US20110241718A1 - Test Plate for Electronic Component Handler - Google Patents
Test Plate for Electronic Component Handler Download PDFInfo
- Publication number
- US20110241718A1 US20110241718A1 US13/163,563 US201113163563A US2011241718A1 US 20110241718 A1 US20110241718 A1 US 20110241718A1 US 201113163563 A US201113163563 A US 201113163563A US 2011241718 A1 US2011241718 A1 US 2011241718A1
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- US
- United States
- Prior art keywords
- test
- corner
- test plate
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- H10P74/00—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
Definitions
- This invention relates to a test plate including pockets that increase the loading efficiency for an electronic component handler.
- Electro Scientific Industries, Inc. sells a variety of electronic component handlers including but not limited to a high volume multi-layer ceramic chip (MLCC) capacitor tester sold as the Model 3300.
- MLCC multi-layer ceramic chip
- FIG. 2 illustrates handler 10 including a loading frame 12 defining loading zone 13 , a plurality of test modules 14 defining a test zone 15 and a blow-off module 16 defining a blow-off zone 17 .
- handler 10 including a loading frame 12 defining loading zone 13 , a plurality of test modules 14 defining a test zone 15 and a blow-off module 16 defining a blow-off zone 17 .
- electronic components pass through loading frame 12 and are individually drawn into test seats or pockets 22 formed as apertures and organized about a test plate.
- a stationary vacuum plate underlies the test plate and includes a plurality of vacuum channels used to create vacuum pressure in pockets 22 .
- Different component types may require different pocket shapes and/or different pocket depths.
- the test plate is positioned at an angle relative to vertical.
- this angle may be a forty five degree angle.
- MLCC components pass through loading frame 12 and are directed by fences of the loading zone 13 toward test pockets 22 .
- One component is received in one test pocket.
- the test plate indexes the loaded components toward testing modules 14 (in the direction of arrow B) where those components are tested.
- the components are presented to blow-off zone 17 , where the components are removed from the handler 10 and organized based on test data from the test modules 14 .
- FIG. 2A With reference to FIG. 2A there is shown a representative prior art electronic component 27 that includes electrode layers 27 A.
- the size of component 27 is defined by a length 27 B, a width 27 C and a thickness 27 D.
- the ratio between length 27 B and width 27 C define the aspect ratio of component 27 .
- Each test pocket 22 includes a loading area 26 as shown in FIG. 2B .
- gravity results in the loading area 26 comprising approximately 80% of the pocket width and the full pocket length.
- a small part of the upper portion of the test pocket width is not substantially involved in loading but rather that small part merely operates to contain the component after loading.
- FIG. 2C one example of how a component is loaded into a test pocket 22 is shown.
- a component it is not uncommon for a component to pitch into pocket 22 .
- a leading edge 28 of component 27 first enters pocket 22 and a trailing edge then falls into pocket 22 as illustrated by arrow 29 .
- test plate for use such a handler is provided where the test plate includes a plurality of test pockets wherein at least one of the test pockets includes at least one corner relief.
- the test pocket may include multiple corner reliefs that may be circular in their configuration.
- FIG. 1 is a perspective view of an individual electronic component being loaded into a test seat/pocket according to an embodiment of the invention
- FIG. 2 is an overall pictorial view of a known electronic component handling machine
- FIG. 2A is a perspective view of an example electronic component
- FIG. 2B is a top plan view of an electronic component captured by a single test pocket
- FIG. 2C illustrates a perspective view of a prior art electronic component being loaded into a test pocket
- FIG. 3 is a plan view of an electronic component captured by a test pocket according to a first embodiment
- FIG. 4A is a plan view of a test pocket according to a second embodiment
- FIG. 4B is a plan view of a test pocket of a third embodiment
- FIG. 4C is a plan view of a test pocket of a fourth embodiment
- FIG. 4D is a plan view of a test pocket of a fifth embodiment
- FIG. 4E is a plan view of a test pocket of a sixth embodiment
- FIG. 4F is a plan view of a test pocket of a seventh embodiment.
- FIG. 5 is a perspective view of one test plate incorporating test pockets according to one embodiment of the invention.
- test plate for an electronic component handler includes test pockets.
- the test pockets are apertures in the test plate.
- Electronic components are delivered to an area near the test pockets and fall into or are pulled into the test pocket.
- At least one corner relief is provided for a test pocket to increase loading efficiency.
- FIGS. 3-5 there is shown a pocket for use with a test plate in an electronic component handler.
- Electronic components such as MLCC's and those shown in FIG. 2A come in a variety of sizes, weights and aspect ratios. Certain types of components may be more difficult to load into a test pocket on a test plate. For example, components having an aspect ratio of 1:1 and of comparatively higher mass may have a lower loading efficiency.
- test pocket 30 including corner reliefs 32 , 32 A.
- Each corner relief 32 , 32 A represents an expanded area in a respective corner of test pocket 30 .
- Corner reliefs 32 , 32 A may extend the full depth of test pocket 30 .
- electronic component 27 can drop into pocket 30 with a reduced likelihood of being trapped, captured or otherwise obstructed.
- Sidewalls 33 and 34 of test pocket 30 may then capture component 27 so that component 27 can pass to a testing module 14 on machine 10 .
- inclusion of corner reliefs 32 , 32 A of the type shown in FIGS. 1 and 3 have improved loading efficiency from approximately 85% to approximately 95%.
- Corner reliefs may be positioned in a number of different fashions in order to improve the loading efficiency of components into a testing machine. These alternate embodiments are shown in FIGS. 4A-4F
- FIG. 4A illustrates a test pocket 36 having corner pockets or reliefs 37 and 37 A.
- Relief 37 extends in a direction lengthwise of the test pocket 36
- relief 37 A projects in a direction widthwise of pocket 36 .
- test pocket 38 includes corner reliefs 39 and 39 A extending in a direction offset from the length and width of pocket 38 .
- FIG. 4C includes four corner reliefs 41 , 41 A, 41 B and 41 C in test pocket 40 .
- the corner reliefs illustrated in FIG. 4C all extend at an angle offset from the width and length of pocket 40 .
- FIG. 4D illustrates test pocket 42 having four corner reliefs 43 , 43 A, 43 B, 43 C all extending in the length direction of pocket 42
- FIG. 4F shows a test pocket 46 where the reliefs 47 , 47 A, 47 B, 47 C all extend widthwise with respect to test pocket 46
- FIG. 4E shows a test pocket 44 with two corner reliefs 45 , 45 A extending widthwise from test pocket 44 .
- Test pockets taught herein can be organized in concentric rings 24 continuous about test plate 20 .
- Test plate 20 is then mounted on the handler 10 for operation as described previously, replacing a conventional test plate with pockets as shown in FIGS. 2B and 2C .
- FIGS. 2B and 2C In FIG. 5 , only some of the pockets 30 are shown in detail due to size. The corner reliefs of these pockets 30 are exaggerated for clarity.
- Corner reliefs may be drilled out using known micro drilling techniques. While the corner reliefs have been illustrated as being semi-circular, the corner reliefs may be any number of different shapes including any polygon.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Test plates with improved test pockets are described herein. One embodiment is a circular test plate comprising a plurality of test pockets, each test pocket being a quadrilateral hole in the test plate, and each quadrilateral hole having four sides and four corners located at the intersections of the sides. Each of the four corners comprises at least one corner having a corner relief that extends from and intersects each of the at least one corner's two intersecting sides, and any remaining corners not having a corner relief. The test plate can be incorporated into a component handler.
Description
- This application is a continuation of U.S. patent application Ser. No. 11/741,921, filed Apr. 30, 2007.
- This invention relates to a test plate including pockets that increase the loading efficiency for an electronic component handler.
- Electronic components are handled by a variety of different electronic component handlers. These different handlers include but are not limited to products sold by Electro Scientific Industries, Inc. of Portland, Oreg., the assignee of the present patent application. Electro Scientific Industries, Inc. sells a variety of electronic component handlers including but not limited to a high volume multi-layer ceramic chip (MLCC) capacitor tester sold as the Model 3300.
- Commonly-assigned U.S. Pat. No. 5,842,579 entitled Electrical Circuit Component Handler describes an electronic component handler. With reference to
FIG. 2 there is shown an overall pictorial view of the electronic component handler of U.S. Pat. No. 5,842,579, the entirety of which is incorporated herein by reference.FIG. 2 illustrateshandler 10 including aloading frame 12 definingloading zone 13, a plurality oftest modules 14 defining atest zone 15 and a blow-off module 16 defining a blow-off zone 17. In operation, electronic components pass throughloading frame 12 and are individually drawn into test seats orpockets 22 formed as apertures and organized about a test plate. Typically, a stationary vacuum plate underlies the test plate and includes a plurality of vacuum channels used to create vacuum pressure inpockets 22. Different component types may require different pocket shapes and/or different pocket depths. - With continued reference to
FIG. 2 it is seen that the test plate is positioned at an angle relative to vertical. By example, this angle may be a forty five degree angle. MLCC components pass throughloading frame 12 and are directed by fences of theloading zone 13 towardtest pockets 22. One component is received in one test pocket. In operation, the test plate indexes the loaded components toward testing modules 14 (in the direction of arrow B) where those components are tested. As the test plate continues to index, the components are presented to blow-off zone 17, where the components are removed from thehandler 10 and organized based on test data from thetest modules 14. - With reference to
FIG. 2A there is shown a representative prior artelectronic component 27 that includeselectrode layers 27A. The size ofcomponent 27 is defined by alength 27B, awidth 27C and athickness 27D. The ratio betweenlength 27B andwidth 27C define the aspect ratio ofcomponent 27. - Each
test pocket 22 includes aloading area 26 as shown inFIG. 2B . In the example where the test plate is positioned at a 45 degree angle, gravity results in theloading area 26 comprising approximately 80% of the pocket width and the full pocket length. When the test plate is positioned at a 45 degree angle, a small part of the upper portion of the test pocket width is not substantially involved in loading but rather that small part merely operates to contain the component after loading. - With reference to
FIG. 2C , one example of how a component is loaded into atest pocket 22 is shown. In particular, it is not uncommon for a component to pitch intopocket 22. A leading edge 28 ofcomponent 27 first enterspocket 22 and a trailing edge then falls intopocket 22 as illustrated byarrow 29. - A need has arisen to increase the loading efficiency of electronic components into test pockets on electronic component handlers. A test plate for use such a handler is provided where the test plate includes a plurality of test pockets wherein at least one of the test pockets includes at least one corner relief. In one embodiment the test pocket may include multiple corner reliefs that may be circular in their configuration.
- Other applications of the present invention will become apparent to those skilled in the art when the following description is read in conjunction with the accompanying drawings.
- The description herein makes reference to the accompanying drawings wherein like reference numerals refer to like parts throughout the several views, and wherein:
-
FIG. 1 is a perspective view of an individual electronic component being loaded into a test seat/pocket according to an embodiment of the invention; -
FIG. 2 is an overall pictorial view of a known electronic component handling machine; -
FIG. 2A is a perspective view of an example electronic component; -
FIG. 2B is a top plan view of an electronic component captured by a single test pocket; -
FIG. 2C illustrates a perspective view of a prior art electronic component being loaded into a test pocket; -
FIG. 3 is a plan view of an electronic component captured by a test pocket according to a first embodiment; -
FIG. 4A is a plan view of a test pocket according to a second embodiment; -
FIG. 4B is a plan view of a test pocket of a third embodiment; -
FIG. 4C is a plan view of a test pocket of a fourth embodiment; -
FIG. 4D is a plan view of a test pocket of a fifth embodiment; -
FIG. 4E is a plan view of a test pocket of a sixth embodiment; -
FIG. 4F is a plan view of a test pocket of a seventh embodiment; and -
FIG. 5 is a perspective view of one test plate incorporating test pockets according to one embodiment of the invention. - A test plate for an electronic component handler is provided that includes test pockets. The test pockets are apertures in the test plate. Electronic components are delivered to an area near the test pockets and fall into or are pulled into the test pocket. At least one corner relief is provided for a test pocket to increase loading efficiency.
- With reference to
FIGS. 3-5 , there is shown a pocket for use with a test plate in an electronic component handler. Electronic components such as MLCC's and those shown inFIG. 2A come in a variety of sizes, weights and aspect ratios. Certain types of components may be more difficult to load into a test pocket on a test plate. For example, components having an aspect ratio of 1:1 and of comparatively higher mass may have a lower loading efficiency. - With reference to
FIGS. 1 and 3 there is shown atest pocket 30 including 32, 32A. Eachcorner reliefs 32, 32A represents an expanded area in a respective corner ofcorner relief test pocket 30. 32, 32A may extend the full depth ofCorner reliefs test pocket 30. By creating 32, 32A,corner reliefs electronic component 27 can drop intopocket 30 with a reduced likelihood of being trapped, captured or otherwise obstructed. Sidewalls 33 and 34 oftest pocket 30 may then capturecomponent 27 so thatcomponent 27 can pass to atesting module 14 onmachine 10. For example, with regard to a conventional 1210 chip, inclusion of 32, 32A of the type shown incorner reliefs FIGS. 1 and 3 have improved loading efficiency from approximately 85% to approximately 95%. - Corner reliefs may be positioned in a number of different fashions in order to improve the loading efficiency of components into a testing machine. These alternate embodiments are shown in
FIGS. 4A-4F -
FIG. 4A illustrates atest pocket 36 having corner pockets or 37 and 37A.reliefs Relief 37 extends in a direction lengthwise of thetest pocket 36, whilerelief 37A projects in a direction widthwise ofpocket 36. InFIG. 4B ,test pocket 38 includes 39 and 39A extending in a direction offset from the length and width ofcorner reliefs pocket 38.FIG. 4C includes four 41, 41A, 41B and 41C incorner reliefs test pocket 40. The corner reliefs illustrated inFIG. 4C all extend at an angle offset from the width and length ofpocket 40. -
FIG. 4D illustratestest pocket 42 having four 43, 43A, 43B, 43C all extending in the length direction ofcorner reliefs pocket 42, whileFIG. 4F shows atest pocket 46 where the 47, 47A, 47B, 47C all extend widthwise with respect to testreliefs pocket 46.FIG. 4E shows atest pocket 44 with two 45, 45A extending widthwise fromcorner reliefs test pocket 44. - Test pockets taught herein, including
pockets 30 in the example ofFIG. 5 , can be organized inconcentric rings 24 continuous abouttest plate 20.Test plate 20 is then mounted on thehandler 10 for operation as described previously, replacing a conventional test plate with pockets as shown inFIGS. 2B and 2C . (InFIG. 5 , only some of thepockets 30 are shown in detail due to size. The corner reliefs of thesepockets 30 are exaggerated for clarity.) - Corner reliefs may be drilled out using known micro drilling techniques. While the corner reliefs have been illustrated as being semi-circular, the corner reliefs may be any number of different shapes including any polygon.
- While the invention has been described in connection with certain embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims, which scope is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures as is permitted under the law.
Claims (17)
1. A circular test plate comprising:
a plurality of test pockets, each test pocket being a quadrilateral hole in the test plate, each quadrilateral hole having four sides and four corners located at the intersections of the sides, each of the four corners comprising:
at least one corner having a corner relief that extends from and intersects each of the at least one corner's two intersecting sides, and
any remaining corners not having a corner relief.
2. The test plate of claim 1 , wherein the test plate is installed in an electronic component handler at an inclined angle.
3. The test plate of claim 2 wherein each test plate has a loading efficiency, whereby the loading efficiency of the test plate having test pockets with corner reliefs is greater than a test plate having test pockets without corner reliefs, due to the addition of the corner reliefs.
4. The test plate of claim 1 wherein at least one corner relief comprises an arcuate hole extending from a top surface of the test plate to a bottom surface of the test plate beyond the intersecting sides of the corner relief's corner.
5. The test plate of claim 1 wherein:
the test plate has a thickness, a top surface and a bottom surface;
each of the test pockets includes side walls that are contiguous and flat between the top surface and the bottom surface of the test plate and the corners of its test pocket; and
each side wall is perpendicular to at least one of the top surface or the bottom surface of the test plate.
6. The test plate of claim 5 wherein each corner relief includes at least one side wall, the at least one side wall being contiguous between the top surface of the test plate, the bottom surface of the test plate, and the intersections between the corner relief and the intersecting sides of the corner relief's corner.
7. The test plate of claim 1 wherein the at least one test pocket includes two corners having a corner relief and two corners not having a corner relief.
8. The test plate of claim 7 wherein the test plate is installed in an electronic component handler about an axis of rotation and wherein the two corner reliefs are situated at radially-outer corners of a test pocket.
9. The test plate of claim 1 wherein the plurality of test pockets are arranged in a plurality of concentric rings on the surface of the test plate.
10. A test plate including a plurality of test pockets wherein:
the test plate is circular, has a thickness, a top surface and a bottom surface;
each of the plurality of test pockets is a quadrilateral hole through the test plate having a radially-inner surface, a radially-outer surface and two side surfaces;
the surfaces of each test pocket are perpendicular to at least one of the top surface or the bottom surface of the test plate;
the surfaces of each test pocket meet to form four interior edges at corners of the test pocket;
the surfaces of each test pocket are each contiguous between the top surface and the bottom surface of the test plate; and
each test pocket includes at least one corner relief at an interior edge thereof, each corner relief extending the test pocket beyond at least one of the surfaces of the test pocket.
11. The test plate of claim 10 wherein the at least one corner relief comprises an arcuate hole extending from one of the side surfaces and one of the radially-inner or the radially-outer surface.
12. The test plate of claim 10 wherein:
the surfaces of each test pocket extends between one of two of the interior edges, one of the interior edges and a corner relief, or two corner reliefs; and
each test pocket is contiguous between those extents.
13. The test plate of claim 10 wherein:
the test pocket includes two corner reliefs adjacent a respective one of the interior edges; and
the test pocket includes rounded corners at the remaining interior edges.
14. The test plate of claim 13 wherein:
the test plate is rotatably mounted in a electronic component handler; and
the each of the two corner reliefs is situated about the interior edge at the intersection between the radially-outer surface and a respective one of the two side surfaces.
15. In a method of testing electronic components using a rotatable test plate installed in an electronic component handler at an inclined angle and having a plurality of test pockets extending through the rotatable test plate, the improvement comprising:
rotating the test plate so that each of a plurality of electronic components resting on a top surface of the rotatable test plate is guided into a respective test pocket of the plurality of test pockets by a corner relief, each test pocket being a quadrilateral hole in the rotatable test plate, each quadrilateral hole having four sides and four corners located at the intersections of the sides, at least one corner of the four corners having the corner relief that extends from and intersects each of the at least one corner's two intersecting sides, and any remaining corners of the four corners not having a corner relief
16. The method of testing electronic components of claim 15 , further comprising:
arranging the corner relief so that a loading efficiency of the electronic component handler is greater than a loading efficiency of the electronic component handler without the corner relief.
17. The method of claim 15 wherein the corner relief comprises at least two corner reliefs, one corner relief situated at a first radially-outer corner of the test pocket and another corner relief situated at a second radially-outer corner of the test pocket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/163,563 US20110241718A1 (en) | 2007-04-30 | 2011-06-17 | Test Plate for Electronic Component Handler |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/741,921 US7965091B2 (en) | 2007-04-30 | 2007-04-30 | Test plate for electronic handler |
| US13/163,563 US20110241718A1 (en) | 2007-04-30 | 2011-06-17 | Test Plate for Electronic Component Handler |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/741,921 Continuation US7965091B2 (en) | 2007-04-30 | 2007-04-30 | Test plate for electronic handler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20110241718A1 true US20110241718A1 (en) | 2011-10-06 |
Family
ID=39885700
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/741,921 Expired - Fee Related US7965091B2 (en) | 2007-04-30 | 2007-04-30 | Test plate for electronic handler |
| US13/163,563 Abandoned US20110241718A1 (en) | 2007-04-30 | 2011-06-17 | Test Plate for Electronic Component Handler |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/741,921 Expired - Fee Related US7965091B2 (en) | 2007-04-30 | 2007-04-30 | Test plate for electronic handler |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7965091B2 (en) |
| JP (2) | JP2010526296A (en) |
| KR (1) | KR20100016104A (en) |
| CN (1) | CN101680928A (en) |
| TW (1) | TW200912339A (en) |
| WO (1) | WO2008134405A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7965091B2 (en) * | 2007-04-30 | 2011-06-21 | Electro Scientific Industries, Inc. | Test plate for electronic handler |
| JP6555045B2 (en) * | 2015-09-18 | 2019-08-07 | 株式会社村田製作所 | Transport device |
| USD803972S1 (en) * | 2016-06-10 | 2017-11-28 | WHG Properties, LLC | Bolt carrier |
| WO2025220720A1 (en) * | 2024-04-19 | 2025-10-23 | 株式会社村田製作所 | Conveyance rotor and appearance inspection device |
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| US5842579A (en) * | 1995-11-16 | 1998-12-01 | Electro Scientific Industries, Inc. | Electrical circuit component handler |
| US6075255A (en) * | 1998-09-14 | 2000-06-13 | Silicon Integrated Systems Company | Contactor system for a ball grid array device |
| US6710611B2 (en) * | 2002-04-19 | 2004-03-23 | Ceramic Component Technologies, Inc. | Test plate for ceramic surface mount devices and other electronic components |
| US6776642B1 (en) * | 2003-07-15 | 2004-08-17 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector assembly having metal clip for pressing loaded LGA IC module |
| US7255575B2 (en) * | 2004-04-27 | 2007-08-14 | Yoshiei Hasegawa | Electrical connecting apparatus |
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| US7965091B2 (en) * | 2007-04-30 | 2011-06-21 | Electro Scientific Industries, Inc. | Test plate for electronic handler |
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| US5227717A (en) * | 1991-12-03 | 1993-07-13 | Sym-Tek Systems, Inc. | Contact assembly for automatic test handler |
| JP3099254B2 (en) * | 1994-02-28 | 2000-10-16 | 安藤電気株式会社 | Suction hand with floating mechanism and transfer contact mechanism |
| JPH08304509A (en) * | 1995-04-28 | 1996-11-22 | Advantest Corp | Semiconductor test equipment |
| US5742168A (en) * | 1995-08-04 | 1998-04-21 | Advantest Corporation | Test section for use in an IC handler |
| US6104204A (en) * | 1997-05-12 | 2000-08-15 | Advantest Corporation | Semiconductor device testing apparatus |
| JP4299383B2 (en) * | 1998-06-25 | 2009-07-22 | 株式会社アドバンテスト | IC test equipment |
| JP3645094B2 (en) * | 1998-07-21 | 2005-05-11 | 信越ポリマー株式会社 | Embossed carrier tape |
| JP3687503B2 (en) * | 2000-07-11 | 2005-08-24 | 株式会社村田製作所 | Electronic component transport device and inspection device using the transport device |
| TWI272392B (en) * | 2002-03-22 | 2007-02-01 | Electro Scient Ind Inc | Test probe alignment apparatus |
| KR20040099471A (en) * | 2002-05-01 | 2004-11-26 | 엔테그리스, 아이엔씨. | Carrier tape for electronic components |
| CN100443911C (en) * | 2002-07-30 | 2008-12-17 | 株式会社爱德万测试 | Electronic component testing device |
| CN100403043C (en) * | 2002-12-04 | 2008-07-16 | 株式会社爱德万测试 | Press parts and electronic parts handling equipment |
| US6942137B2 (en) * | 2003-10-16 | 2005-09-13 | International Business Machines Corporation | Die removal method and apparatus |
| JP2005212797A (en) * | 2004-01-27 | 2005-08-11 | Renesas Technology Corp | Semiconductor chip transfer tray |
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| GB2434211B (en) * | 2004-11-22 | 2009-09-23 | Electro Scient Ind Inc | Method and machine for repetitive testing of an electrical component |
| US7161346B2 (en) * | 2005-05-23 | 2007-01-09 | Electro Scientific Industries, Inc. | Method of holding an electronic component in a controlled orientation during parametric testing |
-
2007
- 2007-04-30 US US11/741,921 patent/US7965091B2/en not_active Expired - Fee Related
-
2008
- 2008-04-22 TW TW097114691A patent/TW200912339A/en unknown
- 2008-04-24 CN CN200880013841A patent/CN101680928A/en active Pending
- 2008-04-24 JP JP2010506487A patent/JP2010526296A/en active Pending
- 2008-04-24 WO PCT/US2008/061387 patent/WO2008134405A1/en not_active Ceased
- 2008-04-24 KR KR1020097022801A patent/KR20100016104A/en not_active Ceased
-
2011
- 2011-06-17 US US13/163,563 patent/US20110241718A1/en not_active Abandoned
-
2014
- 2014-05-19 JP JP2014103587A patent/JP2014194424A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5688127A (en) * | 1995-07-24 | 1997-11-18 | Vlsi Technology, Inc. | Universal contactor system for testing ball grid array (BGA) devices on multiple handlers and method therefor |
| US5842579A (en) * | 1995-11-16 | 1998-12-01 | Electro Scientific Industries, Inc. | Electrical circuit component handler |
| US6075255A (en) * | 1998-09-14 | 2000-06-13 | Silicon Integrated Systems Company | Contactor system for a ball grid array device |
| US6710611B2 (en) * | 2002-04-19 | 2004-03-23 | Ceramic Component Technologies, Inc. | Test plate for ceramic surface mount devices and other electronic components |
| US6776642B1 (en) * | 2003-07-15 | 2004-08-17 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector assembly having metal clip for pressing loaded LGA IC module |
| US7255575B2 (en) * | 2004-04-27 | 2007-08-14 | Yoshiei Hasegawa | Electrical connecting apparatus |
| US7258703B2 (en) * | 2005-01-07 | 2007-08-21 | Asm Assembly Automation Ltd. | Apparatus and method for aligning devices on carriers |
| US7965091B2 (en) * | 2007-04-30 | 2011-06-21 | Electro Scientific Industries, Inc. | Test plate for electronic handler |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200912339A (en) | 2009-03-16 |
| JP2014194424A (en) | 2014-10-09 |
| WO2008134405A1 (en) | 2008-11-06 |
| KR20100016104A (en) | 2010-02-12 |
| US20080264826A1 (en) | 2008-10-30 |
| JP2010526296A (en) | 2010-07-29 |
| US7965091B2 (en) | 2011-06-21 |
| CN101680928A (en) | 2010-03-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: ELECTRO SCIENTIFIC INDUSTRIES, INC., OREGON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BOE, GERALD F.;REEL/FRAME:026479/0376 Effective date: 20110617 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |