[go: up one dir, main page]

US20130343008A1 - Circuit board system with mechanical protection - Google Patents

Circuit board system with mechanical protection Download PDF

Info

Publication number
US20130343008A1
US20130343008A1 US13/915,644 US201313915644A US2013343008A1 US 20130343008 A1 US20130343008 A1 US 20130343008A1 US 201313915644 A US201313915644 A US 201313915644A US 2013343008 A1 US2013343008 A1 US 2013343008A1
Authority
US
United States
Prior art keywords
circuit board
protection element
board system
electrical components
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/915,644
Other languages
English (en)
Inventor
Antti HOLMA
Peter KOKKO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infinera Oy
Original Assignee
Tellabs Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tellabs Oy filed Critical Tellabs Oy
Assigned to TELLABS OY reassignment TELLABS OY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Holma, Antti
Publication of US20130343008A1 publication Critical patent/US20130343008A1/en
Assigned to CORIANT OY reassignment CORIANT OY CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TELLABS OY
Priority to US14/715,627 priority Critical patent/US10201095B2/en
Assigned to CERBERUS BUSINESS FINANCE, LLC, AS THE COLLATERAL AGENT reassignment CERBERUS BUSINESS FINANCE, LLC, AS THE COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CORIANT OY (FORMERLY KNOWN AS TELLABS OY
Assigned to CORIANT OY (FORMERLY TELLABS OY) reassignment CORIANT OY (FORMERLY TELLABS OY) RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: CERBERUS BUSINESS FINANCE, LLC
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the invention relates to a circuit board system comprising mechanical protection of electrical components. Furthermore, the invention relates to a method for manufacturing a circuit board system comprising mechanical protection of electrical components.
  • a typical circuit board system comprises a circuit board furnished with electrical components.
  • the circuit board comprises a body made of one or more layers of electrically insulating material and electrical conductors on one or both of the surfaces of the circuit board and/or between the layers of the electrically insulating material.
  • Each of the electrical components can be, for example, an integrated circuit such as a processor or a memory, or a discrete component such as a resistor, a capacitor, an inductor, a transistor, or a diode.
  • a circuit board system can be subjected to damaging mechanical impacts in many situations.
  • the circuit board system can be a part of a plug-in unit where the circuit board constitutes a body of the plug-in unit and where edges of the circuit board slide in corresponding support elements of a frame or another device for receiving the plug-in unit when the plug-in unit is being installed. If the plug-in unit is being pushed into the frame or the other device in a glancing or otherwise wrong direction, the electrical components of the circuit board system may hit to neighboring plug-in units and/or to structures of the device receiving the plug-in unit.
  • a known arrangement for protecting electrical components against mechanical impacts comprises a shield plate which is parallel to a circuit board and which is installed to the circuit board with spacers so that there is room for electrical components between the circuit board and the shield plate.
  • An inconveniency related to this protection arrangement is unsuitability for applications where the circuit board system has to be as thin as possible in the direction perpendicular to the circuit board.
  • different thermal expansion coefficients of the circuit board and the shield plate may cause mechanical stresses and/or deformations in the circuit board system.
  • circuit board system that can be, for example but not necessarily, a part of a telecommunication equipment.
  • the circuit board system according to the invention comprises:
  • the protection element is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board.
  • the protection element allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe “FP” testing.
  • the protection element does not excessively hinder the cooling of the electrical components because the electrical components are unscreened in the direction perpendicular to the circuit board.
  • the protection element does not increase the thickness of the circuit board system in the direction perpendicular to the circuit board if the thickness of the protection element is at most the maximum of the heights of all components on the surface of the circuit board, where the heights are measured from the surface of the circuit board.
  • the protection element is capable of protecting the components against mechanical impacts in directions parallel to the circuit board and in directions having a slight angle with respect to the surface of the circuit board.
  • the thickness of the protection element is advantageously, but not necessarily, greater than the maximum of the heights of the electrical components to be protected and lower than the maximum of the heights of all components on the surface of the circuit board. If the thickness of the protection element is greater than the maximum of the heights of the electrical components to be protected, the protection element is capable of protecting these electrical components in a situation in which the circuit board is being pressed against a wide flat surface.
  • the body of the protection element is made of same material as the electrically insulating body of the circuit board so as to make the thermal expansion coefficient of the protection element to be substantially the same as that of the circuit board.
  • the protection element comprises rubber so as to make the protection element flexible and thereby capable of adapting to the thermal expansion of the circuit board.
  • the method according to the invention comprises:
  • a method according to an advantageous, exemplifying embodiment of the invention comprises the following actions after the furnishing of the circuit board with the electrical components:
  • the above-mentioned first functional entity can be, for example but not necessarily, a power supply converter of the circuit board system.
  • the above-mentioned second functional entity can be, for example but not necessarily, a signal processing part of the circuit board system.
  • FIG. 1 a illustrates a circuit board system according to an exemplifying embodiment of the invention
  • FIG. 1 b shows a schematic view of a section taken along the line A-A shown in FIG. 1 a
  • FIG. 2 shows a schematic view of a section taken from a detail of a circuit board system according to an exemplifying embodiment of the invention
  • FIGS. 3 a illustrates a part of a circuit board system according to an exemplifying embodiment of the invention
  • FIG. 3 b shows a schematic view of a section taken along the line A-A shown in FIG. 3 a.
  • FIG. 4 shows a flowchart of a method according to an exemplifying embodiment of the invention for manufacturing a circuit board system
  • FIG. 5 shows a flowchart of a method according to an exemplifying embodiment of the invention for manufacturing a circuit board system.
  • FIG. 1 a illustrates a circuit board system according to an exemplifying embodiment of the invention.
  • FIG. 1 b shows a schematic view of a section taken along the line A-A shown in FIG. 1 a.
  • the circuit board system comprises a circuit board 101 furnished with electrical components some of which are denoted with reference numbers 103 , 104 , 105 , 106 , 107 , 108 , 109 , 110 , and 111 .
  • the circuit board system comprises electrical connectors 123 and 124 .
  • the circuit board system can be, for example, a plug-in unit which is installed by pushing it in the x-direction of a coordinate system 190 into a device for receiving the plug-in unit.
  • the circuit board 101 comprises a body made of one or more layers of electrically insulating material and electrical conductors on one or both of the surfaces of the circuit board and/or between the layers of the electrically insulating material.
  • Each of the electrical components can be an integrated circuit such as a processor or a memory, or a discrete component such as a resistor, a capacitor, an inductor, a transistor, or a diode.
  • the electrical components 103 , 104 , 105 , 108 , and 109 are integrated circuits and the electrical components 106 , 107 , 110 , and 111 are discrete components.
  • the circuit board system comprises a protection element 102 attached to areas of the surface of the circuit board 101 which are free from the electrical components.
  • the protection element 102 has a netlike structure so that the protection element comprises openings for the electrical components. Therefore, protection element 102 is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board, i.e. in the z-direction of the coordinate system 190 .
  • the protection element allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe “FP” testing.
  • the protection element 102 has thickness in the direction perpendicular to the circuit board 101 , i.e. in the z-direction of the coordinate system 190 .
  • the protection element 102 forms barriers capable of protecting the electrical components against mechanical impacts in directions parallel to the circuit board, i.e. in the xy-plane of to coordinate system 190 , and in directions having a slight angle with respect to the surface of the circuit board.
  • the protection element 101 does not increase the thickness of the circuit board system in the direction perpendicular to the circuit board if the thickness of the protection element is at most the maximum of the heights of the electrical components, where the heights are measured from the surface of the circuit board.
  • the body of the protection element 102 is made of the same material as the electrically insulating body of the circuit board 101 so as to make the thermal expansion coefficient of the protection element to be substantially the same as that of the circuit board.
  • the protection element can be attached to the circuit board 101 , for example, using glue, screws, solder between surfaces of the circuit board and the protection element, press-fit “PF” or soldered pins in mutually corresponding holes of the circuit board and the protection element, and/or plugs shaped so that they provide form locking with edges of holes of the circuit board.
  • the protection element 102 comprises rubber so as to make the protection element flexible and thereby capable of adapting to the thermal expansion of the circuit board.
  • the protection element 102 can be attached to the circuit board 101 , for example, using glue.
  • a protection element having a glue-surface is straightforward to attach to the circuit board. It can be attached to the circuit board in any of various manufacturing phases, or even in end-user's premises.
  • the protection element may comprise, for example, plugs that are pushed to holes of the circuit board in order to attach the protection element to the circuit board.
  • the plugs are advantageously shaped so that they provide form locking with the edges of the holes of the circuit board.
  • the plugs can be a same piece with the protection element.
  • the protection element 102 comprises electrically conductive parts connected to corresponding electrically conductive parts of the circuit board and providing at least one galvanic connection between a first functional entity 121 of the circuit board system and a second functional entity 122 of the circuit board system.
  • the first functional entity 121 can be, for example but not necessarily, a DC-to-DC or AC-to-DC power supply converter of the circuit board system and the second functional entity 122 can be, for example but not necessarily, a signal processing part of the circuit board system.
  • the first functional entity 121 can be an analogue signal processing part of the circuit board system and the second functional entity 122 can be a digital signal processing part of the circuit board system.
  • the first functional entity 121 can be an equalizer of a digital signal processing part of the circuit board system and the second functional entity 122 can be a detector of the digital signal processing part.
  • the circuit board system can be, for example but not necessarily, a part of a telecommunication device, wherein the signal processing part of the circuit board system may comprise a processing system for supporting one or more data transfer protocols such as, for example, Internet Protocol “IP”, Ethernet protocol, MultiProtocol Label Switching “MPLS” protocol, and Asynchronous Transfer Mode “ATM”.
  • IP Internet Protocol
  • MPLS MultiProtocol Label Switching
  • ATM Asynchronous Transfer Mode
  • FIG. 2 shows a schematic view of a section taken from a detail of a circuit board system according to an exemplifying embodiment of the invention.
  • the detail illustrated in FIG. 2 can be, for example, the detail 140 shown in FIG. 1 b.
  • the protection element 202 comprises holes provided with electrically conductive linings 213 and 214 , and an electrical conductor 212 providing a galvanic connection between the electrically conductive linings 213 and 214 .
  • the circuit board 201 comprises holes provided with electrically conductive linings 217 and 218 .
  • electrically conductive pins 215 and 216 which connect the electrically conductive linings of the holes of the protection element 202 to the electrically conductive linings of the respective holes of the circuit board 201 as illustrated in FIG. 2 .
  • the electrically conductive lining 217 of the circuit board is connected to an electrical conductor 219 of the circuit board, and the electrically conductive lining 218 of the circuit board is connected to an electrical conductor 220 of the circuit board.
  • the electrical conductor 219 is a part of a first functional entity, e.g. a power supply converter, of the circuit board system and the electrical conductor 220 is a part of a second functional entity, e.g. a signal processing part, of the circuit board system.
  • the protection element 202 together with the pins 215 and 216 form a galvanic connection between the electrically conductive linings 217 and 218 and thereby connect the first and second functional entities to each other.
  • the pins 215 and 216 are press-fit “PF” pins at their both ends, and therefore the pins provide friction fits with the electrically conductive linings of the holes of the circuit board and with the electrically conductive linings of the holes of the protection element.
  • the pins 215 and 216 are soldered to the protection element 202 at their first ends, and the pins are press-fit pins at their second ends providing friction fits with the electrically conductive linings 217 and 218 of the holes of the circuit board.
  • the pins 215 and 216 are soldered to the circuit board 201 at their second ends, and the pins are press-fit pins at their first ends providing friction fits with the electrically conductive linings 213 and 214 of the holes of the protection element 202 .
  • the pins 215 and 216 are soldered both to the circuit board 201 and to the protection element 202 .
  • FIG. 3 a illustrates a part of a circuit board system according to an exemplifying embodiment of the invention.
  • FIG. 3 b shows a schematic view of a section taken along the line A-A shown in FIG. 3 a .
  • a protection element 302 surrounds an electrical component 303 and a protection element 332 surrounds electrical components 304 and 305 .
  • the protection element 302 consists of two pieces which together form the loop-shaped structure surrounding the electrical component 303 .
  • the circuit board 301 comprise soldering pads on the surface of the circuit board, and the protection elements 302 and 332 comprise corresponding soldering pads.
  • the protection elements are surface mounted devices “SMD” and the protection elements can be attached to the circuit board in the same SMD soldering process when electrical SMD components are attached to the circuit board.
  • the solder joints between the soldering pads of the circuit board and the corresponding soldering pads of the protection element can be used for providing one or more galvanic connections between functional entities of the circuit board system.
  • FIGS. 1 a, 1 b, 3 a and 3 b there are one or more protection elements on only one side of the circuit board 101 , 201 , 301 . It is to be, however, noted that it is possible to have one or more protection elements on both sides of the circuit board. Furthermore, it is to be noted that the protection elements 102 and 332 shown in FIGS. 1 a, 1 b, 3 a and 3 b may consist of multiple separate pieces each of which being attached to the surface of the circuit board.
  • FIG. 4 shows a flowchart of a method according to an exemplifying embodiment of the invention for manufacturing a circuit board system. The method comprises the following actions:
  • a body of the protection element is made of the same material as an electrically insulating body of the circuit board so as to make the thermal expansion coefficient of the protection element to be substantially the same as that of the circuit board.
  • the circuit board and the at least one protection element comprise soldering pads and the at least one protection element is attached to the circuit board in the same soldering process in which electrical surface mounted device “SMD” components are attached to the circuit board.
  • SMD surface mounted device
  • the protection element comprises rubber so as to make the protection element flexible and thereby capable of adapting to the thermal expansion of the circuit board.
  • FIG. 5 shows a flowchart of a method according to an exemplifying embodiment of the invention for manufacturing a circuit board system. The method comprises the following actions:
  • the circuit board comprises holes lined with electrically conductive material
  • the protection element comprises electrically conductive pins and an electrical conductor between the pins. The pins are pushed to the holes of the circuit board so as to provide the galvanic connection between the first and second functional entities.
  • the pins of the protection element are press-fit pins providing friction fits with the electrically conductive linings of the holes of the circuit board.
  • the pins of the protection element are soldered to the electrically conductive linings of the holes of the circuit board.
  • the protection element comprises holes lined with electrically conductive material and an electrical conductor between the electrically conductive linings.
  • the circuit board comprises electrically conductive pins that are pushed to the holes of the protection element so as to provide the galvanic connection between the first and second functional entities.
  • the pins of the circuit board are press-fit pins providing friction fits with the electrically conductive linings of the holes of the protection element.
  • the pins of the circuit board are soldered to the electrically conductive linings of the holes of the protection element.
  • the first functional entity of the circuit board system is a power supply converter of the circuit board system and the second functional entity of the circuit board system is a signal processing part of the circuit board system

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
US13/915,644 2012-06-26 2013-06-12 Circuit board system with mechanical protection Abandoned US20130343008A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/715,627 US10201095B2 (en) 2012-06-26 2015-05-19 Method for manufacturing a circuit board system with mechanical protection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20125725 2012-06-26
FI20125725A FI20125725A7 (fi) 2012-06-26 2012-06-26 Mekaanisella suojauksella varustettu piirikorttijärjestely

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/715,627 Division US10201095B2 (en) 2012-06-26 2015-05-19 Method for manufacturing a circuit board system with mechanical protection

Publications (1)

Publication Number Publication Date
US20130343008A1 true US20130343008A1 (en) 2013-12-26

Family

ID=48577603

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/915,644 Abandoned US20130343008A1 (en) 2012-06-26 2013-06-12 Circuit board system with mechanical protection
US14/715,627 Active 2034-08-30 US10201095B2 (en) 2012-06-26 2015-05-19 Method for manufacturing a circuit board system with mechanical protection

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/715,627 Active 2034-08-30 US10201095B2 (en) 2012-06-26 2015-05-19 Method for manufacturing a circuit board system with mechanical protection

Country Status (4)

Country Link
US (2) US20130343008A1 (fi)
EP (1) EP2680679B1 (fi)
CN (1) CN203523133U (fi)
FI (1) FI20125725A7 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110785005B (zh) * 2019-11-15 2020-08-28 苏师大半导体材料与设备研究院(邳州)有限公司 一种气垫防护式电路板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761050A (en) * 1996-08-23 1998-06-02 Cts Corporation Deformable pin connector for multiple PC boards
US6963491B2 (en) * 2001-07-13 2005-11-08 Lenovo (Singapore) Pte Ltd Expansion board apparatus and removing method
US20090067140A1 (en) * 2007-09-07 2009-03-12 Apple Inc. Stiffening plate for circuit board and switch assembly
US20090101400A1 (en) * 2007-06-19 2009-04-23 Murata Manufacturing Co., Ltd. Method for manufacturing component-embedded substrate and component-embedded substrate
US20090215287A1 (en) * 2005-07-11 2009-08-27 Masato Mori Substrate Connecting Member and Connecting Structure
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
US20130050954A1 (en) * 2010-10-26 2013-02-28 TDK-Lambda Americas, Inc. Thermal Management System and Method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4541893A (en) * 1984-05-15 1985-09-17 Advanced Micro Devices, Inc. Process for fabricating pedestal interconnections between conductive layers in an integrated circuit
US6495406B1 (en) * 2000-08-31 2002-12-17 Micron Technology, Inc. Method of forming lightly doped drain MOS transistor including forming spacers on gate electrode pattern before exposing gate insulator
JP2002093811A (ja) * 2000-09-11 2002-03-29 Sony Corp 電極および半導体装置の製造方法
DE60238570D1 (de) * 2001-04-18 2011-01-20 Epson Toyocom Corp Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung
JP4082285B2 (ja) * 2003-06-13 2008-04-30 住友電装株式会社 プリント基板の接続構造
FI20035178A7 (fi) * 2003-10-03 2005-04-04 Nokia Corp Häiriösuojattu matkaviestin sekä vastaava menetelmä ja järjestely matkaviestimen häiriösuojauksessa
FI119714B (fi) * 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
KR100709197B1 (ko) * 2005-10-18 2007-04-18 삼성에스디아이 주식회사 플라즈마 디스플레이 장치 및 보강 부재
US7262369B1 (en) * 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
TWI280097B (en) * 2006-03-14 2007-04-21 Arima Communication Corp Metal insert molding plastic of shielding case structure for hand hold device
WO2008001641A1 (en) * 2006-06-27 2008-01-03 Panasonic Corporation Interconnect substrate and electronic circuit mounted structure
US7452213B2 (en) * 2006-09-08 2008-11-18 Seagate Technology Llc Electrical contacts with compliant supports
US20080179731A1 (en) 2007-01-25 2008-07-31 Powertech Technology Inc. Anti-Impact memory module
TW200922394A (en) * 2007-11-02 2009-05-16 Delta Electronics Inc Circuit board module and method of strengthening structure thereof
JP2009239109A (ja) 2008-03-27 2009-10-15 Sharp Corp 電子部品配線基板および部品実装モジュール
JP2010212542A (ja) 2009-03-12 2010-09-24 Panasonic Corp 回路基板
US8097489B2 (en) * 2009-03-23 2012-01-17 Stats Chippac, Ltd. Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die
DE102009058877A1 (de) * 2009-12-18 2011-06-22 Siemens Aktiengesellschaft, 80333 Verfahren zum Prüfen von elektrischen Komponenten in einem Stromnetz, insbesondere in einem Gebäudestromnetz

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761050A (en) * 1996-08-23 1998-06-02 Cts Corporation Deformable pin connector for multiple PC boards
US6963491B2 (en) * 2001-07-13 2005-11-08 Lenovo (Singapore) Pte Ltd Expansion board apparatus and removing method
US20090215287A1 (en) * 2005-07-11 2009-08-27 Masato Mori Substrate Connecting Member and Connecting Structure
US20090101400A1 (en) * 2007-06-19 2009-04-23 Murata Manufacturing Co., Ltd. Method for manufacturing component-embedded substrate and component-embedded substrate
US20090067140A1 (en) * 2007-09-07 2009-03-12 Apple Inc. Stiffening plate for circuit board and switch assembly
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
US20130050954A1 (en) * 2010-10-26 2013-02-28 TDK-Lambda Americas, Inc. Thermal Management System and Method

Also Published As

Publication number Publication date
US20150250059A1 (en) 2015-09-03
FI20125725L (fi) 2013-12-27
EP2680679B1 (en) 2018-01-17
EP2680679A1 (en) 2014-01-01
FI20125725A7 (fi) 2013-12-27
CN203523133U (zh) 2014-04-02
US10201095B2 (en) 2019-02-05

Similar Documents

Publication Publication Date Title
US8116099B2 (en) Circuit board device, electronic device provided with the same, and GND connecting method
KR20160045336A (ko) 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체
EP2312921A1 (en) Interconnect board, printed circuit board unit, and method
JP4860990B2 (ja) 回路接続構造およびプリント回路板
CN109716597B (zh) 用于模块化插接连接器的过压保护模块
US9185833B2 (en) Electronic device housing
US7309240B2 (en) Apparatus and electronic apparatus
EP1881529A2 (en) Thermal conduit
US10201095B2 (en) Method for manufacturing a circuit board system with mechanical protection
US20150201496A1 (en) Radio module and relevant manufacturing method
WO2023098644A1 (zh) 电路板保护结构及充电装置
US20110292966A1 (en) Temperature sensor for flexible circuit
US20150096796A1 (en) Circuit board
AU2013225294B2 (en) An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector
US6692267B1 (en) Printed circuit board testing module
US10912200B2 (en) Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group
US20130344716A1 (en) Circuit board system
JP7483351B2 (ja) 熱監視のためのシステムおよび方法
US10104762B2 (en) Electric assembly to be mounted on a top-hat rail
US10944191B1 (en) Offset ;lug connector on a board connection area
CN101241159A (zh) 用于检测电试样的电检测装置
TWI351900B (en) Circuit board and electronic product using same
US7488180B2 (en) Testing device
EP2830399A1 (en) Printed circuit board cooling
CN208128613U (zh) 一种防静电累积组件及电子设备

Legal Events

Date Code Title Description
AS Assignment

Owner name: TELLABS OY, FINLAND

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HOLMA, ANTTI;REEL/FRAME:030592/0459

Effective date: 20130604

AS Assignment

Owner name: CORIANT OY, FINLAND

Free format text: CHANGE OF NAME;ASSIGNOR:TELLABS OY;REEL/FRAME:034980/0920

Effective date: 20141015

AS Assignment

Owner name: CERBERUS BUSINESS FINANCE, LLC, AS THE COLLATERAL

Free format text: SECURITY INTEREST;ASSIGNOR:CORIANT OY (FORMERLY KNOWN AS TELLABS OY;REEL/FRAME:036132/0362

Effective date: 20150427

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: CORIANT OY (FORMERLY TELLABS OY), ILLINOIS

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:CERBERUS BUSINESS FINANCE, LLC;REEL/FRAME:047727/0035

Effective date: 20181001