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US20130327501A1 - Phase change type heat dissipating device - Google Patents

Phase change type heat dissipating device Download PDF

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Publication number
US20130327501A1
US20130327501A1 US13/631,767 US201213631767A US2013327501A1 US 20130327501 A1 US20130327501 A1 US 20130327501A1 US 201213631767 A US201213631767 A US 201213631767A US 2013327501 A1 US2013327501 A1 US 2013327501A1
Authority
US
United States
Prior art keywords
phase change
generating component
working medium
heat generating
dissipating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/631,767
Other languages
English (en)
Inventor
Rung-An Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, RUNG-AN
Publication of US20130327501A1 publication Critical patent/US20130327501A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H10W40/735—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the present disclosure generally relates to dissipating devices, and more particularly to a dissipating device for removing heat from an electronic component by phase changing.
  • a traditional dissipating device is disposing a metal radiator on a top of the electronic component.
  • the radiator includes a base contacting with the electronic component and a plurality of fins attached to the base. Heat generated by the electronic component is conducted into the base and dissipated to ambient air from the fins.
  • the time of operation under high loading is relative short than the time of standby or the time of operation under low loading.
  • the heat generated by the electronic component in the electronic device is conducted to the air inside a casing of the electronic device quickly via the fins. This leads to a high increasing of the temperature of the casing of the electronic device a short time, and a negative affect of operation for the user.
  • the heat generated by the electronic component is less, and the fins can not be used efficiently.
  • FIG. 1 is an assembled, isometric view of a phase change type heat dissipating device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of the phase change type heat dissipating device of FIG. 1 .
  • FIG. 3 is a cross sectional view of the phase change type heat dissipating device of FIG. 1 , taken along line III-III thereof.
  • a phase change type heat dissipating device 10 in accordance with an exemplary embodiment is provided for removing heat from a heat generating component 20 of an electronic device (not shown).
  • the phase change type heat dissipating device 10 includes a top cover 11 , a bottom plate 12 opposite to the top cover 11 and a working medium 30 between the top cover 11 and the bottom plate 12 .
  • the top cover 11 and the bottom plate 12 are flat. A size of the top cover 11 is greater than that of the bottom plate 12 .
  • a plurality of lateral peripheries of the bottom plate 12 extends upward to form sidewalls 13 . Top ends of the sidewalls 13 curve and extend horizontally to form lateral walls 131 .
  • a periphery of a bottom surface of the top cover 11 is attached to the lateral walls 131 , whereby a cavity 14 is formed between the top cover 11 and the bottom plate 12 .
  • the bottom plate 12 , the sidewalls 13 and the lateral walls 131 are integrally formed as a single piece.
  • the top cover 11 , the bottom plate 12 , the sidewalls 13 and the lateral walls 131 are made from materials having good heat conductivity, such as aluminum and copper.
  • the top cover 11 and the bottom plate 12 can be a shell of other component (not shown) disposed in the electronic device.
  • the working medium 30 is received in the cavity 14 .
  • the working medium 30 is electrically insulated and phase change material, and represents solid state at normal temperature.
  • a volume of the working medium 30 under the normal temperature is smaller than a volume of the cavity 14 .
  • the working medium 30 can be liquefied to liquid at a certain temperature.
  • a melting point of the working medium 30 is between a temperature of the heat generating component 20 under standby/low-loading and the temperature of the heat generating component 20 under high-loading.
  • the working medium 30 can be hydrate, organic acid or esters etc.
  • the heat generating component 20 When assembled, the heat generating component 20 electrically connected to other components in the electronic device by being mounted on a printed circuit board, such as surface mounted technology (SMT).
  • the cavity 14 encloses the heat generating component 20 .
  • the working medium 30 directly contacts the heat generating component 20 .
  • the heat generating component 20 is disposed on the bottom plate 12 .
  • heat generated by the heat generating component 20 is conducted to the working medium 30 quickly.
  • the working medium 30 close to the heat generated component 20 is heated and liquefied to liquid firstly, then thermal convection is generated to prompt the working medium 30 relatively far from the heat generating component 20 and close to the inner surface of the cavity 14 being heated and liquefied.
  • heat is conducted to the inner surface of the cavity 14 .
  • heat can be temporarily stored in the working medium 30 and conducted to the external shell (not shown) of the electronic device slowly. Consequently, the surface of the heat generating component 20 is kept in a comparative low temperature, and the temperature of the external shell is avoided rising too fast in a short time, preventing affecting of the operation for the user.
  • the working medium 30 keeps conducting heat and exchanging heat to external air.
  • the working medium 30 is used for conducting and exchanging heat.
  • the working medium 30 can be utilized fully. Due to the insulation characteristic of the working medium 30 , the working medium 30 will not affect the working performance of the heat generating component 20 .
  • the heat generating component 20 when the heat generating component 20 is engaged with a circuit board (not shown), the circuit board can be received in the cavity 14 .
  • the shape of the top cover 11 , and the bottom plate 12 are not limited to flat, and can be other shape, such as triangular pyramid.
  • the shape of the working medium 30 can be designed according to the shape of the cavity 14 for being received in the cavity 14 .
  • the heat generating component 20 is received in the cavity 14 of the phase change type heat dissipating device 10 .
  • the working medium 30 represents solid state at normal temperature.
  • the working medium 30 is in contact with the heat generating component 20 .
  • heat generated by the heat generating component 20 is conducted to the working medium 30 firstly, the working medium 30 is liquefied gradually for temporarily storing heat.
  • heat is conducted to the external shell of the electronic device slowly, and the temperature of the external shell is avoided rising too fast in a short time for facilitating the operation of the user.
  • the phase change type heat dissipating device 10 is under standby or works under low-loading, the working medium 30 keeps conducting heat and exchanging heat to external air.
  • the working medium 30 turns to be solid state gradually for preparing to store heat in temporary in a next high loading status.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/631,767 2012-06-08 2012-09-28 Phase change type heat dissipating device Abandoned US20130327501A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101120758 2012-06-08
TW101120758A TWI492341B (zh) 2012-06-08 2012-06-08 相變化散熱裝置

Publications (1)

Publication Number Publication Date
US20130327501A1 true US20130327501A1 (en) 2013-12-12

Family

ID=49714364

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/631,767 Abandoned US20130327501A1 (en) 2012-06-08 2012-09-28 Phase change type heat dissipating device

Country Status (3)

Country Link
US (1) US20130327501A1 (zh)
JP (1) JP2013258404A (zh)
TW (1) TWI492341B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130327502A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744195B (zh) * 2021-02-24 2021-10-21 創意電子股份有限公司 熱高峰抑制裝置
CN114975308B (zh) * 2021-02-24 2025-03-28 创意电子股份有限公司 热高峰抑制装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6703128B2 (en) * 2002-02-15 2004-03-09 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices
US20050269063A1 (en) * 2003-02-18 2005-12-08 Jon Zuo Heat pipe having a wick structure containing phase change materials
US20060209516A1 (en) * 2005-03-17 2006-09-21 Chengalva Suresh K Electronic assembly with integral thermal transient suppression
US20080029247A1 (en) * 2006-08-02 2008-02-07 Takayuki Nozaki Temperature regulating member
US20090109623A1 (en) * 2007-10-31 2009-04-30 Forcecon Technology Co., Ltd. Heat-radiating module with composite phase-change heat-radiating efficiency
US20120280382A1 (en) * 2011-05-02 2012-11-08 Samsung Electronics Co., Ltd. Semiconductor packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088556U (ja) * 1983-11-24 1985-06-18 日本無線株式会社 冷却器付電気部品
ES527694A0 (es) * 1983-12-01 1984-11-01 Programa Energetico Unesa Ini Metodo de preparacion de un material de almacenamiento de energia termica por cambio de fase
JP2845221B2 (ja) * 1996-10-25 1999-01-13 日本電気株式会社 潜熱利用型ヒートシンク
US8390248B2 (en) * 2007-07-30 2013-03-05 Kyocera Corporation Electric power conversion apparatus and manufacturing method for the apparatus
TW201029557A (en) * 2009-01-22 2010-08-01 Foxconn Tech Co Ltd Heat dissipation device
JP2012099612A (ja) * 2010-11-01 2012-05-24 Denso Corp 半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6703128B2 (en) * 2002-02-15 2004-03-09 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices
US20050269063A1 (en) * 2003-02-18 2005-12-08 Jon Zuo Heat pipe having a wick structure containing phase change materials
US20060209516A1 (en) * 2005-03-17 2006-09-21 Chengalva Suresh K Electronic assembly with integral thermal transient suppression
US20080029247A1 (en) * 2006-08-02 2008-02-07 Takayuki Nozaki Temperature regulating member
US20090109623A1 (en) * 2007-10-31 2009-04-30 Forcecon Technology Co., Ltd. Heat-radiating module with composite phase-change heat-radiating efficiency
US20120280382A1 (en) * 2011-05-02 2012-11-08 Samsung Electronics Co., Ltd. Semiconductor packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130327502A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device
US9046305B2 (en) * 2012-06-08 2015-06-02 Foxconn Technology Co., Ltd. Phase change type heat dissipating device

Also Published As

Publication number Publication date
TW201351583A (zh) 2013-12-16
JP2013258404A (ja) 2013-12-26
TWI492341B (zh) 2015-07-11

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, RUNG-AN;REEL/FRAME:029051/0262

Effective date: 20120926

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION