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US20120292007A1 - Heat disspation device and control method - Google Patents

Heat disspation device and control method Download PDF

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Publication number
US20120292007A1
US20120292007A1 US13/220,641 US201113220641A US2012292007A1 US 20120292007 A1 US20120292007 A1 US 20120292007A1 US 201113220641 A US201113220641 A US 201113220641A US 2012292007 A1 US2012292007 A1 US 2012292007A1
Authority
US
United States
Prior art keywords
heat
fan
sensed temperatures
generating component
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/220,641
Other languages
English (en)
Inventor
Hung-Nien Chiu
Ching-Bai Hwang
Nien-Tien Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, NIEN-TIEN, CHIU, HUNG-NIEN, HWANG, CHING-BAI
Publication of US20120292007A1 publication Critical patent/US20120292007A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices

Definitions

  • the present disclosure generally relates to heat dissipation devices, and control method for the heat dissipation devices.
  • a heat dissipation device generally comprises a base attached to the electric device, a plurality of fins thermally connected to the base by heat pipes, and a fan for driving airflow towards the fins.
  • the base is intimately attached to the CPU for absorbing the heat generated by the CPU. Most of the heat accumulated on the base is transferred to the fins by the heat pipes and then the fins are cooled by airflow driven by the fan.
  • a fan speed of the heat dissipation device is high, which is not energy saving.
  • FIG. 1 is a schematic view of a heat dissipation device in accordance with an embodiment of the present disclosure.
  • FIG. 2 is similar to FIG. 1 , but showing another aspect of the heat dissipation device.
  • FIG. 3 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 4 is a function block diagram of the circuit of the mobile phone of FIG. 1 .
  • FIG. 5 is a plot of the thermal resistance versus the fan speed of the heat dissipation device.
  • FIG. 6 is a flowchart illustrating a principle of fan speed and processor power adjustment of the heat dissipation device.
  • a heat dissipation device 10 includes a fan 11 , a fins module 12 , a heat pipe 13 , a base 14 , two fixing plates 15 , and a control system 16 .
  • the fan 11 is for driving airflow towards the fins module 12 .
  • the fan 11 includes a housing 111 , a hub 112 and a plurality of blades 113 radially and extending outward from the hub 112 .
  • the housing 111 defines an air outlet 1111 at a lateral side.
  • the hub 112 and the plurality of blades 113 are received in the housing 111 .
  • the fins module 12 is arranged adjacent to the air outlet 1111 .
  • the fins module 12 includes a plurality of fins 121 arranged in parallel to each other. Air channels 122 are formed between each two neighboring fins 121 .
  • the fins 121 each define a rectangular through hole 123 with a size matching the heat pipe 13 .
  • the through holes 123 of the plurality of fins 121 are arranged in alignment, thereby the heat pipe 13 can penetrate through the plurality of fins 121 via the through holes 123 .
  • the heat pipe 13 has a curved shape with a flat profile.
  • the heat pipe 13 is made of metal pipe with excellent heat conductivity and phase-change media sealed in the metal pipe.
  • the heat pipe 13 includes an evaporation section 131 and a condensation section 132 .
  • the evaporation section 131 of the heat pipe 13 is thermally attached to a central portion of the base 14 and fixed to the base 14 by the fixing plate 15 .
  • At least two temperature sensors 133 are arranged at different positions of the evaporation section 131 . At the position where each temperature sensor 133 sits, a temperature is sensed, and a sensed result is sent to the control system 16 , by the temperature sensor 133 .
  • the number of temperature sensors 133 can be two, three, four, or more. In this embodiment, there are three temperature sensors 133 arranged on the evaporation section 131 .
  • the condensation section 132 of the heat pipe 13 is perpendicular to the evaporation section 131 and thermally connected to the fins module 12 .
  • the condensation section 132 penetrates through the plurality of fins 121 via the through holes 123 .
  • the base 14 is a flat heat conductive plate with the four corners cut off.
  • the base 14 has its bottom intimately attached to a processor 17 in use.
  • the base 14 has its top attached to the evaporation section 131 of the heat pipe 13 .
  • the fixing plates 15 each include a central portion 151 , a first side portion 152 and a second side portion 153 .
  • the central portion 151 is a strip-like portion fixed with the base 14 .
  • the first and second side portions 152 , 153 respectively extend from an end of the central portion 151 along a direction inclined to the central portion 151 .
  • the first and second side portions 152 , 153 each include a distal end, in which a through hole 154 is defined. Accordingly, the base 14 can be fixed to a circuit board (not illustrated) by bolts 155 penetrating through the through holes 154 .
  • a plurality of gaskets 156 engage with corresponding bolts 155 under the fixing plates 15 .
  • control system 16 communicates with the processor 17 and the fan 11 , thereby adjusting a heat dissipating efficiency of the heat dissipation device 10 .
  • FIG. 5 a plot of the thermal resistance versus the fan speed of the heat dissipation device 10 is illustrated.
  • the thermal resistance of the heat dissipation device 10 decreases as the fan speed increases.
  • the thermal resistance of the heat dissipation device 10 first decreases and then increases, as the fan speed increases.
  • the processor 17 has an operation power greater than 40 watts.
  • control system 16 is capable of adjusting the speed of the fan 11 and the operation power of the processor 17 , according to temperatures respectively sensed by the three temperature sensors 133 .
  • the principle of fan speed and processor power adjustment of the heat dissipation device 10 is described in detail as follows.
  • the three temperature sensors 133 continuously sense temperatures S 1 , S 2 and S 3 of the respective positions where they sit.
  • the control system 16 respectively compares the temperatures S 1 , S 2 and S 3 with a first critical temperature T 1 which stands for a normal operating temperature of the processor 17 .
  • the control system 16 keeps the operation power of the processor 17 unchanged. If the temperatures S 1 , S 2 and S 3 are all lower than or equal to the first critical temperature T 1 , it shows that heat dissipating efficiency of the heat dissipation device 10 satisfactorily meets the cooling needs of the processor 17 . Accordingly, there is no need to adjust the operation power of the processor 17 .
  • the control system 16 In condition, that anyone of the temperatures S 1 , S 2 , and S 3 is higher than the first critical temperature T 1 , the control system 16 increases the speed of the fan 11 . If anyone of the temperatures S 1 , S 2 , and S 3 is higher than the first critical temperature T 1 , it shows that heat dissipating efficiency of the heat dissipation device 10 fails to meet the cooling needs of the processor 17 . Accordingly, the speed of the fan 11 increases to improve the heat dissipating efficiency of the heat dissipation device 10 . Successively, the control system 16 compares a difference between S 1 and S 2 with a first critical temperature difference N 1 , to check out whether there is a nonuniform temperature distribution caused by drying-out of the heat pipe 13 .
  • the first critical temperature difference N 1 is defined with a value representing a threshold of normal temperature difference between two of the temperature sensors 133 on the heat pipe 13 .
  • the control system 16 keeps the operation power of the processor 17 unchanged.
  • the control system 16 decreases the speed of the fan 11 and then compares the difference between S 2 and S 3 with a second critical temperature difference N 2 .
  • the condition S 1 ⁇ S 2 >N 1 shows that there is a nonuniform temperature distribution on the heat pipe 13 , and the heat dissipating efficiency cannot be finely improved by increasing the speed of the fan 11 . That is because the increased speed of the fan 11 leads to higher thermal resistance of the heat dissipation device 10 . As such, the speed of the fan 11 is decreased to reduce the thermal resistance of the heat dissipation device 10 , according to what is illustrated in FIG. 5 .
  • the second critical temperature difference N 2 is defined with a value representing another threshold of normal temperature difference between another two of the temperature sensors 133 on the heat pipe 13 .
  • the control system 16 keeps the operation power of the processor 17 unchanged.
  • the control system 16 decreases the speed of the fan 11 and respectively compares the temperatures S 1 , S 2 and S 3 with a second critical temperature T 2 .
  • the condition S 2 ⁇ S 3 >N 2 shows that the thermal resistance of the heat dissipation device 10 has not been reduced to a minimum value by decreasing the speed of the fan 11 , according to FIG. 5 .
  • the speed of the fan 11 further decreases to achieve a lower thermal resistance of the heat dissipation device 10 , and the temperatures S 1 , S 2 and S 3 with a second critical temperature T 2 to check out whether the processor 17 has been cooled to a satisfied temperature lower than or equal to the second critical temperature T 2 .
  • the control system 16 keeps the operation power of the processor 17 unchanged.
  • the condition that the temperatures S 1 , S 2 , and S 3 are all lower than or equal to the second critical temperature T 2 shows that, the processor 17 has been cooled to a satisfied temperature by further decreasing the speed of the fan 11 . As such, there is no need to lower the operation power of the processor 17 .
  • the control system 16 decreases the operation power of the processor 17 .
  • the condition that the anyone of the temperatures S 1 , S 2 , and S 3 is higher than T 2 shows that, it is impossible to cool the processor 17 to the satisfied temperature range only by achieving lowest thermal resistance of the heat dissipation device 10 . As such, the processor 17 can only be cooled by reducing the operation power thereof.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/220,641 2011-05-20 2011-08-29 Heat disspation device and control method Abandoned US20120292007A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100117701A TWI590745B (zh) 2011-05-20 2011-05-20 散熱模組及控制該散熱模組的方法
TW100117701 2011-05-20

Publications (1)

Publication Number Publication Date
US20120292007A1 true US20120292007A1 (en) 2012-11-22

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Country Status (2)

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US (1) US20120292007A1 (zh)
TW (1) TWI590745B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130070418A1 (en) * 2011-09-21 2013-03-21 Foxconn Technology Co., Ltd. Heat dissipation module
USD718061S1 (en) * 2014-02-12 2014-11-25 Asia Vital Components Co., Ltd. Heat pipe
US10353357B2 (en) * 2015-06-23 2019-07-16 Dell Products L.P. Systems and methods for combined active and passive cooling of an information handling resource
US11259438B2 (en) * 2016-09-30 2022-02-22 Ma Lighting Technology Gmbh Lighting control console having a cooling device
US11500436B2 (en) * 2020-11-12 2022-11-15 Dell Products L.P. System and method for predictive fan speed control and management

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533564A (zh) 2014-02-27 2015-09-01 萬國商業機器公司 電腦系統中基於功率比値的風扇控制系統與方法
TWI686691B (zh) * 2018-08-16 2020-03-01 緯穎科技服務股份有限公司 電子裝置及被動元件
JP7537445B2 (ja) * 2022-01-25 2024-08-21 カシオ計算機株式会社 冷却装置、光源装置、及び投影装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004240B1 (en) * 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
US7277282B2 (en) * 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
US7346468B2 (en) * 2006-08-08 2008-03-18 International Business Machines Corporation Method and apparatus for detecting heat sink faults
US7451332B2 (en) * 2003-08-15 2008-11-11 Apple Inc. Methods and apparatuses for controlling the temperature of a data processing system
US20090210190A1 (en) * 2008-02-19 2009-08-20 International Business Machine Corporation Heat sink method, system, and program product
US8423200B2 (en) * 2010-08-06 2013-04-16 Hon Hai Precision Industry Co., Ltd. System and method for cooling an electronic device with multiple fans

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004240B1 (en) * 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
US7451332B2 (en) * 2003-08-15 2008-11-11 Apple Inc. Methods and apparatuses for controlling the temperature of a data processing system
US7277282B2 (en) * 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
US7346468B2 (en) * 2006-08-08 2008-03-18 International Business Machines Corporation Method and apparatus for detecting heat sink faults
US20090210190A1 (en) * 2008-02-19 2009-08-20 International Business Machine Corporation Heat sink method, system, and program product
US8423200B2 (en) * 2010-08-06 2013-04-16 Hon Hai Precision Industry Co., Ltd. System and method for cooling an electronic device with multiple fans

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130070418A1 (en) * 2011-09-21 2013-03-21 Foxconn Technology Co., Ltd. Heat dissipation module
USD718061S1 (en) * 2014-02-12 2014-11-25 Asia Vital Components Co., Ltd. Heat pipe
US10353357B2 (en) * 2015-06-23 2019-07-16 Dell Products L.P. Systems and methods for combined active and passive cooling of an information handling resource
US11259438B2 (en) * 2016-09-30 2022-02-22 Ma Lighting Technology Gmbh Lighting control console having a cooling device
US11500436B2 (en) * 2020-11-12 2022-11-15 Dell Products L.P. System and method for predictive fan speed control and management

Also Published As

Publication number Publication date
TWI590745B (zh) 2017-07-01
TW201249316A (en) 2012-12-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHIU, HUNG-NIEN;HWANG, CHING-BAI;CHENG, NIEN-TIEN;REEL/FRAME:026824/0635

Effective date: 20110825

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION