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US20160370133A1 - Metal Foil and Composite Heat Dissipating Plate Thereof - Google Patents

Metal Foil and Composite Heat Dissipating Plate Thereof Download PDF

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Publication number
US20160370133A1
US20160370133A1 US15/168,100 US201615168100A US2016370133A1 US 20160370133 A1 US20160370133 A1 US 20160370133A1 US 201615168100 A US201615168100 A US 201615168100A US 2016370133 A1 US2016370133 A1 US 2016370133A1
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US
United States
Prior art keywords
metal foil
heat dissipating
copper foil
composite heat
dissipating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/168,100
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English (en)
Inventor
Wei Jen Liu
Zheng Zhe Xie
Jun Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
The-Hydroxyl(r) Applied Carbon Technology Inc
Chung Yuan Christian University
Original Assignee
The-Hydroxyl(r) Applied Carbon Technology Inc
Chung Yuan Christian University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The-Hydroxyl(r) Applied Carbon Technology Inc, Chung Yuan Christian University filed Critical The-Hydroxyl(r) Applied Carbon Technology Inc
Assigned to The-hydroxyl® Applied Carbon Technology, Inc., CHUNG YUAN CHRISTIAN UNIVERSITY reassignment The-hydroxyl® Applied Carbon Technology, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, WEI JEN, SHEN, JUN, XIE, ZHENG ZHE
Publication of US20160370133A1 publication Critical patent/US20160370133A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H10W40/255—
    • H10W40/258—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials

Definitions

  • the present invention relates to a metal foil and a composite heat dissipating plate thereof, more particularly, to a composite heat dissipating plate comprising a metal foil with an excellent heat dissipating performance.
  • the object of the present invention is to provide a highly thermal conductive and heat radiation absorptive metal foil and a composite heat dissipating plate thereof that are suitable for continuous industrial productions.
  • Materials of the metal foil may be selected from at least one of copper, aluminum, copper alloy and aluminum alloy, but not limited hereto in the present invention.
  • copper foil is selected as the material, and the basis weight, copper content and surface roughness thereof are altered to obtain a copper foil with high thermal conductivity and heat radiation absorption, and a composite heat dissipating plate structure of the same.
  • the copper foil may be a rolled copper foil or an electrolytic copper foil, and the basis weight, copper content and surface roughness thereof are altered before being proceed to fabricate the composite heat dissipating plate.
  • Such alterations change thermal conductive characteristics of the copper foil, the roughness on the surface increases the surface area so that the heat radiation absorption is higher, and a larger contact surface and bonding strength to at least one nitrogen-doped graphene coating or other coating layers. These simple alterations maximize the thermal conductivity of the copper foil and the composite heat dissipating plate thereof.
  • Another object of the present invention is to provide metal foils of different basis weights and copper contents, and heat dissipating plates thereof.
  • Materials of the metal foil may be selected from at least one of copper, aluminum, copper alloy and aluminum alloy, but not limited hereto in the present invention.
  • the metal foil is a copper foil in embodiments of the present invention.
  • a double sided tape may be used to attach the copper foil or the composite heat dissipating plate to a base material of a testing fixture, so that the copper foil or the composite heat dissipating plate may be positioned towards a heat source to absorb heats generated by a central processing unit (CPU) or a battery pack. The heats are directed away from the heat source through thermal conduction or thermal radiation to prevent a reduced battery performance or damages to electronic components due to accumulated heats in electronic products.
  • CPU central processing unit
  • the present invention provides a metal foil with a basis weight of at least 220 g/m 2 and a metal content of at least 90%.
  • the metal foil aforementioned is a copper foil.
  • the metal foil aforementioned has a basis weight between 220 to 884 g/m 2 .
  • the metal foil aforementioned has a metal content of at least 98%.
  • the metal foil aforementioned has a first surface and an opposite second surface, and at least one of the above-mentioned surfaces has a roughness of 0.19 ⁇ Ra ⁇ 0.23 ⁇ m.
  • the metal foil aforementioned has a first surface and an opposite second surface, and at least one of the above-mentioned surfaces has a roughness of 1.3 ⁇ Rt ⁇ 1.84 ⁇ m.
  • the metal foil aforementioned has a first surface and an opposite second surface, and at least one of the above-mentioned surfaces has a roughness of 1.02 ⁇ Rz ⁇ 1.07 ⁇ m.
  • the metal foil aforementioned has crystal size between 308 and 434 ⁇ .
  • the metal foil aforementioned has a lightness of surface colors of 25 ⁇ L* ⁇ 40.
  • the present invention further provides a composite heat dissipating plate with a metal foil which having a first surface and an opposite second surface, wherein the metal foil has a basis weight of at least 220 g/m 2 , a metal content of at least 90%, and at least a layer of nitrogen-doped graphene coated on at least one of the first surface and the second surface.
  • the metal foil of the composite heat dissipating plate aforementioned is a copper foil.
  • the metal foil of the composite heat dissipating plate aforementioned has a basis weight between 220 to 884 g/m 2 .
  • the metal foil of the composite heat dissipating plate aforementioned has a metal content of at least 98%.
  • the metal foil of the composite heat dissipating plate aforementioned has a preferred roughness of 0.19 ⁇ Ra ⁇ 0.23 ⁇ m on at least one of the first surface and the second surface.
  • the metal foil of the composite heat dissipating plate aforementioned has a preferred roughness of 1.3 ⁇ Rt ⁇ 1.84 ⁇ m on at least one of the first surface and the second surface.
  • the metal foil of the composite heat dissipating plate aforementioned has a preferred roughness of 1.02 ⁇ Rz ⁇ 1.07 ⁇ m on at least one of the first surface and the second surface.
  • the metal foil of the composite heat dissipating plate aforementioned has crystal size between 308 and 434 ⁇ .
  • the metal foil of the composite heat dissipating plate aforementioned has a lightness of surface colors of 25 ⁇ L* ⁇ 40.
  • FIG. 1 is a schematic illustration of a structure of a copper foil according to basis for comparison, comparing samples 1 to 7, and embodiments 1 to 12 of the present invention
  • FIG. 2 is a schematic illustration of a structure of a composite heat dissipating plate according to embodiment 13 of the present invention
  • FIG. 3 is a schematic illustration of a structure of a composite heat dissipating plate according to embodiment 14 of the present invention.
  • FIG. 4 is a schematic illustration of a testing fixture for the copper foil according to basis for comparison, comparing samples 1 to 7, and embodiments 1 to 12 of the present invention
  • FIG. 5 is a schematic illustration of a testing fixture for the composite heat dissipating plate according to embodiment 13 of the present invention.
  • the following description discloses various thicknesses, basis weights, copper contents and surface roughnesses of a copper foil, and compares effects in thermal conductivities thereof.
  • the copper foil has a thickness between 14 and 100 ⁇ m, a basis weight between 124 and 884 g/m 2 , and a preferred basis weight between 220 and 884 g/m 2 .
  • the copper foil has a first surface and an opposite second surface, and at least one of the above-mentioned surfaces has a roughness of 0.19 ⁇ Ra ⁇ 0.23 ⁇ m, 1.3 ⁇ Rt ⁇ 1.84 ⁇ m and/or 1.02 ⁇ Rz ⁇ 1.07 ⁇ m.
  • the roughness may be a naturally formed rough structure on ordinary copper foil (sometimes referred as rolled copper foil), electrolytic processed (sometimes referred as electrolytic copper foil), or through other ordinary techniques of forming rough structures on copper foil or other metals, but not limited thereto in the present invention.
  • the copper foil is a rolled copper foil with a naturally formed roughness, an electrolytic copper foil with a roughness formed with existing electrolytic methods, or other copper foils with roughness and not limited thereto in the present invention.
  • certain values of basis weight and copper content are required for the rolled copper foil and electrolytic copper foil to achieve a preferred heat dissipating performance.
  • Values of Ra, Rt and Rz are different when roughness on rolled copper foil and electrolytic copper foil are different. If values of Ra, Rt and Rz are too high, the basis weight and copper content are insufficient and resulting a poor heat dissipating performance.
  • Ra, Rt and Rz represent different surface roughness measuring methods in surface profile measurement.
  • Ra represents an arithmetic average of absolute values, that is the average of absolute values of the vertical deviations of the roughness profile from the mean line.
  • Rt represents a maximum height of the profile, that is the distance between the highest peak and lowest valley in each sampling length.
  • Rz represents a 10 (ten) points average roughness, that is the average distance between 5 (five) highest peak and 5 (five) lowest valley in each sampling length.
  • the copper foil further has various crystal size and lightnesses of surface colors.
  • Crystal size are crystallinities of the copper foil which may be defined by using X-ray diffraction or other methods of defining crystal size of metal foils.
  • Lightnesses of surface colors are scales of perceived color characteristics of copper foil surfaces.
  • the L*a*b color space developed by International Commission on Illumination (CIE) in 1976, or CIE 1976 color space, has been adopted as an industrial standard to precisely describe colors and lightness, wherein, L* indicates lightness, a* and b* indicate color opponent dimensions. L* is used to indicate lightness of surface color of the copper foil in the present invention.
  • a layer of nitrogen-doped graphene (referred as N-graphene hereafter) is applied on at least one of the first surface or the second surface of the copper foil by coating or other applying methods.
  • the N-graphene may be prepared by doping nitrogen into graphene, wherein the graphene may be obtained through mechanical exfoliation, oxidation reduction, or electrochemical methods, and not limited thereto in the present invention.
  • the graphene may be selected from at least one of monolayer graphene, multilayer graphene, graphene oxide, reduced graphene oxide and graphene derivatives, and not limited thereto in the present invention.
  • FIGS. 1 and 4 are schematic illustrations of structures of a copper foil and a testing fixture according to the basis for comparison, comparing samples 1 to 7, and embodiments 1 to 8 of the present invention.
  • the copper foil 101 has a first surface 112 and an opposite second surface 113 .
  • the present invention provides a temperature testing method with following steps: applying a double sided tape 103 or other adhesive materials on the second surface 113 of the copper foil 101 , attaching the copper foil 101 together with the double sided tape 103 on a base material 106 , and then placing in the testing fixture for temperature tests.
  • the testing fixture may be regarded as a simulation of a tablet PC, wherein a heating chip 107 of one square centimeter (1 ⁇ 1 cm 2 ) in size is attached to a copper plate 105 to simulate an operating a central processing unit (CPU), and a tin foil 111 attached thereunder is to simulate other electrical parts of the tablet PC.
  • the testing fixture has three sensing spots for temperature tests, namely a thermal spot 110 on the heating chip 107 , a first testing spot 108 on the base material 106 on top of the heating chip 107 , and a second testing spot 109 which is also on the base material 106 and 0.5 (zero point five) to 5 (five) centimeters apart from the first testing spot 108 .
  • the temperature testing method measures the gap between a temperature difference T 1 (° C.)(as basis value) and another temperature difference T 2 (° C.), wherein the temperature difference T 1 is measured between the first testing spot 108 and the second testing spot 109 of the copper foil 101 of the basis for comparison, and the temperature difference T 2 is measured between the first testing spot 108 and the second testing spot 109 of the copper foil 101 .
  • the horizontal distance between the first testing spot 108 and the second testing spot 109 is 0.5 (zero point five) centimeter, but not restricted thereto in other embodiments of the present invention. Testing results are shown in Table 1. With reference to FIG.
  • the temperature on the thermal spot 110 is higher than the temperature on the first testing spot 108
  • the temperature on the first testing spot 108 is higher than the temperature on the second testing spot 109 .
  • Heats are effectively directed away from the heating chip 107 when the copper foil 101 has a good heat dissipating performance, the temperature on the first testing spot 108 and the temperature on the second testing spot 109 are closer as a result.
  • the temperature difference T 2 between the first testing spot 108 and the second testing spot 109 of the copper foil 101 is smaller, the temperature difference T 1 between the first testing spot 108 and the second testing spot 109 of the copper foil 101 of the basis for comparison is larger, hence T 1 (° C.) is greater than T 2 (° C.). Therefore, a positive value of T 1 minus T 2 indicates a good heat dissipating performance of the copper foil 101 , where the greater the value, the better the heat dispatching performance.
  • embodiment 5 is a result of additional 184.33 g/m 2 copper basis weight on comparing sample 4, and has a copper content of 98.3%, Ra of 0.19 ⁇ m, Rt of 1.3 ⁇ m, Rz of 1.07 ⁇ m.
  • the heat dissipating performance of embodiment 5 is 2.24° C. higher as compared to comparing sample 4. Therefore, the heat dissipating performance of the copper foil improves with an increased copper basis weight.
  • comparing sample 5 is a result of additional 41.67 g/m 2 copper basis weight and less 20.2% copper content on embodiment 5, and has a copper basis weight of 350 g/m 2 , copper content 78.1%, Ra of 0.19 ⁇ m, Rt of 1.44 ⁇ m, Rz of 1.02 ⁇ m.
  • the heat dissipating performance of comparing sample 5 is 0.428° C. lower than embodiment 5. Therefore, aside from the copper basis weight, the copper content also affects the heat dissipating performance. Comparing samples 1 to 7 and embodiments 1 to 8 clearly indicate that the copper foil 101 has better heat dissipating performances when the basis weight is at least 220 g/m 2 and the copper content is at least 90%.
  • copper foil 101 has a roughness of 0.19 ⁇ Ra ⁇ 0.23 ⁇ m, 1.3 ⁇ Rt ⁇ 1.84 ⁇ m and/or 1.02 ⁇ Rz ⁇ 1.07 ⁇ m on at least one of the first surface and the second surface.
  • FIGS. 1 and 4 are schematic illustrations of structures of a copper foil and a testing fixture according to embodiments 9 to 12 of the present invention.
  • the copper foil 101 has a first surface 112 and an opposite second surface 113 .
  • the copper foil 101 used in embodiments 9 to 12 has the same copper basis weight of 313.53 g/m 2 , copper content of 99.98% and copper foil thickness of 35 ⁇ m.
  • the same temperature testing method to the basis for comparison, comparing samples 1 to 7, and embodiments 1 to 8 is applied.
  • the gap between the temperature difference T 1 of the copper foil 101 of the basis for comparison (as basis value) and the temperature difference T 2 of the copper foil 101 of embodiments 9 to 12 is tested.
  • the testing fixture is as shown in FIG. 4 and the results are shown in Table 2.
  • T 1 minus T 2 values of embodiments 9 to 12 are all positive which indicates better heat dissipating performances.
  • the copper foil 101 have crystal size between 308 and 434 ⁇ and/or lightness of surface colors of 25 ⁇ L
  • FIGS. 2 and 5 are schematic illustrations of the composite heat dissipating plate and the testing fixture of embodiment 13.
  • a composite heat dissipating plate 100 includes a copper foil 101 having a first surface 112 , an opposite second surface 113 , and a layer of N-graphene 102 coated on the first surface 112 of the copper foil 101 .
  • the copper foil 101 has a copper basis weight of 308.33 g/m 2 , a copper content of 98.3%, and a copper foil thickness of 35 ⁇ m.
  • the layer of N-graphene 102 has a nitrogen content of 3.92 wt %, coating thickness of 15 ⁇ m, and is coated on a single side.
  • the present invention provides a temperature testing method including following steps: applying a double sided tape 103 or other adhesive materials on the second surface 113 of the copper foil 101 of the composite heat dissipating plate 100 , attaching the composite heat dissipating plate 100 together with the double sided tape 103 onto the base material 106 , and then placing in the testing fixture for temperature tests.
  • the testing fixture may be regarded as a simulation of a tablet PC, wherein a heating chip 107 of one square centimeter (1 ⁇ 1 cm 2 ) in size is attached to the copper plate 105 to simulate an operating CPU, and a tin foil 111 attached thereunder is to simulate other electrical parts of the tablet PC.
  • the testing fixture has 3 (three) sensing spots to detect temperatures, namely a thermal spot 110 on the heating chip 107 , a first testing spot 108 on the base material 106 on top of the heating chip 107 , and a second testing spot 109 which is also on the base material 106 and 0.5 (zero point five) to 5 (five) centimeters apart from the first testing spot 108 .
  • the temperature testing method measures the gap between a temperature difference T 1 (° C.) (as basis value) and another temperature difference T 2 (° C.), wherein the temperature difference T 1 is measured between the first testing spot 108 and the second testing spot 109 of the copper foil 101 , and the temperature difference T 2 is measured between the first testing spot 108 and the second testing spot 109 of the composite heat dissipating plate 100 , and the first testing spot 108 is 0.5 centimeters apart from the second testing spot 109 .
  • Testing results are shown in Table 3. With reference to FIG. 5 , the temperature on the thermal spot 110 is higher than the temperature on the first testing spot 108 , and the temperature on the first testing spot 108 is higher than the temperature on the second testing spot 109 .
  • Heats are effectively directed away from the heating chip 107 when the composite heat dissipating plate 100 has a good heat dissipating performance, the temperature on the first testing spot 108 and the temperature on the second testing spot 109 are closer as a result.
  • the temperature difference T 2 between the first testing spot 108 and the second testing spot 109 of the composite heat dissipating plate 100 is smaller, the temperature difference T 1 between the first testing spot 108 and the second testing spot 109 of the copper foil 101 is larger, hence T 1 (° C.) is greater than T 2 (° C.). Therefore, a positive value of T 1 minus T 2 indicates a good heat dissipating performance of the composite heat dissipating plate 100 , where the greater the value, the better the heat dissipating performance.
  • FIG. 3 is a schematic illustration of a structure of a composite heat dissipating plate according to embodiment 14 of the present invention.
  • the composite heat dissipating plate 200 includes a copper foil 101 having a first surface 112 , an opposite second surface 113 , and 2 (two) layers of N-graphene 102 respectively coated on the first surface 112 and the second surface 113 of the copper foil 101 .
  • the copper foil 101 has a copper basis weight of 309 g/m 2 , a copper content of 98.5% and a copper foil thickness of 35 ⁇ m.
  • the 2 (two) layers of N-graphene 102 have a nitrogen content of 3.92 wt %, coating thickness of 65 ⁇ m, and coated on double sides of the copper foil 101 .
  • T 1 minus T 2 values are all positive in embodiments 13 and 14, which indicates that better heat dissipating performances are achieved regardless the layer of N-graphene 102 is coated on a single side (the composite heat dissipating plate 100 ) or on double sides (the composite heat dissipating plate 200 ).
  • the copper foil 101 has a first surface 112 and an opposite second surface 113 , and at least one of the surfaces has a roughness of Ra of 0.19 ⁇ m, 1.3 ⁇ Rt ⁇ 1.44 ⁇ m and/or 1.02 ⁇ Rz ⁇ 1.07 ⁇ m.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US15/168,100 2015-06-22 2016-05-30 Metal Foil and Composite Heat Dissipating Plate Thereof Abandoned US20160370133A1 (en)

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TW104120046A TWI592294B (zh) 2015-06-22 2015-06-22 Metal foil and its composite heat sink
TW104120046 2015-06-22

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US9709348B2 (en) * 2015-10-27 2017-07-18 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
US20180106162A1 (en) * 2016-10-13 2018-04-19 General Electric Company Graphene discs and bores and methods of preparing the same
WO2018215664A1 (en) * 2017-05-26 2018-11-29 Graphitene Ltd. Heat spreader and method of manufacture thereof
US10349531B2 (en) * 2015-07-16 2019-07-09 Jx Nippon Mining & Metals Corporation Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
US10356898B2 (en) 2015-08-06 2019-07-16 Jx Nippon Mining & Metals Corporation Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
CN110246808A (zh) * 2018-03-09 2019-09-17 南京银茂微电子制造有限公司 具有降低的结温的功率模块及其制造方法
US10863654B1 (en) * 2019-09-20 2020-12-08 Wuhan China Star Optoelectronics Technology Co., Ltd. Display device
JP2022191175A (ja) * 2021-06-15 2022-12-27 薩摩亞商隆揚國際股▲分▼有限公司台灣分公司 グラファイト複合積層放熱構造およびその製造方法

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