US20150020999A1 - Heat exchanger - Google Patents
Heat exchanger Download PDFInfo
- Publication number
- US20150020999A1 US20150020999A1 US14/371,024 US201214371024A US2015020999A1 US 20150020999 A1 US20150020999 A1 US 20150020999A1 US 201214371024 A US201214371024 A US 201214371024A US 2015020999 A1 US2015020999 A1 US 2015020999A1
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- United States
- Prior art keywords
- chamber
- panel
- fluid
- heat exchanger
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
Definitions
- the present invention relates to a heat exchanger and particularly, but not exclusively to a heat exchanger for exchanging heat with a medium, across a substantially planar surface.
- a heat pipe is a hermetically sealed, evacuated tube comprising a working fluid in both the liquid and vapour phase.
- the liquid turns to vapour upon absorbing the latent heat of vaporization.
- the hot vapour subsequently passes to the cooler end of the tube where it condenses and gives out the latent heat to the tube.
- the condensed liquid then flows back to the hot end of the tube and the vaporization-condensation cycle repeats. Since the latent heat of vaporization is usually very large, considerable quantities of heat can be transferred along the tube and a substantially uniform temperature distribution can be achieved along the heat pipe.
- the exchanger 10 comprises a plurality of heat pipes 11 which are coupled along a proximal portion 11 a thereof to a rear face of a panel 12 .
- the heat pipes 11 are arranged in a substantially parallel configuration and extend along the length of the panel 12 .
- the panel 12 is arranged to absorb heat from the planar surface (not shown) and the heat absorbed is communicated to the proximal portion 11 a of the heat pipes 11 which causes the fluid (not shown) disposed therein to turn to a vapour.
- the distal portion 11 b of the pipes 11 are arranged to extend within a flow duct 13 along which a cooling fluid (not shown) is arranged to pass, so that the vapour which passes to the distal portion 11 b of the pipes 11 can condense.
- the condensate, namely the cooled working fluid, can subsequently return to the proximal portion 11 a of the heat pipes 11 for further absorption of heat from the panel 12 .
- the cooling fluid (not shown) is arranged to extract the heat absorbed by the working fluid so that the heat pipes 11 , and in particular, the fluid disposed within the heat pipes 11 can continue to absorb heat.
- a problem with this arrangement is that the temperature of the working fluid within the heat pipes 11 rises during use, which reduces the ability of the fluid to absorb further heat from the panel 12 . Furthermore, it is often difficult to separately seal the distal portion 11 b of each heat pipe 11 to the flow duct 13 , with the result that the cooling fluid can leak out of the duct.
- a heat exchanger for exchanging heat with a medium across a substantially planar surface, the exchanger comprising:
- circuit provides for a separate return path, namely the duct, for the fluid so that thermal state of the fluid can recover for further heat exchange with the panel.
- a separate return path namely the duct
- the fluid so that thermal state of the fluid can recover for further heat exchange with the panel.
- the heat is transferred to the fluid within the passages.
- the absorbed heat is arranged to cause the fluid to evaporate and this evaporate is arranged to pass to the second chamber where it can condense.
- the condensed, i.e. cooled, fluid can then return to the first chamber along the duct for subsequent heat exchange with the panel.
- the panel is preferably arranged to exchange heat with the fluid disposed within the passages and the passages are preferably arranged to extend within the panel.
- the disposition of the passages within the panel provides for an intimate contact of the side walls of the passage and thus the fluid with the panel and maximises the surface area of the passage which is in contact with the panel. It is also found that the formation of the passages within the panel facilitates an improved sealing of the chambers to the passages, compared with the prior art, since the chambers are only required to form a single seal and with a planar surface, namely the panel, as opposed to a number of separate seals to each passage.
- the panel preferably comprises a heat exchanging surface which is arranged to extend adjacent the medium.
- the first and second chambers are arranged to extend away from the panel from the side opposite the heat exchanging surface, and the duct is preferably arranged to extend between the first and second chambers in spaced relation to the panel. This minimises the exposure of the chambers and particularly the duct to the thermal state, for example the heated state, of the panel.
- the first chamber is arranged to extend at a vertical height which is below the second chamber, such that the fluid can pass from the second chamber to the first chamber along the duct, under the influence of gravity.
- At least one chamber of the heat exchanger preferably comprises a cooler for cooling the fluid disposed within the respective chamber.
- the cooler preferably comprises a cooling duct which extends along the chamber and which is arranged to communicate a cooling fluid between an inlet and an outlet of the cooling duct
- the cooling duct is preferably arranged in thermal communication with the fluid within the respective chamber.
- the exchanger preferably comprises a cooler associated with the first and second chambers.
- the coolers preferably separately comprise a cooling duct which extends along the respective chamber.
- the cooling ducts which extend along each chamber are arranged to communicate a cooling fluid between an inlet and an outlet of the respective duct.
- the outlet of one cooling duct is coupled to the inlet of the other cooling duct.
- the cooler or coolers are thus arranged to reduce the working temperature of the fluid within the chambers and in this situation, provide for an increased capacity for heat absorption from the panel.
- FIG. 1 a is rear, sectional view of a known heat exchanger, for exchanging heat with a substantially planar surface
- FIG. 1 b is a plan view of the heat exchanger illustrated in figure la, taken along line A-A;
- FIG. 2 is a view of the rear of a heat exchanger according to an embodiment of the present invention.
- FIG. 3 is a side view of the heat exchanger illustrated in FIG. 2 ;
- FIG. 4 is a sectional view of the heat exchanger illustrated in FIG. 2 , taken along line B-B;
- FIG. 5 is a plan view of the panel illustrated in FIG. 2 , taken along line C-C;
- FIG. 6 a is a view of the rear of a heat exchanger according to a further embodiment of the present invention.
- FIG. 6 b is a side view of the heat exchanger illustrated in FIG. 6 a.
- the exchanger 100 for facilitating the exchange of heat with a planar surface (not shown), such as a wall of a heated body, a casing of a refrigeration unit, circuit boards and the like.
- the exchanger 100 comprises a substantially planar, heat exchanging panel 101 which is arranged to form a thermal contact along a front surface 101 a thereof with the surface with which heat exchange is desirable.
- the planar form of the panel 101 is arranged to conform with the planar surface (not shown) to maximise the contact area with the planar surface and thus the exchange of heat therewith.
- the exchanger 100 further comprises a fluid transfer circuit for circulating a fluid 102 disposed therein, around the exchanger 100 .
- the circuit comprises a plurality of passages 103 which are arranged to extend along the panel 101 in a direction which is within the plane of the panel 101 .
- the passages 103 may be formed integrally with the panel 101 by casting in a mould for example.
- the passages 103 may extend along a rear surface 101 b of the panel 101 , in thermal contact therewith, although the skilled reader will recognise that this may reduce the thermal exchange with the fluid 102 , compared with passages 103 which extend within the panel 101 .
- the circuit further comprises a first and second chamber 104 , 105 , disposed at a first and second end of the panel 101 , respectively.
- the passages 103 are arranged to extend in a substantially parallel orientation, between the first end of the panel 101 and the second end of the panel 101 , which is substantially opposite the first end.
- Each passage 103 is coupled to the first and second chamber 104 , 105 by a respective transfer duct 106 which is orientated substantially perpendicular to the respective passage 103 and which is arranged to extend rearwardly of the panel 101 toward the respective chamber 104 , 105 .
- the first and second chambers 104 , 105 are disposed upon the rear face 101 b of the panel 101 and extend along the panel 101 in a direction which is substantially perpendicular to the passages 103 .
- the circuit further comprises a duct 107 , which extends between the first and second chambers 104 , 105 , substantially perpendicular thereto and in spaced relation to the panel 101 .
- the heat exchanger 100 is orientated so that the first chamber 104 is arranged at a vertical height which is below the second chamber 105 and the duct 107 is arranged to extend from an underside of the second chamber 105 to an upper region of the first chamber 104 .
- the second chamber 105 comprises a substantially circular cross-sectional shape so that any fluid 102 which passes to the second chamber 105 can settle at a lower region thereof, proximate the duct 107 , and pass under gravity back to the first chamber 104 .
- the front surface 101 a of the panel 101 is first disposed in thermal contact with the receptacle (not shown). This contact may be enhanced using a thermal paste (not shown) as an interface medium between the panel 101 and the receptacle (not shown), for example.
- the panel 101 is orientated with the first chamber 104 disposed at a vertical height below the second chamber 105 and in an idle state in which no heat exchange takes place, the fluid 102 within the circuit is arranged to fill the first chamber 104 and extend partly along the passages 103 and the duct 107 .
- the first chamber 104 serves as a reservoir for the fluid 102 .
- the panel 101 absorbs heat from the receptacle (not shown), which may be via conduction, convection, radiation or a combination thereof, the heat will become conducted to the passages 103 and thus the fluid 102 within the passages 103 .
- the fluid 102 in the passages 103 Upon absorbing the heat from the panel 101 , the fluid 102 in the passages 103 is arranged to turn to a vapour and the vapour subsequently passes along the passages 103 to the second chamber 105 disposed at the rear 101 b of the panel 100 , via the respective transfer ducts 106 , where it cools and condenses.
- the condensate subsequently collects in the chamber 105 and passes to the bottom of the chamber 105 into the duct 107 and becomes returned to the first chamber 104 .
- the spaced relation of the duct 107 from the panel 101 substantially insulates the duct 107 and the fluid 102 therein from the heat associated with the panel 101 , so that the fluid 102 within the duct 107 can recover to its original thermal state for subsequent absorption of heat from the panel 101 .
- the second chamber 105 comprises a cooler (not shown) which is arranged to cool the fluid 102 within the circuit and in particular the condensate in the second chamber 105 .
- the cooler comprises a cooling duct (not shown) which extends along the second chamber 105 and which comprises an inlet 108 disposed at one end of the chamber 105 and an outlet 109 disposed at an opposite end of the chamber 105 .
- the cooling duct (not shown) is arranged to communicate a cooling fluid (not shown) between the inlet 108 and the outlet 109 thereof, within the chamber 105 , so that the cooling fluid (not shown) can absorb heat associated with the fluid 102 within the chamber 105 and thus cool the fluid 102 within the chamber 105 .
- the first and second chamber 104 , 105 separately comprise a cooler (not shown) which are separately arranged to cool the fluid 102 within the first and second chambers 104 , 105 .
- the coolers (not shown) separately comprise a cooling duct (not shown) which are arranged to communicate a cooling fluid (not shown) between an inlet 108 a, 108 b and an outlet 109 a, 109 b thereof, within the respective chamber 104 , 105 , so that the cooling fluid (not shown) can absorb heat associated with the fluid 102 within the respective chamber 104 , 105 and thus coot the fluid 102 .
- the outlet 109 a of the cooling duct within the first chamber 104 is coupled to the inlet 108 b of the cooling duct (not shown) within the second chamber 105 via a conduit 110 , so that the cooling fluid 102 can circulate from the cooler (not shown) disposed within the first chamber 104 to the cooler (not shown) disposed within the second chamber 105 .
- the coolers are arranged to cool the fluid 102 within the fluid transfer circuit to reduce the working temperature of the fluid 102 and thus increase the capacity of the fluid to absorb heat from the panel 101 . This therefore provides for an improved heat exchange with the receptacle (not shown), for example.
- the heat exchanger provides for an improved heat exchanger with a planar surface.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A heat exchanger (100) is disclosed for exchanging heat with a medium across a substantially planar surface. The exchanger (100) comprises: a heat exchanging panel (101); a fluid circuit comprising a first chamber (104) disposed at a first end of the panel (101), a second chamber (105) disposed at a second end of the panel (101), a plurality of passages (103) which extend along the panel between the first and second chambers (104,105), and a duct (107) which extends between the first and second chamber (104,105); a fluid disposed within the circuit; wherein, the plurality of passages (103) are arranged in thermal communication with the panel (101) and are arranged to communicate the fluid from the first chamber (104) to the second chamber (15), and the duct (107) is arranged to communicate fluid from the second chamber (105) to the first chamber (104).
Description
- The present invention relates to a heat exchanger and particularly, but not exclusively to a heat exchanger for exchanging heat with a medium, across a substantially planar surface.
- A heat pipe is a hermetically sealed, evacuated tube comprising a working fluid in both the liquid and vapour phase. When one end of the tube is heated the liquid turns to vapour upon absorbing the latent heat of vaporization. The hot vapour subsequently passes to the cooler end of the tube where it condenses and gives out the latent heat to the tube. The condensed liquid then flows back to the hot end of the tube and the vaporization-condensation cycle repeats. Since the latent heat of vaporization is usually very large, considerable quantities of heat can be transferred along the tube and a substantially uniform temperature distribution can be achieved along the heat pipe.
- Referring to
FIG. 1 of the drawings, there is illustrated a known heat pipeheat exchanging arrangement 10 for exchanging heat, and more particularly absorbing heat from a planar surface (not shown). Theexchanger 10 comprises a plurality ofheat pipes 11 which are coupled along aproximal portion 11 a thereof to a rear face of apanel 12. Theheat pipes 11 are arranged in a substantially parallel configuration and extend along the length of thepanel 12. Thepanel 12 is arranged to absorb heat from the planar surface (not shown) and the heat absorbed is communicated to theproximal portion 11 a of theheat pipes 11 which causes the fluid (not shown) disposed therein to turn to a vapour. - The
distal portion 11 b of thepipes 11 are arranged to extend within aflow duct 13 along which a cooling fluid (not shown) is arranged to pass, so that the vapour which passes to thedistal portion 11 b of thepipes 11 can condense. The condensate, namely the cooled working fluid, can subsequently return to theproximal portion 11 a of theheat pipes 11 for further absorption of heat from thepanel 12. In this respect, the cooling fluid (not shown) is arranged to extract the heat absorbed by the working fluid so that theheat pipes 11, and in particular, the fluid disposed within theheat pipes 11 can continue to absorb heat. - A problem with this arrangement however, is that the temperature of the working fluid within the
heat pipes 11 rises during use, which reduces the ability of the fluid to absorb further heat from thepanel 12. Furthermore, it is often difficult to separately seal thedistal portion 11 b of eachheat pipe 11 to theflow duct 13, with the result that the cooling fluid can leak out of the duct. - We have now devised an improved heat exchanger.
- In accordance with the present invention, there is provided a heat exchanger for exchanging heat with a medium across a substantially planar surface, the exchanger comprising:
-
- a heat exchanging panel;
- a fluid circuit comprising a first chamber disposed at a first end of the panel, a second chamber disposed at a second end of the panel, a plurality of passages which extend along the panel between the first and second chambers, and a duct which extends between the first and second chamber; and,
- a fluid disposed within the circuit; wherein,
- the plurality of passages are arranged in thermal communication with the panel and are arranged to communicate the fluid from the first chamber to the second chamber, and the duct is arranged to communicate fluid from the second chamber to the first chamber.
- Advantageously, circuit provides for a separate return path, namely the duct, for the fluid so that thermal state of the fluid can recover for further heat exchange with the panel. in this respect, for situations in which the panel absorbs heat, then the heat is transferred to the fluid within the passages. The absorbed heat is arranged to cause the fluid to evaporate and this evaporate is arranged to pass to the second chamber where it can condense. The condensed, i.e. cooled, fluid can then return to the first chamber along the duct for subsequent heat exchange with the panel.
- The panel is preferably arranged to exchange heat with the fluid disposed within the passages and the passages are preferably arranged to extend within the panel. The disposition of the passages within the panel provides for an intimate contact of the side walls of the passage and thus the fluid with the panel and maximises the surface area of the passage which is in contact with the panel. It is also found that the formation of the passages within the panel facilitates an improved sealing of the chambers to the passages, compared with the prior art, since the chambers are only required to form a single seal and with a planar surface, namely the panel, as opposed to a number of separate seals to each passage.
- The panel preferably comprises a heat exchanging surface which is arranged to extend adjacent the medium. Preferably, the first and second chambers are arranged to extend away from the panel from the side opposite the heat exchanging surface, and the duct is preferably arranged to extend between the first and second chambers in spaced relation to the panel. This minimises the exposure of the chambers and particularly the duct to the thermal state, for example the heated state, of the panel.
- Preferably, in use, the first chamber is arranged to extend at a vertical height which is below the second chamber, such that the fluid can pass from the second chamber to the first chamber along the duct, under the influence of gravity.
- In an embodiment of the present invention, at least one chamber of the heat exchanger preferably comprises a cooler for cooling the fluid disposed within the respective chamber. The cooler preferably comprises a cooling duct which extends along the chamber and which is arranged to communicate a cooling fluid between an inlet and an outlet of the cooling duct The cooling duct is preferably arranged in thermal communication with the fluid within the respective chamber.
- In a further embodiment of the present invention, the exchanger preferably comprises a cooler associated with the first and second chambers. The coolers preferably separately comprise a cooling duct which extends along the respective chamber. Preferably, the cooling ducts which extend along each chamber are arranged to communicate a cooling fluid between an inlet and an outlet of the respective duct. Preferably, the outlet of one cooling duct is coupled to the inlet of the other cooling duct. The cooler or coolers are thus arranged to reduce the working temperature of the fluid within the chambers and in this situation, provide for an increased capacity for heat absorption from the panel.
- Embodiments of the present invention will now be described by way of example only and with reference to the accompanying drawings, in which:
-
FIG. 1 a is rear, sectional view of a known heat exchanger, for exchanging heat with a substantially planar surface; -
FIG. 1 b is a plan view of the heat exchanger illustrated in figure la, taken along line A-A; -
FIG. 2 is a view of the rear of a heat exchanger according to an embodiment of the present invention; -
FIG. 3 is a side view of the heat exchanger illustrated inFIG. 2 ; -
FIG. 4 is a sectional view of the heat exchanger illustrated inFIG. 2 , taken along line B-B; -
FIG. 5 is a plan view of the panel illustrated inFIG. 2 , taken along line C-C; -
FIG. 6 a is a view of the rear of a heat exchanger according to a further embodiment of the present invention; and, -
FIG. 6 b is a side view of the heat exchanger illustrated inFIG. 6 a. - Referring to the drawings and initially
FIGS. 2-5 , there is illustrated aheat exchanger 100 according to an embodiment of the present invention for facilitating the exchange of heat with a planar surface (not shown), such as a wall of a heated body, a casing of a refrigeration unit, circuit boards and the like. Theexchanger 100 comprises a substantially planar,heat exchanging panel 101 which is arranged to form a thermal contact along afront surface 101 a thereof with the surface with which heat exchange is desirable. The planar form of thepanel 101 is arranged to conform with the planar surface (not shown) to maximise the contact area with the planar surface and thus the exchange of heat therewith. - The
exchanger 100 further comprises a fluid transfer circuit for circulating afluid 102 disposed therein, around theexchanger 100. The circuit comprises a plurality ofpassages 103 which are arranged to extend along thepanel 101 in a direction which is within the plane of thepanel 101. in this respect, thepassages 103 may be formed integrally with thepanel 101 by casting in a mould for example. in an alternative embodiment however, thepassages 103 may extend along arear surface 101 b of thepanel 101, in thermal contact therewith, although the skilled reader will recognise that this may reduce the thermal exchange with thefluid 102, compared withpassages 103 which extend within thepanel 101. - The circuit further comprises a first and
104, 105, disposed at a first and second end of thesecond chamber panel 101, respectively. Thepassages 103 are arranged to extend in a substantially parallel orientation, between the first end of thepanel 101 and the second end of thepanel 101, which is substantially opposite the first end. Eachpassage 103 is coupled to the first and 104, 105 by asecond chamber respective transfer duct 106 which is orientated substantially perpendicular to therespective passage 103 and which is arranged to extend rearwardly of thepanel 101 toward the 104, 105. In this respect, the first andrespective chamber 104, 105 are disposed upon thesecond chambers rear face 101 b of thepanel 101 and extend along thepanel 101 in a direction which is substantially perpendicular to thepassages 103. - The circuit further comprises a
duct 107, which extends between the first and 104, 105, substantially perpendicular thereto and in spaced relation to thesecond chambers panel 101. In use, theheat exchanger 100 is orientated so that thefirst chamber 104 is arranged at a vertical height which is below thesecond chamber 105 and theduct 107 is arranged to extend from an underside of thesecond chamber 105 to an upper region of thefirst chamber 104. Thesecond chamber 105 comprises a substantially circular cross-sectional shape so that anyfluid 102 which passes to thesecond chamber 105 can settle at a lower region thereof, proximate theduct 107, and pass under gravity back to thefirst chamber 104. - In situations where the
exchanger 100 is used to extract heat from a medium, such as a heated receptacle (not shown), to cool the receptacle, thefront surface 101 a of thepanel 101 is first disposed in thermal contact with the receptacle (not shown). This contact may be enhanced using a thermal paste (not shown) as an interface medium between thepanel 101 and the receptacle (not shown), for example. Thepanel 101 is orientated with thefirst chamber 104 disposed at a vertical height below thesecond chamber 105 and in an idle state in which no heat exchange takes place, thefluid 102 within the circuit is arranged to fill thefirst chamber 104 and extend partly along thepassages 103 and theduct 107. In this respect, thefirst chamber 104 serves as a reservoir for thefluid 102. As thepanel 101 absorbs heat from the receptacle (not shown), which may be via conduction, convection, radiation or a combination thereof, the heat will become conducted to thepassages 103 and thus the fluid 102 within thepassages 103. - Upon absorbing the heat from the
panel 101, the fluid 102 in thepassages 103 is arranged to turn to a vapour and the vapour subsequently passes along thepassages 103 to thesecond chamber 105 disposed at the rear 101 b of thepanel 100, via therespective transfer ducts 106, where it cools and condenses. The condensate subsequently collects in thechamber 105 and passes to the bottom of thechamber 105 into theduct 107 and becomes returned to thefirst chamber 104. The spaced relation of theduct 107 from thepanel 101 substantially insulates theduct 107 and the fluid 102 therein from the heat associated with thepanel 101, so that the fluid 102 within theduct 107 can recover to its original thermal state for subsequent absorption of heat from thepanel 101. - In an embodiment of the present invention, the
second chamber 105 comprises a cooler (not shown) which is arranged to cool the fluid 102 within the circuit and in particular the condensate in thesecond chamber 105. The cooler comprises a cooling duct (not shown) which extends along thesecond chamber 105 and which comprises aninlet 108 disposed at one end of thechamber 105 and anoutlet 109 disposed at an opposite end of thechamber 105. The cooling duct (not shown) is arranged to communicate a cooling fluid (not shown) between theinlet 108 and theoutlet 109 thereof, within thechamber 105, so that the cooling fluid (not shown) can absorb heat associated with the fluid 102 within thechamber 105 and thus cool the fluid 102 within thechamber 105. - In a further embodiment of the present invention as illustrated in
FIGS. 6 a and 6 b of the drawings, the first and 104, 105 separately comprise a cooler (not shown) which are separately arranged to cool the fluid 102 within the first andsecond chamber 104, 105. The coolers (not shown) separately comprise a cooling duct (not shown) which are arranged to communicate a cooling fluid (not shown) between ansecond chambers 108 a, 108 b and aninlet 109 a, 109 b thereof, within theoutlet 104, 105, so that the cooling fluid (not shown) can absorb heat associated with the fluid 102 within therespective chamber 104, 105 and thus coot therespective chamber fluid 102. In this embodiment, theoutlet 109 a of the cooling duct within thefirst chamber 104 is coupled to theinlet 108 b of the cooling duct (not shown) within thesecond chamber 105 via a conduit 110, so that the coolingfluid 102 can circulate from the cooler (not shown) disposed within thefirst chamber 104 to the cooler (not shown) disposed within thesecond chamber 105. - The coolers (not shown) are arranged to cool the fluid 102 within the fluid transfer circuit to reduce the working temperature of the fluid 102 and thus increase the capacity of the fluid to absorb heat from the
panel 101. This therefore provides for an improved heat exchange with the receptacle (not shown), for example. - From the foregoing therefore, it is evident that the heat exchanger provides for an improved heat exchanger with a planar surface.
Claims (13)
1. A heat exchanger for exchanging heat with a medium across a substantially planar surface, the exchanger comprising:
a heat exchanging panel;
a fluid circuit comprising a first chamber disposed at a first end of the panel, a second chamber disposed at a second end of the panel, a plurality of passages which extend along the panel between the first and second chambers, and a duct which extends between the first and second chamber;
a fluid disposed within the circuit; wherein,
the plurality of passages are arranged in thermal communication with the panel and are arranged to communicate the fluid from the first chamber to the second chamber, and the duct is arranged to communicate fluid from the second chamber to the first chamber.
2. A heat exchanger according to claim 1 , wherein the panel is arranged to exchange heat with the fluid disposed within the passages.
3. A heat exchanger according to claim 1 , wherein the passages are arranged to extend within the panel.
4. A heat exchanger according to claim 1 , wherein the panel comprises a heat exchanging surface which is arranged to extend adjacent the medium.
5. A heat exchanger according to claim 1 , wherein the first and second chambers are arranged to extend away from the panel from the side opposite the heat exchanging surface.
6. A heat exchanger according to claim 1 , wherein the duct is arranged to extend between the first and second chambers in spaced relation to the panel.
7. A heat exchanger according to claim 1 , wherein the first chamber is arranged to extend at a vertical height which is below the second chamber, such that the fluid can pass from the second chamber to the first chamber along the duct, under the influence of gravity.
8. A heat exchanger according to claim 1 , wherein at least one chamber comprises a cooler for cooling the fluid disposed within the respective chamber.
9. A heat exchanger according to claim 8 , wherein the cooler comprises a cooling duct which is arranged to extend along the chamber and which is arranged to communicate a cooling fluid between an inlet and an outlet of the cooling duct.
10. A heat exchanger according to claim 9 , wherein the cooling duct is arranged to extend in thermal communication with the fluid within the respective chamber.
11. A heat exchanger according to any preceding claim 1 , wherein the first and second chamber comprises a cooler for cooling the fluid disposed therein.
12. A heat exchanger according to claim 11 , wherein the coolers separately comprise a cooling duct which is arranged to extend within the respective chamber.
13. A heat exchanger according to claim 12 , wherein the cooling ducts which extend within the respective chambers separately comprise an inlet and an outlet, and the outlet of one cooling duct is coupled to the inlet of the other cooling duct.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1200480.0A GB2498373B (en) | 2012-01-12 | 2012-01-12 | Heat exchanger |
| GB1200480.0 | 2012-01-12 | ||
| PCT/GB2012/053199 WO2013104884A1 (en) | 2012-01-12 | 2012-12-20 | Heat exchanger |
| GBPCT/GB2012/053199 | 2012-12-20 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/GB2012/053199 Continuation-In-Part WO2013104884A1 (en) | 2012-01-12 | 2012-12-20 | Heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20150020999A1 true US20150020999A1 (en) | 2015-01-22 |
Family
ID=45788821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/371,024 Abandoned US20150020999A1 (en) | 2012-01-12 | 2012-12-20 | Heat exchanger |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150020999A1 (en) |
| EP (1) | EP2802832B1 (en) |
| ES (1) | ES2741474T3 (en) |
| GB (1) | GB2498373B (en) |
| WO (1) | WO2013104884A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018230349A1 (en) * | 2017-06-16 | 2018-12-20 | 株式会社デンソー | Cooler and thermosyphon |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2527338B (en) * | 2014-06-19 | 2018-11-07 | ECONOTHERM UK Ltd | Heat transfer apparatus |
| WO2016086504A1 (en) * | 2014-12-02 | 2016-06-09 | 北京空间飞行器总体设计部 | Vacuum thermal performance test device for two-phase fluid loop, and method |
| NO341387B1 (en) * | 2015-04-24 | 2017-10-30 | Goodtech Recovery Tech As | Heat Tube With Channel Structure |
| FR3075350B1 (en) * | 2017-12-18 | 2019-11-08 | Larth Havlu Radyatör Sanayi Ve Ticaret Anonim Sirketi | HEAT PUMP RADIATOR WITH UNIFORM FACIAL HEAT DISTRIBUTION |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4599994A (en) * | 1983-04-15 | 1986-07-15 | Cole S Warren | Thermosiphon solar water heater having freeze rupture protection |
| US6220337B1 (en) * | 1998-04-27 | 2001-04-24 | Shi-Li Chen | Heat pipe circuit type thermal battery |
| US20080128120A1 (en) * | 2006-12-01 | 2008-06-05 | Chen Guo | Fin-pipe shaped radiator specially adapted to a semiconductor chilling unit and the method of making same |
| US20090293461A1 (en) * | 2006-06-08 | 2009-12-03 | Denso Corporation | Exhaust Heat Recovery Device |
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| US3933198A (en) * | 1973-03-16 | 1976-01-20 | Hitachi, Ltd. | Heat transfer device |
| JPS58198648A (en) * | 1982-05-13 | 1983-11-18 | Matsushita Electric Ind Co Ltd | Loop type heat pipe system solar heat water heater |
| FI68462C (en) * | 1983-04-12 | 1985-09-10 | Heinz Ekman | RADIATOR |
| DE9101673U1 (en) * | 1991-02-14 | 1991-06-06 | Peperle, Wolfram, Dr., 2991 Börger | Integrated heat exchanger for solar collectors |
| JPH1137678A (en) * | 1997-07-22 | 1999-02-12 | Showa Alum Corp | Heat pipe radiator |
| US6810947B2 (en) * | 2001-01-16 | 2004-11-02 | Denso Corporation | Cooling device |
| DE10308993A1 (en) * | 2003-03-01 | 2004-09-09 | Wittenberger, Ernoe, Dipl.-Ing. | Heat pipe heat exchanger construction for heat pipe solar collectors comprises a corrugated sheet steel absorber surrounded by a sealing plate and a pipe crossing channels while maintaining closed inner chambers |
| EP2246654B1 (en) * | 2009-04-29 | 2013-12-11 | ABB Research Ltd. | Multi-row thermosyphon heat exchanger |
| WO2010145074A1 (en) * | 2009-06-17 | 2010-12-23 | 华为技术有限公司 | Heat dissipation device and radio frequency module with same |
| KR100970861B1 (en) * | 2009-10-21 | 2010-07-16 | 유한회사 지오선 | Flat type solar heat collector having double vacuum tube |
-
2012
- 2012-01-12 GB GB1200480.0A patent/GB2498373B/en active Active
- 2012-12-20 ES ES12822981T patent/ES2741474T3/en active Active
- 2012-12-20 US US14/371,024 patent/US20150020999A1/en not_active Abandoned
- 2012-12-20 EP EP12822981.2A patent/EP2802832B1/en active Active
- 2012-12-20 WO PCT/GB2012/053199 patent/WO2013104884A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4599994A (en) * | 1983-04-15 | 1986-07-15 | Cole S Warren | Thermosiphon solar water heater having freeze rupture protection |
| US6220337B1 (en) * | 1998-04-27 | 2001-04-24 | Shi-Li Chen | Heat pipe circuit type thermal battery |
| US20090293461A1 (en) * | 2006-06-08 | 2009-12-03 | Denso Corporation | Exhaust Heat Recovery Device |
| US20080128120A1 (en) * | 2006-12-01 | 2008-06-05 | Chen Guo | Fin-pipe shaped radiator specially adapted to a semiconductor chilling unit and the method of making same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018230349A1 (en) * | 2017-06-16 | 2018-12-20 | 株式会社デンソー | Cooler and thermosyphon |
| JP2019002642A (en) * | 2017-06-16 | 2019-01-10 | 株式会社デンソー | Cooler and thermosiphon |
| CN110753822A (en) * | 2017-06-16 | 2020-02-04 | 株式会社电装 | Cooler and thermosyphon |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2802832B1 (en) | 2019-05-08 |
| WO2013104884A1 (en) | 2013-07-18 |
| GB201200480D0 (en) | 2012-02-22 |
| ES2741474T3 (en) | 2020-02-11 |
| GB2498373A (en) | 2013-07-17 |
| EP2802832A1 (en) | 2014-11-19 |
| GB2498373B (en) | 2016-08-31 |
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Legal Events
| Date | Code | Title | Description |
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| AS | Assignment |
Owner name: ECONOTHERM UK LIMITED, UNITED KINGDOM Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FETCU, DUMITRU;REEL/FRAME:033258/0243 Effective date: 20120712 |
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| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |