US20110145623A1 - System on a chip with clock circuits - Google Patents
System on a chip with clock circuits Download PDFInfo
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- US20110145623A1 US20110145623A1 US13/030,411 US201113030411A US2011145623A1 US 20110145623 A1 US20110145623 A1 US 20110145623A1 US 201113030411 A US201113030411 A US 201113030411A US 2011145623 A1 US2011145623 A1 US 2011145623A1
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- clock signal
- circuit
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- reference clock
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- This invention relates generally to mixed signal integrated circuits and more particularly to multiple clocking modes of a system on a chip.
- a system on a chip integrates multiple independent circuits, which are typically available as individual integrated circuits, onto a single integrated circuit.
- an audio processing SOC combines a processing core (e.g., microprocessor and/or digital signal processor, instruction cache, and data cache), an audio codec (e.g., digitization of analog audio input signals and converting digitized audio signals into analog output signals), a clock circuit, a high speed serial interface (e.g., universal serial bus (USB) interface), and an external memory interface.
- a processing core e.g., microprocessor and/or digital signal processor, instruction cache, and data cache
- an audio codec e.g., digitization of analog audio input signals and converting digitized audio signals into analog output signals
- a clock circuit e.g., a high speed serial interface (e.g., universal serial bus (USB) interface
- USB universal serial bus
- the clock circuit of an audio processing SOC typically includes an oscillation circuit and a phase locked loop (PLL).
- the oscillation circuit generates a reference oscillation from an off-chip crystal and the PLL generates one or more clock signals from the reference oscillation.
- Many applications of the audio processing SOC e.g., music file playback, file transfers via the USB interface, etc.
- require a highly accurate clock e.g., music file playback, file transfers via the USB interface, etc.
- the oscillation circuit and the PLL are designed to provide the highly accurate clock for these operating conditions, which comes at the cost of power consumption.
- SOC system on a chip
- FIG. 1 is a schematic block diagram of a system on a chip (SOC) in accordance with an embodiment of the present invention
- FIG. 2 is a schematic block diagram of an embodiment of a clock circuit in accordance with the present invention.
- FIG. 3 is a schematic block diagram of a clock circuit coupled to a DC-DC converter in accordance with an embodiment of the present invention
- FIG. 4 is a schematic block diagram of an embodiment of a clock circuit and an embodiment of a bandgap circuit coupled to a DC-DC converter in accordance with the present invention
- FIG. 5 is a schematic block diagram of an embodiment of a bandgap circuit in accordance with the present invention.
- FIG. 6 is a schematic block diagram of another embodiment of an SOC in accordance with the present invention.
- FIG. 7 is a schematic block diagram of a reference clock circuit and a first clock circuit in accordance with an embodiment of the present invention.
- FIG. 1 is a schematic block diagram of a system on a chip (SOC) 10 that may be used in portable entertainment devices (e.g., an MP3 player, an advanced MP3 player (i.e., music, photos, and video playback), cellular telephones, personal computers, laptop computers, and/or personal digital assistants.
- portable entertainment devices e.g., an MP3 player, an advanced MP3 player (i.e., music, photos, and video playback), cellular telephones, personal computers, laptop computers, and/or personal digital assistants.
- the SOC 10 includes at least some of a processing module 12 , read only memory (ROM) 14 , a backlight control module 15 , random access memory (RAM) 16 , a digital to analog conversion (DAC) module 18 , an analog to digital conversion (ADC) module 20 , a clocking module 22 , a headphone (HP) amplifier circuit 24 , a DC-DC converter 26 , a line out circuit 26 , a battery charger 28 , a low resolution ADC 30 , a bus structure 32 , a microphone amplifier 34 , a universal serial bus (USB) interface 36 , an interrupt controller 38 , a crypto engine 40 , an input/output pin multiplexer 42 , a plurality of interface modules 44 - 68 , an ECC8 module 70 , and a line in pin 72 .
- ROM read only memory
- RAM random access memory
- DAC digital to analog conversion
- ADC analog to digital conversion
- HP headphone
- the clocking module 22 includes one or more of a real time clock (RTC) module 45 , an oscillation circuit 55 , and a clock circuit 65 .
- the oscillation circuit 55 is coupled to an off-chip crystal and produces therefrom an oscillation.
- the clock circuit 65 may use the oscillation as a reference oscillation to produce one or more clock signals 74 that are used by at least some of the other blocks of the SOC.
- the RTC module 45 provides timing functions such as a second counter, a programmable millisecond interrupt, an alarm interrupt and power-up facility, a watchdog reset, and storage and access to persistent registers.
- the plurality of interface modules 44 - 68 includes at least some of a digital recording interface (DRI) 44 , a universal asynchronous receiver-transmitter (UART) interface 46 , an infrared (IR) interface 48 (e.g., IrDA), a rotary controller 50 , a general purpose input/output (GPIO) interface 52 , a pulse width (PW) interface 54 , a security software provider (SSP) interface 56 , an I2C interface 58 , a serial audio input (SAIF) transmit and/or receive interface 60 , a Sony Philips Digital Interface (SPDIF) 62 , a media interface 64 , an external memory interface 66 , and a liquid crystal display (LCD) interface 68 .
- DRI digital recording interface
- UART universal asynchronous receiver-transmitter
- IR infrared
- GPIO general purpose input/output
- PW pulse width
- SSP security software provider
- I2C interface 58 an I2C interface
- the DRI 44 may be used to interface with a stereo FM (frequency modulated) receiver;
- the UART interface 46 may be used to interface with a host device and/or be used to debug the SOC;
- the IR interface 48 may be used to provide peer-to-peer IR communication;
- the pulse width interface 54 may be used in connection with the backlight control module 15 to control backlighting of a display and/or to provide an output beep;
- the SSP interface 56 may be used to interface with off-chip devices having one or more of an multimedia card (MMC) interface, a scientific data (SD) interface, a secure digital input/output (SDIO) interface, a consumer electronics-AT attachments (CE-ATA) interface, a Triflash interface, a serial peripheral interface (SPI), and a master software (MS) interface;
- the S/PDIF interface 62 may be used to interface with off-chip devices having an S/PDIF transmit and/or receive interface;
- the media interface 64 may be used to interface with a hard
- the DC-DC converter 25 which may be a buck and/or boost converter, generates one or more SOC supply voltages 78 from a battery 80 .
- the DC-DC converter 25 may produce a 1.2 V supply voltage, a 1.8 V supply voltage, and a 3.3 V supply voltage.
- the DC-DC converter 25 may use a single off-chip inductor to produce the SOC supply voltages 78 .
- the SOC 10 is receiving power from a source other than the battery 80 (e.g., 5 V from a USB connection)
- the DC-DC converter 25 may generate one or more the SOC voltages from the alternative power source.
- the battery charger 28 may be enabled to charge the battery 80 .
- the processing module 12 coordinates the recording, playback, and/or file management of multimedia data (e.g., voice, audio, text, data, graphics, images, and/or video).
- the processing module 12 may be a single processing device or a plurality of processing devices.
- Such a processing device may be a microprocessor, micro-controller, digital signal processor, microcomputer, central processing unit, field programmable gate array, programmable logic device, state machine, logic circuitry, analog circuitry, digital circuitry, and/or any device that manipulates signals (analog and/or digital) based on hard coding of the circuitry and/or operational instructions.
- the processing module 12 may have an associated memory and/or memory element, which may be a single memory device, a plurality of memory devices, and/or embedded circuitry of the processing module.
- a memory device may be a read-only memory, random access memory, volatile memory, non-volatile memory, static memory, dynamic memory, flash memory, cache memory, and/or any device that stores digital information.
- the processing module 12 implements one or more of its functions via a state machine, analog circuitry, digital circuitry, and/or logic circuitry
- the memory and/or memory element storing the corresponding operational instructions may be embedded within, or external to, the circuitry comprising the state machine, analog circuitry, digital circuitry, and/or logic circuitry.
- the memory element stores and the processing module executes hard coded and/or operational instructions corresponding to at least some of the steps and/or functions illustrated in FIGS. 1-7 .
- the processing module 12 coordinates the retrieval of multimedia data from off-chip memory via one of the interfaces 44 , 48 , 52 , 56 , 60 , 62 , 64 , and/or 66 .
- the retrieved data is routed within the SOC via the bus structure 32 , which may include a peripheral bus and an advanced high-performance bus (AHB).
- the crypto engine 40 decrypts the retrieved data to produce decrypted retrieved data.
- the decrypted retrieved data is encoded (e.g., is an MP3 file, WMA file, MPEG file, JPEG file, etc.), the processing module 12 coordinates and/or performs the decoding of the retrieved data to produce digitized data.
- An audio component of the digitized data is provided to the DAC module 18 , which may include one or more digital to analog converters.
- the DAC 18 converts the digitized audio component into analog audio signals.
- the headphone amplifier circuit 24 and the line out circuit 26 provide the analog audio signals off-chip.
- a video or image component of the digitized data is provided to the LCD interface for display.
- the processing module 12 coordinates the storage of analog audio input signals received via the microphone amplifier 34 or the line input 72 .
- the ADC module 20 converts the analog audio input signals into digitized audio signals which are then placed on the bus structure.
- the processing module 12 may coordinate the storage of the digitized audio signals in an off-chip memory device.
- the processing module 12 coordinates and/or performs encoding (e.g., MP3, WMA, etc.) of the digitized audio signals to produce encoded audio signals, which are subsequently stored in off-chip memory.
- the processing module 12 coordinates the transferring, editing, and/or deleting of files (e.g., MP3 files, WMA files, MPEG files, JPEG files, and/or any other type of music, video and/or still image files) with a host device via the USB interface 36 .
- the host device e.g., a laptop or PC
- the USB interface 36 places the music file on the bus structure 32 , and it is routed to the desired destination under the control of the processing module 12 .
- the interrupt control module 38 facilitates the various modes of operation by processing interrupts, providing timers, and direct memory access.
- FIG. 2 is a schematic block diagram of an embodiment of a clock circuit 65 that produces a first clock signal 98 when the SOC is in a low power mode (e.g., USB suspend, fast boot sleep mode, etc.) and to produce a second clock signal 100 when the SOC is in a performance mode (e.g., music file playback, file transfer via the USB interface, etc.).
- the clock circuit 65 generates the first clock signal 98 to be less accurate than the second clock signal 100 , but consumes more power when producing the second clock signal 100 than when producing the first clock signal 98 .
- a first clock circuit 90 may produce the first clock signal 98 when the SOC is in a low power mode 94 and a second clock circuit 92 may produce the second clock signal 100 when the SOC is in a performance mode.
- the first clock circuit 90 may be implemented using a variety of clock circuit topologies including, but not limited to, a ring oscillator circuit, an inductor-capacitor resonating oscillator circuit, counters, and a resistor-capacitor oscillator circuit.
- the second clock circuit 92 may also be implemented using a variety of clock circuit topologies including, but not limited to, a crystal oscillator circuit, a phase locked loop, and a counter based oscillator circuit.
- FIG. 3 is a schematic block diagram of a clock circuit 65 coupled to a DC-DC converter 26 .
- the clock circuit 65 is providing the first or the second clock signal 98 or 100 to the DC-DC converter 26 depending on whether the SOC is in the low power mode or the performance mode.
- the DC-DC converter 25 produces the SOC power supply voltage 78 from battery 80 based the first clock signal 98 when the SOC is in the low power mode and based on the second clock signal 100 when the SOC is in the performance mode.
- FIG. 4 is a schematic block diagram of an embodiment of a clock circuit 65 and an embodiment of a bandgap circuit 110 coupled to a DC-DC converter 25 .
- the clock circuit 65 provides the first clock signal 98 to the DC-DC converter 25 when the SOC is in the low power mode and provides the second clock signal 100 to the DC-DC converter when the SOC is in the performance mode.
- the bandgap circuit 110 provides the first bandgap reference 112 to the DC-DC converter 25 when the SOC is in the low power mode and provides the second bandgap reference 114 to the DC-DC converter when the SOC is in the performance mode.
- the first bandgap reference 112 is less accurate than the second bandgap reference 114 , but the bandgap circuit 110 consumes more power when producing the second bandgap reference 114 than when producing the first bandgap reference 112 . In this manner, when the SOC is in the low power mode, the low power bandgap reference 112 and the low power first clock signal 98 are produced, thereby reducing power consumption of the SOC 10 .
- FIG. 5 is a schematic block diagram of an embodiment of a bandgap circuit 110 that includes a first bandgap circuit 120 and a second bandgap circuit 122 .
- the first bandgap circuit 120 produces the first bandgap reference 112 when the first bandgap circuit is enabled and the second bandgap circuit produces the second bandgap reference 114 when the second bandgap circuit 122 is enabled, wherein the first bandgap circuit 120 is enabled when the SOC is in the low power mode and the second bandgap circuit 122 is enabled when the SOC is in the performance mode.
- the first bandgap circuit 120 may include a Zener diode coupled in series with a resistive element (e.g., a resistor, a biased transistor, etc.) while the second bandgap circuit 122 may be a conventional bandgap circuit.
- a resistive element e.g., a resistor, a biased transistor, etc.
- FIG. 6 is a schematic block diagram of another embodiment of an SOC 10 that includes a reference clock 130 , a first clock circuit 132 , the processing module 12 , RAM 16 , ROM 14 , and the bus structure 32 .
- the first clock circuit 132 which may be a ring oscillator circuit, an inductor-capacitor resonating oscillator circuit, and/or a resistor-capacitor oscillator circuit, produces a clock signal 134 . From time-to-time, the first clock circuit 132 tunes the clock signal 134 based on a reference clock signal 136 .
- the reference clock circuit 130 which may be a crystal oscillator circuit, a phase locked loop, and/or a counter based oscillator circuit, is enabled from time-to-time to produce the reference clock signal 136 . Further note that the reference clock signal 136 is more accurate than the clock signal 134 . In this manner, the SOC consumes less power since the more power consuming reference clock circuit is enabled 138 from time to time (e.g., for a few milliseconds every couple of seconds).
- the first clock circuit 132 tunes the clock signal 134 based on the reference clock signal 136 by comparing phase of the reference clock signal 136 with phase of the clock signal 134 .
- the phase of the reference clock signal 136 compares unfavorably with the phase of the clock signal 134 (e.g., they are out of phase)
- the first clock circuit 132 adjusts a parameter.
- the parameter of the first clock circuit may be one or more of a biasing level (e.g., change biasing to adjust slew rate of a ring oscillator), a component value (e.g., adjust a resistive network, a capacitive network, etc.), and a supply voltage level (e.g., lower supply voltage to decrease clock speed or raise the supply voltage to increase clock speed).
- a biasing level e.g., change biasing to adjust slew rate of a ring oscillator
- a component value e.g., adjust a resistive network, a capacitive network, etc.
- a supply voltage level e.g., lower supply voltage to decrease clock speed or raise the supply voltage to increase clock speed.
- the first clock circuit 132 tunes the clock signal 134 based on the reference clock signal 136 by comparing frequency of the reference clock signal 136 with frequency of the clock signal 134 .
- the first clock circuit 132 adjusts a parameter.
- FIG. 7 is a schematic block diagram of a reference clock circuit 130 and a first clock circuit 132 .
- the reference clock circuit 130 includes the oscillation circuit 55 , a phase locked loop (PLL) 140 , and a tri-state buffer 148 .
- the first clock circuit 132 includes a ring oscillation 150 , counters 154 , 156 , and a comparator 158 .
- the ring oscillator 150 may include a variable number of inverter elements that are switched in and out to adjust the rate of the clock signal 134 or the ring oscillator 150 may include a variable divider at its output to change the rate of the clock signal 134 .
- the oscillation circuit 55 When the reference clock circuit 130 is enabled, the oscillation circuit 55 generates a reference oscillation 146 from a crystal 142 .
- the PLL 148 converts the reference oscillation into the reference clock signal 136 , which has a rate equal to the rate of the clock signal 134 .
- the tri-state buffer 148 provides the reference clock signal 136 to the phase/frequency detector 154 .
- the phase and/or frequency detector produces an up signal when the phase and/or frequency of the reference clock signal 136 leads the phase and/or frequency of the clock signal 134 and produces a down signal when the phase and/or frequency of the reference clock signal 136 lags the phase and/or frequency of the clock signal 134 .
- Counter 154 counts the number of cycles of the clock signal 134 and counter 156 counts the number of cycles of the reference clock signal 136 for a given number of cycles.
- the comparator 158 compares the counted number of clock signal cycles 134 produced by counter 154 with the counted number of reference clock 136 cycles produced by counter 156 . If the number of cycles matches, the comparator 158 provides a signal to the ring oscillator 150 , which does not change the operation of the ring oscillator 150 . If, however, the number of cycles of the clock signal 134 is less than the number of cycles of the reference clock 138 , the comparator 158 provides a signal to the ring oscillator 150 such that the ring oscillator 150 speeds up. Conversely, if the number of cycles of the clock signal 134 is greater than the number of cycles of the reference clock 138 , the comparator 158 provides a signal to the ring oscillator 150 such that the ring oscillator 150 slows down.
- the terms “substantially” and “approximately” provides an industry-accepted tolerance for its corresponding term and/or relativity between items. Such an industry-accepted tolerance ranges from less than one percent to fifty percent and corresponds to, but is not limited to, component values, integrated circuit process variations, temperature variations, rise and fall times, and/or thermal noise. Such relativity between items ranges from a difference of a few percent to magnitude differences.
- the term(s) “coupled to” and/or “coupling” and/or includes direct coupling between items and/or indirect coupling between items via an intervening item (e.g., an item includes, but is not limited to, a component, an element, a circuit, and/or a module) where, for indirect coupling, the intervening item does not modify the information of a signal but may adjust its current level, voltage level, and/or power level.
- an intervening item e.g., an item includes, but is not limited to, a component, an element, a circuit, and/or a module
- inferred coupling i.e., where one element is coupled to another element by inference
- the term “operable to” indicates that an item includes one or more of power connections, input(s), output(s), etc., to perform one or more its corresponding functions and may further include inferred coupling to one or more other items.
- the term “associated with”, includes direct and/or indirect coupling of separate items and/or one item being embedded within another item.
- the term “compares favorably”, indicates that a comparison between two or more items, signals, etc., provides a desired relationship. For example, when the desired relationship is that signal 1 has a greater magnitude than signal 2 , a favorable comparison may be achieved when the magnitude of signal 1 is greater than that of signal 2 or when the magnitude of signal 2 is less than that of signal 1 .
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Abstract
Description
- This application is a divisional of co-pending U.S. patent application Ser. No. 11/789,760, filed on Apr. 25, 2007, which claims the benefit of U.S. Provisional Application No. 60/855,811, filed on Nov. 1, 2006.
- This invention relates generally to mixed signal integrated circuits and more particularly to multiple clocking modes of a system on a chip.
- In general, a system on a chip (SOC) integrates multiple independent circuits, which are typically available as individual integrated circuits, onto a single integrated circuit. For example, an audio processing SOC combines a processing core (e.g., microprocessor and/or digital signal processor, instruction cache, and data cache), an audio codec (e.g., digitization of analog audio input signals and converting digitized audio signals into analog output signals), a clock circuit, a high speed serial interface (e.g., universal serial bus (USB) interface), and an external memory interface.
- The clock circuit of an audio processing SOC typically includes an oscillation circuit and a phase locked loop (PLL). The oscillation circuit generates a reference oscillation from an off-chip crystal and the PLL generates one or more clock signals from the reference oscillation. Many applications of the audio processing SOC (e.g., music file playback, file transfers via the USB interface, etc.) require a highly accurate clock. Thus, the oscillation circuit and the PLL are designed to provide the highly accurate clock for these operating conditions, which comes at the cost of power consumption.
- There are, however, many low power operating conditions of an audio processing SOC that do not require a highly accurate clock (e.g., USB suspend mode, fast start sleep modes, etc.). Since there is only one clock circuit on the audio processing SOC, the highly accurate clock is used and the corresponding power is consumed. In the low power operating modes, the power consumption of the system can be dominated by circuitry generating accurate clock frequencies, voltage references, etc.
- Therefore, a need exists for a system on a chip (SOC) that includes a low power mode and a performance mode to reduce power consumption of the SOC.
-
FIG. 1 is a schematic block diagram of a system on a chip (SOC) in accordance with an embodiment of the present invention; -
FIG. 2 is a schematic block diagram of an embodiment of a clock circuit in accordance with the present invention; -
FIG. 3 is a schematic block diagram of a clock circuit coupled to a DC-DC converter in accordance with an embodiment of the present invention; -
FIG. 4 is a schematic block diagram of an embodiment of a clock circuit and an embodiment of a bandgap circuit coupled to a DC-DC converter in accordance with the present invention; -
FIG. 5 is a schematic block diagram of an embodiment of a bandgap circuit in accordance with the present invention; -
FIG. 6 is a schematic block diagram of another embodiment of an SOC in accordance with the present invention; and -
FIG. 7 is a schematic block diagram of a reference clock circuit and a first clock circuit in accordance with an embodiment of the present invention. -
FIG. 1 is a schematic block diagram of a system on a chip (SOC) 10 that may be used in portable entertainment devices (e.g., an MP3 player, an advanced MP3 player (i.e., music, photos, and video playback), cellular telephones, personal computers, laptop computers, and/or personal digital assistants. TheSOC 10 includes at least some of aprocessing module 12, read only memory (ROM) 14, abacklight control module 15, random access memory (RAM) 16, a digital to analog conversion (DAC)module 18, an analog to digital conversion (ADC)module 20, aclocking module 22, a headphone (HP)amplifier circuit 24, a DC-DC converter 26, a line out circuit 26, abattery charger 28, alow resolution ADC 30, a bus structure 32, amicrophone amplifier 34, a universal serial bus (USB)interface 36, aninterrupt controller 38, acrypto engine 40, an input/output pin multiplexer 42, a plurality of interface modules 44-68, anECC8 module 70, and a line inpin 72. - The
clocking module 22 includes one or more of a real time clock (RTC)module 45, anoscillation circuit 55, and aclock circuit 65. In one embodiment, theoscillation circuit 55 is coupled to an off-chip crystal and produces therefrom an oscillation. Theclock circuit 65 may use the oscillation as a reference oscillation to produce one ormore clock signals 74 that are used by at least some of the other blocks of the SOC. TheRTC module 45 provides timing functions such as a second counter, a programmable millisecond interrupt, an alarm interrupt and power-up facility, a watchdog reset, and storage and access to persistent registers. - The plurality of interface modules 44-68 includes at least some of a digital recording interface (DRI) 44, a universal asynchronous receiver-transmitter (UART)
interface 46, an infrared (IR) interface 48 (e.g., IrDA), arotary controller 50, a general purpose input/output (GPIO)interface 52, a pulse width (PW)interface 54, a security software provider (SSP) interface 56, anI2C interface 58, a serial audio input (SAIF) transmit and/or receiveinterface 60, a Sony Philips Digital Interface (SPDIF) 62, amedia interface 64, an external memory interface 66, and a liquid crystal display (LCD)interface 68. In an application, theDRI 44 may be used to interface with a stereo FM (frequency modulated) receiver; theUART interface 46 may be used to interface with a host device and/or be used to debug the SOC; theIR interface 48 may be used to provide peer-to-peer IR communication; thepulse width interface 54 may be used in connection with thebacklight control module 15 to control backlighting of a display and/or to provide an output beep; the SSP interface 56 may be used to interface with off-chip devices having one or more of an multimedia card (MMC) interface, a scientific data (SD) interface, a secure digital input/output (SDIO) interface, a consumer electronics-AT attachments (CE-ATA) interface, a Triflash interface, a serial peripheral interface (SPI), and a master software (MS) interface; the S/PDIF interface 62 may be used to interface with off-chip devices having an S/PDIF transmit and/or receive interface; themedia interface 64 may be used to interface with a hard drive, NAND flash or compact flash to transceiver digitized audio, video, image, text, and/or graphics data; the external memory interface 66 may be used to interface with an SDRAM, a NOR memory, and/or a dual data rate (mDDR) memory device; and theLCD interface 68 may be used to interface with a display. - The DC-
DC converter 25, which may be a buck and/or boost converter, generates one or moreSOC supply voltages 78 from abattery 80. For example, the DC-DC converter 25 may produce a 1.2 V supply voltage, a 1.8 V supply voltage, and a 3.3 V supply voltage. Note that the DC-DC converter 25 may use a single off-chip inductor to produce theSOC supply voltages 78. Further note that when theSOC 10 is receiving power from a source other than the battery 80 (e.g., 5 V from a USB connection), the DC-DC converter 25 may generate one or more the SOC voltages from the alternative power source. When the alternate power source is available, thebattery charger 28 may be enabled to charge thebattery 80. - In operation, the
processing module 12 coordinates the recording, playback, and/or file management of multimedia data (e.g., voice, audio, text, data, graphics, images, and/or video). Theprocessing module 12 may be a single processing device or a plurality of processing devices. Such a processing device may be a microprocessor, micro-controller, digital signal processor, microcomputer, central processing unit, field programmable gate array, programmable logic device, state machine, logic circuitry, analog circuitry, digital circuitry, and/or any device that manipulates signals (analog and/or digital) based on hard coding of the circuitry and/or operational instructions. Theprocessing module 12 may have an associated memory and/or memory element, which may be a single memory device, a plurality of memory devices, and/or embedded circuitry of the processing module. Such a memory device may be a read-only memory, random access memory, volatile memory, non-volatile memory, static memory, dynamic memory, flash memory, cache memory, and/or any device that stores digital information. Note that when theprocessing module 12 implements one or more of its functions via a state machine, analog circuitry, digital circuitry, and/or logic circuitry, the memory and/or memory element storing the corresponding operational instructions may be embedded within, or external to, the circuitry comprising the state machine, analog circuitry, digital circuitry, and/or logic circuitry. Further note that the memory element stores and the processing module executes hard coded and/or operational instructions corresponding to at least some of the steps and/or functions illustrated inFIGS. 1-7 . - In a playback mode of operation, the
processing module 12 coordinates the retrieval of multimedia data from off-chip memory via one of theinterfaces crypto engine 40 decrypts the retrieved data to produce decrypted retrieved data. If the decrypted retrieved data is encoded (e.g., is an MP3 file, WMA file, MPEG file, JPEG file, etc.), theprocessing module 12 coordinates and/or performs the decoding of the retrieved data to produce digitized data. An audio component of the digitized data is provided to theDAC module 18, which may include one or more digital to analog converters. TheDAC 18 converts the digitized audio component into analog audio signals. Theheadphone amplifier circuit 24 and the line out circuit 26 provide the analog audio signals off-chip. A video or image component of the digitized data is provided to the LCD interface for display. - In an audio record mode, the
processing module 12 coordinates the storage of analog audio input signals received via themicrophone amplifier 34 or theline input 72. In this mode, theADC module 20 converts the analog audio input signals into digitized audio signals which are then placed on the bus structure. In one embodiment, theprocessing module 12 may coordinate the storage of the digitized audio signals in an off-chip memory device. In another embodiment, theprocessing module 12 coordinates and/or performs encoding (e.g., MP3, WMA, etc.) of the digitized audio signals to produce encoded audio signals, which are subsequently stored in off-chip memory. - In a file management mode, the
processing module 12 coordinates the transferring, editing, and/or deleting of files (e.g., MP3 files, WMA files, MPEG files, JPEG files, and/or any other type of music, video and/or still image files) with a host device via theUSB interface 36. For example, the host device (e.g., a laptop or PC) may download a music file to the portable entertainment device that includes the SOC 10 via theUSB interface 36. TheUSB interface 36 places the music file on the bus structure 32, and it is routed to the desired destination under the control of theprocessing module 12. Note that theinterrupt control module 38 facilitates the various modes of operation by processing interrupts, providing timers, and direct memory access. -
FIG. 2 is a schematic block diagram of an embodiment of aclock circuit 65 that produces afirst clock signal 98 when the SOC is in a low power mode (e.g., USB suspend, fast boot sleep mode, etc.) and to produce asecond clock signal 100 when the SOC is in a performance mode (e.g., music file playback, file transfer via the USB interface, etc.). Theclock circuit 65 generates thefirst clock signal 98 to be less accurate than thesecond clock signal 100, but consumes more power when producing thesecond clock signal 100 than when producing thefirst clock signal 98. - In this embodiment, a
first clock circuit 90 may produce thefirst clock signal 98 when the SOC is in alow power mode 94 and asecond clock circuit 92 may produce thesecond clock signal 100 when the SOC is in a performance mode. Thefirst clock circuit 90 may be implemented using a variety of clock circuit topologies including, but not limited to, a ring oscillator circuit, an inductor-capacitor resonating oscillator circuit, counters, and a resistor-capacitor oscillator circuit. Thesecond clock circuit 92 may also be implemented using a variety of clock circuit topologies including, but not limited to, a crystal oscillator circuit, a phase locked loop, and a counter based oscillator circuit. -
FIG. 3 is a schematic block diagram of aclock circuit 65 coupled to a DC-DC converter 26. In this illustration, theclock circuit 65 is providing the first or thesecond clock signal DC converter 25 produces the SOCpower supply voltage 78 frombattery 80 based thefirst clock signal 98 when the SOC is in the low power mode and based on thesecond clock signal 100 when the SOC is in the performance mode. -
FIG. 4 is a schematic block diagram of an embodiment of aclock circuit 65 and an embodiment of abandgap circuit 110 coupled to a DC-DC converter 25. In this embodiment, theclock circuit 65 provides thefirst clock signal 98 to the DC-DC converter 25 when the SOC is in the low power mode and provides thesecond clock signal 100 to the DC-DC converter when the SOC is in the performance mode. - In addition, the
bandgap circuit 110 provides thefirst bandgap reference 112 to the DC-DC converter 25 when the SOC is in the low power mode and provides thesecond bandgap reference 114 to the DC-DC converter when the SOC is in the performance mode. In this embodiment, thefirst bandgap reference 112 is less accurate than thesecond bandgap reference 114, but thebandgap circuit 110 consumes more power when producing thesecond bandgap reference 114 than when producing thefirst bandgap reference 112. In this manner, when the SOC is in the low power mode, the lowpower bandgap reference 112 and the low powerfirst clock signal 98 are produced, thereby reducing power consumption of theSOC 10. -
FIG. 5 is a schematic block diagram of an embodiment of abandgap circuit 110 that includes afirst bandgap circuit 120 and asecond bandgap circuit 122. Thefirst bandgap circuit 120 produces thefirst bandgap reference 112 when the first bandgap circuit is enabled and the second bandgap circuit produces thesecond bandgap reference 114 when thesecond bandgap circuit 122 is enabled, wherein thefirst bandgap circuit 120 is enabled when the SOC is in the low power mode and thesecond bandgap circuit 122 is enabled when the SOC is in the performance mode. - In one embodiment, the
first bandgap circuit 120 may include a Zener diode coupled in series with a resistive element (e.g., a resistor, a biased transistor, etc.) while thesecond bandgap circuit 122 may be a conventional bandgap circuit. -
FIG. 6 is a schematic block diagram of another embodiment of anSOC 10 that includes areference clock 130, a first clock circuit 132, theprocessing module 12,RAM 16,ROM 14, and the bus structure 32. In this embodiment, the first clock circuit 132, which may be a ring oscillator circuit, an inductor-capacitor resonating oscillator circuit, and/or a resistor-capacitor oscillator circuit, produces aclock signal 134. From time-to-time, the first clock circuit 132 tunes theclock signal 134 based on areference clock signal 136. Note that thereference clock circuit 130, which may be a crystal oscillator circuit, a phase locked loop, and/or a counter based oscillator circuit, is enabled from time-to-time to produce thereference clock signal 136. Further note that thereference clock signal 136 is more accurate than theclock signal 134. In this manner, the SOC consumes less power since the more power consuming reference clock circuit is enabled 138 from time to time (e.g., for a few milliseconds every couple of seconds). - In one embodiment, the first clock circuit 132 tunes the
clock signal 134 based on thereference clock signal 136 by comparing phase of thereference clock signal 136 with phase of theclock signal 134. When the phase of thereference clock signal 136 compares unfavorably with the phase of the clock signal 134 (e.g., they are out of phase), the first clock circuit 132 adjusts a parameter. Note that the parameter of the first clock circuit may be one or more of a biasing level (e.g., change biasing to adjust slew rate of a ring oscillator), a component value (e.g., adjust a resistive network, a capacitive network, etc.), and a supply voltage level (e.g., lower supply voltage to decrease clock speed or raise the supply voltage to increase clock speed). - In another embodiment, the first clock circuit 132 tunes the
clock signal 134 based on thereference clock signal 136 by comparing frequency of thereference clock signal 136 with frequency of theclock signal 134. When the frequency of thereference clock signal 136 compares unfavorably with the frequency of the clock signal 134 (e.g., they are out of frequency step), the first clock circuit 132 adjusts a parameter. -
FIG. 7 is a schematic block diagram of areference clock circuit 130 and a first clock circuit 132. Thereference clock circuit 130 includes theoscillation circuit 55, a phase locked loop (PLL) 140, and atri-state buffer 148. The first clock circuit 132 includes aring oscillation 150, counters 154, 156, and acomparator 158. Thering oscillator 150 may include a variable number of inverter elements that are switched in and out to adjust the rate of theclock signal 134 or thering oscillator 150 may include a variable divider at its output to change the rate of theclock signal 134. - When the
reference clock circuit 130 is enabled, theoscillation circuit 55 generates areference oscillation 146 from acrystal 142. ThePLL 148 converts the reference oscillation into thereference clock signal 136, which has a rate equal to the rate of theclock signal 134. Thetri-state buffer 148 provides thereference clock signal 136 to the phase/frequency detector 154. The phase and/or frequency detector produces an up signal when the phase and/or frequency of thereference clock signal 136 leads the phase and/or frequency of theclock signal 134 and produces a down signal when the phase and/or frequency of thereference clock signal 136 lags the phase and/or frequency of theclock signal 134. - Counter 154 counts the number of cycles of the
clock signal 134 and counter 156 counts the number of cycles of thereference clock signal 136 for a given number of cycles. At the end of the given number of cycles, thecomparator 158 compares the counted number of clock signal cycles 134 produced bycounter 154 with the counted number ofreference clock 136 cycles produced bycounter 156. If the number of cycles matches, thecomparator 158 provides a signal to thering oscillator 150, which does not change the operation of thering oscillator 150. If, however, the number of cycles of theclock signal 134 is less than the number of cycles of thereference clock 138, thecomparator 158 provides a signal to thering oscillator 150 such that thering oscillator 150 speeds up. Conversely, if the number of cycles of theclock signal 134 is greater than the number of cycles of thereference clock 138, thecomparator 158 provides a signal to thering oscillator 150 such that thering oscillator 150 slows down. - As may be used herein, the terms “substantially” and “approximately” provides an industry-accepted tolerance for its corresponding term and/or relativity between items. Such an industry-accepted tolerance ranges from less than one percent to fifty percent and corresponds to, but is not limited to, component values, integrated circuit process variations, temperature variations, rise and fall times, and/or thermal noise. Such relativity between items ranges from a difference of a few percent to magnitude differences. As may also be used herein, the term(s) “coupled to” and/or “coupling” and/or includes direct coupling between items and/or indirect coupling between items via an intervening item (e.g., an item includes, but is not limited to, a component, an element, a circuit, and/or a module) where, for indirect coupling, the intervening item does not modify the information of a signal but may adjust its current level, voltage level, and/or power level. As may further be used herein, inferred coupling (i.e., where one element is coupled to another element by inference) includes direct and indirect coupling between two items in the same manner as “coupled to”. As may even further be used herein, the term “operable to” indicates that an item includes one or more of power connections, input(s), output(s), etc., to perform one or more its corresponding functions and may further include inferred coupling to one or more other items. As may still further be used herein, the term “associated with”, includes direct and/or indirect coupling of separate items and/or one item being embedded within another item. As may be used herein, the term “compares favorably”, indicates that a comparison between two or more items, signals, etc., provides a desired relationship. For example, when the desired relationship is that
signal 1 has a greater magnitude thansignal 2, a favorable comparison may be achieved when the magnitude ofsignal 1 is greater than that ofsignal 2 or when the magnitude ofsignal 2 is less than that ofsignal 1. - The present invention has also been described above with the aid of method steps illustrating the performance of specified functions and relationships thereof. The boundaries and sequence of these functional building blocks and method steps have been arbitrarily defined herein for convenience of description. Alternate boundaries and sequences can be defined so long as the specified functions and relationships are appropriately performed. Any such alternate boundaries or sequences are thus within the scope and spirit of the claimed invention.
- The present invention has been described above with the aid of functional building blocks illustrating the performance of certain significant functions. The boundaries of these functional building blocks have been arbitrarily defined for convenience of description. Alternate boundaries could be defined as long as the certain significant functions are appropriately performed. Similarly, flow diagram blocks may also have been arbitrarily defined herein to illustrate certain significant functionality. To the extent used, the flow diagram block boundaries and sequence could have been defined otherwise and still perform the certain significant functionality. Such alternate definitions of both functional building blocks and flow diagram blocks and sequences are thus within the scope and spirit of the claimed invention. One of average skill in the art will also recognize that the functional building blocks, and other illustrative blocks, modules and components herein, can be implemented as illustrated or by discrete components, application specific integrated circuits, processors executing appropriate software and the like or any combination thereof.
Claims (20)
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US13/030,411 US20110145623A1 (en) | 2006-11-01 | 2011-02-18 | System on a chip with clock circuits |
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US85581106P | 2006-11-01 | 2006-11-01 | |
US11/789,760 US7917788B2 (en) | 2006-11-01 | 2007-04-25 | SOC with low power and performance modes |
US13/030,411 US20110145623A1 (en) | 2006-11-01 | 2011-02-18 | System on a chip with clock circuits |
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US13/030,411 Abandoned US20110145623A1 (en) | 2006-11-01 | 2011-02-18 | System on a chip with clock circuits |
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US7917788B2 (en) | 2011-03-29 |
US20080104434A1 (en) | 2008-05-01 |
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