[go: up one dir, main page]

US20120097366A1 - Heating exchange chamber for liquid state cooling fluid - Google Patents

Heating exchange chamber for liquid state cooling fluid Download PDF

Info

Publication number
US20120097366A1
US20120097366A1 US12/981,173 US98117310A US2012097366A1 US 20120097366 A1 US20120097366 A1 US 20120097366A1 US 98117310 A US98117310 A US 98117310A US 2012097366 A1 US2012097366 A1 US 2012097366A1
Authority
US
United States
Prior art keywords
cooling fluid
cavity
exchange chamber
flow
heat exchange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/981,173
Other languages
English (en)
Inventor
Chien-An Chen
Yi-Ling Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Assigned to INVENTEC CORPORATION reassignment INVENTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIEN-AN, CHEN, YI-LING
Publication of US20120097366A1 publication Critical patent/US20120097366A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/028—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
    • H10W40/47—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices

Definitions

  • the present invention relates to a heat dissipation module using cooling fluid, and more particularly, to a heat exchange chamber having a flow resistance disposed at a position proximate to the inlet of its cavity for narrowing down a flow channel from the inlet to the cavity so as to raise the resistance to the flow of the cooling fluid before the cooling fluid flows through a thermal dissipation device, and thus enable the cooling fluid to be distributed uniformly through the thermal dissipation device.
  • the heat exchange chamber for liquid state cooling fluid is the one that is commonly seen and used for allowing a cooling fluid to flow therein while enabling a heat exchanging process to be performed between the cooling fluid and a heat source, and thus reducing the temperature of the heat source.
  • the cooling fluid is flowing at a specific speed while being fed into the heat exchange chamber, instead of being distributed uniformly through the whole heat exchange chamber, most of such cooling fluid flow will flow concentrating to the center of the flow channels formed inside the heat exchange chamber. Thereby, the heat dissipating efficiency can be severely affected since there must be a portion of the thermal dissipation device inside the heat exchange chamber that is sit idle as it is not in any thermal contact with the cooling fluid.
  • the primary object of the present invention is to provide a heat exchange chamber capable of utilizing a flow resistance to raise resistance to the flowing of a cooling fluid and thus enabling the cooling fluid to be distributed uniformly inside a cavity formed inside a cavity of the heat exchange chamber.
  • the present invention provides a heat exchange chamber, comprising: a casing, configured with a cavity, an inlet and an outlet in a manner that the inlet is provided for allowing a cooling fluid to flow into the cavity and the outlet is provided for allowing the cooling fluid to flow out of the cavity as the cooling fluid is enabled to flow in a flowing direction through of the cavity; a thermal dissipation device, disposed inside the cavity; and a flow resistance, disposed inside the cavity at a position proximate to the inlet to be used for narrowing down a flow channel from the inlet to the cavity and thus raising the resistance to the flow of the cooling fluid before the cooling fluid flows through the thermal dissipation device, so as to enable the cooling fluid to be distributed uniformly through the thermal dissipation device.
  • FIG. 1 is a side view of a heat exchange chamber according to the present invention.
  • FIG. 2A is a schematic diagram showing a flow resistance according to a first embodiment of the invention.
  • FIG. 2B is a schematic diagram showing a flow resistance according to a second embodiment of the invention.
  • FIG. 2C is a partial top view of FIG. 2B .
  • FIG. 1 and FIG. 2A is a schematic diagram showing a heat exchange chamber for liquid state cooling fluid according to the present invention, and a schematic diagram showing a flow resistance according to a first embodiment of the invention.
  • the heat exchange chamber comprises: a casing 1 , a thermal dissipation device 2 , and a flow resistance 3 .
  • the casing 1 is configured with a cavity 10 , an inlet 11 and an outlet 12 in a manner that the inlet 11 is provided for allowing a cooling fluid 0 to flow into the cavity 10 and the outlet 12 is provided for allowing the cooling fluid 0 to flow out of the cavity 10 as the cooling fluid is enabled to flow in a flowing direction through the cavity 10 , as the arrow 00 shown in FIG. 1 .
  • the diameter of the outlet 12 is larger than that of the inlet 11 , by that the cavity 10 can be prevented from having too much gas being accumulated therein, and thus the boiling point of the cooling fluid 0 can be prevented form increasing with the increasing of the pressure inside the cavity 10 caused by the gas accumulation, so that the heat dissipating efficacy of the cooling fluid is prevented from reducing.
  • the thermal dissipation device 2 is disposed inside the cavity 10 .
  • the flow resistance 3 is disposed inside the cavity 10 at a position proximate to the inlet 11 , i.e. it is disposed at a position between the thermal dissipation device 2 and the inlet 11 . As shown in FIG.
  • the flow resistance 3 is substantially a protrusion constructed for narrowing down a flow channel from the inlet 11 to the cavity 10 so as to raise the resistance to the flow of the cooling fluid 0 before the cooling fluid flows through a thermal dissipation device 2 , and thus enable the cooling fluid 0 to be distributed uniformly through the thermal dissipation device 2 .
  • FIG. 2B and FIG. 2C is a schematic diagram showing a flow resistance according to a second embodiment of the invention, and a partial top view of FIG. 2B .
  • the flow resistance 3 that is composed of a plurality of protrusions 30 , is designed for narrowing down a flow channel from the inlet 11 to the cavity 10 so as to raise the resistance to the flow of the cooling fluid 0 before the cooling fluid flows through a thermal dissipation device 2 , and thus enable the cooling fluid 0 to be distributed uniformly through the thermal dissipation device 2 .
  • FIG. 2B the flow resistance 3 , that is composed of a plurality of protrusions 30 , is designed for narrowing down a flow channel from the inlet 11 to the cavity 10 so as to raise the resistance to the flow of the cooling fluid 0 before the cooling fluid flows through a thermal dissipation device 2 , and thus enable the cooling fluid 0 to be distributed uniformly through the thermal dissipation device 2 .
  • each protrusion is formed with a first ramp 300 and a second ramp 301 , and consequently, by the defining of two corresponding first ramps 300 on any two neighboring protrusions 30 , a converging channel 302 is formed, and the same time, by the defining of two corresponding second ramps 301 on any two neighboring protrusions 30 , a diverging channel 303 is formed.
  • the difference between the first embodiment and the second embodiment of the invention is that: in the first embodiment, the raising of the resistance to the flow of the cooling fluid 0 is achieved by the use of the protrusions of the flow resistance 3 for narrowing down the flow channel; but in the second embodiment, after achieving the raising of the resistance by the use of the converging channels 302 , the providing of the diverging channels 303 will speed up the flowing of the cooling fluid 0 after being evenly distributed by the damping of the converging channels 302 .
  • the casing 1 further comprises: a base 13 , being provided for engaging with a heat source 4 , by that the heat emitted from the heat source 4 can be transmitted to the heat exchange chamber through the base 13 .
  • the heat source 3 can be a center processing unit or a chip module, but is not limited thereby.
  • the base 13 is also being arranged in thermal contact with the thermal dissipation device 2 so as to transmit heat thereto.
  • the flow resistance 3 of the present invention can be mounted on the base 13 while being disposed inside the cavity 10 , or can be mounted on a top panel of the casing that is hanging downward while being disposed inside the cavity 10 . Nevertheless, the shape, the orientation and the position of the flow resistance 3 are not limited thereby.
  • the cross-section area of the flow channel is smaller than that of the inlet 11 , by that the flow of the cooling fluid 0 is slowing down before reaching the thermal dissipation device 2 while enabling the same to be uniformly distributed through the thermal dissipation device 2 .
  • the flow resisting effect of the flow resistance 3 can further be enhanced by a better design relating to its structure and shape as well.
  • the cooling fluid could be distributed uniformly through the dissipating heat device with satisfactory heat dissipating efficacy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/981,173 2010-10-26 2010-12-29 Heating exchange chamber for liquid state cooling fluid Abandoned US20120097366A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099136467 2010-10-26
TW099136467A TWI413751B (zh) 2010-10-26 2010-10-26 一種液態冷卻流體熱交換室

Publications (1)

Publication Number Publication Date
US20120097366A1 true US20120097366A1 (en) 2012-04-26

Family

ID=45971972

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/981,173 Abandoned US20120097366A1 (en) 2010-10-26 2010-12-29 Heating exchange chamber for liquid state cooling fluid

Country Status (2)

Country Link
US (1) US20120097366A1 (zh)
TW (1) TWI413751B (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015110865A1 (en) * 2014-01-22 2015-07-30 Provides Metalmeccanica S.R.L. Heat exchanger
US20160327351A1 (en) * 2012-11-19 2016-11-10 Acer Incorporated Fluid heat exchange apparatus
US9673130B2 (en) * 2014-08-06 2017-06-06 Fuji Electric Co., Ltd. Semiconductor device having a cooler
US20170231115A1 (en) * 2016-02-10 2017-08-10 Omron Automotive Electronics Co., Ltd. Cooler and flow path unit
CN109737772A (zh) * 2018-12-29 2019-05-10 潍柴动力股份有限公司 热交换器总成
WO2025202241A1 (fr) * 2024-03-26 2025-10-02 Valeo Systemes Thermiques Echangeur de chaleur comportant une pluralité de plaques empilées

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110645815A (zh) * 2019-09-29 2020-01-03 联想(北京)有限公司 一种均热板及其制备方法
CN114667035B (zh) * 2022-03-02 2023-05-26 中国电子科技集团公司第二十九研究所 一种流阻可调的模拟通流体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2957679A (en) * 1955-06-02 1960-10-25 Olin Mathieson Heat exchanger
US4235287A (en) * 1975-05-02 1980-11-25 Olin Corporation Heat exchange panel
US4597029A (en) * 1984-03-19 1986-06-24 Trilogy Computer Development Partners, Ltd. Signal connection system for semiconductor chip
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US20030205054A1 (en) * 2000-12-04 2003-11-06 Fujitsu Limited High efficiency cooling system and heat absorbing unit
US20070089859A1 (en) * 2005-10-24 2007-04-26 Fujitsu Limited Electronic apparatus and cooling module
US7719839B2 (en) * 2007-02-19 2010-05-18 Dell Products L.P. Heat conduction apparatus providing for selective configuration for heat conduction

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM314369U (en) * 2006-12-28 2007-06-21 Cooler Master Co Ltd Improved structure for water-cooling head of water-cooling heat dissipation system
TW200911101A (en) * 2007-08-31 2009-03-01 Yen Sun Technology Corp Water-cooled tap structure of a water-cooled heat dissipation system
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2957679A (en) * 1955-06-02 1960-10-25 Olin Mathieson Heat exchanger
US4235287A (en) * 1975-05-02 1980-11-25 Olin Corporation Heat exchange panel
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4597029A (en) * 1984-03-19 1986-06-24 Trilogy Computer Development Partners, Ltd. Signal connection system for semiconductor chip
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US20030205054A1 (en) * 2000-12-04 2003-11-06 Fujitsu Limited High efficiency cooling system and heat absorbing unit
US20070089859A1 (en) * 2005-10-24 2007-04-26 Fujitsu Limited Electronic apparatus and cooling module
US7719839B2 (en) * 2007-02-19 2010-05-18 Dell Products L.P. Heat conduction apparatus providing for selective configuration for heat conduction

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160327351A1 (en) * 2012-11-19 2016-11-10 Acer Incorporated Fluid heat exchange apparatus
US10247495B2 (en) * 2012-11-19 2019-04-02 Acer Incorporated Fluid heat exchange apparatus with recirculating structure
WO2015110865A1 (en) * 2014-01-22 2015-07-30 Provides Metalmeccanica S.R.L. Heat exchanger
CN105934644A (zh) * 2014-01-22 2016-09-07 波威特斯金属加工有限责任公司 热交换器
US10224263B2 (en) 2014-01-22 2019-03-05 Provides Metalmeccanica S.R.L. Heat exchanger
US9673130B2 (en) * 2014-08-06 2017-06-06 Fuji Electric Co., Ltd. Semiconductor device having a cooler
US20170231115A1 (en) * 2016-02-10 2017-08-10 Omron Automotive Electronics Co., Ltd. Cooler and flow path unit
US10433457B2 (en) * 2016-02-10 2019-10-01 Omron Corporation Cooler and flow path unit
CN109737772A (zh) * 2018-12-29 2019-05-10 潍柴动力股份有限公司 热交换器总成
WO2025202241A1 (fr) * 2024-03-26 2025-10-02 Valeo Systemes Thermiques Echangeur de chaleur comportant une pluralité de plaques empilées
FR3160764A1 (fr) * 2024-03-26 2025-10-03 Valeo Systemes Thermiques Echangeur de chaleur comportant une pluralité de plaques empilées

Also Published As

Publication number Publication date
TWI413751B (zh) 2013-11-01
TW201217736A (en) 2012-05-01

Similar Documents

Publication Publication Date Title
US20120097368A1 (en) Heating exchange chamber for liquid state cooling fluid
US20120097366A1 (en) Heating exchange chamber for liquid state cooling fluid
US8437129B2 (en) Server cabinet
US10537042B2 (en) Electronic device with heat-dissipating function and liquid-cooling radiator module thereof
US20120097382A1 (en) Heating exchange chamber for liquid state cooling fluid
US8897012B2 (en) Electronic device and heat dissipation module thereof
US7848103B2 (en) Computer enclosure
EP3193365B1 (en) Heat dissipation system
US8120917B2 (en) Heat dissipation device
US8341967B2 (en) Heat-dissipating device for supplying cold airflow
US9258929B2 (en) Server and heat dissipating assembly thereof
US9317078B2 (en) Storage device backplane with penetrating convection and computer framework
US20070175610A1 (en) Heat dissipating device
TWI694325B (zh) 水冷頭
CN108133722A (zh) 固态硬盘装置
US20150062817A1 (en) Server
US8356656B2 (en) Heat dissipation device and method
CN201115228Y (zh) 一体成型的散热壳体结构
US6968890B1 (en) Heat sink
US20140218864A1 (en) Electronic device with cooling assembly
US20100264790A1 (en) Computer enclosure
US20140174699A1 (en) Heat dissipation assembly
TWI414225B (zh) 電子裝置
TWI658776B (zh) 電子裝置的散熱系統
TWI761541B (zh) 電子設備的主機板散熱系統

Legal Events

Date Code Title Description
AS Assignment

Owner name: INVENTEC CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHIEN-AN;CHEN, YI-LING;SIGNING DATES FROM 20101217 TO 20101220;REEL/FRAME:025555/0927

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION