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US20130043002A1 - Heat dissipating module supporting apparatus - Google Patents

Heat dissipating module supporting apparatus Download PDF

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Publication number
US20130043002A1
US20130043002A1 US13/483,228 US201213483228A US2013043002A1 US 20130043002 A1 US20130043002 A1 US 20130043002A1 US 201213483228 A US201213483228 A US 201213483228A US 2013043002 A1 US2013043002 A1 US 2013043002A1
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US
United States
Prior art keywords
supporting apparatus
latch
securing portion
securing
holding hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/483,228
Inventor
Chao-Jun Zhu
Jin-Biao Ji
Zhi-Jiang Yao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JI, Jin-biao, YAO, ZHI-JIANG, ZHU, Chao-jun
Publication of US20130043002A1 publication Critical patent/US20130043002A1/en
Abandoned legal-status Critical Current

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Classifications

    • H10W40/10
    • H10W40/73

Definitions

  • the present disclosure relates to supporting apparatuses, and particularly to a supporting apparatus for a heat dissipating module.
  • a heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated from electronic components in the electronic device.
  • a bracket is provided to support the heat dissipating module.
  • different electronic components may have different sizes, so different brackets need to be designed accordingly. Such additional design requirements of the brackets may increase manufacturing cost.
  • FIG. 1 is an exploded, isometric view of an embodiment of a supporting apparatus and a heat dissipating module.
  • FIG. 2 is a partially assembled view of a bracket, a heat conducting member, and a latch member of FIG. 1 .
  • FIG. 3 is an assembled view of the supporting apparatus of FIG. 2 .
  • a supporting apparatus of one embodiment is configured to support a heat dissipating module 20 and includes a bracket 30 , a heat conducting member 40 , and a latch member 50 .
  • the heat dissipating module 20 includes a plurality of heat dissipating fins 21 and a heat pipe 23 .
  • the plurality of heat dissipating fins 21 are substantially parallel to each other.
  • the heat pipe 23 extends through the plurality of heat dissipating fins 21 to secure the plurality of heat dissipating fins 21 together.
  • a contacting portion 25 is substantially perpendicularly extended from each of the plurality of heat dissipating fins 21 .
  • the contacting portion 25 is connected to adjacent one of the contacting portion 25 .
  • the bracket 30 includes a securing portion 31 and four securing legs 35 .
  • the securing portion 31 defines a holding hole 32 for insertion of a fastener.
  • the holding hole 32 is substantially circular.
  • a plurality of blocking tabs 34 located on inner surface of the holding hole 32 .
  • the four securing legs 35 extend from the securing portion 31 .
  • the four securing legs 35 are arranged at four corners of a rectangular. Each of the four securing legs 35 defines a securing hole 36 .
  • the heat conducting member 40 includes a body 41 and a plurality of stopping portions 46 located on the body 41 .
  • the body 41 includes a first touching surface 411 (shown in FIG. 3 ), a second touching surface 413 (shown in FIG. 2 ) and a sidewall 415 .
  • the first touching surface 411 is substantially parallel to the second touching surface 413 .
  • the sidewall 415 is connected to the first touching surface 411 and the second touching surface 413 .
  • the plurality of stopping portions 46 are located on the sidewall 415 .
  • the body 41 is substantially columnar, and a diameter of the body 41 is smaller than that of the holding hole 32 .
  • the latch member 50 includes a latch ring 52 and four hooks 54 .
  • the latch ring 52 has a latch hole 51 .
  • the latch ring 52 is substantially circular, and a diameter of the latch hole 51 is smaller than that of the body 41 .
  • the four hooks 54 are located on the latch ring 52 . In one embodiment, the four hooks 54 are arranged at four corners of a rectangular.
  • the heat conducting member 40 is inserted into the holding hole 32 , until the a plurality of stopping portions 46 resist the plurality of blocking tabs 34 .
  • the first touching surface 411 is exposed on a first side of the securing portion 31
  • the second touching surface 413 is exposed on a second side of the securing portion 31 opposite to the first side.
  • the latch ring 52 is deformed to enlarge the latch hole 51 to insert the body 41 into the latch hole 51 .
  • the latch ring 52 returns to encircle the body 41 .
  • the latch member 50 is moved to extend the four hooks 54 through gaps between the body 41 and the securing portion 31 to engage with the securing portion 31 , to secure the heat conducting member 40 and the latch member 50 to the bracket 30 .
  • the heat dissipating module 20 is secured to supporting apparatus.
  • the contacting portion 25 abuts the first touching surface 411 , and the second touching surface 413 abut a heat generating part (not shown). Heat generated by the heat generating part is transferred to the plurality of heat dissipating fins 21 by the heat conducting member 40 .

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating module supporting apparatus includes a bracket, a heat conducting member, and a latch member. The bracket includes a securing portion. The securing portion defines a holding hole. The heat conducting member is engaged in the holding hole and comprises a body. The body comprises a first touching surface and a second touching surface opposite to the first touching surface. The first touching surface is configured to abut a heat dissipating module, and the second touching surface is configured to abut a heat generating part. The latch member secures the body to the securing portion and is removable from the securing portion to disengage the body from securing portion.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to supporting apparatuses, and particularly to a supporting apparatus for a heat dissipating module.
  • 2. Description of Related Art
  • A heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated from electronic components in the electronic device. A bracket is provided to support the heat dissipating module. However, different electronic components may have different sizes, so different brackets need to be designed accordingly. Such additional design requirements of the brackets may increase manufacturing cost.
  • Therefore, there is room for improvement within the art.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an embodiment of a supporting apparatus and a heat dissipating module.
  • FIG. 2 is a partially assembled view of a bracket, a heat conducting member, and a latch member of FIG. 1.
  • FIG. 3 is an assembled view of the supporting apparatus of FIG. 2.
  • FIG. 4 is an assembled view of the heat dissipating module and the supporting apparatus of FIG. 1.
  • DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIG. 1, a supporting apparatus of one embodiment is configured to support a heat dissipating module 20 and includes a bracket 30, a heat conducting member 40, and a latch member 50.
  • The heat dissipating module 20 includes a plurality of heat dissipating fins 21 and a heat pipe 23. In one embodiment, the plurality of heat dissipating fins 21 are substantially parallel to each other. The heat pipe 23 extends through the plurality of heat dissipating fins 21 to secure the plurality of heat dissipating fins 21 together. A contacting portion 25 is substantially perpendicularly extended from each of the plurality of heat dissipating fins 21. The contacting portion 25 is connected to adjacent one of the contacting portion 25.
  • The bracket 30 includes a securing portion 31 and four securing legs 35. The securing portion 31 defines a holding hole 32 for insertion of a fastener. In one embodiment, the holding hole 32 is substantially circular. A plurality of blocking tabs 34 located on inner surface of the holding hole 32. The four securing legs 35 extend from the securing portion 31. In one embodiment, the four securing legs 35 are arranged at four corners of a rectangular. Each of the four securing legs 35 defines a securing hole 36.
  • The heat conducting member 40 includes a body 41 and a plurality of stopping portions 46 located on the body 41. The body 41 includes a first touching surface 411 (shown in FIG. 3), a second touching surface 413 (shown in FIG. 2) and a sidewall 415. In one embodiment, the first touching surface 411 is substantially parallel to the second touching surface 413. The sidewall 415 is connected to the first touching surface 411 and the second touching surface 413. The plurality of stopping portions 46 are located on the sidewall 415. In one embodiment, the body 41 is substantially columnar, and a diameter of the body 41 is smaller than that of the holding hole 32.
  • The latch member 50 includes a latch ring 52 and four hooks 54. The latch ring 52 has a latch hole 51. In one embodiment, the latch ring 52 is substantially circular, and a diameter of the latch hole 51 is smaller than that of the body 41. The four hooks 54 are located on the latch ring 52. In one embodiment, the four hooks 54 are arranged at four corners of a rectangular.
  • Referring to FIGS. 2 and 3, in assembly, the heat conducting member 40 is inserted into the holding hole 32, until the a plurality of stopping portions 46 resist the plurality of blocking tabs 34. The first touching surface 411 is exposed on a first side of the securing portion 31, and the second touching surface 413 is exposed on a second side of the securing portion 31 opposite to the first side.
  • The latch ring 52 is deformed to enlarge the latch hole 51 to insert the body 41 into the latch hole 51. The latch ring 52 returns to encircle the body 41. The latch member 50 is moved to extend the four hooks 54 through gaps between the body 41 and the securing portion 31 to engage with the securing portion 31, to secure the heat conducting member 40 and the latch member 50 to the bracket 30.
  • Referring to FIG. 4, in use, the heat dissipating module 20 is secured to supporting apparatus. The contacting portion 25 abuts the first touching surface 411, and the second touching surface 413 abut a heat generating part (not shown). Heat generated by the heat generating part is transferred to the plurality of heat dissipating fins 21 by the heat conducting member 40.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A supporting apparatus comprising:
a bracket, the bracket comprises a securing portion, the securing portion defining a holding hole;
a heat conducting member, the heat conducting member engaged in the holding hole and comprising a body, the body comprising a first touching surface and a second touching surface opposite to the first touching surface; the first touching surface being configured to abut a heat dissipating module, the second touching surface being adapted to abut a heat generating part; and
a latch member, the latch member secures the body to the securing portion and is removable from the securing portion to disengage the body from securing portion.
2. The supporting apparatus of claim 1, wherein a plurality of blocking tabs are located on an inner surface of the holding hole, the body further comprises a sidewall, the heat conducting member further comprises a plurality of stopping portions on the sidewall, and the plurality of stopping portions extend through the holding hole to resist the plurality of blocking tabs.
3. The supporting apparatus of claim 1, wherein the body is substantially columnar.
4. The supporting apparatus of claim 3, wherein the latch member comprises a latch ring, the latch ring defining a latch hole, and the latch ring being elastically deformable to engage the heat conducting member in the latch hole.
5. The supporting apparatus of claim 4, wherein a diameter of the latch hole is smaller than a diameter of the body.
6. The supporting apparatus of claim 5, wherein the diameter of the body is smaller than a diameter of the holding hole.
7. The supporting apparatus of claim 4, wherein the latch member further comprises four hooks on the latch ring, and the four hooks extend through the holding hole to engage with the securing portion.
8. The supporting apparatus of claim 7, wherein the four hooks are arranged at four corners of a rectangular.
9. The supporting apparatus of claim 1, wherein the bracket further comprises four securing legs extending from the securing portion, and each of the four securing legs defines a securing hole for inserting a fastener.
10. The supporting apparatus of claim 9, wherein the four securing legs are arranged at four corners of a rectangular.
11. A supporting apparatus comprising:
a bracket, the bracket comprising securing portion, the securing portion defining a holding hole;
a heat conducting member, the heat conducting member engaged in the holding hole and comprising a body, the body comprising a first touching surface and a second touching surface opposite the first touching surface; the first touching surface being configured to abut a heat dissipating module, the second touching surface being configured to abut a heat generating part; and
a latch member, the latch member comprising a latch ring and at least one hook located on the latch ring;
wherein the latch ring is elastically deformable to encircle the body, and the at least one hook extends through the holding hole to engage with the securing portion to secure the body to the securing portion.
12. The supporting apparatus of claim 11, wherein a plurality of blocking tabs are located on an inner surface of the holding hole, the body further comprises a sidewall, the heat conducting member further comprises a plurality of stopping portions on the sidewall, and the plurality of stopping portions extend through the holding hole to resist the plurality of blocking tabs.
13. The supporting apparatus of claim 11, wherein the body is substantially columnar.
14. The supporting apparatus of claim 13, wherein the latch ring defining a latch hole, and the latch ring is elastically deformable to engage the conducting member in the latch hole.
15. The supporting apparatus of claim 14, wherein a diameter of the latch hole is smaller than a diameter of the body.
16. The supporting apparatus of claim 15, wherein the diameter of the body is smaller than a diameter of the holding hole.
17. The supporting apparatus of claim 14, wherein the at least one hook comprises four hooks on the latch ring, and the four hooks extend through the holding hole to engage with the securing portion.
18. The supporting apparatus of claim 17, wherein the four hooks are arranged at four corners of a rectangular.
19. The supporting apparatus of claim 11, wherein the bracket further comprises four securing legs extending from the securing portion, and each of the four securing legs defines a securing hole for inserting a fastener.
20. The supporting apparatus of claim 19, wherein the four securing legs are arranged at four corners of a rectangular.
US13/483,228 2011-08-15 2012-05-30 Heat dissipating module supporting apparatus Abandoned US20130043002A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110232276.9A CN102938996A (en) 2011-08-15 2011-08-15 Radiator assembly
CN201110232276.9 2011-08-15

Publications (1)

Publication Number Publication Date
US20130043002A1 true US20130043002A1 (en) 2013-02-21

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US (1) US20130043002A1 (en)
CN (1) CN102938996A (en)
TW (1) TW201308057A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018183622A (en) * 2018-07-10 2018-11-22 マクセルホールディングス株式会社 Beauty equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640882B2 (en) * 2001-07-31 2003-11-04 Agilent Technologies, Inc. Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US20050259405A1 (en) * 2004-04-29 2005-11-24 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly
US20050265000A1 (en) * 2004-05-26 2005-12-01 Foxconn Technology Co., Ltd. Heat sink assembly with fixing devices
US20100128431A1 (en) * 2007-03-07 2010-05-27 Andre Sloth Eriksen Hybrid liquid-air cooled graphics display adapter
US7753106B2 (en) * 2005-10-14 2010-07-13 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US7903412B2 (en) * 2009-01-14 2011-03-08 Cisco Technology, Inc. Mounting socket that dissipates heat from a network device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640882B2 (en) * 2001-07-31 2003-11-04 Agilent Technologies, Inc. Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US20050259405A1 (en) * 2004-04-29 2005-11-24 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly
US20050265000A1 (en) * 2004-05-26 2005-12-01 Foxconn Technology Co., Ltd. Heat sink assembly with fixing devices
US7753106B2 (en) * 2005-10-14 2010-07-13 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20100128431A1 (en) * 2007-03-07 2010-05-27 Andre Sloth Eriksen Hybrid liquid-air cooled graphics display adapter
US7903412B2 (en) * 2009-01-14 2011-03-08 Cisco Technology, Inc. Mounting socket that dissipates heat from a network device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018183622A (en) * 2018-07-10 2018-11-22 マクセルホールディングス株式会社 Beauty equipment

Also Published As

Publication number Publication date
TW201308057A (en) 2013-02-16
CN102938996A (en) 2013-02-20

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;JI, JIN-BIAO;YAO, ZHI-JIANG;REEL/FRAME:028285/0902

Effective date: 20120529

Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHU, CHAO-JUN;JI, JIN-BIAO;YAO, ZHI-JIANG;REEL/FRAME:028285/0902

Effective date: 20120529

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION