線基板、その製造方法および半導体装置 |
| KR100489869B1 (ko) * | 2004-09-07 | 2005-05-17 | (주)유일재료기술 | 고밀도 인쇄회로기판에서의 솔더링 및 와이어 본딩을 위한단일 은-금 도금층의 형성 방법 및 상기 방법에 의해제조된 단일 은-금 도금층을 구비한 고밀도 인쇄회로기판 |
| JP2007165816A (ja) * | 2005-11-15 | 2007-06-28 | Mitsui Mining & Smelting Co Ltd | プリント配線基板、その製造方法およびその使用方法 |
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- 2016-06-07 CN CN201610397198.0A patent/CN107484330A/zh active Pending
- 2016-06-27 TW TW105120225A patent/TWI640235B/zh active
- 2016-09-26 US US15/275,481 patent/US20170354030A1/en not_active Abandoned
-
2019
- 2019-09-20 US US16/577,062 patent/US10874016B2/en active Active
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| US4392013A (en) * | 1979-12-27 | 1983-07-05 | Asahi Kasei Kogyo Kabushiki Kaisha | Fine-patterned thick film conductor structure and manufacturing method thereof |
| US20020180557A1 (en) * | 2000-04-13 | 2002-12-05 | Raytheon Company, A Delaware Corporation | Suspended transmission line with embedded signal channeling device |
| US20140252399A1 (en) * | 2013-03-11 | 2014-09-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3842573A1 (en) * | 2019-12-26 | 2021-06-30 | Toyota Jidosha Kabushiki Kaisha | Method for manufacturing wiring board, and wiring board |
| JP2021102806A (ja) * | 2019-12-26 | 2021-07-15 | トヨタ自動車株式会社 | 配線基板の製造方法および配線基板 |
| US11665829B2 (en) | 2019-12-26 | 2023-05-30 | Toyota Jidosha Kabushiki Kaisha | Method for manufacturing wiring board |
| JP7310599B2 (ja) | 2019-12-26 | 2023-07-19 | トヨタ自動車株式会社 | 配線基板の製造方法および配線基板 |
| US12446163B2 (en) * | 2021-12-16 | 2025-10-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI640235B (zh) | 2018-11-01 |
| US10874016B2 (en) | 2020-12-22 |
| US20200015352A1 (en) | 2020-01-09 |
| CN107484330A (zh) | 2017-12-15 |
| TW201803425A (zh) | 2018-01-16 |
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