US20140202675A1

US20140202675A1 - Heat dissipation unit used in memory device

Info

Publication number: US20140202675A1
Application number: US13/747,119
Authority: US
Inventors: Wei-Hau Chen; Chen-Fong LIN; Hsiao-Jung Lin
Original assignee: Comptake Tech Inc
Current assignee: Comptake Tech Inc
Priority date: 2013-01-22
Filing date: 2013-01-22
Publication date: 2014-07-24

Abstract

A heat dissipation unit used in a memory device includes two heat dissipation sheets, two sides at the top edge of each heat dissipation sheet are bent for respectively forming two lugs having a height difference, and two buckle pieces having a height difference between the two lugs, wherein each lug and each buckle piece of a heat dissipating sheet is mutually stacked onto a corresponding lug and buckle piece of the other heat dissipating sheet, respectively.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat dissipation unit, especially to a heat dissipation unit used in a memory device.
2. Description of Related Art
The computer hardware has been designed to have a higher speed and higher frequency for enhancing the working performance, so the consumed power is relatively higher; compared with related art, the newly-developed electronic unit generates a considerable amount of heat; take a memory device for instance, in order to match up with the high calculation speed of a processor, the clock and the transmission bandwidth are designed to be equipped with higher speed and higher frequency, so the working temperature of the memory device is inevitably raised and the generated heat is also considerable. The working temperature which gets higher and higher would affect the performance of the memory device or would even cause the memory device to be damaged.
The heat dissipation device used in a conventional memory device includes two heat dissipation sheets, and the two heat dissipation sheets are correspondingly installed and fitted at two opposite sides of the memory device, so the high temperature generated while the memory device is working could be dissipated through the two heat dissipation sheets, however, the two heat dissipation sheets have to be tightly and stably fitted at the two opposite sides of the memory device for performing the heat dissipation effect, so a complicated structural design is made for meeting the requirement of being tightly and stably fitted.
However, sometimes the design is overly complicated, an action of lifting to a proper angle has to be done for allowing the two heat dissipation sheets to be fitted with each other (not being fitted in parallel), such design is not suitable to be used for automatic and massive production and assembly; moreover, the securing between the two heat dissipation sheets is inadequate, so a movement may be generated between the two heat dissipation sheets thereby causing dislocation; the two dislocated heat dissipation sheets are not able to perform the anticipated heat dissipation effect, or the memory device may be slowed or damaged.
As such, the present invention provides a novel heat dissipation unit for improving the above-mentioned shortages.

SUMMARY OF THE INVENTION

The present invention is to provide a heat dissipation unit used in a memory device, wherein the assembly is enabled to be done by stacking and buckling with a means of being fitted in parallel, and a simplified structure is also provided thereby being suitable to be adopted in automatic and massive production and assembly and saving the labor cost.
In another aspect, the present invention is to provide a heat dissipation unit used in a memory device, wherein any end of the heat dissipation unit is enabled to be crossly stacked with each other, and a first and a fourth buckle pieces are enabled to be mutually buckled and a second and a third buckle pieces are enabled to be mutually buckled, thereby achieving a buckling and fastening effect capable of completely retraining any movement and preventing dislocation.
Accordingly, the present invention provides a heat dissipation unit used in a memory device, which includes a first sheet dissipation sheet, two sides at the top edge thereof being bent for respectively forming a first lug and a second lug having a height difference relative to the first lug, and a first buckle piece and a second buckle piece having a height difference relative to the first buckle piece between the first lug and the second lug; and a second sheet dissipation sheet, two sides at the top edge thereof being bent for respectively forming a third lug and a fourth lug having a height difference relative to the third lug, and a third buckle piece and a fourth buckle piece having a height difference relative to the third buckle piece between the third lug and the fourth lug; the first lug and the fourth lug are mutually stacked onto each other, the second lug and the third lug are mutually stacked onto each other, the first buckle piece and the fourth buckle piece are mutually stacked onto each other and buckled, and the second buckle piece and the third buckle piece are mutually stacked onto each other and buckled.
In comparison with related art, the present invention has advantageous features as follows. The assembly can be done without an action of lifting to a proper angle prior to the fitting; a simplified structure is provided thereby being suitable for automatic and massive production thereby saving the labor cost; any end of the heat dissipation unit can be for crossly stacking, wherein the first and the fourth buckle pieces and the second and the third buckle pieces are enabled to be buckled with each other, thereby restraining any movement between the two heat dissipation sheets and preventing dislocation.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 is a perspective exploded view showing the heat dissipation unit according to a preferred embodiment of the present invention;

FIG. 2 is a perspective exploded view showing the structure between the heat dissipation unit and a memory device according to a preferred embodiment of the present invention;

FIG. 3 is a perspective assembled view showing the structure between the heat dissipation unit and the memory device according to a preferred embodiment of the present invention; and

FIG. 4 is a cross sectional view of FIG. 3 in another preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

A preferred embodiment of the present invention will be described with reference to the drawings.
The present invention provides a heat dissipation unit used in a memory device, wherein FIG. 1 is a perspective exploded view showing the heat dissipation unit 100 according to a preferred embodiment of the present invention; FIG. 2 is a perspective exploded view showing the structure between the heat dissipation unit 100 and a memory device 400 according to a preferred embodiment of the present invention; FIG. 3 is a perspective assembled view showing the structure between the heat dissipation unit 100 and the memory device 400 according to a preferred embodiment of the present invention; and FIG. 4 is a cross sectional view illustrating the heat dissipation unit 100 and the memory device 400 after being assembled.
Please refer to FIG. 1 and in accordance with FIG. 2 and FIG. 3. The heat dissipation unit 100 used in memory device is fitted at two opposite sides of a memory device 400 (as shown in FIG. 2) for the purpose of heat dissipation. The heat dissipation unit 100 includes two identical heat dissipation sheets; according to this embodiment of the present invention, a first heat dissipation sheet 1 and a second heat dissipation sheet 1 a identical to the first dissipation sheet 1 are adopted, thus the first heat dissipation sheet 1 and the second heat dissipation sheet 1 a can be made by a same mold thereby reducing the expenditure for mold casting.
The first heat dissipation sheet 1 is formed with a first fitting surface 14 facing the rear direction, and two sides at the top edge of the first heat dissipation sheet 1 are bent for respectively forming a first lug 111 and a second lug 121 having a height difference relative to the first lug 111 and both protruding towards the first fitting surface 14, and a first buckle piece 112 and a second buckle piece 122 having a height difference relative to the first buckle piece 112 between the first lug 111 and the second lug 121. Wherein, the first buckle piece 112 is disposed close to the first lug 111 and a height difference is formed between the first buckle piece 112 and the first lug 111, thereby forming a first buckling structure 11; the second buckle piece 122 is disposed close to the second lug 121 and a height difference is formed between the second buckle piece 122 and the second lug 121, thereby forming a second buckling structure 12. In addition, the first buckle piece 112 is formed with a buckle hole 113, the second buckle piece 122 is formed with a buckle protrusion 123 corresponding to the buckle hole 113, and the buckle protrusion 123 of the second buckle piece 122 is enabled to be buckled in the buckle hole 113 of the first buckle piece 112.
The structure of the second heat dissipation sheet 1 a is the same as that of the first heat dissipation sheet 1, the second heat dissipation sheet 1 a includes a third lug 111 a and a fourth lug 121 a, a third buckle piece 112 a and a fourth buckle piece 122 a, and a second fitting surface 14 a facing the front direction; the third lug 111 a, the fourth lug 121 a, the third buckle piece 112 a and the fourth buckle piece 122 a are all protruded towards the second fitting surface 14 a. Wherein, the third buckle piece 112 a and the third lug 111 a form the first buckling structure 11, the fourth buckle piece 122 a and the fourth lug 121 a form the second buckling structure 12, and the third buckle piece 112 a is formed with a buckle hole 113 and the fourth buckle piece 122 a is formed with a buckle protrusion 123.
Substantially, the first buckling structure 11 and second right buckling structure 12 are enabled to be correspondingly buckled and fastened with each other; under the circumstance of the second heat dissipation sheet 1 a being the identical to the first heat dissipation sheet 1, the second heat dissipation sheet 1 a is enabled to be buckled with the first heat dissipation sheet 1 through being rotated for 180 degrees.
In assembling, the first lug 111 and the fourth lug 121 a are correspondingly stacked onto each other with a means of being fitted in parallel, the second lug 121 and the third lug 111 a are correspondingly stacked onto each other with a means of being fitted in parallel, the first buckle piece 112 and the fourth buckle piece 122 a are correspondingly stacked onto each other with a means of being fitted in parallel, and the second buckle piece 122 and the third buckle piece 112 a are also correspondingly stacked onto each other with a means of being fitted in parallel, thereby enabling the left and the right side of the heat dissipation unit 100 to be stably buckled and fastened. In details, the fourth lug 121 a is pressed on the first lug 111, the first buckle piece 113 is pressed on the fourth buckle piece 122 a, so the left side of the heat dissipation unit 100 is crossly stacked with a means which will be described hereinafter; the second lug 121 is pressed on the third lug 111 a, the third buckle piece 112 a is pressed on the second buckle piece 122, so the right side of the heat dissipation unit 100 is crossly stacked with a means which will be described hereinafter.
Accordingly, the buckling means for the left and the right side of the heat dissipation unit 100 are totally the same, in which the first buckling structure 11 of one heat dissipation sheet is buckled with the second buckling structure 12 of another heat dissipation sheet, and the two lugs 111, 121 a and the two buckle pieces 112, 122 a at the left side of the heat dissipation unit 100 are crossly stacked, and the two lugs 121, 111 a and the two buckle pieces 122, 112 a at the right side are crossly stacked, thereby achieving an effect of restraining an up/down movement; the first and the fourth buckle pieces 112, 122 a and the second and the third buckle pieces 122, 112 a are enabled to be buckled with each other, thereby achieving an effect of restraining a front/rear movement and a left/right movement. Please refer to FIG. 2 and FIG. 4, according to this embodiment, the rear of the buckle hole 113 of the first buckle piece 112 is formed with a first buckle inner flange 1131 (as shown in FIG. 4), the front of the buckle hole 113 of the third buckle piece 112 a is formed with a second buckle inner flange 1131 a (as shown in FIG. 2), the buckle protrusion 123 of the second buckle piece 122 is formed with a small area part 1233 corresponding to the first buckle inner flange 1131 thereby being enabled to be abutted with each other, the buckle protrusion 123 of the fourth buckle piece 122 a is formed with another small area part 1233 corresponding to the second buckle inner flange 1131 a thereby being enabled to be abutted with each other.
In details, the buckle protrusion 123 is protruded from the top surface of the second buckle piece 122 or the fourth buckle piece 122 a; as shown in FIG. 2, the buckle protrusion 123 is formed as a wedge having a bottom area part 1231, a large area part 1232 and the small area part 1233, the bottom area part 1231 is fitted to the top surface of the second buckle piece 122 or the fourth buckle piece 122 a, and the large area part 1232 is oriented to face towards the first fitting surface 14 or the second fitting surface 14 a; in another words, the large area part 1232 is oriented to face towards the bending direction (or protruding direction) of the second buckle piece 122 or the fourth buckle piece 122 a). In another preferred embodiment, the buckle protrusion 123 can be formed by punching as shown in FIG. 4, so as to be formed with a protruding member having the exposed large area part 1232 and the exposed small area part 1233.
A beam member 131, which is protruded and oriented to face the fitting surface 14, 14 a, is formed between the first and the second buckling structures 11,12 at the top edge of each of the heat dissipation sheets 1, 1 a, and two sides of the beam member 131 are respectively spaced from the first and the second buckling structure 11, 12 at an interval, so when two heat dissipation sheets 1, 1 a are mutually fitted, the two beam members 131 are combined for forming a shield plate 13 used for shielding the top edges of the two heat dissipation sheets 1, 1 a, thereby providing an embellishing effect.
The fitting surfaces 14, 14 a of the two heat dissipation sheets 1, 1 a are not only provided with a heat conductive medium 3 respectively, but also formed with at least two rows of heat dissipation holes allowing hot air to flow out, the two rows of heat dissipation holes respectively have plural upper heat dissipation holes 15 and plural lower heat dissipation holes 16, and each of the upper heat dissipation holes 15 is staggeringly arranged with each of the corresponding lower heat dissipation holes 16 (i.e. being arranged on different perpendicular); as shown in the figures, hot air is able to flow out from each of the upper heat dissipation holes 15 and each of the lower heat dissipation holes 16, thereby providing a hot air distribution effect. Moreover, all the heat dissipation holes of each of heat dissipation sheets are arranged between the location where the heat conductive medium 3 being provided and the top edge of the heat dissipation sheet 1, 1 a, so the heat dissipation holes are all formed at the upper portion of the heat dissipation unit 100 (as shown in FIG. 4), thereby complying the principle of hot air ascending and allowing the hot air to be discharged more effectively.
Please refer to FIG. 4, the memory device 400 includes a circuit board 4 and memory chips 41 respectively and electrically disposed at two opposite sides of the circuit board 4, the two heat dissipation sheets 1, 1 a respectively utilize the heat conductive medium 3 for being adhered on the memory chips 41 arranged at the two opposite sides of the memory device 400, thereby providing an effect of assisting heat to be dissipated from the memory chips 41.
As what has been disclosed above, the present invention has following advantageous features comparing to related art: the assembly can be done by stacking and buckling with a means of being fitted in parallel, so an action of lifting to a proper angle for being fitted is not needed; in addition, the present invention provides a simplified structure which can be massively produced and assembled thereby saving the labor cost; moreover, any end of the heat dissipation unit 100 can be used for crossly stacking by restraining of the two heat dissipation sheets 1, 1 a from up/down movement, and the first and the fourth buckle pieces 112, 122 a and the second and the third buckle pieces 122, 112 a are enabled to be buckled with each other, thereby restraining the two heat dissipation sheets from front/rear and left/right movements, thereby achieving a buckling and fastening effect capable of completely retraining any movement, so dislocation caused by movement is prevented.
Furthermore, the present invention has more advantageous features, such as, through the shielding of the shield plate 13, the heat dissipation unit 100 is provided with the embellishing effect; the heat dissipation effect can be enhanced through the upper and the lower heat dissipation holes 15, 16, and with the design of the upper and the lower heat dissipation holes 15, 16 being staggeringly arranged, the hot air distribution effect is provided; the upper and the lower heat dissipation holes 15, 16 are formed at the upper portion of the heat dissipation unit 100, thereby complying the principle of hot air ascending and allowing the hot air to be discharged more effectively.
Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

What is claimed is:

1. A heat dissipation unit used in a memory device, including:

a first sheet dissipation sheet, two sides at the top edge of the first sheet dissipation sheet being bent for respectively forming a first lug and a second lug having a height difference relative to the first lug, and a first buckle piece and a second buckle piece having a height difference relative to the first buckle piece between the first lug and the second lug; and

a second sheet dissipation sheet, two sides at the top edge of the second sheet dissipation sheet being bent for respectively forming a third lug and a fourth lug having a height difference relative to the third lug, and a third buckle piece and a fourth buckle piece having a height difference relative to the third buckle piece between the third lug and the fourth lug;

wherein the first lug and the fourth lug are mutually stacked onto each other, the second lug and the third lug are mutually stacked onto each other, the first buckle piece and the fourth buckle piece are mutually stacked onto each other and buckled, and the second buckle piece and the third buckle piece are mutually stacked onto each other and buckled.

2. The heat dissipation unit according to claim 1, wherein the first buckle piece is disposed close to the first lug and a height difference is formed between the first buckle piece and the first lug, the second buckle piece is disposed close to the second lug and a height difference is formed between the second buckle piece and the second lug, the third buckle piece is disposed close to the third lug and a height difference is formed between the third buckle piece and the third lug, and the fourth buckle piece is disposed close to the fourth lug and a height difference is formed between the fourth buckle piece and the fourth lug; the fourth lug is pressed on the first lug, the first buckle piece is pressed on the fourth buckle piece, the second lug is pressed on the third lug, and the third buckle piece is pressed on the second buckle piece.

3. The heat dissipation unit according to claim 1, wherein the first buckle piece is formed with a first buckle hole, the fourth buckle piece is formed with a first buckle protrusion corresponding to the buckle hole, and the first buckle piece and the fourth buckle piece are mutually buckled through the first buckle protrusion being buckled in the first buckle hole; the third buckle piece is formed with a second buckle hole, the second buckle piece is formed with a second buckle protrusion corresponding to the second buckle hole, and the third buckle piece and the second buckle piece are mutually buckled through the second buckle protrusion being buckled in the second buckle hole.

4. The heat dissipation unit according to claim 3, wherein the second buckle protrusion of the first heat dissipation sheet is protruded from a top surface of the second buckle piece, and the second buckle protrusion is formed as a first wedge having a large area part oriented to face towards a bending direction of the second buckle piece and a small area part; the first buckle protrusion of the second heat dissipation sheet is protruded from a top surface of the fourth buckle piece, and the first buckle protrusion is formed as another wedge oriented to face towards a bending direction of the fourth buckle piece and a small area part is.

5. The heat dissipation unit according to claim 1, wherein a beam member is formed between the first buckle piece and the second buckle piece at the top edge of the first heat dissipation sheet; another beam member is formed between the third buckle piece and the fourth buckle piece of the second heat dissipation sheet; two beam members of the first and the second heat dissipation sheets are combined for forming a shield plate used for shielding the top edge of the first heat dissipation sheet and the top edge of the second heat dissipation sheet.

6. The heat dissipation unit according to claim 5, wherein two sides of the beam member of the first heat dissipation sheet are respectively spaced from the first buckle piece and the second buckle piece at an interval; two sides of the beam member of the second heat dissipation sheet are respectively spaced from the third buckle piece and the fourth buckle piece at an interval.

7. The heat dissipation unit according to claim 1, wherein the first heat dissipation sheet is further formed with at least two rows of heat dissipation holes staggeringly arranged, and the second heat dissipation sheet is further formed with at least two rows of another heat dissipation holes staggeringly arranged.

8. The heat dissipation unit according to claim 7, wherein the first heat dissipation sheet is formed with a first fitting surface on which a first heat conductive medium is provided; the second heat dissipation sheet is formed with a second fitting surface on which a second heat conductive medium is provided.

9. The heat dissipation unit according to claim 8, wherein the at least two rows of heat dissipation holes of the first heat dissipation sheet are arranged between the location where the first heat conductive medium being provided and the top edge of the first heat dissipation sheet;

the at least two rows of heat dissipation holes of the second heat dissipation sheet are arranged between the location where the second heat conductive medium being provided and the top edge of the second heat dissipation sheet.

10. The heat dissipation unit according to claim 1, wherein the first heat dissipation sheet is formed with a first fitting surface facing a first direction, and the second heat dissipation sheet is formed with a second fitting surface facing a second direction opposite to the first direction; the first lug, the second lug, the first buckle piece and the second buckle piece of the first heat dissipation sheet are all protruded towards the first fitting surface in the same direction; the third lug, the fourth lug, the third buckle piece and the fourth buckle piece of the second heat dissipation sheet are all protruded towards the second fitting surface in the same direction; the first buckle hole of the first buckle piece is formed with a first buckle inner flange, the second buckle hole of the third buckle piece is formed with a second buckle inner flange; the second buckle protrusion of the second buckle piece is formed with a small area part corresponding to the first buckle inner flange thereby being enabled to be abutted with each other; the first buckle protrusion of the fourth buckle piece is formed with another small area part corresponding to the second buckle inner flange thereby being enabled to be abutted with each other.