US20150144307A1 - Heat dissipating device and heat dissipating fin - Google Patents
Heat dissipating device and heat dissipating fin Download PDFInfo
- Publication number
- US20150144307A1 US20150144307A1 US14/503,419 US201414503419A US2015144307A1 US 20150144307 A1 US20150144307 A1 US 20150144307A1 US 201414503419 A US201414503419 A US 201414503419A US 2015144307 A1 US2015144307 A1 US 2015144307A1
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- United States
- Prior art keywords
- heat dissipating
- closed ring
- heat
- shaped portion
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
- F28F1/325—Fins with openings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/127—Fastening; Joining by methods involving deformation of the elements by shrinking
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- H10W40/037—
-
- H10W40/226—
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- H10W40/73—
Definitions
- the invention relates to a heat dissipating device and a heat dissipating fin and, more particularly, to a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin.
- Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
- the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat dissipating fan, wherein one end of the heat pipe contacts the electronic component, which generates heat during operation, the other end of the heat pipe is connected to the heat dissipating fin, and the heat dissipating fan blows air to the heat dissipating fin, so as to dissipate heat.
- the first method is to fix the heat pipe in a through hole of the heat dissipating fin directly in a tight-fitting manner.
- the second method is to connect the heat pipe and the through hole of the heat dissipating fin in a loose-fitting manner, wherein a thermal conductive adhesive or a solder paste is filled in a gap between the heat pipe and the heat dissipating fin.
- the second method has to form a groove on each of the heat dissipating fins to communicate with the through holes and then fill the thermal conductive adhesive or the solder paste in the groove.
- the heat pipe is inserted into the through hole.
- the thermal conductive adhesive or the solder paste are heated to be converted form solid into liquid and then cooled to be converted form liquid into solid, such that the thermal conductive adhesive or the solder paste is filled in the gap between the heat pipe and the heat dissipating fin.
- the process of the second method is complicated and additional thermal conductive adhesive or solder paste may be remained on the heat dissipating fin, such that the appearance is not good and the thermal impedance increases accordingly.
- the manufacturing time is long, so the manufacturing efficiency is low.
- the invention provides a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin, so as to solve the aforesaid problems.
- a heat dissipating device comprises a heat dissipating fin and a heat pipe.
- the heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening.
- the heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end, and the heat dissipating end is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
- a heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening.
- the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process.
- An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
- FIG. 1 is a perspective view illustrating a heat dissipating device according to a first embodiment of the invention.
- FIG. 2 is a perspective view illustrating the heat dissipating device shown in FIG. 1 from another viewing angle.
- FIG. 3 is an exploded view illustrating the heat dissipating device shown in FIG. 1 before a punching process.
- FIG. 4 is a front view illustrating the heat dissipating device shown in FIG. 1 .
- FIG. 5 is a front view illustrating the heat dissipating device shown in FIG. 4 before the punching process.
- FIG. 6 is a front view illustrating a heat dissipating device before the punching process according to a second embodiment of the invention.
- FIG. 1 is a perspective view illustrating a heat dissipating device 1 according to a first embodiment of the invention
- FIG. 2 is a perspective view illustrating the heat dissipating device 1 shown in FIG. 1 from another viewing angle
- FIG. 3 is an exploded view illustrating the heat dissipating device 1 shown in FIG. 1 before a punching process
- FIG. 4 is a front view illustrating the heat dissipating device 1 shown in FIG. 1
- FIG. 5 is a front view illustrating the heat dissipating device 1 shown in FIG. 4 before the punching process.
- the heat dissipating device 1 of the invention comprises a plurality of heat dissipating fins 10 and a plurality of heat pipes 12 , wherein the number of the heat dissipating fins 10 and the number of the heat pipes 12 can be determined according to practical applications and are not limited to the embodiment shown in FIGS. 1 to 3 .
- the heat dissipating fin 10 comprises a fin body 100 , a plurality of through holes 102 , a plurality of closed ring-shaped portions 104 and a plurality of recesses 106 , wherein the through holes 102 and the recesses 106 are formed on the fin body 100 , and the closed ring-shaped portions 104 extend from a periphery of the through holes 102 . It should be noted that the number of the through holes 102 , the number of the closed ring-shaped portions 104 and the number of the recesses 106 can be determined according to practical applications and are not limited to the embodiment shown in FIGS. 1 to 3 .
- the closed ring-shaped portion 104 has a first U-shaped protruding ear 1040 and a second U-shaped protruding ear 1042 , wherein the first U-shaped protruding ear 1040 is opposite to the second U-shaped protruding ear 1042 .
- the first U-shaped protruding ear 1040 before punching the closed ring-shaped portion 104 , has a first opening 1044 and the second U-shaped protruding ear 1042 has a second opening 1046 .
- the heat pipe 12 has a heat dissipating end 120 and a heat absorbing end 122 , wherein the heat dissipating end 120 is opposite to the heat absorbing end 122 . It should be noted that the structure and the principle of the heat pipe 12 are well known by one skilled in the art, so the related explanation will not be depicted herein.
- an operator may insert the heat dissipating end 120 of the heat pipe 12 into the through hole 102 and the closed ring-shaped portion 104 of the heat dissipating fin 10 in a loose-fitting manner and fix the heat absorbing end 122 of the heat pipe 12 in the recess 106 by welding, engaging or other manners. Afterward, the closed ring-shaped portion 104 is punched. As shown in FIG. 5 , an operator may insert the heat dissipating end 120 of the heat pipe 12 into the through hole 102 and the closed ring-shaped portion 104 of the heat dissipating fin 10 in a loose-fitting manner and fix the heat absorbing end 122 of the heat pipe 12 in the recess 106 by welding, engaging or other manners. Afterward, the closed ring-shaped portion 104 is punched. As shown in FIG.
- the invention can connect the heat pipe 12 and the heat dissipating fin 10 tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device 1 .
- FIG. 6 is a front view illustrating a heat dissipating device 1 ′ before the punching process according to a second embodiment of the invention.
- the difference between the heat dissipating device 1 ′ and the aforesaid heat dissipating device 1 is that the closed ring-shaped portion 104 ′ of the heat dissipating fin 10 ′ of the heat dissipating device 1 ′ only has the first U-shaped protruding ear 1040 without the aforesaid second U-shaped protruding ear 1042 .
- FIG. 6 and FIG. 5 are represented by the same numerals, so the repeated explanation will not be depicted herein again.
- the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process.
- An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end and is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
Description
- 1. Field of the Invention
- The invention relates to a heat dissipating device and a heat dissipating fin and, more particularly, to a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin.
- 2. Description of the Prior Art
- Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
- So far the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat dissipating fan, wherein one end of the heat pipe contacts the electronic component, which generates heat during operation, the other end of the heat pipe is connected to the heat dissipating fin, and the heat dissipating fan blows air to the heat dissipating fin, so as to dissipate heat. In the prior art, there are two methods for connecting the heat pipe and the heat dissipating fin, as follows. The first method is to fix the heat pipe in a through hole of the heat dissipating fin directly in a tight-fitting manner. However, when the heat pipe is inserted into the through hole by the first method, the heat pipe and the heat dissipating fin may pull and drag each other, such that a surface of the heat pipe may be scratched, the heat dissipating fin may deform or the through hole may crack. Accordingly, the yield rate of the first method is low. The second method is to connect the heat pipe and the through hole of the heat dissipating fin in a loose-fitting manner, wherein a thermal conductive adhesive or a solder paste is filled in a gap between the heat pipe and the heat dissipating fin. The second method has to form a groove on each of the heat dissipating fins to communicate with the through holes and then fill the thermal conductive adhesive or the solder paste in the groove. Afterward, the heat pipe is inserted into the through hole. Then, the thermal conductive adhesive or the solder paste are heated to be converted form solid into liquid and then cooled to be converted form liquid into solid, such that the thermal conductive adhesive or the solder paste is filled in the gap between the heat pipe and the heat dissipating fin. However, the process of the second method is complicated and additional thermal conductive adhesive or solder paste may be remained on the heat dissipating fin, such that the appearance is not good and the thermal impedance increases accordingly. Furthermore, the manufacturing time is long, so the manufacturing efficiency is low.
- The invention provides a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin, so as to solve the aforesaid problems.
- According to an embodiment of the invention, a heat dissipating device comprises a heat dissipating fin and a heat pipe. The heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end, and the heat dissipating end is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
- According to another embodiment of the invention, a heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening.
- As mentioned in the above, the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process. An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
- These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
-
FIG. 1 is a perspective view illustrating a heat dissipating device according to a first embodiment of the invention. -
FIG. 2 is a perspective view illustrating the heat dissipating device shown inFIG. 1 from another viewing angle. -
FIG. 3 is an exploded view illustrating the heat dissipating device shown inFIG. 1 before a punching process. -
FIG. 4 is a front view illustrating the heat dissipating device shown inFIG. 1 . -
FIG. 5 is a front view illustrating the heat dissipating device shown inFIG. 4 before the punching process. -
FIG. 6 is a front view illustrating a heat dissipating device before the punching process according to a second embodiment of the invention. - Referring to
FIGS. 1 to 5 ,FIG. 1 is a perspective view illustrating aheat dissipating device 1 according to a first embodiment of the invention,FIG. 2 is a perspective view illustrating theheat dissipating device 1 shown inFIG. 1 from another viewing angle,FIG. 3 is an exploded view illustrating theheat dissipating device 1 shown inFIG. 1 before a punching process,FIG. 4 is a front view illustrating theheat dissipating device 1 shown inFIG. 1 , andFIG. 5 is a front view illustrating theheat dissipating device 1 shown inFIG. 4 before the punching process. - As shown in
FIGS. 1 to 4 , theheat dissipating device 1 of the invention comprises a plurality ofheat dissipating fins 10 and a plurality ofheat pipes 12, wherein the number of the heat dissipating fins 10 and the number of theheat pipes 12 can be determined according to practical applications and are not limited to the embodiment shown inFIGS. 1 to 3 . Theheat dissipating fin 10 comprises afin body 100, a plurality of throughholes 102, a plurality of closed ring-shaped portions 104 and a plurality ofrecesses 106, wherein the throughholes 102 and therecesses 106 are formed on thefin body 100, and the closed ring-shaped portions 104 extend from a periphery of the throughholes 102. It should be noted that the number of the throughholes 102, the number of the closed ring-shaped portions 104 and the number of therecesses 106 can be determined according to practical applications and are not limited to the embodiment shown inFIGS. 1 to 3 . - In this embodiment, the closed ring-
shaped portion 104 has a first U-shaped protrudingear 1040 and a secondU-shaped protruding ear 1042, wherein the firstU-shaped protruding ear 1040 is opposite to the secondU-shaped protruding ear 1042. As shown inFIG. 5 , before punching the closed ring-shaped portion 104, the first U-shaped protrudingear 1040 has afirst opening 1044 and the secondU-shaped protruding ear 1042 has asecond opening 1046. - The
heat pipe 12 has aheat dissipating end 120 and aheat absorbing end 122, wherein theheat dissipating end 120 is opposite to theheat absorbing end 122. It should be noted that the structure and the principle of theheat pipe 12 are well known by one skilled in the art, so the related explanation will not be depicted herein. - As shown in
FIG. 5 , an operator may insert theheat dissipating end 120 of theheat pipe 12 into the throughhole 102 and the closed ring-shaped portion 104 of theheat dissipating fin 10 in a loose-fitting manner and fix theheat absorbing end 122 of theheat pipe 12 in therecess 106 by welding, engaging or other manners. Afterward, the closed ring-shaped portion 104 is punched. As shown inFIG. 4 , after punching the closed ring-shaped portion 104, the first opening 1044 of the first U-shaped protrudingear 1040 and the second opening 1046 of the secondU-shaped protruding ear 1042 of the closed ring-shaped portion 104 shrink, such that the closed ring-shaped portion 104 fixes theheat dissipating end 120 of theheat pipe 12 in a tight-fitting manner. Accordingly, the invention can connect theheat pipe 12 and the heat dissipating fin 10 tightly and improve the yield rate and the efficiency of manufacturing theheat dissipating device 1. - Referring to
FIG. 6 along withFIG. 5 ,FIG. 6 is a front view illustrating aheat dissipating device 1′ before the punching process according to a second embodiment of the invention. The difference between theheat dissipating device 1′ and the aforesaidheat dissipating device 1 is that the closed ring-shaped portion 104′ of theheat dissipating fin 10′ of theheat dissipating device 1′ only has the firstU-shaped protruding ear 1040 without the aforesaid secondU-shaped protruding ear 1042. It should be noted that the same elements inFIG. 6 andFIG. 5 are represented by the same numerals, so the repeated explanation will not be depicted herein again. - As mentioned in the above, the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process. An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
- Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Claims (8)
1. A heat dissipating device comprising:
a heat dissipating fin comprising a fin body, a through hole and a closed ring-shaped portion, the through hole being formed on the fin body, the closed ring-shaped portion extending from a periphery of the through hole and having a first U-shaped protruding ear, the first U-shaped protruding ear having a first opening; and
a heat pipe having a heat dissipating end and a heat absorbing end, the heat dissipating end being opposite to the heat absorbing end, the heat dissipating end being disposed in the through hole and the closed ring-shaped portion, after punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
2. The heat dissipating device of claim 1 , wherein the closed ring-shaped portion further has a second U-shaped protruding ear, the second U-shaped protruding ear has a second opening, after punching the closed ring-shaped portion, the second opening of the second U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in the tight-fitting manner.
3. The heat dissipating device of claim 2 , wherein the first U-shaped protruding ear is opposite to the second U-shaped protruding ear.
4. The heat dissipating device of claim 1 , wherein the heat dissipating fin further comprises a recess formed on the fin body, and the heat absorbing end is fixed in the recess.
5. A heat dissipating fin comprising:
a fin body;
a through hole formed on the fin body; and
a closed ring-shaped portion extending from a periphery of the through hole and having a first U-shaped protruding ear, the first U-shaped protruding ear having a first opening.
6. The heat dissipating fin of claim 5 , wherein the closed ring-shaped portion further has a second U-shaped protruding ear, and the second U-shaped protruding ear has a second opening.
7. The heat dissipating fin of claim 6 , wherein the first U-shaped protruding ear is opposite to the second U-shaped protruding ear.
8. The heat dissipating fin of claim 5 , further comprising a recess formed on the fin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/594,661 US10349558B2 (en) | 2013-11-25 | 2017-05-15 | Method of manufacturing heat dissipating device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320751706.2 | 2013-11-25 | ||
| CN201320751706.2U CN203563292U (en) | 2013-11-25 | 2013-11-25 | Heat radiating device and heat radiating fin |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/594,661 Division US10349558B2 (en) | 2013-11-25 | 2017-05-15 | Method of manufacturing heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20150144307A1 true US20150144307A1 (en) | 2015-05-28 |
Family
ID=50512981
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/503,419 Abandoned US20150144307A1 (en) | 2013-11-25 | 2014-10-01 | Heat dissipating device and heat dissipating fin |
| US15/594,661 Active 2035-03-29 US10349558B2 (en) | 2013-11-25 | 2017-05-15 | Method of manufacturing heat dissipating device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/594,661 Active 2035-03-29 US10349558B2 (en) | 2013-11-25 | 2017-05-15 | Method of manufacturing heat dissipating device |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20150144307A1 (en) |
| CN (1) | CN203563292U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170038153A1 (en) * | 2015-08-07 | 2017-02-09 | Asia Vital Components Co., Ltd. | Heat dissipation device |
| USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
| US20210255531A1 (en) * | 2020-02-18 | 2021-08-19 | Coretronic Corporation | Heat dissipation structure and projection device |
| US11293700B2 (en) * | 2019-10-25 | 2022-04-05 | Cooler Master Co., Ltd. | Multi-thermal characteristic heat sink fin |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030155104A1 (en) * | 2002-02-21 | 2003-08-21 | Wenger Todd Michael | Fin with elongated hole and heat pipe with elongated cross section |
| US20070030654A1 (en) * | 2005-08-04 | 2007-02-08 | Delta Electronics, Inc. | Heat dissipation modules and assembling methods thereof |
| US20070284083A1 (en) * | 2006-05-31 | 2007-12-13 | Min-Hsien Sung | Heat dissipating device |
| US20130025830A1 (en) * | 2011-07-27 | 2013-01-31 | Cooler Master Co., Ltd. | Heat sink assembly of fin module and heat pipes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077188B2 (en) * | 2004-09-27 | 2006-07-18 | Shyh-Ming Chen | Heat dissipating device with heat conductive tubes |
| US7120026B2 (en) * | 2004-10-06 | 2006-10-10 | Shyh-Ming Chen | Heat-dissipating device with heat conductive tubes |
| CN102832137A (en) * | 2011-06-15 | 2012-12-19 | 富准精密工业(深圳)有限公司 | Manufacturing method for heat radiation device |
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2013
- 2013-11-25 CN CN201320751706.2U patent/CN203563292U/en not_active Expired - Lifetime
-
2014
- 2014-10-01 US US14/503,419 patent/US20150144307A1/en not_active Abandoned
-
2017
- 2017-05-15 US US15/594,661 patent/US10349558B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030155104A1 (en) * | 2002-02-21 | 2003-08-21 | Wenger Todd Michael | Fin with elongated hole and heat pipe with elongated cross section |
| US20070030654A1 (en) * | 2005-08-04 | 2007-02-08 | Delta Electronics, Inc. | Heat dissipation modules and assembling methods thereof |
| US20070284083A1 (en) * | 2006-05-31 | 2007-12-13 | Min-Hsien Sung | Heat dissipating device |
| US20130025830A1 (en) * | 2011-07-27 | 2013-01-31 | Cooler Master Co., Ltd. | Heat sink assembly of fin module and heat pipes |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170038153A1 (en) * | 2015-08-07 | 2017-02-09 | Asia Vital Components Co., Ltd. | Heat dissipation device |
| US10215499B2 (en) * | 2015-08-07 | 2019-02-26 | Asia Vital Components Co., Ltd. | Heat dissipation device |
| USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
| US11293700B2 (en) * | 2019-10-25 | 2022-04-05 | Cooler Master Co., Ltd. | Multi-thermal characteristic heat sink fin |
| US20210255531A1 (en) * | 2020-02-18 | 2021-08-19 | Coretronic Corporation | Heat dissipation structure and projection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203563292U (en) | 2014-04-23 |
| US20170251570A1 (en) | 2017-08-31 |
| US10349558B2 (en) | 2019-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: COOLER MASTER (HUI ZHOU) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, CHIA-YU;ZHANG, QINGSONG;SONG, TAO;REEL/FRAME:033858/0219 Effective date: 20140812 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |