US20130043002A1 - Heat dissipating module supporting apparatus - Google Patents
Heat dissipating module supporting apparatus Download PDFInfo
- Publication number
- US20130043002A1 US20130043002A1 US13/483,228 US201213483228A US2013043002A1 US 20130043002 A1 US20130043002 A1 US 20130043002A1 US 201213483228 A US201213483228 A US 201213483228A US 2013043002 A1 US2013043002 A1 US 2013043002A1
- Authority
- US
- United States
- Prior art keywords
- supporting apparatus
- latch
- securing portion
- securing
- holding hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Classifications
-
- H10W40/10—
-
- H10W40/73—
Definitions
- the present disclosure relates to supporting apparatuses, and particularly to a supporting apparatus for a heat dissipating module.
- a heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated from electronic components in the electronic device.
- a bracket is provided to support the heat dissipating module.
- different electronic components may have different sizes, so different brackets need to be designed accordingly. Such additional design requirements of the brackets may increase manufacturing cost.
- FIG. 1 is an exploded, isometric view of an embodiment of a supporting apparatus and a heat dissipating module.
- FIG. 2 is a partially assembled view of a bracket, a heat conducting member, and a latch member of FIG. 1 .
- FIG. 3 is an assembled view of the supporting apparatus of FIG. 2 .
- a supporting apparatus of one embodiment is configured to support a heat dissipating module 20 and includes a bracket 30 , a heat conducting member 40 , and a latch member 50 .
- the heat dissipating module 20 includes a plurality of heat dissipating fins 21 and a heat pipe 23 .
- the plurality of heat dissipating fins 21 are substantially parallel to each other.
- the heat pipe 23 extends through the plurality of heat dissipating fins 21 to secure the plurality of heat dissipating fins 21 together.
- a contacting portion 25 is substantially perpendicularly extended from each of the plurality of heat dissipating fins 21 .
- the contacting portion 25 is connected to adjacent one of the contacting portion 25 .
- the bracket 30 includes a securing portion 31 and four securing legs 35 .
- the securing portion 31 defines a holding hole 32 for insertion of a fastener.
- the holding hole 32 is substantially circular.
- a plurality of blocking tabs 34 located on inner surface of the holding hole 32 .
- the four securing legs 35 extend from the securing portion 31 .
- the four securing legs 35 are arranged at four corners of a rectangular. Each of the four securing legs 35 defines a securing hole 36 .
- the heat conducting member 40 includes a body 41 and a plurality of stopping portions 46 located on the body 41 .
- the body 41 includes a first touching surface 411 (shown in FIG. 3 ), a second touching surface 413 (shown in FIG. 2 ) and a sidewall 415 .
- the first touching surface 411 is substantially parallel to the second touching surface 413 .
- the sidewall 415 is connected to the first touching surface 411 and the second touching surface 413 .
- the plurality of stopping portions 46 are located on the sidewall 415 .
- the body 41 is substantially columnar, and a diameter of the body 41 is smaller than that of the holding hole 32 .
- the latch member 50 includes a latch ring 52 and four hooks 54 .
- the latch ring 52 has a latch hole 51 .
- the latch ring 52 is substantially circular, and a diameter of the latch hole 51 is smaller than that of the body 41 .
- the four hooks 54 are located on the latch ring 52 . In one embodiment, the four hooks 54 are arranged at four corners of a rectangular.
- the heat conducting member 40 is inserted into the holding hole 32 , until the a plurality of stopping portions 46 resist the plurality of blocking tabs 34 .
- the first touching surface 411 is exposed on a first side of the securing portion 31
- the second touching surface 413 is exposed on a second side of the securing portion 31 opposite to the first side.
- the latch ring 52 is deformed to enlarge the latch hole 51 to insert the body 41 into the latch hole 51 .
- the latch ring 52 returns to encircle the body 41 .
- the latch member 50 is moved to extend the four hooks 54 through gaps between the body 41 and the securing portion 31 to engage with the securing portion 31 , to secure the heat conducting member 40 and the latch member 50 to the bracket 30 .
- the heat dissipating module 20 is secured to supporting apparatus.
- the contacting portion 25 abuts the first touching surface 411 , and the second touching surface 413 abut a heat generating part (not shown). Heat generated by the heat generating part is transferred to the plurality of heat dissipating fins 21 by the heat conducting member 40 .
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to supporting apparatuses, and particularly to a supporting apparatus for a heat dissipating module.
- 2. Description of Related Art
- A heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated from electronic components in the electronic device. A bracket is provided to support the heat dissipating module. However, different electronic components may have different sizes, so different brackets need to be designed accordingly. Such additional design requirements of the brackets may increase manufacturing cost.
- Therefore, there is room for improvement within the art.
- Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an embodiment of a supporting apparatus and a heat dissipating module. -
FIG. 2 is a partially assembled view of a bracket, a heat conducting member, and a latch member ofFIG. 1 . -
FIG. 3 is an assembled view of the supporting apparatus ofFIG. 2 . -
FIG. 4 is an assembled view of the heat dissipating module and the supporting apparatus ofFIG. 1 . - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIG. 1 , a supporting apparatus of one embodiment is configured to support aheat dissipating module 20 and includes abracket 30, aheat conducting member 40, and alatch member 50. - The
heat dissipating module 20 includes a plurality of heat dissipating fins 21 and aheat pipe 23. In one embodiment, the plurality ofheat dissipating fins 21 are substantially parallel to each other. Theheat pipe 23 extends through the plurality of heat dissipating fins 21 to secure the plurality of heat dissipating fins 21 together. A contactingportion 25 is substantially perpendicularly extended from each of the plurality of heat dissipating fins 21. The contactingportion 25 is connected to adjacent one of the contactingportion 25. - The
bracket 30 includes asecuring portion 31 and foursecuring legs 35. The securingportion 31 defines aholding hole 32 for insertion of a fastener. In one embodiment, theholding hole 32 is substantially circular. A plurality of blockingtabs 34 located on inner surface of theholding hole 32. The foursecuring legs 35 extend from thesecuring portion 31. In one embodiment, the foursecuring legs 35 are arranged at four corners of a rectangular. Each of the foursecuring legs 35 defines asecuring hole 36. - The
heat conducting member 40 includes abody 41 and a plurality of stoppingportions 46 located on thebody 41. Thebody 41 includes a first touching surface 411 (shown inFIG. 3 ), a second touching surface 413 (shown inFIG. 2 ) and asidewall 415. In one embodiment, the firsttouching surface 411 is substantially parallel to the secondtouching surface 413. Thesidewall 415 is connected to the first touchingsurface 411 and the second touchingsurface 413. The plurality of stoppingportions 46 are located on thesidewall 415. In one embodiment, thebody 41 is substantially columnar, and a diameter of thebody 41 is smaller than that of theholding hole 32. - The
latch member 50 includes alatch ring 52 and fourhooks 54. Thelatch ring 52 has alatch hole 51. In one embodiment, thelatch ring 52 is substantially circular, and a diameter of thelatch hole 51 is smaller than that of thebody 41. The fourhooks 54 are located on thelatch ring 52. In one embodiment, the fourhooks 54 are arranged at four corners of a rectangular. - Referring to
FIGS. 2 and 3 , in assembly, theheat conducting member 40 is inserted into theholding hole 32, until the a plurality of stoppingportions 46 resist the plurality of blockingtabs 34. The firsttouching surface 411 is exposed on a first side of thesecuring portion 31, and the secondtouching surface 413 is exposed on a second side of the securingportion 31 opposite to the first side. - The
latch ring 52 is deformed to enlarge thelatch hole 51 to insert thebody 41 into thelatch hole 51. Thelatch ring 52 returns to encircle thebody 41. Thelatch member 50 is moved to extend the fourhooks 54 through gaps between thebody 41 and thesecuring portion 31 to engage with the securingportion 31, to secure theheat conducting member 40 and thelatch member 50 to thebracket 30. - Referring to
FIG. 4 , in use, theheat dissipating module 20 is secured to supporting apparatus. The contactingportion 25 abuts the first touchingsurface 411, and the second touchingsurface 413 abut a heat generating part (not shown). Heat generated by the heat generating part is transferred to the plurality of heat dissipating fins 21 by theheat conducting member 40. - It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110232276.9A CN102938996A (en) | 2011-08-15 | 2011-08-15 | Radiator assembly |
| CN201110232276.9 | 2011-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20130043002A1 true US20130043002A1 (en) | 2013-02-21 |
Family
ID=47697840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/483,228 Abandoned US20130043002A1 (en) | 2011-08-15 | 2012-05-30 | Heat dissipating module supporting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130043002A1 (en) |
| CN (1) | CN102938996A (en) |
| TW (1) | TW201308057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018183622A (en) * | 2018-07-10 | 2018-11-22 | マクセルホールディングス株式会社 | Beauty equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6640882B2 (en) * | 2001-07-31 | 2003-11-04 | Agilent Technologies, Inc. | Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled |
| US6646880B1 (en) * | 2002-07-10 | 2003-11-11 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip |
| US20050259405A1 (en) * | 2004-04-29 | 2005-11-24 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly |
| US20050265000A1 (en) * | 2004-05-26 | 2005-12-01 | Foxconn Technology Co., Ltd. | Heat sink assembly with fixing devices |
| US20100128431A1 (en) * | 2007-03-07 | 2010-05-27 | Andre Sloth Eriksen | Hybrid liquid-air cooled graphics display adapter |
| US7753106B2 (en) * | 2005-10-14 | 2010-07-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
| US7903412B2 (en) * | 2009-01-14 | 2011-03-08 | Cisco Technology, Inc. | Mounting socket that dissipates heat from a network device |
-
2011
- 2011-08-15 CN CN201110232276.9A patent/CN102938996A/en active Pending
- 2011-08-17 TW TW100129405A patent/TW201308057A/en unknown
-
2012
- 2012-05-30 US US13/483,228 patent/US20130043002A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6640882B2 (en) * | 2001-07-31 | 2003-11-04 | Agilent Technologies, Inc. | Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled |
| US6646880B1 (en) * | 2002-07-10 | 2003-11-11 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip |
| US20050259405A1 (en) * | 2004-04-29 | 2005-11-24 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly |
| US20050265000A1 (en) * | 2004-05-26 | 2005-12-01 | Foxconn Technology Co., Ltd. | Heat sink assembly with fixing devices |
| US7753106B2 (en) * | 2005-10-14 | 2010-07-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
| US20100128431A1 (en) * | 2007-03-07 | 2010-05-27 | Andre Sloth Eriksen | Hybrid liquid-air cooled graphics display adapter |
| US7903412B2 (en) * | 2009-01-14 | 2011-03-08 | Cisco Technology, Inc. | Mounting socket that dissipates heat from a network device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018183622A (en) * | 2018-07-10 | 2018-11-22 | マクセルホールディングス株式会社 | Beauty equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201308057A (en) | 2013-02-16 |
| CN102938996A (en) | 2013-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;JI, JIN-BIAO;YAO, ZHI-JIANG;REEL/FRAME:028285/0902 Effective date: 20120529 Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;JI, JIN-BIAO;YAO, ZHI-JIANG;REEL/FRAME:028285/0902 Effective date: 20120529 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |