US20160201200A1 - Adhesion of coatings using adhesive bonding compositions - Google Patents
Adhesion of coatings using adhesive bonding compositions Download PDFInfo
- Publication number
- US20160201200A1 US20160201200A1 US14/596,283 US201514596283A US2016201200A1 US 20160201200 A1 US20160201200 A1 US 20160201200A1 US 201514596283 A US201514596283 A US 201514596283A US 2016201200 A1 US2016201200 A1 US 2016201200A1
- Authority
- US
- United States
- Prior art keywords
- layer
- protective
- adhesive bonding
- anchors
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 102
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 57
- 238000000576 coating method Methods 0.000 title description 12
- 239000010410 layer Substances 0.000 claims abstract description 147
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 230000001681 protective effect Effects 0.000 claims abstract description 51
- 239000011241 protective layer Substances 0.000 claims abstract description 42
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000012768 molten material Substances 0.000 claims abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 48
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 41
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 34
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 28
- 229910052593 corundum Inorganic materials 0.000 claims description 27
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 27
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 229910052681 coesite Inorganic materials 0.000 claims description 23
- 229910052906 cristobalite Inorganic materials 0.000 claims description 23
- 229910052682 stishovite Inorganic materials 0.000 claims description 23
- 229910052905 tridymite Inorganic materials 0.000 claims description 23
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 19
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 19
- 229910000601 superalloy Inorganic materials 0.000 claims description 15
- 229910002971 CaTiO3 Inorganic materials 0.000 claims description 10
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 7
- 229910052596 spinel Inorganic materials 0.000 claims description 5
- 239000011029 spinel Substances 0.000 claims description 5
- 125000004334 oxygen containing inorganic group Chemical group 0.000 claims 3
- 230000004888 barrier function Effects 0.000 claims 2
- 239000000126 substance Substances 0.000 description 30
- 239000000843 powder Substances 0.000 description 21
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 18
- 239000012720 thermal barrier coating Substances 0.000 description 18
- 239000000395 magnesium oxide Substances 0.000 description 17
- 239000000292 calcium oxide Substances 0.000 description 14
- 239000011651 chromium Substances 0.000 description 14
- -1 CMSX-8 Inorganic materials 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000002893 slag Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 7
- 150000004706 metal oxides Chemical class 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011575 calcium Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 5
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 5
- 150000002484 inorganic compounds Chemical class 0.000 description 5
- 229910001507 metal halide Inorganic materials 0.000 description 5
- 150000005309 metal halides Chemical class 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011253 protective coating Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 3
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 229910000951 Aluminide Inorganic materials 0.000 description 2
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 2
- GOLCXWYRSKYTSP-UHFFFAOYSA-N Arsenious Acid Chemical compound O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229910001011 CMSX-4 Inorganic materials 0.000 description 2
- 101100230100 Caenorhabditis elegans tbc-6 gene Proteins 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910020437 K2PtCl6 Inorganic materials 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 229910000943 NiAl Inorganic materials 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910004273 TeO3 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910007938 ZrBr4 Inorganic materials 0.000 description 2
- 229910007932 ZrCl4 Inorganic materials 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- KPWJBEFBFLRCLH-UHFFFAOYSA-L cadmium bromide Chemical compound Br[Cd]Br KPWJBEFBFLRCLH-UHFFFAOYSA-L 0.000 description 2
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 description 2
- OKIIEJOIXGHUKX-UHFFFAOYSA-L cadmium iodide Chemical compound [Cd+2].[I-].[I-] OKIIEJOIXGHUKX-UHFFFAOYSA-L 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- AYTAKQFHWFYBMA-UHFFFAOYSA-N chromium dioxide Chemical compound O=[Cr]=O AYTAKQFHWFYBMA-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- KLRHPHDUDFIRKB-UHFFFAOYSA-M indium(i) bromide Chemical compound [Br-].[In+] KLRHPHDUDFIRKB-UHFFFAOYSA-M 0.000 description 2
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 2
- MXYATHGRPJZBNA-KRFUXDQASA-N isopimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@@](C=C)(C)CC2=CC1 MXYATHGRPJZBNA-KRFUXDQASA-N 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
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- 150000002738 metalloids Chemical class 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 150000002843 nonmetals Chemical class 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- XZQYTGKSBZGQMO-UHFFFAOYSA-I rhenium pentachloride Chemical compound Cl[Re](Cl)(Cl)(Cl)Cl XZQYTGKSBZGQMO-UHFFFAOYSA-I 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- JAAGVIUFBAHDMA-UHFFFAOYSA-M rubidium bromide Chemical compound [Br-].[Rb+] JAAGVIUFBAHDMA-UHFFFAOYSA-M 0.000 description 2
- FGDZQCVHDSGLHJ-UHFFFAOYSA-M rubidium chloride Chemical compound [Cl-].[Rb+] FGDZQCVHDSGLHJ-UHFFFAOYSA-M 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- KWVVTSALYXIJSS-UHFFFAOYSA-L silver(ii) fluoride Chemical compound [F-].[F-].[Ag+2] KWVVTSALYXIJSS-UHFFFAOYSA-L 0.000 description 2
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- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 229910052566 spinel group Inorganic materials 0.000 description 2
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 2
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- ZSUXOVNWDZTCFN-UHFFFAOYSA-L tin(ii) bromide Chemical compound Br[Sn]Br ZSUXOVNWDZTCFN-UHFFFAOYSA-L 0.000 description 2
- JTDNNCYXCFHBGG-UHFFFAOYSA-L tin(ii) iodide Chemical compound I[Sn]I JTDNNCYXCFHBGG-UHFFFAOYSA-L 0.000 description 2
- QPBYLOWPSRZOFX-UHFFFAOYSA-J tin(iv) iodide Chemical compound I[Sn](I)(I)I QPBYLOWPSRZOFX-UHFFFAOYSA-J 0.000 description 2
- JKNHZOAONLKYQL-UHFFFAOYSA-K tribromoindigane Chemical compound Br[In](Br)Br JKNHZOAONLKYQL-UHFFFAOYSA-K 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- BHHYHSUAOQUXJK-UHFFFAOYSA-L zinc fluoride Chemical compound F[Zn]F BHHYHSUAOQUXJK-UHFFFAOYSA-L 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 2
- LSWWNKUULMMMIL-UHFFFAOYSA-J zirconium(iv) bromide Chemical compound Br[Zr](Br)(Br)Br LSWWNKUULMMMIL-UHFFFAOYSA-J 0.000 description 2
- MHVJRKBZMUDEEV-UHFFFAOYSA-N (-)-ent-pimara-8(14),15-dien-19-oic acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)C=C1CC2 MHVJRKBZMUDEEV-UHFFFAOYSA-N 0.000 description 1
- DIQAKQHNMJSKDT-UHFFFAOYSA-N 3-[4-[3-(dimethylamino)phenyl]-3,5-difluorophenyl]benzo[f]benzotriazole-4,9-dione Chemical compound CN(C)C1=CC=CC(=C1)C2=C(C=C(C=C2F)N3C4=C(C(=O)C5=CC=CC=C5C4=O)N=N3)F DIQAKQHNMJSKDT-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- MXYATHGRPJZBNA-UHFFFAOYSA-N 4-epi-isopimaric acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)CC1=CC2 MXYATHGRPJZBNA-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- 229910011255 B2O3 Inorganic materials 0.000 description 1
- 229910021632 Barium Tetrafluoronickelate Inorganic materials 0.000 description 1
- 229910021631 Barium tetrafluorocobaltate Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910000995 CMSX-10 Inorganic materials 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- UNMYWSMUMWPJLR-UHFFFAOYSA-L Calcium iodide Chemical compound [Ca+2].[I-].[I-] UNMYWSMUMWPJLR-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002493 Ce2(CO3)3 Inorganic materials 0.000 description 1
- 229910020187 CeF3 Inorganic materials 0.000 description 1
- 229910020186 CeF4 Inorganic materials 0.000 description 1
- 229910004755 Cerium(III) bromide Inorganic materials 0.000 description 1
- 229910004664 Cerium(III) chloride Inorganic materials 0.000 description 1
- 229910008069 Cerium(III) iodide Inorganic materials 0.000 description 1
- 229910021554 Chromium(II) chloride Inorganic materials 0.000 description 1
- 229910021562 Chromium(II) fluoride Inorganic materials 0.000 description 1
- 229910021560 Chromium(III) bromide Inorganic materials 0.000 description 1
- 229910021556 Chromium(III) chloride Inorganic materials 0.000 description 1
- 229910019131 CoBr2 Inorganic materials 0.000 description 1
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 description 1
- 229910021582 Cobalt(II) fluoride Inorganic materials 0.000 description 1
- 229910021584 Cobalt(II) iodide Inorganic materials 0.000 description 1
- 229910021583 Cobalt(III) fluoride Inorganic materials 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- 229910021594 Copper(II) fluoride Inorganic materials 0.000 description 1
- KOPBYBDAPCDYFK-UHFFFAOYSA-N Cs2O Inorganic materials [O-2].[Cs+].[Cs+] KOPBYBDAPCDYFK-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- QUUCYKKMFLJLFS-UHFFFAOYSA-N Dehydroabietan Natural products CC1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 QUUCYKKMFLJLFS-UHFFFAOYSA-N 0.000 description 1
- NFWKVWVWBFBAOV-UHFFFAOYSA-N Dehydroabietic acid Natural products OC(=O)C1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 NFWKVWVWBFBAOV-UHFFFAOYSA-N 0.000 description 1
- 229910021545 Dilithium tetrabromonickelate(II) Inorganic materials 0.000 description 1
- 229910005238 GaBr2 Inorganic materials 0.000 description 1
- 229910005258 GaBr3 Inorganic materials 0.000 description 1
- 229910005267 GaCl3 Inorganic materials 0.000 description 1
- 229910005270 GaF3 Inorganic materials 0.000 description 1
- 229910005263 GaI3 Inorganic materials 0.000 description 1
- 229910021599 Gallium(II) chlorid Inorganic materials 0.000 description 1
- 229910006162 GeI2 Inorganic materials 0.000 description 1
- 229910006149 GeI4 Inorganic materials 0.000 description 1
- 229910021600 Germanium(II) bromide Inorganic materials 0.000 description 1
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- 229910003767 Gold(III) bromide Inorganic materials 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- 229910003865 HfCl4 Inorganic materials 0.000 description 1
- 229910004504 HfF4 Inorganic materials 0.000 description 1
- 229910021618 Indium dichloride Inorganic materials 0.000 description 1
- 229910021617 Indium monochloride Inorganic materials 0.000 description 1
- 229910021620 Indium(III) fluoride Inorganic materials 0.000 description 1
- 229910021621 Indium(III) iodide Inorganic materials 0.000 description 1
- 229910021638 Iridium(III) chloride Inorganic materials 0.000 description 1
- 229910021575 Iron(II) bromide Inorganic materials 0.000 description 1
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- 229910021579 Iron(II) iodide Inorganic materials 0.000 description 1
- 229910021576 Iron(III) bromide Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910020451 K2SiO3 Inorganic materials 0.000 description 1
- 229910020491 K2TiF6 Inorganic materials 0.000 description 1
- 229910020148 K2ZrF6 Inorganic materials 0.000 description 1
- 229910020252 KAuCl4 Inorganic materials 0.000 description 1
- 229910017569 La2(CO3)3 Inorganic materials 0.000 description 1
- 229910002249 LaCl3 Inorganic materials 0.000 description 1
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- 229910001290 LiPF6 Inorganic materials 0.000 description 1
- 229910021547 Lithium tetrachloropalladate(II) hydrate Inorganic materials 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
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- 229910021570 Manganese(II) fluoride Inorganic materials 0.000 description 1
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- KGMSWPSAVZAMKR-UHFFFAOYSA-N Me ester-3, 22-Dihydroxy-29-hopanoic acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(=C(C)C)C=C1CC2 KGMSWPSAVZAMKR-UHFFFAOYSA-N 0.000 description 1
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- 229910003424 Na2SeO3 Inorganic materials 0.000 description 1
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- 229910019787 NbF5 Inorganic materials 0.000 description 1
- KGMSWPSAVZAMKR-ONCXSQPRSA-N Neoabietic acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CCC(=C(C)C)C=C2CC1 KGMSWPSAVZAMKR-ONCXSQPRSA-N 0.000 description 1
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- 235000019482 Palm oil Nutrition 0.000 description 1
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- 229910002674 PdO Inorganic materials 0.000 description 1
- 229910018944 PtBr2 Inorganic materials 0.000 description 1
- 229910019032 PtCl2 Inorganic materials 0.000 description 1
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- 229910019571 Re2O7 Inorganic materials 0.000 description 1
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
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- 229910008047 ZrI4 Inorganic materials 0.000 description 1
- JVVXZOOGOGPDRZ-SLFFLAALSA-N [(1R,4aS,10aR)-1,4a-dimethyl-7-propan-2-yl-2,3,4,9,10,10a-hexahydrophenanthren-1-yl]methanamine Chemical compound NC[C@]1(C)CCC[C@]2(C)C3=CC=C(C(C)C)C=C3CC[C@H]21 JVVXZOOGOGPDRZ-SLFFLAALSA-N 0.000 description 1
- OQPDWFJSZHWILH-UHFFFAOYSA-N [Al].[Al].[Al].[Ti] Chemical compound [Al].[Al].[Al].[Ti] OQPDWFJSZHWILH-UHFFFAOYSA-N 0.000 description 1
- YKIOKAURTKXMSB-UHFFFAOYSA-N adams's catalyst Chemical compound O=[Pt]=O YKIOKAURTKXMSB-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 238000004873 anchoring Methods 0.000 description 1
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- ZZCNKSMCIZCVDR-UHFFFAOYSA-N barium(2+);dioxido(dioxo)manganese Chemical compound [Ba+2].[O-][Mn]([O-])(=O)=O ZZCNKSMCIZCVDR-UHFFFAOYSA-N 0.000 description 1
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- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- KOHRTFCSIQIYAE-UHFFFAOYSA-N cadmium;carbonic acid Chemical compound [Cd].OC(O)=O KOHRTFCSIQIYAE-UHFFFAOYSA-N 0.000 description 1
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- 229910001622 calcium bromide Inorganic materials 0.000 description 1
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- 229910001640 calcium iodide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- ZJRWDIJRKKXMNW-UHFFFAOYSA-N carbonic acid;cobalt Chemical compound [Co].OC(O)=O ZJRWDIJRKKXMNW-UHFFFAOYSA-N 0.000 description 1
- OVFCVRIJCCDFNQ-UHFFFAOYSA-N carbonic acid;copper Chemical compound [Cu].OC(O)=O OVFCVRIJCCDFNQ-UHFFFAOYSA-N 0.000 description 1
- WIKQEUJFZPCFNJ-UHFFFAOYSA-N carbonic acid;silver Chemical compound [Ag].[Ag].OC(O)=O WIKQEUJFZPCFNJ-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
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- 238000005524 ceramic coating Methods 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
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- ZEDZJUDTPVFRNB-UHFFFAOYSA-K cerium(3+);triiodide Chemical compound I[Ce](I)I ZEDZJUDTPVFRNB-UHFFFAOYSA-K 0.000 description 1
- 229910000421 cerium(III) oxide Inorganic materials 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- MOOUSOJAOQPDEH-UHFFFAOYSA-K cerium(iii) bromide Chemical compound [Br-].[Br-].[Br-].[Ce+3] MOOUSOJAOQPDEH-UHFFFAOYSA-K 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 239000011636 chromium(III) chloride Substances 0.000 description 1
- XBWRJSSJWDOUSJ-UHFFFAOYSA-L chromium(ii) chloride Chemical compound Cl[Cr]Cl XBWRJSSJWDOUSJ-UHFFFAOYSA-L 0.000 description 1
- RNFYGEKNFJULJY-UHFFFAOYSA-L chromium(ii) fluoride Chemical compound [F-].[F-].[Cr+2] RNFYGEKNFJULJY-UHFFFAOYSA-L 0.000 description 1
- UZDWIWGMKWZEPE-UHFFFAOYSA-K chromium(iii) bromide Chemical compound [Cr+3].[Br-].[Br-].[Br-] UZDWIWGMKWZEPE-UHFFFAOYSA-K 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- AVWLPUQJODERGA-UHFFFAOYSA-L cobalt(2+);diiodide Chemical compound [Co+2].[I-].[I-] AVWLPUQJODERGA-UHFFFAOYSA-L 0.000 description 1
- 229910000001 cobalt(II) carbonate Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(II) oxide Inorganic materials [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(II,III) oxide Inorganic materials [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 1
- WZJQNLGQTOCWDS-UHFFFAOYSA-K cobalt(iii) fluoride Chemical compound F[Co](F)F WZJQNLGQTOCWDS-UHFFFAOYSA-K 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229910000009 copper(II) carbonate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- GWFAVIIMQDUCRA-UHFFFAOYSA-L copper(ii) fluoride Chemical compound [F-].[F-].[Cu+2] GWFAVIIMQDUCRA-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- 239000011646 cupric carbonate Substances 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910001647 dawsonite Inorganic materials 0.000 description 1
- NFWKVWVWBFBAOV-MISYRCLQSA-N dehydroabietic acid Chemical compound OC(=O)[C@]1(C)CCC[C@]2(C)C3=CC=C(C(C)C)C=C3CC[C@H]21 NFWKVWVWBFBAOV-MISYRCLQSA-N 0.000 description 1
- 229940118781 dehydroabietic acid Drugs 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- DUVPPTXIBVUIKL-UHFFFAOYSA-N dibromogermanium Chemical compound Br[Ge]Br DUVPPTXIBVUIKL-UHFFFAOYSA-N 0.000 description 1
- RJYMRRJVDRJMJW-UHFFFAOYSA-L dibromomanganese Chemical compound Br[Mn]Br RJYMRRJVDRJMJW-UHFFFAOYSA-L 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- AKUNKIJLSDQFLS-UHFFFAOYSA-M dicesium;hydroxide Chemical compound [OH-].[Cs+].[Cs+] AKUNKIJLSDQFLS-UHFFFAOYSA-M 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- CTNMMTCXUUFYAP-UHFFFAOYSA-L difluoromanganese Chemical compound F[Mn]F CTNMMTCXUUFYAP-UHFFFAOYSA-L 0.000 description 1
- QYHNIMDZIYANJH-UHFFFAOYSA-N diindium Chemical compound [In]#[In] QYHNIMDZIYANJH-UHFFFAOYSA-N 0.000 description 1
- IAGYEMVJHPEPGE-UHFFFAOYSA-N diiodogermanium Chemical compound I[Ge]I IAGYEMVJHPEPGE-UHFFFAOYSA-N 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- KZYDBKYFEURFNC-UHFFFAOYSA-N dioxorhodium Chemical compound O=[Rh]=O KZYDBKYFEURFNC-UHFFFAOYSA-N 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 description 1
- SRVXDMYFQIODQI-UHFFFAOYSA-K gallium(iii) bromide Chemical compound Br[Ga](Br)Br SRVXDMYFQIODQI-UHFFFAOYSA-K 0.000 description 1
- DWRNSCDYNYYYHT-UHFFFAOYSA-K gallium(iii) iodide Chemical compound I[Ga](I)I DWRNSCDYNYYYHT-UHFFFAOYSA-K 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- OVWPJGBVJCTEBJ-UHFFFAOYSA-K gold tribromide Chemical compound Br[Au](Br)Br OVWPJGBVJCTEBJ-UHFFFAOYSA-K 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- DDYSHSNGZNCTKB-UHFFFAOYSA-N gold(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Au+3].[Au+3] DDYSHSNGZNCTKB-UHFFFAOYSA-N 0.000 description 1
- PDPJQWYGJJBYLF-UHFFFAOYSA-J hafnium tetrachloride Chemical compound Cl[Hf](Cl)(Cl)Cl PDPJQWYGJJBYLF-UHFFFAOYSA-J 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- APHGZSBLRQFRCA-UHFFFAOYSA-M indium(1+);chloride Chemical compound [In]Cl APHGZSBLRQFRCA-UHFFFAOYSA-M 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 description 1
- HEQBUZNAOJCRSL-UHFFFAOYSA-N iron(ii) chromite Chemical compound [O-2].[O-2].[O-2].[Cr+3].[Fe+3] HEQBUZNAOJCRSL-UHFFFAOYSA-N 0.000 description 1
- BQZGVMWPHXIKEQ-UHFFFAOYSA-L iron(ii) iodide Chemical compound [Fe+2].[I-].[I-] BQZGVMWPHXIKEQ-UHFFFAOYSA-L 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- KYKBXWMMXCGRBA-UHFFFAOYSA-K lanthanum(3+);triiodide Chemical compound I[La](I)I KYKBXWMMXCGRBA-UHFFFAOYSA-K 0.000 description 1
- XKUYOJZZLGFZTC-UHFFFAOYSA-K lanthanum(iii) bromide Chemical compound Br[La](Br)Br XKUYOJZZLGFZTC-UHFFFAOYSA-K 0.000 description 1
- ICAKDTKJOYSXGC-UHFFFAOYSA-K lanthanum(iii) chloride Chemical compound Cl[La](Cl)Cl ICAKDTKJOYSXGC-UHFFFAOYSA-K 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 229910001540 lithium hexafluoroarsenate(V) Inorganic materials 0.000 description 1
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Inorganic materials [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 229910001537 lithium tetrachloroaluminate Inorganic materials 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(III) oxide Inorganic materials O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 1
- QWYFOIJABGVEFP-UHFFFAOYSA-L manganese(ii) iodide Chemical compound [Mn+2].[I-].[I-] QWYFOIJABGVEFP-UHFFFAOYSA-L 0.000 description 1
- SRVINXWCFNHIQZ-UHFFFAOYSA-K manganese(iii) fluoride Chemical compound [F-].[F-].[F-].[Mn+3] SRVINXWCFNHIQZ-UHFFFAOYSA-K 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- GICWIDZXWJGTCI-UHFFFAOYSA-I molybdenum pentachloride Chemical compound Cl[Mo](Cl)(Cl)(Cl)Cl GICWIDZXWJGTCI-UHFFFAOYSA-I 0.000 description 1
- ZSSVQAGPXAAOPV-UHFFFAOYSA-K molybdenum trichloride Chemical compound Cl[Mo](Cl)Cl ZSSVQAGPXAAOPV-UHFFFAOYSA-K 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- GNMQOUGYKPVJRR-UHFFFAOYSA-N nickel(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Ni+3].[Ni+3] GNMQOUGYKPVJRR-UHFFFAOYSA-N 0.000 description 1
- DBJLJFTWODWSOF-UHFFFAOYSA-L nickel(ii) fluoride Chemical compound F[Ni]F DBJLJFTWODWSOF-UHFFFAOYSA-L 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- KQXXODKTLDKCAM-UHFFFAOYSA-N oxo(oxoauriooxy)gold Chemical compound O=[Au]O[Au]=O KQXXODKTLDKCAM-UHFFFAOYSA-N 0.000 description 1
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 1
- PZFKDUMHDHEBLD-UHFFFAOYSA-N oxo(oxonickeliooxy)nickel Chemical compound O=[Ni]O[Ni]=O PZFKDUMHDHEBLD-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 description 1
- HNNUTDROYPGBMR-UHFFFAOYSA-L palladium(ii) iodide Chemical compound [Pd+2].[I-].[I-] HNNUTDROYPGBMR-UHFFFAOYSA-L 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- YHBDIEWMOMLKOO-UHFFFAOYSA-I pentachloroniobium Chemical compound Cl[Nb](Cl)(Cl)(Cl)Cl YHBDIEWMOMLKOO-UHFFFAOYSA-I 0.000 description 1
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- KGRJUMGAEQQVFK-UHFFFAOYSA-L platinum(2+);dibromide Chemical compound Br[Pt]Br KGRJUMGAEQQVFK-UHFFFAOYSA-L 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 1
- 229910001546 potassium hexafluoroantimonate(V) Inorganic materials 0.000 description 1
- 229910001541 potassium hexafluoroarsenate(V) Inorganic materials 0.000 description 1
- 229910002093 potassium tetrachloropalladate(II) Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910001173 rene N5 Inorganic materials 0.000 description 1
- 229910001088 rené 41 Inorganic materials 0.000 description 1
- YSZJKUDBYALHQE-UHFFFAOYSA-N rhenium trioxide Chemical compound O=[Re](=O)=O YSZJKUDBYALHQE-UHFFFAOYSA-N 0.000 description 1
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 description 1
- WPFGFHJALYCVMO-UHFFFAOYSA-L rubidium carbonate Chemical compound [Rb+].[Rb+].[O-]C([O-])=O WPFGFHJALYCVMO-UHFFFAOYSA-L 0.000 description 1
- 229910000026 rubidium carbonate Inorganic materials 0.000 description 1
- AHLATJUETSFVIM-UHFFFAOYSA-M rubidium fluoride Inorganic materials [F-].[Rb+] AHLATJUETSFVIM-UHFFFAOYSA-M 0.000 description 1
- WFUBYPSJBBQSOU-UHFFFAOYSA-M rubidium iodide Inorganic materials [Rb+].[I-] WFUBYPSJBBQSOU-UHFFFAOYSA-M 0.000 description 1
- 229910001953 rubidium(I) oxide Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- OEKDNFRQVZLFBZ-UHFFFAOYSA-K scandium fluoride Chemical compound F[Sc](F)F OEKDNFRQVZLFBZ-UHFFFAOYSA-K 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium(III) oxide Inorganic materials O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 description 1
- 229910001544 silver hexafluoroantimonate(V) Inorganic materials 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
- KQTXIZHBFFWWFW-UHFFFAOYSA-L silver(I) carbonate Inorganic materials [Ag]OC(=O)O[Ag] KQTXIZHBFFWWFW-UHFFFAOYSA-L 0.000 description 1
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001545 sodium hexafluoroantimonate(V) Inorganic materials 0.000 description 1
- 229910001542 sodium hexafluoroarsenate(V) Inorganic materials 0.000 description 1
- CMZUMMUJMWNLFH-UHFFFAOYSA-N sodium metavanadate Chemical compound [Na+].[O-][V](=O)=O CMZUMMUJMWNLFH-UHFFFAOYSA-N 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 239000011655 sodium selenate Substances 0.000 description 1
- 239000011781 sodium selenite Substances 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910001538 sodium tetrachloroaluminate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910001625 strontium bromide Inorganic materials 0.000 description 1
- YJPVTCSBVRMESK-UHFFFAOYSA-L strontium bromide Chemical compound [Br-].[Br-].[Sr+2] YJPVTCSBVRMESK-UHFFFAOYSA-L 0.000 description 1
- LEDMRZGFZIAGGB-UHFFFAOYSA-L strontium carbonate Chemical compound [Sr+2].[O-]C([O-])=O LEDMRZGFZIAGGB-UHFFFAOYSA-L 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 229910001637 strontium fluoride Inorganic materials 0.000 description 1
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 description 1
- 229910001643 strontium iodide Inorganic materials 0.000 description 1
- KRIJWFBRWPCESA-UHFFFAOYSA-L strontium iodide Chemical compound [Sr+2].[I-].[I-] KRIJWFBRWPCESA-UHFFFAOYSA-L 0.000 description 1
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- CUDGTZJYMWAJFV-UHFFFAOYSA-N tetraiodogermane Chemical compound I[Ge](I)(I)I CUDGTZJYMWAJFV-UHFFFAOYSA-N 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(II) oxide Inorganic materials [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 229910021324 titanium aluminide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GQUJEMVIKWQAEH-UHFFFAOYSA-N titanium(III) oxide Chemical compound O=[Ti]O[Ti]=O GQUJEMVIKWQAEH-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- FEONEKOZSGPOFN-UHFFFAOYSA-K tribromoiron Chemical compound Br[Fe](Br)Br FEONEKOZSGPOFN-UHFFFAOYSA-K 0.000 description 1
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 description 1
- JNLSTWIBJFIVHZ-UHFFFAOYSA-K trifluoroindigane Chemical compound F[In](F)F JNLSTWIBJFIVHZ-UHFFFAOYSA-K 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- RMUKCGUDVKEQPL-UHFFFAOYSA-K triiodoindigane Chemical compound I[In](I)I RMUKCGUDVKEQPL-UHFFFAOYSA-K 0.000 description 1
- LOIHSHVELSAXQN-UHFFFAOYSA-K trirhenium nonachloride Chemical compound Cl[Re](Cl)Cl LOIHSHVELSAXQN-UHFFFAOYSA-K 0.000 description 1
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten dioxide Inorganic materials O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten(VI) oxide Inorganic materials O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- ITAKKORXEUJTBC-UHFFFAOYSA-L vanadium(ii) chloride Chemical compound Cl[V]Cl ITAKKORXEUJTBC-UHFFFAOYSA-L 0.000 description 1
- HQYCOEXWFMFWLR-UHFFFAOYSA-K vanadium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[V+3] HQYCOEXWFMFWLR-UHFFFAOYSA-K 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- PCMOZDDGXKIOLL-UHFFFAOYSA-K yttrium chloride Chemical compound [Cl-].[Cl-].[Cl-].[Y+3] PCMOZDDGXKIOLL-UHFFFAOYSA-K 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
- XLMQAUWIRARSJG-UHFFFAOYSA-J zirconium(iv) iodide Chemical compound [Zr+4].[I-].[I-].[I-].[I-] XLMQAUWIRARSJG-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
- C23C20/06—Coating with inorganic material, other than metallic material
- C23C20/08—Coating with inorganic material, other than metallic material with compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
- C23C28/3215—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer at least one MCrAlX layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/324—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
Definitions
- This invention relates generally to the field of materials technology, and more particularly to the fabrication and repair of multi-layer metallic articles containing adhesive coatings.
- Hot section components of modern gas turbine engines are often made of high-temperature alloys including superalloys based on nickel, iron and cobalt.
- Cast superalloys e.g., 247, 738, CMSX4, Rene 5, etc.
- high performance wrought alloys e.g., X, 625, 617, etc.
- These superalloys have been developed to withstand increasingly higher operating temperatures as well as the presence of corrosive and oxidative conditions.
- protective coating systems are often applied to the surface of superalloy components to form multi-layer articles. These coating systems include an environmental coating, which can also serve as a metallic bond coat layer, and usually a ceramic thermal barrier coating (TBC) overlying the environmental or bond coat layer.
- TBC ceramic thermal barrier coating
- Such environmental coatings are typically metallic overlay coatings of the formula “MCrAlX” (where M is a Group VIIIB element such as Co, Ni, or a mixture thereof, and X is a rare earth element such as Y, Hf, W, Zr, La, or a mixture thereof) or diffusion aluminide coatings such as NiAl or a modified NiAl that includes an element such as Pt, Rh or Pd.
- M is a Group VIIIB element such as Co, Ni, or a mixture thereof
- X is a rare earth element such as Y, Hf, W, Zr, La, or a mixture thereof
- diffusion aluminide coatings such as NiAl or a modified NiAl that includes an element such as Pt, Rh or Pd.
- TBC thermal barrier coating
- the TBC layer is often formed from metal oxides such as yttria-stabilized zirconias (YSZs).
- YSZs yttria-stabilized zirconia
- adhesion of the outer protective layer to the underlying metallic substrate is an important consideration that can greatly affect the efficiency and longevity of a hot section component.
- Protective coatings are subject to degradation as a function of service. Elevated temperatures, high stresses (both sustained and cyclic), reactions with process gas, and foreign object impact can cause a variety of chemical and physical property changes leading to loss of coating (via e.g. cracking and spalling) resulting in exposure of the underlying substrate and further component damage.
- FIG. 1 illustrates one non-limiting example in which a superalloy substrate 2 protected by a multi-layered TBC system 8 , comprising an inner MCrAlY bond coat layer 4 and an outer ceramic TBC layer 6 , is compromised through degradation of the outer ceramic TBC layer 6 leading to erosion 12 of both the bond coat layer 4 and the underlying superalloy substrate 2 .
- the missing portion 10 of the TBC layer may have occurred due to relatively poor adhesion between the outer ceramic TBC layer 6 and the inner MCrAlY bond coat layer 4 .
- FIG. 1 illustrates damage that can occur to an underlying metallic substrate when a protective coating is damaged or degraded.
- FIG. 2 is a cross-sectional view of a multi-layer article containing a metallic substrate, an adhesive bonding layer, and a ceramic protective layer, according to one embodiment.
- FIG. 3 is a cross-sectional view of a multi-layer article containing a metallic substrate, a bond coat layer, an adhesive bonding layer, and a ceramic protective layer, according to one embodiment.
- FIG. 4 is a cross-sectional view of a multi-layer article containing a metallic substrate, a ceramic protective layer, and a plurality of chemical anchors bonded to both the metallic substrate and the protective layer, according to one embodiment.
- FIG. 5 is a cross-section view of a multi-layer article containing a metallic substrate, a bond coat layer, a ceramic protective layer, and a plurality of chemical anchors bonded to both the bond coat layer and the ceramic protective layer, according to one embodiment.
- FIG. 6 is a photograph illustrating a spear-like cuspidine crystal, according to one embodiment.
- FIG. 7 illustrates process steps of a method for forming a multi-layer article, according to one embodiment.
- FIG. 8 illustrates process steps of a method for forming a multi-layer article, according to one embodiment.
- FIG. 9 illustrates process steps of a method for forming a multi-layer article, according to one embodiment.
- welding compositions e.g., flux compositions
- welding compositions are generally formulated to enhance detachability of the resulting slag deposits, see, e.g., Oladipupo, A. O., “Slag Detachability from Submerged Arc Welds,” Doctoral Thesis (Massachusetts Institute of Technology) February 1987 and US 2006/0266799.
- FIG. 2 is a cross-sectional view of a multi-layer article 1 according to one embodiment.
- the multi-layer article 1 comprises a metallic substrate 2 bonded to an adhesive bonding layer 14 that is covered by a protective layer 6 .
- the multi-layer article 1 of this embodiment does not contain an intermediate bond coat layer—but instead relies upon the adhesive bonding layer 14 which is a non-MCrAlY deposit having low detachability as briefly described above and further described in greater detail below.
- the metallic substrate 2 of FIG. 2 may be a ferrous substrate (e.g., stainless steel) or a non-ferrous substrate such as a superalloy.
- a ferrous substrate e.g., stainless steel
- a non-ferrous substrate such as a superalloy.
- superalloy is used herein as it is commonly used in the art, i.e., a highly corrosion and oxidation resistant alloy that exhibits excellent mechanical strength and resistance to creep at high temperatures.
- Superalloys typically include a high nickel or cobalt content. Examples of superalloys include alloys sold under the trademarks and brand names Hastelloy, Inconel alloys (e.g. IN 100, IN 700, IN 713, IN 738, IN 792, IN 939), Rene alloys (e.g.
- the terms “metal,” “metallic material,” “alloy,” and “metal alloy” are used herein in a general sense to describe pure metals, semi-pure metals and metal alloys.
- the protective layer 6 of FIG. 2 may be a ceramic layer suitable for use as a thermal barrier coating (TBC), including TBCs well known in the relevant art.
- TBC thermal barrier coating
- Such ceramic coatings generally have low thermal conductivity and include metal oxides such as zirconia (ZrO 2 ) partially or fully stabilized by yttria (Y 2 O 3 ), magnesia (MgO) or other oxides.
- the protective layer 6 may include a yttri-stabilized zirconia (YSZ).
- the adhesive bonding layer 14 of FIG. 2 contains one or more inorganic compounds that may include metal oxides, metal halides, metal oxometallates, metal carbonates, as well as elemental metals and metalloids of Groups IIA, IIIB, IVB, VB, VIB, VIIB, VIIIB, IB, IIB, IIIA, IVA, VA of the Period Table, lanthanides, and non-metals such as boron and carbon.
- inorganic compounds may include metal oxides, metal halides, metal oxometallates, metal carbonates, as well as elemental metals and metalloids of Groups IIA, IIIB, IVB, VB, VIB, VIIB, VIIIB, IB, IIB, IIIA, IVA, VA of the Period Table, lanthanides, and non-metals such as boron and carbon.
- the adhesive bonding layer 14 is formed by heating a protective bonding composition into a molten material in contact with a metal-containing surface, and then the molten material is allowed to cool and solidify into a deposit having low detachability from the metal-containing surface.
- the protective bonding composition is formulated to contain certain mixtures of compounds (described below in greater detail) which react in the heated environment of the molten material to form at least one oxygen-containing compound that promotes the bonding of the adhesive bonding layer 14 to the metallic substrate 2 , the protective layer 6 , or both.
- the oxygen-containing compound is selected from a spinel compound, a perovskite compound, a cuspidine compound, and mixtures thereof. In some embodiments the oxygen-containing compound is selected from MgAlCrO 4 , FeCrO 4 , CaTiO 3 , Ca 4 (Si 2 O 7 )(F,OH) 2 , and mixtures thereof.
- spinel compound is used herein in a general sense to describe an inorganic compound or mineral of the general formula MgAlMO 4 wherein the element “M” refers to a metallic element such as Al or a transition metal such as Cr.
- M refers to a metallic element such as Al or a transition metal such as Cr.
- spinel compound is also used herein in the same manner as this term is commonly understood in the relevant art.
- perovskite compound is used herein in a general sense to describe an inorganic compound or mineral of the general formula CaTiO 3 .
- perovskite compound is also used herein in the same manner as this term is commonly understood in the relevant art.
- cuspidine compound is used herein in a general sense to describe an inorganic compound or mineral of the general formula Ca 4 (Si 2 O 7 )(F,OH) 2 .
- the term “cuspidine compound” is also used herein in the same manner as this term is commonly understood in the relevant art.
- the oxygen-containing compound is believed to enhance adhesion between the adhesive bonding layer 14 and the metallic substrate 2 , the protective layer 6 , or both, by forming rigid crystalline structures serving as hooks or anchors to which the respective materials can inter-bond.
- FIG. 6 is a photograph illustrating such rigid crystalline structures in the form of spear-like cuspidine crystals 52 that are chemically anchored to a surface of a metallic substrate 50 .
- the spear-like protrusions of the cuspidine crystals 52 can then rigidly bond to an upper layer (e.g., an adhesive bonding layer 14 or a protective layer 6 ) that is subsequently or concurrently formed to produce a multi-layer article in which the outer protective layer has low detachability.
- the multi-layer article 1 may contain a plurality of chemical anchors 16 bonded to the adhesive bonding layer 14 and to at least one of the metallic substrate 2 and the protective layer 6 .
- the plurality of chemical anchors 16 form inter-layer bonds such that one portion of the chemical anchors 16 is bonded to the adhesive bonding layer 14 and another portion of the chemical anchors is bonded to the metallic substrate 2 .
- FIG. 3 is a cross-sectional view of a multi-layer article 3 containing a metallic substrate 2 , a bond coat layer 4 , an adhesive bonding layer 14 , and a protective layer 6 , according to one embodiment.
- the bond coat layer 4 may be in the form of a metallic coating of the general formula MCrAlX wherein “M” is a Group VIIIB element such as Co, Ni, or a mixture thereof, and “X” is a rare earth elements such as Y, Hf, W, Zr, La, or a mixture thereof.
- the bond coat layer 4 may be in the form of a diffusion aluminide coating such as NiAl or a modified NiAl that includes an element such as Cr, Pt, Rh or Pd.
- FIG. 1 is a cross-sectional view of a multi-layer article 3 containing a metallic substrate 2 , a bond coat layer 4 , an adhesive bonding layer 14 , and a protective layer 6 , according to one embodiment.
- FIG 3 also illustrates the possible presence of a plurality of chemical anchors 16 bonded to the adhesive bonding layer 14 and to the bond coat layer 4 by forming inter-layer bonds such that one portion of the chemical anchors 16 is bonded to the adhesive bonding layer 14 and another portion of the chemical anchors 16 is bonded to the bond coat layer 4 .
- the metallic substrate 2 of FIG. 2 may be in the form of a superalloy substrate
- the bond coat layer 4 may be in the form of a MCrAlY bond coat layer
- the protective layer 6 may be in the form of a ceramic TBC layer.
- FIGS. 4 and 5 illustrate other embodiments wherein the plurality of chemical anchors 16 enhance adhesion of the multi-layer articles 5 , 7 by forming inter-layer bonds such that a first portion of the chemical anchors 16 is bonded to the metallic substrate 2 , a second portion of the chemical anchors 16 is bonded to a residual portion 18 of an adhesive bonding layer, and a third portion of the chemical anchors 16 is bonded to the protective layer 6 .
- FIG. 4 is a cross-sectional view of a multi-layer article 5 containing a metallic substrate 2 , a protective layer 6 , and a plurality of chemical anchors 16 inter-bonded to both the metallic substrate 2 and to the protective layer 6 .
- the multi-layer article 5 may also contain a residual portion 18 of an adhesive bonding layer such that the chemical anchors 16 inter-bond to all three of the metallic substrate 2 , the protective layer 6 and the residual portion 18 of an adhesive bonding layer.
- FIG. 5 is a cross-sectional view of a multi-layer article 7 containing a metallic substrate 2 , a bond coat layer 4 , a protective layer 6 , and a plurality of chemical anchors 16 inter-bonded to both the bond coat layer 4 and to the protective layer 6 .
- the multi-layer article 7 may also contain a residual portion 18 of an adhesive bonding layer such that the chemical anchors 16 inter-bond to all three of the bond coat layer 4 , the protective layer 6 and the residual portion 18 of an adhesive bonding layer.
- FIG. 7 illustrates process steps of a method for forming the multi-layer article 1 of FIG. 2 , according to one embodiment.
- a protective bonding composition 20 is deposited onto a surface of a metallic substrate 2 , and an energy beam 22 ′ is traversed over the surface of the protective bonding composition 20 to form a melt pool 24 that is then allowed to cool and solidify into an adhesive bonding layer 14 affixed to the metallic substrate 2 .
- the resulting article may also contain a plurality of chemical anchors 16 inter-bonded to both the metallic substrate 2 and to the adhesive bonding layer 14 .
- a ceramic powder 26 is then deposited onto a surface of the adhesive bonding layer 14 , and an energy beam 22 ′′ is traversed over the surface of the ceramic powder 26 to form a region 28 of sintering ceramic powder which upon cooling forms a protective ceramic layer 6 .
- FIG. 8 illustrates process steps of a method for forming the multi-layer article 3 of FIG. 3 , according to one embodiment.
- a MCrAlY powder 30 is deposited onto a surface of a metallic substrate 2
- a protective bonding composition 20 (as, for example, a powder) is deposited onto the layer of MCrAlY powder 30
- an energy beam 22 ′ is traversed over the surface of the resulting multi-powder layer to form a melt pool 32 that is then allowed to cool and solidify into a MCrAlY bond coat layer 4 bonded to the metallic substrate 2 and covered by an adhesive bonding layer 14 affixed to the bond coat layer 4 .
- the resulting article may also contain a plurality of chemical anchors 16 inter-bonded to both the bond coat layer 4 and to the adhesive bonding layer 14 .
- the MCrAlY powder 30 and the protective bonding composition 20 may be deposited onto the surface of the metallic substrate 2 as a mixture of powders (as opposed to the separate multi-layers illustrated in FIG. 8 ).
- Step 2 of FIG. 8 a ceramic powder 26 is then deposited onto a surface of the adhesive bonding layer 14 , and an energy beam 22 ′′ is traversed over the surface of the ceramic powder 26 to form a region 28 of sintering ceramic powder which upon cooling forms a protective ceramic layer 6 .
- FIG. 9 illustrates process steps of a method for forming the multi-layer article 7 of FIG. 5 , according to one embodiment.
- a MCrAlY powder 30 is deposited onto a surface of a metallic substrate 2
- a protective bonding composition 20 (as, for example, a powder) is deposited onto the layer of MCrAlY powder 30
- an energy beam 22 ′ is traversed over the surface of the resulting multi-powder layer to form a melt pool 32 that is then allowed to cool and solidify into a MCrAlY bond coat layer 4 bonded to the metallic substrate 2 and covered by an adhesive bonding layer 14 affixed to the bond coat layer 4 .
- the resulting article may also contain a plurality of chemical anchors 16 inter-bonded to both the bond coat layer 4 and to the adhesive bonding layer 14 .
- the MCrAlY powder 30 and the protective bonding composition 20 may be deposited onto the surface of the metallic substrate 2 as a mixture of powders (as opposed to the separate multi-layers illustrated in FIG. 8 .
- Step 2 of FIG. 9 involves removal of a portion of the adhesive bonding layer 14 to form a residual portion 18 of the adhesive bonding layer 14 such that some portions of the chemical anchors 16 are exposed in an upward direction.
- Chemical and/or mechanical methods known in the relevant art for removing slag layers may be used to accomplish the removal of a portion of the adhesive bonding layer 14 in Step 2 .
- Step 3 of FIG. 9 a ceramic powder 26 is then deposited onto a surface of the article formed in Step 2 , and an energy beam 22 ′′ is traversed over the surface of the ceramic powder 26 to form a region 28 of sintering ceramic powder which upon cooling forms a protective ceramic layer 6 .
- the Step 3 deposition of the protective ceramic layer 6 can occur such that the chemical anchors 16 form inter-layer bonds in which a first portion of the chemical anchors 16 is bonded to the metallic substrate 2 , a second portion of the chemical anchors 16 is bonded to the residual portion 18 of adhesive bonding layer 14 , and a third portion of the chemical anchors 16 is bonded to the protective ceramic layer 6 .
- Protective bonding compositions 20 may contain inorganic compounds such as metal oxides, metal halides, metal oxometallates, metal carbonates, a mixtures thereof—as well as elemental metals, lanthanides and metalloids.
- Protective bonding compositions 20 may also include organic compounds such as high-molecular weight hydrocarbons (e.g., beeswax, paraffin), carbohydrates (e.g., cellulose), natural and synthetic oils (e.g., palm oil), organic reducing agents (e.g., charcoal, coke), carboxylic acids and dicarboxylic acids (e.g., abietic acid, isopimaric acid, neoabietic acid, dehydroabietic acid, rosins), carboxylic acid salts (e.g., rosin salts), carboxylic acid derivatives (e.g., dehydro-abietylamine), amines (e.g., triethanolamine), alcohols (e.g., high polyglycols
- metal oxides is used herein in a general sense to describe compounds having the general formula M a O b in which the variable “M” represents a metal atom, and the variables “a” and “b” represent integers greater than zero.
- Non-limiting examples of metal oxides include compounds such as Li 2 O, BeO, B 2 O 3 , B 6 O, MgO, Al 2 O 3 , SiO 2 , CaO, Sc 2 O 3 , TiO, TiO 2 , Ti 2 O 3 , VO, V 2 O 3 , V 2 O 4 , V 2 O 5 , Cr 2 O 3 , CrO 3 , MnO, MnO 2 , Mn 2 O 3 , Mn 3 O 4 , FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, Ni 2 O 3 , Cu 2 O, CuO, ZnO, Ga 2 O 3 , GeO 2 , As 2 O 3 , Rb 2 O, SrO,
- metal halides is used herein in a general sense to describe compounds containing a metal atom and at least one halogen atom.
- Non-limiting examples of metal halides include compounds such as LiF, LiCl, LiBr, LiI, Li 2 NiBr 4 , Li 2 CuCl 4 , LiAsF 6 , LiPF 6 , LiAlCl 4 , LiGaCl 4 , Li 2 PdCl 4 , NaF, NaCl, NaBr, Na 3 AlF 6 , NaSbF 6 , NaAsF 6 , NaAuBr 4 , NaAlCl 4 , Na 2 PdCl 4 , Na 2 PtCl 4 , MgF 2 , MgCl 2 , MgBr 2 , AlF 3 , KCl, KF, KBr, K 2 RuCl 5 , K 2 IrCl 6 , K 2 PtCl 6 , K 2 PtCl 6 , K 2
- metal oxometallates is used herein in a general sense to describe compounds having the general formula M a X b O c in which the variable “M” represents a metal atom, the variable “X” represents a metal or non-metal atom, and the variables “a,” “b,” and “c” represent integers greater than zero.
- Non-limiting examples of metal oxometallates include compounds such as LiIO 3 , LiBO 2 , Li 2 SiO 3 , LiClO 4 , Na 2 B 4 O 7 , NaBO 3 , Na 2 SiO 3 , NaVO 3 , Na 2 MoO 4 , Na 2 SeO 4 , Na 2 SeO 3 , Na 2 TeO 3 , K 2 SiO 3 , K 2 CrO 4 , K 2 Cr 2 O 7 , CaSiO 3 , BaMnO 4 , and mixtures thereof, to name a few.
- the term “metal oxometallates” is also used herein in the same manner as this term is commonly understood in the relevant art.
- metal carbonates is used herein in a general sense to describe compounds containing a metal atom and at least one carbonate group.
- Non-limiting example of metal carbonates include compounds such as Li 2 CO 3 , Na 2 CO 3 , NaHCO 3 , MgCO 3 , K 2 CO 3 , CaCO 3 , Cr 2 (CO 3 ) 3 , MnCO 3 , CoCO 3 , NiCO 3 , CuCO 3 , Rb 2 CO 3 , SrCO 3 , Y 2 (CO3) 3 , Ag 2 CO 3 , CdCO 3 , In 2 (CO 3 ) 3 , Sb 2 (CO 3 ) 3 , C 2 CO 3 , BaCO 3 , La 2 (CO 3 ) 3 , Ce 2 (CO 3 ) 3 , NaAl(CO 3 ) (OH) 2 , and mixtures thereof, to name a few.
- the term “metal carbonates” is also used herein in the same manner as this term is commonly understood in the relevant art.
- TBC 6 adhesion to a MCrAlY bond-coat underlayer 4 is improved by employing a protective bonding composition 20 containing MgO and Al 2 O 3 .
- a protective bonding composition 20 containing MgO and Al 2 O 3 It is known in the welding industry that slag is particularly difficult to remove from chromium-bearing substrates, or from deposits made with a chromium-bearing filler, or from deposits utilizing chromium oxide in the flux. See, e.g., Oladipupo, A. O., “Slag Detachability from Submerged Arc Welds,” Doctoral Thesis (Massachusetts Institute of Technology) February 1987. Fluxes with magnesium oxide and alumina are particularly problematic due to the formation of chromium spinels such as iron chromate and magnesium aluminum chromate by reactions such as:
- spinels represent solid reaction products that embed and attach to the underlying metallic substrate and can therefore serve as chemical anchors 16 that can greatly increase attachability (bond integrity) in multi-layer articles of the present disclosure.
- Protective bonding compositions 20 in some embodiments contain MgO and Al 2 O 3 in respective proportions such that a molten mixture containing the composition 20 and Cr forms MgAlCrO 4 .
- a molar ratio of the MgO to the Al 2 O 3 in the protective bonding composition 20 ranges from about 1.5:1 to about 1:1.5, or from about 1.3:1 to about 1:1.3, or from about 1.1:1 to about 1:1.1 respectively. In other embodiments the molar ratio of the MgO to the Al 2 O 3 is about 1:1.
- MgO/Al 2 O 3 -containing compositions 20 comprise at least one of: (1) greater than about 25 percent by weight of MgO; and (2) greater than out 25 percent by weight of Al 2 O 3 , based on a total weight of the protective bonding composition 20 .
- compositions 20 comprise at least one of: (1) greater than about 35 percent by weight of MgO; and (2) greater than about 35 percent by weight of Al 2 O 3 , based on a total weight of the protective bonding composition 20 .
- the MgO/Al 2 O 3 -containing compositions 20 may further comprise Cr, such as for example greater than about 10 percent by weight of Cr or greater than about 15 percent by weight of Cr.
- the MgO/Al 2 O 3 -containing compositions 20 may further comprise at least one selected from the group consisting of Cr, CrO 2 , Cr 2 O 3 and CrO 3 .
- Some MgO/Al 2 O 3 -containing compositions 20 further contain TiO 2 , SiO 2 and ZrO 2 , such that a sum of the weights of the Al 2 O 3 , TiO 2 , SiO 2 and the ZrO 2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of the protective bonding composition 20 .
- the MgO/Al 2 O 3 -containing compositions 20 further contain at least one of: (1) CaO and TiO 2 in respective proportions such that a molten mixture containing the composition 20 also forms CaTiO 3 ; and (2) CaF 2 and SiO 2 in respective proportions such that a molten mixture containing the composition 20 also forms Ca 4 (Si 2 O 7 )(F,OH) 2 .
- Flux compositions containing calcium oxide and rutile are also known in the relevant art to be problematic (in terms of slag detachability from a weld) and to form calcium titanate perovskites by reactions such as:
- perovskites may also act as chemical anchors 16 that reduce detachability.
- protective bonding compositions 20 that contain mixtures of compounds selected from MgO, Al 2 O 3 , CaO and TiO 2 can increase TBC 6 adherence to chromium-containing MCrAlY bond coats 4 .
- Some protective bonding compositions 20 contain CaO and TiO 2 in respective proportions such that a molten mixture containing the composition 20 forms CaTiO 3 .
- a molar ratio of the CaO to the TiO 2 ranges from about 1.5:1 to about 1:1.5, or from about 1.3:1 to about 1:1.3, or from about 1.1:1 to about 1:1.1 respectively. In other embodiments the molar ratio of the CaO to the TiO 2 is about 1:1.
- compositions 20 comprise at least one of: (1) greater than about 5 percent by weight of the CaO; and (2) greater than about 5 percent by weight of the TiO 2 , based on a total weight of the protective bonding composition 20 .
- compositions 20 comprise at least one of: (1) greater than about 10 percent by weight of the CaO; and (2) greater than about 10 percent by weight of the TiO2, based on a total weight of the protective bonding composition 20 .
- Some CaO/TiO 2 -containing compositions 20 further contain SiO 2 , Al 2 O 3 and ZrO 2 , such that a sum of the weights of the Al 2 O 3 , TiO 2 , SiO 2 and the ZrO 2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of the protective bonding composition 20 .
- the CaO/TiO 2 -containing compositions 20 further contain at least one of: (1) CaF 2 and SiO 2 in respective proportions such that a molten mixture containing the composition 20 also forms Ca 4 (Si 2 O 7 )(F,OH) 2 ; and (2) MgO and Al 2 O 3 in respective proportions such that a molten mixture containing the composition 20 and Cr forms MgAlCrO 4 .
- Flux compositions containing calcium fluoride and silica are also known in the relevant art to be problematic and to form cuspidine [Ca 4 (Si 2 O 7 )(F,OH) 2 ] which also hinders slag removal.
- Cuspis is Greek and means “spear” which is related to the shape of crystalline cuspidine (see FIG. 6 ) which is likely responsible for its anchoring effect when contained in slags.
- Some protective bonding compositions 20 of the present disclosure contain CaF 2 and SiO 2 in respective proportions such that a molten mixture containing the composition 20 forms Ca 4 (Si 2 O 7 )(F,OH) 2 .
- a molar ratio of the CaF 2 to the SiO 2 ranges from about 1.5:1 to about 2.5:1, or from about 1.7:1 to about 2.3:1, or from about 1.9:1 to about 2.1:1, respectively.
- the molar ratio of the CaF 2 to the SiO 2 is about 2:1 respectively.
- CaF 2 /SiO 2 -containing compositions 20 comprise at least one of: (1) greater than about 25 percent by weight of CaF 2 ; and (2) greater than about 25 percent by weight of SiO 2 . In other embodiments CaF 2 /SiO 2 -containing compositions 20 comprise at least one of: (1) greater than about 35 percent by weight of CaF 2 ; and (2) greater than about 35 percent by weight of SiO 2 .
- Some CaF 2 /SiO 2 -containing compositions 20 further contain Al 2 O 3 , TiO 2 and ZrO 2 , such that a sum of the weights of the Al 2 O 3 , TiO 2 , SiO 2 and the ZrO 2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of the protective bonding composition 20 .
- the CaF 2 /SiO 2 -containing compositions 20 further contain at least one of: (1) CaO and TiO 2 in respective proportions such that the molten mixture also forms CaTiO 3 ; and (2) MgO and Al 2 O 3 in respective proportions such that a molten mixture containing the composition 20 and Cr forms MgAlCrO 4 .
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Abstract
A multi-layer article (1) disclosed herein contains a metallic substrate (2), a protective layer (6), and an adhesive bonding layer (14) including an oxygen-containing compound that bonds the adhesive bonding layer to the metallic substrate, the protective layer, or both. A method for forming the multi-layer article includes the steps of heating a protective bonding composition (20) to form a molten material (24) in contact with a metal-containing surface (2), allowing the molten material to cool and solidify into the adhesion bonding layer (14) affixed to the metal-containing surface, depositing a ceramic material (26) onto the adhesive bonding layer, and heating the ceramic material to form the protective layer (6) affixed to the adhesive bonding layer.
Description
- This invention relates generally to the field of materials technology, and more particularly to the fabrication and repair of multi-layer metallic articles containing adhesive coatings.
- Hot section components of modern gas turbine engines are often made of high-temperature alloys including superalloys based on nickel, iron and cobalt. Cast superalloys (e.g., 247, 738, CMSX4, Rene 5, etc.) and high performance wrought alloys (e.g., X, 625, 617, etc.) are often used in such high-temperature applications (e.g., turbine blades, vanes, combustion transition liners). These superalloys have been developed to withstand increasingly higher operating temperatures as well as the presence of corrosive and oxidative conditions. To withstand these extreme environments, protective coating systems are often applied to the surface of superalloy components to form multi-layer articles. These coating systems include an environmental coating, which can also serve as a metallic bond coat layer, and usually a ceramic thermal barrier coating (TBC) overlying the environmental or bond coat layer.
- Such environmental coatings (or bond coats) are typically metallic overlay coatings of the formula “MCrAlX” (where M is a Group VIIIB element such as Co, Ni, or a mixture thereof, and X is a rare earth element such as Y, Hf, W, Zr, La, or a mixture thereof) or diffusion aluminide coatings such as NiAl or a modified NiAl that includes an element such as Pt, Rh or Pd. In thermal barrier coating (TBC) systems containing both a metallic bond coat and a ceramic TBC layer, the TBC layer is often formed from metal oxides such as yttria-stabilized zirconias (YSZs). One of the purposes of the bond coat layer in a TBC system is to improve adhesion between the outer TBC layer and the underlying substrate being protected.
- In such multi-layered coating systems, adhesion of the outer protective layer to the underlying metallic substrate is an important consideration that can greatly affect the efficiency and longevity of a hot section component. Protective coatings are subject to degradation as a function of service. Elevated temperatures, high stresses (both sustained and cyclic), reactions with process gas, and foreign object impact can cause a variety of chemical and physical property changes leading to loss of coating (via e.g. cracking and spalling) resulting in exposure of the underlying substrate and further component damage.
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FIG. 1 illustrates one non-limiting example in which asuperalloy substrate 2 protected by a multi-layered TBC system 8, comprising an inner MCrAlYbond coat layer 4 and an outerceramic TBC layer 6, is compromised through degradation of the outerceramic TBC layer 6 leading toerosion 12 of both thebond coat layer 4 and the underlyingsuperalloy substrate 2. In this illustration themissing portion 10 of the TBC layer may have occurred due to relatively poor adhesion between the outerceramic TBC layer 6 and the inner MCrAlYbond coat layer 4. - A need exists to somehow improve adhesion between these outer
4, 6 and theprotective layers underlying substrate 2 to improve component longevity and efficiency. - The invention is explained in the following description in view of the drawings that show:
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FIG. 1 illustrates damage that can occur to an underlying metallic substrate when a protective coating is damaged or degraded. -
FIG. 2 is a cross-sectional view of a multi-layer article containing a metallic substrate, an adhesive bonding layer, and a ceramic protective layer, according to one embodiment. -
FIG. 3 is a cross-sectional view of a multi-layer article containing a metallic substrate, a bond coat layer, an adhesive bonding layer, and a ceramic protective layer, according to one embodiment. -
FIG. 4 is a cross-sectional view of a multi-layer article containing a metallic substrate, a ceramic protective layer, and a plurality of chemical anchors bonded to both the metallic substrate and the protective layer, according to one embodiment. -
FIG. 5 is a cross-section view of a multi-layer article containing a metallic substrate, a bond coat layer, a ceramic protective layer, and a plurality of chemical anchors bonded to both the bond coat layer and the ceramic protective layer, according to one embodiment. -
FIG. 6 is a photograph illustrating a spear-like cuspidine crystal, according to one embodiment. -
FIG. 7 illustrates process steps of a method for forming a multi-layer article, according to one embodiment. -
FIG. 8 illustrates process steps of a method for forming a multi-layer article, according to one embodiment. -
FIG. 9 illustrates process steps of a method for forming a multi-layer article, according to one embodiment. - The inventors were aware that certain welding and cladding flux formulations produce slag deposits that are difficult to remove. This adhesion is generally considered to be problematic in the welding industry—especially with multi-pass welds where it becomes both labor intensive to remove the deposits and where incomplete removal can result in the formation of inclusions and inferior weld deposits. For this reason welding compositions (e.g., flux compositions) are generally formulated to enhance detachability of the resulting slag deposits, see, e.g., Oladipupo, A. O., “Slag Detachability from Submerged Arc Welds,” Doctoral Thesis (Massachusetts Institute of Technology) February 1987 and US 2006/0266799.
- Although contrary to the accepted wisdom in the relevant art, the inventors recognized a possible utility of welding compositions capable of forming such deposits having low detachability, as a way to improve adhesion between protective coating systems and underlying metallic substrates. It was also envisioned that certain deposits could also be formulated to provide protective features that either supplement the outer protective layer (e.g., TBC/bond coat) or replace it altogether. Based upon this recognition, the inventors have developed protective bonding compositions and methods for using such compositions in the fabrication and repair of multi-layer articles having improved adhesion between protective outer layer(s) and underlying metallic substrates.
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FIG. 2 is a cross-sectional view of amulti-layer article 1 according to one embodiment. In this non-limiting example themulti-layer article 1 comprises ametallic substrate 2 bonded to anadhesive bonding layer 14 that is covered by aprotective layer 6. Unlike previously reported coating systems, themulti-layer article 1 of this embodiment does not contain an intermediate bond coat layer—but instead relies upon theadhesive bonding layer 14 which is a non-MCrAlY deposit having low detachability as briefly described above and further described in greater detail below. - The
metallic substrate 2 ofFIG. 2 (as well as in other embodiments described and implied below) may be a ferrous substrate (e.g., stainless steel) or a non-ferrous substrate such as a superalloy. The term “superalloy” is used herein as it is commonly used in the art, i.e., a highly corrosion and oxidation resistant alloy that exhibits excellent mechanical strength and resistance to creep at high temperatures. Superalloys typically include a high nickel or cobalt content. Examples of superalloys include alloys sold under the trademarks and brand names Hastelloy, Inconel alloys (e.g. IN 100, IN 700, IN 713, IN 738, IN 792, IN 939), Rene alloys (e.g. Rene N5, Rene 41, Rene 80, Rene 108, Rene 142, Rene 220), Haynes alloys (282), Mar M, CM 247, CM 247 LC, C263, 718, X-750, 25 ECY 768, 282, X45, PWA 1480, PWA 1483, PWA 1484, CMSX single crystal alloys (e.g., CMSX-4, CMSX-8, CMSX-10), GTD 111, GTD 222, MGA 1400, MGA 2400, PSM 116, Mar-M-200, Udimet 600, Udimet 500 and titanium aluminide. The terms “metal,” “metallic material,” “alloy,” and “metal alloy” are used herein in a general sense to describe pure metals, semi-pure metals and metal alloys. - The
protective layer 6 ofFIG. 2 (as well as in other embodiments described and implied below) may be a ceramic layer suitable for use as a thermal barrier coating (TBC), including TBCs well known in the relevant art. Such ceramic coatings generally have low thermal conductivity and include metal oxides such as zirconia (ZrO2) partially or fully stabilized by yttria (Y2O3), magnesia (MgO) or other oxides. In some embodiments theprotective layer 6 may include a yttri-stabilized zirconia (YSZ). - The
adhesive bonding layer 14 ofFIG. 2 (as well as in other embodiments described an implied below) contains one or more inorganic compounds that may include metal oxides, metal halides, metal oxometallates, metal carbonates, as well as elemental metals and metalloids of Groups IIA, IIIB, IVB, VB, VIB, VIIB, VIIIB, IB, IIB, IIIA, IVA, VA of the Period Table, lanthanides, and non-metals such as boron and carbon. As explained below in greater detail, theadhesive bonding layer 14 is formed by heating a protective bonding composition into a molten material in contact with a metal-containing surface, and then the molten material is allowed to cool and solidify into a deposit having low detachability from the metal-containing surface. - To attain the desired low detachability of the
adhesive bonding layer 14, the protective bonding composition is formulated to contain certain mixtures of compounds (described below in greater detail) which react in the heated environment of the molten material to form at least one oxygen-containing compound that promotes the bonding of theadhesive bonding layer 14 to themetallic substrate 2, theprotective layer 6, or both. - In some embodiments the oxygen-containing compound is selected from a spinel compound, a perovskite compound, a cuspidine compound, and mixtures thereof. In some embodiments the oxygen-containing compound is selected from MgAlCrO4, FeCrO4, CaTiO3, Ca4(Si2O7)(F,OH)2, and mixtures thereof.
- The term “spinel compound” is used herein in a general sense to describe an inorganic compound or mineral of the general formula MgAlMO4 wherein the element “M” refers to a metallic element such as Al or a transition metal such as Cr. The term “spinel compound” is also used herein in the same manner as this term is commonly understood in the relevant art. The term “perovskite compound” is used herein in a general sense to describe an inorganic compound or mineral of the general formula CaTiO3. The term “perovskite compound” is also used herein in the same manner as this term is commonly understood in the relevant art. The term “cuspidine compound” is used herein in a general sense to describe an inorganic compound or mineral of the general formula Ca4(Si2O7)(F,OH)2. The term “cuspidine compound” is also used herein in the same manner as this term is commonly understood in the relevant art.
- In some embodiments the oxygen-containing compound is believed to enhance adhesion between the
adhesive bonding layer 14 and themetallic substrate 2, theprotective layer 6, or both, by forming rigid crystalline structures serving as hooks or anchors to which the respective materials can inter-bond.FIG. 6 is a photograph illustrating such rigid crystalline structures in the form of spear-like cuspidine crystals 52 that are chemically anchored to a surface of ametallic substrate 50. The spear-like protrusions of thecuspidine crystals 52 can then rigidly bond to an upper layer (e.g., anadhesive bonding layer 14 or a protective layer 6) that is subsequently or concurrently formed to produce a multi-layer article in which the outer protective layer has low detachability. - As also illustrated in
FIG. 2 , in some embodiments themulti-layer article 1 may contain a plurality ofchemical anchors 16 bonded to theadhesive bonding layer 14 and to at least one of themetallic substrate 2 and theprotective layer 6. In the embodiment ofFIG. 2 the plurality ofchemical anchors 16 form inter-layer bonds such that one portion of thechemical anchors 16 is bonded to theadhesive bonding layer 14 and another portion of the chemical anchors is bonded to themetallic substrate 2. -
FIG. 3 is a cross-sectional view of amulti-layer article 3 containing ametallic substrate 2, abond coat layer 4, anadhesive bonding layer 14, and aprotective layer 6, according to one embodiment. Thebond coat layer 4 may be in the form of a metallic coating of the general formula MCrAlX wherein “M” is a Group VIIIB element such as Co, Ni, or a mixture thereof, and “X” is a rare earth elements such as Y, Hf, W, Zr, La, or a mixture thereof. In other embodiments thebond coat layer 4 may be in the form of a diffusion aluminide coating such as NiAl or a modified NiAl that includes an element such as Cr, Pt, Rh or Pd.FIG. 3 also illustrates the possible presence of a plurality of chemical anchors 16 bonded to theadhesive bonding layer 14 and to thebond coat layer 4 by forming inter-layer bonds such that one portion of the chemical anchors 16 is bonded to theadhesive bonding layer 14 and another portion of the chemical anchors 16 is bonded to thebond coat layer 4. - In some embodiments, for example, the
metallic substrate 2 ofFIG. 2 may be in the form of a superalloy substrate, thebond coat layer 4 may be in the form of a MCrAlY bond coat layer and theprotective layer 6 may be in the form of a ceramic TBC layer. -
FIGS. 4 and 5 illustrate other embodiments wherein the plurality of chemical anchors 16 enhance adhesion of the multi-layer articles 5, 7 by forming inter-layer bonds such that a first portion of the chemical anchors 16 is bonded to themetallic substrate 2, a second portion of the chemical anchors 16 is bonded to aresidual portion 18 of an adhesive bonding layer, and a third portion of the chemical anchors 16 is bonded to theprotective layer 6. -
FIG. 4 is a cross-sectional view of a multi-layer article 5 containing ametallic substrate 2, aprotective layer 6, and a plurality ofchemical anchors 16 inter-bonded to both themetallic substrate 2 and to theprotective layer 6. In some embodiments the multi-layer article 5 may also contain aresidual portion 18 of an adhesive bonding layer such that the chemical anchors 16 inter-bond to all three of themetallic substrate 2, theprotective layer 6 and theresidual portion 18 of an adhesive bonding layer. -
FIG. 5 is a cross-sectional view of a multi-layer article 7 containing ametallic substrate 2, abond coat layer 4, aprotective layer 6, and a plurality ofchemical anchors 16 inter-bonded to both thebond coat layer 4 and to theprotective layer 6. In some embodiments the multi-layer article 7 may also contain aresidual portion 18 of an adhesive bonding layer such that the chemical anchors 16 inter-bond to all three of thebond coat layer 4, theprotective layer 6 and theresidual portion 18 of an adhesive bonding layer. -
FIG. 7 illustrates process steps of a method for forming themulti-layer article 1 ofFIG. 2 , according to one embodiment. InStep 1 ofFIG. 7 , aprotective bonding composition 20 is deposited onto a surface of ametallic substrate 2, and anenergy beam 22′ is traversed over the surface of theprotective bonding composition 20 to form amelt pool 24 that is then allowed to cool and solidify into anadhesive bonding layer 14 affixed to themetallic substrate 2. In some embodiments, depending upon the content of theprotective bonding composition 20, the resulting article may also contain a plurality ofchemical anchors 16 inter-bonded to both themetallic substrate 2 and to theadhesive bonding layer 14. InStep 2 ofFIG. 7 , aceramic powder 26 is then deposited onto a surface of theadhesive bonding layer 14, and anenergy beam 22″ is traversed over the surface of theceramic powder 26 to form aregion 28 of sintering ceramic powder which upon cooling forms a protectiveceramic layer 6. -
FIG. 8 illustrates process steps of a method for forming themulti-layer article 3 ofFIG. 3 , according to one embodiment. InStep 1 ofFIG. 8 , aMCrAlY powder 30 is deposited onto a surface of ametallic substrate 2, and a protective bonding composition 20 (as, for example, a powder) is deposited onto the layer ofMCrAlY powder 30, and anenergy beam 22′ is traversed over the surface of the resulting multi-powder layer to form amelt pool 32 that is then allowed to cool and solidify into a MCrAlYbond coat layer 4 bonded to themetallic substrate 2 and covered by anadhesive bonding layer 14 affixed to thebond coat layer 4. In some embodiments, depending upon the content of theprotective bonding composition 20, the resulting article may also contain a plurality ofchemical anchors 16 inter-bonded to both thebond coat layer 4 and to theadhesive bonding layer 14. In other embodiments, theMCrAlY powder 30 and theprotective bonding composition 20 may be deposited onto the surface of themetallic substrate 2 as a mixture of powders (as opposed to the separate multi-layers illustrated inFIG. 8 ). InStep 2 ofFIG. 8 , aceramic powder 26 is then deposited onto a surface of theadhesive bonding layer 14, and anenergy beam 22″ is traversed over the surface of theceramic powder 26 to form aregion 28 of sintering ceramic powder which upon cooling forms a protectiveceramic layer 6. -
FIG. 9 illustrates process steps of a method for forming the multi-layer article 7 ofFIG. 5 , according to one embodiment. InStep 1 ofFIG. 9 , aMCrAlY powder 30 is deposited onto a surface of ametallic substrate 2, and a protective bonding composition 20 (as, for example, a powder) is deposited onto the layer ofMCrAlY powder 30, and anenergy beam 22′ is traversed over the surface of the resulting multi-powder layer to form amelt pool 32 that is then allowed to cool and solidify into a MCrAlYbond coat layer 4 bonded to themetallic substrate 2 and covered by anadhesive bonding layer 14 affixed to thebond coat layer 4. In some embodiments, depending upon the content of theprotective bonding composition 20, the resulting article may also contain a plurality ofchemical anchors 16 inter-bonded to both thebond coat layer 4 and to theadhesive bonding layer 14. In other embodiments, theMCrAlY powder 30 and theprotective bonding composition 20 may be deposited onto the surface of themetallic substrate 2 as a mixture of powders (as opposed to the separate multi-layers illustrated inFIG. 8 . -
Step 2 ofFIG. 9 involves removal of a portion of theadhesive bonding layer 14 to form aresidual portion 18 of theadhesive bonding layer 14 such that some portions of the chemical anchors 16 are exposed in an upward direction. Chemical and/or mechanical methods known in the relevant art for removing slag layers may be used to accomplish the removal of a portion of theadhesive bonding layer 14 inStep 2. - In
Step 3 ofFIG. 9 , aceramic powder 26 is then deposited onto a surface of the article formed inStep 2, and anenergy beam 22″ is traversed over the surface of theceramic powder 26 to form aregion 28 of sintering ceramic powder which upon cooling forms a protectiveceramic layer 6. Because theremoval Step 2 exposes portions of the chemical anchors 16 in an upward direction, theStep 3 deposition of the protectiveceramic layer 6 can occur such that the chemical anchors 16 form inter-layer bonds in which a first portion of the chemical anchors 16 is bonded to themetallic substrate 2, a second portion of the chemical anchors 16 is bonded to theresidual portion 18 ofadhesive bonding layer 14, and a third portion of the chemical anchors 16 is bonded to the protectiveceramic layer 6. -
Protective bonding compositions 20 may contain inorganic compounds such as metal oxides, metal halides, metal oxometallates, metal carbonates, a mixtures thereof—as well as elemental metals, lanthanides and metalloids.Protective bonding compositions 20 may also include organic compounds such as high-molecular weight hydrocarbons (e.g., beeswax, paraffin), carbohydrates (e.g., cellulose), natural and synthetic oils (e.g., palm oil), organic reducing agents (e.g., charcoal, coke), carboxylic acids and dicarboxylic acids (e.g., abietic acid, isopimaric acid, neoabietic acid, dehydroabietic acid, rosins), carboxylic acid salts (e.g., rosin salts), carboxylic acid derivatives (e.g., dehydro-abietylamine), amines (e.g., triethanolamine), alcohols (e.g., high polyglycols, glycerols), natural and synthetic resins (e.g., polyol esters of fatty acids), and other organic compounds, as well a mixture thereof. - The term “metal oxides” is used herein in a general sense to describe compounds having the general formula MaOb in which the variable “M” represents a metal atom, and the variables “a” and “b” represent integers greater than zero. Non-limiting examples of metal oxides include compounds such as Li2O, BeO, B2O3, B6O, MgO, Al2O3, SiO2, CaO, Sc2O3, TiO, TiO2, Ti2O3, VO, V2O3, V2O4, V2O5, Cr2O3, CrO3, MnO, MnO2, Mn2O3, Mn3O4, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, Ni2O3, Cu2O, CuO, ZnO, Ga2O3, GeO2, As2O3, Rb2O, SrO, Y2O3, ZrO2, NiO, NiO2, Ni2O5, MoO3, MoO2, RuO2, Rh2O3, RhO2, PdO, Ag2O, CdO, In2O3, SnO, SnO2, Sb2O3, TeO2, TeO3, Cs2O, BaO, HfO2, Ta2O5, WO2, WO3, ReO3, Re2O7, PtO2, Au2O3, La2O3, CeO2, Ce2O3, and mixtures thereof, to name a few. The term “metal oxides” is also used herein in the same manner as this term is commonly understood in the relevant art.
- The term “metal halides” is used herein in a general sense to describe compounds containing a metal atom and at least one halogen atom. Non-limiting examples of metal halides include compounds such as LiF, LiCl, LiBr, LiI, Li2NiBr4, Li2CuCl4, LiAsF6, LiPF6, LiAlCl4, LiGaCl4, Li2PdCl4, NaF, NaCl, NaBr, Na3AlF6, NaSbF6, NaAsF6, NaAuBr4, NaAlCl4, Na2PdCl4, Na2PtCl4, MgF2, MgCl2, MgBr2, AlF3, KCl, KF, KBr, K2RuCl5, K2IrCl6, K2PtCl6, K2PtCl6, K2ReCl6, K3RhCl6, KSbF6, KAsF6, K2NiF6, K2TiF6, K2ZrF6, K2PtI6, KAuBr4, K2PdBr4, K2PdCl4, CaF2, CaF, CaBr2, CaCl2, CaI2, ScBr3, ScCl3, ScF3, ScI3, TiF3, VCl2, VCl3, CrCl3, CrBr3, CrCl2, CrF2, MnCl2, MnBr2, MnF2, MnF3, MnI2, FeBr2, FeBr3, FeCl2, FeCl3, FeI2, CoBr2, CoCl2, CoF3, CoF2, CoI2, NiBr2, NiCl2, NiF2, NiI2, CuBr, CuBr2, CuCl, CuCl2, CuF2, CuI, ZnF2, ZnBr2, ZnCl2, ZnI2, GaBr3, Ga2Cl4, GaCl3, GaF3, GaI3, GaBr2, GeBr2, GeI2, GeI4, RbBr, RbCl, RbF, RbI, SrBr2, SrCl2, SrF2, SrI2, YCl3, YF3, YI3, YBr3, ZrBr4, ZrCl4, ZrI2, YBr, ZrBr4, ZrCl4, ZrF4, ZrI4, NbCl5, NbF5, MoCl3, MoCl5, RuI3, RhCl3, PdBr2, PdCl2, PdI2, AgCl, AgF, AgF2, AgSbF6, AgI, CdBr2, CdCl2, CdI2, InBr, InBr3, InCl, InCl2, InCl3, InF3, InI, InI3, SnBr2, SnCl2, SnI2, SnI4, SnCl3, SbF3, SbI3, CsBr, CsCl, CsF, CsI, BaCl2, BaF2, BaI2, BaCoF4, BaNiF4, HfCl4, HfF4, TaCl5, TaF5, WCl4, WCl6, ReCl3, ReCl5, IrCl3, PtBr2, PtCl2, AuBr3, AuCl, AuCl3, AuI, KAuCl4, LaBr3, LaCl3, LaF3, LaI3, CeBr3, CeCl3, CeF3, CeF4, CeI3, and mixtures thereof, to name a few. The term “metal halides” is also used herein in the same manner as this term is commonly understood in the relevant art.
- The term “metal oxometallates” is used herein in a general sense to describe compounds having the general formula MaXbOc in which the variable “M” represents a metal atom, the variable “X” represents a metal or non-metal atom, and the variables “a,” “b,” and “c” represent integers greater than zero. Non-limiting examples of metal oxometallates include compounds such as LiIO3, LiBO2, Li2SiO3, LiClO4, Na2B4O7, NaBO3, Na2SiO3, NaVO3, Na2MoO4, Na2SeO4, Na2SeO3, Na2TeO3, K2SiO3, K2CrO4, K2Cr2O7, CaSiO3, BaMnO4, and mixtures thereof, to name a few. The term “metal oxometallates” is also used herein in the same manner as this term is commonly understood in the relevant art.
- The term “metal carbonates” is used herein in a general sense to describe compounds containing a metal atom and at least one carbonate group. Non-limiting example of metal carbonates include compounds such as Li2CO3, Na2CO3, NaHCO3, MgCO3, K2CO3, CaCO3, Cr2(CO3)3, MnCO3, CoCO3, NiCO3, CuCO3, Rb2CO3, SrCO3, Y2(CO3)3, Ag2CO3, CdCO3, In2(CO3)3, Sb2(CO3)3, C2CO3, BaCO3, La2(CO3)3, Ce2(CO3)3, NaAl(CO3) (OH)2, and mixtures thereof, to name a few. The term “metal carbonates” is also used herein in the same manner as this term is commonly understood in the relevant art.
- In some embodiments TBC 6 adhesion to a MCrAlY bond-coat underlayer 4 (such as, for example, in
FIGS. 3 and 5 ) is improved by employing aprotective bonding composition 20 containing MgO and Al2O3. It is known in the welding industry that slag is particularly difficult to remove from chromium-bearing substrates, or from deposits made with a chromium-bearing filler, or from deposits utilizing chromium oxide in the flux. See, e.g., Oladipupo, A. O., “Slag Detachability from Submerged Arc Welds,” Doctoral Thesis (Massachusetts Institute of Technology) February 1987. Fluxes with magnesium oxide and alumina are particularly problematic due to the formation of chromium spinels such as iron chromate and magnesium aluminum chromate by reactions such as: -
MgO+Al2O3→MgAlCrO4 - These spinels represent solid reaction products that embed and attach to the underlying metallic substrate and can therefore serve as chemical anchors 16 that can greatly increase attachability (bond integrity) in multi-layer articles of the present disclosure.
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Protective bonding compositions 20 in some embodiments contain MgO and Al2O3 in respective proportions such that a molten mixture containing thecomposition 20 and Cr forms MgAlCrO4. In some embodiments a molar ratio of the MgO to the Al2O3 in theprotective bonding composition 20 ranges from about 1.5:1 to about 1:1.5, or from about 1.3:1 to about 1:1.3, or from about 1.1:1 to about 1:1.1 respectively. In other embodiments the molar ratio of the MgO to the Al2O3 is about 1:1. - Some MgO/Al2O3-containing
compositions 20 comprise at least one of: (1) greater than about 25 percent by weight of MgO; and (2) greater than out 25 percent by weight of Al2O3, based on a total weight of theprotective bonding composition 20. Inother embodiments compositions 20 comprise at least one of: (1) greater than about 35 percent by weight of MgO; and (2) greater than about 35 percent by weight of Al2O3, based on a total weight of theprotective bonding composition 20. In some embodiments the MgO/Al2O3-containingcompositions 20 may further comprise Cr, such as for example greater than about 10 percent by weight of Cr or greater than about 15 percent by weight of Cr. In other embodiments the MgO/Al2O3-containingcompositions 20 may further comprise at least one selected from the group consisting of Cr, CrO2, Cr2O3 and CrO3. - Some MgO/Al2O3-containing
compositions 20 further contain TiO2, SiO2 and ZrO2, such that a sum of the weights of the Al2O3, TiO2, SiO2 and the ZrO2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of theprotective bonding composition 20. Still in other embodiments the MgO/Al2O3-containingcompositions 20 further contain at least one of: (1) CaO and TiO2 in respective proportions such that a molten mixture containing thecomposition 20 also forms CaTiO3; and (2) CaF2 and SiO2 in respective proportions such that a molten mixture containing thecomposition 20 also forms Ca4(Si2O7)(F,OH)2. - Flux compositions containing calcium oxide and rutile are also known in the relevant art to be problematic (in terms of slag detachability from a weld) and to form calcium titanate perovskites by reactions such as:
-
CaO+TiO2→CaTiO3 - These perovskites may also act as chemical anchors 16 that reduce detachability. The inventors have recognized that
protective bonding compositions 20 that contain mixtures of compounds selected from MgO, Al2O3, CaO and TiO2 can increaseTBC 6 adherence to chromium-containing MCrAlY bond coats 4. - Some
protective bonding compositions 20 contain CaO and TiO2 in respective proportions such that a molten mixture containing thecomposition 20 forms CaTiO3. In some embodiments a molar ratio of the CaO to the TiO2 ranges from about 1.5:1 to about 1:1.5, or from about 1.3:1 to about 1:1.3, or from about 1.1:1 to about 1:1.1 respectively. In other embodiments the molar ratio of the CaO to the TiO2 is about 1:1. - Some CaO/TiO2-containing
compositions 20 comprise at least one of: (1) greater than about 5 percent by weight of the CaO; and (2) greater than about 5 percent by weight of the TiO2, based on a total weight of theprotective bonding composition 20. Inother embodiments compositions 20 comprise at least one of: (1) greater than about 10 percent by weight of the CaO; and (2) greater than about 10 percent by weight of the TiO2, based on a total weight of theprotective bonding composition 20. - Some CaO/TiO2-containing
compositions 20 further contain SiO2, Al2O3 and ZrO2, such that a sum of the weights of the Al2O3, TiO2, SiO2 and the ZrO2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of theprotective bonding composition 20. Still in other embodiments the CaO/TiO2-containingcompositions 20 further contain at least one of: (1) CaF2 and SiO2 in respective proportions such that a molten mixture containing thecomposition 20 also forms Ca4(Si2O7)(F,OH)2; and (2) MgO and Al2O3 in respective proportions such that a molten mixture containing thecomposition 20 and Cr forms MgAlCrO4. - Flux compositions containing calcium fluoride and silica are also known in the relevant art to be problematic and to form cuspidine [Ca4(Si2O7)(F,OH)2] which also hinders slag removal. Cuspis is Greek and means “spear” which is related to the shape of crystalline cuspidine (see
FIG. 6 ) which is likely responsible for its anchoring effect when contained in slags. - Some
protective bonding compositions 20 of the present disclosure contain CaF2 and SiO2 in respective proportions such that a molten mixture containing thecomposition 20 forms Ca4(Si2O7)(F,OH)2. In some embodiments a molar ratio of the CaF2 to the SiO2 ranges from about 1.5:1 to about 2.5:1, or from about 1.7:1 to about 2.3:1, or from about 1.9:1 to about 2.1:1, respectively. In other embodiments the molar ratio of the CaF2 to the SiO2 is about 2:1 respectively. - Some CaF2/SiO2-containing
compositions 20 comprise at least one of: (1) greater than about 25 percent by weight of CaF2; and (2) greater than about 25 percent by weight of SiO2. In other embodiments CaF2/SiO2-containingcompositions 20 comprise at least one of: (1) greater than about 35 percent by weight of CaF2; and (2) greater than about 35 percent by weight of SiO2. - Some CaF2/SiO2-containing
compositions 20 further contain Al2O3, TiO2 and ZrO2, such that a sum of the weights of the Al2O3, TiO2, SiO2 and the ZrO2 is less than about 6.5 percent by weight or more than about 12 percent by weight, based on a total weight of theprotective bonding composition 20. Still in other embodiments the CaF2/SiO2-containingcompositions 20 further contain at least one of: (1) CaO and TiO2 in respective proportions such that the molten mixture also forms CaTiO3; and (2) MgO and Al2O3 in respective proportions such that a molten mixture containing thecomposition 20 and Cr forms MgAlCrO4. - While various embodiments of the present invention have been shown and described herein, it will be obvious that such embodiments are provided by way of example only. Numerous variations, changes and substitutions may be made without departing from the invention herein.
Claims (25)
1. A multi-layer article, comprising:
a metallic substrate;
a protective layer; and
an adhesive bonding layer comprising an oxygen-containing compound that bonds the adhesive bonding layer to the metallic substrate, the protective layer, or both.
2. The article of claim 1 , further comprising a plurality of anchors bonded to the adhesive bonding layer and to at least one of the metallic substrate and the protective layer,
wherein:
the anchors comprise the oxygen-containing compound; and
a structure of the anchors is effective to adhere the metallic substrate, the protective layer, or both, to the adhesive bonding layer by forming inter-layer linkages such that one portion of the anchors is attached to the adhesive bonding layer and another portion of the anchors is attached to the metallic substrate or to the protective layer.
3. The article of claim 1 , comprising:
a superalloy substrate;
a MCrAlY bond coat layer bonded to a surface of the superalloy substrate;
the adhesive bonding layer bonded to a surface of the MCrAlY bond coat layer; and
a ceramic thermal barrier layer bonded to a surface of the adhesive bonding layer.
4. The article of claim 1 , comprising:
a superalloy substrate;
the adhesive bonding layer bonded to a surface of the superalloy substrate; and
a ceramic thermal barrier layer bonded to a surface of the adhesive bonding layer.
5. The article of claim 1 , wherein the oxygen-containing compound is at least one selected from the group consisting of a spinel compound, a perovskite compound, and a cuspidine compound.
6. The article of claim 1 , wherein the oxygen-containing compound is at least one selected from the group consisting of MgAlCrO4, FeCrO4, CaTiO3, and Ca4(Si2O7)(F,OH)2.
7. The article of claim 1 , wherein the adhesive bonding layer is formed from a protective bonding composition comprising at least one of:
a mixture of MgO and Al2O3 in respective proportions such that an adhesive bonding layer comprising Cr further comprises MgAlCrO4;
a mixture of CaO and TiO2 in respective proportions such that the adhesive bonding layer comprises CaTiO3; and
a mixture of CaF2 and SiO2 in respective proportions such that the adhesive bonding layer comprises Ca4(Si2O7)(F,OH)2.
8. The article of claim 7 , satisfying at least one of the following conditions:
(i) the protective bonding composition comprises at least one of
greater than about 25 percent by weight of the MgO, and
greater than about 25 percent by weight of the Al2O3;
(ii) the protective bonding composition comprises at least one of
greater than about 5 percent by weight of the CaO, and
greater than about 5 percent by weight of the TiO2; and
(iii) the protective bonding composition comprises at least one of
greater than about 25 percent by weight of the CaF2, and
greater than about 20 percent by weight of the SiO2,
based on a total weight of the protective bonding composition.
9. A multi-layer article, comprising:
a metallic layer;
a protective layer; and
a plurality of anchors bonded to both the metallic layer and the protective layer,
wherein:
the anchors comprise an oxygen-containing inorganic compound; and
a structure of the anchors is effective to adhere the metallic layer to the protective layer by forming inter-layer linkages such that one portion of the anchors is attached to the metallic layer and another portion of the anchors is attached to the protective layer.
10. The article of claim 9 , further comprising an adhesive bonding layer disposed between the metallic layer and the protective layer and in direct contact with the anchors, wherein the anchors form the inter-layer linkages such that a first portion of the anchors is attached to the metallic layer, a second portion of the anchors is attached to the adhesive bonding layer, and a third portion of the anchors is attached to the protective layer.
11. The article of claim 9 , wherein the oxygen-containing inorganic compound is at least one selected from the group consisting of a spinel compound, a perovskite compound, and a cuspidine compound.
12. The article of claim 9 , wherein the oxygen-containing inorganic compound is at least one selected from the group consisting of MgAlCrO4, FeCrO4, CaTiO3, and Ca4(Si2O7)(F,OH)2.
13. A method for forming a multi-layer article of claim 1 , the method comprising:
heating a protective bonding composition to form a molten material in contact with a metal-containing surface;
allowing the molten material to cool and solidify into the adhesive bonding layer affixed to the metal-containing surface;
depositing a ceramic material onto the adhesive bonding layer; and
heating the ceramic material to form the protective layer affixed to the adhesive bonding layer, to form the multi-layer article.
14. The method of claim 13 , wherein the protective bonding composition comprises at least two selected from the group consisting of MgO, Al2O3, CaO, TiO2, CaF2 and SiO2.
15. The method of claim 13 , wherein the protective bonding composition comprises MgO and Al2O3 in respective proportions such that the molten material in the presence of Cr contains MgAlCrO4.
16. The method of claim 15 , wherein a molar ratio of the MgO to the Al2O3 ranges from about 1.5:1 to about 1:1.5 respectively.
17. The method of claim 15 , wherein the protective bonding composition comprises at least one of:
greater than about 25 percent by weight of the MgO; and
greater than about 25 percent by weight of the Al2O3,
based on a total weight of the protective bonding composition.
18. The method of claim 13 , wherein the protective bonding composition comprises CaO and TiO2 in respective proportions such that the molten material contains CaTiO3.
19. The method of claim 18 , wherein a molar ratio of the CaO to the TiO2 ranges from about 1.5:1 to about 1:1.5 respectively.
20. The method of claim 18 , wherein the protective bonding composition comprises at least one of:
greater than about 5 percent by weight of the CaO; and
greater than about 5 percent by weight of the TiO2,
based on a total weight of the protective bonding composition.
21. The method of claim 13 , wherein the protective bonding composition comprises CaF2 and SiO2 in respective proportions such that the molten material contains Ca4(Si2O7)(F,OH)2.
22. The method of claim 21 , wherein a molar ratio of the CaF2 to the SiO2 ranges from about 1.5:1 to about 2.5:1 respectively.
23. The method of claim 21 , wherein the protective bonding composition comprises at least one of:
greater than about 25 percent by weight of the CaF2; and
greater than about 20 percent by weight of the SiO2,
based on a total weight of the protective bonding composition.
24. The method of claim 13 , wherein the metal-containing surface is a metallic substrate or is a bond coat layer affixed to a surface of the metallic substrate.
25. The method of claim 13 , further comprising removing a portion of the adhesive bonding layer before the depositing of the ceramic material, such that:
anchors contained in the adhesive bonding layer are not removed and remain attached to the metal-containing surface; and
exposed portions of the anchors become attached to the protective layer during the heating of the ceramic material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/596,283 US20160201200A1 (en) | 2015-01-14 | 2015-01-14 | Adhesion of coatings using adhesive bonding compositions |
| DE102016100587.8A DE102016100587A1 (en) | 2015-01-14 | 2016-01-14 | Improved adhesion of coatings using bonding compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/596,283 US20160201200A1 (en) | 2015-01-14 | 2015-01-14 | Adhesion of coatings using adhesive bonding compositions |
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| US20160201200A1 true US20160201200A1 (en) | 2016-07-14 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/596,283 Abandoned US20160201200A1 (en) | 2015-01-14 | 2015-01-14 | Adhesion of coatings using adhesive bonding compositions |
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| Country | Link |
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| US (1) | US20160201200A1 (en) |
| DE (1) | DE102016100587A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180138141A1 (en) * | 2015-06-04 | 2018-05-17 | Lintec Corporation | Protective film for semiconductors, semiconductor device, and composite sheet |
| CN116544631A (en) * | 2023-07-06 | 2023-08-04 | 深圳海辰储能控制技术有限公司 | Protective material layer, battery, energy storage device and electric equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6471881B1 (en) * | 1999-11-23 | 2002-10-29 | United Technologies Corporation | Thermal barrier coating having improved durability and method of providing the coating |
| US20060128548A1 (en) * | 2004-02-10 | 2006-06-15 | General Electric Company | Bondcoat for the application of tbc's and wear coatings to oxide ceramic matrix |
| US20120148794A1 (en) * | 2008-04-24 | 2012-06-14 | Siemens Power Generation, Inc. | Cmc anchor for attaching a ceramic thermal barrier to metal |
| US20150030871A1 (en) * | 2013-07-26 | 2015-01-29 | Gerald J. Bruck | Functionally graded thermal barrier coating system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060266799A1 (en) | 2005-05-31 | 2006-11-30 | Lincoln Global, Inc. | Slag detachability |
-
2015
- 2015-01-14 US US14/596,283 patent/US20160201200A1/en not_active Abandoned
-
2016
- 2016-01-14 DE DE102016100587.8A patent/DE102016100587A1/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6471881B1 (en) * | 1999-11-23 | 2002-10-29 | United Technologies Corporation | Thermal barrier coating having improved durability and method of providing the coating |
| US20060128548A1 (en) * | 2004-02-10 | 2006-06-15 | General Electric Company | Bondcoat for the application of tbc's and wear coatings to oxide ceramic matrix |
| US20120148794A1 (en) * | 2008-04-24 | 2012-06-14 | Siemens Power Generation, Inc. | Cmc anchor for attaching a ceramic thermal barrier to metal |
| US20150030871A1 (en) * | 2013-07-26 | 2015-01-29 | Gerald J. Bruck | Functionally graded thermal barrier coating system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180138141A1 (en) * | 2015-06-04 | 2018-05-17 | Lintec Corporation | Protective film for semiconductors, semiconductor device, and composite sheet |
| US10825790B2 (en) * | 2015-06-04 | 2020-11-03 | Lintec Corporation | Protective film for semiconductors, semiconductor device, and composite sheet |
| CN116544631A (en) * | 2023-07-06 | 2023-08-04 | 深圳海辰储能控制技术有限公司 | Protective material layer, battery, energy storage device and electric equipment |
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|---|---|
| DE102016100587A1 (en) | 2016-07-14 |
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