[go: up one dir, main page]

US20140131742A1 - LED Spirit Connector System and Manufacturing Method - Google Patents

LED Spirit Connector System and Manufacturing Method Download PDF

Info

Publication number
US20140131742A1
US20140131742A1 US14/076,711 US201314076711A US2014131742A1 US 20140131742 A1 US20140131742 A1 US 20140131742A1 US 201314076711 A US201314076711 A US 201314076711A US 2014131742 A1 US2014131742 A1 US 2014131742A1
Authority
US
United States
Prior art keywords
led
chain
tube
light source
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/076,711
Other languages
English (en)
Inventor
Andrey Zykin
Alcinda Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LED SPIRIT Inc
LED SPIRIT SYSTEMS
Original Assignee
LED SPIRIT Inc
LED SPIRIT SYSTEMS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LED SPIRIT Inc, LED SPIRIT SYSTEMS filed Critical LED SPIRIT Inc
Priority to US14/076,711 priority Critical patent/US20140131742A1/en
Assigned to LED SPIRIT SYSTEMS reassignment LED SPIRIT SYSTEMS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZYKIN, ANDREY, MILLER, ALCINDA
Publication of US20140131742A1 publication Critical patent/US20140131742A1/en
Assigned to LED SPIRIT INC reassignment LED SPIRIT INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZYKIN, ANDREY, MILLER, ALCINDA
Priority to US14/989,184 priority patent/US10128426B1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H01L33/647—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W90/753—

Definitions

  • the present invention relates to Light Emitting Diodes (LEDs) mounting within electrical and mechanical structures, and in particular to devices, systems and methods for the efficient and inexpensive removal of heat from the LEDs in LED light fixtures.
  • LEDs Light Emitting Diodes
  • LEDs promise to revolutionize illumination, through their ultra efficient conversion of energy into visible light.
  • CFL Compact Fluorescent Light bulb
  • An LED is an element in which electrons and holes are combined in a P-N semiconductor junction structure by application of current thereby emitting certain types of light.
  • LEDs are typically formed to have a package structure, in which an LED chip is mounted on a mechanical carrier, frequently referred to as an “LED package.”
  • LED package is generally mounted on a printed circuit board (PCB) and receives current applied from electrodes formed on the PCB to thereby emit light.
  • PCB printed circuit board
  • LED sticks In general illumination applications, engineers have discovered the importance of generating light in a 360 deg. envelope, not unlike the way in which an incandescent filament illuminates. To accomplish such goals, a new type of package termed an LED sticks or LED straw has been created. In it, individual LEDs are serially placed along a thin sleeve or slice of material, typically made of a sapphire or ceramic material. The stick is powered from each end, creating a stick of light.
  • heat generated from the LED chip has a direct influence on the light emitting performance and life span of the LED package.
  • heat generated from the LED chip is not effectively removed, dislocation and mismatch occur in a crystal structure of the LED chip.
  • brightness is related to power applied, so a large amount of heat is generated in an LED chip due to the high currents, heat that must be typically transferred to a heat sink, typically, a separate device for effectively dissipating the generated heat is required.
  • LEDs are typically mounted on printed circuit boards (PCBs), which are used to mechanically support and electrically connect the LEDs to electronic drivers (power supplies, amplifiers, etc.) using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate.
  • This substrate is typically a dielectric or insulator. Some of these dielectrics include Teflon, FR-4, FR-1, CEM-1 or CEM-3.
  • the above has a significant limitation, the thermal transfer from the LED package to the heat sink, is going through a plastic, not the optimal way in which to efficiently transfer heat. What is needed, is a way in which to mechanically support and electrically connect the LED package to a heat sink with the highest efficiency possible.
  • the invention is about an LED light source system comprising two or more LED packages connected in series forming an LED chain so that each individual LED package within said chain has one or more electrical contacts formed along opposite sides of said package side, said electrical contacts electrically and mechanically connected along the length of said chain between neighboring LED.
  • one or more of the LED packages forming said chain has said package upper and/or lower LED lead bent and formed as a clip, clamp or spring along all or portion of said lead length.
  • the initial LED package located at said chain near end, and the final LED package located at said chain distal end are connectable to a power source.
  • said LED chain is inserted into a container shaped as a tube and secured within said tube by said LED leads.
  • said LED leads are secured to slots within said tube interior.
  • said LED chain is inserted into a container shaped as a bulb or lamp.
  • two or more of said LED chains are concatenated to form a supra chain.
  • said supra chain is inserted into a container shaped as a tube and secured within said tube by said LED leads.
  • said LED leads are secured to slots within said tube interior.
  • said LED chain is inserted into a container shaped as a bulb or lamp.
  • the invention is about an LED light source matrix comprising two or more LED packages connected in series forming an LED chain so that each individual LED package within said chain has one or more electrical contacts formed along opposite sides of said package side, said electrical contacts electrically and mechanically connected along the length of said chain between neighboring LED and within two or more neighboring rows of said LED chains, wherein at least one said LED package occupying the same respective column position within said matrix has at least one of said package upper and/or lower LED lead connected to its respective counterpart above or below it within said matrix.
  • said LED matrix is inserted into a container shaped as a bulb or lamp.
  • one or more of the LED leads from said LED matrix first and last rows are appropriately shaped and inserted into a container shaped as a bulb so that said LED leads can secure said matrix within said bulb interior.
  • said LED matrix is inserted into a container shaped as a tube and secured within said tube by said LED leads.
  • said LED leads are secured to slots within said tube interior.
  • one or more of the LED leads from said LED matrix first and last rows are appropriately shaped and thermally connected to a heat sink, then inserted into a container shaped as a tube so that said LED leads can secure said matrix within said tube interior.
  • the invention is about a method for manufacturing an LED light source system, said method comprising configuring two or more LED packages connected in series forming an LED chain so that each individual LED package within said chain has one or more electrical contacts formed along opposite sides of said package side, said electrical contacts electrically and mechanically connected along the length of said chain between neighboring LED and ensuring that one or more of the LED packages forming said chain has said package upper and/or lower LED lead bent and formed as a clip, clamp or spring along all or portion of said lead length.
  • it further comprises configuring the initial LED package located at said chain near end, and the final LED package located at said chain distal end are connectable to a power source.
  • the invention comprised inserting said LED chain into a container shaped as a tube and secured within said tube by said LED leads.
  • the method comprises ensuring said LED chain when inserted into a container shaped as a tube and secured within said tube by said LED leads.
  • the method further comprises inserting said LED leads securely to slots within said tube interior.
  • FIGS. 1-4 show some prior art illustrations for LED technology.
  • FIGS. 5-11 show illustrations of the improved LED mechanical/electrical packaging options, according to exemplary embodiments of the invention.
  • FIGS. 12-15 show illustrations of LED packaging options, according to exemplary embodiments of the invention.
  • FIGS. 16-41 show illustrations of improved mechanical/electrical/heat dissipation options, according to exemplary embodiments of the invention.
  • lead frames or lead LED frames 100 which are used today to distribute and ship LED packages 102 (said packages comprised of both lensed LED packages and non-lensed ones) throughout the industry.
  • These frames consist of a lattice 106 having one or more orthogonal horizontal 108 and vertical 110 members that hold the LEDs in place, and are used for shipping from LED mfr. to the LED light fixture assembly mfr.
  • the LEDs 102 are cut off from the frame strips lattice members 108 , 110 and become loose, independent, individual light-emitting diodes LEDs 102 . During manufacturing, the LEDs 102 are then soldered onto a printed-circuit board (PCB) 402 .
  • PCB printed-circuit board
  • the above has a large number of disadvantages, one of the primary ones being the fact that the already aligned and prepositioned LEDs 102 are loosened, before being re-attached to the PCB 402 .
  • This step requires machinery to align and position the LEDs 102 .
  • the proposed solution described here is to completely eliminate the PCB 402 used to position the LEDs 102 by making certain changes to the Lead LED Frame (LLF) 100 when manufacturing the LEDs 102 .
  • the LEDs 102 are first stamped out, pressed from plastic, electrical and other holders made, crossing points, etc. cut off and then the LEDs are created, then cut off from the frame 100 , sorted, aligned and then soldered to PCB.
  • one or more LED 102 electrical contacts are formed on either side of the LED package 102 (side one 504 and side two 506 ). These are the electrical leads used to power the LED, which are later bent for surface mount attachment to the PCB).
  • the LED is held to the frame by the LED holders 508 , 510 which are usually on two remaining sides of the LED package. These are used to hold the LED package to the lead frame, and are later cut-off after the LED 102 is manufactured.
  • the LEDs 102 are rotated 90 degrees in the design for the forming machine, so that the one or more electrical contacts 604 , 606 , 608 , 610 , 612 , 614 are formed along each side forming the rows of the lead frame (and between neighboring LEDs), and the LED holders 508 , 510 (not electrically connected to the LED) are extended along the column to provide support for the inner members.
  • the LEDs 102 are connected as a long single-pearl string 902 , by a joint 904 between each LED 102 .
  • Power is applied at one end, and flows along the row to power each LED 102 by a suitable power source. After so many LEDs, the LED chain may require electrical ending. However a light fixture formed by a chain of LED chains (say a supra chain) formed by the mechanical linkage of two or more LED chains, with separate electrical power connections going to the various LED chains integrating the supra chain. If required, resistors and other components may be stamped along each or every so many of the LEDs 102 joints 904 .
  • the individual LEDs 102 are assembled or stamped into a two dimensional matrix 702 in which the rows 704 , 706 , 708 share the power connections (an LED matrix formed of LED chains).
  • the connections between neighbors along the rows are connected through traditional metal stamping techniques, and may include resistors and other components placed at either the ends or after a number of LEDs.
  • the electrical power connection is attached at either end of a number of LEDs on a column, and daisy chained along the row of the matrix. Resistors such as these are typically used as current limiters to prevent against overdriving of the electronics.
  • the LED leads are left uncut, so that within two or more neighboring rows of said LED chains, at least one said LED package occupying the same respective column position within said matrix has at least one of said package upper and/or lower LED lead connected to its respective counterpart above or below it within said matrix.
  • the above matrix may be powered column-wise (with the power supply connected along the LED's occupying the first and last columns), or as a supra chain (where the end of each matrix row) is electrically connected to the beginning of another row within the column.
  • Said LED matrix may then be bent into tube, squares or any other suitable shape.
  • the LED holder leads 508 , 510 are not cut or clipped, but instead formed as clips, clamps and/or springs along its length or at/near their end 710 , 712 so as to mechanically and thermally attach the LEDs to the heat sink 1000 . While electrically isolated through either special coatings or encapsulation, they are thermally connected to the LED 102 package, so that efficient, metal-to-metal heat transfer channels are provided. Note a further advantage of this approach, is that these holder leads 508 , 510 act as radiating heat sinks.
  • the above allows for the voltage connections 602 (as well as 604 , 606 , 608 , 610 , 612 , 614 and any others) to be held above the datum plane of any heat sink, allowing for the insulation of air to keep voltages from mixing or short-circuiting.
  • Such an approach affords the opportunity to build an electrically connected electrical lead frame with no PCB that is capable of operating in a similar way.
  • the electrical insulation of the voltage channels ( 714 , 716 ) is accomplished by elevating these above the datum of the heat sink 402 .
  • such a linear ‘necklace’ or LED strip 1202 is formed when all LEDs 102 are connected through traditional technological interconnectors and holders capable of manufacturer through traditional precise micro-molding injection.
  • an encapsulated electrical connection 1204 instead of the PCB carries out the electrical interconnections and mechanical holders between LEDs 102 . In such a connection there is no soldering, and all connections represent monolithic, isolated electrical links within an insulated housing.
  • the plastic housing 1302 of the LED 102 may be configured so that the snap-on of the plastic creates the electrical connections between LEDs 102 , which greatly increases reliability and durability of contacts between packages 1304 , 1306 , 1308 , transitional electro resistance decreases because of no soldering points.
  • connection between the various LED packages 102 is accomplished by wires 1502 .
  • the fold in the connection between LEDs is formed as a S or Z or fold in one embodiment, allowing flexible bending of the connection between LEDs.
  • FIGS. 16-17 we illustrate a PCB-less system as part of a fluorescent bulb replacement for the T-5 and T-8 bulb standards.
  • the LEDs may be arranged linearly or in matrix form. It should be noted that the lack of a PCB provides for a much wider angle of light (as the PCB does not cause a shadow).
  • FIGS. 18-21 we see an embodiment where three or more parallel strips 1802 of LEDs are formed into an LED matrix that may be then shaped cylindrical form or LED roll 1902 and powered from one end to the other.
  • the flexibility stated before, can be appreciated in an embodiment where the LED roll 1902 is fitted inside the body of a traditional light bulb or lamp volume 2202 ( FIG. 22 ) is used to provide Omni-directional light.
  • the LED roll is shaped as a tapered cone, improving the light distribution.
  • a flexible matrix lattice arrangement 2502 is curved to fit within the contour of the bulb, lamp or a linear package.
  • the driving electronics may be located within the base of the bulb 2504 .
  • the LED roll 1902 is formed and inserted within a tube (such as a T-5/T-8 or other similar extended tube), so that they may replace a fluorescent tube within such a light fixture.
  • a tube such as a T-5/T-8 or other similar extended tube
  • one or more strips 1802 are inserted within one or more slots 2702 built into said tube 2704 or they may be formed into a LED tube or cylinder 1902 and then inserted into the enclosure tube 2704 .
  • Said enclosure tube may have the aforementioned slots 2702 .
  • a gas mix i.e. bulbs, lamps or the T-5/T-8 tubes 2704 .
  • the complete lighting package may be immersed in a cooling fluid, which may be a dielectric to preserve electrical integrity while providing cooling.
  • a cooling fluid which may be a dielectric to preserve electrical integrity while providing cooling.
  • Such fluids may include inert gases.
  • a single strand LED chain 1202 which in one embodiment we mount to a mechanical strip 2802 with a series of openings that match those of the string 902 .
  • the strip acts as both a mechanical holder, and a heat transfer device for the LED packages.
  • the ends of the strip 2802 are bent (in one embodiment as an ‘S’, ‘Z’, or any other “spring” form 3002 , in order to form a compression spring insert, so that when the strip 2802 is slid within the housing of said tube 2704 it forms a constant and efficient metal-to-metal heat transfer medium to the housing, which acts here as the heat sink.
  • the strip 2802 , the spring 3402 and insert legs 3404 act themselves as radiators.
  • a base 2902 incorporating a layer of a material such as CERATOM 912 could be used. Acting as an efficient heat conducting dielectric, this would ensure efficient heat transfer to the heat sink 3002 and any fins or radiators attached thereto.
  • the LED matrix or grid is held above the heat sink, using only the edge 3202 connections to transfer the heat, resulting in an inexpensive, non-PCB solution.
  • the complete lighting package may be immersed in a cooling fluid, which may be a dielectric to preserve electrical integrity while providing cooling. This may include inert gases.
  • the strips of LEDs may then be inserted into a suitably modified T-5, T-8 or other suitable enclosure tube 2704 .
  • Said enclosure tube may have the aforementioned slots 2702 or be smooth and have the leads 3402 from the LED strips 1802 bent so they extend outside of the strips without significantly occluding the light emitted from the LEDs.
  • they mechanically support the LED strips 1802 within the enclosure tube 2704 .
  • the coating of yellowing phosphor described above may be applied near the periphery of the encapsulation 3502 , above the actual LED die area 3602 or directly above the LED die on a traditional package 3702 .
  • An LED light emitting bar, pole, filament, or candle could have a size of bar that is plastic covered in length of 30 mm, diameter of 2.5 to 3.5 mm, having a size of bar with connectors of 38-40 mm.
  • the quantity of light chips 200 within a single candle could be 26 pcs, in the 465-475 nm, having a serial connection.
  • Top attach, using an eutectic placement, wire bonding Au or Al with Au plated-chipper.
  • Wire bonding could be done by 1 wire to LED die, or by 2 wires on same LED die “Leg” size of L 5.0 ⁇ W 0.7 ⁇ T 0.7 or L 5.0 ⁇ W 0.5 ⁇ T 0.5 mm. LED die “Leg” goes throughout of plastic for 3.0-4.0 mm.
  • Epoxy cover LED compatible, phosphor compatible, no need for weather protection, bar will be insulated inside and protected Plastic (Epoxy): mixed with phosphor, molded over metal “legs” with LED dies Plastic (Epoxy). Especially shaped for better light output and distribution, cylindrical stars. Microscopic view: bar inside, single wire bonding, eutectic die attach, die thickness ⁇ 10 mil
  • the system could be used as replacement for incandescent light bulbs filaments, since due to its shape it could also be used as replacement for “gas discharge line” in T8, T5 fluorescent tubes.
  • PCB Printed Circuit Board
  • the separated, independent heat sink for every LED die (chip) in a bar would provide one of the best heat dissipation ability for LED dies, due to the ratio of sizes between LED die and size of the heat sink.

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
US14/076,711 2012-11-12 2013-11-11 LED Spirit Connector System and Manufacturing Method Abandoned US20140131742A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/076,711 US20140131742A1 (en) 2012-11-12 2013-11-11 LED Spirit Connector System and Manufacturing Method
US14/989,184 US10128426B1 (en) 2013-11-11 2016-01-06 LS core LED connector system and manufacturing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201261725196P 2012-11-12 2012-11-12
US201261725191P 2012-11-12 2012-11-12
US201261737459P 2012-12-14 2012-12-14
US201261737422P 2012-12-14 2012-12-14
US201261737437P 2012-12-14 2012-12-14
US14/076,711 US20140131742A1 (en) 2012-11-12 2013-11-11 LED Spirit Connector System and Manufacturing Method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/989,184 Continuation-In-Part US10128426B1 (en) 2013-11-11 2016-01-06 LS core LED connector system and manufacturing method

Publications (1)

Publication Number Publication Date
US20140131742A1 true US20140131742A1 (en) 2014-05-15

Family

ID=50680874

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/076,711 Abandoned US20140131742A1 (en) 2012-11-12 2013-11-11 LED Spirit Connector System and Manufacturing Method
US14/076,682 Active - Reinstated US9240538B2 (en) 2012-11-12 2013-11-11 LED spirit system and manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/076,682 Active - Reinstated US9240538B2 (en) 2012-11-12 2013-11-11 LED spirit system and manufacturing method

Country Status (2)

Country Link
US (2) US20140131742A1 (fr)
WO (2) WO2014075001A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130335967A1 (en) * 2011-03-03 2013-12-19 Osram Gmbh Lighting device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10128426B1 (en) 2013-11-11 2018-11-13 Andrey Zykin LS core LED connector system and manufacturing method
US10043783B1 (en) 2013-11-11 2018-08-07 Andrey Zykin LED spirit system and manufacturing method
DE102017127721A1 (de) * 2017-11-23 2019-05-23 Osram Opto Semiconductors Gmbh Led-filament mit konversionsschicht
FR3107944B1 (fr) * 2020-03-05 2022-02-11 Bordes Jacques Système LED sans dissipateur thermique
CN111810860A (zh) * 2020-07-01 2020-10-23 深圳市科利尔照明有限责任公司 一种可多方向弯曲的led灯带及其led灯串结构
CN112397628B (zh) * 2021-01-11 2021-11-09 江苏明纳半导体科技有限公司 一种高效的led自动封装装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5655830A (en) * 1993-12-01 1997-08-12 General Signal Corporation Lighting device
US20030193803A1 (en) * 2002-04-16 2003-10-16 Yuan Lin Flexible rod light device formed of chip on board based LED lamps and manufacturing method thereof
US20040196643A1 (en) * 2003-04-04 2004-10-07 Toshiyuki Terada Photography light source device
US20040252501A1 (en) * 2002-04-24 2004-12-16 Hideo Moriyama Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
US20050007033A1 (en) * 2003-07-09 2005-01-13 Tir Systems Ltd. Strip lighting system incorporating light emitting devices
US20050024866A1 (en) * 2002-01-18 2005-02-03 Homan Petrus Josephus Device for radiating light
US20090009997A1 (en) * 2007-06-21 2009-01-08 James Sanfilippo Modular lighting arrays
US7594738B1 (en) * 2008-07-02 2009-09-29 Cpumate Inc. LED lamp with replaceable power supply
US20110211339A1 (en) * 2010-02-26 2011-09-01 Qing Rong Technology Inc. Light emitter diode module
US20110249469A1 (en) * 2010-04-12 2011-10-13 Young-Keun Lee Light source unit and backlight assembly having the same
US20110267814A1 (en) * 2010-05-03 2011-11-03 Moon Kyung-Mi Illumination apparatus employing light-emitting device package

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2142176C1 (ru) * 1997-06-10 1999-11-27 Карпович Нина Васильевна Источник света
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
US20050127833A1 (en) * 2003-12-10 2005-06-16 Tieszen Dwayne A. White light LED and method to adjust the color output of same
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
TWI309480B (en) * 2006-07-24 2009-05-01 Everlight Electronics Co Ltd Led packaging structure
KR101186648B1 (ko) * 2009-12-21 2012-09-28 서울반도체 주식회사 Ｌｅｄ 패키지 및 그의 제조 방법
EP2535640B2 (fr) * 2010-09-08 2020-09-23 Zhejiang Ledison Optoelectronics Co., Ltd. Ampoule del et néon del assurant un éclairage 4 pi
DE102011114882A1 (de) * 2010-10-15 2012-04-19 Ceramtec Gmbh LED-Leuchte mit integriertem Treiber
RU113329U1 (ru) * 2011-08-05 2012-02-10 Владимир Алексеевич Смолин Трубчатый светодиодный источник света

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5655830A (en) * 1993-12-01 1997-08-12 General Signal Corporation Lighting device
US20050024866A1 (en) * 2002-01-18 2005-02-03 Homan Petrus Josephus Device for radiating light
US20030193803A1 (en) * 2002-04-16 2003-10-16 Yuan Lin Flexible rod light device formed of chip on board based LED lamps and manufacturing method thereof
US20040252501A1 (en) * 2002-04-24 2004-12-16 Hideo Moriyama Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
US20040196643A1 (en) * 2003-04-04 2004-10-07 Toshiyuki Terada Photography light source device
US20050007033A1 (en) * 2003-07-09 2005-01-13 Tir Systems Ltd. Strip lighting system incorporating light emitting devices
US20090009997A1 (en) * 2007-06-21 2009-01-08 James Sanfilippo Modular lighting arrays
US7594738B1 (en) * 2008-07-02 2009-09-29 Cpumate Inc. LED lamp with replaceable power supply
US20110211339A1 (en) * 2010-02-26 2011-09-01 Qing Rong Technology Inc. Light emitter diode module
US20110249469A1 (en) * 2010-04-12 2011-10-13 Young-Keun Lee Light source unit and backlight assembly having the same
US20110267814A1 (en) * 2010-05-03 2011-11-03 Moon Kyung-Mi Illumination apparatus employing light-emitting device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130335967A1 (en) * 2011-03-03 2013-12-19 Osram Gmbh Lighting device
US9182100B2 (en) * 2011-03-03 2015-11-10 Osram Gmbh Lighting device

Also Published As

Publication number Publication date
WO2014075002A1 (fr) 2014-05-15
US9240538B2 (en) 2016-01-19
US20140131741A1 (en) 2014-05-15
WO2014075001A1 (fr) 2014-05-15

Similar Documents

Publication Publication Date Title
US10128426B1 (en) LS core LED connector system and manufacturing method
US11543081B2 (en) LED assembly with omnidirectional light field
US20140131742A1 (en) LED Spirit Connector System and Manufacturing Method
US8596820B2 (en) LED unit and LED lighting lamp using the LED unit
US10249807B2 (en) Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
USRE47530E1 (en) Light-emitting diode apparatus
US9488345B2 (en) Light emitting device, illumination apparatus including the same, and mounting substrate
US9157579B2 (en) LED assembly with omnidirectional light field
CN103329290B (zh) 发光器件和方法
US8794793B2 (en) Solid state lighting device with elongated heatsink
US8847251B2 (en) Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position
US9416948B2 (en) Light-emitting module and lighting apparatus
CN107270148A (zh) Led灯丝灯
US20100320892A1 (en) Heat dissipation enhanced led lamp for spotlight
DE102012002859A1 (de) Beleuchtungsquelle mit veringerter Innenkerngröße
JPWO2014045523A1 (ja) 照明用光源及び照明装置
US20150330580A1 (en) Led lamp with base electrical interconnect
US11592166B2 (en) Light emitting device having improved illumination and manufacturing flexibility
JP5884054B2 (ja) 照明用光源及び照明装置
CN109449147B (zh) 可做直插灯丝的led支架、led光源及其加工工艺
CN207112408U (zh) Led灯丝灯
US11189770B2 (en) LS grid core LED connector system and manufacturing method
WO2018075998A1 (fr) Système de connecteur de del à âme sous forme de grille de ls et procédé de fabrication
KR101937196B1 (ko) 엘이디 전구용 엘이디 모듈, 엘이디 모듈 어레이 및 그 제조방법
CN105841066A (zh) 一种汽车led指示灯

Legal Events

Date Code Title Description
AS Assignment

Owner name: LED SPIRIT SYSTEMS, MONTANA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZYKIN, ANDREY;MILLER, ALCINDA;SIGNING DATES FROM 20131122 TO 20131129;REEL/FRAME:031875/0508

AS Assignment

Owner name: LED SPIRIT INC, MONTANA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MILLER, ALCINDA;ZYKIN, ANDREY;SIGNING DATES FROM 20131113 TO 20131129;REEL/FRAME:035295/0791

STCV Information on status: appeal procedure

Free format text: ON APPEAL -- AWAITING DECISION BY THE BOARD OF APPEALS

STCV Information on status: appeal procedure

Free format text: BOARD OF APPEALS DECISION RENDERED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION