[go: up one dir, main page]

US20120037351A1 - Method for manufacturing heat sink having heat-dissipating fins and structure of the same - Google Patents

Method for manufacturing heat sink having heat-dissipating fins and structure of the same Download PDF

Info

Publication number
US20120037351A1
US20120037351A1 US13/281,850 US201113281850A US2012037351A1 US 20120037351 A1 US20120037351 A1 US 20120037351A1 US 201113281850 A US201113281850 A US 201113281850A US 2012037351 A1 US2012037351 A1 US 2012037351A1
Authority
US
United States
Prior art keywords
heat
dissipating
substrate
extending arms
extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/281,850
Inventor
Wen-Chen Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neng Tyi Precision Ind Co Ltd
Original Assignee
Neng Tyi Precision Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neng Tyi Precision Ind Co Ltd filed Critical Neng Tyi Precision Ind Co Ltd
Priority to US13/281,850 priority Critical patent/US20120037351A1/en
Publication of US20120037351A1 publication Critical patent/US20120037351A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H10W40/226—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention is related to a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same, and in particular to a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same whereby solder for welding the heat-dissipating fins can be avoided.
  • Heat sinks are widely used with heat-generating electronic elements such as CPUs or lamps (e.g. halogen lamp, LED lamp etc.), thereby facilitating heat dissipation.
  • the heat sink having heat-dissipating fins is the most popular heat sink.
  • FIG. 1 shows a conventional heat sink, in which a plurality of heat-dissipating fins 13 is arranged equidistantly on the top surface 111 of a base 11 by means of soldering.
  • the heat-dissipating fins 13 are used to increase the heat-dissipating area. With the bottom surface 112 of the base 11 contacting a heat source, the base 11 absorbs the heat and transmits the heat rapidly to surfaces 131 of each heat-dissipating fin 13 , thereby facilitating the heat dissipation.
  • the solder 12 may cause some heat transfer loss when the heat is transmitted to the heat-dissipating fins 13 , which affects the heat-dissipating effect of the heat-dissipating fins 13 . Therefore, it is an important issue to develop a heat sink that is capable of dissipating the heat efficiently.
  • the object of the present invention is to provide a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same, whereby the solder can be avoided to reduce the heat transfer loss and the heat dissipation of electronic elements can be achieved.
  • the present invention provides a method for manufacturing a heat sink having heat-dissipating fins, which includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, the center portion having a top surface, a bottom surface and side walls, the extending arms extending from the side walls of the center portion with a gap provided between each extending arm and two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the corresponding extending arms of the substrate, each heat-dissipating fin comprising a base piece and heat-dissipating plates connected on both sides of the base piece, the two heat-dissipating plates of each heat-dissipating fin being inserted into the gaps between the corresponding extending arm and two adjacent extending arms, each heat-dissipating plate having a top end and a bottom end; and bending and
  • each extending arm of one of the substrates corresponds to each gap of the other substrate.
  • Each heat-dissipating fin is inserted into the gap between the two corresponding extending arms of the two substrates.
  • the present invention further provides a structure of a heat sink having heat-dissipating fins, which includes: a substrate comprising a center portion and a plurality of extending arms, the center portion having a top surface, a bottom surface and two side walls, the extending arms extending from the side walls of the center portion with a gap provided between each extending arm and two adjacent extending arms; and a plurality of heat-dissipating fins each comprising a base piece and heat-dissipating plates connected on both sides of the base piece, each heat-dissipating plate having a top end and a bottom end, both heat-dissipating plates of each heat-dissipating fin being inserted into the gap between the corresponding extending arm and two adjacent extending arms, one of the two opposite side walls of each extending arm abutting against one of the two opposite surfaces of each heat-dissipating plate, the top and bottom ends of the two heat-d
  • two substrates can be provided and they are overlapped with each other.
  • Each extending arm of one substrate corresponds to each gap of the other substrate.
  • the two heat-dissipating plates of each heat-dissipating fin are inserted into the gaps between the corresponding extending arm and two adjacent extending arms of the two substrates.
  • the present invention has advantageous effects as follows. Since the heat-dissipating fins are inserted into the gaps respectively between each extending arm of the substrate, and the two side walls of each extending arm abut against and thus fix the heat-dissipating plate and the heat-dissipating fin, in comparison with the prior art of welding the heat-dissipating fins by solder, the present invention avoids the heat transfer loss caused by solder. Further, the overall manufacturing steps of the present invention are simple without increasing the difficulty in assembling and manufacturing processes.
  • the top surface or bottom surface of the substrate, or one top surface or bottom surface of the two substrates can be adhered to contact heat-generating electronic elements.
  • the top and bottom ends of each heat-dissipating plate protrude from the top and bottom surfaces of the substrate.
  • the cooling airflow or the airflow of a heat source can be flowed into/out of the top and bottom surfaces of the substrate in two ways. In this way, the heat dissipation of the electronic elements can be achieved more easily.
  • FIG. 1 is a perspective view showing a conventional heat sink
  • FIG. 2 is a flow chart of the method of the present invention
  • FIG. 3 is a perspective view showing the substrate of the present invention.
  • FIG. 4 is a partially exploded perspective and assembled view showing the substrate and the heat-dissipating fins of the present invention
  • FIG. 5 is an assembled perspective view showing the substrate and the heat-dissipating fins of the present invention.
  • FIG. 6 is a front view showing the portion A of FIG. 5 ;
  • FIG. 7 is an exploded perspective view showing the substrate of another embodiment of the present invention.
  • FIG. 8 is an exploded perspective view (I) showing the heat-dissipating fins and the substrate of another embodiment of the present invention.
  • FIG. 9 is an exploded perspective view (II) showing the heat-dissipating fins and the substrate of another embodiment of the present invention.
  • the present invention provides a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same.
  • the method includes the steps as follows.
  • a substrate 2 is provided.
  • the substrate 2 comprises a center portion 21 and a plurality of extending arms 22 .
  • the center portion 21 has a top surface 211 , a bottom surface 212 and side walls 213 .
  • the extending arms 22 extend from the side walls 213 of the center portion 21 .
  • a gap 23 is provided between each extending arm 22 and two adjacent extending arms 22 respectively.
  • a plurality of heat-dissipating fins 3 is provided.
  • the heat-dissipating fins 3 are inserted into the gaps 23 between the corresponding extending arms 22 of the substrate 2 respectively.
  • Each heat-dissipating fin 3 comprises a base piece 31 and two heat-dissipating plates 32 connected on both sides of the base piece 31 .
  • each heat-dissipating fin 3 The two heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23 between the corresponding extending arm 22 and the two adjacent extending arms 22 respectively.
  • Each heat-dissipating plate 32 has a top end 321 and a bottom end 322 .
  • Each extending arm 22 of the substrate 2 is bent and pressed, so that one of the two opposite side walls 223 of each extending arm 22 abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32 , as shown in FIG. 6 .
  • the top and bottom ends 321 , 322 of the two heat-dissipating plates 32 of each heat-dissipating fin 3 protrude from the top and bottom surfaces 211 , 212 of the center portion 21 of the substrate 2 . In this way, a heat sink product can be obtained.
  • each extending arm 22 is bent (upwardly or downwardly, and an upward bending is shown in the present invention) toward the center portion 21 , so that each extending arm 22 is bent to point upwards or downwards from the side walls 213 of the center portion 21 . Further, each extending arm 22 is pressed in such a manner that both side wall surfaces 221 abut against the heat-dissipating plates 32 of the corresponding heat-dissipating fin 3 . In this way, each heat-dissipating fin 3 can be fixed to the side edge of the center portion 21 firmly.
  • the structure of the heat sink of the present invention includes the above substrate 2 and a plurality of heat-dissipating fins 3 .
  • Each extending arm 22 of the substrate 2 is bent to extend from the side walls 213 of the center portion 21 .
  • a gap 23 is formed between each extending arm 22 and two adjacent extending arms 22 respectively.
  • Each heat-dissipating fin 3 is provided in the gap 23 between the corresponding extending arms 22 of the substrate 2 .
  • One of the two side wall surfaces 221 of each extending arm 22 abuts against one of the two surfaces 323 of each heat-dissipating plate 32 .
  • the top end 321 and the bottom end 322 of the two heat-dissipating plates 32 of each heat-dissipating fin 3 protrude from the top surface 211 and the bottom surface 212 of the substrate 2 .
  • the center portion 21 of the above substrate 2 can be a circular plate.
  • each extending arm 22 is radially provided on the side walls 213 of the circular plate-like center portion 21 .
  • the above center portion 21 can be a polygonal plate (such as quadrangle).
  • the extending arms 22 are formed to extend from each side wall 213 of the center portion 21 respectively.
  • the center portion 21 is a circular plate. Therefore, the above step (2) of inserting the heat-dissipating fins 3 can be performed automatically, thereby achieving mass production. More specifically, each heat-dissipating fin 3 can be inserted on the substrate 2 manually in sequence. Of course, the insertion can be performed automatically, thereby achieving mass production.
  • the substrate 2 and the heat-dissipating fins 3 can be made of the same metallic material having a heat-dissipating effect, such as copper and aluminum.
  • FIGS. 7 and 9 show another embodiment.
  • the difference between the present embodiment and the previous embodiment lies in that:
  • Two substrates 2 , 2 ′ are provided.
  • the two substrates 2 , 2 ′ are overlapped with each other.
  • Each extending arm 22 ′ of one substrate 2 ′ corresponds to each gap 23 of the other substrate 2 , so that the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ are arranged alternatively in the vertical direction.
  • Each heat-dissipating fin 3 is inserted in the gaps 23 , 23 ′ of the corresponding extending arms 22 , 22 ′ of the two substrates 2 , 2 ′. Both heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23 , 23 ′ between the extending arms 22 , 22 ′ and two adjacent extending alms 22 , 22 ′.
  • Each of the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ is bent and pressed, so that one of the two opposite side wall surfaces 221 , 221 ′abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32 .
  • the free ends of the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ are bent (upwardly or downwardly) toward the two center portions 21 , 21 ′ in the same direction.
  • the free ends of the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ are bent toward the two center portions 21 , 21 ′ in opposite directions. That is to say, the free end of each extending arm 22 of one substrate 2 is opposite to the free end of each extending arm 22 ′ of the other substrate 2 ′.
  • the structure of the heat sink of the present embodiment includes two substrates 2 , 2 ′ that are overlapped with other and a plurality of heat-dissipating fins 3 .
  • the extending arms 22 , 22 ′ of each substrate 2 , 2 ′ are bent to extend from the side walls 213 , 213 ′ of the center portions 21 , 21 ′.
  • Each extending arm 22 ′ of one substrate 2 ′ corresponds to each gap 23 of the other substrate 2 .
  • Each heat-dissipating fin 3 is provided in the gaps 23 , 23 ′ between the corresponding extending arms 22 , 22 ′ of the two substrates 2 , 2 ′.
  • Two heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23 , 23 ′ between the corresponding extending arms 22 , 22 ′ and two adjacent extending arms 22 , 22 ′.
  • One of the two side wall surfaces 221 , 221 ′ of each extending arm 22 , 22 ′ abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32 .
  • the free ends of the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ extend in the same direction.
  • the free ends of the extending arms 22 , 22 ′ of the two substrates 2 , 2 ′ extend in opposite directions.
  • the heat-dissipating fin 3 is inserted into the gaps 23 , 23 ′ respectively between each extending arm 22 , 22 ′of the substrate 2 , 2 ′, and the two side walls 221 , 221 ′ of each extending arm 22 , 22 ′ abut against and thus fix the heat-dissipating plates 32 and the heat-dissipating fins 3 .
  • the present invention avoids the heat transfer loss caused by solder.
  • the overall manufacturing steps of the present invention are simple without increasing the difficulty in assembling and manufacturing processes. Further, avoiding the solder conforms to the concept of environmental protection (because the solder usually contains lead, while the lead-free solder has increased cost.)
  • the top surface 211 or bottom surface 212 of the substrate 2 or one top surface 211 ′ or bottom surface 212 of the two substrates 2 , 2 ′ can be adhered to contact heat-generating electronic elements (such as LED lamp).
  • the top and bottom ends 321 , 322 of each heat-dissipating plate 32 protrude from the top surfaces 211 , 211 ′ and the bottom surfaces 212 , 212 ′ of the substrates 2 , 2 ′.
  • the cooling airflow or the airflow of a heat source can be flowed into /out of the top surface 211 , 211 ′ and the bottom surface 212 , 212 ′ of the substrate 2 , 2 ′ in two ways. In this way, the heat dissipation of the electronic elements can be achieved more easily.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.

Description

    RELATED APPLICATIONS
  • This application is a Divisional patent application of co-pending application Ser. No. 12/073,720, filed on 10 Mar. 2008, now pending. The entire disclosure of the prior application, Ser. No. 12/073,720, from which an oath or declaration is supplied, is considered a part of the disclosure of the accompanying Divisional application and is hereby incorporated by reference.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention is related to a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same, and in particular to a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same whereby solder for welding the heat-dissipating fins can be avoided.
  • 2. Description of Related Art
  • Heat sinks are widely used with heat-generating electronic elements such as CPUs or lamps (e.g. halogen lamp, LED lamp etc.), thereby facilitating heat dissipation. The heat sink having heat-dissipating fins is the most popular heat sink. FIG. 1 shows a conventional heat sink, in which a plurality of heat-dissipating fins 13 is arranged equidistantly on the top surface 111 of a base 11 by means of soldering.
  • The heat-dissipating fins 13 are used to increase the heat-dissipating area. With the bottom surface 112 of the base 11 contacting a heat source, the base 11 absorbs the heat and transmits the heat rapidly to surfaces 131 of each heat-dissipating fin 13, thereby facilitating the heat dissipation.
  • Since the heat-dissipating fins 13 are welded on the top surface 111 of the base 11, and the heat transfer coefficient of the solder 12 is different from that of the base 11 or the heat-dissipating fins 13, the solder 12 may cause some heat transfer loss when the heat is transmitted to the heat-dissipating fins 13, which affects the heat-dissipating effect of the heat-dissipating fins 13. Therefore, it is an important issue to develop a heat sink that is capable of dissipating the heat efficiently.
  • Consequently, because of the above technical defects, the inventor keeps on carving unflaggingly through wholehearted experience and research to develop the present invention, which can effectively improve the defects described above.
    • SUMMARY OF THE INVENTION
  • In view of the above problems, the object of the present invention is to provide a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same, whereby the solder can be avoided to reduce the heat transfer loss and the heat dissipation of electronic elements can be achieved.
  • According to one aspect of the present invention, the present invention provides a method for manufacturing a heat sink having heat-dissipating fins, which includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, the center portion having a top surface, a bottom surface and side walls, the extending arms extending from the side walls of the center portion with a gap provided between each extending arm and two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the corresponding extending arms of the substrate, each heat-dissipating fin comprising a base piece and heat-dissipating plates connected on both sides of the base piece, the two heat-dissipating plates of each heat-dissipating fin being inserted into the gaps between the corresponding extending arm and two adjacent extending arms, each heat-dissipating plate having a top end and a bottom end; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surfaces of each heat-dissipating plate, the top and bottom ends of the two heat-dissipating plates of each heat-dissipating fin protruding from the top and bottom surfaces of the substrate.
  • Alternatively, in the above-mentioned steps, two substrates that are overlapped with each other can be provided. Each extending arm of one of the substrates corresponds to each gap of the other substrate. Each heat-dissipating fin is inserted into the gap between the two corresponding extending arms of the two substrates.
  • According to another aspect of the present invention, the present invention further provides a structure of a heat sink having heat-dissipating fins, which includes: a substrate comprising a center portion and a plurality of extending arms, the center portion having a top surface, a bottom surface and two side walls, the extending arms extending from the side walls of the center portion with a gap provided between each extending arm and two adjacent extending arms; and a plurality of heat-dissipating fins each comprising a base piece and heat-dissipating plates connected on both sides of the base piece, each heat-dissipating plate having a top end and a bottom end, both heat-dissipating plates of each heat-dissipating fin being inserted into the gap between the corresponding extending arm and two adjacent extending arms, one of the two opposite side walls of each extending arm abutting against one of the two opposite surfaces of each heat-dissipating plate, the top and bottom ends of the two heat-dissipating plates of each heat-dissipating fin protruding from the top and bottom surfaces of the substrate.
  • Alternatively, two substrates can be provided and they are overlapped with each other. Each extending arm of one substrate corresponds to each gap of the other substrate. The two heat-dissipating plates of each heat-dissipating fin are inserted into the gaps between the corresponding extending arm and two adjacent extending arms of the two substrates.
  • The present invention has advantageous effects as follows. Since the heat-dissipating fins are inserted into the gaps respectively between each extending arm of the substrate, and the two side walls of each extending arm abut against and thus fix the heat-dissipating plate and the heat-dissipating fin, in comparison with the prior art of welding the heat-dissipating fins by solder, the present invention avoids the heat transfer loss caused by solder. Further, the overall manufacturing steps of the present invention are simple without increasing the difficulty in assembling and manufacturing processes.
  • Next, the top surface or bottom surface of the substrate, or one top surface or bottom surface of the two substrates can be adhered to contact heat-generating electronic elements. The top and bottom ends of each heat-dissipating plate protrude from the top and bottom surfaces of the substrate. Via this arrangement, the cooling airflow or the airflow of a heat source can be flowed into/out of the top and bottom surfaces of the substrate in two ways. In this way, the heat dissipation of the electronic elements can be achieved more easily.
  • In order to further understand the techniques, methods and effects employed by the present invention to achieve the desired objects, a detailed description relating thereto will be made with reference to the accompanying drawings. In this way, the objects, characteristics and features of the present invention can be appreciated more thoroughly. However, the drawings are illustrative only, but not used to limit the scope of the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing a conventional heat sink;
  • FIG. 2 is a flow chart of the method of the present invention;
  • FIG. 3 is a perspective view showing the substrate of the present invention;
  • FIG. 4 is a partially exploded perspective and assembled view showing the substrate and the heat-dissipating fins of the present invention;
  • FIG. 5 is an assembled perspective view showing the substrate and the heat-dissipating fins of the present invention;
  • FIG. 6 is a front view showing the portion A of FIG. 5;
  • FIG. 7 is an exploded perspective view showing the substrate of another embodiment of the present invention;
  • FIG. 8 is an exploded perspective view (I) showing the heat-dissipating fins and the substrate of another embodiment of the present invention; and
  • FIG. 9 is an exploded perspective view (II) showing the heat-dissipating fins and the substrate of another embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 2 to 5. The present invention provides a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same. The method includes the steps as follows.
  • (1) A substrate 2 is provided. The substrate 2 comprises a center portion 21 and a plurality of extending arms 22. The center portion 21 has a top surface 211, a bottom surface 212 and side walls 213. The extending arms 22 extend from the side walls 213 of the center portion 21. A gap 23 is provided between each extending arm 22 and two adjacent extending arms 22 respectively.
  • (2) A plurality of heat-dissipating fins 3 is provided. The heat-dissipating fins 3 are inserted into the gaps 23 between the corresponding extending arms 22 of the substrate 2 respectively. Each heat-dissipating fin 3 comprises a base piece 31 and two heat-dissipating plates 32 connected on both sides of the base piece 31.
  • The two heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23 between the corresponding extending arm 22 and the two adjacent extending arms 22 respectively. Each heat-dissipating plate 32 has a top end 321 and a bottom end 322.
  • (3) Each extending arm 22 of the substrate 2 is bent and pressed, so that one of the two opposite side walls 223 of each extending arm 22 abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32, as shown in FIG. 6. At the same time, the top and bottom ends 321, 322 of the two heat-dissipating plates 32 of each heat-dissipating fin 3 protrude from the top and bottom surfaces 211, 212 of the center portion 21 of the substrate 2. In this way, a heat sink product can be obtained.
  • In the above step (3) of bending and pressing, the free end of each extending arm 22 is bent (upwardly or downwardly, and an upward bending is shown in the present invention) toward the center portion 21, so that each extending arm 22 is bent to point upwards or downwards from the side walls 213 of the center portion 21. Further, each extending arm 22 is pressed in such a manner that both side wall surfaces 221 abut against the heat-dissipating plates 32 of the corresponding heat-dissipating fin 3. In this way, each heat-dissipating fin 3 can be fixed to the side edge of the center portion 21 firmly.
  • According to the above description, the structure of the heat sink of the present invention includes the above substrate 2 and a plurality of heat-dissipating fins 3. Each extending arm 22 of the substrate 2 is bent to extend from the side walls 213 of the center portion 21. A gap 23 is formed between each extending arm 22 and two adjacent extending arms 22 respectively. Each heat-dissipating fin 3 is provided in the gap 23 between the corresponding extending arms 22 of the substrate 2. One of the two side wall surfaces 221 of each extending arm 22 abuts against one of the two surfaces 323 of each heat-dissipating plate 32. The top end 321 and the bottom end 322 of the two heat-dissipating plates 32 of each heat-dissipating fin 3 protrude from the top surface 211 and the bottom surface 212 of the substrate 2.
  • The center portion 21 of the above substrate 2 can be a circular plate. Thus, each extending arm 22 is radially provided on the side walls 213 of the circular plate-like center portion 21. Of course, the above center portion 21 can be a polygonal plate (such as quadrangle). The extending arms 22 are formed to extend from each side wall 213 of the center portion 21 respectively. Preferably, the center portion 21 is a circular plate. Therefore, the above step (2) of inserting the heat-dissipating fins 3 can be performed automatically, thereby achieving mass production. More specifically, each heat-dissipating fin 3 can be inserted on the substrate 2 manually in sequence. Of course, the insertion can be performed automatically, thereby achieving mass production. In addition, the substrate 2 and the heat-dissipating fins 3 can be made of the same metallic material having a heat-dissipating effect, such as copper and aluminum.
  • Please refer to FIGS. 7 and 9, which show another embodiment. The difference between the present embodiment and the previous embodiment lies in that:
  • (1) Two substrates 2, 2′ are provided. The two substrates 2, 2′ are overlapped with each other. Each extending arm 22′ of one substrate 2′ corresponds to each gap 23 of the other substrate 2, so that the extending arms 22, 22′ of the two substrates 2, 2′ are arranged alternatively in the vertical direction.
  • (2) Each heat-dissipating fin 3 is inserted in the gaps 23, 23′ of the corresponding extending arms 22, 22′ of the two substrates 2, 2′. Both heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23, 23′ between the extending arms 22, 22′ and two adjacent extending alms 22, 22′.
  • (3) Each of the extending arms 22, 22′ of the two substrates 2, 2′ is bent and pressed, so that one of the two opposite side wall surfaces 221, 221′abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32.
  • As shown in FIG. 8, in the step (3) of bending and pressing of the present embodiment, the free ends of the extending arms 22, 22′ of the two substrates 2, 2′ are bent (upwardly or downwardly) toward the two center portions 21, 21′ in the same direction. Alternatively, as shown in FIG. 9, the free ends of the extending arms 22, 22′ of the two substrates 2, 2′ are bent toward the two center portions 21, 21′ in opposite directions. That is to say, the free end of each extending arm 22 of one substrate 2 is opposite to the free end of each extending arm 22′ of the other substrate 2′.
  • According to the above, the structure of the heat sink of the present embodiment includes two substrates 2, 2′ that are overlapped with other and a plurality of heat-dissipating fins 3. The extending arms 22, 22′ of each substrate 2, 2′ are bent to extend from the side walls 213, 213′ of the center portions 21, 21′. Each extending arm 22′ of one substrate 2′ corresponds to each gap 23 of the other substrate 2.
  • Each heat-dissipating fin 3 is provided in the gaps 23, 23′ between the corresponding extending arms 22, 22′ of the two substrates 2, 2′. Two heat-dissipating plates 32 of each heat-dissipating fin 3 are inserted into the gaps 23, 23′ between the corresponding extending arms 22, 22′ and two adjacent extending arms 22, 22′. One of the two side wall surfaces 221, 221′ of each extending arm 22, 22′ abuts against one of the two opposite surfaces 323 of each heat-dissipating plate 32.
  • In addition, the free ends of the extending arms 22, 22′ of the two substrates 2, 2′ extend in the same direction. Alternatively, the free ends of the extending arms 22, 22′ of the two substrates 2, 2′ extend in opposite directions.
  • According to the above description, in the present invention, the heat-dissipating fin 3 is inserted into the gaps 23, 23′ respectively between each extending arm 22, 22′of the substrate 2, 2′, and the two side walls 221, 221′ of each extending arm 22, 22′ abut against and thus fix the heat-dissipating plates 32 and the heat-dissipating fins 3. In comparison with the prior art of welding the heat-dissipating fins by solder, the present invention avoids the heat transfer loss caused by solder. Further, the overall manufacturing steps of the present invention are simple without increasing the difficulty in assembling and manufacturing processes. Further, avoiding the solder conforms to the concept of environmental protection (because the solder usually contains lead, while the lead-free solder has increased cost.)
  • Next, the top surface 211 or bottom surface 212 of the substrate 2, or one top surface 211′ or bottom surface 212 of the two substrates 2, 2′ can be adhered to contact heat-generating electronic elements (such as LED lamp). The top and bottom ends 321, 322 of each heat-dissipating plate 32 protrude from the top surfaces 211, 211′ and the bottom surfaces 212, 212′ of the substrates 2, 2′. Via this arrangement, the cooling airflow or the airflow of a heat source can be flowed into /out of the top surface 211, 211′ and the bottom surface 212, 212′ of the substrate 2, 2′ in two ways. In this way, the heat dissipation of the electronic elements can be achieved more easily.
  • While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (2)

What is claimed is:
1. A structure of a heat sink having heat-dissipating fins, comprising:
a substrate comprising a center portion and a plurality of extending arms, the center portion having a top surface, a bottom surface and two side walls, the extending arms extending from the side walls of the center portion with two gaps respectively provided between each extending arm and two adjacent extending arms; and
a plurality of heat-dissipating fins each comprising a base piece and heat-dissipating plates connected on both sides of the base piece, each heat-dissipating plate having a top end and a bottom end, both heat-dissipating plates of each heat-dissipating fin being inserted into the gaps between the corresponding extending arm and two adjacent extending arms, one of the two opposite side walls of each extending arm abutting against one of the two opposite surfaces of each heat-dissipating plate, the top and bottom ends of the two heat-dissipating plates of each heat-dissipating fin protruding from the top and bottom surfaces of the substrate.
2. The structure of a heat sink having heat-dissipating fins according to claim 1, wherein the center portion is a circular plate.
US13/281,850 2008-01-16 2011-10-26 Method for manufacturing heat sink having heat-dissipating fins and structure of the same Abandoned US20120037351A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/281,850 US20120037351A1 (en) 2008-01-16 2011-10-26 Method for manufacturing heat sink having heat-dissipating fins and structure of the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW97101661 2008-01-16
TW097101661A TW200934362A (en) 2008-01-16 2008-01-16 Method of manufacturing heat dissipaters having heat sinks and structure thereof
US12/073,720 US8087456B2 (en) 2008-01-16 2008-03-10 Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US13/281,850 US20120037351A1 (en) 2008-01-16 2011-10-26 Method for manufacturing heat sink having heat-dissipating fins and structure of the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/073,720 Division US8087456B2 (en) 2008-01-16 2008-03-10 Method for manufacturing heat sink having heat-dissipating fins and structure of the same

Publications (1)

Publication Number Publication Date
US20120037351A1 true US20120037351A1 (en) 2012-02-16

Family

ID=39642625

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/073,720 Expired - Fee Related US8087456B2 (en) 2008-01-16 2008-03-10 Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US13/281,850 Abandoned US20120037351A1 (en) 2008-01-16 2011-10-26 Method for manufacturing heat sink having heat-dissipating fins and structure of the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US12/073,720 Expired - Fee Related US8087456B2 (en) 2008-01-16 2008-03-10 Method for manufacturing heat sink having heat-dissipating fins and structure of the same

Country Status (4)

Country Link
US (2) US8087456B2 (en)
EP (1) EP2081220A3 (en)
JP (1) JP4482595B2 (en)
TW (1) TW200934362A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180148827A1 (en) * 2016-03-16 2018-05-31 Shenzhen China Star Optoelectronics Technology Co., Ltd. Thermal conduction device and vapor deposition crucible

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
CN101549435B (en) * 2008-04-03 2012-06-13 富准精密工业(深圳)有限公司 Method for manufacturing heat sink
TWI357479B (en) * 2008-11-28 2012-02-01 Univ Nat Taiwan Science Tech A thermal module for light source
EP2241390B1 (en) * 2009-04-16 2012-08-08 Neng Tyi Precision Industries Co., Ltd. Radiator manufacturing method
CN101876427A (en) * 2009-04-29 2010-11-03 鸿富锦精密工业（深圳）有限公司 LED lamp cooling device
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
CN102401358B (en) * 2010-09-10 2016-08-03 欧司朗股份有限公司 The manufacture method of cooling body, cooling body and there is the illuminator of this cooling body
JP5185346B2 (en) * 2010-09-15 2013-04-17 株式会社日本自動車部品総合研究所 heatsink
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module
TW201235824A (en) * 2011-02-25 2012-09-01 Asia Vital Components Co Ltd Heat dissipating module and its manufacturing method
CN102679293B (en) * 2011-03-18 2017-06-09 奇鋐科技股份有限公司 A kind of LED radiator and manufacturing method thereof
USD662898S1 (en) * 2011-03-24 2012-07-03 Graftech International Holdings Inc. Heat sink for LED light bulb
CN102760705A (en) * 2011-04-27 2012-10-31 鼎元光电科技股份有限公司 Heat radiator
CN102840567A (en) * 2011-06-21 2012-12-26 欧司朗股份有限公司 Heat sink and manufacture method thereof
CN102927456B (en) * 2011-08-09 2016-08-03 欧司朗股份有限公司 LED luminescence component and the LED modification lamp with this LED luminescence component
GB2495977B (en) * 2011-10-28 2015-09-02 Taiwan Gigantic Light Electric Corp Ltd Heat dissipation assembly
CN104246365A (en) * 2012-07-10 2014-12-24 普司科Led股份有限公司 Optical semiconductor illumination device
CN103471060A (en) * 2013-09-06 2013-12-25 南京北方科技有限公司 Combined light-emitting diode (LED) radiator
TWI506227B (en) * 2014-08-05 2015-11-01 Lite On Technology Corp Light-emitting device
JP2016066694A (en) * 2014-09-24 2016-04-28 株式会社東芝 Heat sink and illumination apparatus
US9581322B2 (en) 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
CN105627206A (en) * 2015-12-30 2016-06-01 深圳市超频三科技股份有限公司 Global illumination lamp and lamp assembly thereof
JP6648206B2 (en) * 2018-07-19 2020-02-14 三菱電機株式会社 Heat radiation fins, heat sinks and lighting equipment
US11525637B2 (en) * 2020-01-19 2022-12-13 Raytheon Technologies Corporation Aircraft heat exchanger finned plate manufacture
US12038241B2 (en) * 2020-07-28 2024-07-16 Kyle Borden Marquis Layered radiator for efficient heat rejection
CN114378543B (en) * 2022-02-15 2022-10-18 苏州市华盛源机电有限公司 Production method of plug-in type radiating fin
US12525214B1 (en) 2025-02-07 2026-01-13 Focal Point, Llc Pendant fixture with modular acoustic baffle vanes

Citations (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148441A (en) * 1959-09-14 1964-09-15 Calumet & Hecla Method of making attached fin type tubes
US3182114A (en) * 1963-01-04 1965-05-04 Fan Tron Corp Rectifier unit with heat dissipator
US3187082A (en) * 1961-02-01 1965-06-01 Cool Fin Electronics Corp Heat dissipating electrical shield
US3216496A (en) * 1961-02-01 1965-11-09 Astro Dynamics Inc Heat sink for electronic devices
US3305013A (en) * 1963-11-01 1967-02-21 Webasto Werk Baier Kg W Heat radiator
US4733293A (en) * 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US5014776A (en) * 1988-04-27 1991-05-14 Joachim Hess Heat emitting unit in form of a heater or cooler
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
US5638715A (en) * 1993-10-06 1997-06-17 R-Theta Inc. Method and apparatus for fabricating high fin density heatsinks
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
US6098279A (en) * 1997-11-14 2000-08-08 Hon Hai Precision Ind. Co., Ltd. Method for making heat sink device
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6266245B1 (en) * 1999-09-30 2001-07-24 Wen-Chen Wei Heat dissipation fixture seating structure
US6263956B1 (en) * 2000-04-14 2001-07-24 Hsin-mao Hsieh Heat dissipating structure and its manufacturing method
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6336498B1 (en) * 2001-04-27 2002-01-08 Wen-Chen Wei Leaf piece structure for heat dissipater
US6386275B1 (en) * 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
US6554060B2 (en) * 2001-02-07 2003-04-29 The Furukawa Electric Co., Ltd. Heat sink with fins
US6587341B1 (en) * 2002-03-04 2003-07-01 Chun Long Metal Co., Ltd. Heat dissipater structure
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6681847B1 (en) * 2003-02-20 2004-01-27 Advanced Thermal Technologies Radiator fin formed by sintering operation
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus
US20040118552A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating device
US6758262B2 (en) * 2000-10-25 2004-07-06 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig
US6776224B1 (en) * 2003-05-30 2004-08-17 Shin Ming Chen Heating dissipating device for electronic elements
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US7028757B1 (en) * 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
US20070084595A1 (en) * 2005-10-14 2007-04-19 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7497013B2 (en) * 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US20090178795A1 (en) * 2008-01-16 2009-07-16 Wen-Chen Wei Manufacturing method for a radiator and a structure thereof
USD603810S1 (en) * 2008-08-29 2009-11-10 Lighthouse Technology Co., Ltd. Heat sink for illuminating device
USD619551S1 (en) * 2009-07-21 2010-07-13 Foxsemicon Integrated Technology, Inc. Heat dissipation device
US7918587B2 (en) * 2008-11-05 2011-04-05 Chaun-Choung Technology Corp. LED fixture and mask structure thereof
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US8087456B2 (en) * 2008-01-16 2012-01-03 Neng Tyi Precision Industries Co., Ltd. Method for manufacturing heat sink having heat-dissipating fins and structure of the same
USD662898S1 (en) * 2011-03-24 2012-07-03 Graftech International Holdings Inc. Heat sink for LED light bulb
US8365407B2 (en) * 2009-04-14 2013-02-05 Neng Tyi Precision Industries Co., Ltd. Radiator manufacturing method and aligning-and-moving mechanism thereof
US8453715B2 (en) * 2008-10-30 2013-06-04 General Electric Company Synthetic jet embedded heat sink

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148441A (en) * 1959-09-14 1964-09-15 Calumet & Hecla Method of making attached fin type tubes
US3187082A (en) * 1961-02-01 1965-06-01 Cool Fin Electronics Corp Heat dissipating electrical shield
US3216496A (en) * 1961-02-01 1965-11-09 Astro Dynamics Inc Heat sink for electronic devices
US3182114A (en) * 1963-01-04 1965-05-04 Fan Tron Corp Rectifier unit with heat dissipator
US3305013A (en) * 1963-11-01 1967-02-21 Webasto Werk Baier Kg W Heat radiator
US4733293A (en) * 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US5014776A (en) * 1988-04-27 1991-05-14 Joachim Hess Heat emitting unit in form of a heater or cooler
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
US5638715A (en) * 1993-10-06 1997-06-17 R-Theta Inc. Method and apparatus for fabricating high fin density heatsinks
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
US6098279A (en) * 1997-11-14 2000-08-08 Hon Hai Precision Ind. Co., Ltd. Method for making heat sink device
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6266245B1 (en) * 1999-09-30 2001-07-24 Wen-Chen Wei Heat dissipation fixture seating structure
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6263956B1 (en) * 2000-04-14 2001-07-24 Hsin-mao Hsieh Heat dissipating structure and its manufacturing method
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus
US6758262B2 (en) * 2000-10-25 2004-07-06 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6554060B2 (en) * 2001-02-07 2003-04-29 The Furukawa Electric Co., Ltd. Heat sink with fins
US6336498B1 (en) * 2001-04-27 2002-01-08 Wen-Chen Wei Leaf piece structure for heat dissipater
US6386275B1 (en) * 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
US6587341B1 (en) * 2002-03-04 2003-07-01 Chun Long Metal Co., Ltd. Heat dissipater structure
US20040118552A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating device
US6681847B1 (en) * 2003-02-20 2004-01-27 Advanced Thermal Technologies Radiator fin formed by sintering operation
US6776224B1 (en) * 2003-05-30 2004-08-17 Shin Ming Chen Heating dissipating device for electronic elements
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US7028757B1 (en) * 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
US7497013B2 (en) * 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
US20070084595A1 (en) * 2005-10-14 2007-04-19 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7963035B2 (en) * 2008-01-16 2011-06-21 Neg Tyi Precision Co., Ltd. Manufacturing method for a radiator and a structure thereof
US20090178795A1 (en) * 2008-01-16 2009-07-16 Wen-Chen Wei Manufacturing method for a radiator and a structure thereof
US8087456B2 (en) * 2008-01-16 2012-01-03 Neng Tyi Precision Industries Co., Ltd. Method for manufacturing heat sink having heat-dissipating fins and structure of the same
USD603810S1 (en) * 2008-08-29 2009-11-10 Lighthouse Technology Co., Ltd. Heat sink for illuminating device
US8453715B2 (en) * 2008-10-30 2013-06-04 General Electric Company Synthetic jet embedded heat sink
US7918587B2 (en) * 2008-11-05 2011-04-05 Chaun-Choung Technology Corp. LED fixture and mask structure thereof
US8365407B2 (en) * 2009-04-14 2013-02-05 Neng Tyi Precision Industries Co., Ltd. Radiator manufacturing method and aligning-and-moving mechanism thereof
USD619551S1 (en) * 2009-07-21 2010-07-13 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD662898S1 (en) * 2011-03-24 2012-07-03 Graftech International Holdings Inc. Heat sink for LED light bulb

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180148827A1 (en) * 2016-03-16 2018-05-31 Shenzhen China Star Optoelectronics Technology Co., Ltd. Thermal conduction device and vapor deposition crucible

Also Published As

Publication number Publication date
JP4482595B2 (en) 2010-06-16
US20090178794A1 (en) 2009-07-16
TW200934362A (en) 2009-08-01
US8087456B2 (en) 2012-01-03
JP2009170860A (en) 2009-07-30
EP2081220A2 (en) 2009-07-22
TWI353212B (en) 2011-11-21
EP2081220A3 (en) 2010-06-16

Similar Documents

Publication Publication Date Title
US8087456B2 (en) Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US8230902B2 (en) Heat-dissipating element and heat sink having the same
US8459841B2 (en) Lamp assembly
US8164236B2 (en) Lamp assembly
CN101627472A (en) Heat sink, electronic device, and method for manufacturing electronic device
EP2444724B1 (en) LED bulb
US20110024088A1 (en) Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
US8233277B2 (en) Heat dissipation device with self-locking base
JP2008270609A (en) Electronic component heat dissipation device
US7963035B2 (en) Manufacturing method for a radiator and a structure thereof
JP2013115040A (en) Light module and its light component
CN104604353A (en) Heat radiation member, heat radiation circuit board, and heat emission device package
US7672131B2 (en) Heat sink assembly and method manufacturing the same
CN101547584A (en) Heat sink, heat sink combination and fixing device thereof
CN102543912B (en) Radiator and its preparation method
JP4674487B2 (en) Surface mount light emitting device
US7190588B2 (en) Heat-dissipating fin assembly for heat sink
CN102548342B (en) Radiator and its preparation method
TWI514120B (en) Thermal module
TWI391087B (en) Expansion card device and its heat sink
CN101513661A (en) Radiator manufacturing method and radiator structure
CN101513662A (en) Method for manufacturing radiator with radiating fins and structure thereof
JP2007165486A (en) Heat sink and semiconductor device
KR200248523Y1 (en) Cooling device assembly for integrated circuits
KR20030000818A (en) Cooling device assembly for integrated circuits and method for producing the same

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION