US20130243974A1 - Method of preparing nickel-coated nanocarbon - Google Patents
Method of preparing nickel-coated nanocarbon Download PDFInfo
- Publication number
- US20130243974A1 US20130243974A1 US13/745,959 US201313745959A US2013243974A1 US 20130243974 A1 US20130243974 A1 US 20130243974A1 US 201313745959 A US201313745959 A US 201313745959A US 2013243974 A1 US2013243974 A1 US 2013243974A1
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- United States
- Prior art keywords
- nanocarbon
- nickel
- plating solution
- nickel plating
- semiconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 179
- 229910021392 nanocarbon Inorganic materials 0.000 title claims abstract description 127
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 90
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000007747 plating Methods 0.000 claims abstract description 61
- 238000007772 electroless plating Methods 0.000 claims abstract description 27
- 239000002253 acid Substances 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 9
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 47
- 239000002134 carbon nanofiber Substances 0.000 claims description 45
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 43
- 239000002109 single walled nanotube Substances 0.000 claims description 42
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 38
- 238000006243 chemical reaction Methods 0.000 claims description 17
- 239000002079 double walled nanotube Substances 0.000 claims description 10
- 239000002048 multi walled nanotube Substances 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 9
- 239000002041 carbon nanotube Substances 0.000 claims description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000011260 aqueous acid Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 150000002940 palladium Chemical class 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 229910001432 tin ion Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 16
- 229910018104 Ni-P Inorganic materials 0.000 description 15
- 229910018536 Ni—P Inorganic materials 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 15
- 239000011247 coating layer Substances 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000002411 thermogravimetry Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 229910003481 amorphous carbon Inorganic materials 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 230000001235 sensitizing effect Effects 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 229910002666 PdCl2 Inorganic materials 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- -1 TWCNTs Chemical compound 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000006172 buffering agent Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 206010016654 Fibrosis Diseases 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910018499 Ni—F Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004761 fibrosis Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Definitions
- the present invention relates to a method of preparing a nickel-coated Nanocarbon, and, more particularly, to a method of preparing a nickel-coated nanocarbon whose shape is controlled by controlling process variables in electroless plating.
- Nanocarbons have high strength, a high elastic modulus, excellent thermal and electrical conductivity and excellent mechanical and physical properties. Therefore, recently, there have been attempts to put nanocarbons to practical use in various fields by coating nanocarbons with metal materials to prepare nanocarbon-metal composites. For example, since nickel-coated nanocarbons exhibit excellent performance as electromagnetic-wave shielding materials or far-field electromagnetic-wave absorbing materials, attempts to coat nanocarbons with nickel have been made.
- Korean Unexamined Patent Application Publication No. 2006-0073019 discloses a method of preparing a carbon nanotube-metal composite by coating carbon nanotubes with a metal using electroless plating.
- carbon nanotubes a typical example of nanocarbons
- Nanocarbons have a nanosized cylindrical graphite sheet and an sp2 bond structure.
- Nanocarbons exhibit conductive characteristics or semiconductive characteristics depending on the rolling angle and structure of the graphite sheet.
- Carbon nanotubes may be classified into single-walled carbon nanotubes (SWCNTs), double-walled carbon nanotubes (DWCNTs), multi-walled carbon nanotubes (MWCNTs) and rope carbon nanotubes according to the number of bonds constituting a wall.
- SWCNTs single-walled carbon nanotubes
- DWCNTs double-walled carbon nanotubes
- MWCNTs multi-walled carbon nanotubes
- rope carbon nanotubes according to the number of bonds constituting a wall.
- single-walled carbon nanotubes exhibit various electrical, chemical, physical and optical characteristics because they have both metallic characteristics and semiconductive characteristics.
- metallic single-walled carbon nanotubes SWCNTs
- SWCNTs are necessarily mixed with semiconductive single-walled carbon nanotubes (SWCNTs).
- Metallic nanocarbons such as CNF (carbon nanofiber), MWCNT, TWCNT, DWCNT, metallic SWCNT and the like, are different from semiconductive nanocarbons, such as semiconductive SWCNT, SWCNT bundles and the like, in electrical characteristics.
- electroless plating a chemical reaction occurs on the surface of a subject to be plated. Therefore, at the time of coating nanocarbons with a metal using electroless plating, differentiated processes are required depending on electrical properties.
- conventional technologies do not provide a solution for the problem.
- the present invention has been made to solve the above-mentioned problems, and the present invention intends to provide a coating method that is differentiated according to the electrical properties of a nanocarbon in the process of coating a nanocarbon with nickel using electroless plating.
- the present invention intends to provide a method of coating a metallic nanocarbon, such as a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT, with nickel using electroless plating.
- a metallic nanocarbon such as a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT
- the present invention intends to provide a method of coating a semiconductive nanocarbon, such as a semiconductive SWCNT or a SWCNT bundle, with nickel using electroless plating.
- the present invention intends to provide a method of coating a nanocarbon with nickel using electroless plating to prepare a shape-controlled nickel-coated nanocarbon.
- the present invention provides a method of preparing a nickel-coated nanocarbon using electroless plating, including the steps of: washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon; immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated Pd seed on a surface of the nanocarbon; treating the nanocarbon having the Pd seed with a strong acid; immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon; and heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
- FIG. 1 is a conceptional view of the present invention
- FIG. 2 shows the results of thermogravimetric analysis (TGA) of carbon nanofibers (CNFs) before and after heat treatment;
- FIG. 3 shows scanning electron microscope (SEM) images of amorphous and crystalline carbon nanofibers of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes;
- FIG. 4 shows transmission electron microscope (TEM) images of amorphous and crystalline carbon nano-fibers of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes;
- FIG. 5 shows the results of thermogravimetric analysis (TGA) of amorphous carbon nanofibers (CNFs) of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes; and
- FIG. 6 shows the results of thermogravimetric analysts (TGA) of crystalline carbon nanofibers (CNFs) of Examples 1 to 3, which were prepared by performing high-temperature heat treatment at 400° C. (celsius degree) for 3 hours under an air atmosphere, according to fibrous, scalelike and spherical nickel-plating shapes.
- TGA thermogravimetric analysts
- the present invention provides a method of preparing a nickel-coated nanocarbon using electroless plating, including the steps of: 1) washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon; 2) immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated Pd seed on a surface of the nanocarbon; 3) treating the nanocarbon having the Pd seed with a strong acid; 4) immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon; and 5) heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
- nanocarbons are classified into metallic nanocarbons, such as CNFs, MWCNTs, TWCNTs, DWCNTs, metallic SWCNTs and the like, and semiconductive nanocarbons, such as semiconductive SWCNTs, semiconductive SWCNT bundles and the like.
- nickel coating may include Ni—P coating and Ni—B coating according to the kind of reductant used in electroless plating. That is, Ni—P coating is formed at the time of electroless-plating nickel using a P-type reductant, and Ni—B coating is formed at the time of electroless-plating nickel using a B-type reductant.
- the nanocarbon is washed with ultrasonic waves in an organic solvent or an aqueous acid solution.
- the nanocarbon is immersed into an organic solvent such as an alcohol or an aqueous acid solution and is then treated with ultrasonic waves, thus removing impurities such as amorphous carbon and the like.
- the nanocarbon is thermally oxidized at 400 ⁇ 600° C. (celsius degree) for 30 minutes ⁇ 5 hours under an air atmosphere.
- FIG. 2 it can be ascertained that when a carbon nanofiber (CNF) was thermally oxidized at 400 ⁇ 600° C. (celsius degree) for 3 hours under an air atmosphere, the purity of CNF was increased from 87 wt % to 99 wt %. Therefore, the process of washing CNF with a solvent such as an alcohol may be replaced by thermal oxidization treatment.
- the thermal oxidization treatment is advantageous in terms of economy and environment compared to a washing process.
- the washed or thermally-oxidized nanocarbon is immersed into a Pd-containing solution to reduce palladium (Pd) ions on the surface of the nanocarbon, thereby forming an activated palladium (Pd) seed on the surface of the nanocarbon.
- Electroless plating is performed only on the activated surface of the nanocarbon, and the degree of activation of the surface of the nanocarbon influences the adhesivity of an electroless plated layer.
- the washed or thermally-oxidized nanocarbon is immersed into a Pd-containing solution to reduce palladium (Pd) ions on the surface of the nanocarbon, so that an activated palladium (Pd) seed is formed on the surface of the nanocarbon, thereby activating the surface of the nanocarbon.
- the method may further include the step of immersing a semiconductive nanocarbon into a tin (Sn)-containing solution to adsorb tin ions (Sn 2+ ) on the surface of the semiconductive nanocarbon and then washing the tin ion-adsorbed semiconductive nanocarbon with water, that is, the step of sensitizing the semiconductive nanocarbon.
- a semiconductive nanocarbon into a tin (Sn)-containing solution to adsorb tin ions (Sn 2+ ) on the surface of the semiconductive nanocarbon and then washing the tin ion-adsorbed semiconductive nanocarbon with water, that is, the step of sensitizing the semiconductive nanocarbon.
- the step of sensitizing the semiconductive nanocarbon is not required.
- the nanocarbon is a semiconductive SWCNT or a SWCNT bundle
- the step of sensitizing the semiconductive nanocarbon is performed before the step of activating the nanocarbon.
- the nanocarbon having the Pd seed is treated with a strong acid to deposit purified palladium (Pd).
- the nanocarbon is a semiconductive nanocarbon (a semiconductive SWCNT or a SWCNT bundle)
- the strong acid-treated nanocarbon is immersed into an electroless nickel plating solution to form a nickel plated layer on the surface of the nanocarbon.
- the nickel plating solution may be classified into a normal temperature type of nickel plating solution (a reaction is conducted at 40° C. (celsius degree) or lower) and a high temperature type of nickel plating solution (a reaction is conducted at 100° C. (celsius degree) or lower).
- the plating rate can be controlled by controlling pH. That is, the plating rate increases when pH is higher than 4.8
- the plating rate is controlled according to the target plating thickness.
- the step 4) may be performed at 20- ⁇ 40 ° C. (celsius degree) for 5 ⁇ 20 minutes when the electroless nickel plating solution is a normal temperature type of nickel plating solution, and may be performed at 70 ⁇ 100° C. (celsius degree) for 1 ⁇ 10 minutes when the electroless nickel plating solution is a high temperature type of nickel plating solution.
- the pH may be maintained at 4 ⁇ 6.
- the electroless nickel plating solution can be more stably maintained, the plating rate becomes high, and the plating efficiency becomes high.
- the loadage, shape, density and particle size of a metal cast be controlled by controlling the concentration, deposition time, reaction temperature and pH of a plating solution.
- Plating solutions are classified into a high phosphorus concentration plating solution (phosphorus content: 10 ⁇ 13%), a middle phosphorus concentration plating solution (phosphorus content: 7 ⁇ 9%) and a low phosphorus concentration plating solution (phosphorus content: 1 ⁇ 5%) according to the content of phosphorus. As the content of phosphorus increases, a plating rate decreases, corrosion resistance increases, and heat resistance decreases.
- the loadage, shape, density and particle size of Ni—P, Ni—B or Ni can be controlled by controlling process variables such as electroless plating solution concentration, deposition time, traction temperature, pH and the like.
- Ni—P coating layers or Ni—B coating layers such as a fibrous Ni—F or Ni—B coating layer, a scalelike Ni—P or Ni—B coating layer, a spherical Ni—P or Ni—B coating layer and the like, can be formed on the surface of the nanocarbon by controlling process variables.
- a fibrous coating layer can be formed when a reaction rate is slow under the conditions of a large amount of Pd ions, a low temperature and low pH (reference: 4.8).
- a scalelike coating layer can be formed when a reaction is rapidly conducted under the conditions of a large amount of Pd ions, a high temperature and high pH (reference: 4.8).
- a spherical coating layer can be formed under the conditions of a small amount of Pd ions, a high temperature and high pH (reference: 4.8). That is, when the concentration of Pd serving as a seed of nickel plating becomes low, and temperature and pH becomes high, a reaction is rapidly conducted, with the result that nickel ions are collected only on the circumference of Pd, thereby forming a spherical coating layer.
- the step 4) may be conducted under the conditions of a Pd concentration of 0.4 ⁇ 1 g/L, a nickel plating solution concentration of 5 ⁇ 10 g/L, a deposition time of 10 ⁇ 15 minutes, a reaction temperature of 70 ⁇ 80° C. (celsius degree) and a pH of 4 ⁇ 5, thus forming a fibrous nickel plated layer.
- the step 4) may be conducted under the conditions of a Pd concentration of 0.4 ⁇ 1 g/L, a nickel plating solution concentration of 5 ⁇ 10 g/L, a deposition time of 5 ⁇ 10 minutes, a reaction temperature of 80 ⁇ 100° C. and a pH of 5 ⁇ 6, thus forming a scalelike nickel plated layer.
- the step 4) may be conducted under the conditions of a Pd concentration of 0.125 ⁇ 0.2 g/L, a nickel plating solution concentration of 5 ⁇ 10 g/L, a deposition time of 5 ⁇ 10 minutes, a reaction temperature of 80 ⁇ 100° C. (celsius degree) and a pH of 5 ⁇ 6, thus forming a spherical nickel plated layer.
- the nanocarbon provided with a fibrous coating layer is advantageous in that it has high strength
- the nanocarbon provided with a scalelike coating layer is advantageous in that it can effectively block magnetic waves and easily adsorb hydrogen because its surface area is large
- the nanocarbon provided with a spherical coating layer is advantageous in that it can be easily used as a catalyst support of a fuel cell.
- the electroless nickel plating solution includes a main component and a subsidiary component.
- the main component may be a reductant for reducing a nickel salt or nickel ions into nickel by donating electrons thereto.
- nickel salt nickel chloride, nickel sulfate, nickel sulfamate or the like may be used.
- reductant hypophosphite, hydrogenated borate, dimethylamineborane, hydrazine or the like may be used.
- a complexing agent a buffering agent, a pH adjuster, a promoter, a stabilizer, an improver or the like may be used.
- the subsidiary component is added in order to increase the life cycle of a plating solution and improve the efficiency of a reductant.
- the complexing agent serves to help the stabilization of metal ions by forming metal ions into metal complex ions and thus adjusting the total amount of metal ions participating in a reduction reaction or by retarding the precipitation of meal ions into a metal salt.
- the kind of the complexing agent is not particularly limited.
- an organic acid such as sodium acetate, ethylene glycol or the like, or salts thereof may be used.
- the buffering agent is used to decrease the width in change of pH at the time of electroless plating, and the kind thereof is not particularly limited.
- the pH adjuster is used to prevent the pH change influencing the rate and efficiency of electroless plating and the state of a plating film, and the kind thereof is not particularly limited.
- As the pH adjuster ammonium hydroxide, an inorganic acid, an organic acid, caustic soda or the like may be used.
- the promoter serves to improve the efficiency of metal deposition by accelerating the plating rate, and the kind thereof is not particularly limited.
- As the promoter sulfide, fluoride or the like may be used.
- the stabilizer serves to prevent a reduction reaction from occurring on the site other than the surface to be plated and to prevent a plating bath composition from being naturally decomposed, and the kind thereof is not particularly limited.
- As the stabilizer lead chloride, lead sulfide, lead nitride or the like may be used.
- the improver serves to improve the gloss of a plating film.
- the nanocarbon provided with the nickel plated layer is heat-treated at a high temperature of 300 ⁇ 700° C. (celsius degree) for 3 hours under an inert gas atmosphere (Ar, N 2 , He or the like), a vacuum atmosphere (10 ⁇ 3 tor) or an air atmosphere.
- an inert gas atmosphere Ar, N 2 , He or the like
- a vacuum atmosphere 10 ⁇ 3 tor
- the nickel plated layer formed on the nanocarbon, obtained in the step 4), may be an amorphous nickel plated layer.
- This amorphous nickel plated layer can be converted into a crystalline nickel plated layer by thermally oxidizing the amorphous nickel plated layer.
- an amorphous Ni—P or Ni—B coating layer formed by immersing the nanocarbon into an electroless nickel plating solution may be converted into a crystalline Ni—P or Ni—B coating layer by heat treatment.
- the method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention is characterized in that pre-treatment, activation treatment, acceleration treatment and then plating treatment are sequentially performed when a nanocarbon is a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT, and in that pre-treatment, sensitization treatment, activation treatment, acceleration treatment and then plating treatment are sequentially performed when a nanocarbon is a semiconductive SWCNT or a SWCNT bundle.
- the method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention is effective in improving the result and reliability of a plating process because electroless plating is performed according to differentiated processes in consideration of electrical properties of nanocarbons.
- CNF (VGCF®-H, manufactured by Showa Denko Corporation) was immersed into an ethanol solution, was treated with ultrasonic waves for 30 minutes, was immersed into a solution including PdCl 2 , HCl and H 2 O, and was then further treated with ultrasonic waves for 10 minutes. Thereafter, the CNF was immersed into a concentrated sulfuric acid solution, was treated with ultrasonic waves for 3 minutes, was immersed into a nickel plating solution including SX-A, SX-M and H 2 O, and was then stirred at 90° C., (celsius degree) for 10 minutes at a rotation speed of 200 rpm to obtain Ni—P-coated CNF.
- SX-A is a nickel plating solution including nickel in a concentration of 2.138 M
- SX-M is a reducing solution including sodium hypophosphite in a concentration of 2.36 M.
- Ni—P-coated CNF was heat-treated at a temperature of 300 to 700° C. (celsius degree) for 3 hours under an air atmosphere.
- Ni—P-coated CNF obtained from Examples 1 to 3 was heat-treated at a high temperature of 400° C. (celsius degree) for 3 hours under an air atmosphere to prepare crystalline Ni—P-coated CNF.
- a semiconductive SWCNT bundle was immersed into an ethanol solution, was treated with ultrasonic waves for 30 minutes (washing process), was immersed into a solution including PdCl 2 , HCl and H 2 O, and was then further treated with ultrasonic waves for 10 minutes. Thereafter, the semiconductive SWCNT bundle was immersed into a solution including 0.1 mol SnCl 2 and 0.1 mol HCl for several seconds to sensitize the semiconductive SWCNT bundle, and then the sensitized semiconductive SWCNT bundle was immersed into a concentrated sulfuric acid solution, was treated with ultrasonic waves for 3 minutes, was immersed into a nickel plating solution including SX-A, SX-M and H 2 O, and was then stirred at 90° C. (celsius degree) for 10 minutes at a rotation speed of 200 rpm to obtain a nickel-coated SWCNT bundle.
- FIG. 3 shows SEM images of the amorphous and crystalline carbon nanofibers of Examples 1 to 3.
- Amorphous fibrous, scalelike and spherical nickel plated layers formed on the surface of carbon nanofibers are shown in the upper portion of FIG. 3 .
- crystalline fibrous, scalelike and spherical nickel plated layers formed on the surface of carbon nanofibers are shown in the lower portion of FIG. 3 . From the SEM images of FIG. 3 , it can be ascertained that the surface shape of the amorphous nickel plated layer was changed by high-temperature heat treatment.
- FIG. 4 shows TEM images of amorphous and crystalline carbon nanofibers of Examples 1 to 3. From the TEM images of FIG. 4 , the thickness and shapes of the N—P-plated layers laminated on carbon nanofiber can be ascertained by the sectional area thereof.
- FIG. 5 shows the results of TGA analysis of the thermal characteristics of the fibrous, scalelike and spherical nickel plated layers of amorphous carbon nanofibers (CNFs). From the results shown in FIG. 5 , it can be ascertained that the thermal characteristics thereof are changed depending on the shape of the nickel plated layer and that the carbon nanofiber is stable as the distribution of the nickel plated layer becomes wider.
- CNFs amorphous carbon nanofibers
- FIG. 6 shows the results of TGA analysis of the thermal characteristics of the fibrosis, scalelike and spherical nickel plated layers of the crystalline carbon nanofibers (CNFs), which were prepared by heat-treating the amorphous carbon nanofibers (CNFs) at a high temperature of 400° C. (celsius degree). From the results shown in FIG. 6 , it can be ascertained that the nickel plate layer becomes thermally stable as it is crystallised.
- CNFs crystalline carbon nanofibers
- variously-shaped metal-coated nanocarbons can be simply and easily prepared in large quantities using electroless plating in consideration of electrical properties of nanocarbons.
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Abstract
A method of preparing a nickel-coated nanocarbon using electroless plating is provided. The method includes washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon, immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated Pd seed on a surface of the nanocarbon, treating the nanocarbon having the Pd seed with a strong acid, immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon, and heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
Description
- This application claims the benefit of Korean Patent Application No. KR 10-2012-0026650, filed on Mar. 13, 2012, which is hereby incorporated by reference in its entirety into this application.
- 1. Technical Field
- The present invention relates to a method of preparing a nickel-coated Nanocarbon, and, more particularly, to a method of preparing a nickel-coated nanocarbon whose shape is controlled by controlling process variables in electroless plating.
- 2. Description of the Related Art
- Nanocarbons have high strength, a high elastic modulus, excellent thermal and electrical conductivity and excellent mechanical and physical properties. Therefore, recently, there have been attempts to put nanocarbons to practical use in various fields by coating nanocarbons with metal materials to prepare nanocarbon-metal composites. For example, since nickel-coated nanocarbons exhibit excellent performance as electromagnetic-wave shielding materials or far-field electromagnetic-wave absorbing materials, attempts to coat nanocarbons with nickel have been made.
- Recently, electroless plating has been frequently used as a method of coating nanocarbons with nickel.
- For example, Korean Unexamined Patent Application Publication No. 2006-0073019 discloses a method of preparing a carbon nanotube-metal composite by coating carbon nanotubes with a metal using electroless plating.
- Meanwhile, carbon nanotubes, a typical example of nanocarbons, have a nanosized cylindrical graphite sheet and an sp2 bond structure. Nanocarbons exhibit conductive characteristics or semiconductive characteristics depending on the rolling angle and structure of the graphite sheet. Carbon nanotubes may be classified into single-walled carbon nanotubes (SWCNTs), double-walled carbon nanotubes (DWCNTs), multi-walled carbon nanotubes (MWCNTs) and rope carbon nanotubes according to the number of bonds constituting a wall.
- Among these carbon nanotubes, single-walled carbon nanotubes (SWCNTs) exhibit various electrical, chemical, physical and optical characteristics because they have both metallic characteristics and semiconductive characteristics. Generally, at the time of synthesizing single-walled carbon nanotubes (SWCNTs), metallic single-walled carbon nanotubes (SWCNTs) are necessarily mixed with semiconductive single-walled carbon nanotubes (SWCNTs).
- Metallic nanocarbons, such as CNF (carbon nanofiber), MWCNT, TWCNT, DWCNT, metallic SWCNT and the like, are different from semiconductive nanocarbons, such as semiconductive SWCNT, SWCNT bundles and the like, in electrical characteristics. In electroless plating, a chemical reaction occurs on the surface of a subject to be plated. Therefore, at the time of coating nanocarbons with a metal using electroless plating, differentiated processes are required depending on electrical properties. However, conventional technologies do not provide a solution for the problem.
- Accordingly, the present invention has been made to solve the above-mentioned problems, and the present invention intends to provide a coating method that is differentiated according to the electrical properties of a nanocarbon in the process of coating a nanocarbon with nickel using electroless plating.
- More specifically, the present invention intends to provide a method of coating a metallic nanocarbon, such as a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT, with nickel using electroless plating.
- Further, the present invention intends to provide a method of coating a semiconductive nanocarbon, such as a semiconductive SWCNT or a SWCNT bundle, with nickel using electroless plating.
- Further, the present invention intends to provide a method of coating a nanocarbon with nickel using electroless plating to prepare a shape-controlled nickel-coated nanocarbon.
- In order to accomplish the above objects, the present invention provides a method of preparing a nickel-coated nanocarbon using electroless plating, including the steps of: washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon; immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated Pd seed on a surface of the nanocarbon; treating the nanocarbon having the Pd seed with a strong acid; immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon; and heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
- The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a conceptional view of the present invention; -
FIG. 2 shows the results of thermogravimetric analysis (TGA) of carbon nanofibers (CNFs) before and after heat treatment; -
FIG. 3 shows scanning electron microscope (SEM) images of amorphous and crystalline carbon nanofibers of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes; -
FIG. 4 shows transmission electron microscope (TEM) images of amorphous and crystalline carbon nano-fibers of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes; -
FIG. 5 shows the results of thermogravimetric analysis (TGA) of amorphous carbon nanofibers (CNFs) of Examples 1 to 3 according to fibrous, scalelike and spherical nickel-plating shapes; and -
FIG. 6 shows the results of thermogravimetric analysts (TGA) of crystalline carbon nanofibers (CNFs) of Examples 1 to 3, which were prepared by performing high-temperature heat treatment at 400° C. (celsius degree) for 3 hours under an air atmosphere, according to fibrous, scalelike and spherical nickel-plating shapes. - Hereinafter, preferred embodiment of the present invention will be described in detail.
- The present invention provides a method of preparing a nickel-coated nanocarbon using electroless plating, including the steps of: 1) washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon; 2) immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated Pd seed on a surface of the nanocarbon; 3) treating the nanocarbon having the Pd seed with a strong acid; 4) immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon; and 5) heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
- In the present invention, nanocarbons are classified into metallic nanocarbons, such as CNFs, MWCNTs, TWCNTs, DWCNTs, metallic SWCNTs and the like, and semiconductive nanocarbons, such as semiconductive SWCNTs, semiconductive SWCNT bundles and the like.
- In the present invention, nickel coating may include Ni—P coating and Ni—B coating according to the kind of reductant used in electroless plating. That is, Ni—P coating is formed at the time of electroless-plating nickel using a P-type reductant, and Ni—B coating is formed at the time of electroless-plating nickel using a B-type reductant.
- In the method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention, in the step 1), for the purpose of purity improvement, the nanocarbon is washed with ultrasonic waves in an organic solvent or an aqueous acid solution. For example, the nanocarbon is immersed into an organic solvent such as an alcohol or an aqueous acid solution and is then treated with ultrasonic waves, thus removing impurities such as amorphous carbon and the like.
- Meanwhile, in the step 1), the nanocarbon is thermally oxidized at 400˜600° C. (celsius degree) for 30 minutes˜5 hours under an air atmosphere. Referring to
FIG. 2 , it can be ascertained that when a carbon nanofiber (CNF) was thermally oxidized at 400˜600° C. (celsius degree) for 3 hours under an air atmosphere, the purity of CNF was increased from 87 wt % to 99 wt %. Therefore, the process of washing CNF with a solvent such as an alcohol may be replaced by thermal oxidization treatment. The thermal oxidization treatment is advantageous in terms of economy and environment compared to a washing process. - In the step 2), the washed or thermally-oxidized nanocarbon is immersed into a Pd-containing solution to reduce palladium (Pd) ions on the surface of the nanocarbon, thereby forming an activated palladium (Pd) seed on the surface of the nanocarbon.
- Electroless plating is performed only on the activated surface of the nanocarbon, and the degree of activation of the surface of the nanocarbon influences the adhesivity of an electroless plated layer.
- Therefore, in the step 2), the washed or thermally-oxidized nanocarbon is immersed into a Pd-containing solution to reduce palladium (Pd) ions on the surface of the nanocarbon, so that an activated palladium (Pd) seed is formed on the surface of the nanocarbon, thereby activating the surface of the nanocarbon.
- When the nanocarbon is a semiconductive SWCNT or a SWCNT bundle, the method may further include the step of immersing a semiconductive nanocarbon into a tin (Sn)-containing solution to adsorb tin ions (Sn2+) on the surface of the semiconductive nanocarbon and then washing the tin ion-adsorbed semiconductive nanocarbon with water, that is, the step of sensitizing the semiconductive nanocarbon.
- When the nanocarbon is a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT, the step of sensitizing the semiconductive nanocarbon is not required. However, when the nanocarbon is a semiconductive SWCNT or a SWCNT bundle, the step of sensitizing the semiconductive nanocarbon is performed before the step of activating the nanocarbon.
- In the step 3) which is an acceleration procedure, when the nanocarbon is a metallic nanocarbon (a CNF, a MWCNT a TWCNT, a DWCNT or a metallic SWCNT), the nanocarbon having the Pd seed is treated with a strong acid to deposit purified palladium (Pd).
- Further, in the step 3), when the nanocarbon is a semiconductive nanocarbon (a semiconductive SWCNT or a SWCNT bundle), a tin (Sn) component remaining on the surface of the nanocarbon after sensitization treatment and activation treatment is removed to deposit purified palladium (Pd). That is, when the semiconductive nanocarbon is sensitized and activated, a reaction of Sn2++Pd2+=Sn4++Pd0 is caused, so that a PD seed is formed and Sn4+ remains. The remaining Sn4+ is removed by treating it with a strong acid.
- In the step 4), the strong acid-treated nanocarbon is immersed into an electroless nickel plating solution to form a nickel plated layer on the surface of the nanocarbon.
- Even though a Pd catalyst is activated on the surface of the nanocarbon, it must be maintained at a predetermined temperature or more in order to continuously perform an antocatalytic plating reaction, and moreover, a plating reaction rate increases as the temperature increases. The nickel plating solution may be classified into a normal temperature type of nickel plating solution (a reaction is conducted at 40° C. (celsius degree) or lower) and a high temperature type of nickel plating solution (a reaction is conducted at 100° C. (celsius degree) or lower).
- Further, the plating rate can be controlled by controlling pH. That is, the plating rate increases when pH is higher than 4.8
- Since plating thickness increases in proportion to plating time, the plating rate is controlled according to the target plating thickness.
- In the present invention, the step 4) may be performed at 20-˜40° C. (celsius degree) for 5˜20 minutes when the electroless nickel plating solution is a normal temperature type of nickel plating solution, and may be performed at 70˜100° C. (celsius degree) for 1˜10 minutes when the electroless nickel plating solution is a high temperature type of nickel plating solution.
- Further, in the step 4), the pH may be maintained at 4˜6. When the pH is maintained at 4˜6, the electroless nickel plating solution can be more stably maintained, the plating rate becomes high, and the plating efficiency becomes high.
- In the method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention, the loadage, shape, density and particle size of a metal cast be controlled by controlling the concentration, deposition time, reaction temperature and pH of a plating solution.
- Plating solutions are classified into a high phosphorus concentration plating solution (phosphorus content: 10˜13%), a middle phosphorus concentration plating solution (phosphorus content: 7˜9%) and a low phosphorus concentration plating solution (phosphorus content: 1˜5%) according to the content of phosphorus. As the content of phosphorus increases, a plating rate decreases, corrosion resistance increases, and heat resistance decreases.
- According to the present invention, the loadage, shape, density and particle size of Ni—P, Ni—B or Ni can be controlled by controlling process variables such as electroless plating solution concentration, deposition time, traction temperature, pH and the like.
- In particular, various shapes of Ni—P coating layers or Ni—B coating layers, such as a fibrous Ni—F or Ni—B coating layer, a scalelike Ni—P or Ni—B coating layer, a spherical Ni—P or Ni—B coating layer and the like, can be formed on the surface of the nanocarbon by controlling process variables.
- As shown in
FIG. 1 , a fibrous coating layer can be formed when a reaction rate is slow under the conditions of a large amount of Pd ions, a low temperature and low pH (reference: 4.8). - Further, a scalelike coating layer can be formed when a reaction is rapidly conducted under the conditions of a large amount of Pd ions, a high temperature and high pH (reference: 4.8).
- Further, a spherical coating layer can be formed under the conditions of a small amount of Pd ions, a high temperature and high pH (reference: 4.8). That is, when the concentration of Pd serving as a seed of nickel plating becomes low, and temperature and pH becomes high, a reaction is rapidly conducted, with the result that nickel ions are collected only on the circumference of Pd, thereby forming a spherical coating layer.
- Specifically, the step 4) may be conducted under the conditions of a Pd concentration of 0.4˜1 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 10˜15 minutes, a reaction temperature of 70˜80° C. (celsius degree) and a pH of 4˜5, thus forming a fibrous nickel plated layer.
- Further, the step 4) may be conducted under the conditions of a Pd concentration of 0.4˜1 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 5˜10 minutes, a reaction temperature of 80˜100° C. and a pH of 5˜6, thus forming a scalelike nickel plated layer.
- Further, the step 4) may be conducted under the conditions of a Pd concentration of 0.125˜0.2 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 5˜10 minutes, a reaction temperature of 80˜100° C. (celsius degree) and a pH of 5˜6, thus forming a spherical nickel plated layer.
- The nanocarbon provided with a fibrous coating layer is advantageous in that it has high strength, the nanocarbon provided with a scalelike coating layer is advantageous in that it can effectively block magnetic waves and easily adsorb hydrogen because its surface area is large, and the nanocarbon provided with a spherical coating layer is advantageous in that it can be easily used as a catalyst support of a fuel cell.
- The electroless nickel plating solution includes a main component and a subsidiary component.
- The main component may be a reductant for reducing a nickel salt or nickel ions into nickel by donating electrons thereto. As the nickel salt, nickel chloride, nickel sulfate, nickel sulfamate or the like may be used. As the reductant, hypophosphite, hydrogenated borate, dimethylamineborane, hydrazine or the like may be used.
- As the subsidiary component, a complexing agent, a buffering agent, a pH adjuster, a promoter, a stabilizer, an improver or the like may be used. The subsidiary component is added in order to increase the life cycle of a plating solution and improve the efficiency of a reductant.
- The complexing agent serves to help the stabilization of metal ions by forming metal ions into metal complex ions and thus adjusting the total amount of metal ions participating in a reduction reaction or by retarding the precipitation of meal ions into a metal salt. The kind of the complexing agent is not particularly limited. As the complexing agent, an organic acid such as sodium acetate, ethylene glycol or the like, or salts thereof may be used.
- The buffering agent is used to decrease the width in change of pH at the time of electroless plating, and the kind thereof is not particularly limited.
- The pH adjuster is used to prevent the pH change influencing the rate and efficiency of electroless plating and the state of a plating film, and the kind thereof is not particularly limited. As the pH adjuster, ammonium hydroxide, an inorganic acid, an organic acid, caustic soda or the like may be used.
- The promoter serves to improve the efficiency of metal deposition by accelerating the plating rate, and the kind thereof is not particularly limited. As the promoter, sulfide, fluoride or the like may be used.
- The stabilizer serves to prevent a reduction reaction from occurring on the site other than the surface to be plated and to prevent a plating bath composition from being naturally decomposed, and the kind thereof is not particularly limited. As the stabilizer, lead chloride, lead sulfide, lead nitride or the like may be used.
- The improver serves to improve the gloss of a plating film.
- in the step 5), the nanocarbon provided with the nickel plated layer is heat-treated at a high temperature of 300˜700° C. (celsius degree) for 3 hours under an inert gas atmosphere (Ar, N2, He or the like), a vacuum atmosphere (10−3 tor) or an air atmosphere.
- The nickel plated layer formed on the nanocarbon, obtained in the step 4), may be an amorphous nickel plated layer. This amorphous nickel plated layer can be converted into a crystalline nickel plated layer by thermally oxidizing the amorphous nickel plated layer. For example, when a nanocarbon is coated with Ni—P or Ni—B by electroless plating, an amorphous Ni—P or Ni—B coating layer formed by immersing the nanocarbon into an electroless nickel plating solution may be converted into a crystalline Ni—P or Ni—B coating layer by heat treatment.
- Consequently, the method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention is characterized in that pre-treatment, activation treatment, acceleration treatment and then plating treatment are sequentially performed when a nanocarbon is a CNF, a MWCNT, a TWCNT, a DWCNT or a metallic SWCNT, and in that pre-treatment, sensitization treatment, activation treatment, acceleration treatment and then plating treatment are sequentially performed when a nanocarbon is a semiconductive SWCNT or a SWCNT bundle.
- The method of preparing a nickel-coated nanocarbon using electroless plating according to the present invention is effective in improving the result and reliability of a plating process because electroless plating is performed according to differentiated processes in consideration of electrical properties of nanocarbons.
- Hereinafter, the present invention will be described in more detail with reference to the following Examples. However, these Examples are set forth to illustrate the present invention, and the scope of the present invention is not limited thereto. The following Examples may be modified and changed within the scope of the present invention by those skilled in the art.
- CNF (VGCF®-H, manufactured by Showa Denko Corporation) was immersed into an ethanol solution, was treated with ultrasonic waves for 30 minutes, was immersed into a solution including PdCl2, HCl and H2O, and was then further treated with ultrasonic waves for 10 minutes. Thereafter, the CNF was immersed into a concentrated sulfuric acid solution, was treated with ultrasonic waves for 3 minutes, was immersed into a nickel plating solution including SX-A, SX-M and H2O, and was then stirred at 90° C., (celsius degree) for 10 minutes at a rotation speed of 200 rpm to obtain Ni—P-coated CNF.
- Here, SX-A is a nickel plating solution including nickel in a concentration of 2.138 M, and SX-M is a reducing solution including sodium hypophosphite in a concentration of 2.36 M.
- The Ni—P-coated CNF was heat-treated at a temperature of 300 to 700° C. (celsius degree) for 3 hours under an air atmosphere.
-
TABLE 1 Pd Ni Reaction concen- plating temperature tration solution Deposition (celcius (g/L) (g/L) time (min) degree) pH Remark Ex. 1 0.8 7 12 75 4.2 fibrous Ex. 2 0.8 7 7 90 5.5 scalelike Ex. 3 0.2 7 7 90 5.5 spherical - Preparation of Crystalline Nickel-Coated CNF
- The Ni—P-coated CNF obtained from Examples 1 to 3 was heat-treated at a high temperature of 400° C. (celsius degree) for 3 hours under an air atmosphere to prepare crystalline Ni—P-coated CNF.
- A semiconductive SWCNT bundle was immersed into an ethanol solution, was treated with ultrasonic waves for 30 minutes (washing process), was immersed into a solution including PdCl2, HCl and H2O, and was then further treated with ultrasonic waves for 10 minutes. Thereafter, the semiconductive SWCNT bundle was immersed into a solution including 0.1 mol SnCl2 and 0.1 mol HCl for several seconds to sensitize the semiconductive SWCNT bundle, and then the sensitized semiconductive SWCNT bundle was immersed into a concentrated sulfuric acid solution, was treated with ultrasonic waves for 3 minutes, was immersed into a nickel plating solution including SX-A, SX-M and H2O, and was then stirred at 90° C. (celsius degree) for 10 minutes at a rotation speed of 200 rpm to obtain a nickel-coated SWCNT bundle.
- Test Example: Evaluation of Characteristics of Nickel-Coated CNFs
- The SEM analysis and TEM analysis of the amorphous and crystalline Ni—P-coated CNFs obtained from Example 1 to 3 were carried out.
FIG. 3 shows SEM images of the amorphous and crystalline carbon nanofibers of Examples 1 to 3. Amorphous fibrous, scalelike and spherical nickel plated layers formed on the surface of carbon nanofibers are shown in the upper portion ofFIG. 3 . Further, crystalline fibrous, scalelike and spherical nickel plated layers formed on the surface of carbon nanofibers are shown in the lower portion ofFIG. 3 . From the SEM images ofFIG. 3 , it can be ascertained that the surface shape of the amorphous nickel plated layer was changed by high-temperature heat treatment. -
FIG. 4 shows TEM images of amorphous and crystalline carbon nanofibers of Examples 1 to 3. From the TEM images ofFIG. 4 , the thickness and shapes of the N—P-plated layers laminated on carbon nanofiber can be ascertained by the sectional area thereof. - Further, the TGA analysis of the amorphous and crystalline fibrous, scalelike and spherical Ni—P-coated CNFs obtained from Example 1 to 3 were carried out.
-
FIG. 5 shows the results of TGA analysis of the thermal characteristics of the fibrous, scalelike and spherical nickel plated layers of amorphous carbon nanofibers (CNFs). From the results shown inFIG. 5 , it can be ascertained that the thermal characteristics thereof are changed depending on the shape of the nickel plated layer and that the carbon nanofiber is stable as the distribution of the nickel plated layer becomes wider. -
FIG. 6 shows the results of TGA analysis of the thermal characteristics of the fibrosis, scalelike and spherical nickel plated layers of the crystalline carbon nanofibers (CNFs), which were prepared by heat-treating the amorphous carbon nanofibers (CNFs) at a high temperature of 400° C. (celsius degree). From the results shown inFIG. 6 , it can be ascertained that the nickel plate layer becomes thermally stable as it is crystallised. - As described above, according to the present invention, variously-shaped metal-coated nanocarbons can be simply and easily prepared in large quantities using electroless plating in consideration of electrical properties of nanocarbons.
- Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (12)
1. A method of preparing a nickel-coated nanocarbon using electroless plating, comprising the steps of:
1) washing a nanocarbon with a solvent or thermally-oxidizing the nanocarbon to remove impurities from the nanocarbon;
2) immersing the washed or thermally-oxidized nanocarbon into a Pd-containing solution to form an activated palladium (Pd) seed on a surface of the nanocarbon;
3) treating the nanocarbon having the Pd seed with a strong acid;
4) immersing the strong acid-treated nanocarbon into an electroless nickel plating solution to form a nickel plated layer on a surface of the nanocarbon; and
5) heat-treating the nanocarbon having the nickel plated layer at a high temperature to crystallize the nanocarbon.
2. The method of claim 1 , wherein the nanocarbon is selected from a carbon nanofiber (CNF), a multi-walled carbon nanotube (MWCNT), a triple-walled carbon nanotube (TWCNT), a double-walled carbon nanotube (DWCNT), a metallic single-walled carbon nanotube (SWCNT), a semiconductive single-walked carbon nanotube (SWCNT) and a semiconductive single-walled carbon nanotube bundle.
3. The method of claim 1 , wherein, in the step 1), the nanocarbon is washed with ultrasonic waves in an organic solvent or an aqueous acid solution.
4. The method of claim 1 , wherein, in the step 1), the nanocarbon is thermally oxidized at 400˜600° C. for 30 minutes˜5 hours under an air atmosphere.
5. The method of claim 1 , wherein the nanocarbon is a semiconductive SWCNT or a SWCNT bundle, and the method further includes, after the step 2), the step of immersing a semiconductive nanocarbon into a tin (Sn)-containing solution to adsorb tin ions (Sn2+) on a surface of the semiconductive nanocarbon and then washing the tin ion-adsorbed semiconductive nanocarbon with wafer.
6. The method of claim 1 , wherein, in the step 3), the nanocarbon having the Pd seed is treated with a strong acid to deposit purified palladium (Pd).
7. The method of claim 1 , wherein, in the step 4), when the electroless nickel plating solution is a normal temperature type of nickel plating solution, the strong acid-treated nanocarbon is immersed into the electroless nickel plating solution at 20˜40° C. for 5˜20 minutes, and, when the electroless nickel plating solution is a high temperature type of nickel plating solution, the strong acid-treated nanocarbon is immersed into the electroless nickel plating solution at 70˜100° C. for 1˜10 minutes.
8. The method of claim 1 , wherein, in the step 4), the pH of the electroless nickel plating solution is maintained at 4˜6.
9. The method of claim 1 , wherein the step 4) is conducted under the conditions of a Pd concentration of 0.4˜1 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 10˜15 minutes, a reaction temperature of 70˜80° C. am a pH of 4˜5, so as to form a fibrous nickel plated layer.
10. The method of claim 1 , wherein the step 4) is conducted under the conditions of a Pd concentration of 0.4˜1 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 5˜10 minutes, a reaction temperature of 80˜100° C. an a pH of 5˜6, so as to form a scalelike nickel plated layer.
11. The method of claim 1 , wherein the step 4) is conducted under the conditions of a Pd concentration of 0.125˜0.2 g/L, a nickel plating solution concentration of 5˜10 g/L, a deposition time of 5˜10 minutes, a reaction temperature of 80˜100° C. an a pH of 5˜6, so as to form a spherical nickel plated layer.
12. The method of claim 1 , wherein, in the step 5), the nanocarbon having the nickel plated layer is heat-treated at a high temperature of 300˜700° C. for 3 hours under an inert gas atmosphere, a vacuum atmosphere or an air atmosphere.
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| KR1020120026650A KR101365457B1 (en) | 2012-03-15 | 2012-03-15 | Method of Manufacturing Ni-coated Nano- carbons |
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| US (1) | US20130243974A1 (en) |
| JP (1) | JP5602260B2 (en) |
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| JP2013193954A (en) | 2013-09-30 |
| JP5602260B2 (en) | 2014-10-08 |
| KR101365457B1 (en) | 2014-02-21 |
| KR20130104797A (en) | 2013-09-25 |
| CN103303897A (en) | 2013-09-18 |
| CN103303897B (en) | 2015-08-26 |
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