US20160082569A1

US20160082569A1 - Retainer and wafer carrier including the same

Info

Publication number: US20160082569A1
Application number: US14/729,030
Authority: US
Inventors: Sang-Hyun Bae; Kyu-dong Jung; Il-hwan Kim; Jung-Hwan Kim; Hyuek-Jae Lee; Tae-Je Cho
Original assignee: Individual
Current assignee: Samsung Electronics Co Ltd
Priority date: 2014-09-19
Filing date: 2015-06-02
Publication date: 2016-03-24
Also published as: CN105448789A; KR20160033910A

Abstract

A retainer for a wafer carrier comprising: a body including a plurality of slots configured to receive side surfaces of wafers; and for each of the slots, a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding wafer, the supporting structure being spaced apart from an upper corner of the side surface of the corresponding wafer.

Description

CROSS-RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean Patent Application No. 2014-124723, filed on Sep. 19, 2014 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in their entirety.

BACKGROUND

1. Field
Embodiments relate to a retainer and a wafer carrier including the same. More particularly, example embodiments relate to a retainer arranged in a wafer carrier to support wafers, and a wafer carrier including the retainer.
2. Description of the Related Art
Generally, wafers may be received in a wafer carrier. The wafer carrier may include a front open unified pod (FOUP). The FOUP may include a retainer configured to support the wafers.
According to related arts, a side corner of the wafer may make contact with the retainer so that the side corner of the wafer may be damaged. Particularly, the side corner of the wafer having a thin thickness may be more damaged.

SUMMARY

An embodiment includes a retainer for a wafer carrier comprising: a body including a plurality of slots configured to receive side surfaces of wafers; and for each of the slots, a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding wafer, the supporting structure being spaced apart from an upper corner of the side surface of the corresponding wafer.
An embodiment includes a wafer carrier comprising: a case having an entrance configured to receive wafers, a first inner surface facing the entrance, and second and third inner surfaces extended from the first inner surface to the entrance; a door installed at the entrance; and retainers arranged on an inner surface of the door and on each of the first to third inner surfaces of the case, each retainer including a body including a plurality of slots configured to receive side surfaces of wafers, each slot including a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding one of the wafers, the supporting structure configured to be spaced apart from an upper corner of the side surface of the corresponding wafer.
An embodiment includes a retainer for a wafer carrier comprising: a body including a plurality of slots; and for each of the slots, the slot comprises: an upper surface; a lower surface; and a supporting structure formed on a sidewall of the slot and protruding into the slot wherein a furthest extent of the protrusion of the supporting structure into the slot is offset from the upper surface.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. FIGS. 1 to 16 represent non-limiting, example embodiments as described herein.

FIG. 1 is an exploded perspective view illustrating a wafer carrier in accordance with some embodiments;

FIG. 2 is a plan view illustrating a retainer for supporting a wafer in the wafer carrier of FIG. 1;

FIG. 3A-3D are cross-sectional views taken along a line III-III′ in FIG. 2 according to some embodiments;

FIG. 4 is a cross-sectional view taken along a line IV-IV′ in FIG. 2;

FIG. 5 is a cross-sectional view illustrating a retainer in accordance with some embodiments;

FIG. 6 is a cross-sectional view illustrating a retainer for supporting a wafer in accordance with some embodiments;

FIG. 7 is a cross-sectional view illustrating a retainer for supporting a wafer in accordance with some embodiments;

FIG. 8 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments;

FIG. 9 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments;

FIG. 10 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments;

FIG. 11 is a plan view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments;

FIG. 12 is a cross-sectional view taken along a line XII-XII′ in FIG. 11;

FIG. 13 is a cross-sectional view taken along a line XIII-XIII′ in FIG. 2;

FIG. 14 is a plan view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with example embodiments;

FIG. 15 is a cross-sectional view taken along a line XV-XV′ in FIG. 14; and

FIG. 16 is a cross-sectional view taken along a line XVI-XVI′ in FIG. 14.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which particular embodiments are shown. Embodiments may, take many different forms and should not be construed as limited to the particular embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.
It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.
These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section.
Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized example embodiments (and intermediate structures). As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, example embodiments will be explained in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view illustrating a wafer carrier in accordance with some embodiments, FIG. 2 is a plan view illustrating a retainer for supporting a wafer in the wafer carrier of FIG. 1, FIG. 3A-3D are cross-sectional views taken along a line III-III′ in FIG. 2 according to some embodiments, FIG. 4 is a cross-sectional view taken along a line IV-IV′ in FIG. 2, FIG. 5 is a cross-sectional view illustrating a retainer in accordance with some embodiments, FIG. 6 is a cross-sectional view illustrating a retainer for supporting a wafer in accordance with some embodiments, and FIG. 7 is a cross-sectional view illustrating a retainer for supporting a wafer in accordance with some embodiments.
Referring to FIG. 1, a wafer carrier 100 of this embodiment may include a case 110, first retainers 120, second retainers 130 and a door 140.
The case 110 may have an internal space where multiple wafers W may be horizontally received. For clarity, only a single wafer W is illustrated. The case 110 may have an entrance 112 through which the wafers W may be moved. The case 110 may have a rectangular parallelepiped shape. Thus, the case 110 may have a first inner surface 114 facing the entrance 112, and a second inner surface 116 and a third inner surface 118 extended from the first inner surface 114 to the entrance 112. The second inner surface 116 and the third inner surface 118 may have a rounded shape protruding from a central portion of the case 110 toward an outside of the case 110. Although a rectangular parallelepiped has been used as an example of a shape of the case 110, in other embodiments, the case 110 may have other shapes.
The door 140 may be installed at the entrance 112 of the case 110. When the door 140 is closed, the combination of the case 110 and the door 140 may have the rectangular parallelepiped shape.
The first retainers 120 may be arranged on an inner surface of the door 140 and the first inner surface 114 of the case 110. In the view of FIG. 1, the first retainers 120 on the first inner surface 114 are obscured by a side of the case 110 with the second inner surface 116; however, as illustrated in FIG. 2, the first retainers 120 on the first inner surface 114 may be opposite the first retainers 120 on the door 140 when the door 140 is closed. The second retainers 130 may be arranged on the second inner surface 116 and the third inner surface 118 of the case 110. As shown in FIG. 2, the first retainers 120 may face each other. Further, the second retainers 130 may face each other. As a result, four side surfaces of each of the wafers W may be supported by the first retainers 120 and the second retainers 130.
Referring to FIG. 3A, the first retainer 120 may include a first body 122 and a first supporting structure 124. The first body 122 may be arranged on the inner surface of the door 140 and the first inner surface 114 of the case 110. In particular, an outer surface of the first body 122 may be fixed to the inner surface of the door 140 and the first inner surface 114 of the case 110. The first body 122 may have multiple first slots 126, each configured to receive a side surface S of a corresponding one of the wafers W.
The first supporting structure 124 may be formed on an inner surface of the first body 122. The first supporting structure 124 may be integrally formed with the first body 122; however, in other embodiments, the first supporting structure 124 may be a separate component that is assembled with the first body 122. The first body 122 and the first supporting structure 124 may include a resilient material such as a plastic, a rubber, etc.
The first supporting structure 124 may be disposed to make close contact with the side surface S of the wafer W to support the wafer W. In some embodiments, the first supporting structure 124 may include first embossings arranged by substantially the same interval in a vertical direction. The first supporting structure 124 may have a semi-circular shape protruding from the inner surface of the first body 122 in the horizontal direction. Thus, the first supporting structure 124 may have a rounded surface configured to make point contact with the side surface S of the wafer W. The resilient first supporting structure 124, when making contact with the side surface S of the wafer W, may be slightly compressed to softly support the side surface S of the wafer W.
In addition, because the first supporting structure 124 may have the semi-circular shape, an upper corner UC of the side surface S of the wafer W may be spaced apart from the first supporting structure 124. A lower corner DC of the side surface S of the wafer W may also be spaced apart from the first supporting structure 124. Thus, only one point of the side surface S of the wafer W may make point contact with the first supporting structure 124. In contrast, the upper corner UC and the lower corner DC may not make contact with the first supporting structure 124. As a result, contacts between the sharp upper corner UC and the sharp lower corner DC of the wafer W and the first supporting structure 124 may be prevented so that the upper corner UC and the lower corner DC of the wafer W may not be damaged due to such contact.
Additionally, the misaligned wafer W may be loaded into the internal space of the case 110. In order to prevent a contact between the upper corner UC and the lower corner DC of the misaligned wafer W and the first supporting structure 124, the first supporting structure 124 may have a thickness substantially the same as a thickness of the wafer W. However, the thickness of the first supporting structure 124 may not be restricted within the thickness of the wafer W. The thickness of the first supporting structure 124 may vary within the non-contact between the upper corner UC and the lower corner DC of the wafer W and the first supporting structure 124.
In an embodiment, the slot 126 may be bounded by a lower surface 126L and an upper surface 126U. The lower surface 126L may be configured to support a back side of the wafer W. The first supporting structure 124 may be configured to extend into the slot 126 from the first body 122. A furthest extent of the first supporting structure 124 extending into the slot may be offset from one or more of the lower surface 126L and the upper surface 126U. In this embodiment, the furthest extent of the first supporting structure 124 is offset from both the lower surface 126L and the upper surface 126U. In particular, the upper corner UC and the lower corner DC of the wafer W may be disposed closer to the upper surface 126U and the lower surface 126L when a wafer W is loaded. Because the furthest extent of the first supporting structure 124 is offset from both the lower surface 126L and the upper surface 126U, the first supporting structure 124 may contact the wafer W only on the side surface S at a location offset from the upper corner UC and the lower corner DC.
Referring to FIG. 3B, the first retainer 120′ may include structures similar to the first retainer 120 of FIG. 3A. In particular, the first supporting structure 124′ may be similar to the first supporting structure 124; however, the first supporting structure 124′ may have a different shape. In this embodiment, the first supporting structure 124′ has a triangular shape. Accordingly, the first supporting structure 124′ may still make point contact with only one point of the side surface S of the wafer W. Although a triangular shape and a semi-circular shape have been used as examples, any structure that may make point contact with only one point of the side surface S of the wafer W at a point between the upper corner UC and the lower corner DC may be used.
Referring to FIG. 3C, the first retainer 120″ may include structures similar to the first retainer 120 of FIG. 3A. In particular, the first supporting structure 124″ may be similar to the first supporting structure 124; however, the first supporting structure 124″ may have a different shape. In this embodiment, the first supporting structure 124″ has a trapezoid shape. In particular, the first supporting structure 124″ a surface SS that is configured to contact the side surface S of the wafer W. However, the contact between the side surface S of the wafer W and the surface SS of the first supporting structure 124″ does not extend to the upper corner UC and the lower corner DC. Although a trapezoid has been used as an example, any shape that makes surface contact with the side surface S of the wafer W that does not extend to the upper corner UC and the lower corner DC may be used.
Referring to FIG. 3D, the first retainer 120′″ may include structures similar to the first retainer 120 of FIG. 3A. In particular, the first supporting structure 124′″ may be similar to the first supporting structure 124; however, the first supporting structure 124′″ may have a different shape. In this embodiment, the first supporting structure 124′″ has a ribbed shape. As a result, the first supporting structure 124′″ may be configured to make point contact with the side surface S of the wafer W at multiple locations. However, each of these point contacts may be offset from the upper corner UC and the lower corner DC. Although a first supporting structure 124′″ configured to have up to three point contacts has been used as an example, a structure configured to have any number of point contacts may be used as the first supporting structure 124′″ as long as the point contact are offset from the upper corner UC and the lower corner DC. In addition, although multiple point contacts have been illustrated as the result of ribs with each having a triangular shape, the shape of the individual ribs may be similar to that of a structure configured to create a single point contact. For example, each rib may have a semi-circular shape.
Although a variety of shapes have been given as examples of the first supporting structure 124, any shape that results in contact with the side surface S of the wafer W that is offset from the upper corner UC and the lower corner DC may be used. Furthermore, other embodiments will be described below using a first supporting structure 124, with modifications to a first supporting structure 124, having a structure similar to the first supporting structure 124, or the like. In such embodiments, the example of the semi-circular first supporting structure 124 may be replaced with first supporting structures 124 having different shapes as described above.
Referring to FIG. 4, the second retainer 130 may have a structure substantially the same as the structure of the first retainer 120. Because the second inner surface 116 and the third inner surface 118 of the case 110 may have the rounded shape protruding from the central portion of the case 110 toward the outside of the case 110, the second retainer 130 may also have a rounded shape protruding toward the second inner surface 116 and the third inner surface 118 of the case 110.
The second retainer 130 may include a second body 132 and a second supporting structure 134. The second body 132 may be arranged on the second inner surface 116 and the third inner surface 118 of the case 110. The second body 132 may have multiple second slots 136, each configured to receive a side surface S of a corresponding one of the wafers W.
In some embodiments, the second supporting structure 134 may include second embossings formed on an inner surface of the second body 132. The second supporting structure 134 may be integrally formed with the second body 132; however, in other embodiments, the second supporting structure 134 may be a separate component that is assembled with the second body 132. The second body 132 and the second supporting structure 134 may include a resilient material such as a plastic, a rubber, etc. The second supporting structure 134 may have a shape and functions substantially the same as the shape and the functions of the first supporting structure 124. Thus, any further illustrations with respect to the second supporting structure 134 may be omitted herein for brevity.
Alternatively, referring to FIG. 5, the first supporting structure 124 may have a hollow portion 128. Thus, the first supporting structure 124 may have a hollow structure having a hollow inner space. The resilient first supporting structure 124 making contact with the side surface S of the wafer W may be compressed into the hollow portion 128 to more softly support the side surface S of the wafer W. Similarly, the second supporting structure 134 may also have a hollow portion.
The first retainer 120 and the second retainer 130 may be configured to support a wafer in FIG. 6. The wafer in FIG. 6 may include a carrier wafer CW1 and a device wafer
DW1. The device wafer DW1 may be attached to an upper surface of the carrier wafer CW1 using an adhesive. The carrier wafer CW1 may include a bare wafer without electronic devices. In contrast, the device wafer DW1 may include electronic devices. The device wafer DW1 may have a side surface DS1 substantially coplanar with a side surface CS1 of the carrier wafer CW1.
In some embodiments, the device wafer DW1 may include multiple plugs P. The plugs P may be formed in the device wafer DW1 in a vertical direction. The plugs P may be electrically connected between an upper semiconductor chip and a lower semiconductor chip of a multi-chip package. The plugs P may electrically make contact with conductive bumps of the upper semiconductor chip. Thus, the plugs P may have upper ends exposed through an upper surface of the device wafer DW1. The upper surface of the device wafer DW1 may be removed by a grinding process until the upper ends of the plugs P may be exposed. During the grinding process, the carrier wafer CW1 may support the device wafer DW1. As a result, the device wafer DW1 may have a thickness less than a thickness of the carrier wafer CW1. Thus, an upper corner UC1 of the thin device wafer DW1 may be easily damaged. In order to prevent the damage of the upper corner UC1 of the device wafer DW1 a trimming process for partially removing the upper corner UC1 of the device wafer DW1 may be performed.
However, in some embodiments, the first supporting structure 124 may make point contact with only the side surface CS1 of the carrier wafer CW1. The first supporting structure 124 may be spaced apart from the upper corner UC1 of the side surface DS1 of the device wafer DW1. Further, the first supporting structure 124 may be spaced apart from a lower corner DC1 of a side surface CS1 of the carrier wafer CW1. Thus, the sharp upper corner UC1 of the device wafer DW1 and the sharp lower corner DC1 of the carrier wafer CW1 may not make contact with the first supporting structure 124 so that the upper corner UC1 of the device wafer DW1 and the lower corner DC1 of the carrier wafer CW1 may not be damaged. As a result, the trimming process for partially removing the side surface DS1 of the device wafer DW1 may not be performed.
The first retainer 120 and the second retainer 130 may be configured to support a wafer in FIG. 7. The wafer in FIG. 7 may include a carrier wafer CW2 and a device wafer DW2. The carrier wafer CW2 and the device wafer DW2 in FIG. 7 may have structures substantially similar to the structures of the carrier wafer CW1 and the device wafer DW1 in FIG. 6, respectively, except for a side surface DS2 of the device wafer DW2. Thus, any further illustrations of substantially similar aspects of the carrier wafer CW2 and the device wafer DW2 in FIG. 7 may be omitted herein for brevity.
The side surface DS2 of the device wafer DW2 may be positioned nearer to a central portion of the carrier wafer CW2 with respect to a side surface CS2 of the carrier wafer CW2. For example, a trimming process may be performed on the side surface DS2 of the device wafer DW2 so that the side surface DS2 of the device wafer DW2 may be positioned nearer to a central portion of the carrier wafer CW2 with respect to a side surface CS2 of the carrier wafer CW2.
The device wafer DW2 may be attached to an upper surface of the carrier wafer CW2 using an adhesive. The carrier wafer CW2 may include a bare wafer without electronic devices. In contrast, the device wafer DW2 may include electronic devices. A sharp upper corner UC2 of the device wafer DW2 and a sharp lower corner DC2 of the carrier wafer CW2 may not make contact with the first supporting structure 124 so that the upper corner UC2 of the device wafer DW2 and the lower corner DC2 of the carrier wafer CW2 may not be damaged.
FIG. 8 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments, FIG. 9 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments, and FIG. 10 is a cross-sectional view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments.
Referring to FIG. 8, a retainer 220 of this example embodiment may include a body 222 and a supporting structure 224. The body 222 may have multiple slots 226, each configured to receive side surfaces S of a corresponding wafer W.
In some embodiments, the supporting structure 224 may include a supporting surface. The supporting structure 224 may be configured to partially make face contact with the side surface S of the wafer W. Thus, the supporting surface of the supporting structure 224 may be configured to have a thickness less than a thickness of the wafer W. The supporting surface of the supporting structure 224 may be configured to be substantially parallel to the side surface S of the wafer W. The supporting structure 224 may be configured to make face contact with less than all of the side surface S of the wafer W. In addition, the supporting structure 224 may be configured to not make contact with the upper corner UC and the lower corner DC of the wafer W. That is the supporting surface of the supporting structure 224 may be offset from the upper corner UC and the lower corner DC of the wafer W.
Additionally, the body 222 may further include a first receiving groove 227 and a second receiving groove 228. The first receiving groove 227 may be configured to extend from the slot 226 to expose the upper corner UC of the wafer W. The second receiving groove 228 may be configured to extend from the slot 226 to expose the lower corner DC of the wafer W. Because the upper corner UC of the wafer W may be exposed through the first receiving groove 227 and the lower corner DC of the wafer W may be exposed through the second receiving groove 228, contacts between the upper corner UC and the supporting structure 224, and between the lower corner DC of the supporting structure 224 may be prevented. In some embodiments, the first receiving groove 227 and the second receiving groove 228 may have a circular shape. Alternatively, the first receiving groove 227 and the second receiving groove 228 may have other shapes such that the upper corner UC and the supporting structure 224 do not contact and the lower corner DC and the supporting structure 224 do not contact.
The retainer 220 may be configured to support a wafer in FIG. 9. The wafer in FIG. 9 may have a structure substantially the same as the structure of the wafer including the carrier wafer CW1 and the device wafer DW1 in FIG. 6. Thus, any further description of similar aspects of the wafer in FIG. 9 may be omitted herein for brevity.
The supporting structure 224 may be configured to partially make face contact with the side surface CS1 of the carrier wafer CW1. The supporting structure 224 may be configured to be substantially parallel to the side surface CS1 of the carrier wafer CW1.
The supporting structure 224 may be configured to make face contact with less than all of the side surface CS1 of the carrier wafer CW1. In some embodiments, the supporting structure 224 may be configured to make face contact with both a portion of the side surface CS1 of the carrier wafer CW1 and the side surface DS1 of the device wafer DW1. However, the supporting structure 224 may be configured to not make contact with all of the side surface DS1 of the device wafer DW1. Thus, the supporting structure 224 may be configured to not make contact with the upper corner UC1 of the device wafer DW1 and the lower corner DC1 of the carrier wafer CW1.
The upper corner UC1 of the device wafer DW1 may be exposed through the first receiving groove 227. The lower corner DC1 of the carrier wafer CW1 may be exposed through the second receiving groove 228. Therefore, the contacts between the upper corner UC1 of the device wafer DW1 and the supporting structure 224 and between the lower corner DC1 of the carrier wafer CW1 and the supporting structure 224 may be prevented.
The retainer 220 may be configured to support a wafer in FIG. 10. The wafer in FIG. 10 may have a structure substantially the same as the structure of the wafer including the carrier wafer CW2 and the device wafer DW2 in FIG. 7. Thus, any further description of similar features of the wafer in FIG. 10 may be omitted herein for brevity.
The supporting structure 224 may partially make face contact with the side surface CS2 of the carrier wafer CW2. The supporting surface of the supporting structure 224 may be configured to be substantially parallel to the side surface CS2 of the carrier wafer CW2.
The supporting structure 224 may be configured to make face contact with a partial of the side surface CS2 of the carrier wafer CW2. In contrast, the supporting structure 224 may be configured to not make contact with the side surface DS2 of the device wafer DW2. Thus, the supporting structure 224 may be configured to not make contact with the upper corner UC2 of the device wafer DW2 and the lower corner DC2 of the carrier wafer CW2.
The upper corner UC2 of the device wafer DW2 may be exposed through the first receiving groove 227. The lower corner DC2 of the carrier wafer CW2 may be exposed through the second receiving groove 228. Therefore, the contacts between the upper corner UC2 of the device wafer DW2 and the supporting structure 224 and between the lower corner DC2 of the carrier wafer CW2 and the supporting structure 224 may be prevented.
FIG. 11 is a plan view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments, FIG. 12 is a cross-sectional view taken along a line XII-XII′ in FIG. 11, and FIG. 13 is a cross-sectional view taken along a line XIII-XIII′ in FIG. 2.
Referring to FIG. 11, first retainers 320 may be arranged on the inner surface of the door 140 and the first inner surface 114 of the case. The second retainers 330 may be arranged on the second inner surface 116 and the third inner surface 118 of the case. Thus, four side surfaces of the wafer W may be supported by the first retainers 320 and the second retainers 330.
Referring to FIG. 12, the first retainer 320 may have a structure substantially the same as the structure of the first retainer 120 in FIG. 3. The first retainer 320 may include a first body 322 and a supporting structure 324. The first body 322 may include a plurality of first slots 326 configured to receive side surfaces S of the wafers W. The supporting structure 324 may have a semi-circular shape protruded from an inner surface of the first body 322 in the horizontal direction to make point contact with the side surface of the wafer W, or another structure as described above.
Referring to FIG. 13, the second retainer 330 may include a second body 332 and a supporting structure 334. The second body 332 may include multiple second slots 336, each configured to receive the side surfaces S a corresponding one of the wafers S.
The supporting structure 334 may be configured to partially make face contact with the side surface S of the wafer W. The supporting surface of the supporting structure 334 may have a thickness less than a thickness of the wafer W. The supporting surface of the supporting structure 334 may be configured to be substantially parallel to the side surface S of the wafer W. The supporting structure 334 may be configured to make face contact with a partial of the side surface S of the wafer W. In contrast, the supporting structure 334 may be configured to not make contact with the upper corner UC and the lower corner DC of the wafer W.
Additionally, the second body 332 may further include a first receiving groove 337 and a second receiving groove 338. The first receiving groove 337 may be configured to extend from the second slot 336 to expose the upper corner UC of the wafer W. The second receiving groove 338 may be configured to extend from the second slot 336 to expose the lower corner DC of the wafer W. Because the upper corner UC of the wafer W may be exposed through the first receiving groove 337 and the lower corner DC of the wafer W may be exposed through the second receiving groove 338, contacts between the upper corner UC and the supporting structure 334, and between the lower corner DC of the supporting structure 334 may be prevented.
Alternatively, the first retainer 320 may include the supporting structure 334. The second retainer 330 may include the supporting structure 324. Further, the first retainer 320 and the second retainer 330 may be configured to support the wafer in FIG. 6 or the wafer in FIG. 7.
FIG. 14 is a plan view illustrating a retainer of a wafer carrier for supporting a wafer in accordance with some embodiments, FIG. 15 is a cross-sectional view taken along a line XV-XV′ in FIG. 14, and FIG. 16 is a cross-sectional view taken along a line XVI-XVI′ in FIG. 14.
Referring to FIG. 14, first retainers 420 may be arranged on the inner surface of the door 140 and the first inner surface 114 of the case. The second retainers 430 may be arranged on the second inner surface 116 and the third inner surface 118 of the case. Thus, four side surfaces of the wafer W may be supported by the first retainers 420 and the second retainers 430.
Referring to FIG. 15, the first retainer 420 may have a structure substantially the same as the structure of the first retainer 120 in FIG. 3. The first retainer 420 may include a first body 422 and a supporting surface 424. The first body 422 may include multiple first slots 426, each configured to receive side surfaces S a corresponding one of the wafers W. The supporting surface 424 may have a semi-circular shape protruded from an inner surface of the first body 422 in the horizontal direction to make point contact with the side surface of the wafer W.
Referring to FIG. 16, the second retainer 430 may include a second body 432 including multiple second slots 436, each configured to receive the side surfaces S a corresponding one of the wafers S. However, the embossing, the supporting surface, or other supporting structure may not be formed on the sidewalls of the second slots 436.
Alternatively, the first retainer 420 and the second retainer 430 may be configured to support the wafer in FIG. 6 or the wafer in FIG. 7.
According to example embodiments, the supporting structure may be spaced apart from the upper corner and the lower corner of the side surface of the wafer so that the supporting structure may not make contact with the corners of the side surface of the wafer. Thus, the side surface of the wafer may not be damaged. Particularly, because the corners of the side surface of the thin device wafer including the plugs may not make contact with the supporting structure, the side corners of the side surface of the thin device wafer may not be damaged. As a result, it may not be required to perform a trimming process for partially removing the side surface of the device wafer in order to prevent damages of the side surface of the thin device wafer.
Some embodiments include a retainer capable of preventing damages of a side corner of a wafer.
Some embodiments include a wafer carrier including the above-mentioned retainer.
Some embodiments include a retainer for a wafer carrier. The retainer may include a body and a supporting structure. The body may be arranged on an inner surface of a wafer carrier configured to receive a plurality of wafers. The body may have a plurality of slots configured to receive a side surface of each of the wafers. The supporting structure may be formed on a sidewall of each of the slots. The supporting structure may make contact with the side surface of each of the wafers. The supporting structure may be spaced apart from an upper corner of the side surface of each of the wafers.
In some embodiments, the supporting structure may be spaced apart from a lower corner of the side surface of each of the wafers.
In some embodiments, the supporting structure may have a rounded surface configured to make point contact with the side surface of each of the wafers.
In some embodiments, the supporting structure may include at least one embossing having the rounded surface.
In some embodiments, the embossing may have a hollow structure.
In some embodiments, the supporting structure may have a supporting surface configured to partially make face contact with the side surface of each of the wafers.
In some embodiments, the supporting surface may be parallel to the side surface of each of the wafers.
In some embodiments, the supporting surface may have a thickness less than a thickness of the wafer.
In some embodiments, the body may have a first receiving groove connected to the slot to expose the upper corner of the wafer and an upper end of the supporting surface.
In some embodiments, the body may have a second receiving groove connected to the slot to expose the lower corner of the wafer and a lower end of the supporting surface.
In some embodiments, the supporting structure may include a resilient material.
In some embodiments, the supporting structure may be integrally formed with the body.
In some embodiments, the wafer may include a carrier wafer and a device wafer. The device wafer may be attached to the carrier wafer. The device wafer may include plugs formed in the device wafer.
In some embodiments, the device wafer may have a side surface substantially coplanar with a side surface of the carrier wafer.
In some embodiments, the device wafer may have a side surface inside the side surface of the carrier wafer toward a central portion of the carrier wafer.
Some embodiments include a retainer for a wafer carrier. The retainer may include a body and an embossing. The body may be arranged on an inner surface of a wafer carrier configured to receive carrier wafers and device wafers. Each of the device wafers may be attached to each of the carrier wafers. Each of the device wafers may include plugs formed in each of the device wafers. The body may include a plurality of slots configured to receive side surfaces of the carrier wafers and the device wafers. The embossing may be formed on a sidewall of each of the slots. The embossing may make point contact with the side surface of each of the carrier wafers. The embossing may be spaced apart from an upper corner of each of the device wafers.
In some embodiments, the device wafer may have a side surface substantially coplanar with a side surface of the carrier wafer.
In some embodiments, the embossing may be spaced apart from a lower corner of the carrier wafer.
In some embodiments, the embossing may include a resilient material.
In some embodiments, the embossing may have a hollow structure.
Some embodiments include a wafer carrier. The wafer carrier may include a case, a door and retainers. The case may include an entrance through which wafers may be moved, a first inner surface facing the entrance, second and third inner surfaces extended from the first inner surface to the entrance. The door may be arranged at the entrance. Each of the retainers may include a body and a supporting structure. The body may be arranged on the first to third inner surfaces of the case. The body may have a plurality of slots configured to receive side surfaces of the wafers. The supporting structure may be formed on a sidewall of each of the slots. The supporting structure may make contact with the side surface of each of the wafers. The supporting structure may be spaced apart from an upper corner of the side surface of each of the wafers.
In some embodiments, the supporting structure may be spaced apart from a lower corner of the side surface of each of the wafers.
In some embodiments, the supporting structure may include at least one embossing configured to make point contact with the side surface of the wafer.
In some embodiments, the supporting structure may have a supporting surface configured to partially make face contact with the side surface of the wafer.
In some embodiments, the body may have a first receiving groove connected to the slot to expose the upper corner of the wafer and an upper end of the supporting surface, and a second receiving groove connected to the slot to expose the lower corner of the wafer and a lower end of the supporting surface.
In some embodiments, the retainers on the second and third inner surfaces may have a rounded shape protruded toward the second third inner surface of the case.
In some embodiments, the wafer may include a carrier wafer and a device wafer. The device wafer may be attached to the carrier wafer. The device wafer may include plugs formed in the device wafer. The device wafer may have a side surface substantially coplanar with a side surface of the carrier wafer.
Some embodiments include a wafer carrier. The wafer carrier may include a case, a door and a first retainer and a second retainer. The case may include an entrance through which wafers may be moved, a first inner surface facing the entrance, second and third inner surfaces extended from the first inner surface to the entrance. The door may be arranged at the entrance. The first retainer may include a body and a supporting structure. The body may be arranged on the first inner surface of the case and an inner surface of the door. The body may have a plurality of first slots configured to receive side surfaces of the wafers. The supporting structure may be formed on a sidewall of each of the first slots. The supporting structure may make contact with the side surface of each of the wafers. The supporting structure may be spaced apart from an upper corner of the side surface of each of the wafers. The second retainer may be arranged on the second and third inner surfaces of the case. The second retainer may have a plurality of second slots configured to receive the side surfaces of the wafers.
In some embodiments, the second retainer may have a supporting surface formed on side walls of the second slots to partially make face contact with the side surface of the wafer.
In some embodiments, the second retainer may have a first receiving groove connected to the slot to expose the upper corner of the wafer and an upper end of the supporting surface, and a second receiving groove connected to the slot to expose the lower corner of the wafer and a lower end of the supporting surface.
In some embodiments, the second retainer may have a rounded shape protruded toward the second third inner surface of the case.
In some embodiments, the wafer may include a carrier wafer and a device wafer. The device wafer may be attached to the carrier wafer. The device wafer may include plugs formed in the device wafer. The device wafer may have a side surface substantially coplanar with a side surface of the carrier wafer.
In some embodiments, the supporting structure may be spaced apart from the upper corner and the lower corner of the side surface of the wafer so that the supporting structure may not make contact with the corners of the side surface of the wafer. Thus, the side surface of the wafer may not be damaged. Particularly, because the corners of the side surface of the thin device wafer including the plugs may not make contact with the supporting structure, the side corners of the side surface of the thin device wafer may not be damaged. As a result, it may not be required to perform a trimming process for partially removing the side surface of the device wafer in order to prevent damages of the side surface of the thin device wafer
The foregoing is illustrative of example embodiments and is not to be construed as limiting thereof. Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in the example embodiments without materially departing from the novel teachings and advantages of the present invention. Accordingly, all such modifications are intended to be included within the scope of the present invention as defined in the claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Therefore, it is to be understood that the foregoing is illustrative of various example embodiments and is not to be construed as limited to the specific example embodiments disclosed, and that modifications to the disclosed example embodiments, as well as other example embodiments, are intended to be included within the scope of the appended claims.

Claims

What is claimed is:

1. A retainer for a wafer carrier comprising:

a body including a plurality of slots configured to receive side surfaces of wafers; and

for each of the slots, a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding wafer, the supporting structure being spaced apart from an upper corner of the side surface of the corresponding wafer.

2. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure is spaced apart from a lower corner of the side surface of the corresponding wafer.

3. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure has a rounded surface configured to make point contact with the side surface of the corresponding wafer.

4. The retainer for a wafer carrier of claim 3, wherein for the at least one of the slots, the supporting structure comprises an embossing having the rounded surface.

5. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure has a hollow structure.

6. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure comprises a supporting surface configured to partially make face contact with the side surface of the corresponding wafer.

7. The retainer for a wafer carrier of claim 6, wherein for the at least one of the slots, the supporting surface is substantially parallel to the side surface of the corresponding wafer.

8. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the body further comprises a first receiving groove connected to the slot and configured to expose the upper corner of the corresponding wafer and an upper end of the supporting structure.

9. The retainer for a wafer carrier of claim 8, wherein for the at least one of the slots, the body further comprises a second receiving groove connected to the slot and configured to expose a lower corner of the corresponding wafer and a lower end of the supporting structure.

10. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure comprises a resilient material.

11. The retainer for a wafer carrier of claim 1, wherein for at least one of the slots, the supporting structure is integrally formed with the body.

12. The retainer for a wafer carrier of claim 1, wherein each of the wafers comprises:

a carrier wafer; and

a device wafer attached to the carrier wafer, the device wafer having a side surface substantially coplanar with a side surface of the carrier wafer.

13. The retainer for a wafer carrier of claim 1, wherein each of the wafers comprises:

a carrier wafer; and

a device wafer attached to the carrier wafer, the device wafer having a side surface closer to a central portion of the carrier wafer than a side surface of the carrier wafer.

14. A wafer carrier comprising:

a case having an entrance configured to receive wafers, a first inner surface facing the entrance, and second and third inner surfaces extended from the first inner surface to the entrance;

a door installed at the entrance; and

retainers arranged on an inner surface of the door and on each of the first to third inner surfaces of the case, each retainer including a body including a plurality of slots configured to receive side surfaces of wafers, each slot including a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding one of the wafers, the supporting structure configured to be spaced apart from an upper corner of the side surface of the corresponding wafer.

15. The wafer carrier of claim 14, wherein structures of the slots of the retainer on the inner surface of the door are different from structures of the slots of the retainers on the second and third inner surfaces.

16. The wafer carrier of claim 14, wherein the retainers on the second and third inner surfaces of the case have a rounded shape protruding towards the corresponding second or third surface.

17. A retainer for a wafer carrier comprising:

a body including a plurality of slots; and

for each of the slots, the slot comprises:

an upper surface;

a lower surface; and

a supporting structure formed on a sidewall of the slot and protruding into the slot wherein a furthest extent of the protrusion of the supporting structure into the slot is offset from the upper surface.

18. The retainer for a wafer carrier of claim 17, wherein for at least one of the slots, the furthest extent of the protrusion of the supporting structure into the slot is offset from the lower surface.

19. The retainer for a wafer carrier of claim 17, wherein for at least one of the slots, the furthest extent of the protrusion of the supporting structure is a surface.

20. The retainer for a wafer carrier of claim 17, wherein for at least one of the slots, the slot further comprises a groove disposed at a corner of the upper surface and the sidewall.