[go: up one dir, main page]

US20110308783A1 - Fluid-powered heat exchanger apparatus for cooling electronic equipment - Google Patents

Fluid-powered heat exchanger apparatus for cooling electronic equipment Download PDF

Info

Publication number
US20110308783A1
US20110308783A1 US13/163,642 US201113163642A US2011308783A1 US 20110308783 A1 US20110308783 A1 US 20110308783A1 US 201113163642 A US201113163642 A US 201113163642A US 2011308783 A1 US2011308783 A1 US 2011308783A1
Authority
US
United States
Prior art keywords
fluid
fluid flow
flow passageway
coolant
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/163,642
Inventor
Mark Randal Nicewonger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/163,642 priority Critical patent/US20110308783A1/en
Publication of US20110308783A1 publication Critical patent/US20110308783A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/6851—With casing, support, protector or static constructional installations

Definitions

  • This disclosure relates generally to the technical fields of cooling fluids, and in one example embodiment, this disclosure relates to an apparatus for transferring heat between two coolant loops.
  • the present invention relates to the use of fluids to cool electronic equipment.
  • Such equipment generally includes computers, communications equipment, and data storage devices.
  • Such equipment is typically housed within an equipment rack, the standard 19-inch rack being commonly employed.
  • Fluids distributed to electronic equipment are typically used as a coolant for removing heat generated by the electronic circuits.
  • the most commonly used coolant is air, but liquid coolants such as water are also employed, especially in applications where high amounts of heat are being generated in a compact space (high heat density).
  • heat exchanger As liquid coolants are brought into proximity of electronic equipment, it is often desirable to attain fluid isolation between the primary source of coolant (facilities coolant) and the coolant being delivered to the equipment. This isolation is achieved by a heat exchanger, where the heat conducted by an equipment coolant loop is transferred to a facilities coolant loop.
  • the heat exchanger For equipment housed in racks, the heat exchanger is typically located outside the rack, and is sized large enough to facilitate cooling of many articles of equipment in multiple racks. Coolant is moved through the facilities coolant loop by means of remotely located facilities pumping equipment, and the heat exchanger unit provides a pump for moving fluid through the equipment coolant loop.
  • the heat exchanger employs an electric motor which in addition to providing motive force to drive the pump, draws some amount of electrical power, generates some amount of heat, and has the potential of creating electromagnetic radiation, potentially interfering with electronic equipment. Servicing heat exchangers often requires specialized knowledge and tools related to fluid handling systems.
  • the current invention seeks to improve the suitability of heat exchangers for operation in proximity to electronic equipment by:
  • the first two objectives are achieved by removing the electric motor usually associated with a heat exchanger pumping system, and replacing it with a turbine.
  • the turbine is driven by the facilities coolant loop, and the turbine runner is mechanically coupled to the pump impeller on the equipment coolant loop.
  • the remaining objectives are attained by integrating the majority of heat exchanger system components into a unified body, making the system compact and easily adapted to the standard 19-inch rack mounting system.
  • the compact form of the module makes it possible to mount multiple heat exchangers into a rack, whereby the number included can be scaled to the heat load of the rack, plus any additional units desired to provide system redundancy.
  • Rack-mounted heat exchangers can be quickly and easily swapped out of the rack for outside servicing by qualified personnel.
  • FIG. 1 depicts a cut-away view of a rack-mountable heat exchanger where the main body of the unit comprises a fluid reservoir with an integrated turbine-driven pump assembly.
  • a preferred embodiment of the invention would be a heat exchanger unit for facilitating the removal of heat from an electronic equipment rack.
  • the heat exchanger mounts into the equipment rack along with the equipment being cooled.
  • the heat exchanger occupies a 2U rack space, and multiple heat exchanger units may be mounted in the rack, providing scalability and cooling system redundancy.
  • FIG. 1 shows a cut-away view of the heat exchanger.
  • the outer shell of the unit constitutes a containment reservoir ( 101 ) for the equipment coolant.
  • a first set of fluid connection ports function as the equipment coolant loop supply ( 103 ) and equipment coolant loop return ( 102 ).
  • the equipment coolant enters the return connection port ( 102 ), flows through a system of channels formed by internal baffles ( 110 ), and is pumped out the equipment coolant supply port ( 103 ) by the force of a pump impeller ( 107 ).
  • a second set of fluid connection ports functions as the facilities coolant loop supply ( 104 ) and facilities coolant loop return ( 105 ).
  • the facilities pumping system forces coolant into the facilities supply coolant port ( 104 ), and through a turbine runner ( 106 ), proportional fluid control valve ( 112 ), and internal tubing ( 109 ), before exiting the facilities return coolant port ( 105 ).
  • the internal tubing takes a serpentine path through the equipment coolant reservoir, thus facilitating heat transfer between the two coolant loops.
  • the rotational force of the turbine runner is directly coupled to the pump impeller by a shaft ( 108 ).
  • the velocity of coolant flowing through the equipment coolant loop is proportional to the velocity of the coolant passing through the facilities coolant loop, and is throttled by the proportional fluid control valve to attain the desired flow rate.
  • valve could be disposed to bypass the turbine and control the flow rate by shunting some amount of coolant past the turbine instead of throttling coolant
  • the valve is actuated by a stepper motor ( 113 ) mounted to the back of the unit and mechanically coupled to the valve housing.
  • the valve, turbine runner, and pump impeller housings are all integrated internally into the reservoir.
  • the unit is secured to the equipment rack by mounting brackets ( 111 ) at each corner.
  • the invention has been described for use with liquid coolants on both coolant loops, but the invention may be adapted for alternate combinations of coolants.
  • the equipment coolant loop could employ air as the coolant, in which case the pump impeller would be replaced with fan blades.
  • Other variations such as the use of a two-phase coolant may be exercised by those skilled in the art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat exchanger is located in an electronic equipment enclosure as part of a system for transporting heat away from the electronic equipment. The heat exchanger comprises first and second coolant loops. The amount of electrical power consumed within the equipment enclosure is reduced by employing the motive force of the fluid being pumped through the first cooling loop to move fluid through the second cooling loop without the use of an electric motor. The velocity of fluid flowing through the second coolant loop is varied by controlling the velocity of fluid flowing through the first coolant loop.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims priority to: 1) U.S. provisional application, Ser. No. 61/356,016, filed Jun. 17, 2010, which application(s) are all also incorporated by reference herein in their entirety.
    • FIELD OF TECHNOLOGY
  • This disclosure relates generally to the technical fields of cooling fluids, and in one example embodiment, this disclosure relates to an apparatus for transferring heat between two coolant loops.
    • BACKGROUND Technical Field
  • The present invention relates to the use of fluids to cool electronic equipment. Such equipment generally includes computers, communications equipment, and data storage devices. Such equipment is typically housed within an equipment rack, the standard 19-inch rack being commonly employed. Fluids distributed to electronic equipment are typically used as a coolant for removing heat generated by the electronic circuits. The most commonly used coolant is air, but liquid coolants such as water are also employed, especially in applications where high amounts of heat are being generated in a compact space (high heat density). There is a movement in the computing industry toward increasing cooling system efficiency by close-coupling of liquid coolants, bringing the liquid coolant as close as possible to the source of the heat.
    • Background of the Invention
  • As liquid coolants are brought into proximity of electronic equipment, it is often desirable to attain fluid isolation between the primary source of coolant (facilities coolant) and the coolant being delivered to the equipment. This isolation is achieved by a heat exchanger, where the heat conducted by an equipment coolant loop is transferred to a facilities coolant loop. For equipment housed in racks, the heat exchanger is typically located outside the rack, and is sized large enough to facilitate cooling of many articles of equipment in multiple racks. Coolant is moved through the facilities coolant loop by means of remotely located facilities pumping equipment, and the heat exchanger unit provides a pump for moving fluid through the equipment coolant loop. The heat exchanger employs an electric motor which in addition to providing motive force to drive the pump, draws some amount of electrical power, generates some amount of heat, and has the potential of creating electromagnetic radiation, potentially interfering with electronic equipment. Servicing heat exchangers often requires specialized knowledge and tools related to fluid handling systems.
    • SUMMARY OF THE INVENTION
  • The current invention seeks to improve the suitability of heat exchangers for operation in proximity to electronic equipment by:
  • 1. eliminating heat generated by electric motors
  • 2. eliminating electromagnetic interference from motors
  • 3. providing failsafe redundancy for heat exchanger systems
  • 4. providing scalability for heat exchanger systems
  • 5. enhancing serviceability of heat exchanger systems
  • The first two objectives are achieved by removing the electric motor usually associated with a heat exchanger pumping system, and replacing it with a turbine. The turbine is driven by the facilities coolant loop, and the turbine runner is mechanically coupled to the pump impeller on the equipment coolant loop. The remaining objectives are attained by integrating the majority of heat exchanger system components into a unified body, making the system compact and easily adapted to the standard 19-inch rack mounting system. The compact form of the module makes it possible to mount multiple heat exchangers into a rack, whereby the number included can be scaled to the heat load of the rack, plus any additional units desired to provide system redundancy. Rack-mounted heat exchangers can be quickly and easily swapped out of the rack for outside servicing by qualified personnel.
  • The methods, systems, and apparatuses disclosed herein may be implemented in any means for achieving various aspects of the present disclosure. Other features will be apparent from the accompanying drawings and from the detailed description that follows.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Example embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements and in which:
  • FIG. 1 depicts a cut-away view of a rack-mountable heat exchanger where the main body of the unit comprises a fluid reservoir with an integrated turbine-driven pump assembly.
    •  DETAILED DESCRIPTION
  • A preferred embodiment of the invention would be a heat exchanger unit for facilitating the removal of heat from an electronic equipment rack. The heat exchanger mounts into the equipment rack along with the equipment being cooled. The heat exchanger occupies a 2U rack space, and multiple heat exchanger units may be mounted in the rack, providing scalability and cooling system redundancy.
  • FIG. 1 shows a cut-away view of the heat exchanger. The outer shell of the unit constitutes a containment reservoir (101) for the equipment coolant. A first set of fluid connection ports function as the equipment coolant loop supply (103) and equipment coolant loop return (102). The equipment coolant enters the return connection port (102), flows through a system of channels formed by internal baffles (110), and is pumped out the equipment coolant supply port (103) by the force of a pump impeller (107). A second set of fluid connection ports functions as the facilities coolant loop supply (104) and facilities coolant loop return (105). The facilities pumping system forces coolant into the facilities supply coolant port (104), and through a turbine runner (106), proportional fluid control valve (112), and internal tubing (109), before exiting the facilities return coolant port (105). The internal tubing takes a serpentine path through the equipment coolant reservoir, thus facilitating heat transfer between the two coolant loops. The rotational force of the turbine runner is directly coupled to the pump impeller by a shaft (108). The velocity of coolant flowing through the equipment coolant loop is proportional to the velocity of the coolant passing through the facilities coolant loop, and is throttled by the proportional fluid control valve to attain the desired flow rate. Alternately, the valve could be disposed to bypass the turbine and control the flow rate by shunting some amount of coolant past the turbine instead of throttling coolant The valve is actuated by a stepper motor (113) mounted to the back of the unit and mechanically coupled to the valve housing. The valve, turbine runner, and pump impeller housings are all integrated internally into the reservoir. The unit is secured to the equipment rack by mounting brackets (111) at each corner.
  • The invention has been described for use with liquid coolants on both coolant loops, but the invention may be adapted for alternate combinations of coolants. For example, the equipment coolant loop could employ air as the coolant, in which case the pump impeller would be replaced with fan blades. Other variations such as the use of a two-phase coolant may be exercised by those skilled in the art.
  • While the invention has been described in detail herein in accordance with certain preferred embodiments thereof, many modifications and changes therein may be effected by those skilled in the art. For example, methods and operations described herein can be in different sequences than the exemplary ones described herein, e.g., in a different order. Thus, one or more additional new operations may be inserted within the existing operations or one or more operations may be abbreviated or eliminated, according to a given application, so long as substantially the same function, way and result is obtained. Accordingly, it is intended by the appended claims to cover all such modifications and changes as fall within the true spirit and scope of the invention.

Claims (20)

1. An apparatus for transferring heat generated by electronic equipment, comprising a heat exchanger, wherein a first fluid flow passageway is in thermal communication with a second fluid flow passageway, whereby heat is transferred between first and second fluids contained respectively therein, and further including a turbine in fluid communication with the first fluid flow passageway, and a pump in fluid communication with the second fluid flow passageway, wherein the rotational force generated by the turbine runner is mechanically transferred to the pump impeller.
2. An apparatus as in claim 1, in which the first fluid flow passageway in fluid communication with at least one facilities coolant system constitutes a first coolant loop, and the second fluid flow passageway in fluid communication with at least one article of electronic equipment constitutes a second coolant loop.
3. An apparatus as in claim 1, in which fluid flows through the first fluid flow passageway by means of the force of an external pump.
4. An apparatus as in claim 1, in which fluid flows through the first fluid flow passageway by means of the force of gravity.
5. An apparatus as in claim 1, in which the second fluid passageway constitutes a fluid reservoir or plenum.
6. An apparatus as in claim 5, in which the reservoir is disposed to prime the pump.
7. An apparatus as in claim 5, in which the pump impeller housing is an integral part of the fluid reservoir or plenum.
8. An apparatus as in claim 5, in which the first fluid flow passageway passes through the reservoir or plenum in fluid isolation.
9. An apparatus as in claim 8, in which the turbine runner housing is an integral part of the fluid reservoir or plenum.
10. An apparatus as in claim 1, in which the rotational force of the turbine runner is directly coupled to the pump impeller.
11. An apparatus as in claim 1, in which the rotational force of the turbine runner is coupled to the pump impeller through an arrangement of gears, or by means of a belt or chain.
12. An apparatus as in claim 1, in which the flow rate of the second fluid is adjustably controlled by varying the flow rate of the first fluid.
13. An apparatus as in claim 12, in which the fluid flow rate is adjusted to maintain a constant temperature of the equipment being cooled.
14. An apparatus as in claim 12, in which the fluid flow rate is adjusted to optimize the energy efficiency of the cooling system in response to a measurement of the heat load or power consumption of the electronic equipment being cooled.
15. An apparatus as in claim 1, further including at least one electrically-operated fluid control valve, or fluid flow rate sensor, or fluid temperature sensor in fluid communication with at least one fluid flow passageway.
16. An apparatus as in claim 15, further including an electronic control module in electrical communication with at least one electrically actuated fluid control valve, or fluid flow rate sensor, or fluid temperature sensor.
17. An apparatus as in claim 16, in which the control module comprises a digital processor unit and memory for storing a digital control program, which is executed by the processor unit for controlling the module, and includes a communication link interconnecting the control module and a computer, or interconnecting a plurality of control modules disposed to a plurality of heat exchanger modules.
18. An apparatus as in claim 1, in which the impeller constitutes fan blades, whereby air is moved through the second fluid flow passageway.
19. An apparatus as in claim 1, in which the module is disposed to an electronic equipment chassis or equipment rack.
20. An apparatus as in claim 1, in which the fluid passing through the first fluid passageway is a liquid coolant.
US13/163,642 2010-06-17 2011-06-17 Fluid-powered heat exchanger apparatus for cooling electronic equipment Abandoned US20110308783A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/163,642 US20110308783A1 (en) 2010-06-17 2011-06-17 Fluid-powered heat exchanger apparatus for cooling electronic equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35601610P 2010-06-17 2010-06-17
US13/163,642 US20110308783A1 (en) 2010-06-17 2011-06-17 Fluid-powered heat exchanger apparatus for cooling electronic equipment

Publications (1)

Publication Number Publication Date
US20110308783A1 true US20110308783A1 (en) 2011-12-22

Family

ID=45327648

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/163,642 Abandoned US20110308783A1 (en) 2010-06-17 2011-06-17 Fluid-powered heat exchanger apparatus for cooling electronic equipment
US13/163,329 Abandoned US20110313576A1 (en) 2010-06-17 2011-06-17 System and method for flowing fluids through electronic chassis modules

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/163,329 Abandoned US20110313576A1 (en) 2010-06-17 2011-06-17 System and method for flowing fluids through electronic chassis modules

Country Status (1)

Country Link
US (2) US20110308783A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3057341A1 (en) * 2016-10-10 2018-04-13 Bull Sas COMPACT LIQUID COOLING COMPACT MODULE
EP3474648A1 (en) * 2017-10-19 2019-04-24 Hewlett-Packard Enterprise Development LP Cooling module
CN111263554A (en) * 2018-11-30 2020-06-09 Ovh公司 Rack adapted to receive a component and system comprising the rack and the component
EP3684153A1 (en) * 2019-01-18 2020-07-22 Asetek Danmark A/S Cooling unit
EP3557964B1 (en) * 2018-04-17 2022-11-09 GE Aviation Systems LLC Electronics cooling module
US11617281B2 (en) 2019-02-13 2023-03-28 Ovh Rack adapted for receiving a component, system including the rack and the component and method of delivering power to a component mounted in a rack
US11856724B2 (en) 2018-11-30 2023-12-26 Ovh System comprising a rack, with support members and components insertable in the rack and connectable via liquid connectors

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9496200B2 (en) * 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US9027360B2 (en) 2011-05-06 2015-05-12 International Business Machines Corporation Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
US9307674B2 (en) 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9854715B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
WO2014141162A1 (en) * 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) * 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
TWI445289B (en) * 2011-08-19 2014-07-11 Inventec Corp Coolant pipe of sever rack
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US8817471B2 (en) * 2011-11-16 2014-08-26 Cooper Technologies Company Overheat suppression systems and methods for an electrical housing
US9043035B2 (en) 2011-11-29 2015-05-26 International Business Machines Corporation Dynamically limiting energy consumed by cooling apparatus
EP2605345B1 (en) * 2011-12-13 2021-04-28 Alcatel Lucent Thermal management of photonics assemblies
CN103287758A (en) * 2012-02-22 2013-09-11 鸿富锦精密工业（深圳）有限公司 Container
CN102711414B (en) * 2012-04-20 2015-07-08 华为技术有限公司 Liquid cooling device
KR101457937B1 (en) * 2012-04-24 2014-11-07 이청종 Oil cooling system and method for server
US9167730B2 (en) * 2012-05-07 2015-10-20 Abb Technology Oy Electronics compartment
JP5807718B2 (en) * 2012-05-31 2015-11-10 富士通株式会社 Rack type information processing equipment
WO2014011706A1 (en) 2012-07-09 2014-01-16 Inertech Ip Llc Transformerless multi-level medium-voltage uninterruptible power supply (ups) systems and methods
CA2926777C (en) 2012-10-09 2021-11-02 Inertech Ip Llc Cooling systems and methods incorporating a plural in series pumped liquid refrigerant trim evaporator cycle
FR3002624B1 (en) * 2013-02-28 2015-02-27 Bull Sas HYDRAULIC DISTRIBUTOR
US12366870B2 (en) * 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
US9774190B2 (en) 2013-09-09 2017-09-26 Inertech Ip Llc Multi-level medium voltage data center static synchronous compensator (DCSTATCOM) for active and reactive power control of data centers connected with grid energy storage and smart green distributed energy sources
US10254021B2 (en) 2013-10-21 2019-04-09 Inertech Ip Llc Cooling systems and methods using two cooling circuits
JP5880519B2 (en) * 2013-10-21 2016-03-09 トヨタ自動車株式会社 In-vehicle electronic device
US11306959B2 (en) 2013-11-06 2022-04-19 Inertech Ip Llc Cooling systems and methods using two circuits with water flow in series and counter flow arrangement
WO2016057854A1 (en) 2014-10-08 2016-04-14 Inertech Ip Llc Systems and methods for cooling electrical equipment
EP3852263B1 (en) 2014-10-21 2024-06-26 Inertech IP LLC Systems and methods for controlling multi-level diode clamped inverters using space vector pulse width modulation (svpwm)
WO2016069313A1 (en) * 2014-10-27 2016-05-06 Ebullient, Llc Two-phase cooling system component
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
US10193380B2 (en) 2015-01-13 2019-01-29 Inertech Ip Llc Power sources and systems utilizing a common ultra-capacitor and battery hybrid energy storage system for both uninterruptible power supply and generator start-up functions
JP6447267B2 (en) * 2015-03-11 2019-01-09 富士通株式会社 Unit device
US10098258B2 (en) * 2015-03-12 2018-10-09 International Business Machines Corporation Minimizing leakage in liquid cooled electronic equipment
US10085367B2 (en) * 2015-03-12 2018-09-25 International Business Machines Corporation Minimizing leakage in liquid cooled electronic equipment
US9655281B2 (en) * 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US10931190B2 (en) 2015-10-22 2021-02-23 Inertech Ip Llc Systems and methods for mitigating harmonics in electrical systems by using active and passive filtering techniques
US10206312B2 (en) * 2015-12-21 2019-02-12 Dell Products, L.P. Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
US10146231B2 (en) 2015-12-21 2018-12-04 Dell Products, L.P. Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature
US9795065B2 (en) 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem
US10156873B2 (en) 2015-12-21 2018-12-18 Dell Products, L.P. Information handling system having fluid manifold with embedded heat exchanger system
US10064314B2 (en) 2015-12-21 2018-08-28 Dell Products, L.P. Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance
US10010013B2 (en) 2015-12-21 2018-06-26 Dell Products, L.P. Scalable rack-mount air-to-liquid heat exchanger
US10330100B2 (en) * 2016-10-05 2019-06-25 Cooler Master Co., Ltd. Pump, pump assembly and liquid cooling system
JP7087254B2 (en) * 2016-10-24 2022-06-21 富士通株式会社 Electronics
US10609840B2 (en) * 2017-04-18 2020-03-31 Baidu Usa Llc Modular quick-release liquid heat removal coupling system for electronic racks
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
US11608919B2 (en) * 2018-02-27 2023-03-21 Intel Corporation Universal quick disconnect
US10925190B2 (en) * 2018-06-04 2021-02-16 Baidu Usa Llc Leak detection and response system for liquid cooling of electronic racks of a data center
US11051425B2 (en) * 2018-08-31 2021-06-29 Te Connectivity Corporation Thermal management for communication system
US10809466B2 (en) * 2018-11-15 2020-10-20 Hewlett Packard Enterprise Development Lp Switch sub-chassis systems and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
DK3702740T3 (en) * 2019-02-28 2021-05-31 Ovh FLOW DETECTION DEVICE, COOLING DEVICE FOR AN ELECTRONIC DEVICE AND HOLDER WHICH HOSTS A MAJORITY OF ELECTRONIC DEVICES
TWI680272B (en) * 2019-03-08 2019-12-21 雙鴻科技股份有限公司 Heat dissipation device
US10701838B1 (en) * 2019-03-25 2020-06-30 Amazon Technologies, Inc. Self-installing connections for rack liquid cooling
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11842943B2 (en) 2019-08-06 2023-12-12 Intel Corporation Electronic systems with inverted circuit board with heat sink to chassis attachment
US11089715B2 (en) * 2019-09-17 2021-08-10 Baidu Usa Llc Cooling chassis design for server liquid cooling of electronic racks of a data center
US11582886B2 (en) * 2020-02-05 2023-02-14 Baidu Usa Llc Modular server cooling system
US11044834B1 (en) 2020-02-21 2021-06-22 Google Llc Inverted liquid cooling system
US11330741B2 (en) * 2020-03-26 2022-05-10 Baidu Usa Llc Modular design of blind mate interface for liquid cooling
US11157050B1 (en) * 2020-04-28 2021-10-26 Hewlett Packard Enterprise Development Lp Compute node tray cooling
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11252844B2 (en) * 2020-06-08 2022-02-15 Baidu Usa Llc Liquid distribution for electronic racks
US11310938B2 (en) * 2020-06-09 2022-04-19 Dell Products, L.P. Leak sensor drip tray
US11363738B2 (en) * 2020-06-30 2022-06-14 Eagle Technology, Llc Electronic device with cooling fluid manifold and multi-function cooling fluid tubes with related electronics cabinet and associated methods
CN112860042B (en) * 2021-02-09 2025-02-07 华勤技术股份有限公司 Liquid cooling device and electronic equipment
US11895809B2 (en) * 2021-05-12 2024-02-06 Nvidia Corporation Intelligent leak sensor system for datacenter cooling systems
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11690201B2 (en) * 2021-06-18 2023-06-27 Baidu Usa Llc Server architecture for hybrid system integration and interface management
US11729946B2 (en) * 2021-08-31 2023-08-15 Baidu Usa Llc Electronics rack with leak segregation system
US11980006B2 (en) * 2021-09-01 2024-05-07 Baidu Usa Llc Leak segregation and detection system for an electronics rack
US11868189B2 (en) * 2021-09-01 2024-01-09 Quanta Computer Inc. Systems and methods for controlling leaks in liquid cooling systems for computer devices
US11864305B2 (en) * 2021-09-14 2024-01-02 Baidu Usa Llc Connector module with mobile plate for servers
US12082380B2 (en) * 2021-12-17 2024-09-03 Baidu Usa Llc Prefabricated module for heterogeneous data centers
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US12453045B2 (en) * 2022-07-20 2025-10-21 Dell Products, L.P. Liquid line routing apparatus for information technology equipment
US12432879B2 (en) * 2023-04-06 2025-09-30 Lenovo Global Technology (United States) Inc. Liquid cooling leak detection apparatus
US20240349453A1 (en) * 2023-04-12 2024-10-17 The Durbin Group, Llc Method and apparatus for a pumped liquid cooling system using a phase change refrigerant
US20250169033A1 (en) * 2023-11-21 2025-05-22 Zt Group Int'l, Inc. Dba Zt Systems Fluid reservoir device for computing system
US20250246880A1 (en) * 2024-01-30 2025-07-31 Leviton Manufacturing Co., Inc. Electrical panel with venting and water protection
US12477686B2 (en) * 2024-01-31 2025-11-18 Dell Products L.P. Liquid cooling bench clip

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3057341A1 (en) * 2016-10-10 2018-04-13 Bull Sas COMPACT LIQUID COOLING COMPACT MODULE
WO2018069635A1 (en) * 2016-10-10 2018-04-19 Bull Sas Compact liquid cooling module for an it server
US11083111B2 (en) 2016-10-10 2021-08-03 Bull Sas Compact liquid cooling module for computer server
EP3474648A1 (en) * 2017-10-19 2019-04-24 Hewlett-Packard Enterprise Development LP Cooling module
CN109688761A (en) * 2017-10-19 2019-04-26 慧与发展有限责任合伙企业 Refrigerating module
US10349560B2 (en) 2017-10-19 2019-07-09 Hewlett Packard Enterprise Development Lp Cooling module
EP3557964B1 (en) * 2018-04-17 2022-11-09 GE Aviation Systems LLC Electronics cooling module
CN111263554A (en) * 2018-11-30 2020-06-09 Ovh公司 Rack adapted to receive a component and system comprising the rack and the component
US11439035B2 (en) 2018-11-30 2022-09-06 Ovh Rack adapted for receiving a component and system including the rack and the component
US11856724B2 (en) 2018-11-30 2023-12-26 Ovh System comprising a rack, with support members and components insertable in the rack and connectable via liquid connectors
EP3684153A1 (en) * 2019-01-18 2020-07-22 Asetek Danmark A/S Cooling unit
US11617281B2 (en) 2019-02-13 2023-03-28 Ovh Rack adapted for receiving a component, system including the rack and the component and method of delivering power to a component mounted in a rack

Also Published As

Publication number Publication date
US20110313576A1 (en) 2011-12-22

Similar Documents

Publication Publication Date Title
US20110308783A1 (en) Fluid-powered heat exchanger apparatus for cooling electronic equipment
US8094453B2 (en) Compliant conduction rail assembly and method facilitating cooling of an electronics structure
CN112822909B (en) Electronic rack liquid cooling system
EP2609800B1 (en) Liquid cooling system for a server
US10225958B1 (en) Liquid cooling system for a data center
US8514575B2 (en) Multimodal cooling apparatus for an electronic system
EP3292459B1 (en) Cooling electronic devices in a data center
US8248801B2 (en) Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat
US7907406B1 (en) System and method for standby mode cooling of a liquid-cooled electronics rack
US8879257B2 (en) Combined power and cooling rack supporting an electronics rack(s)
US8817465B2 (en) Multi-rack assembly with shared cooling apparatus
US8164901B2 (en) High efficiency heat removal system for rack mounted computer equipment
US9045995B2 (en) Electronics rack with liquid-coolant-driven, electricity-generating system
EP2786647B1 (en) Cooling system for a server
US8797740B2 (en) Multi-rack assembly method with shared cooling unit
US9009968B2 (en) Coolant manifold with separately rotatable manifold section(s)
US7551440B2 (en) System and method for cooling an electronic component
EP2812769B1 (en) Heat dissipating system
US20140085817A1 (en) Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US20050061541A1 (en) Liquid cooled system module
US9291281B2 (en) Thermostat-controlled coolant flow within a heat sink
US20190128271A1 (en) Pump with integrated bypass mechanism
CN116249315A (en) High Power Density Servers with Hybrid Thermal Management
US7921903B2 (en) Heat exchange system
CN118678613A (en) Rack components

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- INCOMPLETE APPLICATION (PRE-EXAMINATION)