US20150136613A1

US20150136613A1 - Catalysts for low temperature electrolytic co reduction

Info

Publication number: US20150136613A1
Application number: US14/604,198
Authority: US
Inventors: Christina Li; Matthew W. Kanan
Original assignee: Leland Stanford Junior University
Current assignee: Leland Stanford Junior University
Priority date: 2013-02-12
Filing date: 2015-01-23
Publication date: 2015-05-21

Abstract

A method for electrochemically reducing CO is provided. A cathode is provided, wherein the cathode comprises a conductive substrate with a catalyst of a metal and a metal oxide based coating on a side of the cathode. An anode is spaced apart from the cathode. An ionic transport is provided between the anode and cathode. The cathode is exposed to CO and H₂O. The anode is exposed to H₂O. A voltage is provided between the cathode and anode.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No. PCT/US2013/025791 filed on Feb. 12, 2013, which is incorporated herein by reference for all purposes.

BACKGROUND OF THE INVENTION

This invention relates generally to the reduction of CO. Sustainable production of C-based fuel requires using renewable energy to power the reductive fixation of CO.

SUMMARY OF THE INVENTION

In accordance with the invention, a method for electrochemically reducing CO is provided. A cathode is provided, wherein the cathode comprises a conductive substrate with a catalyst of a metal and a metal oxide based coating on a side of the cathode. An anode is spaced apart from the cathode. An ionic transport is provided between the anode and cathode. The cathode is exposed to CO and H₂O. The anode is exposed to H₂O. A voltage is provided between the cathode and anode.
In another manifestation of the invention, a method for electrochemically reducing CO is provided. A coating is formed on a cathode by heating a metal layer of the cathode in air, electrochemically oxidizing the metal layer of the cathode, or by a metal oxide deposition to form a metal and metal oxide interface. An anode is spaced apart from the cathode. An ionic transport is provided between the anode and cathode. The coating is exposed to CO and H₂O. The anode is exposed to H₂O. A voltage is provided between the cathode and anode.
In another manifestation of the invention an apparatus, for electrochemically reducing CO is provided. An anode is provided. An oxidized cathode is spaced apart from the anode. A chamber for exposing the anode and oxidized cathode to at least one electrolyte is adjacent to the anode and oxidized cathode. A gas chamber for exposing the oxidized cathode to CO is adjacent to the oxidized cathode. A CO source for providing CO to the gas chamber is connected to the gas chamber.
The invention and objects and features thereof will be more readily apparent from the following detailed description and appended claims when taken with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows the XPS spectra of untreated Sn foil before and after electrolysis and Sn foil after etching in HBr.

FIG. 1B is a plot of total current density vs time, CO faradaic efficiency vs time, and overall HCO₂H faradaic efficiency at −0.7 V vs RHE in CO₂-saturated 0.5 M NaHCO₃for unetched Sn.

FIG. 1C is a plot of total current density vs time, CO faradaic efficiency vs time, and overall HCO₂H faradaic efficiency for untreated Sn at −0.7 V vs RHE in CO₂-saturated 0.5 M NaHCO₃for etched Sn.

FIG. 2A depicts the bulk electrolysis trace at −0.7 V in NaHCO₃/CO₂electrolyte for a Ti cathode before and after the addition of 1 mM SnCl₂to the electrolyte.

FIG. 2B shows SEM images of a Ti electrode before and after deposition showing the formation of a porous, particulate film with ˜100 nm-diameter pieces atop a more uniform layer.

FIG. 2C is a high resolution Sn 3d_5/2XPS of a Sn/SnO_xcatalyst removed 30 min or 12 h after the addition of Sn²⁺.

FIG. 2D provides graphs of XRD patterns showing Sn⁰, SnO₂, and Ti peaks after 30 min or 12 h.

FIGS. 3A-C shows the comparison of CO₂reduction catalysis for unexcited Sn foil and in situ deposited Sn/SnO_xthin film electrodes.

FIGS. 4A-E shows the total geometric current density (j_tot) vs time, the faradaic efficiency (FE) for CO vs time and the overall FE for HCO₂H for the polycrystalline Cu electrode and several of the annealed electrodes with progressively thicker initial Cu₂O layers at −0.5 V vs the reversible hydrogen electrode.

FIG. 4F shows the average FE for CO vs the amount of charge required to reduce the Cu₂O layer per electrode area.

FIGS. 5A-F show the scanning electron microscopy (SEM) images, X-ray diffraction (XRD) patterns, and high-resolution Cu 2p X-ray photoelectron spectroscopy (XPS) spectra for a Cu electrode after annealing procedure and after subsequent CO₂reduction electrolysis.

FIGS. 6A-C show the total current densities and faradaic efficiencies for the major products for a Cu electrode annealed at 500° C. for 12 h and for polycrystalline Cu.

FIG. 7 shows Tafel data for a Cu electrode annealed at 500° C. for 12 h and Tafel data for polycrystalline Cu.

FIG. 8 is a high level flow chart of an embodiment of the invention.

FIGS. 9A-B are enlarged cross-sectional views of part of a conductive substrate with a metal coating, forming part of a cathode.

FIG. 10 is a schematic view of an electrolyzer that may be used in an embodiment of the invention.

FIG. 11 is a high level flow chart of another embodiment of the invention.

FIG. 12 is a schematic view of an electrolyzer that may be used in another embodiment of the invention.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

Tin

Metal electrodes have been the focus of extensive CO₂electroreduction studies in aqueous solutions at ambient temperature. Sn has attracted considerable interest because it is one of the most active metals and its low cost is amenable to large-scale use. Despite its appeal relative to other electrodes, the energy efficiency of Sn is too low for practical electrolysis. Sn is reported to require at least 0.86 V of overpotential to attain a CO₂reduction partial current density of 4-5 mA/cm²in an aqueous solution saturated with 1 atm of CO₂. It is generally assumed that the bare Sn surface is the catalytically active surface for CO₂reduction. The large overpotential required for CO₂reduction is thought to result from the barrier associated with the initial e⁻ transfer to form a CO₂ ^− intermediate that is poorly stabilized by the Sn surface. This mechanistic scenario is commonly invoked for many metal electrodes.
In an embodiment of the invention, SnO_xis essential to CO₂reduction catalysis on Sn. This may be shown by demonstrating that removal of SnO_xfrom a Sn electrode results in nearly exclusive H₂evolution activity. This insight is subsequently applied to prepare a composite Sn/SnO_xthin film catalyst that exhibits greatly enhanced CO₂reduction activity relative to a typical Sn electrode.
To evaluate the importance of SnO_xon the surface of Sn in CO₂reduction, we compared the activity of Sn electrodes that had been etched in strong acid to the activity of untreated electrodes. In both cases, new pieces of high purity Sn foil (99.998%) were used. The surface of the untreated foil was examined by XPS to characterize the native SnOx layer. FIG. 1A shows the XPS spectra of untreated Sn foil before and after electrolysis (left) and Sn foil after etching in HBr (right). The curves are combinations of two Gaussian/Lorentzian curves at 486.5 eV and 484.7 eV. FIG. 1B is a plot of total current density vs time (indicated by the line), CO faradaic efficiency vs time (indicated by the ▪ points) and overall HCO₂H faradaic efficiency for untreated Sn at −0.7 V vs RHE in CO₂-saturated 0.5 M NaHCO₃for unetched Sn. FIG. 1C is a plot of total current density vs time (indicated by the line), CO faradaic efficiency vs time (indicated by the ▪ points) and overall HCO₂H faradaic efficiency for untreated Sn at −0.7 V vs RHE in CO₂-saturated 0.5 M NaHCO₃for etched Sn.
The high resolution Sn 3d_5/2spectrum was fit to two peaks at 486.5 eV and 484.7 eV that correspond to Sn^4+/2+ (SnO_x) and Sn⁰, respectively. The ratio of corrected peak areas for SnO_xto Sn⁰is 95:5, indicating the presence of a >5 nm native SnO_xlayer.
Etched electrodes were prepared by immersing the Sn foil in 24% HBr at 90° C. for 10 min. An XPS spectrum of the etched electrode taken immediately after removal from the HBr solution exhibited a SnO_x:Sn⁰ratio of 17:83 (FIG. 1A). The residual oxide observed on this electrode is likely due to oxide regrowth in the brief exposure to air upon transferring to the XPS chamber, as assessed by independent XPS experiments with a sputtered electrode. For electrolysis experiments, etched electrodes were rinsed with deionized water at the conclusion of the etching procedure and used immediately to minimize oxide regrowth.
The electrolyses were performed in an H-cell in 0.5 M aqueous NaHCO₃saturated with CO₂(“NaHCO₃/CO₂”) at a potential of −0.7 V vs the reversible hydrogen electrode (RHE; all potentials are referenced to this electrode). The headspace of the cathodic compartment was continuously purged with CO₂into the sampling valve of a gas chromatograph (GC), enabling periodic quantification of the gas phase products. FIG. 1B shows the total geometric current density (j_tot) vs time and the faradaic efficiency for CO production at various time points for an untreated Sn electrode. The electrode exhibits a current density of 0.4-0.6 mA/cm²and a steady-state faradaic efficiency for CO of 5-10%. NMR analysis of the electrolyte at the conclusion of the experiment indicates 19% faradaic efficiency for HCO₂H; the remainder of the current is accounted for by H₂formation. This CO₂reduction activity is consistent with the best reported activity for Sn at −1.06 V, taking into account the difference in overpotential. An electrode examined by XPS after a 12 h electrolysis at −0.7 V exhibited a SnO_x:Sn⁰ratio of 89:11, indicating that the native SnO_xlayer is stable to the reduction conditions (FIG. 1A).
Strikingly, an etched Sn electrode exhibits a much higher j_totof 3-4 mA/cm², but very low faradaic efficiency for CO (0.5%) and HCO₂H production (0.3%) (FIG. 1C). The higher j_totlikely reflects a larger electrochemical surface area due to etching. Despite the higher surface area, the geometric partial current density for CO₂reduction is lower for the etched Sn electrode (24-32 μA/cm²) than the untreated Sn electrode (92-140 μA/cm²) due to the much lower faradaic efficiency. Very low (<1%) CO₂reduction faradaic efficiencies on etched Sn are also observed over a range of potentials from −0.5 V to −1.0 V. Thus, etched Sn is a moderately efficient H₂evolution catalyst, but is essentially inactive for CO₂electroreduction. Similar results were obtained if Sn electrodes were etched by polarizing at −3 V in HCl solution instead of treating with hot HBr solution.
Together, the XPS and electrolysis results indicate that removal of the native SnO_xlayer from a Sn electrode suppresses CO₂reduction activity such that H₂evolution accounts for >99% of the current density. The small residual CO₂reduction activity observed on etched Sn likely reflects the growth of a small amount of SnO_xon the etched electrode before the start of electrolysis.
Based on these results, we hypothesized that the simultaneous deposition of Sn⁰and SnO_xon an electrode surface would result in a material with enhanced Sn—SnO_xcontact that is consequently a more active catalyst for CO₂reduction than a typical Sn foil electrode with a native SnO_xlayer. Accordingly, we sought electrodeposition conditions in which the hydrolysis of Sn²⁺ by cathodically generated OH⁻ would take place concurrently with the reduction of Sn²⁺ to Sn⁰(E⁰=−0.1375 V vs NHE). As described below, deposition on Ti electrodes under the same conditions used for CO₂electroreduction proved to be particularly effective.
FIG. 2A depicts the bulk electrolysis trace at −0.7 V in NaHCO₃/CO₂electrolyte for a Ti cathode before and after the addition of 1 mM SnCl₂to the electrolyte. Prior to the addition of Sn²⁺, the Ti electrode exhibits a current density of −10 μA/cm²with very little detectable CO₂reduction. Addition of Sn²⁺ results in a sharp rise in the current density to a steady-state value of ˜1.8 mA/cm²and the formation of a grey deposit on the electrode surface. The current density is stable for >10 h and corresponds to >85% CO₂reduction with the remainder accounted for by H₂evolution. Nearly identical results are obtained if Sn(OTf)₂is used instead of SnCl₂, indicating that Cl⁻ is not necessary for catalyst formation.
The composition and structure of the electrodeposited catalyst were characterized by a combination of scanning electron microscopy (SEM), XPS and powder x-ray diffraction (XRD). A catalyst was prepared via in situ deposition as described above and removed from the electrolyte 30 min after the addition of Sn²⁺. FIG. 2B shows SEM images of a Ti electrode before (left) and after (right) deposition showing the formation of a porous, particulate film with ˜100 nm-diameter pieces atop a more uniform layer. FIG. 2C is a high resolution Sn 3d_5/2XPS of a Sn/SnO_xcatalyst removed 30 min (left) or 12 h (right) after the addition of Sn²⁺. XPS analysis indicates a SnO_x:Sn⁰ratio of 93:7, similar to the ratio observed for Sn foil electrodes with a native SnO_xlayer. FIG. 2D provides graphs of XRD patterns showing Sn⁰(▪), SnO₂(★) and Ti () peaks after 30 min or 12 h. In the XRD pattern of this electrode, strong Sn⁰peaks are observed along with small peaks that correspond to SnO₂. The latter are absent for a Sn foil electrode with a native SnO_x. For comparison, a separate catalyst film was prepared and removed for analysis 12 h after the addition of Sn²⁺. The XPS spectrum, shown in FIG. 2C, and XRD pattern for this electrode are very similar to those of the sample removed after 30 min. Together, these results indicate that a composite Sn/SnO_xmaterial is formed under the deposition conditions.
The electrodeposited catalyst (hereafter referred to as “Sn/SnO_x”) exhibits greatly enhanced CO₂reduction catalysis compared to a typical Sn foil electrode with a native SnO_xlayer. For both electrodes, CO, HCO₂H and H₂together account for >99% of the reduction products in NaHCO₃/CO₂electrolyte. To compare the activities of Sn foil and Sn/SnO_x, we measured their partial current densities for CO and HCO₂H at selected potentials between −0.5 and −0.7 V. Comparison of CO₂reduction catalysis for Sn foil and in situ deposited Sn/SnO_xthin film electrodes are illustrated in FIGS. 3A-C. FIG. 3A shows Tafel plots for HCO₂H production. FIG. 3B shows Tafel plots for CO production. FIG. 3C is a bar graph showing Faradaic efficiencies for HCO₂H and CO at various potentials. These data were obtained by performing stepped-potential electrolyses with periodic quantification of the gaseous products by GC and removal of aliquots after each step for NMR analysis.
For Sn foil, approximate Tafel slopes of 74 mV/dec and 72 mV/dec are observed for HCO₂H and CO production, respectively. Similar Tafel slopes are observed for HCO₂H (67 mV/dec) and CO (77 mV/dec) production on Sn/SnO_x, however the geometric partial current densities are 7-8-fold higher than for Sn foil. The higher geometric current densities on Sn/SnOx are not simply the result of greater electroactive surface area, as indicated by cyclic voltammetry and the dramatic differences in faradaic efficiencies for Sn foil and Sn/SnO_x. Over the range of potentials used for Tafel analysis, the CO faradaic efficiencies are 4-fold higher and the HCO₂H faradaic efficiencies are 2-3-fold higher on Sn/SnO_xthan on untreated Sn foil.
The Tafel slopes for HCO₂H and CO production on both Sn foil and Sn/SnO_xare inconsistent with CO₂reduction mechanisms that proceed through an initial rate-determining 1 e⁻ transfer to CO₂. Such a mechanism would result in a 118 mV/dec slope. The observed slopes are instead much closer to 59 mV/dec, which supports mechanisms in which there is a reversible 1 e⁻ transfer to CO₂to form CO₂ ^− prior to a chemical rate-determining step. Possibilities for the chemical rate-determining step include protonation of CO₂ ^− or migration to an alternative site on the electrode surface. Competing rate-determining steps, such as protonation at C vs O of CO₂ ^−, may determine the HCO₂H vs CO selectivity.
The Tafel data, combined with the absence of appreciable CO₂reduction activity on etched Sn, suggest that SnO_xenables CO₂reduction to occur by stabilizing CO₂ ^−. At present, we cannot determine whether reduction takes place at the interface between Sn⁰and SnO_xor on the SnO_xsurface directly. In the absence of SnO_xto stabilize CO₂ ^−, Sn⁰only catalyzes H₂evolution because the 1 e⁻ transfer to CO₂is prohibitively slow. The higher CO₂reduction partial current density and faradaic efficiency on Sn/SnO_xrelative to Sn foil with a native SnO_xlayer are therefore indicative of a greater density of active sites for CO₂reduction and a higher ratio of these sites to H₂evolution sites for the in situ deposited catalyst.
The CO₂reduction activity of Sn/SnO_x, as indicated by the Tafel plots and faradaic efficiencies in FIGS. 3A-C, compares favorably to all polycrystalline metal electrodes in aqueous electrolytes with the exception of Au, which is comparably active initially, but subject to rapid deactivation. Improving CO₂and ion mass transport by incorporating Sn/SnOx in a flow cell and/or a gas diffusion electrode may enable increasing the current density by 1-2 orders of magnitude without large overpotential increases. Elucidating the detailed mechanistic role of SnO_xin mediating electron transfer to CO₂is an important objective toward this goal. Moreover, the importance of SnO_xto CO₂reduction on Sn surfaces raises the possibilities that metal oxides may be involved in CO₂reduction pathways on other metal electrodes and that the preparation of alternative metal/metal oxide composites may yield additional CO₂reduction catalysts with superior activity.

Copper

Polycrystalline Cu has been the focus of most CO₂reduction studies because it is one of the best available catalysts and is capable of producing hydrocarbon products. Although mechanistic studies have yielded valuable insights into the CO₂reduction pathways on Cu, the principal shortcomings of this electrode have not been addressed. Most significantly, the energetic efficiency of Cu is limited by the large overpotential (>0.7 V) required for CO₂reduction to outcompete H₂O reduction. In addition, Cu electrodes rapidly lose their CO₂reduction activity unless stringently purified electrolytes are used, a requirement that is not compatible with scalable fuel synthesis.
Achieving efficient Cu-catalyzed CO₂reduction requires preparing Cu particles whose surfaces have active sites that are different from those on the surface of a polycrystalline Cu electrode. Electrochemical reduction of metal oxides provides one possible route to metal particles with altered surface structures. Researchers have previously used electrochemical methods including potential cycling and anodic pulses to form and subsequently reduce oxides on Cu electrodes. These treatments have resulted in increased hydrogen evolution activity in alkaline electrolytes and altered product selectivity at high overpotential in CO₂reduction electrolyses. While these studies provide evidence of altered electrocatalytic properties, substantial improvements to the energetic efficiency of CO₂reduction have not been observed. Researchers have also used copper oxide electrodes in CO₂reduction electrolyses. The oxides were reduced to Cu⁰in situ during CO₂reduction catalysis, but only transient changes in the CO₂product distribution attributed to oxide catalysis were observed. Here we show that the CO₂reduction properties of Cu⁰electrodes resulting from copper oxide reduction vary widely depending on the properties of the initial oxide layer. Reduction of thick Cu₂O layers formed by high temperature annealing results in electrodes that catalyze energy-efficient CO₂reduction and are stable to the deactivation phenomena that plague bulk metal electrodes.
Electrodes were prepared by electropolishing pieces of polycrystalline Cu foil (99.9999%) in 85% phosphoric acid and subsequently annealing the electrodes in air at selected temperatures for variable amounts of time. The activities of these electrodes were compared to that of a polycrystalline Cu electrode in controlled potential electrolyses performed in CO₂-saturated 0.5 M NaHCO₃electrolyte (“NaHCO₃/CO₂”) in a two-compartment electrolysis cell. The headspace of the cathodic chamber was continuously purged with CO₂into the sampling loop of a gas chromatograph (GC) to enable periodic quantification of the gas-phase products. The solution-phase products were quantified by NMR analysis of the electrolyte at the conclusion of the electrolyses.
FIGS. 4A-E shows the total geometric current density (j_tot) vs time, the faradaic efficiency (FE) for CO vs time and the overall FE for HCO₂H for the polycrystalline Cu electrode (FIG. 4A) and several of the annealed electrodes (FIG. 4B-E) with progressively thicker initial Cu₂O layers at −0.5 V vs the reversible hydrogen electrode (RHE; all potentials are referenced to this electrode). The polycrystalline Cu electrode exhibited a j_totof ˜100 μA/cm², a FE for CO that declined from 10% at the start of the electrolysis to <2% over the course of 7 h and a FE for HCO₂H of 3%. The majority of the current, >90%, was due to H₂evolution. These values are consistent with the previously measured activity for Cu in KHCO₃electrolytes. Annealing Cu at 130° C., the temperature used to prepare Cu₂O electrodes for most previous studies, had very little effect on the activity under these conditions. The electrode annealed at 130° C. for 12 h (FIG. 4B) exhibited a j_totof 10 mA/cm²during the first 4 s in which the thin Cu₂O layer was reduced. Subsequently, the j_totand FEs were very similar to those of the polycrystalline electrode.
In contrast to these results, the electrodes annealed at higher temperatures exhibited larger j_totvalues and improved CO₂reduction FEs upon reduction of the Cu₂O layer. The electrode annealed at 300° C. for 30 min exhibited an initial j_totof 10 mA/cm²for 2 min as the Cu₂O was reduced and subsequently a stable j_totof 1.0 mA/cm². The FE for CO was 25% during the first hour of electrolysis before declining to 10% over 7 h; the FE for HCO₂H on the reduced electrode was 5%. Further improvements were obtained by starting with a thicker Cu₂O layer. After Cu₂O reduction of the electrode annealed at 300° C. for 5 h, j_totreached a stable value of 1.3 mA/cm², the FE for CO reached 35% and the FE for HCO₂H was 24% (FIG. 4D). Annealing at 500° C. for 12 h resulted in an even thicker Cu₂O layer and a stable j_totof 2.7 mA/cm². This electrode produced CO with ˜40% FE and HCO₂H with 33% FE. Notably, the FE for CO was maintained at 40% throughout the electrolysis, indicating not only efficient but also stable activity for CO₂reduction on this surface.
A plot of the average CO FEs for the annealed electrodes vs the amount of charge passed per electrode area (Q) in the Cu₂O reduction is shown in FIG. 4F. The FEs increased with the amount of charge passed until reaching a plateau at 30-40% for Q≧˜5 C/cm². Assuming bulk density of Cu₂O on the electrode, 5 C/cm²corresponds to a ˜3 μm-thick layer. Together, these results demonstrate that a threshold thickness of the initial Cu₂O layer is required to achieve both efficient and stable CO₂reduction catalysis for the electrode resulting from Cu₂O reduction.
Based on these results, electrodes prepared by annealing Cu at 500° C. for 12 h were selected for further characterization and CO₂reduction studies. FIGS. 5A-F show the scanning electron microscopy (SEM) images (FIGS. 5A, D), X-ray diffraction (XRD) patterns (FIGS. 5B, E), and high-resolution Cu 2p X-ray photoelectron spectroscopy (XPS) spectra (FIGS. 5C, F) for a Cu electrode after this annealing procedure (FIGS. 5A-C) and after subsequent CO₂reduction electrolysis (FIGS. 5D-F). After annealing, the SEM showed a dense array of rods with 100-1000 nm diameters on the electrode surface. These rods are the outermost portion of a thick Cu₂O layer coating the electrode, as evidenced by the large Cu₂O peaks and the near complete suppression of the Cu⁰peaks in the XRD pattern. The characteristic Cu²⁺ satellite peaks in the XPS spectrum are consistent with the presence of a thin (<10 nm) CuO layer coating the Cu₂O. Following CO₂reduction electrolysis, SEM indicated that the rod morphology was intact, but smaller particles (˜20 nm) were embedded within the rods (FIG. 5D and Figure S3). Only Cu⁰peaks were observed in the XRD pattern, FIG. 5F. The Cu 2p XPS spectrum indicated the presence of Cu⁰or Cu¹⁺ but the peaks associated with Cu²⁺ in the spectra prior to electrolysis were absent. Together, these results indicate the complete reduction of the Cu₂O layer, although we cannot rule out the presence of a thin, metastable Cu₂O layer or other surface-bound Cu¹⁺ species during electrocatalysis.
The electrochemically active surface area of a reduced electrode that had been annealed at 500° C. for 12 h was determined by measuring the double layer capacitance in 0.1 M HClO₄after CO₂reduction electrolysis. The capacitance was 13.9 mF/cm², which is 475× larger than the capacitance of 29 μF/cm²measured for a polycrystalline Cu electrode. This roughness factor is considerably larger than the difference in j_totbetween the two electrodes (˜30×), consistent with the difference in FEs between the two electrodes.
The presence of 100-1000 nm rods observed in FIG. 5D is not necessary for efficient CO₂reduction. Electrodes annealed at temperatures ≧500° C. for variable amounts of time exhibited very different morphological features on this length scale, but nonetheless comparable FEs for CO₂reduction at −0.5 V. These results suggest that the CO₂reduction efficiency of electrodes annealed at high temperatures is associated with a Cu particle surface or grain boundary structure that forms when suitably thick Cu₂O layers are electrochemically reduced.
To further characterize the effect of high temperature annealing on the CO₂reduction activity of Cu, we measured the partial current densities for the reduction products at a variety of potentials between −0.2 V and −1.0 V in NaHCO₃/CO₂using an electrode that had been annealed at 500° C. for 12 h (hereafter referred to as “annealed Cu”). The total current densities and faradaic efficiencies for the major products are shown in FIGS. 6A-C, which provides comparisons of electrocatalytic activities of polycrystalline Cu and Cu annealed at 500° C. for 12 h. FIG. 6A is a graph of total current density vs. potential. FIG. 6B is a graph of faradaic efficiencies for CO and HCO₂H vs potential. FIG. 6C is a graph of faradaic efficiencies for CH₄, C₂H₄and C₂H₆vs potential. Attempts to collect the corresponding data under identical conditions with polycrystalline Cu were unsuccessful due to the rapid degradation of catalytic activity. Instead, optimal data from previous studies with polycrystalline Cu at several potentials in 0.1 M KHCO₃are included for comparison.
The annealed Cu electrode exhibits a high efficiency for CO₂reduction at remarkably low overpotentials. A peak faradaic efficiency of ˜45% for CO production is obtained at potentials ranging from −0.3 V to −0.5 V, corresponding to 0.19 V to 0.39 V of overpotential for this product (FIG. 6B). By comparison, essentially no CO₂reduction to CO is observed for polycrystalline Cu in this potential range; the maximum efficiency for CO with polycrystalline Cu is 20%, which requires −0.8 V (η=0.69 V). Similarly, annealed Cu attains a peak faradaic efficiency for HCO₂H production of 30% at potentials ranging from −0.45 V to −0.65 V (η=0.25 V to 0.45 V), whereas polycrystalline Cu requires −0.7 V to −0.9 V (η=0.5 V to 0.7 V) to attain a comparable faradaic efficiency (FIG. 6B).
At relatively negative potentials (<−0.6 V), annealed Cu catalyzes the reduction of CO₂to ethylene and ethane (FIG. 6C). In contrast, polycrystalline Cu produces only ethylene and methane at high overpotential. Previous work on Cu single crystals has shown that the ratio of ethylene to methane can be boosted by introducing (111) steps in the (100) basal plane, i.e. by using single crystal Cu electrodes with a high index face exposed to the solution. However, methane was never fully suppressed and no ethane was observed in these studies. These results indicate that the surface structures of the Cu particles produced by Cu₂O reduction are distinct from the structures of the high index faces of Cu. We also note that no methanol was detected among the reduction products for annealed Cu at any potential examined here, in contrast to what has been reported for CO₂reduction catalysis with Cu electrodes annealed at lower temperatures.
The faradaic efficiencies for the hydrocarbon products on annealed Cu are low and H₂is the major product at high overpotentials. This difference relative to the lower overpotential regime most likely reflects the mass transport limitations at the high current densities observed (>10 mA/cm²) rather than the intrinsic selectivity of the electrode. Improvements in mass transport by using a flow cell or gas diffusion electrode are expected to enable substantially higher CO₂reduction current densities without large overpotential increases.
To obtain insight into the mechanistic pathway(s) for CO₂reduction with annealed Cu, a plot of overpotential vs the log of the partial current density for CO production (a Tafel plot) was extracted from the data described above. The data are shown in FIG. 7 along with Tafel data for polycrystalline Cu. The plot for annealed Cu is linear over the range of overpotentials from 0.05 V to 0.3 V with a slope of 116 mV/decade. This slope is consistent with a rate-determining initial electron transfer to CO₂to form a surface-adsorbed CO₂ ^− intermediate, a mechanism that is commonly invoked for metal electrodes. A similar slope is evident in the plot for polycrystalline Cu. The dramatic difference in FE between the two electrodes suggests that the Cu surfaces formed by reducing thick Cu₂O layers enable formation of the CO₂ ^− intermediate while suppressing H₂O reduction.
In summary, our results show that Cu particles prepared by reducing μm-thick Cu₂O films catalyze the reduction of CO₂to CO and HCO₂H with high faradaic efficiencies at exceptionally low overpotentials and produce C2 hydrocarbons to the exclusion of CH₄at high overpotentials. Electrodes with these characteristics can readily be prepared with high surface areas, enabling >1 mA/cm²geometric current densities for CO₂reduction at <0.4 V overpotential and measurable CO₂reduction current densities at <0.1 V overpotential, levels of activity that were previously inaccessible with metal electrodes under comparable conditions. Furthermore, CO₂reduction with these electrodes is resistant to deactivation for at least several hours, a marked improvement over the rapid deactivation of polycrystalline Cu under identical conditions. We anticipate that elucidation of the surface structures of the Cu particles formed by reducing thick Cu₂O layers will provide crucial insights into the structural requirements for preferential CO₂reduction and the formation of C2 products. In addition, this synthetic approach may prove useful for preparing additional electrocatalysts for CO₂reduction.

Embodiments of Implementation

To facilitate understanding of the invention, FIG. 8 is a high level flow chart of an embodiment of the invention. In this embodiment, a cathode with a catalyst metal is provided (step 804). A metal oxide coating is formed on the catalyst metal (step 808). The metal oxide coating and the catalyst metal form a metal and metal oxide coating, which may comprise a metal oxide coating over a metal coating or a single coating with both metal oxide particles and metal particles. An anode is spaced apart from the cathode (step 812). An ionic transport is provided between the anode and cathode (step 816). The cathode is exposed to CO₂and H₂O (step 820). The anode is exposed to H₂O (step 824). A voltage is provided between the cathode and anode (step 828). The voltage causes CO₂and H₂O to be reduced to CO, H₂, and O₂. The CO and H₂may be converted to hydrocarbon or alcohol products.
In a specific embodiment of the invention, the cathode is formed by providing a conductive substrate (step 804) with a catalyst metal coating (step 808). FIG. 9A is an enlarged cross-sectional view of part of a conductive substrate 904 with a metal coating 908, forming part of a cathode 912. In this example, the conductive substrate 904 is steel. The metal coating 908 is copper. The conductive substrate may be in the form of a net over which the metal coating is applied. In other embodiments, the conductive substrate and metal coating may be a single piece of the same material, such as a copper wire. In such a case, the metal coating may be considered an outer layer of the metal substrate.
A metal oxide coating is formed on the catalyst metal (step 808). FIG. 9B shows the part of the cathode 912 after the metal oxide coating 916 is formed. In this example, part of the copper catalyst metal coating 908 is formed into copper oxide by heating the cathode to at least 300° C. for at least 15 minutes. Preferably, the metal oxide coating is thicker than a native oxide layer. For example, the metal oxide coating has a thickness of at least twice the thickness of a native metal oxide layer. More preferably, the metal oxide coating is at least 50 nm thick. In other embodiments, the metal oxide coating 916 may be provided by a deposition process to deposit the metal oxide coating on the catalyst metal coating. In this example the copper catalyst metal coating 908 and the metal oxide coating 916 form a metal and metal oxide coating. In other embodiment, metal particles and metal oxide particles may form a single layer to form the metal and metal oxide coating.
In some embodiments, some or all of the native metal oxide layer may be reduced before or during usage as a cathode. In the specification and claims, the term “oxidized cathode” will apply to a cathode on which an oxide layer is formed on the cathode by a process that increases the thickness of the metal oxide beyond that of a native metal oxide, whether the metal oxide coating remains or is subsequently reduced. Therefore the oxidized cathode is a cathode with an oxidized cathode layer, which is a metal and metal oxide coating where the metal oxide either remains or is reduced back to metal, and wherein the metal oxide is at least twice as thick as native metal oxide.
An anode is spaced apart from the cathode (step 812). FIG. 10 is a schematic view of an electrolyzer 1000 that may be used in an embodiment of the invention. An anode is formed by a conductive anode substrate 1004 covered with an anode material 1008. In this example, the anode material 1008 is nickel. An anode electrolyte compartment 1012 is adjacent to the anode and holds an anode electrolyte. The anode electrolyte is provided from an anode electrolyte source 1016, which may continuously circulate anode electrolyte through the anode electrolyte compartment 1012. A cathode electrolyte compartment 1020 holds a cathode electrolyte. The cathode electrolyte is provided from a cathode electrolyte source 1024, which may continuously circulate cathode electrolyte through the cathode electrolyte compartment 1020. Alternatively, the cathode electrolyte may flow to a tank where the solution-phase products are collected. A separator 1028 is placed between the anode electrolyte compartment 1012 and the cathode electrolyte compartment 1020. The separator 1028 may be a porous frit or membrane that may allow certain ions to pass through the separator 1028. As described above, a cathode comprising a conductive substrate 904 with an oxidized cathode layer 1032 forms a cathode adjacent to the cathode electrolyte compartment 1020. In this embodiment, a gas chamber 1036 is placed on the backside of the cathode. A CO₂source 1040 provides a flow of CO₂into the gas chamber 1036. A product collector 1044 collects gas-phase products and unused CO₂from the gas chamber 1036. Product in the product collector 1044 may be isolated and the remaining CO₂may be recycled back to the CO₂source 1040. A voltage source 1048, such as a battery, provides a voltage between the anode and cathode.
In operation, the anode electrolyte source 1016 flows electrolyte through the anode electrolyte compartment 1012. The cathode electrolyte source 1024 flows electrolyte through the cathode electrolyte compartment 1020. CO₂is flowed from the CO₂source 1040 into the gas chamber 1036. The voltage source 1048 applies a positive voltage to the anode substrate 1004 and a negative voltage to the cathode substrate 904 with the anode connected to a positive terminal and the cathode connected to a negative terminal. The process provides electrolysis of the CO₂. Various chemical reactions may occur during the electrolysis of CO₂, depending on the metal cathode and other factors. One chemical reaction is CO₂+H₂O^→00+H₂+O₂. Other chemical reactions provide products of HCO₂H, CH₃OH or C₂H₄. In a preferred embodiment, the product collector 1044 provides the product to another system that converts CO, O₂, and H₂and possibly other products to methanol or some other fuel or usable chemical.
It has been unexpectedly found that by providing a metal oxide layer on a cathode that is thicker than the native oxide layer and subsequently reducing the metal oxide layer, the reduction of CO₂is improved. Without being bound by theory, it is believed that the reduction of the thick metal oxide layer results in metal particles that have unique structures that result in improved CO₂reduction, however, the reason for the improvement is currently unknown. It has also been unexpectedly found that for some cathodes having a metal and metal oxide interface improves CO₂reduction. Preferably, the metal and metal oxide use the same metal material. However, in an embodiment using cerium oxide, the metal is something other than cerium such as tin or copper. Since cerium would turn to cerium oxide during electrolysis, tin is used to provide a native metal for an enhanced metal oxide metal interface, which provides improved CO₂reduction.
As demonstrated above, copper cathodes that are annealed at 130° C. to grow the oxidation layer do not provide the desired improvement. Annealing copper at 300° C. provides some improvement. It has been found that annealing copper at over 500° C. provides the preferred improvement. Anodization at a constant potential for several hours can also be used to obtain a thick Cu₂O layer on Cu and results in improved CO₂reduction.
In the case of some metals such as gold, neither annealing in air or O₂or anodization at a constant potential is effective for preparing a thick oxide layer. Instead, a square wave potential routine is preferred to obtain the metal oxide layer. In the case of gold, a thick, hydrous Au₂O₃layer can be formed on the Au electrode by applying a square wave potential alternating between 2.7 V and 0.45 V vs Hg/HgSO₄at a frequency of 1 kHz for 30-60 min. Subsequent reduction of this Au₂O₃layer results in a Au electrode with greatly improved CO₂reduction activity and resistance to catalyst deactivation. Similarly, growth of a silver oxide on silver electrodes by application of a square wave potential routine, followed by electrochemical reduction, results in an Ag electrode with greatly improved CO₂reduction activity and resistance to catalyst deactivation.
FIG. 11 is a high level flow chart of another embodiment of the invention. In this embodiment, a cathode with a catalyst metal is provided (step 1104). A metal oxide coating is formed on the catalyst metal (step 1108). The metal oxide coating and the catalyst metal form a metal and metal oxide coating, which may comprise a metal oxide coating over a metal coating or a single coating with both metal oxide particles and metal particles. An anode is spaced apart from the cathode (step 1112). An ionic transport is provided between the anode and cathode (step 1116). The cathode is exposed to CO and H₂O (step 1120). The anode is exposed to H₂O (step 1124). A voltage is provided between the cathode and anode (step 1128). The voltage causes CO and H₂O to be reduced to CH₃CH₂OH.
In a specific embodiment of the invention, the cathode is formed by providing a conductive substrate (step 1104) with a catalyst metal coating (step 1108). In this example, the conductive substrate is steel. The metal coating is copper. The conductive substrate may be in the form of a net over which the metal coating is applied. In other embodiments, the conductive substrate and metal coating may be a single piece of the same material, such as a copper wire. In such a case, the metal coating may be considered an outer layer of the metal substrate.
A metal oxide coating is formed on the catalyst metal (step 1108). In this example, part of the copper catalyst metal coating is formed into copper oxide by heating the cathode to at least 300° C. for at least 15 minutes. Preferably, the metal oxide coating is thicker than a native oxide layer. For example, the metal oxide coating has a thickness of at least twice the thickness of a native metal oxide layer. More preferably, the metal oxide coating is at least 50 nm thick. In this example the copper catalyst metal coating and the metal oxide coating form a metal and metal oxide coating.
An anode is spaced apart from the cathode (step 1112). FIG. 12 is a schematic view of an electrolyzer 1200 that may be used in an embodiment of the invention. An anode is formed by a conductive anode substrate 1204 covered with an anode material 1208. In this example, the anode material 1208 is nickel. An anode electrolyte compartment 1212 is adjacent to the anode and holds an anode electrolyte. The anode electrolyte is provided from an anode electrolyte source 1216, which may continuously circulate anode electrolyte through the anode electrolyte compartment 1212. A cathode electrolyte compartment 1220 holds a cathode electrolyte. The cathode electrolyte is provided from a cathode electrolyte source 1224, which may continuously circulate cathode electrolyte through the cathode electrolyte compartment 1220. In this embodiment, the cathode electrolyte flows to a product collector 1244 where the solution-phase products are collected. A separator 1228 is placed between the anode electrolyte compartment 1212 and the cathode electrolyte compartment 1220. The separator 1228 may be a porous fit or membrane that may allow certain ions to pass through the separator 1228. As described above, a cathode comprising a conductive substrate 1230 with an oxidized cathode layer 1232 forms a cathode adjacent to the cathode electrolyte compartment 1220. In this embodiment, a gas chamber 1236 is placed on the backside of the cathode. A CO source 1240 provides a flow of CO into the gas chamber 1236. The product collector 1244 collects products and unused CO from the gas chamber 1236. Product in the product collector 1244 may be isolated and the remaining CO may be recycled back to the CO source 1240. A voltage source 1248, such as a battery, provides a voltage between the anode and cathode.
In operation, the anode electrolyte source 1216 flows electrolyte through the anode electrolyte compartment 1212. The cathode electrolyte source 1224 flows electrolyte through the cathode electrolyte compartment 1220. In this example, the electrolyte is KOH in an aqueous solution. CO is flowed from the CO source 1240 into the gas chamber 1236. The voltage source 1248 applies a positive voltage to the anode substrate 1204 and a negative voltage to the cathode substrate 1230 with the anode connected to a positive terminal and the cathode connected to a negative terminal. The process provides electrolysis of the CO. Various chemical reactions may occur during the electrolysis of CO, depending on the metal cathode and other factors. If the reduction uses an acidic aqueous solution for ion transport, in one embodiment, the following reaction occurs: 2CO+8e⁻+8H⁺→CH₃CH₂OH+H₂O. If the reduction uses a basic aqueous solution for ion transport, in another embodiment, the following reaction occurs: 2CO+8e⁻+7H₂O→CH₃CH₂OH+8OH⁻. Since the product is CH₃CH₂OH, may be produced in liquid phase, the product may diffuse through the conductive substrate 1230 and the oxidized cathode layer 1232 to the cathode electrolyte compartment 1220. In such a case, the product collector 1244 would need to remove the product from the cathode electrolyte.
In one embodiment, the product collector 1044 for a CO₂reduction system may provide CO for the CO source 1240 for the CO reduction system. In another embodiment, another source of CO may be used. In another embodiment, a source of a mixture of CO and CO₂may provide both CO and CO₂to a reduction system. In some embodiments, the pressure of the CO from the CO source 1240 is provided at a pressure greater than 1 atm. The higher pressure increases the solubility of CO in an aqueous solution. The use of an oxide-derived Cu catalyst in embodiments of the invention proved CO reduction with a high energetic efficiency without requiring H₂. In another embodiment of the invention, CO is converted to acetate according to the equation 2CO+4e⁻+3H⁺→CH₃CO₂ ⁻. In another embodiment of the invention, CO is converted to ethylene according to the equation 2CO+8e⁻+8H⁺→C₂H₄+2H₂O. In other embodiments, the electrolytic reduction reduces CO to other hydrocarbons or alcohols. In other embodiments, the electrolytic reduction reduces CO₂to hydrocarbons or alcohols.
While this invention has been described in terms of several preferred embodiments, there are alterations, permutations, modifications and various substitute equivalents, which fall within the scope of this invention. It should also be noted that there are many alternative ways of implementing the methods and apparatuses of the present invention. It is therefore intended that the following appended claims be interpreted as including all such alterations, permutations, modifications, and various substitute equivalents as fall within the true spirit and scope of the present invention.

Claims

What is claimed is:

1. A method for electrochemically reducing CO, comprising:

providing a cathode, wherein the cathode comprises a conductive substrate with a catalyst of a metal and a metal oxide based coating on a side of the cathode;

providing an anode spaced apart from the cathode;

providing an ionic transport between the anode and cathode;

exposing the cathode to CO and H₂O;

exposing the anode to H₂O; and

providing a voltage between the cathode and anode.

2. The method, as recited in claim 1, wherein the metal oxide is copper oxide.

3. The method, as recited in claim 2, wherein the metal oxide is thicker than the native oxide.

4. The method, as recited in claim 3, wherein the providing the cathode comprises:

providing a conductive substrate with a metal coating; and

providing on the conductive substrate a metal oxide coating that is thicker than a native oxide layer by either annealing the metal coating, electrochemically oxidizing the metal coating, chemically oxidizing the metal coating or depositing a metal oxide layer.

5. The method, as recited in claim 4, further comprising reducing metal oxide in the metal and metal oxide based coating to the metal 0 oxidation state.

6. The method, as recited in claim 5, where the metal oxide in the metal and metal oxide based coating has a thickness that is greater than 50 nm.

7. The method, as recited in claim 1, wherein the metal oxide and metal are of the same metal material.

8. The method, as recited in claim 1, wherein the metal and metal oxide containing coating provide a metal and metal oxide interface.

9. The method, as recited in claim 1, wherein the exposing the cathode to CO and H₂O, comprises:

exposing a first side of the cathode to H₂O; and

flowing CO past a second side of the cathode.

10. The method, as recited in claim 1, wherein the providing the cathode, comprises:

providing a conductive substrate with a metal coating; and

applying an anodic square wave potential to the metal coating to form an oxide layer.

11. The method, as recited in claim 1, wherein the metal coating is copper or copper alloy.

12. The method, as recited in claim 1, wherein the ionic transport is an aqueous basic solution.

13. A method for electrochemically reducing CO, comprising:

providing on a cathode a coating formed by heating a metal layer of the cathode in air, electrochemically oxidizing the metal layer of the cathode, chemically oxidizing the metal layer or by a metal oxide deposition to form a metal and metal oxide interface;

providing an anode spaced apart from the cathode;

providing an ionic transport between the anode and cathode;

exposing the coating to CO and H₂O;

exposing the anode to H₂O; and

providing a voltage between the cathode and anode.

14. The method, as recited in claim 13, wherein the cathode is copper and the coating is formed by heating the cathode to a temperature of at least 500° C. for at least 15 minutes.

15. The method, as recited in claim 13, wherein the cathode is copper and the coating is formed by heating the cathode to a temperature of at least 300° C. for at least 15 minutes.

16. The method, as recited in claim 13, further comprising reducing the metal oxide to metal.

17. The method, as recited in claim 13, where the metal oxide has a thickness that is greater than 50 nm.

18. The method, as recited in claim 13, where the metal oxide has a thickness that is greater than twice a thickness of a native oxide layer.

19. The method, as recited in claim 13, wherein the providing on a cathode a coating, comprises applying an anodic square wave potential to the metal layer to form an oxide layer.

20. The method, as recited in claim 13, wherein the metal layer is copper or copper alloy.

21. The method, as recited in claim 13, wherein the metal oxide is copper oxide.

22. The method, as recited in claim 13, wherein the ionic transport is an aqueous basic solution.

23. An apparatus, for electrochemically reducing CO, comprising:

an anode;

an oxidized cathode spaced apart from the anode;

a chamber for exposing the anode and oxidized cathode to at least one electrolyte adjacent to the anode and oxidized cathode;

a gas chamber for exposing the oxidized cathode to CO adjacent to the oxidized cathode; and

a CO source for providing CO to the gas chamber, connected to the gas chamber.

24. The apparatus, as recited in claim 23, wherein the oxidized cathode comprises:

a conductive substrate; and

an oxidized layer over the conductive substrate.

25. The apparatus, as recited in claim 24, wherein the oxidized layer, comprises:

a metal layer formed over the conductive substrate; and

a metal oxide layer formed over the conductive substrate and forming a metal layer metal oxide layer interface.

26. The apparatus, as recited in claim 25, wherein the oxidized layer is subsequently reduced.

27. The apparatus, as recited in claim 23, wherein the oxidized cathode comprises a metal layer that has been oxidized using an anodic square wave potential.

28. The apparatus, as recited in claim 23, wherein the metal layer is copper or copper alloy.

29. The apparatus, as recited in claim 23, wherein the metal oxide layer is copper oxide.