US20170266727A1

US20170266727A1 - Additive manufacturing apparatus and additive manufacturing method

Info

Publication number: US20170266727A1
Application number: US15/505,448
Authority: US
Inventors: Tomoko Nishino; Naotada Okada
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 2014-09-16
Filing date: 2015-02-23
Publication date: 2017-09-21
Also published as: DE112015004212T5; US11318536B2; WO2016042794A1; CN106604810B; JP5905060B1; US20200198012A1; JP2016060063A; CN106604810A

Abstract

An additive manufacturing apparatus according to one embodiment includes a manufacturing unit, an elastic wave generation unit, an elastic wave detection unit, and an inspection unit. The manufacturing unit sequentially stacks a layer formed by emitting a first energy beam to a material and solidifying the material. The elastic wave generation unit emits a second energy beam to a manufactured object including the layer and generates an elastic wave propagating in the manufactured object. The elastic wave detection unit detects the elastic wave. The inspection unit inspects the manufactured object on the basis of a detection result from the elastic wave detection unit.

Description

FIELD

Embodiments of the present invention relates to an additive manufacturing apparatus and an additive manufacturing method.

BACKGROUND

Conventionally, there has been known an additive manufacturing apparatus to form an additive manufactured object. The additive manufacturing apparatus forms a layer by melting a powder material by a laser beam, and forms the additive manufactured object having a three-dimensional shape by stacking the layers.

CITATION LIST

Patent Literature

Patent Literature 1: JP 2006-200030 A
Patent Literature 2: JP 2012-163406 A

SUMMARY OF THE INVENTION

Problem to be Solved by the Invention

A manufactured object which is manufactured by such an additive manufacturing apparatus may contain an abnormal area such as a bubble generated during manufacture. It is significant to obtain an additive manufacturing apparatus and an additive manufacturing method which allow detection of abnormality in such a manufactured object.

Means for Solving Problem

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an exemplary schematic view of an additive manufacturing apparatus according to a first embodiment.

FIG. 2 is an exemplary schematic cross-sectional view of part of a nozzle according to the first embodiment.

FIG. 3 is an exemplary schematic view of an inspection device according to the first embodiment.

FIG. 4 is an exemplary schematic view of irradiation positions of laser beams according to the first embodiment.

FIG. 5 is an exemplary flowchart of a procedure to form an additive manufactured object according to the first embodiment.

FIG. 6 is an exemplary explanatory view of an abnormality detection process for an additive manufactured object according to the first embodiment.

FIG. 7 is an exemplary explanatory view of repair processing for an additive manufactured object according to the first embodiment.

FIG. 8 is an exemplary schematic view of an inspection device according to a second embodiment.

DETAILED DESCRIPTION

Embodiments will be described below with reference to the drawings. Note that, in the following embodiments, similar elements are included. Therefore, in the following, those similar elements are denoted by common reference numerals/signs, and repeated description will be omitted.

First Embodiment

An additive manufacturing apparatus 1 according to the present embodiment, illustrated in FIG. 1, forms an additive manufactured object according to a laser deposition method. The additive manufacturing apparatus 1 includes a treatment tank 11, a stage 12, a moving device 13, a nozzle device 14, an optical device 15, an inspection device 16, a control unit 17, and the like. The additive manufacturing apparatus 1 feeds a material 121 (manufacturing material) through the nozzle device 14, and emits a laser beam L1 to the material 121 to form a layer 110 b of the material 121 on an object 110 disposed on the stage 12, so that the layers 110 b are stacked to form an additive manufactured object 100. Here, a manufactured object 101 includes at least one layer 110 b. The manufactured object 101 represents an intermediate product provided in a manufacturing process of the additive manufactured object 100, or the additive manufactured object 100 having been formed.
The object 110 is an object to which the material 121 is fed through the nozzle device 14, and includes a base 110 a and the layer 110 b. A plurality of the layers 110 b is stacked on an upper face of the base 110 a. The material 121 includes a powdered metal material, a powdered resin material, or the like. Alternatively, the material 121 may be not the powdered material but a linear material. For manufacturing, at least one material 121 can be used.
In the treatment tank 11, a main chamber 21 and a sub-chamber 22 are provided. The sub-chamber 22 is provided adjacent to the main chamber 21. Between the main chamber 21 and the sub-chamber 22, a door portion 23 is provided. When the door portion 23 is opened, the main chamber 21 and the sub-chamber 22 communicate with each other, and when the door portion 23 is closed, the main chamber 21 is air-tightly sealed.
In the main chamber 21, an air inlet hole 21 a and an air outlet hole 21 b are provided. An inert gas such as nitrogen or argon is supplied into the main chamber 21 through the air inlet hole 21 a by operation of an air supplying device (not illustrated). A gas in the main chamber 21 is exhausted from the main chamber 21 through the air outlet hole 21 b by operation of an air exhausting device (not illustrated).
Furthermore, in the main chamber 21, a transfer device (not illustrated) is provided. Furthermore, a conveying device 24 is provided from the main chamber 21 to the sub-chamber 22. The transfer device transfers the additive manufactured object 100 treated in the main chamber 21 to the conveying device 24. The conveying device 24 conveys the additive manufactured object 100 transferred from the transfer device, into the sub-chamber 22. That is, the sub-chamber 22 stores therein the additive manufactured object 100 treated in the main chamber 21. After the additive manufactured object 100 is stored in the sub-chamber 22, the door portion 23 is closed, and the sub-chamber 22 and the main chamber 21 are isolated from each other.
In the main chamber 21, the stage 12, the moving device 13, part of the nozzle device 14, the inspection device 16, and the like are provided.
The stage 12 supports the object 110. The moving device 13 can move the stage 12 in orthogonal triaxial directions.
The nozzle device 14 feeds the powdered (or linear) material 121 to the object 110 positioned on the stage 12. Furthermore, the nozzle device 14 has a nozzle 33 emitting the laser beam L1 to the object 110 positioned on the stage 12. Furthermore, the nozzle 33 emits the laser beam L1 while feeding the material 121. The nozzle device 14 emits the laser beam L1 to the material 121 to melt the material 121, and forms the layer 110 b. The nozzle device 14 repeatedly forms the layer 110 b, and sequentially stacks the layers 110 b. The nozzle device 14 constitutes a manufacturing unit 18 together with the optical device 15. The laser beam L1 is an example of a first energy beam. Note that, the energy beam preferably melts or sinters the material 121, and may be, for example, an electron beam or an electromagnetic wave ranging from microwaves to ultraviolet.
The nozzle device 14 has a feeding device 31 (manufacturing material feeding device), the nozzle 33, a feed tube 34, and the like. The material is fed from the feeding device 31 to the nozzle 33, through the feed tube 34.
The feeding device 31 includes a tank 31 a and a feed unit 31 b. The tank 31 a stores therein the powder material 121. The feed unit 31 b feeds a predetermined amount of the material 121 in the tank 31 a, to the nozzle 33. When the material 121 is the powdered material, the feed unit 31 b feeds a carrier gas (gas) containing the material 121 to the nozzle 33. The carrier gas is, for example, an inert gas such as nitrogen or argon.
The nozzle 33 has a casing 71. The casing 71 is configured to have a vertically elongated tubular shape. As illustrated in FIG. 2, in the casing 71, a plurality of passages 71 a and a single passage 71 b are provided.
The passage 71 b is positioned coaxially with an axis Ax of the casing 71. That is, the passage 71 b extends vertically. In the passage 71 b, the laser beam L1 is introduced from the optical device 15. In the passage 71 b, an optical system is provided which includes a conversion lens for converting the laser beam L1 to parallel light, and a lens for focusing the laser beam L1 converted to the parallel light. The laser beam L1 is focused under the casing 71 by the lens. The laser beam L1 has a focal point (convergence point) positioned on the axis Ax.
Each of the passages 71 a is connected to the feeding device 31 through the feed tube 34. When the material 121 is the powdered material, the material 121 is fed to each passage 71 a from the feeding device 31, together with the carrier gas. The passage 71 a has a lower portion inclined with respect to the axis Ax of the casing 71 to be closer to the axis Ax toward the lower side.
When the material 121 is the powdered material, the nozzle 33 jets (injects) the material 121 below the casing 71 (passage 71 a), from a lower end (an opening) of the passage 71 a. Alternatively, when the material 121 is the linear material, the nozzle 33 extrudes (injects) the material 121 below the casing 71 (passage 71 a), from the lower end (the opening) of the passage 71 a. The jetted or extruded material 121 reaches the convergence point of the laser beam L1. The material 121 fed by the nozzle 33 is melted by the laser beam L1 to form a mass of the molten material 121. Note that, the material 121 may be sintered by the laser beam L1.
As illustrated in FIG. 1, the optical device 15 includes a laser emitter 41 and a cable 210. The laser emitter 41 has an oscillator (not illustrated), and emits the laser beam L1 by oscillation of the oscillator. The laser emitter 41 can change a power density of the laser beam L1 to be emitted. The laser emitter 41 is connected to the nozzle 33 through the cable 210. The laser beam L1 emitted from the laser emitter 41 is guided to the nozzle 33.
As illustrated in FIG. 3, the inspection device 16 (apparatus) has a measurement unit 51, a processing unit 52, a laser interferometer 53, and an inspection unit 54 (abnormality detection unit). The measurement unit 51 measures a shape of the manufactured object 101. The processing unit 52 emits a laser beam L2 to the manufactured object 101 to partially remove a surface 101 a of the manufactured object 101, and generates an elastic wave propagating in the manufactured object 101, upon impact of emission of the laser beam L2. Furthermore, the processing unit 52 processes the surface 101 a of the manufactured object 101 on the basis of a measurement result from the measurement unit 51, and irregularities on the surface 101 a of the manufactured object 101 can be reduced, that is, can be leveled. The laser interferometer 53 detects the elastic wave. The inspection unit 54 inspects the manufactured object 101 on the basis of a detection result of the elastic wave.
The measurement unit 51 has an illuminating device 55 (illuminating apparatus), a camera 56 (imaging unit), and an image processing device (not illustrated). The measurement unit 51 measures a shape of a surface of an object to be measured (layer 110 b or manufactured object 101), for example, using a light section method. In this measurement, the illuminating device 55 emits linear light to the surface of the object to be measured (layer 110 b or manufactured object 101). The camera 56 captures an image including the linear light. The image processing device measures irregularities in the surface shape on the basis of a position of the linear light (deviation from reference line). The measurement unit 51 transmits the measured shape (measurement result) to the control unit 17 (see FIG. 1). Note that, the measurement unit 51 may measure the shape of the object to be measured using a method (e.g., interference method or the like) other than the light section method.
The processing unit 52 has a laser emitter 60 (light source), a beam splitter 61, and a lens 62 (condensing lens).
The laser emitter 60 has the oscillator (not illustrated), and emits the laser beam L2 by oscillation of the oscillator. The laser beam L2 is, for example, a pulse laser beam. The laser emitter 60 emits the laser beam L2 having intensity large enough to vaporize a solidified material 121 of the manufactured object 101. The laser beam L2 emitted from the laser emitter 60 is made incident to the beam splitter 61.
The beam splitter 61 is positioned on a side of the laser emitter 60, from which the laser beam L2 is emitted. The beam splitter 61 reflects part of the incident laser beam L2. Note that, in FIG. 3 and the like, illustration of the laser beam L2 emitted from the laser emitter 60 and passing through the beam splitter 61 is omitted. The laser beam L2 reflected from the beam splitter 61 is made incident to the lens 62.
The laser beam L2 from the beam splitter 61 is focused by the lens 62, and is emitted to the surface 101 a of the manufactured object 101 (layer 110 b). Specifically, the laser beam L2 is emitted to, for example, an end face 101 b of the manufactured object 101 in a stacking direction of the plurality of layers 110 b. At this time, the laser beam L2 is emitted to the end face 101 b (surface 101 a) of the manufactured object 101, substantially along a normal direction (stacking direction of the layers 110 b) of the end face 101 b (surface 101 a).
The processing unit 52 vaporizes part of the material of the manufactured object 101 and removes part of the manufactured object 101 with the laser beam L2 emitted to the manufactured object 101 through the above-described optical system (first optical system). At this time, the processing unit 52 can change an amount of manufactured object 101 to be removed according to a measurement result from the measurement unit 51 to reduce the irregularities on the surface 101 a (end face 101 b), that is, to level the end face 101 b (surface 101 a). The processing unit 52 can change an amount of end face 101 b (surface 101 a) to be removed by, for example, changing the intensity of the laser beam L2. In this case, the intensity of the laser beam L2 is set larger with increasing height of the surface 101 a. The processing unit 52 processes the end face 101 b to have a flat face parallel with a movement direction (direction orthogonal to the stacking direction) of the stage.
Furthermore, the processing unit 52 generates the elastic wave (density wave) in the manufactured object 101, upon impact of irradiation of the end face 101 b (surface 101 a) with the laser beam L2. In the manufactured object 101, the elastic wave radially propagates from a processing position processed by the laser beam L2 on the end face 101 b (surface 101 a). The processing unit 52 is an example of an elastic wave generation unit and a removal unit. That is, the elastic wave generation unit serves as the processing unit 52 and the removal unit. In other words, the processing unit 52 serves as the elastic wave generation unit and the removal unit. Furthermore, the laser beam L2 is an example of a second energy beam and a first laser beam.
Furthermore, an optical filter 63 is provided between the beam splitter 61 and the lens 62. The optical filter 63 is configured to transmit the laser beam L2 reflected from the beam splitter 61 to the lens 62, and not to transmit the reflected light of the laser beam L2 emitted from the lens 62 to the manufactured object 101 and reflected from the manufactured object 101. Furthermore, an optical filter (not illustrated) can be provided on the opposite side of the beam splitter 61 relative to the laser emitter 60. The optical filter does not transmit the laser beam L2 emitted from the laser emitter 60 and passing through the beam splitter 61.
The laser interferometer 53 has a laser emitter 65, a beam splitter 66, the beam splitter 61, the lens 62, a mirror 67, and a detector 64. The laser interferometer 53 detects the elastic wave propagating in the manufactured object 101. The laser interferometer 53 is an example of an elastic wave detection unit.
The laser emitter 65 has the oscillator (not illustrated), and emits a laser beam L3 oscillated by the oscillator. The laser beam L3 is, for example, a continuous laser beam (CW laser beam) or a pulse laser beam. The laser beam L3 emitted from the laser emitter 65 is made incident to the beam splitter 66.
The beam splitter 66 is positioned on a side of the laser emitter 65, from which the laser beam L3 is emitted. The beam splitter 66 partially reflects the incident laser beam L3. The laser beam L3 reflected from the beam splitter 61 is made incident to the lens 62. Note that, in FIG. 3 and the like, the laser beam L3 emitted from the laser emitter 65 and passing through the beam splitter 66 is not illustrated.
The laser beam L3 from the beam splitter 66 is focused by the lens 62, and is emitted to the end face 101 b (surface 101 a) of the manufactured object 101 (layer 110 b). At this time, the laser beam L3 is emitted to the end face 101 b (surface 101 a) of the manufactured object 101 substantially along a normal direction of the end face 101 b (surface 101 a). The laser beam L3 emitted to the end face 101 b is reflected from the end face 101 b, and is made incident to the detector 64 as detected light through the lens 62, the beam splitter 61, and the beam splitter 66. The end face 101 b of the manufactured object 101 is oscillated by a reflected wave (elastic wave) of the elastic wave reflected in the manufactured object 101. The laser interferometer 53 detects displacement of the end face 101 b on the basis of reflected light from the end face 101 b. Note that, the laser emitter 65 emits the laser beam L3 having intensity at which the material 121 does not melt on the end face 101 b.
While, part of the laser beam L3 emitted from the laser emitter 65 and made incident to the beam splitter 61 through the beam splitter 66 is reflected from the beam splitter 61 and made incident to the mirror 67.
The mirror 67 reflects the incident laser beam L3. Part of the laser beam L3 reflected from the mirror 67 is made incident to the detector 64 as reference light through the beam splitter 61 and the beam splitter 66.
The detector 64 is positioned on the opposite side of the beam splitter 66 relative to the beam splitter 61. The detector 64 receives reflected light (detected light) of the laser beam L3 reflected from the end face 101 b of the manufactured object 101, and reflected light (reference light) of the laser beam L3 reflected from the mirror 67. The detector 64 can detect displacement of the end face 101 b (temporal change in height of the end face 101 b) on the basis of interference between the detected light and the reference light. That is, the detector 64 detects the elastic wave (reflected wave) on the end face 101 b of the manufactured object 101.
The inspection unit 54 detects (determines) an abnormality 101 c in the manufactured object 101 on the basis of a detection result from the detector 64. Here, when a portion of the manufactured object 101 having no abnormality 101 c therein is inspected, the elastic wave generated on the end face 101 b reaches a bottom face of the manufactured object 101, is reflected from the bottom face, and returns to the end face 101 b. In contrast, when a portion of the manufactured object 101 having the abnormality 101 c therein is inspected, the elastic wave generated on the end face 101 b is reflected from the abnormality 101 c and returns to the end face 101 b. That is, an elapsed time is longer with increasing depth of the abnormality 101 c, and the elapsed time is shorter with decreasing depth of the abnormality 101 c. Therefore, the inspection unit 54 can detect the depth (position) of the abnormality 101 c on the basis of the elapsed time from emission of the laser beam to detection of the displacement of the end face 101 b, or on the basis of a parameter changing according to the elapsed time.
Furthermore, when the abnormality 101 c is a void, the reflected wave has a smaller intensity with decreasing size of the abnormality 101 c and with increasing density of the inspected portion, and the reflected wave has a larger intensity with increasing size of the abnormality 101 c and with decreasing density of the inspected portion. Therefore, the inspection unit 54 can detect a size of the abnormality 101 c or a density of an inspected portion, on the basis of the intensity (amplitude) of the reflected wave or the parameter changing according to the intensity of the reflected wave.
As described above, the inspection unit 54 can detect the presence or absence, the depth (position), the density, or the like of the abnormality 101 c in the manufactured object 101, on the basis of a detection result (elastic wave, elastic wave signal) from the detector 64. Note that, the inspection unit 54 can detect a position of the abnormality 101 c on a plane orthogonal to the stacking direction, on the basis of information obtained from the control unit 17 and representing an irradiation position of the laser beam L3 from the laser emitter 65. Furthermore, the inspection unit 54 has, for example, a control unit and a storage unit. The control unit has a central processing unit (CPU), a controller, or the like. The storage unit has a read only memory (ROM), a random access memory (RAM), and the like. The control unit can execute various calculation processing relating to the abnormality detection according to a loaded program (e.g., an operating system (OS), an application, or a web application).
Here, in the present embodiment, a single lens 62 focuses the laser beam L2 and the laser beam L3, as illustrated in FIG. 3. However, as illustrated in FIG. 4, a focal position (converging position) of the laser beam L2 focused by the lens 62 is different in location from a focal position (converging position) of the laser beam L3 focused by the lens 62. Specifically, in a relative movement direction of the laser beams L2 and L3, that is, the relative movement direction of the inspection device 16 relative to the manufactured object 101 (direction indicated by an arrow A in FIG. 3), an irradiation position P3 of the laser beam L3 is positioned in back (on the upstream side) of an irradiation position P2 of the laser beam L2. Therefore, the laser beam L3 is emitted to a position of the end face 101 b which has the irregularities reduced or leveled by the laser beam L2, and displacement is then detected on the basis of the reflected wave (elastic wave) from the position. Thus, according to the present embodiment, displacement can be detected with high accuracy, compare with, for example, detection of the displacement based on a reflected wave (elastic wave) from a position which has irregularities not reduced by the laser beam L2 and to which the laser beam L3 is emitted. Note that, an arrow B in FIG. 3 represents the movement direction of the stage 12 (manufactured object 101) moved by driving the moving device 13.
Furthermore, in the present embodiment, the laser beam L2 (first laser beam) and the laser beam L3 (second laser beam) may have different wavelengths so that the laser beams do not interfere with each other. Specifically, for example, the wavelength of the laser beam L2 may be shorter than the wavelength of the laser beam L3. Furthermore, the laser beam L2 and the laser beam L3 may be different in polarization direction (polarization plane) so that the laser beams do not interference with each other. Specifically, for example, one of the laser beam L2 and the laser beam L3 may be P polarized light, and the other thereof may be S polarized light.
Furthermore, when the laser beam L2 has a smaller pulse width, the elastic wave has a higher frequency and resolution is increased, whereby detection of a smaller abnormality 101 c is facilitated. However, when the laser beam L2 has the smaller pulse width, that is, the elastic wave has a higher frequency, the elastic wave is more absorbed in the manufactured object 101 and detection of the elastic wave is made more difficult. Accordingly, the pulse width of the laser beam L2 is set according to the size of the abnormality 101 c to be detected. For example, for the abnormality 101 c having a size not less than several micrometers, the pulse width of the laser beam L2 can be set to 1 fs to 1 ns.
As an example, the control unit 17 has a central processing unit (CPU) and a storage unit. The storage unit has a read only memory (ROM), a random access memory (RAM), and the like. The control unit 17 is electrically connected to the moving device 13, the optical device 15, the conveying device 24, the feeding device 31, and the inspection device 16, through a signal line 220. The control unit 17 (CPU) controls the moving device 13, the optical device 15, the conveying device 24, the feeding device 31, and the inspection device 16, according to a loaded program (e.g., an operating system (OS), an application, or a web application). The additive manufacturing apparatus 1 forms the additive manufactured object 100 on the basis of control (program) of the control unit 17.
The control unit 17 controls the moving device 13 to move the stage 12 in the triaxial directions. The control unit 17 controls the conveying device 24 to convey the additive manufactured object 100 having been formed to the sub-chamber 22. The control unit 17 controls the feeding device 31 to adjust feeding or non-feeding of the material 121 and an amount of the material 121 to be fed. The control unit 17 controls the laser emitter 41 to adjust the intensity (power density) of the laser beams L1, L2, and L3 emitted from the laser emitters 41, 60, and 65. Furthermore, the control unit 17 controls a moving device (not illustrated) to control the movement of the nozzle 33. Furthermore, the control unit 17 controls a moving device (not illustrated) to control the movement of the inspection device 16.
The storage unit of the control unit 17 stores therein data or the like representing a shape (reference shape) of the additive manufactured object 100 to be formed. This shape data includes data about the shape (reference shape) of each layer 110 b.
The control unit 17 has a function of determining the shape of the layer 110 b or the additive manufactured object 100. The control unit 17 compares the shape of the layer 110 b or the additive manufactured object 100 measured by the measurement unit 51 with the reference shape stored in the storage unit, and determines whether a portion without a predetermined shape is formed.
Furthermore, the control unit 17 has a function of trimming the shape of the layer 110 b or the additive manufactured object 100 into a predetermined shape. The control unit 17 controls the laser emitter 60 of the processing unit 52 so that the laser beam L2 has intensity strong enough to vaporize a portion (portion to be removed) of the layer 110 b or the additive manufactured object 100 having a shape other than the predetermined shape. Next, the control unit 17 controls the processing unit 52 and the moving device 13 so that the laser beam L2 is emitted to the portion. Therefore, the portion is vaporized.
Next, an example of a procedure of forming the additive manufactured object 100 by the additive manufacturing apparatus 1 (i.e., a method for producing the additive manufactured object 100) will be described with reference to a flowchart of FIG. 5.
First of all, the control unit 17 controls the moving device 13, the nozzle device 14, and the optical device 15 to form the layer 110 b (S1). At S1, the material 121 is fed and the laser beam L1 is emitted on the basis of the data (reference data) about the layer 110 b stored in the storage unit. At this time, the control unit 17 controls the moving device 13, the feeding device 31, and the like to feed the material 121 from the nozzle 33 to a predetermined range, and controls the laser emitter 41 to melt the fed material 121 by the laser beam L1. Therefore, a predetermined amount of the molten material 121 is fed to a range in which the layer 110 b is formed on the base 110 a. At this time, in the present embodiment, the material 121 is fed so that the layer 110 b to be formed has a height larger than the height in the data about the layer 110 b stored in the storage unit. After the material 121 is jetted or extruded on the base 110 a or the layer 110 b, a mass of the material 121, such as a layer or a thin film, is formed. At this time, the material 121 is cooled by the carrier gas carrying the material 121 or solidified by being cooled due to heat transfer to the mass of the material 121, and then the layer 110 b is formed. The control unit 17 may perform annealing. In the annealing, the control unit 17 controls the laser emitter 41 so that the laser beam L1 is emitted to the layer 110 b onto the base 110 a. Therefore, after the material 121 in the layer 110 b is melted again, the material 121 is solidified again. Note that, annealing may be performed outside the additive manufacturing apparatus 1, using an annealing apparatus (not illustrated).
Next, the control unit 17 controls the inspection device 16 and the moving device 13 to inspect inside the manufactured object 101 (S2: abnormality detection process (inspection process)). As illustrated in FIG. 6, at S2, shape measurement, trimming, and inspection are performed. First of all, the control unit 17 controls the measurement unit 51 and the moving device 13 to measure the shape (surface shape, three-dimensional shape) of the surface 101 a of the layer 110 b of the manufactured object 101. The control unit 17 obtains measured shape data representing the shape of the layer 110 b from the measurement unit 51. Then, the control unit 17 controls the processing unit 52 and the moving device 13 to trim the end face 101 b of the manufactured object 101 (surface 101 a). At this time, the control unit 17 controls the processing unit 52 and the moving device 13 so that the height of the layer 110 b is substantially the same as the height indicated in the data about the layer 110 b stored in the storage unit (e.g., a certain height). At this time, the control unit 17 changes the amount of end face 101 b to be removed according to a measured height of the end face 101 b of the layer 110 b (irregularities) so that the height of the end face 101 b of the layer 110 b (thickness of the layer 110 b) is substantially constant. Specifically, the control unit 17 controls the processing unit 52 so that the laser beam L2 has intensity according to the amount of end face 101 b to be removed. Therefore, for example, a next layer 110 b can be effectively formed flat, or accuracy in inspection of the elastic wave is effectively increased. Trimming is performed with emission of the laser beam L2 by the processing unit 52. Then, the laser interferometer 53 detects, using the laser beam L3, the elastic wave generated by emission of the laser beam L2, and the inspection unit 54 detects (determines) the presence or absence of an abnormality 101 c in the manufactured object 101 on the basis of a detection result from the laser interferometer 53. The detection of the presence or absence of the abnormality 101 c is performed whenever the laser beam L2 is emitted. In the present embodiment, detection of the presence or absence of the abnormality 101 c is performed for whole area of the end face 101 b. Furthermore, when comparison, which is performed between reference shape data about the layer 110 b stored in the storage unit and the measured shape data as a measurement result from the measurement unit 51, shows that the manufacturing is performed in a portion (area) where the manufacturing should not be performed, the control unit 17 removes the portion at the trimming. For example, when manufacturing is performed in a portion (area) where manufacturing should not be performed in a direction orthogonal to the stacking direction, the control unit 17 removes the portion.
S2 may be performed whenever one layer 110 b is formed, or may be performed whenever a plurality of layers 110 b is formed. S2 is performed after the layer 110 b is formed. Note that, the shape measurement and the trimming may be performed whenever one layer 110 b is formed, and detection of the elastic wave may be performed whenever a plurality of layers 110 b is formed.
Then, as illustrated in FIG. 5, when the inspection device 16 (the inspection unit 54) detects an abnormality 101 c in the manufactured object 101 (“Yes” at S3), the control unit 17 repairs (removes) the abnormality 101 c (S4: repairing processing). When the abnormality 101 c is a void, at S4, formation of an opening, manufacturing (filling), and removal of a protruding portion are performed, as illustrated in FIG. 7. First of all, the control unit 17 controls the processing unit 52 and the moving device 13 to remove a portion of the manufactured object 101 between the end face 101 b (surface 101 a) and the abnormality 101 c, that is, a portion of the manufactured object 101 on a side of the end face 101 b relative to the abnormality 101 c. Therefore, an opening 101 d is formed in the manufactured object 101 to have the abnormality 101 c at the bottom. Next, the control unit 17 controls the manufacturing unit 18 so that the opening 101 d is filled with the material 121 and the material 121 is solidified. At this time, the manufacturing unit 18 performs manufacturing, for example, until the material 121 protrudes from the opening 101 d. Then, the control unit 17 controls the processing unit 52 to remove at least part of the manufactured object 101 protruded from the opening 101 d, that is, all or part of a portion of the manufactured object 101 protruding from the opening 101 d. More specifically, the control unit 17 controls the laser emitter 60 of the processing unit 52 to vaporize the protruding portion (material 121) protruded from the opening 101 d. Since the protruding portion is removed as described above, a filled portion is further readily leveled. Note that, S4 may be performed whenever a plurality of layers 110 b is formed.
In contrast, when the inspection device 16 does not detect the abnormality 101 c in the manufactured object 101 (“No” at S3), S4 is not performed.
Next, as illustrated in FIG. 5, when not all layers 110 b are formed (“No” at S5), the processing returns to S1, and a new layer 110 b is formed on the layer 110 b having been formed. The control unit 17 repeatedly performs processing of S1 to S5 to stack the plurality of layers 110 b. When all layer 110 b are formed (“Yes” at S5), a series of processing is finished.
As described above, in the present embodiment, the manufacturing unit 18 sequentially stacks the layer 110 b formed by emitting the laser beam L1 (first energy beam) to the powdered (or linear) material 121 and solidifying the material 121; the processing unit 52 (elastic wave generation unit) generates the elastic wave propagating in the manufactured object 101 including at least one layer 110 b; the laser interferometer 53 detects the elastic wave; and the inspection unit 54 inspects the manufactured object 101 on the basis of a detection result from the laser interferometer 53. Thus, the abnormality 101 c in the manufactured object 101 can be detected.
Furthermore, in the present embodiment, the processing unit 52 emits the laser beam L2 (second energy beam) to process the surface 101 a of the manufactured object 101. The processing unit 52 emits the laser beam 12 to the surface 101 a to generate the elastic wave. That is, since the processing unit 52 functions as the elastic wave generation unit, the additive manufacturing apparatus 1 can have a simple configuration in comparison with a configuration in which the elastic wave generation unit is provided separately from the processing unit 52.
Furthermore, in the present embodiment, the laser beam L2 (first laser beam) and the laser beam L3 (second laser beam) do not interfere with each other. Thus, the abnormality 101 c in the manufactured object 101 can be detected with high accuracy.
Furthermore, in the present embodiment, a single lens 62 focuses the laser beam L2 and the laser beam L3. Thus, the additive manufacturing apparatus 1 can have a simple configuration in comparison with a configuration in which the laser beam L2 and the laser beam L3 are focused by different lenses.
Furthermore, in the present embodiment, the processing unit 52 (removal unit) can partially remove the manufactured object 101. When the inspection unit 54 detects the abnormality 101 c in the manufactured object 101, the processing unit 52 partially removes the manufactured object 101 from the surface 101 a of the manufactured object 101 to the abnormality 101 c, and then the manufacturing unit 18 fills the material 121 in the opening 101 d of the manufactured object 101 formed after removal thereof by the processing unit 52, so that the material 121 is solidified. Thus, the manufactured object 101 repaired after removing the abnormality 101 c can be obtained.

Second Embodiment

An additive manufacturing apparatus 1A according to the present embodiment includes a configuration similar to that of the additive manufacturing apparatus 1 according to the first embodiment. However, in the present embodiment, an inspection device 16A is different from the inspection device 16 according to the first embodiment, as illustrated in FIG. 8.
The inspection device 16A has the measurement unit 51, a processing unit 52A, a laser interferometer 53A, and the inspection unit 54.
In the present embodiment, a laser emitter 201 (light source), the beam splitter 61, the beam splitter 66, a beam splitter 202, the mirror 67, a mirror 203, the lens 62 (condensing lens), a wavelength converter 204, a light intensity adjusting member 205, and the detector 64 are provided as members constituting the processing unit 52A and the laser interferometer 53A. The processing unit 52A has the laser emitter 201, the beam splitters 61 and 202, the mirror 203, and the lens 62. In contrast, the laser interferometer 53A has the laser emitter 201, the beam splitters 61, 66, and 202, the lens 62, the mirror 67, the wavelength converter 204, the light intensity adjusting member 205, and the detector 64. The processing unit 52A is an example of the elastic wave generation unit and the removal unit.
The laser emitter 201 has the oscillator (not illustrated), and emits a laser beam L4 oscillated by the oscillator. The laser beam L4 is, for example a pulse laser beam. The laser beam L4 is an example of a third laser beam.
The laser beam L2 emitted from the laser emitter 201 is made incident to the beam splitter 202, and is divided into the laser beam L2 and the laser beam L3 by the beam splitter 202. The beam splitter 202 is an example of a dividing unit.
The laser beam L2 is reflected from the mirror 203 and is made incident to the beam splitter 61. The laser beam L2 is partially reflected from the beam splitter 61, is focused by the lens 62, and is emitted to the end face 101 b of the manufactured object 101.
The laser beam L3 is made incident to the wavelength converter 204 and the light intensity adjusting member 205 in sequence, is converted in wavelength by the wavelength converter 204, and is reduced in light intensity by the light intensity adjusting member 205. The laser beam L3 emitted from the light intensity adjusting member 205 is made incident to the beam splitter 66. The laser beam L3 is partially reflected by the beam splitter 66, and is made incident to the beam splitter 61. The laser beam L3 incident to the beam splitter 61 is divided into light incident to the lens 62 and light incident to the mirror 67, similarly to the first embodiment. The laser beam L3 incident to the lens 62 is focused by the lens 62, and is emitted to the end face 101 b of the manufactured object 101. The laser beam L3 emitted to the end face 101 b of the manufactured object 101 is reflected from the end face 101 b, and is made incident to the detector 64 through the lens 62, the beam splitter 61, and the beam splitter 66. In contrast, the laser beam L3 reflected from the mirror 67 is made incident to the detector 64 through the beam splitter 61 and the beam splitter 66. Note that, the laser beam L3 is adjusted by the light intensity adjusting member 205 in light intensity to have intensity small enough to prevent melting of the material 121 on the end face 101 b.
Furthermore, also in the present embodiment, a single lens 62 focuses the laser beam L2 and the laser beam L3, similarly to the first embodiment. Furthermore, the focal position (converging position) of the laser beam L2 focused by the lens 62 is different in location from the focal position (converging position) of the laser beam L3 focused by the lens 62. Specifically, in a relative movement direction of the laser beams L2 and L3, that is, a relative movement direction of the inspection device 16A relative to the manufactured object 101 (e.g., direction indicated by an arrow A), an irradiation position P3 of the laser beam L3 is positioned in back (on the upstream side) of an irradiation position P2 of the laser beam L2.
Furthermore, in the present embodiment, since the wavelength of the laser beam L3 of the laser beam L2 is converted by the wavelength converter 204, the laser beam L3 and the laser beam L2 do not interference with each other even if the laser beam L3 and the laser beam L2 overlap each other.
As described above, in the present embodiment, a single laser emitter 201 emits the laser beam L4 (third laser beam), and the beam splitter 202 (dividing unit) divides the laser beam L4 emitted from the laser emitter 201 into the laser beam L2 (first laser beam) and the laser beam L3 (second laser beam). Thus, the number of laser emitters 201 can be reduced in comparison with a configuration in which laser emitters are provided for the laser beams L2 and L3 emitted from the laser emitter 201.
Note that, each of the above-described embodiments may be configured, for example, so that the feeding device 31 supplies a plurality of materials 121 of different kinds to the nozzle 33 and the plurality of different materials 121 is selectively supplied from the nozzle 33 so as to adjust (change) the percentages of the materials 121. Therefore, a gradient material (functional gradient material), in which the proportions of the materials 121 change (gradually reduce or gradually increase) according to the position (location) in the additive manufactured object 100, can be manufactured. Specifically, for example, upon forming the layer 110 b, the control unit 17 can control the feeding device 31 to have the proportions of the materials 121 set (stored) corresponding to each position of three-dimensional coordinates of the additive manufactured object 100, so that the additive manufactured object 100 can be formed as the gradient material (functional gradient material) in which the proportions of the materials 121 are arbitrarily changed in a three-dimensional direction. An amount of change (rate of change) in percentage of the material 121 per unit length can be also variously set.
As described above, according to each of the above-described embodiments, the additive manufacturing apparatuses 1 and 1A and the additive manufacturing method can be obtained by which the abnormality 101 c in the manufactured object 101 can be detected, for example.
Certain embodiments have been described, but these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. The novel embodiments may be embodied in a variety of other forms, and furthermore, various omissions, substitutions and changes may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such embodiments or modifications as would fall within the scope and spirit of the inventions.
For example, the additive manufacturing apparatus may have a configuration (powder bed process) or the like, in which a step of feeding powder material by a material feed unit to form a material layer and a step of emitting the first energy beam such as laser beam to the material layer by an irradiation device to solidify a material are repeatedly performed to stack individualized layers (layers) for manufacturing. In this configuration, the material 121 protruded from the opening 101 d may be removed as required. For example, when the material 121 protruded from the opening 101 d has a height smaller than the height of the material layer, the material 121 may not be removed.
Furthermore, in each of the above-described embodiments, the elastic wave is generated in an ablation mode using the laser beam L2 emitted from the processing unit 52, but a configuration for emitting the laser beam may be provided separately from the processing unit 52 to generate the elastic wave in a thermal stress mode using the laser beam.

Claims

1. An additive manufacturing apparatus comprising:

a manufacturing unit that sequentially stacks a layer formed by emitting a first energy beam to a material and solidifying the material;

an elastic wave generation unit that emits a second energy beam to a manufactured object including the layer and generates an elastic wave propagating in the manufactured object;

an elastic wave detection unit that detects the elastic wave; and

an inspection unit that inspects the manufactured object on the basis of a detection result from the elastic wave detection unit.

2. The additive manufacturing apparatus according to claim 1, wherein

the elastic wave generation unit is served as a processing unit that processes a surface of the manufactured object by emitting the second energy beam.

3. The additive manufacturing apparatus according to claim 2, further comprising

a measurement unit that measures a shape of the layer, wherein

the processing unit processes the surface on the basis of a measurement result from the measurement unit.

4. The additive manufacturing apparatus according to claim 2, wherein

the elastic wave detection unit detects the elastic wave in an area of the manufactured object having the surface processed by the processing unit.

5. The additive manufacturing apparatus according to claim 2, wherein

the second energy beam is a first laser beam,

the elastic wave detection unit is a laser interferometer that emits a second laser beam to the surface and receives reflected light of the second laser beam reflected from the surface, and

the first laser beam and the second laser beam do not interfere with each other.

6. The additive manufacturing apparatus according to claim 5, further comprising

a single lens that focuses the first laser beam and the second laser beam.

7. The additive manufacturing apparatus according to claim 5, further comprising:

a single laser emitter that emits a third laser beam; and

a dividing unit that divides the third laser beam emitted from the laser emitter into the first laser beam and the second laser beam.

8. The additive manufacturing apparatus according to claim 1, further comprising

a removal unit that is capable of partially removing the manufactured object, wherein

when the inspection unit detects abnormality in the manufactured object, the removal unit partially removes the manufactured object from the surface of the manufactured object to the abnormality, and the manufacturing unit fills the material in an opening of the manufactured object formed after removal thereof by the removal unit and solidifies the material.

9. The additive manufacturing apparatus according to claim 8, wherein

the removal unit removes at least part of the manufactured object protruded from the opening.

10. An additive manufacturing method comprising:

emitting a first energy beam to a material and solidifying the material to form a layer;

emitting a second energy beam to a manufactured object including the layer, and generating an elastic wave propagating in the manufactured object;

detecting the elastic wave; and

inspecting the manufactured object on the basis of a detection result about the elastic wave.

11. The additive manufacturing method according to claim 10, further comprising:

processing a surface of the manufactured object by emitting the second energy beam; and

generating the elastic wave by processing the surface.

12. The additive manufacturing method according to claim 11, further comprising:

measuring a shape of the layer; and

processing the surface on the basis of a result of the measurement.

13. The additive manufacturing method according to claim 11, wherein

the detecting includes detecting the elastic wave in an area of the manufactured object in which the surface is processed.

14. The additive manufacturing method according to claim 11, wherein

the second energy beam is a first laser beam,

the additive manufacturing method further comprises emitting the second laser beam to the surface and receiving reflected light of the second laser beam reflected from the surface to detect the elastic wave, and

15. The additive manufacturing method according to claim 14, further comprising:

emitting a third laser beam; and

dividing the third laser beam into the first laser beam and the second laser beam.

16. The additive manufacturing method according to claim 10, further comprising

when abnormality in the manufactured object is detected, partially removing the manufactured object from the surface of the manufactured object to the abnormality, and filling the material in an opening of the manufactured object formed after removal thereof and solidifying the material.

17. The additive manufacturing method according to claim 16, wherein

the partially removing includes removing at least part of the manufactured object protruded from the opening.