US20140211573A1 - Memory for a voltage regulator circuit - Google Patents
Memory for a voltage regulator circuit Download PDFInfo
- Publication number
- US20140211573A1 US20140211573A1 US14/225,435 US201414225435A US2014211573A1 US 20140211573 A1 US20140211573 A1 US 20140211573A1 US 201414225435 A US201414225435 A US 201414225435A US 2014211573 A1 US2014211573 A1 US 2014211573A1
- Authority
- US
- United States
- Prior art keywords
- memory
- voltage
- supply voltage
- decoder
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/021—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in voltage or current generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/06—Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
- G11C7/08—Control thereof
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
Definitions
- the present invention relates to a data storage technology, and more particularly to a memory for a voltage regulator circuit, in which a supply voltage generated by the voltage regulator circuit is used as a programming voltage.
- Non-volatile memory is capable of storing data without being supplied with external electrical power. Because of having the feature of no external power consumption, the non-volatile memory is particularly applicable to be used in portable apparatuses.
- the non-volatile memory can have three operations: read, write and erase; wherein the write operation is also referred to as the program operation. Basically, the three operations of the non-volatile memory require respective different voltages. Because the non-volatile memory highly demands a more accurate programming voltage level while executing the program operation, the associated programming voltage is required to be much accurate accordingly.
- the present invention provides a memory, in which a supply voltage used as a programming voltage is generated.
- the memory avoids the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
- the present invention further provides a decoder for the memory, comprising an input terminal and a plurality of output terminals, the decoder being configured to have the output terminals thereof electrically coupled to the source lines.
- the present invention further provides a voltage regulator circuit for the memory, configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and a control signal, and consequently adjust the value of the supply voltage according to the feedback signal.
- An embodiment of the present invention provides a memory, which includes a memory array, a decoder and a voltage regulator circuit.
- the memory array includes a plurality of source lines and a plurality of memory units, and each of the source lines is electrically coupled to a respective group of memory units.
- the decoder includes an input terminal and a plurality of output terminals. The decoder is configured to have the output terminals thereof electrically coupled to the source lines, respectively.
- the voltage regulator circuit is configured to provide a supply voltage to the input terminal of the decoder and electrically coupled to the output terminals of the decoder.
- the voltage regulator circuit is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and a control signal, and consequently adjust the value of the supply voltage according to the feedback signal.
- the memory further includes a supply voltage switch electrically coupled between an output terminal of the voltage regulator circuit and the input terminal of the decoder and configured to receive the supply voltage and a predetermined voltage and consequently selectively output, according to a control command, either the supply voltage or the predetermined voltage to the input terminal of the decoder.
- control signal is generated according to a comparison result
- comparison result indicates the number of different bits existing between output data and input data of the memory array
- output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data
- the supply voltage generated by the voltage regulator circuit is used as a programming voltage. Because the voltage regulator circuit is electrically coupled to the output terminals of the decoder and is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and the control signal, and consequently adjust the value of the supply voltage according to the feedback signal of the voltage regulator circuit, the memory avoids the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
- FIG. 1 is a schematic view of a memory array in accordance with an embodiment of the present invention
- FIG. 2 is a schematic view illustrating an exemplified circuit structure of a comparison unit shown in FIG. 1 ;
- FIG. 3 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown in FIG. 1 ;
- FIG. 4 is a schematic view of a memory array in accordance with another embodiment of the present invention.
- FIG. 5 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown in FIG. 4 ;
- FIG. 6 is a schematic view of a memory array in accordance with still another embodiment of the present invention.
- FIG. 7 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown in FIG. 6 ;
- FIG. 8 is a schematic flow chart of an operation method of a supply voltage generation circuit in accordance with an embodiment of the present invention.
- FIG. 1 is a schematic view of a memory in accordance with an embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted for brevity.
- the memory 100 in this embodiment includes a data input/output interface 110 , a supply voltage generation circuit 120 , a supply voltage switch 160 , a decoder 170 and a memory array 180 .
- the memory array 180 includes a plurality of source lines 181 and a plurality of memory units 182 , and each of the source lines 181 is electrically coupled to a respective group of memory units 182 .
- the decoder 170 has an input terminal 171 and a plurality of output terminals 172 .
- the decoder 170 is configured to have the output terminals 172 thereof electrically coupled to the source lines 181 of the memory array 180 . According to the aforementioned description, it is understood that the decoder 170 is a source line decoder.
- the supply voltage switch 160 electrically coupled between an output terminal of the supply voltage generation circuit 120 and the input terminal 171 of the decoder 170 , is configured to receive a supply voltage PV 1 and a predetermined voltage PV 2 and consequently selectively output, according to a control command CM, either the supply voltage PV 1 or the predetermined voltage PV 2 to the input terminal 171 of the decoder 170 .
- the supply voltage PV 1 is used as a programming voltage
- the predetermined voltage PV 2 is used as, for example, a readout voltage.
- the supply voltage generation circuit 120 includes a comparison unit 130 , a voltage level control unit 140 and a voltage regulator circuit 150 .
- the comparison unit 130 is configured to compare the input data and the output data of the memory array 180 to each other and thereby generating a comparison result CR accordingly.
- the aforementioned output data are the storage data stored in a plurality of memory unit 182 of the memory array 180 processed by a program operation according to the aforementioned input data; and the comparison result CR indicates the number of different bits existing between the output data and the input data.
- the voltage level control unit 140 is configured to generate a control signal CS according to the comparison result CR.
- the voltage regulator circuit 150 is configured to provide the supply voltage PV 1 for the memory array 180 and adjust the value of the supply voltage PV 1 according to the control signal CS.
- the comparison unit 130 is further electrically coupled to the data input/output interface 110 , from which to receive the input data and the output data; wherein the data input/output interface 110 is further configured to latch the aforementioned input data.
- the data input/output interface 110 further includes an input data transmission unit 112 and an output data transmission unit 114 ; specifically, the input data transmission unit 112 is configured to transmit and latch the aforementioned input data, and the output data transmission unit 114 is configured to transmit the aforementioned output data.
- the supply voltage generation circuit 120 first, according to the input data of the memory array 180 , provides the supply voltage PV 1 so as to transmit the supply voltage PV 1 used as a programming voltage to the input terminal 171 of the decoder 170 . Then, a plurality of (e.g., four) memory units 182 of the memory array 180 can perform a program operation according to the value of the programming voltage, and thereby each memory unit 182 stores one bit of data.
- a plurality of (e.g., four) memory units 182 of the memory array 180 can perform a program operation according to the value of the programming voltage, and thereby each memory unit 182 stores one bit of data.
- the memory 100 transmits the storage data, constituted of the four bits of data stored in the four memory units 182 processed by the program operation according to the input data, to the data input/output interface 110 ; wherein the storage data herein are referred to as the output data of the memory array 180 .
- the supply voltage generation circuit 120 first obtains the latched input data from the data input/output interface 110 and the output data transmitted to the data input/output interface 110 , and then compares the input data and the output data to each other and thereby generating the comparison result CR.
- the power supply voltage generating circuit 120 is configured to adjust the value of the supply voltage PV 1 according to the comparison result CR if the comparison result CR indicates that there is at least one bit of different data existing between the aforementioned output data and the input data, due to the fact that the programming voltage required by less than four memory units 182 is different to that required by four memory units 182 .
- the supply voltage generation circuit 120 is configured to lower the supply voltage PV 1 to have a voltage value corresponding to the programming voltage required by two memory units 182 . Consequently, the two memory units 182 stored with error data can process the program operation again according to the adjusted programming voltage so as to have the correct data stored therein.
- the supply voltage PV 1 is adjusted based on the number of different bits. The more number of different bits that there are, the higher the supply voltage PV 1 is to be; whereas, the less number of different bits that there are, the lower the supply voltage PV 1 thereby becomes. And, the different bits will not increase in the program sequence.
- the comparison operation is performed on the aforementioned input data and the output data repeatedly until when there is no more of any bit of different data therebetween to be found.
- the voltage level control unit 140 is not limited to receive the comparison result CR derived from the comparison unit 130 only; in other words, the voltage level control unit 140 may be configured to receive a comparison result CR′ derived from outside of the memory 100 as depicted in FIG. 1 . That is, the comparison result CR′ is derived from outside of the memory 100 associated with the memory array 180 .
- the supply voltage generation circuit 120 is capable of dynamically adjusting the value of the supply voltage PV 1 according to the load (that is, the number of the memory unit 182 required to be driven); and consequently, the supply voltage generation circuit 120 can provide more accurate supply voltage PV 1 used as a programming voltage.
- each component in the supply voltage generation circuit 120 is described in the following description.
- the comparison unit 130 in FIG. 1 can compare the aforementioned input data and the output data to each other in a digital data comparison manner, analog-type current comparison manner or analog-type voltage comparison manner.
- FIG. 2 One exemplified circuit design of the comparison unit 130 employing a digital data comparison manner is depicted in FIG. 2 .
- FIG. 2 is a schematic view illustrating an exemplified circuit structure of the comparison unit 130 shown in FIG. 1 .
- the comparison unit 130 includes a plurality of NOT gates 132 , a plurality of NAND gates 134 and a plurality of D-type flip-flops 136 .
- These NOT gates 132 are configured to have the input terminals thereof electrically coupled to each other and for receiving the input data DIN [0:N] of the memory array 180 ; wherein N is a natural number.
- the NAND gates 134 each are configured to have one input terminal thereof for receiving an output signal of one respective NOT gate 132 and another input terminal thereof electrically coupled to the another input terminals of the rest of the NAND gates 134 and for receiving the output data DOUT [0:N] of the memory array 180 .
- the D-type flip-flops 136 each have a data input terminal D, a clock signal input terminal CLK, a reset signal input terminal R and a data output terminal Q. Each D-type flip-flop 136 is configured to have the data input terminal D thereof for receiving an output signal of one respective NAND gate 134 . These D-type flip-flops 136 are configured to have the clock signal input terminals CLK thereof for receiving a clock signal CK; wherein the clock signal CK is generated only when the aforementioned input data and the aforementioned output are required to be compared to each other. In addition, these D-type flip-flops 136 are configured to have the reset signal input terminals R thereof for receiving a reset signal RS.
- Each D-type flip-flop 136 is configured to have the data output terminal Q thereof for providing an output signal (such as the signals Q 1 ⁇ Q 4 ); wherein these output signals of these D-type flip-flops 136 corporately form the comparison result CR.
- the comparison unit 130 has a multi-stage circuit structure, and each stage of the circuit includes one NOT gate 132 , one NAND gate 134 and one D-type flip-flop 136 .
- the voltage level control unit 140 in FIG. 1 may be stored with a lookup table (not shown), which records a mapping relationship between the number of memory units 182 required to process the program operation and the corresponding supply voltage PV 1 .
- the voltage level control unit 140 can generate the control signal CS according to a lookup result obtained from looking up the lookup table according to the comparison result CR.
- the voltage regulator circuit 150 in FIG. 1 is, for example, realized by a low dropout regulator as illustrated in FIG. 3 , which is a schematic view illustrating an exemplified circuit structure of the voltage regulator circuit 150 .
- the voltage regulator circuit 150 includes a P-type transistor 151 , a voltage divider circuit 152 , a plurality of switches 153 , a switch control circuit 154 and a voltage comparator 155 .
- the P-type transistor 151 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and an another source/drain thereof for providing the supply voltage PV 1 .
- the voltage divider circuit 152 includes a plurality of resistors 152 - 1 coupled in series and is configured to have one terminal thereof electrically coupled to the another source/drain of the P-type transistor 151 and an another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND).
- a reference voltage e.g., a ground voltage GND
- each switch 153 has a first terminal 153 - 1 , a second terminal 153 - 2 and a control terminal 153 - 3 .
- each switch 153 is configured to have the first terminal 153 - 1 and the second terminal 153 - 2 thereof electrically coupled to two terminals of one respective resistor 152 - 1 in the voltage divider circuit 152 , respectively, and is selectively being turned on according to a signal received by the control terminal 153 - 3 thereof
- the switch control circuit 154 is electrically coupled to the control terminals 153 - 3 of the switches 153 and configured to selectively turn on the switches 153 according to the control signal CS outputted from the voltage level control unit 140 .
- the voltage comparator 155 has a positive input terminal +, a negative input terminal ⁇ and an output terminal.
- the voltage comparator 155 is configured to have the positive input terminal + thereof for receiving a reference voltage VREF, the negative input terminal ⁇ thereof electrically coupled to an electrical connection node of two respective resistors 152 - 1 in the voltage divider circuit 152 , and the output terminal thereof electrically coupled to the gate of the P-type transistor 151 ; wherein the electrical connection node is configured to provide a feedback signal FB.
- FIG. 4 is a schematic view of a memory in accordance with another embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted for brevity.
- the main difference between the memory 400 in this embodiment and the aforementioned memory 100 in aforementioned embodiment is that the voltage regulator circuit 450 of the supply voltage generation circuit 420 of the memory 400 is further electrically coupled to the input terminal 171 of the decoder 170 and is further configured to generate a feedback signal according to the signal received by the input terminal 171 of the decoder 170 and the control signal CS and consequently adjust the value of the supply voltage PV 1 according to the feedback signal.
- FIG. 5 is a schematic view illustrating an exemplified circuit structure of the voltage regulator circuit 450 shown in FIG. 4 .
- the voltage regulator circuit 450 includes a P-type transistor 451 , a voltage divider circuit 452 , a plurality of switches 453 , a switch control circuit 454 and a voltage comparator 455 .
- the P-type transistor 451 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and another source/drain thereof for providing the supply voltage PV 1 .
- the voltage divider circuit 452 includes a plurality of resistors 452 - 1 coupled in series and is configured to have one terminal thereof electrically coupled to the input terminal 171 of the decoder 170 and another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND).
- a reference voltage e.g., a ground voltage GND
- the switches 453 each have a first terminal 453 - 1 , a second terminal 453 - 2 and a control terminal 453 - 3 .
- each switch 453 is configured to have the first terminal 453 - 1 and the second terminal 453 - 2 thereof electrically coupled to two terminals of one respective resistor 452 - 1 in the voltage divider circuit 452 , respectively.
- the switch control circuit 454 is electrically coupled to the control terminals 453 - 3 of the switches 453 and is configured to selectively turn on the switches 453 according to the control signal CS outputted from the voltage level control unit 140 .
- the voltage comparator 455 has a positive input terminal +, a negative input terminal ⁇ and an output terminal.
- the voltage comparator 455 is configured to have the positive input terminal + thereof for receiving a reference voltage VREF, the negative input terminal ⁇ thereof electrically coupled to an electrical connection node of two specific resistors 452 - 1 in the voltage divider circuit 452 , and the output terminal thereof electrically coupled to the gate of the P-type transistor 451 ; wherein the electrical connection node is configured to provide the aforementioned feedback signal FS.
- FIG. 6 is a schematic view of a memory in accordance with still another embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted.
- the main difference between the memory 600 in this embodiment and the aforementioned memory 100 is that the voltage regulator circuit 650 of the supply voltage generation circuit 620 of the memory 600 is further electrically coupled to each output terminal 172 of the decoder 170 and is further configured to generate a feedback signal according to a signal outputted from one of the output terminals 172 and the control signal CS and consequently adjust the value of the supply voltage PV 1 according to the feedback signal.
- FIG. 7 is a schematic view illustrating an exemplified circuit structure of the voltage regulator circuit 650 shown in FIG. 6 .
- the voltage regulator circuit 650 includes a P-type transistor 651 , a voltage divider circuit 652 , a plurality of switches 653 , a switch control circuit 654 , a voltage comparator 655 and a selection circuit 656 .
- the P-type transistor 651 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and another source/drain thereof for providing the supply voltage PV 1 .
- the selection circuit 656 has a plurality of input terminals 656 - 1 and an output terminal 656 - 2 ; wherein these input terminals 656 - 1 of the selection circuit 656 are electrically coupled to the output terminals 172 of the decoder 170 , respectively.
- the selection circuit 656 is configured to select one of the input terminals 656 - 1 according to a selection signal SL and to output the signal received by the selected input terminal 656 - 1 through the output terminal 656 - 2 thereof.
- the voltage divider circuit 652 includes a plurality of resistors 652 - 1 coupled in series.
- the voltage divider circuit 652 is configured to have one terminal thereof electrically coupled to the output terminal 656 - 2 of the selection circuit 656 and an another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND).
- the switches 653 each have a first terminal 653 - 1 , a second terminal 653 - 2 and a control terminal 653 - 3 .
- each switch 653 is configured to have the first terminal 653 - 1 and the second terminal 653 - 2 thereof electrically coupled to two terminals of one respective resistor 652 - 1 in the voltage divider circuit 652 , respectively.
- the switch control circuit 654 is electrically coupled to the control terminals 653 - 3 of the switches 653 and is configured to selectively turn on the switches 653 according to the control signal CS.
- the voltage comparator 655 has a positive input terminal +, a negative input terminal ⁇ and an output terminal.
- the voltage comparator 655 is configured to have the positive input terminal +thereof for receiving a reference voltage VREF, the negative input terminal ⁇ electrically coupled to an electrical connection node of two specific resistors 652 - 1 in the voltage divider circuit 652 , and the output terminal thereof electrically coupled to the gate of the P-type transistor 651 ; wherein the electrical connection node is configured to provide the aforementioned feedback signal FB.
- FIG. 8 is a schematic flow chart of an operation method of a supply voltage generation circuit in accordance with an embodiment of the present invention.
- the memory array comprises a plurality of memory units and is electrically coupled to a decoder comprising an input terminal and a plurality of output terminals. Each output terminal of the decoder is electrically coupled to a respective group of the memory units. As shown in FIG. 8
- the supply voltage generation method includes the following steps: providing, according to input data of the memory array, a supply voltage to the input terminal of the decoder (step S 802 ); generating a comparison result by comparing the input data to output data of the memory array, wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data (step S 804 ); and adjusting the value of the supply voltage according to the comparison result if the comparison result indicates that there is at least one different bit existing between the input data and the output data (step S 806 ).
- the supply voltage generation circuit and the operation method of the supply voltage generation circuit according to the present invention first generates a comparison result by comparing input data to output data of a memory array; wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data. Accordingly, the value of the supply voltage can be adjusted according to the comparison result if the comparison result indicates that there is at least one different bit existing between the input data and the output data.
- the supply voltage generation circuit and the operation method of the supply voltage generation circuit according to the present invention each are capable of providing a more accurate supply voltage used as a programming voltage.
- the supply voltage generated by the voltage regulator circuit is used as a programming voltage.
- the voltage regulator circuit is further electrically coupled to the output terminals of the decoder and is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and the control signal and consequently adjust the value of the supply voltage according to the feedback signal of the voltage regulator circuit, the memory can avoid the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Continuous-Control Power Sources That Use Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Read Only Memory (AREA)
Abstract
Description
- This application is a divisional of, and claims the benefit of U.S. Nonprovisional application Ser. No. 13/652,422 entitled “MEMORY, SUPPLY VOLTAGE GENERATION CIRCUIT, AND OPERATION METHOD OF A SUPPLY VOLTAGE GENERATION CIRCUIT USED FOR A MEMORY ARRAY” filed Oct. 15, 2012, the disclosure of which is hereby incorporated by reference herein in its entirety.
- The present invention relates to a data storage technology, and more particularly to a memory for a voltage regulator circuit, in which a supply voltage generated by the voltage regulator circuit is used as a programming voltage.
- Non-volatile memory is capable of storing data without being supplied with external electrical power. Because of having the feature of no external power consumption, the non-volatile memory is particularly applicable to be used in portable apparatuses.
- The non-volatile memory can have three operations: read, write and erase; wherein the write operation is also referred to as the program operation. Basically, the three operations of the non-volatile memory require respective different voltages. Because the non-volatile memory highly demands a more accurate programming voltage level while executing the program operation, the associated programming voltage is required to be much accurate accordingly.
- The present invention provides a memory, in which a supply voltage used as a programming voltage is generated. The memory avoids the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
- The present invention further provides a decoder for the memory, comprising an input terminal and a plurality of output terminals, the decoder being configured to have the output terminals thereof electrically coupled to the source lines.
- The present invention further provides a voltage regulator circuit for the memory, configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and a control signal, and consequently adjust the value of the supply voltage according to the feedback signal.
- An embodiment of the present invention provides a memory, which includes a memory array, a decoder and a voltage regulator circuit. The memory array includes a plurality of source lines and a plurality of memory units, and each of the source lines is electrically coupled to a respective group of memory units. The decoder includes an input terminal and a plurality of output terminals. The decoder is configured to have the output terminals thereof electrically coupled to the source lines, respectively. The voltage regulator circuit is configured to provide a supply voltage to the input terminal of the decoder and electrically coupled to the output terminals of the decoder. The voltage regulator circuit is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and a control signal, and consequently adjust the value of the supply voltage according to the feedback signal. In addition, the memory further includes a supply voltage switch electrically coupled between an output terminal of the voltage regulator circuit and the input terminal of the decoder and configured to receive the supply voltage and a predetermined voltage and consequently selectively output, according to a control command, either the supply voltage or the predetermined voltage to the input terminal of the decoder.
- In the embodiment of present invention, the control signal is generated according to a comparison result, the comparison result indicates the number of different bits existing between output data and input data of the memory array, and the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data.
- In summary, in the memory according to the present invention, the supply voltage generated by the voltage regulator circuit is used as a programming voltage. Because the voltage regulator circuit is electrically coupled to the output terminals of the decoder and is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and the control signal, and consequently adjust the value of the supply voltage according to the feedback signal of the voltage regulator circuit, the memory avoids the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
- The embodiments of present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
-
FIG. 1 is a schematic view of a memory array in accordance with an embodiment of the present invention; -
FIG. 2 is a schematic view illustrating an exemplified circuit structure of a comparison unit shown inFIG. 1 ; -
FIG. 3 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown inFIG. 1 ; -
FIG. 4 is a schematic view of a memory array in accordance with another embodiment of the present invention; -
FIG. 5 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown inFIG. 4 ; -
FIG. 6 is a schematic view of a memory array in accordance with still another embodiment of the present invention; -
FIG. 7 is a schematic view illustrating an exemplified circuit structure of a voltage regulator circuit shown inFIG. 6 ; and -
FIG. 8 is a schematic flow chart of an operation method of a supply voltage generation circuit in accordance with an embodiment of the present invention. - The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
-
FIG. 1 is a schematic view of a memory in accordance with an embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted for brevity. As shown, thememory 100 in this embodiment includes a data input/output interface 110, a supplyvoltage generation circuit 120, asupply voltage switch 160, adecoder 170 and amemory array 180. Thememory array 180 includes a plurality ofsource lines 181 and a plurality ofmemory units 182, and each of thesource lines 181 is electrically coupled to a respective group ofmemory units 182. Thedecoder 170 has aninput terminal 171 and a plurality ofoutput terminals 172. In this embodiment, thedecoder 170 is configured to have theoutput terminals 172 thereof electrically coupled to thesource lines 181 of thememory array 180. According to the aforementioned description, it is understood that thedecoder 170 is a source line decoder. - The
supply voltage switch 160, electrically coupled between an output terminal of the supplyvoltage generation circuit 120 and theinput terminal 171 of thedecoder 170, is configured to receive a supply voltage PV1 and a predetermined voltage PV2 and consequently selectively output, according to a control command CM, either the supply voltage PV1 or the predetermined voltage PV2 to theinput terminal 171 of thedecoder 170. In this embodiment, the supply voltage PV1 is used as a programming voltage; and the predetermined voltage PV2 is used as, for example, a readout voltage. - The supply
voltage generation circuit 120 includes acomparison unit 130, a voltagelevel control unit 140 and avoltage regulator circuit 150. Thecomparison unit 130 is configured to compare the input data and the output data of thememory array 180 to each other and thereby generating a comparison result CR accordingly. The aforementioned output data are the storage data stored in a plurality ofmemory unit 182 of thememory array 180 processed by a program operation according to the aforementioned input data; and the comparison result CR indicates the number of different bits existing between the output data and the input data. In addition, the voltagelevel control unit 140 is configured to generate a control signal CS according to the comparison result CR. Thevoltage regulator circuit 150 is configured to provide the supply voltage PV1 for thememory array 180 and adjust the value of the supply voltage PV1 according to the control signal CS. - In addition, for obtaining of the aforementioned input data and the output data, the
comparison unit 130 is further electrically coupled to the data input/output interface 110, from which to receive the input data and the output data; wherein the data input/output interface 110 is further configured to latch the aforementioned input data. In this embodiment, the data input/output interface 110 further includes an inputdata transmission unit 112 and an outputdata transmission unit 114; specifically, the inputdata transmission unit 112 is configured to transmit and latch the aforementioned input data, and the outputdata transmission unit 114 is configured to transmit the aforementioned output data. - One exemplified operation process of the supply
voltage generation circuit 120 executing the program operation on fourmemory units 182 is described in the following description. Please refer toFIG. 1 , again. The supplyvoltage generation circuit 120 first, according to the input data of thememory array 180, provides the supply voltage PV1 so as to transmit the supply voltage PV1 used as a programming voltage to theinput terminal 171 of thedecoder 170. Then, a plurality of (e.g., four)memory units 182 of thememory array 180 can perform a program operation according to the value of the programming voltage, and thereby eachmemory unit 182 stores one bit of data. Afterwards, thememory 100 transmits the storage data, constituted of the four bits of data stored in the fourmemory units 182 processed by the program operation according to the input data, to the data input/output interface 110; wherein the storage data herein are referred to as the output data of thememory array 180. - Afterwards, the supply
voltage generation circuit 120 first obtains the latched input data from the data input/output interface 110 and the output data transmitted to the data input/output interface 110, and then compares the input data and the output data to each other and thereby generating the comparison result CR. Specifically, the power supplyvoltage generating circuit 120 is configured to adjust the value of the supply voltage PV1 according to the comparison result CR if the comparison result CR indicates that there is at least one bit of different data existing between the aforementioned output data and the input data, due to the fact that the programming voltage required by less than fourmemory units 182 is different to that required by fourmemory units 182. - For example, if the comparison result CR indicates that there are two bits of different data existing between the aforementioned output data and the input data, the supply
voltage generation circuit 120 is configured to lower the supply voltage PV1 to have a voltage value corresponding to the programming voltage required by twomemory units 182. Consequently, the twomemory units 182 stored with error data can process the program operation again according to the adjusted programming voltage so as to have the correct data stored therein. In other words, the supply voltage PV1 is adjusted based on the number of different bits. The more number of different bits that there are, the higher the supply voltage PV1 is to be; whereas, the less number of different bits that there are, the lower the supply voltage PV1 thereby becomes. And, the different bits will not increase in the program sequence. In addition, it is understood that the comparison operation is performed on the aforementioned input data and the output data repeatedly until when there is no more of any bit of different data therebetween to be found. Moreover, the voltagelevel control unit 140 is not limited to receive the comparison result CR derived from thecomparison unit 130 only; in other words, the voltagelevel control unit 140 may be configured to receive a comparison result CR′ derived from outside of thememory 100 as depicted inFIG. 1 . That is, the comparison result CR′ is derived from outside of thememory 100 associated with thememory array 180. - Based on the aforementioned description, it is understood that the supply
voltage generation circuit 120 is capable of dynamically adjusting the value of the supply voltage PV1 according to the load (that is, the number of thememory unit 182 required to be driven); and consequently, the supplyvoltage generation circuit 120 can provide more accurate supply voltage PV1 used as a programming voltage. - The circuit design of each component in the supply
voltage generation circuit 120 is described in the following description. In addition, it is understood that thecomparison unit 130 inFIG. 1 can compare the aforementioned input data and the output data to each other in a digital data comparison manner, analog-type current comparison manner or analog-type voltage comparison manner. One exemplified circuit design of thecomparison unit 130 employing a digital data comparison manner is depicted inFIG. 2 . -
FIG. 2 is a schematic view illustrating an exemplified circuit structure of thecomparison unit 130 shown inFIG. 1 . As shown, thecomparison unit 130 includes a plurality ofNOT gates 132, a plurality ofNAND gates 134 and a plurality of D-type flip-flops 136. TheseNOT gates 132 are configured to have the input terminals thereof electrically coupled to each other and for receiving the input data DIN [0:N] of thememory array 180; wherein N is a natural number. TheNAND gates 134 each are configured to have one input terminal thereof for receiving an output signal of onerespective NOT gate 132 and another input terminal thereof electrically coupled to the another input terminals of the rest of theNAND gates 134 and for receiving the output data DOUT [0:N] of thememory array 180. - The D-type flip-
flops 136 each have a data input terminal D, a clock signal input terminal CLK, a reset signal input terminal R and a data output terminal Q. Each D-type flip-flop 136 is configured to have the data input terminal D thereof for receiving an output signal of onerespective NAND gate 134. These D-type flip-flops 136 are configured to have the clock signal input terminals CLK thereof for receiving a clock signal CK; wherein the clock signal CK is generated only when the aforementioned input data and the aforementioned output are required to be compared to each other. In addition, these D-type flip-flops 136 are configured to have the reset signal input terminals R thereof for receiving a reset signal RS. Each D-type flip-flop 136 is configured to have the data output terminal Q thereof for providing an output signal (such as the signals Q1˜Q4); wherein these output signals of these D-type flip-flops 136 corporately form the comparison result CR. As illustrated inFIG. 2 , thecomparison unit 130 has a multi-stage circuit structure, and each stage of the circuit includes oneNOT gate 132, oneNAND gate 134 and one D-type flip-flop 136. - In addition, the voltage
level control unit 140 inFIG. 1 may be stored with a lookup table (not shown), which records a mapping relationship between the number ofmemory units 182 required to process the program operation and the corresponding supply voltage PV1. Thus, the voltagelevel control unit 140 can generate the control signal CS according to a lookup result obtained from looking up the lookup table according to the comparison result CR. - The
voltage regulator circuit 150 inFIG. 1 is, for example, realized by a low dropout regulator as illustrated inFIG. 3 , which is a schematic view illustrating an exemplified circuit structure of thevoltage regulator circuit 150. As shown, thevoltage regulator circuit 150 includes a P-type transistor 151, avoltage divider circuit 152, a plurality ofswitches 153, aswitch control circuit 154 and avoltage comparator 155. The P-type transistor 151 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and an another source/drain thereof for providing the supply voltage PV1. Thevoltage divider circuit 152 includes a plurality of resistors 152-1 coupled in series and is configured to have one terminal thereof electrically coupled to the another source/drain of the P-type transistor 151 and an another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND). - In addition, each
switch 153 has a first terminal 153-1, a second terminal 153-2 and a control terminal 153-3. Specifically, eachswitch 153 is configured to have the first terminal 153-1 and the second terminal 153-2 thereof electrically coupled to two terminals of one respective resistor 152-1 in thevoltage divider circuit 152, respectively, and is selectively being turned on according to a signal received by the control terminal 153-3 thereof Specifically, theswitch control circuit 154 is electrically coupled to the control terminals 153-3 of theswitches 153 and configured to selectively turn on theswitches 153 according to the control signal CS outputted from the voltagelevel control unit 140. Thevoltage comparator 155 has a positive input terminal +, a negative input terminal − and an output terminal. Thevoltage comparator 155 is configured to have the positive input terminal + thereof for receiving a reference voltage VREF, the negative input terminal − thereof electrically coupled to an electrical connection node of two respective resistors 152-1 in thevoltage divider circuit 152, and the output terminal thereof electrically coupled to the gate of the P-type transistor 151; wherein the electrical connection node is configured to provide a feedback signal FB. - Additionally, in order to avoid the effect of the temperature/ or manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage, the voltage regulator circuit in the power supply voltage regulator circuit associated with the present invention can employ various feedback manners, as the circuit designs illustrated in
FIGS. 4 , 6.FIG. 4 is a schematic view of a memory in accordance with another embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted for brevity. The main difference between thememory 400 in this embodiment and theaforementioned memory 100 in aforementioned embodiment is that thevoltage regulator circuit 450 of the supplyvoltage generation circuit 420 of thememory 400 is further electrically coupled to theinput terminal 171 of thedecoder 170 and is further configured to generate a feedback signal according to the signal received by theinput terminal 171 of thedecoder 170 and the control signal CS and consequently adjust the value of the supply voltage PV1 according to the feedback signal. -
FIG. 5 is a schematic view illustrating an exemplified circuit structure of thevoltage regulator circuit 450 shown inFIG. 4 . As shown, thevoltage regulator circuit 450 includes a P-type transistor 451, avoltage divider circuit 452, a plurality ofswitches 453, aswitch control circuit 454 and avoltage comparator 455. The P-type transistor 451 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and another source/drain thereof for providing the supply voltage PV1. Thevoltage divider circuit 452 includes a plurality of resistors 452-1 coupled in series and is configured to have one terminal thereof electrically coupled to theinput terminal 171 of thedecoder 170 and another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND). - In addition, the
switches 453 each have a first terminal 453-1, a second terminal 453-2 and a control terminal 453-3. Specifically, eachswitch 453 is configured to have the first terminal 453-1 and the second terminal 453-2 thereof electrically coupled to two terminals of one respective resistor 452-1 in thevoltage divider circuit 452, respectively. Theswitch control circuit 454 is electrically coupled to the control terminals 453-3 of theswitches 453 and is configured to selectively turn on theswitches 453 according to the control signal CS outputted from the voltagelevel control unit 140. Thevoltage comparator 455 has a positive input terminal +, a negative input terminal − and an output terminal. Thevoltage comparator 455 is configured to have the positive input terminal + thereof for receiving a reference voltage VREF, the negative input terminal − thereof electrically coupled to an electrical connection node of two specific resistors 452-1 in thevoltage divider circuit 452, and the output terminal thereof electrically coupled to the gate of the P-type transistor 451; wherein the electrical connection node is configured to provide the aforementioned feedback signal FS. -
FIG. 6 is a schematic view of a memory in accordance with still another embodiment of the present invention; wherein it is to be noted that only a portion of the memory circuit structure associated with the present invention is depicted. The main difference between thememory 600 in this embodiment and theaforementioned memory 100 is that thevoltage regulator circuit 650 of the supplyvoltage generation circuit 620 of thememory 600 is further electrically coupled to eachoutput terminal 172 of thedecoder 170 and is further configured to generate a feedback signal according to a signal outputted from one of theoutput terminals 172 and the control signal CS and consequently adjust the value of the supply voltage PV1 according to the feedback signal. -
FIG. 7 is a schematic view illustrating an exemplified circuit structure of thevoltage regulator circuit 650 shown inFIG. 6 . As shown, thevoltage regulator circuit 650 includes a P-type transistor 651, avoltage divider circuit 652, a plurality ofswitches 653, aswitch control circuit 654, avoltage comparator 655 and aselection circuit 656. The P-type transistor 651 is configured to have one source/drain thereof electrically coupled to an operating power supply VDD and another source/drain thereof for providing the supply voltage PV1. Theselection circuit 656 has a plurality of input terminals 656-1 and an output terminal 656-2; wherein these input terminals 656-1 of theselection circuit 656 are electrically coupled to theoutput terminals 172 of thedecoder 170, respectively. Theselection circuit 656 is configured to select one of the input terminals 656-1 according to a selection signal SL and to output the signal received by the selected input terminal 656-1 through the output terminal 656-2 thereof. - In addition, the
voltage divider circuit 652 includes a plurality of resistors 652-1 coupled in series. Thevoltage divider circuit 652 is configured to have one terminal thereof electrically coupled to the output terminal 656-2 of theselection circuit 656 and an another terminal thereof electrically coupled to a reference voltage (e.g., a ground voltage GND). Theswitches 653 each have a first terminal 653-1, a second terminal 653-2 and a control terminal 653-3. Specifically, eachswitch 653 is configured to have the first terminal 653-1 and the second terminal 653-2 thereof electrically coupled to two terminals of one respective resistor 652-1 in thevoltage divider circuit 652, respectively. Theswitch control circuit 654 is electrically coupled to the control terminals 653-3 of theswitches 653 and is configured to selectively turn on theswitches 653 according to the control signal CS. - The
voltage comparator 655 has a positive input terminal +, a negative input terminal − and an output terminal. Thevoltage comparator 655 is configured to have the positive input terminal +thereof for receiving a reference voltage VREF, the negative input terminal − electrically coupled to an electrical connection node of two specific resistors 652-1 in thevoltage divider circuit 652, and the output terminal thereof electrically coupled to the gate of the P-type transistor 651; wherein the electrical connection node is configured to provide the aforementioned feedback signal FB. - According to the descriptions of the aforementioned embodiments, an operation method of the aforementioned supply voltage generation circuits for a memory array can be summarized to have a plurality of basic operation steps by those ordinarily skilled in the art as illustrated in
FIG. 8 , which is a schematic flow chart of an operation method of a supply voltage generation circuit in accordance with an embodiment of the present invention. The memory array comprises a plurality of memory units and is electrically coupled to a decoder comprising an input terminal and a plurality of output terminals. Each output terminal of the decoder is electrically coupled to a respective group of the memory units. As shown inFIG. 8 , the supply voltage generation method includes the following steps: providing, according to input data of the memory array, a supply voltage to the input terminal of the decoder (step S802); generating a comparison result by comparing the input data to output data of the memory array, wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data (step S804); and adjusting the value of the supply voltage according to the comparison result if the comparison result indicates that there is at least one different bit existing between the input data and the output data (step S806). - In summary, the supply voltage generation circuit and the operation method of the supply voltage generation circuit according to the present invention first generates a comparison result by comparing input data to output data of a memory array; wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data. Accordingly, the value of the supply voltage can be adjusted according to the comparison result if the comparison result indicates that there is at least one different bit existing between the input data and the output data. Thus, the supply voltage generation circuit and the operation method of the supply voltage generation circuit according to the present invention each are capable of providing a more accurate supply voltage used as a programming voltage.
- Moreover, in the memory according to the present invention, the supply voltage generated by the voltage regulator circuit is used as a programming voltage. Because the voltage regulator circuit is further electrically coupled to the output terminals of the decoder and is configured to generate a feedback signal according to a signal outputted from one output terminal of the decoder and the control signal and consequently adjust the value of the supply voltage according to the feedback signal of the voltage regulator circuit, the memory can avoid the effect of temperature and manufacturing variations of the components, disposed on the transmission path of the programming voltage, on the programming voltage.
- While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/225,435 US8804440B1 (en) | 2012-10-15 | 2014-03-26 | Memory for a voltage regulator circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/652,422 US8724404B2 (en) | 2012-10-15 | 2012-10-15 | Memory, supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array |
| US14/225,435 US8804440B1 (en) | 2012-10-15 | 2014-03-26 | Memory for a voltage regulator circuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/652,422 Division US8724404B2 (en) | 2012-10-15 | 2012-10-15 | Memory, supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20140211573A1 true US20140211573A1 (en) | 2014-07-31 |
| US8804440B1 US8804440B1 (en) | 2014-08-12 |
Family
ID=50475209
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/652,422 Active 2032-10-27 US8724404B2 (en) | 2012-10-15 | 2012-10-15 | Memory, supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array |
| US14/225,435 Active US8804440B1 (en) | 2012-10-15 | 2014-03-26 | Memory for a voltage regulator circuit |
| US14/225,432 Active US8767485B1 (en) | 2012-10-15 | 2014-03-26 | Operation method of a supply voltage generation circuit used for a memory array |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/652,422 Active 2032-10-27 US8724404B2 (en) | 2012-10-15 | 2012-10-15 | Memory, supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/225,432 Active US8767485B1 (en) | 2012-10-15 | 2014-03-26 | Operation method of a supply voltage generation circuit used for a memory array |
Country Status (1)
| Country | Link |
|---|---|
| US (3) | US8724404B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016196045A1 (en) * | 2015-05-29 | 2016-12-08 | Maxim Integrated Products, Inc. | Low power ultra-wide-band transmitter |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8316158B1 (en) | 2007-03-12 | 2012-11-20 | Cypress Semiconductor Corporation | Configuration of programmable device using a DMA controller |
| CN106933289B (en) * | 2017-04-28 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of number low-dropout regulator and its control method |
| US10878882B1 (en) * | 2019-06-19 | 2020-12-29 | Micron Technology, Inc. | Systems and methods for performing dynamic on-chip calibration of memory control signals |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6992934B1 (en) * | 2005-03-15 | 2006-01-31 | Silicon Storage Technology, Inc. | Read bitline inhibit method and apparatus for voltage mode sensing |
| US8315089B2 (en) * | 2007-10-16 | 2012-11-20 | SK Hynix Inc. | Phase change memory device with improved performance that minimizes cell degradation |
| US20130222051A1 (en) * | 2012-02-24 | 2013-08-29 | Hsiang-Yi Chiu | Charge Pump Device and Driving Capability Adjustment Method Thereof |
Family Cites Families (106)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3663828A (en) | 1970-10-20 | 1972-05-16 | Nasa | Failsafe multiple transformer circuit configuration |
| US3818402A (en) | 1973-05-30 | 1974-06-18 | Westinghouse Electric Corp | Tap-changing series-multiple transformer system |
| US4163944A (en) | 1976-12-22 | 1979-08-07 | Ncr Corporation | Compensation circuit for an electrical signal mixer |
| US4245355A (en) | 1979-08-08 | 1981-01-13 | Eaton Corporation | Microwave frequency converter |
| US4409608A (en) | 1981-04-28 | 1983-10-11 | The United States Of America As Represented By The Secretary Of The Navy | Recessed interdigitated integrated capacitor |
| US4816784A (en) | 1988-01-19 | 1989-03-28 | Northern Telecom Limited | Balanced planar transformers |
| JP2746762B2 (en) | 1990-02-01 | 1998-05-06 | 松下電子工業株式会社 | Layout method of semiconductor integrated circuit |
| US5159205A (en) | 1990-10-24 | 1992-10-27 | Burr-Brown Corporation | Timing generator circuit including adjustable tapped delay line within phase lock loop to control timing of signals in the tapped delay line |
| US5406447A (en) | 1992-01-06 | 1995-04-11 | Nec Corporation | Capacitor used in an integrated circuit and comprising opposing electrodes having barrier metal films in contact with a dielectric film |
| JP3036233B2 (en) | 1992-06-22 | 2000-04-24 | 松下電器産業株式会社 | Semiconductor device and manufacturing method thereof |
| US5208725A (en) | 1992-08-19 | 1993-05-04 | Akcasu Osman E | High capacitance structure in a semiconductor device |
| US5808330A (en) | 1994-11-02 | 1998-09-15 | Lsi Logic Corporation | Polydirectional non-orthoginal three layer interconnect architecture |
| US5583359A (en) | 1995-03-03 | 1996-12-10 | Northern Telecom Limited | Capacitor structure for an integrated circuit |
| US5637900A (en) | 1995-04-06 | 1997-06-10 | Industrial Technology Research Institute | Latchup-free fully-protected CMOS on-chip ESD protection circuit |
| US6452442B1 (en) | 1995-12-04 | 2002-09-17 | Intel Corporation | Apparatus for obtaining noise immunity in electrical circuits |
| US5760456A (en) | 1995-12-21 | 1998-06-02 | Grzegorek; Andrew Z. | Integrated circuit compatible planar inductors with increased Q |
| US6081146A (en) | 1996-09-25 | 2000-06-27 | Kabushiki Kaisha Toshiba | Interface circuit and interface circuit delay time controlling method |
| US6026134A (en) | 1997-06-19 | 2000-02-15 | Cypress Semiconductor Corp. | Phase locked loop (PLL) with linear parallel sampling phase detector |
| US5923225A (en) | 1997-10-03 | 1999-07-13 | De Los Santos; Hector J. | Noise-reduction systems and methods using photonic bandgap crystals |
| US6008102A (en) | 1998-04-09 | 1999-12-28 | Motorola, Inc. | Method of forming a three-dimensional integrated inductor |
| US5959820A (en) | 1998-04-23 | 1999-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cascode LVTSCR and ESD protection circuit |
| KR20000011585A (en) | 1998-07-28 | 2000-02-25 | 윤덕용 | Semiconductor device and method for manufacturing the same |
| JP3592950B2 (en) | 1999-03-11 | 2004-11-24 | 株式会社東芝 | Frequency multiplier |
| US6172378B1 (en) | 1999-05-03 | 2001-01-09 | Silicon Wave, Inc. | Integrated circuit varactor having a wide capacitance range |
| US6427226B1 (en) | 1999-05-25 | 2002-07-30 | Advanced Micro Devices, Inc. | Selectively reducing transistor channel length in a semiconductor device |
| JP2001085248A (en) | 1999-09-17 | 2001-03-30 | Oki Electric Ind Co Ltd | Transformer |
| TW509943B (en) | 1999-10-06 | 2002-11-11 | Ind Tech Res Inst | Hidden-type refreshed 2P2N pseudo static random access memory and its refreshing method |
| US6630897B2 (en) | 1999-10-28 | 2003-10-07 | Cellonics Incorporated Pte Ltd | Method and apparatus for signal detection in ultra wide-band communications |
| US6456221B2 (en) | 1999-10-28 | 2002-09-24 | The National University Of Singapore | Method and apparatus for signal detection in ultra wide-band communications |
| US6291872B1 (en) | 1999-11-04 | 2001-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three-dimensional type inductor for mixed mode radio frequency device |
| US6194739B1 (en) | 1999-11-23 | 2001-02-27 | Lucent Technologies Inc. | Inline ground-signal-ground (GSG) RF tester |
| US6407412B1 (en) | 2000-03-10 | 2002-06-18 | Pmc-Sierra Inc. | MOS varactor structure with engineered voltage control range |
| US6822312B2 (en) | 2000-04-07 | 2004-11-23 | Koninklijke Philips Electronics N.V. | Interdigitated multilayer capacitor structure for deep sub-micron CMOS |
| US6483188B1 (en) | 2000-05-15 | 2002-11-19 | Atheros Communications, Inc. | Rf integrated circuit layout |
| AU2001263348A1 (en) | 2000-05-19 | 2001-12-03 | Philip A. Harding | Slot core transformers |
| US6901126B1 (en) | 2000-06-30 | 2005-05-31 | Texas Instruments Incorporated | Time division multiplex data recovery system using close loop phase and delay locked loop |
| US6329234B1 (en) | 2000-07-24 | 2001-12-11 | Taiwan Semiconductor Manufactuirng Company | Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow |
| JP2002043842A (en) | 2000-07-26 | 2002-02-08 | Oki Electric Ind Co Ltd | Lc resonance circuit and voltage-controlled oscillator |
| US6545547B2 (en) | 2000-08-18 | 2003-04-08 | Texas Instruments Incorporated | Method for tuning a VCO using a phase lock loop |
| US6448858B1 (en) | 2000-09-15 | 2002-09-10 | International Business Machines Corporation | Mask layout for sidefed RF power amplifier |
| US6370372B1 (en) | 2000-09-25 | 2002-04-09 | Conexant Systems, Inc. | Subharmonic mixer circuit and method |
| US6521939B1 (en) | 2000-09-29 | 2003-02-18 | Chartered Semiconductor Manufacturing Ltd. | High performance integrated varactor on silicon |
| US6593838B2 (en) | 2000-12-19 | 2003-07-15 | Atheros Communications Inc. | Planar inductor with segmented conductive plane |
| US6480137B2 (en) | 2001-02-28 | 2002-11-12 | Texas Instruments Incorporated | Method of generating matched capacitor arrays |
| US6608363B1 (en) | 2001-03-01 | 2003-08-19 | Skyworks Solutions, Inc. | Transformer comprising stacked inductors |
| KR100725935B1 (en) | 2001-03-23 | 2007-06-11 | 삼성전자주식회사 | Phase Locked Loop Circuits for Fractional-and-Frequency Synthesizers |
| DE60219712T2 (en) | 2001-04-19 | 2008-02-28 | Interuniversitair Microelektronica Centrum Vzw | Manufacture of integrated tunable / switchable passive micro and millimeter wave modules |
| US6596579B1 (en) | 2001-04-27 | 2003-07-22 | Lsi Logic Corporation | Method of forming analog capacitor dual damascene process |
| US6573568B2 (en) | 2001-06-01 | 2003-06-03 | Winbond Electronics Corp. | ESD protection devices and methods for reducing trigger voltage |
| US6728942B2 (en) | 2001-06-12 | 2004-04-27 | Conexant Systems, Inc. | Method and system for predictive MOSFET layout generation with reduced design cycle |
| US6639298B2 (en) | 2001-06-28 | 2003-10-28 | Agere Systems Inc. | Multi-layer inductor formed in a semiconductor substrate |
| US6958522B2 (en) | 2001-07-05 | 2005-10-25 | International Business Machines Corporation | Method to fabricate passive components using conductive polymer |
| JP4090222B2 (en) | 2001-07-17 | 2008-05-28 | 株式会社ルネサステクノロジ | Semiconductor integrated circuit, method for designing semiconductor integrated circuit, and program for designing semiconductor integrated circuit |
| JP2004538703A (en) | 2001-08-03 | 2004-12-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Analog FIR filter |
| US6588002B1 (en) | 2001-08-28 | 2003-07-01 | Conexant Systems, Inc. | Method and system for predictive layout generation for inductors with reduced design cycle |
| US6461914B1 (en) | 2001-08-29 | 2002-10-08 | Motorola, Inc. | Process for making a MIM capacitor |
| US6700771B2 (en) | 2001-08-30 | 2004-03-02 | Micron Technology, Inc. | Decoupling capacitor for high frequency noise immunity |
| US6668358B2 (en) | 2001-10-01 | 2003-12-23 | International Business Machines Corporation | Dual threshold gate array or standard cell power saving library circuits |
| TW531984B (en) | 2001-10-02 | 2003-05-11 | Univ Singapore | Method and apparatus for ultra wide-band communication system using multiple detectors |
| US6625077B2 (en) | 2001-10-11 | 2003-09-23 | Cascade Semiconductor Corporation | Asynchronous hidden refresh of semiconductor memory |
| US20030076636A1 (en) | 2001-10-23 | 2003-04-24 | Ming-Dou Ker | On-chip ESD protection circuit with a substrate-triggered SCR device |
| US7169679B2 (en) | 2002-01-07 | 2007-01-30 | Honeywell International Inc. | Varactor with improved tuning range |
| JP3877597B2 (en) | 2002-01-21 | 2007-02-07 | シャープ株式会社 | Multi-terminal MOS varactor |
| US6833756B2 (en) | 2002-01-24 | 2004-12-21 | Broadcom Corporation | Input buffer amplifier with centroidal layout |
| DE10214068B4 (en) | 2002-03-28 | 2009-02-19 | Advanced Micro Devices, Inc., Sunnyvale | ESD protection circuit for radio frequency output connections in an integrated circuit |
| US6720608B2 (en) | 2002-05-22 | 2004-04-13 | United Microelectronics Corp. | Metal-insulator-metal capacitor structure |
| US6830966B2 (en) | 2002-06-12 | 2004-12-14 | Chartered Semiconductor Manufacturing Ltd. | Fully silicided NMOS device for electrostatic discharge protection |
| US6756656B2 (en) | 2002-07-11 | 2004-06-29 | Globespanvirata Incorporated | Inductor device with patterned ground shield and ribbing |
| KR100482365B1 (en) | 2002-07-12 | 2005-04-13 | 삼성전자주식회사 | Refresh control circuits in pseudo sram device and method same |
| US6841847B2 (en) | 2002-09-04 | 2005-01-11 | Chartered Semiconductor Manufacturing, Ltd. | 3-D spiral stacked inductor on semiconductor material |
| TW575989B (en) | 2002-09-25 | 2004-02-11 | Mediatek Inc | NPN Darlington ESD protection circuit |
| US6810242B2 (en) | 2002-09-30 | 2004-10-26 | Skyworks Solutions, Inc. | Subharmonic mixer |
| US6885534B2 (en) | 2002-10-21 | 2005-04-26 | Silicon Integrated Systems Corporation | Electrostatic discharge protection device for giga-hertz radio frequency integrated circuits with varactor-LC tanks |
| US6853272B1 (en) | 2002-11-15 | 2005-02-08 | National Semiconductor Corporation | Linear voltage controlled capacitance circuit |
| US6724677B1 (en) | 2002-11-15 | 2004-04-20 | Macronix International Co., Ltd. | ESD device used with high-voltage input pad |
| US6909149B2 (en) | 2003-04-16 | 2005-06-21 | Sarnoff Corporation | Low voltage silicon controlled rectifier (SCR) for electrostatic discharge (ESD) protection of silicon-on-insulator technologies |
| EP1478045B1 (en) | 2003-05-16 | 2012-06-06 | Panasonic Corporation | Mutual induction circuit |
| US6967876B2 (en) | 2003-08-28 | 2005-11-22 | Stmicroelectronics S.R.L. | Method for controlling programming voltage levels of non-volatile memory cells, the method tracking the cell features, and corresponding voltage regulator |
| US7064618B2 (en) | 2003-09-29 | 2006-06-20 | Intel Corporation | PLL with swappable tuning loops |
| US6927638B2 (en) | 2003-09-29 | 2005-08-09 | Intel Corporation | PLL with multiple tuning loops |
| JP4567314B2 (en) | 2003-10-24 | 2010-10-20 | 富士通セミコンダクター株式会社 | Semiconductor device and manufacturing method thereof |
| US7027276B2 (en) | 2004-04-21 | 2006-04-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | High voltage ESD protection circuit with low voltage transistors |
| TWI296159B (en) | 2004-07-06 | 2008-04-21 | Realtek Semiconductor Corp | Mos varactor and method for making the same |
| TWI259043B (en) | 2004-11-19 | 2006-07-21 | Realtek Semiconductor Corp | Structure of circuit layout and method thereof |
| US7262069B2 (en) | 2005-06-07 | 2007-08-28 | Freescale Semiconductor, Inc. | 3-D inductor and transformer devices in MRAM embedded integrated circuits |
| US7239557B2 (en) | 2005-06-17 | 2007-07-03 | Micron Technology, Inc. | Program method with optimized voltage level for flash memory |
| US20070102745A1 (en) | 2005-11-04 | 2007-05-10 | Tsun-Lai Hsu | Capacitor structure |
| US7274085B1 (en) | 2006-03-09 | 2007-09-25 | United Microelectronics Corp. | Capacitor structure |
| US7365627B2 (en) | 2006-03-14 | 2008-04-29 | United Microelectronics Corp. | Metal-insulator-metal transformer and method for manufacturing the same |
| US7705428B2 (en) | 2006-03-21 | 2010-04-27 | United Microelectronics Corp. | Varactor |
| US7498918B2 (en) | 2006-04-04 | 2009-03-03 | United Microelectronics Corp. | Inductor structure |
| US7367113B2 (en) | 2006-04-06 | 2008-05-06 | United Microelectronics Corp. | Method for fabricating a transformer integrated with a semiconductor structure |
| US20070249294A1 (en) | 2006-04-20 | 2007-10-25 | Chang-Ching Wu | Transmit-receive switch for ultrawideband and method for isolating transmitting and receiving signal thereof |
| US7672100B2 (en) | 2006-05-23 | 2010-03-02 | Sofics Bvba | Electrostatic discharge protection structures with reduced latch-up risks |
| US20070296055A1 (en) | 2006-06-23 | 2007-12-27 | Albert Kuo Huei Yen | Rf integrated circuit with esd protection and esd protection apparatus thereof |
| US7948055B2 (en) | 2006-08-31 | 2011-05-24 | United Microelectronics Corp. | Inductor formed on semiconductor substrate |
| US20080185679A1 (en) | 2006-10-19 | 2008-08-07 | United Microelectronics Corp. | Inductor layout and manufacturing method thereof |
| US7656264B2 (en) | 2006-10-19 | 2010-02-02 | United Microelectronics Corp. | High coupling factor transformer and manufacturing method thereof |
| US7653885B2 (en) | 2007-02-05 | 2010-01-26 | Cadence Design Systems, Inc. | Selection of cells from a multiple threshold voltage cell library for optimized mapping to a multi-Vt circuit |
| US20080200132A1 (en) | 2007-02-15 | 2008-08-21 | United Microelectronics Corp. | Method for producing layout of semiconductor integrated circuit with radio frequency devices |
| US7368761B1 (en) | 2007-03-08 | 2008-05-06 | United Microelectronics Corp. | Electrostatic discharge protection device and fabrication method thereof |
| US7405642B1 (en) | 2007-03-09 | 2008-07-29 | United Microelectronics Corp. | Three dimensional transformer |
| US8641419B2 (en) | 2007-07-25 | 2014-02-04 | David J. Clark | Methods and devices for fixed dental restoration |
| US7872852B2 (en) | 2008-02-12 | 2011-01-18 | United Microelectronics Corp. | Conductive structure having capacitor |
| KR101434403B1 (en) | 2008-05-15 | 2014-08-27 | 삼성전자주식회사 | Flash memory device, its programming method, and memory system including it |
| US7915135B2 (en) | 2009-04-30 | 2011-03-29 | United Microelectronics Corp. | Method of making multi-layer structure for metal-insulator-metal capacitor |
-
2012
- 2012-10-15 US US13/652,422 patent/US8724404B2/en active Active
-
2014
- 2014-03-26 US US14/225,435 patent/US8804440B1/en active Active
- 2014-03-26 US US14/225,432 patent/US8767485B1/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6992934B1 (en) * | 2005-03-15 | 2006-01-31 | Silicon Storage Technology, Inc. | Read bitline inhibit method and apparatus for voltage mode sensing |
| US8315089B2 (en) * | 2007-10-16 | 2012-11-20 | SK Hynix Inc. | Phase change memory device with improved performance that minimizes cell degradation |
| US20130222051A1 (en) * | 2012-02-24 | 2013-08-29 | Hsiang-Yi Chiu | Charge Pump Device and Driving Capability Adjustment Method Thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016196045A1 (en) * | 2015-05-29 | 2016-12-08 | Maxim Integrated Products, Inc. | Low power ultra-wide-band transmitter |
| US10530421B2 (en) | 2015-05-29 | 2020-01-07 | Maxim Integrated Products, Inc. | Low power ultra-wide-band transmitter |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140104962A1 (en) | 2014-04-17 |
| US8804440B1 (en) | 2014-08-12 |
| US8767485B1 (en) | 2014-07-01 |
| US8724404B2 (en) | 2014-05-13 |
| US20140204686A1 (en) | 2014-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9245647B2 (en) | One-time programmable memory cell and circuit | |
| JP2020510397A (en) | Low dropout regulator | |
| US9589657B2 (en) | Internal power supply voltage auxiliary circuit, semiconductor memory device and semiconductor device | |
| US20110038396A1 (en) | Temperature detecting device and method | |
| US8804440B1 (en) | Memory for a voltage regulator circuit | |
| KR101377155B1 (en) | Internal voltage generator and control method thereof, and semiconductor memory device and system incluting the same | |
| CN108231117B (en) | memory device | |
| US9360877B2 (en) | Negative voltage regulation circuit and voltage generation circuit including the same | |
| CN114300022B (en) | Antifuse programming control circuit based on master-slave charge pump structure | |
| US10482966B2 (en) | Block decoder of nonvolatile memory and level shifter | |
| US8982656B2 (en) | Non-volatile semiconductor memory device and semiconductor device | |
| CN110706726B (en) | Power-on reset circuit with stable power-on reset voltage | |
| JP5950647B2 (en) | Reference voltage circuit | |
| CN105027218B (en) | Resistive random access memory (RERAM) and conductive bridge-type random access memory (CBRAM) cross-linked fuse and read method and system | |
| US20080055996A1 (en) | Flash memory device including unified oscillation circuit and method of operating the device | |
| US8873295B2 (en) | Memory and operation method thereof | |
| CN114167929B (en) | Voltage generating circuit and electronic device | |
| US8526244B2 (en) | Anti-fuse circuit | |
| CN107665718B (en) | Charge transfer type sense amplifier | |
| US9941002B2 (en) | Resistive memory and memory cell | |
| TWI704564B (en) | Memory device and power control circuit thereof | |
| TWI517161B (en) | Supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array | |
| US10868467B1 (en) | Pump circuit, pump device, and operation method of pump circuit | |
| JP2011211608A (en) | Impedance adjustment circuit, and method of controlling the same | |
| KR20170067639A (en) | Resistive memory and memory cell thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: UNITED MICROELECTRONICS CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SHI-WEN;LU, HSIN-PENG;TSAI, CHUNG-CHENG;AND OTHERS;REEL/FRAME:032524/0203 Effective date: 20120925 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
| AS | Assignment |
Owner name: MARLIN SEMICONDUCTOR LIMITED, IRELAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:UNITED MICROELECTRONICS CORPORATION;REEL/FRAME:056991/0292 Effective date: 20210618 Owner name: MARLIN SEMICONDUCTOR LIMITED, IRELAND Free format text: ASSIGNMENT OF ASSIGNOR'S INTEREST;ASSIGNOR:UNITED MICROELECTRONICS CORPORATION;REEL/FRAME:056991/0292 Effective date: 20210618 |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |