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US20110048682A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20110048682A1
US20110048682A1 US12/620,571 US62057109A US2011048682A1 US 20110048682 A1 US20110048682 A1 US 20110048682A1 US 62057109 A US62057109 A US 62057109A US 2011048682 A1 US2011048682 A1 US 2011048682A1
Authority
US
United States
Prior art keywords
tube
wick
core
retaining structure
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/620,571
Other languages
English (en)
Inventor
Fang-Xiang Yu
Jer-Haur Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUO, JER-HAUR, YU, FANG-XIANG
Publication of US20110048682A1 publication Critical patent/US20110048682A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • H10W40/73

Definitions

  • the disclosure generally relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating an improved heat pipe.
  • CPUs central processing units
  • a heat dissipation device is usually adopted for cooling the electronic component.
  • a heat dissipation device typically includes a heat pipe and a fin-type heat sink.
  • the heat pipe includes a sealed tube, a wick structure attaching to an inner surface of the tube, and working fluid received in the tube.
  • One end of the heat pipe forms an evaporation end and attaches to an electronic component to absorb heat therefrom, and an opposite end of the heat pipe forms a condensation end and extends through the heat sink to transfer the heat of the electronic component to the heat sink for further dissipation.
  • the condensation end of the heat pipe is inserted into the heat sink by way of interference fit, therefore the condensing end of the heat pipe can be maintained in intimate contact with the heat sink.
  • the heat of the electronic component can be timely transferred from the condensation end of the heat pipe to the heat sink.
  • the tube of the heat pipe may deform during assembly of the heat pipe into the heat sink, and thus the wick structure attached on the tube may be damaged or destroyed.
  • narrow gaps are usually formed between the tube and the wick structure.
  • the wick structure not only provides a capillary force for drawing condensed working fluid from the condensation end back to the evaporation end, but also provides a heat transfer path between the tube and the working fluid contained in the tube. Therefore, if the wick structure is damaged or destroyed, a heat transfer capability of the heat pipe may be greatly impaired. Accordingly, a heat dissipation efficiency of the heat dissipation device is reduced.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a first embodiment.
  • FIG. 2 is an exploded view of a heat pipe of the heat dissipation device of FIG. 1 .
  • FIG. 3 is an assembled view of the heat pipe of FIG. 2 , but with two end caps thereof being omitted.
  • FIG. 4 is a schematic view of a wick structure of a heat pipe according to a second embodiment.
  • FIG. 5 shows a wick structure according to a third embodiment.
  • FIG. 6 shows a wick structure according to a fourth embodiment.
  • FIG. 7 shows a wick structure according to a fifth embodiment.
  • a heat dissipation device includes a heat sink 10 and a heat pipe 20 .
  • the heat sink 10 overall has a substantially rectangular configuration.
  • the heat sink 10 includes a main body 12 , and a plurality of dissipation fins 14 extending outwardly generally away from a middle of the heat sink 10 .
  • the main body 12 is a quadrangular prism, and defines an approximately rectangular top surface, an opposite rectangular bottom surface, and four rectangular side surfaces between the top surface and the bottom surface.
  • a through hole 124 extends through the main body 12 along an axial direction of the main body 12 from the bottom surface to the top surface of the main body 12 .
  • the through hole 124 is substantially located at a center of the main body 12 .
  • a cross section of the through hole 124 is circular.
  • the dissipation fins 14 extend outwardly from four corners of the main body 12 , respectively, i.e., from junctions of the four side surfaces of the main body 12 .
  • the dissipation fins 14 are formed at all four lateral sides of the main body 12 .
  • Each dissipation fin 14 is plate-shaped.
  • the dissipation fins 14 at each lateral side of the main body 12 are located between two neighboring ribs 16 , and have outer ends coplanar with outer ends of the two neighboring ribs 16 .
  • the dissipation fins 14 at left and right lateral sides of the main body 12 are parallel to each other, while perpendicular to the left and the right lateral sides of the heat sink 10 .
  • the dissipation fins 14 at front and rear lateral sides of the main body 12 are parallel to each other, while perpendicular to the front and rear lateral sides of the heat sink 10 .
  • the dissipation fins 14 at the left and right lateral sides of the main body 12 are perpendicular to the dissipation fins 14 at the front and rear lateral sides of the main body 12 .
  • the heat pipe 20 is a round-type heat pipe 20 , and has an outer diameter slightly larger than a diameter of the through hole 124 of the main body 12 of the heat sink 10 .
  • the heat pipe 20 includes a tube 26 , a bottom cap 22 , a top cap 24 , working fluid (not shown), and a retaining structure 28 .
  • the tube 26 , the bottom cap 22 and the top cap 24 cooperatively form a sealed interspace 268 in the heat pipe 20 , the sealed interspace 268 receiving the working fluid and the retaining structure 28 therein.
  • the tube 26 is cylindrical. An outer diameter of the tube 26 is slightly larger than the diameter of the through hole 124 of the main body 12 of the heat sink 10 .
  • a first wick 260 is provided on an entire inner surface of the tube 26 , in the form of a layer. The first wick 260 is for providing a capillary force to draw back condensed working fluid.
  • Both of the bottom cap 22 and the top cap 24 are disk-shaped. A diameter of each of the bottom cap 22 and the top cap 24 is equal to the outer diameter of the tube 26 .
  • the bottom cap 22 and the top cap 24 respectively couple to a bottom end 262 and a top end 264 of the tube 26 , thereby forming the interspace 268 .
  • the bottom cap 22 has a planar-shaped bottom surface 222 and an opposite top surface.
  • a third wick 220 is provided on the top surface of the bottom cap 22 , in the form of a layer.
  • the top cap 24 has a top surface 240 and an opposite bottom surface.
  • An annular protrusion 242 extends upwardly from a center of the top surface 240 of the top cap 24 .
  • An aperture (not shown) extends through the top cap 24 and communicates with the protrusion 242 .
  • the retaining structure 28 includes two plates 282 , 284 .
  • the two plates 282 , 284 are substantially the same as each other.
  • Each of the plates 282 , 284 is elongated, rectangular and thin.
  • a width of each plate 282 , 284 is substantially the same as an inner diameter of the tube 26 , and a length of each plate 282 , 284 is a little shorter than a length of the tube 26 in an axial direction of the tube 26 .
  • the two plates 282 , 284 perpendicularly cross each other, and thus the retaining structure 28 has a profile like a cross.
  • a second wick 280 is formed on an outer surface of each plate 282 , 284 , in the form of a layer.
  • the first wick 260 of the tube 26 , the third wick 220 of the bottom cap 22 , and the second wick 280 of the retaining structure 28 are sintered powder.
  • the wicks 260 , 220 , 280 of the tube 26 , the bottom cap 22 , and the retaining structure 28 can be screen mesh or fine grooves.
  • the wicks 260 , 220 , 280 of the tube 26 , the bottom cap 22 , and the retaining structure 28 can all be of the same type, or can be of different types.
  • the retaining structure 28 When the heat dissipation device is assembled, the retaining structure 28 is arranged in the tube 26 with a bottom end thereof being at the same level as the bottom end 262 of the tube 26 . Since the width of each plate 282 , 284 of the retaining structure 28 is approximately the same as the inner diameter of the tube 26 , each of the two plates 282 , 284 abuts the first wick 260 of the tube 26 at opposite two lateral edges thereof. Accordingly, the second wick 280 on the retaining structure 28 is connected to the first wick 260 of the tube 26 .
  • the bottom cap 22 is coupled to the bottom end 262 of the tube 26 and is fixed onto the tube 26 by soldering.
  • the third wick 220 on the bottom cap 22 is thus connected to the first wick 260 of the tube 26 and the second wick 280 of the retaining structure 28 .
  • the top cap 24 is coupled and fixed onto the top end 264 of the tube 26 by soldering. Since the retaining structure 28 is shorter than the tube 26 , the top cap 24 spaces a distance from a top end of the retaining structure 28 .
  • the sealed interspace 268 formed in the heat pipe 20 between the top cap 24 , the bottom cap 22 and the tube 26 is separated into four channels 266 by the two plates 282 , 284 of the retaining structure 28 received in the interspace 268 .
  • the four channels 266 are the same as each other. Each of the channels 266 extends along the axial direction of the tube 26 , and communicates the other channels 266 over the top end of the retaining structure 28 .
  • the heat pipe 20 When assembling the heat pipe 20 to the heat sink 10 , the heat pipe 20 is vertically inserted into the through hole 124 of the heat sink 10 until the bottom surface of the bottom cap 22 of the heat pipe 20 is at the same level as the bottom surface of the heat sink 10 . Since the heat pipe 20 has the retaining structure 28 arranged therein, a rigidity of the tube 26 of the heat pipe 20 is enhanced. That is, the tube 26 of the heat pipe 20 resists deformation during assembly even though the outer diameter of the heat pipe 20 is slightly larger than the diameter of the through hole 124 of the heat sink 10 . Thus damage to or destruction of the first wick 260 of the tube 26 of the heat pipe 20 is avoided.
  • the bottom surface of the bottom cap 22 of the heat pipe 20 attaches to an electronic component tightly to absorb heat therefrom, and thereby rapidly transfers the heat to the working fluid in the heat pipe 20 .
  • the working fluid vaporizes immediately and flows upwardly along the channels 266 to dissipate the heat to the heat sink 10 .
  • the first wick 260 on the tube 26 of the heat pipe 20 is intact and fully functional, the first wick 260 not only can provide a capillary force for drawing condensed working fluid back to a bottom of the heat pipe 20 , but also can provide a heat transfer path between the tube 26 and the working fluid.
  • the second wick 280 on the retaining structure 28 also can provide a capillary force for drawing back condensed working fluid. Therefore, the heat of the electronic component can be timely transferred to the heat sink 10 by the heat pipe 20 .
  • FIG. 4 shows a retaining structure 28 a according to a second embodiment.
  • the retaining structure 28 a includes four plates, i.e., a first plate 284 , a second plate 282 , a third plate 286 and a fourth plate 288 .
  • a wick 280 in the form of a layer is provided on an outer surface of each of the four plates 282 , 284 , 286 , 288 .
  • the first plate 284 and second plate 282 are the same as the two plates 282 , 284 of the retaining structure 28 of the first embodiment.
  • the third plate 286 and the fourth plate 288 are identical to each other.
  • the third plate 286 and the fourth plate 288 are arranged at opposite sides of the first plate 284 , and are equidistantly spaced from the first plate 284 . Both the third plate 286 and the fourth plate 288 perpendicularly cross the second plate 282 . Thus the first plate 284 , the third plate 286 and the fourth plate 288 are parallel to each other, and all are perpendicular to the second plate 282 .
  • a length of each of the third plate 286 and the fourth plate 288 is the same as that of the first plate 284 and the second plate 282 , i.e., the four plates 282 , 284 , 286 , 288 have the same length.
  • a width of each of the third plate 286 and the fourth plate 288 is less than that of each of the first plate 284 and the second plate 282 .
  • Lateral edges of the first plate 284 , the second plate 282 , the third plate 286 and the fourth plate 288 are located on an imaginary cylinder, which has a diameter approximately the same as the inner diameter of the tube 26 .
  • FIG. 5 shows a retaining structure 28 b according to a third embodiment.
  • the retaining structure 28 b includes a hollow core 281 , and a plurality of supporting fins 282 b extending radially from an outer circumferential surface of the core 281 .
  • a wick 280 in the form of a layer is provided on an outer surface of each supporting fin 282 b , and on the outer circumferential surface of the core 281 .
  • an additional wick 285 is arranged inside the core 281 , for providing an additional path for condensed working fluid to flow back to the bottom of the heat pipe 20 .
  • the core 281 has an outer diameter smaller than the inner diameter of the tube 26 .
  • the supporting fins 282 b are identical to each other, and are evenly angularly spaced from each other around the outer surface of the core 281 .
  • Each supporting fin 282 b is rectangular. Lateral edges of the supporting fins 282 b are located on an imaginary cylinder, which has a diameter substantially the same as the inner diameter of the tube 26 .
  • FIG. 6 shows a retaining structure 28 c according to a fourth embodiment.
  • the retaining structure 28 c of this embodiment includes a core 281 c and a plurality of supporting fins 282 c .
  • a wick 280 in the form of a layer is provided on an outer surface of each of the supporting fins 282 c , and on an outer circumferential surface of the core 281 c .
  • the core 281 c is hollow, and is in the shape of a frustum of a circular cone.
  • An outer diameter of the core 281 c gradually decreases from bottom to top; and an inner diameter of the core 281 c gradually decreases from bottom to top, corresponding to the outer diameter.
  • the core 281 c defines a passage 283 c therein, with a diameter of the passage 283 c gradually decreasing from bottom to top.
  • a maximum outer diameter of the core 281 c at the bottom is substantially the same as the inner diameter of the tube 26 .
  • the supporting fins 282 c are formed on the outer circumferential surface of the core 281 c , and are identical to each other. Each supporting fin 282 c is triangular. A with of the supporting fin 282 c as measured in a radial direction gradually decreases from top to bottom. A lateral edge of each supporting fin 282 c is vertical. When the retaining structure 28 c is assembled into the tube 26 , the lateral edges of all of the supporting fins 282 c abut the tube 26 to enhance the rigidity of the tube 26 . In addition, since the core 281 c at the bottom end has the outer diameter approximately equal to the inner diameter of the tube 26 , the bottom end of the core 281 c can also abut the tube 26 .
  • the passage 283 c in the core 281 c acts as a convergent channel for moving of vaporized working fluid.
  • the vaporized working fluid flowing in the passage 283 c of the core 281 c and the condensed wording fluid flowing in the wick 280 on the retaining structure 28 c and in the first wick 260 on the tube 26 are isolated from each other by the core 281 c , and interaction between the vaporized working fluid and condensed wording fluid is avoided. Accordingly, a heat transfer capability of the heat pipe 20 with the retaining structure 28 c is enhanced.
  • FIG. 7 shows a retaining structure 28 d according to a fifth embodiment.
  • the retaining structure 28 d of this embodiment includes a hollow core 281 d , and a plurality of supporting fins 282 d around the core 281 d .
  • a wick 280 in the form of a layer is provided on an outer surface of each supporting fin 282 d , and on an outer circumferential surface of the core 281 d .
  • the core 281 d includes an upper portion 287 d and a lower portion 289 d .
  • the lower portion 289 d of the core 281 d has an outer diameter gradually decreasing from bottom to top, while the upper portion 287 d of the core 281 d has a uniform outer diameter.
  • a maximum outer diameter of the lower portion 289 d of the core 281 d is at the bottom of the core 281 d , and is substantially equal to the inner diameter of the tube 26 .
  • a minimum outer diameter of the lower portion 289 d of the core 281 d is at a top of the lower portion 289 d of the core 281 d , and is larger than the diameter of the upper portion 287 d of the core 281 d .
  • a generally annular, horizontal step 285 d is formed at the top of the lower portion 289 d of the core 281 d .
  • the step 285 d surrounds and adjoins an outer periphery of a bottom of the upper portion 287 d of the core 281 d.
  • the supporting fins 282 d are identical to each other.
  • a lateral edge of each supporting fin 282 d is vertical. All of the lateral edges of the supporting fins 282 d are located on an imaginary cylinder, which has a diameter approximately the same as the inner diameter of the tube 26 .
  • Each supporting fin 282 d includes an upper section 29 extending radially and outwardly from the upper portion 287 d of the core 281 d , and a lower section 30 extending radially and outwardly from the lower portion 289 d of the core 281 d .
  • the upper section 29 of each supporting fin 282 d is rectangular, while the lower section 30 of each supporting fin 282 d is triangular.
  • lateral edges of the supporting fins 282 d abut the first wick 260 of the tube 26 to enhance the rigidity of the tube 26 .
  • the bottom end of the core 281 d abuts the tube 26 , and the hollow core 281 d defines a channel 283 d therein for moving of vaporized working fluid.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/620,571 2009-08-31 2009-11-17 Heat dissipation device Abandoned US20110048682A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910306391.9A CN102003903B (zh) 2009-08-31 2009-08-31 热管及采用该热管的散热装置
CN200910306391.9 2009-08-31

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CN (1) CN102003903B (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100012300A1 (en) * 2006-09-29 2010-01-21 Electronics And Telecommunications Research Institute Heat uniforming device for electronic apparatus
GB2511354A (en) * 2013-03-01 2014-09-03 Iceotope Ltd A module for cooling one or more heat generating components
US20150159965A1 (en) * 2013-12-10 2015-06-11 Sunonwealth Electric Machine Industry Co., Ltd. Heat Exchanging Tube
WO2016079155A1 (en) * 2014-11-17 2016-05-26 Mcneil Ab Electronic nicotine delivery system
US10226076B2 (en) 2014-11-17 2019-03-12 Mcneil Ab Disposable cartridge for use in an electronic nicotine delivery system
CN111577467A (zh) * 2020-05-27 2020-08-25 中国航空发动机研究院 一种用于高速吸气式发动机的拼接式换热器

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CN203177703U (zh) * 2013-01-14 2013-09-04 深圳市万景华科技有限公司 立体式导热结构
CN204085273U (zh) * 2014-07-07 2015-01-07 杨积文 柱状传热装置及用于流体物质传热的管道
CN105318750B (zh) * 2014-07-29 2018-11-06 杨积文 蜂窝状传热装置及其用途
CN105318755B (zh) * 2014-07-29 2019-07-05 杨积文 双层柱状传热装置及用于流体物质传热的管道及方法
CN114459267B (zh) * 2020-11-09 2023-10-31 欣兴电子股份有限公司 均温板装置及其制作方法
CN114046680B (zh) * 2021-11-23 2023-07-21 联想(北京)有限公司 热管及其制作方法

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3603382A (en) * 1969-11-03 1971-09-07 Nasa Radial heat flux transformer
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US3901311A (en) * 1973-01-12 1975-08-26 Grumman Aerospace Corp Self-filling hollow core arterial heat pipe
US4440215A (en) * 1971-02-08 1984-04-03 Q-Dot Corporation Heat pipe
US4846263A (en) * 1984-12-27 1989-07-11 Kabushiki Kaisha Toshiba Heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
US20020144802A1 (en) * 2001-04-06 2002-10-10 Visteon Global Technologies Evaporative cooling device and method
US6490250B1 (en) * 1999-03-09 2002-12-03 Conexant Systems, Inc. Elementary stream multiplexer
US6603382B1 (en) * 1999-04-13 2003-08-05 Alps Electric Co., Ltd. Inductive element having improved superposed DC current characteristic
US6913072B2 (en) * 2003-06-02 2005-07-05 Chin-Kuang Luo Heat dissipating device
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same
US7142422B2 (en) * 2003-08-13 2006-11-28 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US7423879B2 (en) * 2006-05-31 2008-09-09 Neng Tyi Precision Industries Co., Ltd. Sleeve-tightening heat dissipating module
US7870889B2 (en) * 2006-12-13 2011-01-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050274495A1 (en) * 2004-05-28 2005-12-15 Wang Chin W Cylindrical heat pipe structure
CN1849049A (zh) * 2006-04-20 2006-10-18 嘉善华昇电子热传科技有限公司 扁形柱状热管

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3603382A (en) * 1969-11-03 1971-09-07 Nasa Radial heat flux transformer
US4440215A (en) * 1971-02-08 1984-04-03 Q-Dot Corporation Heat pipe
US3901311A (en) * 1973-01-12 1975-08-26 Grumman Aerospace Corp Self-filling hollow core arterial heat pipe
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US4846263A (en) * 1984-12-27 1989-07-11 Kabushiki Kaisha Toshiba Heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
US6490250B1 (en) * 1999-03-09 2002-12-03 Conexant Systems, Inc. Elementary stream multiplexer
US6603382B1 (en) * 1999-04-13 2003-08-05 Alps Electric Co., Ltd. Inductive element having improved superposed DC current characteristic
US20020144802A1 (en) * 2001-04-06 2002-10-10 Visteon Global Technologies Evaporative cooling device and method
US6913072B2 (en) * 2003-06-02 2005-07-05 Chin-Kuang Luo Heat dissipating device
US7142422B2 (en) * 2003-08-13 2006-11-28 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same
US7423879B2 (en) * 2006-05-31 2008-09-09 Neng Tyi Precision Industries Co., Ltd. Sleeve-tightening heat dissipating module
US7870889B2 (en) * 2006-12-13 2011-01-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100012300A1 (en) * 2006-09-29 2010-01-21 Electronics And Telecommunications Research Institute Heat uniforming device for electronic apparatus
GB2511354A (en) * 2013-03-01 2014-09-03 Iceotope Ltd A module for cooling one or more heat generating components
US20150159965A1 (en) * 2013-12-10 2015-06-11 Sunonwealth Electric Machine Industry Co., Ltd. Heat Exchanging Tube
WO2016079155A1 (en) * 2014-11-17 2016-05-26 Mcneil Ab Electronic nicotine delivery system
US10188148B2 (en) 2014-11-17 2019-01-29 Mcneil Ab Electronic nicotine delivery system
US10226076B2 (en) 2014-11-17 2019-03-12 Mcneil Ab Disposable cartridge for use in an electronic nicotine delivery system
US10531692B2 (en) 2014-11-17 2020-01-14 Mcneil Ab Disposable cartridge for use in an electronic nicotine delivery system
US10542781B2 (en) 2014-11-17 2020-01-28 Mcneil Ab Electronic nicotine delivery system
US10791768B2 (en) 2014-11-17 2020-10-06 Mcneil Ab Disposable cartridge for use in an electronic nicotine delivery system
US10842199B2 (en) 2014-11-17 2020-11-24 Mcneil Ab Electronic nicotine delivery system
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