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US20110247787A1 - Heat dissipating system - Google Patents

Heat dissipating system Download PDF

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Publication number
US20110247787A1
US20110247787A1 US12/886,516 US88651610A US2011247787A1 US 20110247787 A1 US20110247787 A1 US 20110247787A1 US 88651610 A US88651610 A US 88651610A US 2011247787 A1 US2011247787 A1 US 2011247787A1
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US
United States
Prior art keywords
fan
air
duct
heat dissipating
dissipating system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/886,516
Inventor
Lei Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, LEI
Publication of US20110247787A1 publication Critical patent/US20110247787A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present disclosure relates to a heat dissipating system.
  • CPUs Central processing units
  • CPUs can generate a lot of heat during operation. If the heat cannot be dissipated properly, the CPU may malfunction or even be damaged.
  • an air-duct and fan is used to conduct heat away from the CPU.
  • a single fan with air-duct is not efficient enough and may easily be overwhelmed by the excessive amounts of heat produced by current CPUs.
  • FIG. 1 is an assembled view of a heat dissipating system in accordance with one embodiment.
  • FIG. 2 is an isometric view of an air-duct of FIG. 1 .
  • FIG. 3 is an isometric view of a fan mounted on the air-duct.
  • FIG. 4 is an isometric view of a fastener.
  • FIG. 5 is an assembled view of a heat dissipating system in accordance with another embodiment.
  • FIG. 6 is an isometric view of an air-duct of FIG. 5 .
  • FIG. 7 is an isometric view of a fan mounted on the air-duct of FIG. 6 .
  • FIG. 8 is an assemble view of a heat dissipating system in accordance with another embodiment.
  • FIG. 9 is an isometric view of an air-duct of FIG. 8 .
  • FIG. 10 is an isometric view of a fan mounted on the air-duct of FIG. 9 .
  • a heat dissipating system in accordance with an embodiment includes an air-duct 10 , a central processing unit (CPU) (not shown) positioned under the air-duct 10 and a plurality of fans 30 .
  • CPU central processing unit
  • the air-duct 10 includes an inlet 11 and an outlet 12 .
  • a hook 13 extends from the inlet 11 to secure a system fan (not shown).
  • Two securing pieces 14 are formed on the outlet 12 .
  • a plurality of holes 15 is defined in the securing pieces 14 .
  • a plurality of holes is defined in the fan 30 .
  • the fan 30 is mounted on the air-duct 10 with a fastener 40 .
  • the fastener 40 includes a first neck portion 44 and a first funnel-shaped securing portion 43 connected to the first neck portion 44 .
  • the first neck portion 44 is received in one of the holes of the fan 30 .
  • the fastener 40 includes a resisting portion 45 connected to the first neck portion 44 to resist against the fan 30 .
  • the fastener 40 also includes a second neck portion 46 connected to the resisting portion 45 .
  • the hole 15 in the securing piece 14 receives the second neck portion 46 .
  • the fastener 40 includes a second funnel-shaped securing portion 47 connected to the second neck portion 46 to resist against the securing piece 14 .
  • the fastener 40 also includes an inserting portion 42 connected to the first securing portion 43 .
  • the hole of the fan 30 receives the inserting portion 42 .
  • the fastener 40 includes an end portion 48 extending through the fan 30 .
  • the fastener 40 is used to secure the fan 30 to the securing pieces 14 of the air-duct 10 .
  • the end portion 48 resists against the fan 30 .
  • the inserting portion 42 is inserted into one of the holes of the fan 30 .
  • the first securing portion 43 resists against the fan 30 .
  • the first neck portion 44 is inserted into another hole of the fan 30 .
  • the resisting portion 45 resists against the fan 30 and the securing pieces 14 .
  • the second neck portion 46 is inserted into the hole 15 of the securing piece 14 .
  • the second securing portion 47 resists against the securing piece 14 .
  • the remaining fans 30 are mounted on the inlet 11 and the outlet 12 of the air-duct 10 .
  • An air channel is formed between the inlet 11 and the outlet 12 of the air-duct 10 .
  • the fans 30 mounted on the outlet 12 accelerate heat dissipation thus protecting the CPU.
  • two fans 30 are mounted on the outlet 12 .
  • a plurality of securing pieces 14 a extends from the outlet 12 .
  • a plurality of holes 15 a is defined in each securing piece 14 a .
  • Fasteners 40 are used to secure the fans 30 on the air-duct 10 through the holes 15 a .
  • the fans 30 are mounted on the inlet 11 and the outlet 12 .
  • An air channel is formed between the inlet 11 and the outlet 12 .
  • the fans 30 mounted on the outlet 12 accelerate heat dissipation and thus protect the CPU.
  • an opening 16 is defined in a top of the air-duct 10 adjacent to the outlet 12 .
  • a plurality of holes 161 is defined in the air-duct 10 around the opening 16 . Rather than mounting a fan 30 directly on the CPU, the fan 30 is secured on the top of the air-duct 10 through the holes 161 , so that vibration of the fan 30 is less likely to influence operation of the CPU.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating system includes a heat generating component, an air-duct, a first fan and a second fan. The air-duct includes an inlet and an outlet. An air channel is formed between the inlet and the outlet to dissipate heat from the heat generating component. The heat generating component is located in the air channel. The first fan is located at the outlet. The second fan is located at the inlet opposite to the first fan. The first fan and the second fan are capable of cooperatively dissipating heat from the heat generating component through the air channel.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat dissipating system.
  • 2. Description of Related Art
  • Central processing units (CPUs) can generate a lot of heat during operation. If the heat cannot be dissipated properly, the CPU may malfunction or even be damaged. Generally, an air-duct and fan is used to conduct heat away from the CPU. However, a single fan with air-duct is not efficient enough and may easily be overwhelmed by the excessive amounts of heat produced by current CPUs.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an assembled view of a heat dissipating system in accordance with one embodiment.
  • FIG. 2 is an isometric view of an air-duct of FIG. 1.
  • FIG. 3 is an isometric view of a fan mounted on the air-duct.
  • FIG. 4 is an isometric view of a fastener.
  • FIG. 5 is an assembled view of a heat dissipating system in accordance with another embodiment.
  • FIG. 6 is an isometric view of an air-duct of FIG. 5.
  • FIG. 7 is an isometric view of a fan mounted on the air-duct of FIG. 6.
  • FIG. 8 is an assemble view of a heat dissipating system in accordance with another embodiment.
  • FIG. 9 is an isometric view of an air-duct of FIG. 8.
  • FIG. 10 is an isometric view of a fan mounted on the air-duct of FIG. 9.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIGS. 1-2, a heat dissipating system in accordance with an embodiment includes an air-duct 10, a central processing unit (CPU) (not shown) positioned under the air-duct 10 and a plurality of fans 30.
  • The air-duct 10 includes an inlet 11 and an outlet 12. A hook 13 extends from the inlet 11 to secure a system fan (not shown). Two securing pieces 14 are formed on the outlet 12. A plurality of holes 15 is defined in the securing pieces 14.
  • Referring to FIGS. 3-4, a plurality of holes is defined in the fan 30. The fan 30 is mounted on the air-duct 10 with a fastener 40. The fastener 40 includes a first neck portion 44 and a first funnel-shaped securing portion 43 connected to the first neck portion 44. The first neck portion 44 is received in one of the holes of the fan 30.
  • The fastener 40 includes a resisting portion 45 connected to the first neck portion 44 to resist against the fan 30. The fastener 40 also includes a second neck portion 46 connected to the resisting portion 45. The hole 15 in the securing piece 14 receives the second neck portion 46.
  • The fastener 40 includes a second funnel-shaped securing portion 47 connected to the second neck portion 46 to resist against the securing piece 14. The fastener 40 also includes an inserting portion 42 connected to the first securing portion 43. The hole of the fan 30 receives the inserting portion 42. The fastener 40 includes an end portion 48 extending through the fan 30.
  • In assembly, the fastener 40 is used to secure the fan 30 to the securing pieces 14 of the air-duct 10. The end portion 48 resists against the fan 30. The inserting portion 42 is inserted into one of the holes of the fan 30. The first securing portion 43 resists against the fan 30. The first neck portion 44 is inserted into another hole of the fan 30. The resisting portion 45 resists against the fan 30 and the securing pieces 14. The second neck portion 46 is inserted into the hole 15 of the securing piece 14. Finally, the second securing portion 47 resists against the securing piece 14. Then, using the above-described heat dissipating system, the remaining fans 30 are mounted on the inlet 11 and the outlet 12 of the air-duct 10. An air channel is formed between the inlet 11 and the outlet 12 of the air-duct 10. The fans 30 mounted on the outlet 12 accelerate heat dissipation thus protecting the CPU.
  • Referring to FIGS. 5-7, in another embodiment, two fans 30 are mounted on the outlet 12. A plurality of securing pieces 14 a extends from the outlet 12. A plurality of holes 15 a is defined in each securing piece 14 a. Fasteners 40 are used to secure the fans 30 on the air-duct 10 through the holes 15 a. Thus, using the above-described heat dissipating system, the fans 30 are mounted on the inlet 11 and the outlet 12. An air channel is formed between the inlet 11 and the outlet 12. The fans 30 mounted on the outlet 12 accelerate heat dissipation and thus protect the CPU.
  • Referring to FIGS. 8-10, in another embodiment, an opening 16 is defined in a top of the air-duct 10 adjacent to the outlet 12. A plurality of holes 161 is defined in the air-duct 10 around the opening 16. Rather than mounting a fan 30 directly on the CPU, the fan 30 is secured on the top of the air-duct 10 through the holes 161, so that vibration of the fan 30 is less likely to influence operation of the CPU.
  • While the present disclosure has been illustrated by the description of preferred embodiments thereof, and while the preferred embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such details. Additional advantages and modifications within the spirit and scope of the present disclosure will readily appear to those skilled in the art. Therefore, the present disclosure is not limited to the specific details and illustrative examples shown and described.

Claims (16)

1. A heat dissipating system comprising:
a heat generating component;
an air-duct laid on a top of the heat generating component, the air-duct comprising an inlet and an outlet, an air channel formed between the inlet and the outlet to dissipate heat from the heat generating component, and the heat generating component located in the air channel;
a first fan located at the outlet; and
a second fan located at the inlet opposite to the first fan, wherein the first fan and the second fan are capable of cooperatively dissipating heat from the heat generating component through the air channel.
2. The heat dissipating system of claim 1, wherein the first fan is mounted to the air-duct by a fastener, the fastener comprising a first neck portion and a first funnel-shaped securing portion connecting to the first neck portion, a first hole defined in the fan to receive the first neck portion.
3. The heat dissipating system of claim 2, wherein the fastener comprises a resisting portion connecting to the first neck portion to resist the fan.
4. The heat dissipating system of claim 3, wherein the fastener comprises a second neck portion connecting with the resisting portion, a second hole is defined in the air-duct to receive the second neck portion.
5. The heat dissipating system of claim 4, wherein the fastener comprises a second funnel-shaped securing portion connecting with the second neck portion to resist the air-duct.
6. The heat dissipating system of claim 4, wherein the air-duct comprises at least two securing pieces, and the second hole is defined in each securing piece.
7. The heat dissipating system of claim 2, wherein the fastener comprises an inserting portion connecting with the first funnel-shape securing portion, a third hole is defined in the fan to receive the inserting portion.
8. The heat dissipating system of claim 7, wherein the fastener comprises an end portion extending through the first fan.
9. A heat dissipating system comprising:
a heat generating component;
an air-duct laid on a top of the heat generating component, the air-duct comprising an inlet and an outlet, an air channel formed between the inlet and the outlet to dissipate heat from the heat generating component, and the heat generating component located in the air channel;
two first fans located at the outlet side by side; and
a second fan located at the inlet opposite to the first fans, wherein the first fans and the second fan are capable of cooperatively dissipating heat from the heat generating component through the air channel.
10. The heat dissipating system of claim 9, wherein each first fan is mounted to the air-duct by a fastener, the fastener comprising a first neck portion and a first funnel-shaped securing portion connecting to the first neck portion, a first hole defined in the fan to receive the first neck portion.
11. The heat dissipating system of claim 10, wherein the fastener comprises a resisting portion connecting to the first neck portion to resist the fan.
12. The heat dissipating system of claim 11, wherein the fastener comprises a second neck portion connecting with the resisting portion, a second hole is defined in the air-duct to receive the second neck portion.
13. The heat dissipating system of claim 12, wherein the fastener comprises a second funnel-shaped securing portion connecting to the second neck portion to resist the air-duct.
14. The heat dissipating system of claim 12, wherein the air-duct comprises at least two securing pieces, and the second hole is defined in each securing piece.
15. The heat dissipating system of claim 11, wherein the fastener comprises an inserting portion connecting with the first funnel-shape securing portion, and a third hole is defined in the fan to receive the inserting portion.
16. The heat dissipating system of claim 15, wherein the fastener comprises an end portion extending through each first fan.
US12/886,516 2010-04-09 2010-09-20 Heat dissipating system Abandoned US20110247787A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010101434902A CN102213984A (en) 2010-04-09 2010-04-09 Heat radiating system
CN201010143490.2 2010-04-09

Publications (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150034275A1 (en) * 2013-08-05 2015-02-05 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Heat exchanging system of vending machine
US9504183B2 (en) * 2014-11-20 2016-11-22 Accedian Networks Inc. Hybrid thermal management of electronic device
US10299403B2 (en) * 2015-09-23 2019-05-21 Advanced Micro Devices, Inc. Modular thermal solution for high-performance processors
US20240306349A1 (en) * 2021-03-11 2024-09-12 Hirokazu Takabayashi Cooling apparatus and in-vehicle device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102419624A (en) * 2011-12-08 2012-04-18 周志农 Air guiding heat dissipation device for computer
CN103149992A (en) * 2012-12-28 2013-06-12 联宝(合肥)电子科技有限公司 Fan tandem type heat dissipation method and fan tandem type heat dissipation system
WO2018032493A1 (en) * 2016-08-19 2018-02-22 深圳市赛亿科技开发有限公司 Chip heat dissipation apparatus and electronic device
CN107168497A (en) * 2017-06-27 2017-09-15 葛娅敬 A kind of air guiding heat dissipation device for computer
CN113126721A (en) * 2019-12-31 2021-07-16 鸿富锦精密工业(武汉)有限公司 Electronic device and heat dissipation mechanism thereof
CN111541166A (en) * 2020-04-08 2020-08-14 安徽佑赛科技股份有限公司 Mounting structure for intelligent distribution transformer terminal

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US6951449B2 (en) * 2002-05-07 2005-10-04 Delta Electronics, Inc. Heat-dissipating device
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CN2653580Y (en) * 2003-10-30 2004-11-03 曜越科技股份有限公司 Forced exhaust type computer host cooling device
CN1694246A (en) * 2004-05-08 2005-11-09 采石科技有限公司 Convection radiating air ventilation cover
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CN201312471Y (en) * 2008-12-05 2009-09-16 讯凯国际股份有限公司 Wind scooper

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Publication number Priority date Publication date Assignee Title
US5316423A (en) * 1992-12-11 1994-05-31 Kin Daniel C C Acoustic isolation fastener and method for attachment
US6951449B2 (en) * 2002-05-07 2005-10-04 Delta Electronics, Inc. Heat-dissipating device
US20050195568A1 (en) * 2004-03-08 2005-09-08 Daniel Shyr Active convective air scoop cooler
US7384210B2 (en) * 2004-08-24 2008-06-10 Dell Products L.P. Method and apparatus for mounting a component in an information handling system
US20080180905A1 (en) * 2007-01-31 2008-07-31 Inventec Corporation Heat dissipation air duct

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150034275A1 (en) * 2013-08-05 2015-02-05 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Heat exchanging system of vending machine
US9504183B2 (en) * 2014-11-20 2016-11-22 Accedian Networks Inc. Hybrid thermal management of electronic device
US9888609B2 (en) * 2014-11-20 2018-02-06 Accedian Networks Inc. Hybrid thermal management of electronic device
US10299403B2 (en) * 2015-09-23 2019-05-21 Advanced Micro Devices, Inc. Modular thermal solution for high-performance processors
US20240306349A1 (en) * 2021-03-11 2024-09-12 Hirokazu Takabayashi Cooling apparatus and in-vehicle device

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AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, LEI;REEL/FRAME:025018/0209

Effective date: 20100915

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, LEI;REEL/FRAME:025018/0209

Effective date: 20100915

STCB Information on status: application discontinuation

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