US20140065968A1 - Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter - Google Patents
Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter Download PDFInfo
- Publication number
- US20140065968A1 US20140065968A1 US13/957,581 US201313957581A US2014065968A1 US 20140065968 A1 US20140065968 A1 US 20140065968A1 US 201313957581 A US201313957581 A US 201313957581A US 2014065968 A1 US2014065968 A1 US 2014065968A1
- Authority
- US
- United States
- Prior art keywords
- millimeter wave
- signals
- baseband
- radio apparatus
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/24—Radio transmission systems, i.e. using radiation field for communication between two or more posts
- H04B7/26—Radio transmission systems, i.e. using radiation field for communication between two or more posts at least one of which is mobile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/24—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Definitions
- the present invention relates generally to transmitting and receiving millimeter wave signals.
- the 60 GHz band is an unlicensed band which features a large amount of bandwidth and a large worldwide overlap.
- the large bandwidth means that a very high volume of information can be transmitted wirelessly.
- multiple applications that require transmission of a large amount of data, can be developed to allow wireless communication around the 60 GHz band. Examples for such applications include, but are not limited to, wireless high definition TV (HDTV), wireless docking station, wireless Gigabit Ethernet, and many others.
- HDMI wireless high definition TV
- wireless docking station wireless Gigabit Ethernet
- ICs integrated circuits
- Such circuits should be fabricated and packaged as a single IC (chip) that can be assembled on a printed circuit board (PCB).
- the size of the package may range from several to a few hundred square millimeters.
- PCB printed circuit board
- FIG. 1 shows a typical assembly of a laptop computer 100 having radio transmission capabilities.
- a motherboard 110 of the computer 100 includes a RF module 120 that receives and transmits RF signals through a receive antenna 130 and a transmit antenna 140 , which are located in the lid 150 . Signals from the RF module 120 to antennas 130 and 140 are transferred over wires 160 .
- the motherboard 110 is assembled in the base part of the computer 110 , which is relatively cooler than the lid 150 , therefore the RF module 120 is installed therein.
- the form factor of the assembly illustrated in FIG. 1 cannot be adapted to enable the integration of 60 GHz communication applications in consumer electronics products, primarily because transferring high frequency signals over the wires 160 significantly attenuate the signals. Increasing the power of the signals at the RF module 120 would require designing complex and expensive RF circuits of the module 120 . Thus, such assembly is not feasible for commercial uses in consumer electronics products of 60 GHz communication applications.
- Certain embodiments disclosed herein include a distributed form factor millimeter wave radio apparatus.
- the apparatus comprises a first motherboard part including a baseband module, wherein the first motherboard part is mounted on a first plane of a portable computing device; a second motherboard part including a first millimeter wave radio module configured to receive (RX) and transmit (TX) millimeter wave signals; and a third motherboard part including a second millimeter wave radio module configured to receive (RX) and transmit (TX) millimeter wave signals, wherein each of the second motherboard part and the third motherboard part is mounted on a second plane of the portable computing device which is distributed from the first plane, wherein the second motherboard part is connected to the baseband module through a first cable, and the third motherboard part is connected to the baseband module through a second cable, wherein each of the first and second cables is coupled at each of its ends to a resistor-capacitor (RC) network.
- RC resistor-capacitor
- FIG. 1 is a typical assembly of a laptop computer having radio transmission capabilities.
- FIGS. 2A and 2B are schematic diagrams of a laptop computer assembled in accordance with an embodiment of the invention.
- FIG. 3 is a diagram illustrating the interface between a baseband module and an active antenna as implemented in accordance with an embodiment of the invention.
- Certain embodiments of the invention comprise a distributed form factor of a motherboard and active antennas that enables the efficient transmission and reception of signals in at least the 60 GHz band.
- a form factor of a motherboard typically determines the specifications for its general shape and size. It also specifies what type of case and power supply will be supported, the placement of mounting holes, and the physical layout and organization of the board.
- FIGS. 2A and 2B A schematic diagram of a laptop computer 200 assembled in accordance with the teachings of an embodiment of the invention is shown in FIGS. 2A and 2B .
- the form factor of a motherboard is spread between the base 202 and lid planes 205 of a laptop computer 200 .
- the motherboard consists of three parts 210 - 1 , 210 - 2 and 210 - 3 which receptively include a baseband module 220 , a receiver (RX) active antenna 230 , and a transmitter (TX) active antenna 240 .
- the part 210 - 1 is in the base plane 202 of the computer 200 and parts 210 - 2 and 210 - 3 are in the lid plane 205 .
- the RX and TX antennas are of the same type and only one antenna is used for reception and transmission of signals.
- two cables 250 - 1 and 250 - 2 are utilized to transfer signals from and to the baseband module 220 and the active antennas 230 and 240 .
- These signals include power, control, baseband, and local oscillator source (LO).
- the baseband signals transferred to each of the active antennas 230 and 240 include two I and Q signals having the same frequency but shifted in phase.
- five signals are transferred from the baseband module 220 to each of the active antennas 230 and 240 .
- the baseband and LO signals are characterized as low frequency and low power radio signals.
- the baseband signals are in the range of approximately 900 MHz, while the LO signal is in the range of 7-8 GHz.
- the I and Q baseband signals are replaced with intermediate frequency (IF) signals.
- the RX active antenna 230 integrates an antenna 231 and an RF circuit 232 mounted on the motherboard part 210 - 3 .
- the antenna 231 receives high frequency (e.g., 60 GHz) signals, which are down converted, by the RF circuit 232 , to I and Q baseband signals using the LOs.
- the control signals control the RF circuit 232 .
- the TX active antenna 240 includes an RF circuit 242 for at least up converting I and Q baseband signals using the LOs to high frequency signals which are transmitted through an antenna 241 . It would be appreciated that only low frequency signals are transferred between the lid plane 205 and the base plane 202 , therefore the attenuation of these signals is significantly less than of high frequency signals.
- the RX and TX active antennas 230 and 240 do not need to compensate on gain losses.
- the RF circuits 232 and 242 are integrated in a single chip that performs tasks mentioned above.
- a cable 250 - 1 or 250 - 2 comprises a pair of coax cables for transferring five signals.
- FIG. 3 shows an exemplary diagram illustrating the interface between the baseband module 220 and the TX active antenna 240 .
- the I-baseband, control and power signals are simultaneously transferred over a coax cable 310
- the Q-baseband, control and LO signals are carried over a coax cable 320 .
- the signals are combined and separated by means of frequency diplexers 330 and the RC networks 340 .
- the frequency signals are combined by using diplexers 330 while the DC power and control signals are combined by means of the RC networks 340 .
- Other analog devices, such as Ferrites and inductors may also be utilized for this purpose.
- a diplexer 330 is a passive device that implements frequency domain multiplexing. Input signals are multiplexed onto an output signal. The input signals occupy disjoint frequency bands can coexist on the output signal without interfering with each other. For analog signal the diplexer 330 can de-multiplex an input signal to output signals (e.g., I-baseband, control signals and LO signals or Q-baseband, control, and power signals).
- output signals e.g., I-baseband, control signals and LO signals or Q-baseband, control, and power signals.
- a similar interface is implemented between the baseband module 220 and the RX active antenna 230 .
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Transceivers (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Abstract
Description
- This application is a continuation application of U.S. application Ser. No. 12/536,941, now U.S. Pat. No. 8,509,709. The Ser. No. 12/536,941 application claims the benefit of US provisional application No. 61/086,924 filed on Aug. 7, 2008, the contents of which are herein incorporated by reference.
- The present invention relates generally to transmitting and receiving millimeter wave signals.
- The 60 GHz band is an unlicensed band which features a large amount of bandwidth and a large worldwide overlap. The large bandwidth means that a very high volume of information can be transmitted wirelessly. As a result, multiple applications, that require transmission of a large amount of data, can be developed to allow wireless communication around the 60 GHz band. Examples for such applications include, but are not limited to, wireless high definition TV (HDTV), wireless docking station, wireless Gigabit Ethernet, and many others.
- In order to facilitate such applications there is a need to develop integrated circuits (ICs), such as amplifiers, mixers, radio frequency (RF) analog circuits, and active antennas that operate in the 60 GHz frequency range. Such circuits should be fabricated and packaged as a single IC (chip) that can be assembled on a printed circuit board (PCB). The size of the package may range from several to a few hundred square millimeters. In addition, there is a need to solve problems resulting from the current assembly of electronic devices, such as laptop computers in order to enable efficient transmission and reception of millimeter wave signals.
- A prime example for such a problem is illustrated in
FIG. 1 , which shows a typical assembly of alaptop computer 100 having radio transmission capabilities. Amotherboard 110 of thecomputer 100 includes aRF module 120 that receives and transmits RF signals through areceive antenna 130 and atransmit antenna 140, which are located in thelid 150. Signals from theRF module 120 to 130 and 140 are transferred overantennas wires 160. Themotherboard 110 is assembled in the base part of thecomputer 110, which is relatively cooler than thelid 150, therefore theRF module 120 is installed therein. - The form factor of the assembly illustrated in
FIG. 1 cannot be adapted to enable the integration of 60 GHz communication applications in consumer electronics products, primarily because transferring high frequency signals over thewires 160 significantly attenuate the signals. Increasing the power of the signals at theRF module 120 would require designing complex and expensive RF circuits of themodule 120. Thus, such assembly is not feasible for commercial uses in consumer electronics products of 60 GHz communication applications. - It would be therefore advantageous to provide a solution for assembling a computing device having a form factor suitable for use in at least the 60 GHz band.
- Certain embodiments disclosed herein include a distributed form factor millimeter wave radio apparatus. The apparatus comprises a first motherboard part including a baseband module, wherein the first motherboard part is mounted on a first plane of a portable computing device; a second motherboard part including a first millimeter wave radio module configured to receive (RX) and transmit (TX) millimeter wave signals; and a third motherboard part including a second millimeter wave radio module configured to receive (RX) and transmit (TX) millimeter wave signals, wherein each of the second motherboard part and the third motherboard part is mounted on a second plane of the portable computing device which is distributed from the first plane, wherein the second motherboard part is connected to the baseband module through a first cable, and the third motherboard part is connected to the baseband module through a second cable, wherein each of the first and second cables is coupled at each of its ends to a resistor-capacitor (RC) network.
- The subject matter that is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features and advantages of the invention will be apparent from the following detailed description taken in conjunction with the accompanying drawings.
-
FIG. 1 is a typical assembly of a laptop computer having radio transmission capabilities. -
FIGS. 2A and 2B are schematic diagrams of a laptop computer assembled in accordance with an embodiment of the invention. -
FIG. 3 is a diagram illustrating the interface between a baseband module and an active antenna as implemented in accordance with an embodiment of the invention. - The embodiments disclosed by the invention are only examples of the many possible advantageous uses and implementations of the innovative teachings presented herein. In general, statements made in the specification of the present application do not necessarily limit any of the various claimed inventions. Moreover, some statements may apply to some inventive features but not to others. In general, unless otherwise indicated, singular elements may be in plural and vice versa with no loss of generality. In the drawings, like numerals refer to like parts through several views.
- Certain embodiments of the invention comprise a distributed form factor of a motherboard and active antennas that enables the efficient transmission and reception of signals in at least the 60 GHz band. A form factor of a motherboard typically determines the specifications for its general shape and size. It also specifies what type of case and power supply will be supported, the placement of mounting holes, and the physical layout and organization of the board.
- A schematic diagram of a
laptop computer 200 assembled in accordance with the teachings of an embodiment of the invention is shown inFIGS. 2A and 2B . In accordance with an embodiment of the invention the form factor of a motherboard is spread between thebase 202 andlid planes 205 of alaptop computer 200. Specifically, the motherboard consists of three parts 210-1, 210-2 and 210-3 which receptively include abaseband module 220, a receiver (RX)active antenna 230, and a transmitter (TX)active antenna 240. As shown inFIG. 2B , the part 210-1 is in thebase plane 202 of thecomputer 200 and parts 210-2 and 210-3 are in thelid plane 205. In one embodiment of the invention the RX and TX antennas are of the same type and only one antenna is used for reception and transmission of signals. - Referring back to
FIG. 2A , two cables 250-1 and 250-2 are utilized to transfer signals from and to thebaseband module 220 and the 230 and 240. These signals include power, control, baseband, and local oscillator source (LO). The baseband signals transferred to each of theactive antennas 230 and 240 include two I and Q signals having the same frequency but shifted in phase. Thus, in accordance with an embodiment of the invention five signals are transferred from theactive antennas baseband module 220 to each of the 230 and 240. It should be appreciated by one of ordinary skill in the art that the baseband and LO signals are characterized as low frequency and low power radio signals. For example, the baseband signals are in the range of approximately 900 MHz, while the LO signal is in the range of 7-8 GHz. In certain embodiments of the invention, the I and Q baseband signals are replaced with intermediate frequency (IF) signals.active antennas - The RX
active antenna 230 integrates anantenna 231 and anRF circuit 232 mounted on the motherboard part 210-3. Theantenna 231 receives high frequency (e.g., 60 GHz) signals, which are down converted, by theRF circuit 232, to I and Q baseband signals using the LOs. The control signals control theRF circuit 232. Similarly, the TXactive antenna 240 includes anRF circuit 242 for at least up converting I and Q baseband signals using the LOs to high frequency signals which are transmitted through anantenna 241. It would be appreciated that only low frequency signals are transferred between thelid plane 205 and thebase plane 202, therefore the attenuation of these signals is significantly less than of high frequency signals. Thus, the RX and TX 230 and 240 do not need to compensate on gain losses. In other embodiments of the invention, theactive antennas 232 and 242 are integrated in a single chip that performs tasks mentioned above.RF circuits - In accordance with certain embodiments for practicing the invention, a cable 250-1 or 250-2 comprises a pair of coax cables for transferring five signals.
FIG. 3 shows an exemplary diagram illustrating the interface between thebaseband module 220 and the TXactive antenna 240. The I-baseband, control and power signals are simultaneously transferred over acoax cable 310, while the Q-baseband, control and LO signals are carried over acoax cable 320. The signals are combined and separated by means offrequency diplexers 330 and the RC networks 340. The frequency signals are combined by usingdiplexers 330 while the DC power and control signals are combined by means of the RC networks 340. Other analog devices, such as Ferrites and inductors may also be utilized for this purpose. - A
diplexer 330 is a passive device that implements frequency domain multiplexing. Input signals are multiplexed onto an output signal. The input signals occupy disjoint frequency bands can coexist on the output signal without interfering with each other. For analog signal thediplexer 330 can de-multiplex an input signal to output signals (e.g., I-baseband, control signals and LO signals or Q-baseband, control, and power signals). A similar interface is implemented between thebaseband module 220 and the RXactive antenna 230. - It is important to note that these embodiments are only examples of the many advantageous uses of the innovative teachings herein. Specifically, the innovative teachings disclosed herein can be adapted in any type of consumer electronic devices where reception and transmission of millimeter wave signals is needed. Moreover, some statements may apply to some inventive features but not to others. In general, unless otherwise indicated, it is to be understood that singular elements may be in plural and vice versa with no loss of generality.
- All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/957,581 US20140065968A1 (en) | 2008-08-07 | 2013-08-02 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8692408P | 2008-08-07 | 2008-08-07 | |
| US12/536,941 US8509709B2 (en) | 2008-08-07 | 2009-08-06 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
| US13/957,581 US20140065968A1 (en) | 2008-08-07 | 2013-08-02 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/536,941 Continuation US8509709B2 (en) | 2008-08-07 | 2009-08-06 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20140065968A1 true US20140065968A1 (en) | 2014-03-06 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/536,931 Abandoned US20100033393A1 (en) | 2008-08-07 | 2009-08-06 | Techniques for Mounting a Millimeter Wave Antenna and a Radio Frequency Integrated Circuit Onto a PCB |
| US12/536,941 Expired - Fee Related US8509709B2 (en) | 2008-08-07 | 2009-08-06 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
| US13/957,581 Abandoned US20140065968A1 (en) | 2008-08-07 | 2013-08-02 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/536,931 Abandoned US20100033393A1 (en) | 2008-08-07 | 2009-08-06 | Techniques for Mounting a Millimeter Wave Antenna and a Radio Frequency Integrated Circuit Onto a PCB |
| US12/536,941 Expired - Fee Related US8509709B2 (en) | 2008-08-07 | 2009-08-06 | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
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| US (3) | US20100033393A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170222668A1 (en) * | 2016-02-03 | 2017-08-03 | Qualcomm Incorporated | Over-the-air loopback for array identification |
| US20170223639A1 (en) * | 2016-02-03 | 2017-08-03 | Qualcomm Incorporated | Calibrating transmit error vector magnitude using over-the-air loopback |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100033393A1 (en) * | 2008-08-07 | 2010-02-11 | Wilocity, Ltd. | Techniques for Mounting a Millimeter Wave Antenna and a Radio Frequency Integrated Circuit Onto a PCB |
| US8675715B2 (en) * | 2009-12-23 | 2014-03-18 | Electronics And Telecommunications Research Institute | Apparatus of 60 GHZ band modem |
| US8587482B2 (en) | 2011-01-21 | 2013-11-19 | International Business Machines Corporation | Laminated antenna structures for package applications |
| US20120309331A1 (en) * | 2011-06-06 | 2012-12-06 | Wilocity, Ltd. | Modular millimeter-wave radio frequency system |
| US8670322B2 (en) * | 2011-06-06 | 2014-03-11 | Wilocity, Ltd. | Single transmission line for connecting radio frequency modules in an electronic device |
| KR101208241B1 (en) | 2011-07-12 | 2012-12-04 | 삼성전기주식회사 | Semiconductor package |
| KR101218989B1 (en) | 2011-07-15 | 2013-01-21 | 삼성전기주식회사 | Semiconductor package and manufacturing method thereof |
| CN102437416A (en) * | 2011-08-25 | 2012-05-02 | 电子科技大学 | Broadband low cross-polarization printed dipole antenna with parasitic element |
| US9525439B2 (en) * | 2011-12-06 | 2016-12-20 | Qualcomm Incorporated | Fully integrated millimeter-wave radio frequency system |
| US8912957B2 (en) | 2011-12-12 | 2014-12-16 | Qualcomm Incorporated | Reconfigurable millimeter wave multibeam antenna array |
| US9614700B2 (en) | 2013-01-02 | 2017-04-04 | Qualcomm Incorporated | Techniques for channel estimation in millimeter-wave communication systems |
| CN203434265U (en) * | 2013-04-19 | 2014-02-12 | 深圳市海骏电子科技有限公司 | Planar antenna microwave module and intelligent control energy-saving lamp |
| US10347967B2 (en) * | 2016-01-26 | 2019-07-09 | Qualcomm Incorporated | Signal delivery and antenna layout using flexible printed circuit board (PCB) |
| US10205224B2 (en) | 2016-09-23 | 2019-02-12 | Apple Inc. | Electronic device with millimeter wave antenna arrays |
| JP6868462B2 (en) * | 2017-05-10 | 2021-05-12 | 株式会社フジクラ | Wireless relay device |
| JP6608976B2 (en) * | 2018-01-24 | 2019-11-20 | ヤマハ発動機株式会社 | Directional antenna |
| US11271323B2 (en) * | 2018-03-29 | 2022-03-08 | Nec Corporation | Radio communication apparatus |
| KR102466531B1 (en) * | 2018-04-13 | 2022-11-14 | 삼성전자주식회사 | Apparatus and method for arranging antennas supporting millimeter wave frequency bands |
| US11271328B2 (en) | 2018-09-24 | 2022-03-08 | Qualcomm Incorporated | Hybrid wireless transceiver architecture that supports multiple antenna arrays |
| US10770798B2 (en) | 2018-09-28 | 2020-09-08 | Qualcomm Incorporated | Flex cable fed antenna system |
| CN113366767B (en) * | 2018-11-29 | 2023-03-10 | 芬兰国家技术研究中心股份公司 | Antenna assembly for wireless communication device |
| KR102663103B1 (en) | 2019-01-24 | 2024-05-07 | 삼성전자주식회사 | Antenna module that plural printed circuit boards are layered and electronic device including the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070094623A1 (en) * | 2005-10-24 | 2007-04-26 | Haizhou Chen | Timing, noise, and power analysis of integrated circuits |
| US8509709B2 (en) * | 2008-08-07 | 2013-08-13 | Wilocity, Ltd. | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6801755B2 (en) * | 2001-03-29 | 2004-10-05 | Intol Corporation | Method and apparatus for providing a radio module for a computer system |
| EP1380119A4 (en) * | 2001-04-18 | 2006-02-01 | Bae Systems Information | Bandwidth-efficient wireless network modem |
| US6920573B2 (en) * | 2001-05-23 | 2005-07-19 | Smartpower Corporation | Energy-conserving apparatus and operating system having multiple operating functions stored in keep-alive memory |
| US20030210191A1 (en) * | 2002-05-08 | 2003-11-13 | Mohammadian Alireza H. | Embedded antennas for a communications device |
| US20050185364A1 (en) * | 2004-01-05 | 2005-08-25 | Jory Bell | Docking station for mobile computing device |
| US7119745B2 (en) * | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
| US7002511B1 (en) * | 2005-03-02 | 2006-02-21 | Xytrans, Inc. | Millimeter wave pulsed radar system |
| DE602006021172D1 (en) * | 2005-06-02 | 2011-05-19 | Lockheed Corp | ELECTRONICALLY REMOVED MILLIMETER SHAFT ANTENNA |
| TWM283338U (en) * | 2005-06-03 | 2005-12-11 | Hon Hai Prec Ind Co Ltd | A printed dipole antenna |
| US20060276157A1 (en) * | 2005-06-03 | 2006-12-07 | Chen Zhi N | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
| US7324059B2 (en) * | 2005-08-19 | 2008-01-29 | Electronics And Telecommunications Research Institiute | Stub printed dipole antenna (SPDA) having wide-band and multi-band characteristics and method of designing the same |
| US7801556B2 (en) * | 2005-08-26 | 2010-09-21 | Qualcomm Incorporated | Tunable dual-antenna system for multiple frequency band operation |
| US7372408B2 (en) * | 2006-01-13 | 2008-05-13 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas |
| US7518221B2 (en) * | 2006-01-26 | 2009-04-14 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
| US7518229B2 (en) * | 2006-08-03 | 2009-04-14 | International Business Machines Corporation | Versatile Si-based packaging with integrated passive components for mmWave applications |
| US7684526B2 (en) * | 2006-09-21 | 2010-03-23 | Broadcom Corporation | Frequency domain equalizer for dual antenna radio |
| US8781522B2 (en) * | 2006-11-02 | 2014-07-15 | Qualcomm Incorporated | Adaptable antenna system |
| US9111189B2 (en) * | 2007-10-31 | 2015-08-18 | Location Based Technologies, Inc. | Apparatus and method for manufacturing an electronic package |
| US7855697B2 (en) * | 2007-08-13 | 2010-12-21 | Corning Cable Systems, Llc | Antenna systems for passive RFID tags |
| US7797818B2 (en) * | 2007-09-13 | 2010-09-21 | Sony Ericsson Mobile Communications Ab | Flexible modular systems for constructing a wireless communication terminal |
| US8072065B2 (en) * | 2008-02-14 | 2011-12-06 | Viasat, Inc. | System and method for integrated waveguide packaging |
| US7852281B2 (en) * | 2008-06-30 | 2010-12-14 | Intel Corporation | Integrated high performance package systems for mm-wave array applications |
| US7728774B2 (en) * | 2008-07-07 | 2010-06-01 | International Business Machines Corporation | Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production |
-
2009
- 2009-08-06 US US12/536,931 patent/US20100033393A1/en not_active Abandoned
- 2009-08-06 US US12/536,941 patent/US8509709B2/en not_active Expired - Fee Related
-
2013
- 2013-08-02 US US13/957,581 patent/US20140065968A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070094623A1 (en) * | 2005-10-24 | 2007-04-26 | Haizhou Chen | Timing, noise, and power analysis of integrated circuits |
| US8509709B2 (en) * | 2008-08-07 | 2013-08-13 | Wilocity, Ltd. | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170222668A1 (en) * | 2016-02-03 | 2017-08-03 | Qualcomm Incorporated | Over-the-air loopback for array identification |
| US20170223639A1 (en) * | 2016-02-03 | 2017-08-03 | Qualcomm Incorporated | Calibrating transmit error vector magnitude using over-the-air loopback |
| WO2017136543A1 (en) * | 2016-02-03 | 2017-08-10 | Qualcomm Incorporated | Over-the-air loopback for array identification |
| US9813081B2 (en) * | 2016-02-03 | 2017-11-07 | Qualcomm Incorporated | Over-the-air loopback for array identification |
| US9867144B2 (en) * | 2016-02-03 | 2018-01-09 | Qualcomm Incorporated | Calibrating transmit error vector magnitude using over-the-air loopback |
| CN108604937A (en) * | 2016-02-03 | 2018-09-28 | 高通股份有限公司 | Aerial loopback for array identification |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100033393A1 (en) | 2010-02-11 |
| US8509709B2 (en) | 2013-08-13 |
| US20100035561A1 (en) | 2010-02-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: QUALCOMM INCORPORATED, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:QUALCOMM ATHEROS, INC.;REEL/FRAME:033521/0834 Effective date: 20140801 Owner name: QUALCOMM ATHEROS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WILOCITY LTD.;REEL/FRAME:033521/0593 Effective date: 20140707 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE |
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| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE |