US20150225678A1 - Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil - Google Patents
Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil Download PDFInfo
- Publication number
- US20150225678A1 US20150225678A1 US14/695,395 US201514695395A US2015225678A1 US 20150225678 A1 US20150225678 A1 US 20150225678A1 US 201514695395 A US201514695395 A US 201514695395A US 2015225678 A1 US2015225678 A1 US 2015225678A1
- Authority
- US
- United States
- Prior art keywords
- copper foil
- electrolytic copper
- cleaning fluid
- cleaning
- fluid composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 239000011889 copper foil Substances 0.000 title claims abstract description 70
- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 239000012530 fluid Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 12
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 11
- 229910021645 metal ion Inorganic materials 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910001868 water Inorganic materials 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 6
- 239000001110 calcium chloride Substances 0.000 claims description 6
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 6
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 6
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001424 calcium ion Inorganic materials 0.000 claims description 2
- 229910001425 magnesium ion Inorganic materials 0.000 claims description 2
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 abstract description 16
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 230000000052 comparative effect Effects 0.000 description 29
- 238000012360 testing method Methods 0.000 description 16
- 238000005406 washing Methods 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910001416 lithium ion Inorganic materials 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- KZEVSDGEBAJOTK-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[5-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CC=1OC(=NN=1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O KZEVSDGEBAJOTK-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- DFGKGUXTPFWHIX-UHFFFAOYSA-N 6-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]acetyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)C1=CC2=C(NC(O2)=O)C=C1 DFGKGUXTPFWHIX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical group CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- RLBLFSQXAKQALA-UHFFFAOYSA-N [Na].[K].[Mg].[Ca] Chemical compound [Na].[K].[Mg].[Ca] RLBLFSQXAKQALA-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- -1 benzotriazole Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011255 nonaqueous electrolyte Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000008234 soft water Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
-
- C11D11/0029—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/16—Metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12729—Group IIA metal-base component
Definitions
- the present invention relates to a method to treat the surfaces of electrolytic copper foils, and more particularly, to a method for cleaning a copper foil to adjust the metal composition of the surfaces of the electrolytic copper foil after the anti-rust treatment.
- Electrolytic copper foil is an indispensable material for printed circuit board, and especially the double-sided glossy copper foil can be coated with electrode material for the use of cathode plate of lithium ion secondary battery. Following the increasing demands of consumer electronic products, the demands of lithium ion secondary batteries have increased gradually.
- the development trend of commercial small electronic products is moving toward smaller and lightweight designs.
- the batteries as driving power not only have to possess the advantages of having high operation voltage, high energy density and long cycle life, but they also have to follow the trend of minimization.
- the non-aqueous electrolyte secondary battery such as lithium ion secondary battery, possesses the features of high energy density, high capacity and long cycle life, thereby, it is used widely as driving power for portable electronic instruments.
- the causes of poor preservation of electrolytic copper foil are oxidation and acid corrosion. Therefore, after manufacturing the electrolytic copper foil, it was processed with anti-rust treatment using electroplating, such as chromium coating, or using organic compounds, such as benzotriazole, to form chelate compound with copper, thereby enhancing the resistance of electrolytic copper foil.
- electroplating such as chromium coating
- organic compounds such as benzotriazole
- the defects of poor preservation include the appearance of oxidation spots and discoloring.
- the electrolyte is consisting of copper dissolved in sulfuric acid.
- One possible rationale of causing the defects could be the continuous corrosion of copper foil due to the residual sulfuric acid on the surfaces of copper foil after the formation of foil.
- the electrolytic copper foil is washed with water after the anti-rusting treatment using deionized water in two-staged steps to wash the electrolytic copper foil which is coated with anti-rust layer to remove the residual sulfuric ion or other impurities on the surface of the electrolytic copper foil.
- the washing steps there are specific requirements for water pressure, water distribution, washing distance and washing angel.
- the deionized water with conductivity less than 10 ⁇ S/cm was used (Printed Circuit Communications, volume 10, 2004).
- the soft water with good softening processes was used as cleaning solutions.
- this method is effective for a short period of time to prevent the discoloring of the electrolytic copper foil, but it does not achieve significant effects for the long term preservation of the copper foil.
- the method which should be especially suitable for the washing steps after the anti-rust treatment, should include a cleaning method, a composition of the cleaning fluid to be used for the cleaning method and an electrolytic copper foil resistant to oxidation and rust-corrosion.
- the present invention provides a cleaning fluid composition for cleaning an electrolytic copper foil, comprising a liquid medium and a salt of a group HA metal, wherein the metal ion content produced in the liquid medium from the salt of group HA metal is greater than 10 mg/L.
- the content of the metal ion produced in the liquid medium is greater than 32 mg/L. In another embodiment, the content of the metal ion produced in the liquid medium is greater than 63 mg/L. In other words, the content of the metal ion produced in the liquid medium may be at least from 32 mg/L to 63 mg/L.
- the liquid medium can be de-ionized water or pure water.
- the IIA group metal ion is a magnesium or calcium ion.
- the salt of the IIA group metal is at least one of magnesium chloride and calcium chloride.
- the present invention also provides a method for cleaning an electrolytic copper foil by using the aforementioned cleaning fluid composition.
- the method of the present invention can be used to clean various electrolytic foils which are treated or untreated.
- the electrolytic copper foil has been processed with anti-rust treatment.
- a rinsing style is used to clean the electrolytic copper foil.
- the aforementioned cleaning fluid composition is used through a fan-shaped spray-column style to clean the electrolytic copper foil.
- the electrolytic copper foil is immersed in the aforementioned cleaning fluid composition for 0.1 to 20 seconds.
- the present invention also provides an electrolytic copper foil comprising the group-IIA metal which is adhered to a surface of the electrolytic copper foil, wherein the signal strength of the group-IIA metal is greater than 0.1% based on the signal strength of copper element (as 100%) analyzed by a secondary ion mass spectrometry.
- the signal strength of the group-IIA metal is in a range from between 0.1 and 0.8%.
- the cleaning fluid composition of the present invention contains a group-IIA metal salt which can effectively react with the residual acid groups on the copper foil, such as a sulfate group, a phosphate group, or an acetate group. Therefore, besides the existence of the copper element on the surfaces of the electrolytic copper foil which are washed using the cleaning method of the present invention, he group-IIA metal is also adhered to the surfaces of the electrolytic copper foil, so as to protect the copper foil from acid corrosion during the manufacturing processes and transportation and to further provide excellent protection from oxidation and rust corrosion.
- a group-IIA metal salt which can effectively react with the residual acid groups on the copper foil, such as a sulfate group, a phosphate group, or an acetate group. Therefore, besides the existence of the copper element on the surfaces of the electrolytic copper foil which are washed using the cleaning method of the present invention, he group-IIA metal is also adhered to the surfaces of the electrolytic copper foil, so as to protect the copper
- FIG. 1 is a schematic drawing to show the method for cleaning an electrolytic copper foil according to the present invention.
- FIG. 2 is a three-dimensional schematic drawing to show the method for cleaning an electrolytic copper foil by using spray-column according to the present invention.
- FIG. 1 is a schematic drawing to show a method for cleaning an electrolytic copper foil.
- the electrolytic copper foil 4 was moved to a chromic acid tank 2 to add a chrome coating as an anti-rust step.
- the electrolytic copper foil was moved to a washing tank 3 filled with the cleaning fluid of the present invention by immersing the chrome-coated electrolytic copper foil for 0.1 to 20 seconds.
- the electrolytic copper foil 4 was air-dried, and then the electrolytic copper foil 4 was obtained by using a winding device.
- the electrolytic copper foil 4 prior to introducing the electrolytic copper foil 4 to the cleaning tank 3 , the electrolytic copper foil was also washed using rinsing style with the cleaning fluid composition of the present invention through columns 20 and 20 ′ producing fan-shaped spray-column
- the cleaning fluid composition of the present invention there were no specific limitations for washing distance, water pressure, water distribution and washing angle.
- the electrolytic copper foil 4 was washed with fan-shaped spray-column
- FIG. 2 is a three-dimensional schematic drawing to show the method for cleaning the electrolytic copper foil by using spray-column.
- columns 20 and 20 ′ are implemented on the opposite sides of the electrolytic copper foil 4 .
- the electrolyte composition in electrolytic tank 1 included a copper sulfate electrolyte containing copper sulfate (CuSO 4.5 H 2 O) at the concentration of 270 g/L and sulfuric acid (H 2 SO 4 ) at the concentration of 100 g/L.
- CuSO 4.5 H 2 O copper sulfate
- sulfuric acid H 2 SO 4
- This electrolyte was used to prepare an electrolytic copper foil with the thickness of 8 ⁇ m at the liquid temperature of 42° C. and the electric current density of 50 A/dm 2 .
- the composition of electroplating solution in chromic acid tank 2 included chromic acid (H 2 CrO 4 ) at the concentration of 1 g/L. This electroplating solution was used to coat a layer of chrome on the electrolytic copper foil at the liquid temperature of 35° C. and the electric current density of 3 A/dm 2 so as to form an anti-rust layer.
- Deionized water was used as cleaning fluid.
- the electrolytic copper foils which were washed by the cleaning fluid compositions in aforementioned comparative examples 1-7 and embodiments 1-6, were cut into test samples in A4 size.
- the weather-resistance tests were performed on the test samples, and the existence of the gloss on the outer appearances was visually observed. The results are shown in Table 3.
- test samples were placed at the constant temperature of 70° C. and the constant relative humidity of 80% for 14 hours.
- the changes of the outer appearances were observed visually and rated as 5-levels.
- the results are shown in Table 3.
- the levels of anti-tarnish were defined as follows.
- the anti-tarnish property of the electrolytic copper foils washed by the cleaning fluid compositions in embodiments 1-6 is much better than those washed by the cleaning fluid compositions in comparative examples 1-7.
- the washed electrolytic copper foils in embodiments 1-6 have better anti-tarnish property.
- the washed electrolytic copper foils in embodiments 1-6 have better anti-tarnish property. Based on the results, when the amounts of the salts of group-IIA metals are inadequate, it is difficult to achieve the effects of the cleaning fluid composition of the present invention.
- the cleaning fluid composition of the present invention is more effective in removing acid groups (such as sulfate group, phosphate group, or acetate group). Therefore, the cleaning fluid composition of the present invention is more suitable for cleaning electrolytic copper foils.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.
Description
- This application is a divisional application of U.S. patent application Ser. No. 14/046,077, filed on Oct. 4, 2013; which claims foreign priority under 35 U.S.C. §119(a) to Patent Application No. 102127581, filed on Aug. 1, 2013, in the Intellectual Property Office of Ministry of Economic Affairs, Republic of China (Taiwan, R.O.C.), the entire content of each of which Patent Application is incorporated herein by reference.
- The present invention relates to a method to treat the surfaces of electrolytic copper foils, and more particularly, to a method for cleaning a copper foil to adjust the metal composition of the surfaces of the electrolytic copper foil after the anti-rust treatment.
- Electrolytic copper foil is an indispensable material for printed circuit board, and especially the double-sided glossy copper foil can be coated with electrode material for the use of cathode plate of lithium ion secondary battery. Following the increasing demands of consumer electronic products, the demands of lithium ion secondary batteries have increased gradually.
- In addition, the development trend of commercial small electronic products is moving toward smaller and lightweight designs. The batteries as driving power not only have to possess the advantages of having high operation voltage, high energy density and long cycle life, but they also have to follow the trend of minimization. Since the non-aqueous electrolyte secondary battery, such as lithium ion secondary battery, possesses the features of high energy density, high capacity and long cycle life, thereby, it is used widely as driving power for portable electronic instruments.
- In general, the causes of poor preservation of electrolytic copper foil are oxidation and acid corrosion. Therefore, after manufacturing the electrolytic copper foil, it was processed with anti-rust treatment using electroplating, such as chromium coating, or using organic compounds, such as benzotriazole, to form chelate compound with copper, thereby enhancing the resistance of electrolytic copper foil. However, during long term preservation, oxidation and acid corrosion can still occur to the electrolytic copper foil which was processed with electro-plating anti-rust treatment. The defects of poor preservation include the appearance of oxidation spots and discoloring. In the manufacturing process of the copper foils which were used in printed circuit board or the cathode plate of lithium ion secondary battery, the electrolyte is consisting of copper dissolved in sulfuric acid. One possible rationale of causing the defects could be the continuous corrosion of copper foil due to the residual sulfuric acid on the surfaces of copper foil after the formation of foil.
- In order to resolve the problem of poor preservation of the electrolytic copper foil due to rusting, in the industry the electrolytic copper foil is washed with water after the anti-rusting treatment using deionized water in two-staged steps to wash the electrolytic copper foil which is coated with anti-rust layer to remove the residual sulfuric ion or other impurities on the surface of the electrolytic copper foil. Also, in the washing steps, there are specific requirements for water pressure, water distribution, washing distance and washing angel. In addition, in a relevant publication, it indicated the high demands of water quality in the washing steps, and in general the deionized water with conductivity less than 10 μS/cm was used (Printed Circuit Communications, volume 10, 2004). In other words, the soft water with good softening processes was used as cleaning solutions. However, this method is effective for a short period of time to prevent the discoloring of the electrolytic copper foil, but it does not achieve significant effects for the long term preservation of the copper foil.
- Therefore, it is an urgent need for the industry to develop an effective method for a surface treatment to improve the anti-oxidation and anti-rust corrosion property of the electrolytic copper foil. The method, which should be especially suitable for the washing steps after the anti-rust treatment, should include a cleaning method, a composition of the cleaning fluid to be used for the cleaning method and an electrolytic copper foil resistant to oxidation and rust-corrosion.
- The present invention provides a cleaning fluid composition for cleaning an electrolytic copper foil, comprising a liquid medium and a salt of a group HA metal, wherein the metal ion content produced in the liquid medium from the salt of group HA metal is greater than 10 mg/L.
- In one embodiment, the content of the metal ion produced in the liquid medium is greater than 32 mg/L. In another embodiment, the content of the metal ion produced in the liquid medium is greater than 63 mg/L. In other words, the content of the metal ion produced in the liquid medium may be at least from 32 mg/L to 63 mg/L.
- The liquid medium can be de-ionized water or pure water.
- The IIA group metal ion is a magnesium or calcium ion. In one preferred embodiment of the present invention, the salt of the IIA group metal is at least one of magnesium chloride and calcium chloride.
- The present invention also provides a method for cleaning an electrolytic copper foil by using the aforementioned cleaning fluid composition. The method of the present invention can be used to clean various electrolytic foils which are treated or untreated. In one embodiment, the electrolytic copper foil has been processed with anti-rust treatment.
- In one embodiment, a rinsing style is used to clean the electrolytic copper foil. In one preferred embodiment, the aforementioned cleaning fluid composition is used through a fan-shaped spray-column style to clean the electrolytic copper foil.
- In another embodiment, the electrolytic copper foil is immersed in the aforementioned cleaning fluid composition for 0.1 to 20 seconds.
- The present invention also provides an electrolytic copper foil comprising the group-IIA metal which is adhered to a surface of the electrolytic copper foil, wherein the signal strength of the group-IIA metal is greater than 0.1% based on the signal strength of copper element (as 100%) analyzed by a secondary ion mass spectrometry. In one embodiment, the signal strength of the group-IIA metal is in a range from between 0.1 and 0.8%.
- The cleaning fluid composition of the present invention contains a group-IIA metal salt which can effectively react with the residual acid groups on the copper foil, such as a sulfate group, a phosphate group, or an acetate group. Therefore, besides the existence of the copper element on the surfaces of the electrolytic copper foil which are washed using the cleaning method of the present invention, he group-IIA metal is also adhered to the surfaces of the electrolytic copper foil, so as to protect the copper foil from acid corrosion during the manufacturing processes and transportation and to further provide excellent protection from oxidation and rust corrosion.
- The present disclosure can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
-
FIG. 1 is a schematic drawing to show the method for cleaning an electrolytic copper foil according to the present invention; and -
FIG. 2 is a three-dimensional schematic drawing to show the method for cleaning an electrolytic copper foil by using spray-column according to the present invention. - In the following, specific embodiments are provided to illustrate the detailed description of the present invention. Those skilled in the art can easily conceive the advantages and effects of the present invention, based on the disclosure of the specification. The present invention can also be practiced or applied by referring to the other different embodiments. Each of the details in the specification can also be modified or altered in various ways in view of different aspects and applications, without departing from the spirit of the disclosure of the present invention.
-
FIG. 1 is a schematic drawing to show a method for cleaning an electrolytic copper foil. In one embodiment, after anelectrolytic copper foil 4 was prepared in an electrolytic tank 1, theelectrolytic copper foil 4 was moved to a chromic acid tank 2 to add a chrome coating as an anti-rust step. As a washing step, after the chrome-coating step, the electrolytic copper foil was moved to awashing tank 3 filled with the cleaning fluid of the present invention by immersing the chrome-coated electrolytic copper foil for 0.1 to 20 seconds. Theelectrolytic copper foil 4 was air-dried, and then theelectrolytic copper foil 4 was obtained by using a winding device. - In this embodiment, prior to introducing the
electrolytic copper foil 4 to thecleaning tank 3, the electrolytic copper foil was also washed using rinsing style with the cleaning fluid composition of the present invention through 20 and 20′ producing fan-shaped spray-column When the cleaning fluid composition of the present invention was used to clean the electrolytic copper foil, there were no specific limitations for washing distance, water pressure, water distribution and washing angle. In a preferred embodiment, thecolumns electrolytic copper foil 4 was washed with fan-shaped spray-column -
FIG. 2 is a three-dimensional schematic drawing to show the method for cleaning the electrolytic copper foil by using spray-column. As shown inFIG. 2 , 20 and 20′ are implemented on the opposite sides of thecolumns electrolytic copper foil 4. There are multiple holes (200 and 200′) on 20 and 20′ to produce fan-shaped spray-column In another embodiment, the electrolyte composition in electrolytic tank 1 included a copper sulfate electrolyte containing copper sulfate (CuSO4.5H2O) at the concentration of 270 g/L and sulfuric acid (H2SO4) at the concentration of 100 g/L. This electrolyte was used to prepare an electrolytic copper foil with the thickness of 8 μm at the liquid temperature of 42° C. and the electric current density of 50 A/dm2. In the aforementioned embodiment, the composition of electroplating solution in chromic acid tank 2 included chromic acid (H2CrO4) at the concentration of 1 g/L. This electroplating solution was used to coat a layer of chrome on the electrolytic copper foil at the liquid temperature of 35° C. and the electric current density of 3 A/dm2 so as to form an anti-rust layer.columns - Deionized water was used as cleaning fluid.
- 3270 mL of deionized water and the ingredients of the compositions listed in table 1 were fed into a 40 L reactor which has a stirrer to obtain the cleaning liquid compositions.
- 3270 mL of deionized water and the ingredients of the compositions listed in Table 1 were fed into a 40 L reactor which has a stirrer to obtain the cleaning liquid compositions.
- 3270 mL of deionized water and the ingredients of the compositions listed in Table 1 were fed into a 40 L reactor which has a stirrer to obtain the cleaning liquid compositions of the present invention.
-
TABLE 1 Metal ion content in cleaning Metal salt fluid composition Comparative examples 1 — — Comparative example 2 Sodium chloride 5.7 (mg/L) Comparative example 3 Sodium chloride 38.3 Comparative example 4 Potassium chloride 5.6 Comparative example 5 Potassium chloride 32.1 Comparative example 6 Magnesium chloride 5.3 Comparative example 7 Calcium chloride 5.1 Embodiment 1 Magnesium chloride 10.2 Embodiment 2 Magnesium chloride 32.8 Embodiment 3Magnesium chloride 63.1 Embodiment 4Calcium chloride 10.4 Embodiment 5Calcium chloride 34.3 Embodiment 6 Calcium chloride 65.2 - The surface elements on the electrolytic copper foils, which were washed by the cleaning fluid compositions in the aforementioned comparative examples 1-7 and embodiments 1-6, were analyzed. After the contents of copper, sodium, potassium, magnesium and calcium on the surfaces of the electrolytic copper foils were measured, the ratio of each element in group-IA and group-IIA to the copper content was calculated and shown in Table 2.
- The electrolytic copper foils, which were washed by the cleaning fluid compositions in aforementioned comparative examples 1-7 and embodiments 1-6, were cut into test samples in A4 size. The weather-resistance tests were performed on the test samples, and the existence of the gloss on the outer appearances was visually observed. The results are shown in Table 3.
- The analysis method for test examples is described in details as follows.
- The secondary ion mass spectrometer (SIMS), TOF SIMS IV, produced by Ion Top Company was used for the analysis. The conditions for the analysis included using Cs+ (25 keV) as ion source and using the sputtered area of 100 um×100 um. The receivable secondary ions included copper (Cu)63, copper (Cu)65, sodium (Na)23, potassium (K)39, magnesium (Mg)24, and calcium (Ca)40. The strength of each element was measured and the percentage of the strength of sodium (Na)23, potassium (K)39, magnesium (Mg)24, and calcium (Ca)40 based on the strength of (copper (Cu)63 +copper (Cu)65) was calculated. The results are shown in Table 2.
- The test samples were placed at the constant temperature of 70° C. and the constant relative humidity of 80% for 14 hours. The changes of the outer appearances were observed visually and rated as 5-levels. The results are shown in Table 3.
-
TABLE 2 Percentage of the signal strength of each element analyzed by SIMS (based on the signal strength of copper element as 100%) Sodium Potassium Magnesium Calcium Comparative — — — — example 1 Comparative 0.73 — — — example 2 Comparative 5.13 — — — example 3 Comparative — 0.72 — — example 4 Comparative — 4.75 — — example 5 Comparative — — 0.09 — example 6 Comparative — — — 0.05 example 7 Embodiment 1 — — 0.14 — Embodiment 2 — — 0.42 — Embodiment 3— — 0.8 — Embodiment 4— — — 0.1 Embodiment 5— — — 0.34 Embodiment 6 — — — 0.7 -
TABLE 3 Level of anti-tarnish Comparative example 1 1 Comparative example 2 1 Comparative example 3 2 Comparative example 4 1 Comparative example 5 3 Comparative example 6 2 Comparative example 7 2 Embodiment 1 4 Embodiment 2 4 Embodiment 34 Embodiment 45 Embodiment 55 Embodiment 6 5 - The levels of anti-tarnish were defined as follows.
- 1. Under the visual observation, 100% of the surfaces of the test samples were oxidized and discolored, or the discolored area was less than 100% but changed to green or black, based on the total surface areas of the test samples.
- 2. Under the visual observation, 75% of the surfaces of the test samples were oxidized and discolored, based on the total surface areas of the test samples.
- 3. Under the visual observation, 50% of the surfaces of the test samples were oxidized and discolored, based on the total surface areas of the test samples.
- 4. Under the visual observation, 25% of the surfaces of the test samples were oxidized and discolored, based on the total surface areas of the test samples.
- 5. Under the visual observation, none of the surfaces of the test samples was oxidized and discolored.
- Referring to Table 3, the anti-tarnish property of the electrolytic copper foils washed by the cleaning fluid compositions in embodiments 1-6 is much better than those washed by the cleaning fluid compositions in comparative examples 1-7. In comparing to comparative examples 2-5 with the addition of the salts of group-IA metals, the washed electrolytic copper foils in embodiments 1-6 have better anti-tarnish property. In addition, in comparing to comparative examples 6-7, the washed electrolytic copper foils in embodiments 1-6 have better anti-tarnish property. Based on the results, when the amounts of the salts of group-IIA metals are inadequate, it is difficult to achieve the effects of the cleaning fluid composition of the present invention.
- Based on the aforementioned embodiments, in comparison with prior technologies, the cleaning fluid composition of the present invention is more effective in removing acid groups (such as sulfate group, phosphate group, or acetate group). Therefore, the cleaning fluid composition of the present invention is more suitable for cleaning electrolytic copper foils.
- The above embodiments are only used to illustrate the principle of the present invention and the effect thereof, and should not be construed as to limit the present invention. The above embodiments can be modified and altered by those skilled in the art, without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention is defined in the following appended claims.
Claims (13)
1-3. (canceled)
4. A cleaning fluid composition for cleaning electrolytic copper foil, comprising:
a liquid medium; and
a salt of a group-IIA metal, wherein a content of a metal ion dissociated from the salt in the liquid medium is 10 mg/L or more.
5. The cleaning fluid composition of claim 4 , wherein the content of the metal ion dissociated from the salt in the liquid medium is 32 mg/L or more.
6. The cleaning fluid composition of claim 5 , wherein the content of the metal ion dissociated from the salt in the liquid medium is 63 mg/L or more.
7. The cleaning fluid composition of claim 4 , wherein the liquid medium is deionized water or pure water.
8. The cleaning fluid composition of claim 4 , wherein the metal ion is magnesium ion or calcium ion.
9. The cleaning fluid composition of claim 4 , wherein the salt of the group-IIA metal is at least one of magnesium chloride and calcium chloride.
10. A method for cleaning an electrolytic copper foil, comprising a step of applying the cleaning fluid composition of claim 4 to the electrolytic copper foil.
11. The method of claim 10 , further comprising performing an anti-rust treatment on the electrolytic copper foil.
12. The method of claim 10 , further comprising rinsing the electrolytic copper foil with a fluid.
13. The method of claim 12 , wherein the rinsing is performed by spraying the fluid in fan-shaped spray-column to the electrolytic copper foil.
14. The method of claim 10 , wherein the step of applying the cleaning fluid composition includes immersing the electrolytic copper foil in the cleaning fluid composition of claim 4 .
15. The method of claim 14 , wherein the electrolytic copper foil is immersed in the cleaning fluid composition for 0.1 to 20 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/695,395 US20150225678A1 (en) | 2013-08-01 | 2015-04-24 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102127581A TWI539032B (en) | 2013-08-01 | 2013-08-01 | Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method |
| TW102127581 | 2013-08-01 | ||
| US14/046,077 US9388371B2 (en) | 2013-08-01 | 2013-10-04 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
| US14/695,395 US20150225678A1 (en) | 2013-08-01 | 2015-04-24 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/046,077 Division US9388371B2 (en) | 2013-08-01 | 2013-10-04 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20150225678A1 true US20150225678A1 (en) | 2015-08-13 |
Family
ID=52427933
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/046,077 Active 2033-10-31 US9388371B2 (en) | 2013-08-01 | 2013-10-04 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
| US14/695,395 Abandoned US20150225678A1 (en) | 2013-08-01 | 2015-04-24 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/046,077 Active 2033-10-31 US9388371B2 (en) | 2013-08-01 | 2013-10-04 | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9388371B2 (en) |
| JP (2) | JP5878958B2 (en) |
| KR (1) | KR101612334B1 (en) |
| CN (1) | CN104342746B (en) |
| MY (1) | MY162487A (en) |
| TW (1) | TWI539032B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835769A (en) * | 2019-12-04 | 2020-02-25 | 西安航天动力机械有限公司 | Spray liquid squeezing device of crude foil machine |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104789976B (en) * | 2015-05-14 | 2017-03-29 | 吴江飞乐天和电子材料有限公司 | A kind of etched foil cleaning method, etched foil cleaning device |
| KR102029139B1 (en) * | 2015-11-09 | 2019-10-07 | 케이씨에프테크놀로지스 주식회사 | Electrolytic Copper Foil, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same |
| US10544063B2 (en) * | 2017-09-15 | 2020-01-28 | United Technologies Corporation | Method of fabricating a ceramic matrix composite |
| CN108817123B (en) * | 2018-08-13 | 2023-08-18 | 佛山博睿荣创智能科技有限公司 | Automatic production line for sectional materials |
| CN110042439A (en) * | 2019-04-24 | 2019-07-23 | 福建清景铜箔有限公司 | Rapid Cleaning foil device |
| KR102202482B1 (en) | 2019-06-13 | 2021-01-12 | 김종범 | Sulfuric acid washing apparatus in an electrolytic copper |
| CN111229720A (en) * | 2020-02-20 | 2020-06-05 | 江西理工大学 | On-line ultrasonic cleaning device in electrolytic copper foil surface treatment process |
| CN113136582B (en) * | 2021-03-12 | 2023-09-22 | 昆明汇泉高纯半导材料有限公司 | Tantalum foil pretreatment device for preparing graphite heater of single crystal furnace |
| KR102741161B1 (en) * | 2022-03-10 | 2024-12-10 | (주)피엔티 | Metal foil manufacturing apparatus for manufacturing Metal foil having having lithium layer |
| CN115305161B (en) * | 2022-07-22 | 2023-06-20 | 福建紫金铜箔科技有限公司 | A kind of electrolytic copper foil anode plate cleaning agent and preparation method thereof |
| CN117732787A (en) * | 2023-12-25 | 2024-03-22 | 哈尔滨博睿创富新材料有限公司 | Design and production method of an automated pickling line for molten salt electrolysis of high-purity titanium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3746253A (en) * | 1970-09-21 | 1973-07-17 | Walberg & Co A | Coating system |
| US4379834A (en) * | 1978-11-17 | 1983-04-12 | Hoechst Aktiengesellschaft | Process for cleaning copper-containing metal surfaces |
| US6291081B1 (en) * | 1999-08-31 | 2001-09-18 | Mitsui Mining & Smelting Co., Ltd. | Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57152485A (en) * | 1981-03-17 | 1982-09-20 | Nippon Denkai Kk | Copper foil and its surface treatment |
| FR2526446B1 (en) * | 1982-05-06 | 1986-02-21 | Penarroya Miniere Metall | METHOD AND APPARATUS FOR PREPARING METAL BY ELECTROLYSIS, PARTICULARLY LEAD, AND SEMI-PRODUCT OBTAINED BY THEIR IMPLEMENTATION |
| US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
| KR100297179B1 (en) * | 1990-07-02 | 2002-12-26 | 올린 코포레이션 | A method for electrodepositing copper or copper alloy foil with chromium-zinc ion to impart discoloration resistance to the foil and a basic electrolyte solution for electrodepositing a discoloration preventing film on copper or copper alloy foil. |
| JPH101798A (en) * | 1996-06-10 | 1998-01-06 | Nkk Corp | Electrolytic chromate treatment method |
| TWI229152B (en) * | 1999-06-08 | 2005-03-11 | Mitsui Mining & Smelting Co | Manufacturing method of electrodeposited copper foil |
| JP4077143B2 (en) * | 2000-07-31 | 2008-04-16 | 日本特殊陶業株式会社 | Chromate drainage treatment method |
| JP4550263B2 (en) | 2000-12-14 | 2010-09-22 | 日鉱金属株式会社 | Copper alloy foil for laminates |
| JP2003013156A (en) * | 2001-07-04 | 2003-01-15 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminates |
| KR100491385B1 (en) | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
| JP2003027162A (en) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminates |
| JP2003034829A (en) | 2001-07-24 | 2003-02-07 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminates |
| JP2003041334A (en) | 2001-08-01 | 2003-02-13 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminates |
| US7749611B2 (en) | 2002-12-05 | 2010-07-06 | Gbc Metals, L.L.C. | Peel strength enhancement of copper laminates |
| JP2004349693A (en) * | 2003-04-30 | 2004-12-09 | Mec Kk | Adhesive layer for copper surface |
| JP2004349639A (en) | 2003-05-26 | 2004-12-09 | Seiko Epson Corp | Pattern forming method and pattern forming apparatus, device manufacturing method, electro-optical device, and electronic apparatus |
| US7132158B2 (en) | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
| TW200718347A (en) * | 2005-07-14 | 2007-05-01 | Mitsui Mining & Smelting Co | Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
| US20110139626A1 (en) * | 2008-06-12 | 2011-06-16 | Furukawa Electric Co., Ltd. | Electrolytic copper coating, method of manufacturing the same, and copper electrolyte for manufacturing electrolytic copper coating |
| JP2009300873A (en) | 2008-06-16 | 2009-12-24 | Kaneka Corp | Method for manufacturing new circuit substrate |
| WO2012002418A1 (en) | 2010-06-30 | 2012-01-05 | 三井金属鉱業株式会社 | Process for production of copper foil for negative electrode current collector |
| TW201038766A (en) | 2010-07-08 | 2010-11-01 | Rong yi chemical co ltd | Method of electroless gold plating over miniature circuits on substrate |
| KR101343951B1 (en) * | 2011-06-23 | 2013-12-24 | 코닉이앤씨 주식회사 | Manufacturing method and manufacturing apparatus of metal foil |
-
2013
- 2013-08-01 TW TW102127581A patent/TWI539032B/en active
- 2013-09-11 CN CN201310412228.7A patent/CN104342746B/en active Active
- 2013-10-04 US US14/046,077 patent/US9388371B2/en active Active
- 2013-10-14 MY MYPI2013003756A patent/MY162487A/en unknown
- 2013-10-30 KR KR1020130129804A patent/KR101612334B1/en active Active
-
2014
- 2014-07-25 JP JP2014151631A patent/JP5878958B2/en active Active
- 2014-10-22 JP JP2014215221A patent/JP6277106B2/en active Active
-
2015
- 2015-04-24 US US14/695,395 patent/US20150225678A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3746253A (en) * | 1970-09-21 | 1973-07-17 | Walberg & Co A | Coating system |
| US4379834A (en) * | 1978-11-17 | 1983-04-12 | Hoechst Aktiengesellschaft | Process for cleaning copper-containing metal surfaces |
| US6291081B1 (en) * | 1999-08-31 | 2001-09-18 | Mitsui Mining & Smelting Co., Ltd. | Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
Non-Patent Citations (1)
| Title |
|---|
| Equilibrium Relative Humidity; found at http://www.omega.com/temperature/z/pdf/z103.pdf, 10/24/16 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835769A (en) * | 2019-12-04 | 2020-02-25 | 西安航天动力机械有限公司 | Spray liquid squeezing device of crude foil machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5878958B2 (en) | 2016-03-08 |
| CN104342746A (en) | 2015-02-11 |
| US9388371B2 (en) | 2016-07-12 |
| KR101612334B1 (en) | 2016-04-14 |
| TWI539032B (en) | 2016-06-21 |
| US20150037606A1 (en) | 2015-02-05 |
| MY162487A (en) | 2017-06-15 |
| KR20150016057A (en) | 2015-02-11 |
| JP2015038253A (en) | 2015-02-26 |
| TW201506205A (en) | 2015-02-16 |
| CN104342746B (en) | 2019-01-18 |
| JP2015030917A (en) | 2015-02-16 |
| JP6277106B2 (en) | 2018-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9388371B2 (en) | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil | |
| CN110029381B (en) | A kind of production method of tin plate with high tin plating amount | |
| KR102888545B1 (en) | Surface-treated steel sheet and method of producing the same | |
| JP5898616B2 (en) | Method for producing copper foil for negative electrode current collector | |
| US10914017B2 (en) | Sn-plated steel sheet | |
| US10865491B2 (en) | Sn-based alloy plated steel sheet | |
| KR101232963B1 (en) | Plated steel sheet for can and process for producing the plated steel sheet | |
| WO2014132735A1 (en) | Surface-treated steel sheet manufacturing method | |
| WO2016125911A1 (en) | Tin-plated steel sheet, chemical conversion treated steel sheet and manufacturing method therefor | |
| WO2010027021A1 (en) | Copper-zinc alloy electroplating bath | |
| JP2002356785A (en) | Tin-plated steel sheet excellent in oxidation resistance and method for producing the same | |
| JP4742677B2 (en) | Method for producing tin-plated steel strip | |
| WO2015020053A1 (en) | Steel sheet for container | |
| KR102524705B1 (en) | Method of producing surface-treated steel sheet and surface-treated steel sheet | |
| JP5678817B2 (en) | Method for producing tin-plated steel sheet | |
| WO2023195252A1 (en) | Surface-treated steel sheet and production method therefor | |
| KR20250065872A (en) | Surface-treated steel plate and its manufacturing method | |
| JP2013185190A (en) | Method for manufacturing electrogalvanized steel sheet | |
| CN107815718A (en) | A kind of magnesium alloy differential arc oxidation method | |
| CN106400078A (en) | Aluminum material surface hardening and anticorrosion method | |
| PL30726B1 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: CHANG CHUN PETROCHEMICAL CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHENG, KUEI-SEN;LAI, YAO-SHENG;JUO, TSANG-JIN;AND OTHERS;REEL/FRAME:035491/0220 Effective date: 20130823 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |