US20150233011A1 - Treatment for Electroplating Racks to Avoid Rack Metallization - Google Patents
Treatment for Electroplating Racks to Avoid Rack Metallization Download PDFInfo
- Publication number
- US20150233011A1 US20150233011A1 US14/184,011 US201414184011A US2015233011A1 US 20150233011 A1 US20150233011 A1 US 20150233011A1 US 201414184011 A US201414184011 A US 201414184011A US 2015233011 A1 US2015233011 A1 US 2015233011A1
- Authority
- US
- United States
- Prior art keywords
- ether acetate
- electroplating rack
- aqueous solution
- metallization
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 63
- 238000001465 metallisation Methods 0.000 title claims abstract description 54
- 229920001944 Plastisol Polymers 0.000 claims abstract description 79
- 239000004999 plastisol Substances 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000003112 inhibitor Substances 0.000 claims abstract description 43
- 239000007864 aqueous solution Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 21
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims abstract description 12
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012811 non-conductive material Substances 0.000 claims abstract description 8
- 239000000243 solution Substances 0.000 claims description 30
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 22
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 20
- -1 transition metal salt Chemical class 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 claims description 12
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- WITDFSFZHZYQHB-UHFFFAOYSA-N dibenzylcarbamothioylsulfanyl n,n-dibenzylcarbamodithioate Chemical compound C=1C=CC=CC=1CN(CC=1C=CC=CC=1)C(=S)SSC(=S)N(CC=1C=CC=CC=1)CC1=CC=CC=C1 WITDFSFZHZYQHB-UHFFFAOYSA-N 0.000 claims description 10
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000003125 aqueous solvent Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 claims description 8
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 claims description 6
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 6
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 5
- 239000012736 aqueous medium Substances 0.000 claims description 4
- 239000012990 dithiocarbamate Substances 0.000 claims description 4
- 150000004659 dithiocarbamates Chemical class 0.000 claims description 4
- 229960002447 thiram Drugs 0.000 claims description 4
- RKQOSDAEEGPRER-UHFFFAOYSA-L zinc diethyldithiocarbamate Chemical compound [Zn+2].CCN(CC)C([S-])=S.CCN(CC)C([S-])=S RKQOSDAEEGPRER-UHFFFAOYSA-L 0.000 claims description 4
- AUMBZPPBWALQRO-UHFFFAOYSA-L zinc;n,n-dibenzylcarbamodithioate Chemical compound [Zn+2].C=1C=CC=CC=1CN(C(=S)[S-])CC1=CC=CC=C1.C=1C=CC=CC=1CN(C(=S)[S-])CC1=CC=CC=C1 AUMBZPPBWALQRO-UHFFFAOYSA-L 0.000 claims description 4
- KMNUDJAXRXUZQS-UHFFFAOYSA-L zinc;n-ethyl-n-phenylcarbamodithioate Chemical compound [Zn+2].CCN(C([S-])=S)C1=CC=CC=C1.CCN(C([S-])=S)C1=CC=CC=C1 KMNUDJAXRXUZQS-UHFFFAOYSA-L 0.000 claims description 4
- YBKBEKGVHFHCRI-UHFFFAOYSA-L zinc;piperidine-1-carbodithioate Chemical compound [Zn+2].[S-]C(=S)N1CCCCC1.[S-]C(=S)N1CCCCC1 YBKBEKGVHFHCRI-UHFFFAOYSA-L 0.000 claims description 4
- DUBNHZYBDBBJHD-UHFFFAOYSA-L ziram Chemical group [Zn+2].CN(C)C([S-])=S.CN(C)C([S-])=S DUBNHZYBDBBJHD-UHFFFAOYSA-L 0.000 claims description 4
- ZZXUZKXVROWEIF-UHFFFAOYSA-N 1,2-butylene carbonate Chemical compound CCC1COC(=O)O1 ZZXUZKXVROWEIF-UHFFFAOYSA-N 0.000 claims description 3
- WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 claims description 3
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 3
- OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical compound SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 claims description 3
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 claims description 3
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 claims description 3
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims description 3
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 claims description 3
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 3
- CKCGJBFTCUCBAJ-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propyl acetate Chemical compound CCOC(C)COC(C)COC(C)=O CKCGJBFTCUCBAJ-UHFFFAOYSA-N 0.000 claims description 3
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 claims description 3
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 claims description 3
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 claims description 3
- OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical compound SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 claims description 3
- IDYUFXLSXUPQOY-UHFFFAOYSA-N 4,6-bis(sulfanylidene)-1,3,5-triazinan-2-one Chemical compound O=C1NC(=S)NC(=S)N1 IDYUFXLSXUPQOY-UHFFFAOYSA-N 0.000 claims description 3
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 claims description 3
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 229940116901 diethyldithiocarbamate Drugs 0.000 claims description 3
- LMBWSYZSUOEYSN-UHFFFAOYSA-N diethyldithiocarbamic acid Chemical compound CCN(CC)C(S)=S LMBWSYZSUOEYSN-UHFFFAOYSA-N 0.000 claims description 3
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 3
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims description 3
- BLCKKNLGFULNRC-UHFFFAOYSA-L n,n-dimethylcarbamodithioate;nickel(2+) Chemical compound [Ni+2].CN(C)C([S-])=S.CN(C)C([S-])=S BLCKKNLGFULNRC-UHFFFAOYSA-L 0.000 claims description 3
- 150000002894 organic compounds Chemical group 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052723 transition metal Inorganic materials 0.000 claims description 3
- DRKOTOCDZAUOFY-UHFFFAOYSA-L zinc;n,n-bis(7-methyloctyl)carbamodithioate Chemical compound [Zn+2].CC(C)CCCCCCN(C([S-])=S)CCCCCCC(C)C.CC(C)CCCCCCN(C([S-])=S)CCCCCCC(C)C DRKOTOCDZAUOFY-UHFFFAOYSA-L 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 88
- 229910052759 nickel Inorganic materials 0.000 description 44
- 239000004033 plastic Substances 0.000 description 17
- 229920003023 plastic Polymers 0.000 description 17
- 238000000576 coating method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 230000001351 cycling effect Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 6
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920002857 polybutadiene Polymers 0.000 description 5
- 229920006942 ABS/PC Polymers 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000012190 activator Substances 0.000 description 3
- 229960005070 ascorbic acid Drugs 0.000 description 3
- 235000010323 ascorbic acid Nutrition 0.000 description 3
- 239000011668 ascorbic acid Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- MMIPFLVOWGHZQD-UHFFFAOYSA-N manganese(3+) Chemical compound [Mn+3] MMIPFLVOWGHZQD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011877 solvent mixture Substances 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000012668 chain scission Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- YFSUTJLHUFNCNZ-UHFFFAOYSA-N perfluorooctane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-N 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- 239000003799 water insoluble solvent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
Definitions
- the present invention relates generally to a method of treating electroplating racks used for supporting non-conductive substrates during a metallization step.
- ABS acrylonitrile/butadiene/styrene copolymers
- ABS/PC polycarbonate
- ABS comprises a relatively hard matrix of acrylonitrile/styrene copolymer and the butadiene polymerizes to form a separate phase. It is this softer phase of polybutadiene (which contains double bonds in the polymer backbone) which may be readily etched using various techniques.
- the etching has been carried out using a mixture of chromic and sulfuric acids operated at elevated temperature.
- the chromic acid is capable of dissolving the polybutadiene phase of the ABS by oxidation of the double bonds in the backbone of the polybutadiene polymer, which has proven to be reliable and effective over a wide range of ABS and ABS/PC plastics.
- the use of chromic acid has become increasingly regulated because of its toxicity and carcinogenic nature. For this reason, there has been considerable research into other means of etching ABS plastics and a number of approaches have been suggested to achieve this.
- acidic permanganate is capable of oxidizing the double bonds in the polybutadiene. Chain scission can then be achieved by further oxidation with periodate ions.
- Ozone is also capable of oxidizing polybutadiene. However, ozone is extremely dangerous to use and highly toxic.
- sulfur trioxide can be used to etch ABS, but this has not been successfully achieved on a typical plating line.
- Other examples of techniques for etching ABS plastics are described in U.S. Pat. Pub. No. 2005/0199587 to Bengston, U.S. Pat. Pub. No. 2009/0092757 to Sakou et al., and U.S. Pat. No. 5,160,600 to Gordhanbai et al., the subject matter of each of which is herein incorporated by reference in its entirety.
- ABS and ABS/PC plastic can be etched in a solution containing manganese(III) ions in strong sulfuric acid as described in U.S. Pat. Pub. No. 2013/0186774 to Pearson et al., the subject matter of which is herein incorporated by reference in its entirety.
- the racks are typically at least partially coated with a non-conductive material to prevent the rack from being entirely covered with metal during the electroplating process, and the most common rack coating is a PVC plastisol.
- the use of chromic acid in the etching stage prior to activation is effective in modifying the surface of the plastisol coating so that it is resistant to metallization after being coated with a palladium activator (usually a colloid of palladium and tin).
- the present invention relates generally to an electroplating rack for supporting non-conductive substrates during an electrodeposition process
- the electroplating rack is at least partially coated with a non-conductive material
- electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor.
- the present invention relates generally to a method of treating an electroplating rack used for supporting non-conductive substrates during an electrodeposition process, wherein the electroplating rack is at least partially coated with a non-conductive material, the method comprising:
- the present invention allows for the treatment of electroplating racks used for the purpose of supporting non-conductive substrates during a metallization step.
- the method described herein allows for the effective activation of plastics that have been etched without the use of chromic acid while avoiding the common problem of rack “plate up” which occurs when chromic acid free etchants are used for the initial roughening of the plastic.
- the present invention relates generally to the catalysis and subsequent metallization of plastics such as ABS and ABS/PC plastics that have been etched in process solutions that do not contain chromic acid and without problems of “plate up” on at least partially coated racks.
- the method generally comprises the steps of:
- the present invention relates generally to an electroplating rack for supporting non-conductive substrates during an electrodeposition process
- the electroplating rack is at least partially coated with a non-conductive material; and wherein the electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor.
- the electroplating rack is typically coated with a PVC plastisol, or another non-conductive material.
- the non-aqueous solution generally comprises about 5 g/L to about 40 g/L of the metallization inhibitor, more preferably about 15 g/L to about 25 g/L of the metallization inhibitor, and most preferably about 10 g/L to about 20 g/L of the metallization inhibitor.
- the non-aqueous solution is preferably maintained at a temperature of between about 25° C. and about 75° C., more preferably a temperature of between about 35° C. and about 65° C., during the time that the electroplating rack is immersed in the non-aqueous solution.
- the electroplating rack is immersed in the non-aqueous solution for a period of time sufficient to treat the PVC plastisol coated rack to avoid rack plate on. That is the electroplating rack is preferably immersed in the non-aqueous solution for between about 1 minute and about 60 minutes, more preferably for between about 2 minute and about 30 minutes.
- the inventors of the present invention have found that metallization inhibitors that are substantially soluble in aqueous media are unsuitable for the process described herein because they tend to slowly leach into subsequent process solutions and prevent metallization of the parts.
- the metallization inhibitor is at least essentially insoluble in aqueous media.
- the solution containing the metallization inhibitor is a non-aqueous solution.
- Suitable water insoluble metallization inhibitors are generally organic compounds comprising sulfur in a ⁇ 2 valency and include, but are not limited to, transition metal salts of di-substituted dithiocarbamates and tetra-substituted thiuram sulfides.
- Suitable dithiocarbamates include, for example, zinc dimethyl-dithiocarbamate (ZDMC), zinc diethyldithiocarbamate (ZDEC), zinc dibutyldithiocarbamate (ZDBC), zinc ethylphenyldithiocarbamate (ZEPC), zinc dibenzyldithiocarbamate (ZBEC), zinc pentamethylenedithiocarbamate (Z5MC), tellurium diethyldithiocarbamate, nickel dibutyl dithiocarbamate, nickel dimethyldithiocarbamate, and zinc diisononyldithiocarbamate.
- ZDMC zinc dimethyl-dithiocarbamate
- ZDEC zinc diethyldithiocarbamate
- ZDBC zinc dibutyldithiocarbamate
- ZBEC zinc ethylphenyldithiocarbamate
- ZBEC zinc pentamethylenedi
- Preferred tetra-substituted thiuram sulfides include, for example, tetrabenzylthiuram disulfide, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, mercaptoimidazoles, mercaptobenzoxazoles, mercaptothiazole, mercaptotriazole, dithiocyanuric acid, and trithiocyanuric acid.
- the metallization inhibitor comprises nickel dibutyl dithiocarbamate or tetrabenzylthiuram disulfide.
- Suitable non-aqueous solvents include, but are not limited to butylene carbonate, propylene carbonate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethylmethyl carbonate, propyl lactate, gamma-butyrolactone, ethyl 3-ethoxypropionate and diethyleneglycol monomethyl ether acetate, ethyleneglycol monomethyl ether acetate, ethyleneglycol monoethyl ether acetate, diethyleneglycol monoethyl ether acetate, diethyleneglycol mono-n-butyl ether acetate, propyleneglycol monomethyl ether acetate, propyleneglycol monoethyl ether acetate, propyleneglycol monopropyl ether acetate, propyleneglycol monobutyl ether acetate, dipropyleneglycol monomethyl ether acetate, dipropyleneglycol monoethyl ether a
- the solvent mixture must be capable of dissolving an effective amount of the metallization inhibitor, be readily rinsed off treated racks, and be preferably non-volatile and safe to handle with regards to its toxicology and flammability. In addition, the solvent mixture should cause no damage to the rack coating. It has been found that solvents that are very readily water-soluble can have difficulty in dissolving water-insoluble metallization inhibitors and thus do not give an effective inhibition of metallization. However, substantially water insoluble solvents that readily dissolve the inhibitors and provide a better degree of inhibition can cause a greater degree of attack on the rack coating and are also more problematic to rinse off the rack after treatment.
- the degree of attack on the rack coating is related to the degree of diffusion of the metallization inhibitor into the surface of the rack coating, and the choice of solvents is therefore critical to the success of the process.
- the metallization inhibitor described herein can be readily applied to racks during the normal treatment cycle to remove unwanted metallic deposits from the tips of the contact points.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The PVC plastisol coated test piece showed no coverage of the electroless nickel. Repeated cycling of ABS and PVC test pieces through steps 1-10 continually showed full electroless nickel coverage of ABS and no electroless nickel coverage of the PVC.
- test pieces were examined.
- the ABS test panel was fully covered in electroless nickel with no apparent voids.
- Subsequent electroplating of this test panel gave full coverage and good adhesion.
- the PVC plastisol coated test piece showed full coverage of the electroless nickel over the entire surface of the plastisol test piece. This would be totally unacceptable in commercial practice.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The PVC plastisol coated test piece showed significant coverage of the electroless nickel which was observed to cover between 10% and 50% of the surface area. There was no apparent difference observed between the PVC plastisol coated test piece that had been treated in a solvent versus a PVC plastisol coated test piece that had not been treated in a solvent.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. In addition, the PVC plastisol coated test piece showed no coverage of the electroless nickel.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The treated PVC plastisol coated test piece showed no coverage of the electroless nickel.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The treated PVC plastisol coated test piece showed no coverage of the electroless nickel.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The treated PVC plastisol coated test piece showed no coverage of the electroless nickel.
- the old PVC plastisol coated test piece was treated as follows:
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The treated PVC plastisol coated test piece showed no coverage of the electroless nickel despite being a very well used and aged coating with a cracked and roughened surface.
- test pieces were examined. It was found that the ABS test panel was fully covered in electroless nickel with no apparent voids. Subsequent electroplating of this test panel gave full coverage and good adhesion. The treated PVC plastisol coated test piece showed no coverage of the electroless nickel.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/184,011 US20150233011A1 (en) | 2014-02-19 | 2014-02-19 | Treatment for Electroplating Racks to Avoid Rack Metallization |
| TW104101271A TWI623653B (zh) | 2014-02-19 | 2015-01-15 | 電鍍掛架及避免掛架金屬化之電鍍掛架處理 |
| CN201580008986.XA CN106103811A (zh) | 2014-02-19 | 2015-01-16 | 避免挂架金属化的电镀挂架处理 |
| PCT/US2015/011704 WO2015126544A1 (en) | 2014-02-19 | 2015-01-16 | Treatment for electroplating racks to avoid rack metallization |
| MX2016010851A MX2016010851A (es) | 2014-02-19 | 2015-01-16 | Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor. |
| JP2016552978A JP2017511843A (ja) | 2014-02-19 | 2015-01-16 | ラックのメタライゼーションを防止するための電気めっき用ラックの処理 |
| EP15752252.5A EP3108039A4 (en) | 2014-02-19 | 2015-01-16 | Treatment for electroplating racks to avoid rack metallization |
| CA2939316A CA2939316A1 (en) | 2014-02-19 | 2015-01-16 | Treatment for electroplating racks to avoid rack metallization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/184,011 US20150233011A1 (en) | 2014-02-19 | 2014-02-19 | Treatment for Electroplating Racks to Avoid Rack Metallization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20150233011A1 true US20150233011A1 (en) | 2015-08-20 |
Family
ID=53797590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/184,011 Abandoned US20150233011A1 (en) | 2014-02-19 | 2014-02-19 | Treatment for Electroplating Racks to Avoid Rack Metallization |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150233011A1 (es) |
| EP (1) | EP3108039A4 (es) |
| JP (1) | JP2017511843A (es) |
| CN (1) | CN106103811A (es) |
| CA (1) | CA2939316A1 (es) |
| MX (1) | MX2016010851A (es) |
| TW (1) | TWI623653B (es) |
| WO (1) | WO2015126544A1 (es) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160102403A1 (en) * | 2014-10-13 | 2016-04-14 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
| CN107075684A (zh) * | 2014-11-04 | 2017-08-18 | 埃托特克德国有限公司 | 用于金属化塑料部件的方法 |
| WO2019115938A1 (fr) | 2017-12-13 | 2019-06-20 | Maxence Renaud | Outillage de galvanoplastie |
| WO2021064417A1 (en) | 2019-10-04 | 2021-04-08 | Macdermid, Inc. | Prevention of unwanted plating on rack coatings for electrodeposition |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9809899B2 (en) * | 2014-08-07 | 2017-11-07 | Macdermid Acumen, Inc. | Treatment for electroplating racks to avoid rack metallization |
| JP6648885B2 (ja) * | 2015-09-08 | 2020-02-14 | 奥野製薬工業株式会社 | めっき用治具の皮膜形成用組成物、めっき用治具及びめっき処理方法 |
| EP3228729A1 (en) | 2016-04-04 | 2017-10-11 | COVENTYA S.p.A. | Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
| US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
| US5817388A (en) * | 1996-11-08 | 1998-10-06 | Carl M. Rodia & Associates | Multi-component dye compositions for optical recording media |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3619243A (en) * | 1970-02-17 | 1971-11-09 | Enthone | No rerack metal plating of electrically nonconductive articles |
| US3939056A (en) * | 1973-10-19 | 1976-02-17 | Sony Corporation | Coated plating rack |
| AU8113175A (en) * | 1974-07-11 | 1976-11-18 | Kollmorgen Corp | Process for the formation of real images and products produced thereby |
| JPS5933676B2 (ja) * | 1981-12-14 | 1984-08-17 | 旭化成株式会社 | メツキ用治具の被覆用樹脂組成物 |
| US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
| CN101253286B (zh) * | 2005-09-02 | 2011-03-30 | 荏原优莱特科技股份有限公司 | 催化剂施加用增强剂 |
| JP2007092111A (ja) * | 2005-09-28 | 2007-04-12 | Okuno Chem Ind Co Ltd | めっき析出阻害用組成物 |
| US20140178770A1 (en) * | 2012-02-07 | 2014-06-26 | Battelle Memorial Institute | Electrolytes for dendrite-free energy storage devices having high coulombic effciency |
| US8980460B2 (en) * | 2012-02-07 | 2015-03-17 | Battelle Memorial Institute | Methods and electrolytes for electrodeposition of smooth films |
-
2014
- 2014-02-19 US US14/184,011 patent/US20150233011A1/en not_active Abandoned
-
2015
- 2015-01-15 TW TW104101271A patent/TWI623653B/zh not_active IP Right Cessation
- 2015-01-16 JP JP2016552978A patent/JP2017511843A/ja active Pending
- 2015-01-16 CN CN201580008986.XA patent/CN106103811A/zh active Pending
- 2015-01-16 EP EP15752252.5A patent/EP3108039A4/en not_active Withdrawn
- 2015-01-16 MX MX2016010851A patent/MX2016010851A/es unknown
- 2015-01-16 CA CA2939316A patent/CA2939316A1/en not_active Abandoned
- 2015-01-16 WO PCT/US2015/011704 patent/WO2015126544A1/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
| US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
| US5817388A (en) * | 1996-11-08 | 1998-10-06 | Carl M. Rodia & Associates | Multi-component dye compositions for optical recording media |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160102403A1 (en) * | 2014-10-13 | 2016-04-14 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
| US9506150B2 (en) * | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
| CN107075684A (zh) * | 2014-11-04 | 2017-08-18 | 埃托特克德国有限公司 | 用于金属化塑料部件的方法 |
| JP2017534769A (ja) * | 2014-11-04 | 2017-11-24 | アトテック・ドイチュラント・ゲーエムベーハーＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ Ｇｍｂｈ | プラスチック部品をメタライズするプロセス |
| CN107075684B (zh) * | 2014-11-04 | 2019-08-30 | 埃托特克德国有限公司 | 用于金属化塑料部件的方法 |
| WO2019115938A1 (fr) | 2017-12-13 | 2019-06-20 | Maxence Renaud | Outillage de galvanoplastie |
| WO2021064417A1 (en) | 2019-10-04 | 2021-04-08 | Macdermid, Inc. | Prevention of unwanted plating on rack coatings for electrodeposition |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201534768A (zh) | 2015-09-16 |
| CN106103811A (zh) | 2016-11-09 |
| WO2015126544A1 (en) | 2015-08-27 |
| EP3108039A1 (en) | 2016-12-28 |
| CA2939316A1 (en) | 2015-08-27 |
| MX2016010851A (es) | 2016-11-17 |
| JP2017511843A (ja) | 2017-04-27 |
| EP3108039A4 (en) | 2017-10-18 |
| TWI623653B (zh) | 2018-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: MACDERMID ACUMEN, INC., CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HERDMAN, RODERICK D.;CHAPANERI, ROSHAN V.;HYSLOP, ALISON;SIGNING DATES FROM 20140211 TO 20140212;REEL/FRAME:032247/0130 |
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| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |