US20120325437A1 - Flat heat pipe with capilllary structure - Google Patents
Flat heat pipe with capilllary structure Download PDFInfo
- Publication number
- US20120325437A1 US20120325437A1 US13/169,149 US201113169149A US2012325437A1 US 20120325437 A1 US20120325437 A1 US 20120325437A1 US 201113169149 A US201113169149 A US 201113169149A US 2012325437 A1 US2012325437 A1 US 2012325437A1
- Authority
- US
- United States
- Prior art keywords
- pipe body
- capillary
- heat pipe
- flat heat
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
Definitions
- the present invention relates to a heat pipe, in particular to an improved heat pipe with a capillary structure.
- CPUs central processing units
- heat generated by the CPU becomes increasingly higher
- conventional heat dissipating devices comprised of an extruded aluminum heat sink and a fan can no longer meet the heat dissipating requirement of present CPUs, and thus related manufacturers continue developing heat pipes or vapor chambers with a higher thermal conductivity and combine the heat pipe or vapor chamber with the heat sink to overcome the heat dissipating problem.
- the conventional heat pipe usually uses a tubular object as a pipe body of the heat pipe and goes through a pressing process to manufacture a heat pipe with a flat pipe body.
- a heat pipe with a pipe body having a thickness less than 2 mm is called a super thin heat pipe
- a heat pipe with a pipe body having a thickness greater than 2 mm is called a thin heat pipe.
- the interior of the heat pipe should reserve sufficient space for conducting a vapor-liquid phase change.
- a capillary tissue is also one of the major factors affecting the space inside the pipe body, particularly for the thin and super thin heat pipes having a very limited interior space. Therefore, how to utilize the limited internal space of the thin heat pipe effectively is one of the technical issues at present.
- the present invention provides an improved flat heat pipe with a capillary structure, comprising a pipe body and a capillary tissue.
- the pipe body is hollow and flat and includes a bottom wall and a top wall disposed opposite to the top wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body.
- the capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue has a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. With the protrusions formed on the capillary tissue, sufficient capillary forces are provided, while a gap is formed to serve as the air passage to achieve the foregoing objective.
- FIG. 1 is a perspective view of the first preferred embodiment of the present invention
- FIG. 2 is a cross-sectional view of the first preferred embodiment of the present invention.
- FIG. 3 is a cross-sectional view of the second preferred embodiment of the present invention.
- FIG. 4 is a cross-sectional view of the third preferred embodiment of the present invention.
- the improved flat heat pipe comprises a pipe body 1 and a capillary tissue 2 .
- the pipe body 1 is made of a good conductive material such as copper or aluminum, and the pipe body 1 is hollow and flat and includes a bottom wall 10 formed on a pipe wall of the pipe body 1 and a top wall 11 disposed opposite to the bottom wall 10 , and an appropriate quantity of working fluid (not shown in the figure) is sealed inside the pipe body 1 .
- the capillary tissue 2 is covered onto the internal side of the bottom wall 10 of the pipe body 1 , and the capillary tissue 2 can be a metal net or a sintered powder provided for sucking the working fluid sealed inside the pipe body 1 at room temperature.
- the present invention is characterized in that the capillary tissue 2 includes at least two protrusions 20 formed inside the pipe body 1 and extended in the lengthwise direction of the pipe body 1 , and a gap is reserved between the two protrusions 20 and the internal side of the top wall 11 of the pipe body 1 to form an air passage 12 . Therefore, if a heat source (not shown in the figure) is in contact with the bottom wall 10 of the pipe body 1 , the working fluid contained in the capillary tissue 2 at this portion absorbs the heat generated by the heat source to change its state from liquid to vapor, and the vapor working fluid can be transmitted to a far end of the heat pipe through the air passage 12 between the pipe body 1 and the capillary tissue 2 for cooling.
- a heat source not shown in the figure
- the vapor working fluid Since the vapor working fluid is far away from the heat source and cooled, the vapor working fluid will be converted into its liquid state again and the liquid working fluid will be absorbed by the capillary tissue 2 , and the protrusions 20 formed by the capillary tissue 2 can provide sufficient capillary forces (in other words, the capillary tissue 2 still has sufficient thickness for the required capillary action) to flow the liquid working fluid back to its original position in contact with the heat source quickly, so as to achieve good thermal conduction and backflow effects as well as a circular vapor-liquid phase change effect of the heat pipe.
- the capillary tissue 2 may have a smaller space depending on the height (or thickness) of the pipe body 1 , or the protrusions 20 of the capillary tissue 2 are attached onto the internal side of the top wall 11 of the pipe body 1 if a thicker capillary tissue 2 is required. Since the protrusions 20 of the capillary tissue 2 are not attached completely with the internal side of the top wall 11 , therefore gaps are formed between them to form the air passage 12 for conducting the heat of the vapor working fluid.
- a support structure 3 is installed between the protrusion 20 of the capillary tissue 2 and the internal side of the top wall 11 of the pipe body 1 , and the support structure 3 is in a staggered wavy form for providing an internal support between the bottom wall 10 and the top wall 11 of the pipe body 1 .
- the improved flat heat pipe with a capillary structure of the present invention can be made.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A flat heat pipe with a capillary structure includes a pipe body and a capillary tissue. The pipe body is substantially hollow and flat and includes a bottom wall and a top wall opposite to the bottom wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body. The capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue includes a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. The protrusions formed by the capillary tissue can provide sufficient capillary forces and also produce the gap to form the air passage.
Description
- The present invention relates to a heat pipe, in particular to an improved heat pipe with a capillary structure.
- As the computing speed of central processing units (CPUs) for computers becomes increasingly faster, the heat generated by the CPU becomes increasingly higher, and conventional heat dissipating devices comprised of an extruded aluminum heat sink and a fan can no longer meet the heat dissipating requirement of present CPUs, and thus related manufacturers continue developing heat pipes or vapor chambers with a higher thermal conductivity and combine the heat pipe or vapor chamber with the heat sink to overcome the heat dissipating problem.
- However, the conventional heat pipe usually uses a tubular object as a pipe body of the heat pipe and goes through a pressing process to manufacture a heat pipe with a flat pipe body. In general, a heat pipe with a pipe body having a thickness less than 2 mm is called a super thin heat pipe, and a heat pipe with a pipe body having a thickness greater than 2 mm is called a thin heat pipe. Regardless of the requirements of a thin heat pipe, the interior of the heat pipe should reserve sufficient space for conducting a vapor-liquid phase change. In addition to working fluid sealed in the heat pipe, a capillary tissue is also one of the major factors affecting the space inside the pipe body, particularly for the thin and super thin heat pipes having a very limited interior space. Therefore, how to utilize the limited internal space of the thin heat pipe effectively is one of the technical issues at present.
- In view of the aforementioned shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally provides a feasible solution to overcome the shortcomings of the prior art.
- Therefore, it is a primary objective of the present invention to provide an improved flat heat pipe with a capillary structure. With the installation of a capillary tissue and a pipe body, a smooth flow path is provided for a vapor or liquid working fluid to achieve good thermal conduction and backflow effects, when a vapor-liquid phase change of the working fluid takes place inside the heat pipe.
- To achieve the foregoing objective, the present invention provides an improved flat heat pipe with a capillary structure, comprising a pipe body and a capillary tissue. The pipe body is hollow and flat and includes a bottom wall and a top wall disposed opposite to the top wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body. The capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue has a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. With the protrusions formed on the capillary tissue, sufficient capillary forces are provided, while a gap is formed to serve as the air passage to achieve the foregoing objective.
-
FIG. 1 is a perspective view of the first preferred embodiment of the present invention; -
FIG. 2 is a cross-sectional view of the first preferred embodiment of the present invention; -
FIG. 3 is a cross-sectional view of the second preferred embodiment of the present invention; and -
FIG. 4 is a cross-sectional view of the third preferred embodiment of the present invention. - The technical characteristics and contents of the present invention will become apparent with the following detailed description and related drawings. The drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.
- With reference to
FIGS. 1 and 2 for a perspective view and a cross-sectional view of an improved flat heat pipe with a capillary structure in accordance with a first preferred embodiment of the present invention respectively, the improved flat heat pipe comprises apipe body 1 and acapillary tissue 2. - The
pipe body 1 is made of a good conductive material such as copper or aluminum, and thepipe body 1 is hollow and flat and includes abottom wall 10 formed on a pipe wall of thepipe body 1 and atop wall 11 disposed opposite to thebottom wall 10, and an appropriate quantity of working fluid (not shown in the figure) is sealed inside thepipe body 1. - The
capillary tissue 2 is covered onto the internal side of thebottom wall 10 of thepipe body 1, and thecapillary tissue 2 can be a metal net or a sintered powder provided for sucking the working fluid sealed inside thepipe body 1 at room temperature. - The present invention is characterized in that the
capillary tissue 2 includes at least twoprotrusions 20 formed inside thepipe body 1 and extended in the lengthwise direction of thepipe body 1, and a gap is reserved between the twoprotrusions 20 and the internal side of thetop wall 11 of thepipe body 1 to form anair passage 12. Therefore, if a heat source (not shown in the figure) is in contact with thebottom wall 10 of thepipe body 1, the working fluid contained in thecapillary tissue 2 at this portion absorbs the heat generated by the heat source to change its state from liquid to vapor, and the vapor working fluid can be transmitted to a far end of the heat pipe through theair passage 12 between thepipe body 1 and thecapillary tissue 2 for cooling. Since the vapor working fluid is far away from the heat source and cooled, the vapor working fluid will be converted into its liquid state again and the liquid working fluid will be absorbed by thecapillary tissue 2, and theprotrusions 20 formed by thecapillary tissue 2 can provide sufficient capillary forces (in other words, thecapillary tissue 2 still has sufficient thickness for the required capillary action) to flow the liquid working fluid back to its original position in contact with the heat source quickly, so as to achieve good thermal conduction and backflow effects as well as a circular vapor-liquid phase change effect of the heat pipe. - With reference to
FIG. 3 for a cross-sectional view of a second preferred embodiment of the present invention, thecapillary tissue 2 may have a smaller space depending on the height (or thickness) of thepipe body 1, or theprotrusions 20 of thecapillary tissue 2 are attached onto the internal side of thetop wall 11 of thepipe body 1 if a thickercapillary tissue 2 is required. Since theprotrusions 20 of thecapillary tissue 2 are not attached completely with the internal side of thetop wall 11, therefore gaps are formed between them to form theair passage 12 for conducting the heat of the vapor working fluid. - With reference to
FIG. 4 for a cross-sectional view of a third preferred embodiment of the present invention, asupport structure 3 is installed between theprotrusion 20 of thecapillary tissue 2 and the internal side of thetop wall 11 of thepipe body 1, and thesupport structure 3 is in a staggered wavy form for providing an internal support between thebottom wall 10 and thetop wall 11 of thepipe body 1. - With the aforementioned components and structure, the improved flat heat pipe with a capillary structure of the present invention can be made.
- In summation of the description above, the present invention improves over the prior art and complies with the patent application requirements, and thus is duly filed for patent application.
- While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (7)
1. A flat heat pipe with a capillary structure, comprising:
a pipe body, being substantially hollow and flat, and having a bottom wall and a top wall disposed opposite to the bottom wall, both walls being formed on the pipe body, and an appropriate quantity of working fluid being sealed inside the pipe body; and
a capillary tissue, covered onto an internal side of the bottom wall;
wherein the capillary tissue includes a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage.
2. The flat heat pipe with a capillary structure as recited in claim 1 , wherein the pipe body is made of copper or aluminum.
3. The flat heat pipe with a capillary structure as recited in claim 1 , wherein the capillary tissue is a metal net or a sintered powder.
4. The flat heat pipe with a capillary structure as recited in claim 1 , wherein the capillary tissue has two protrusions.
5. The flat heat pipe with a capillary structure as recited in claim 1 , wherein the protrusion of the capillary tissue is attached onto the internal side of the top wall.
6. The flat heat pipe with a capillary structure as recited in claim 1 , further comprising a support structure disposed between the protrusion of the capillary tissue and the internal wall of the top wall.
7. The flat heat pipe with a capillary structure as recited in claim 6 , wherein the support structure is substantially in a staggered wavy form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/169,149 US20120325437A1 (en) | 2011-06-27 | 2011-06-27 | Flat heat pipe with capilllary structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/169,149 US20120325437A1 (en) | 2011-06-27 | 2011-06-27 | Flat heat pipe with capilllary structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20120325437A1 true US20120325437A1 (en) | 2012-12-27 |
Family
ID=47360719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/169,149 Abandoned US20120325437A1 (en) | 2011-06-27 | 2011-06-27 | Flat heat pipe with capilllary structure |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20120325437A1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150101192A1 (en) * | 2013-10-15 | 2015-04-16 | Hao Pai | Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction |
| US20160037684A1 (en) * | 2014-08-01 | 2016-02-04 | Samsung Electronics Co., Ltd. | Set-top box |
| US9646935B1 (en) * | 2015-10-16 | 2017-05-09 | Celsia Technologies Taiwan, Inc. | Heat sink of a metallic shielding structure |
| US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
| US10146275B2 (en) | 2016-02-17 | 2018-12-04 | Microsoft Technology Licensing, Llc | 3D printed thermal management system |
| US11306980B2 (en) * | 2020-09-08 | 2022-04-19 | Inventec (Pudong) Technology Corporation | Heat sink and thermal dissipation system |
| CN114577046A (en) * | 2017-05-08 | 2022-06-03 | 开文热工科技公司 | Thermal management plane |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US12464679B2 (en) | 2020-06-19 | 2025-11-04 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| US12498181B2 (en) | 2018-12-11 | 2025-12-16 | Kelvin Thermal Technologies, Inc. | Vapor chamber |
| US12523431B2 (en) | 2014-09-15 | 2026-01-13 | Kelvin Thermal Technologies, Inc. | Polymer-based microfabricated thermal ground plane |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100212870A1 (en) * | 2009-02-26 | 2010-08-26 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe |
| US20100319882A1 (en) * | 2009-06-17 | 2010-12-23 | Yeh-Chiang Technology Corp. | Ultra-thin heat pipe and manufacturing method thereof |
| US20110005725A1 (en) * | 2009-07-13 | 2011-01-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Plate type heat pipe and heat sink using the same |
| US20110067844A1 (en) * | 2009-09-24 | 2011-03-24 | Celsia Technologies Taiwan, Inc. | Planar heat pipe |
| US20120111540A1 (en) * | 2010-11-08 | 2012-05-10 | Foxconn Technology Co., Ltd. | Flat type heat pipe and method for manufacturing the same |
| US20120325438A1 (en) * | 2011-06-27 | 2012-12-27 | Celsia Technologies Taiwan | Heat pipe with flexible support structure |
| US20130037242A1 (en) * | 2011-08-09 | 2013-02-14 | Cooler Master Co., Ltd. | Thin-type heat pipe structure |
| US20130213612A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
-
2011
- 2011-06-27 US US13/169,149 patent/US20120325437A1/en not_active Abandoned
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100212870A1 (en) * | 2009-02-26 | 2010-08-26 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe |
| US20130037244A1 (en) * | 2009-02-26 | 2013-02-14 | Sheng-Lin Wu | Flat heat pipe |
| US20100319882A1 (en) * | 2009-06-17 | 2010-12-23 | Yeh-Chiang Technology Corp. | Ultra-thin heat pipe and manufacturing method thereof |
| US20110005725A1 (en) * | 2009-07-13 | 2011-01-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Plate type heat pipe and heat sink using the same |
| US20110067844A1 (en) * | 2009-09-24 | 2011-03-24 | Celsia Technologies Taiwan, Inc. | Planar heat pipe |
| US20120111540A1 (en) * | 2010-11-08 | 2012-05-10 | Foxconn Technology Co., Ltd. | Flat type heat pipe and method for manufacturing the same |
| US20120325438A1 (en) * | 2011-06-27 | 2012-12-27 | Celsia Technologies Taiwan | Heat pipe with flexible support structure |
| US20130037242A1 (en) * | 2011-08-09 | 2013-02-14 | Cooler Master Co., Ltd. | Thin-type heat pipe structure |
| US20130213612A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
| US20150101192A1 (en) * | 2013-10-15 | 2015-04-16 | Hao Pai | Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction |
| US20160037684A1 (en) * | 2014-08-01 | 2016-02-04 | Samsung Electronics Co., Ltd. | Set-top box |
| US12523431B2 (en) | 2014-09-15 | 2026-01-13 | Kelvin Thermal Technologies, Inc. | Polymer-based microfabricated thermal ground plane |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US9646935B1 (en) * | 2015-10-16 | 2017-05-09 | Celsia Technologies Taiwan, Inc. | Heat sink of a metallic shielding structure |
| US10146275B2 (en) | 2016-02-17 | 2018-12-04 | Microsoft Technology Licensing, Llc | 3D printed thermal management system |
| CN114577046A (en) * | 2017-05-08 | 2022-06-03 | 开文热工科技公司 | Thermal management plane |
| US12498181B2 (en) | 2018-12-11 | 2025-12-16 | Kelvin Thermal Technologies, Inc. | Vapor chamber |
| US12464679B2 (en) | 2020-06-19 | 2025-11-04 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| US11306980B2 (en) * | 2020-09-08 | 2022-04-19 | Inventec (Pudong) Technology Corporation | Heat sink and thermal dissipation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;AND OTHERS;REEL/FRAME:026502/0071 Effective date: 20110525 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |