[go: up one dir, main page]

US20100307718A1 - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
US20100307718A1
US20100307718A1 US12/507,094 US50709409A US2010307718A1 US 20100307718 A1 US20100307718 A1 US 20100307718A1 US 50709409 A US50709409 A US 50709409A US 2010307718 A1 US2010307718 A1 US 2010307718A1
Authority
US
United States
Prior art keywords
fin assembly
fins
shaft
heat sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/507,094
Inventor
Ming-Ke Chen
Zhen-Xing Ye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, MING-KE, YE, Zhen-xing
Publication of US20100307718A1 publication Critical patent/US20100307718A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H10W40/73
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/10Movable elements, e.g. being pivotable
    • H10W40/226

Definitions

  • the disclosure relates to a heat sink.
  • CPUs Central processing units
  • heat sinks are made ever bigger to dissipate the increased amount of heat produced by the more powerful CPUs.
  • larger heat sinks mean higher cost in packing and transporting.
  • FIG. 1 is an isometric view of an embodiment of a heat sink.
  • FIG. 2 is a front view of the heat sink of FIG. 1 .
  • FIG. 3 is similar to FIG. 1 , but showing the heat sink in a different state.
  • an embodiment of a heat sink 10 includes a base 20 , a heat pipe 40 , a first fin assembly 60 , and two second fin assemblies 80 .
  • the base 20 is used to contact with a heat generating device (not shown), such as a central processing unit, for example, and absorb heat generated by the heat generating device.
  • a heat generating device such as a central processing unit, for example, and absorb heat generated by the heat generating device.
  • the heat pipe 40 is U-shaped and includes a first shaft 41 , and two second shafts 42 .
  • the first shaft 41 is inserted into the base 20 with opposite ends of the first shaft 41 extending outside the base 20 .
  • the second shafts 42 perpendicularly extend from the opposite ends of the first shaft 41 towards a same direction, respectively.
  • Each second shaft 42 has a round-shaped cross section.
  • the first fin assembly 60 includes a plurality of parallel first fins 61 .
  • Two through holes 600 are defined in each first fin 61 corresponding to the second shafts 42 , where one of the through holes 600 is adjacent to a first end of the first fin 61 , and the other one of the through holes 600 is adjacent to a second end opposite to the first end of the first fin 61 .
  • the second shafts 42 are inserted in the corresponding through holes 600 to connect the plurality of first fins 61 together to fix the first fin assembly 60 .
  • the second fin assemblies 80 are rotatably mounted to the second shafts 42 , respectively.
  • Each second fin assembly 80 includes a plurality of parallel second fins 82 .
  • Each second fin 82 defines a rounded pivot hole (not labeled) engaging with the corresponding second shaft 42 .
  • Each second fin assembly 80 is rotatably mounted to the corresponding second shaft 42 via the plurality of second fins 82 strung by the corresponding second shaft 42 , wherein the second fins 82 are located between adjacent first fins 61 respectively, so as to be staggered with the first fins 61 .
  • Each second fin assembly 80 further includes an operating bar 84 mounted to corresponding sides of the plurality of second fins 82 .
  • each second fin assembly 80 can be operated to rotate the second fin assembly 80 relative to the corresponding second shaft 42 of the heat pipe 40 .
  • the second fin assemblies 80 can be rotated to retract into the first fin assembly 60 , to reduce volume of the heat sink 10 (shown as in FIGS. 1 and 2 ).
  • the second fin assemblies 80 can be rotated to extend out of the first fin assembly 60 , to increase volume of the heat sink 10 (shown as in FIG. 3 ).
  • one of the second fin assembly 80 may be omitted.
  • the rounded pivot holes of the second fins 82 of each second fin assembly 60 may instead be elongated guiding holes, while the round-shaped cross section of each second shaft 42 may instead be rectangular.
  • the second fin assemblies 80 can be slid relative to the first fin assembly 60 via the second shafts 42 sliding along the corresponding guiding holes, so as to extend out of or retract into the first fin assembly 60 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink includes a first fin assembly including a number of first fins, and a second fin assembly including a number of second fins. The second fin assembly can be retracted into the first fin assembly to reduce volume of the heat sink when packing the heat sink, and the second fin assembly can be extend out of the first fin assembly to increase volume of the heat sink when using the first fin assembly for heat dissipation.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to a heat sink.
  • 2. Description of Related Art
  • Central processing units (CPUs) in computers have been developed to be more powerful. Therefore, heat sinks are made ever bigger to dissipate the increased amount of heat produced by the more powerful CPUs. However, larger heat sinks mean higher cost in packing and transporting.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of an embodiment of a heat sink.
  • FIG. 2 is a front view of the heat sink of FIG. 1.
  • FIG. 3 is similar to FIG. 1, but showing the heat sink in a different state.
  • DETAILED DESCRIPTION
  • Referring to FIGS. 1 to 3, an embodiment of a heat sink 10 includes a base 20, a heat pipe 40, a first fin assembly 60, and two second fin assemblies 80.
  • The base 20 is used to contact with a heat generating device (not shown), such as a central processing unit, for example, and absorb heat generated by the heat generating device.
  • The heat pipe 40 is U-shaped and includes a first shaft 41, and two second shafts 42. The first shaft 41 is inserted into the base 20 with opposite ends of the first shaft 41 extending outside the base 20. The second shafts 42 perpendicularly extend from the opposite ends of the first shaft 41 towards a same direction, respectively. Each second shaft 42 has a round-shaped cross section.
  • The first fin assembly 60 includes a plurality of parallel first fins 61. Two through holes 600 are defined in each first fin 61 corresponding to the second shafts 42, where one of the through holes 600 is adjacent to a first end of the first fin 61, and the other one of the through holes 600 is adjacent to a second end opposite to the first end of the first fin 61. The second shafts 42 are inserted in the corresponding through holes 600 to connect the plurality of first fins 61 together to fix the first fin assembly 60.
  • The second fin assemblies 80 are rotatably mounted to the second shafts 42, respectively. Each second fin assembly 80 includes a plurality of parallel second fins 82. Each second fin 82 defines a rounded pivot hole (not labeled) engaging with the corresponding second shaft 42. Each second fin assembly 80 is rotatably mounted to the corresponding second shaft 42 via the plurality of second fins 82 strung by the corresponding second shaft 42, wherein the second fins 82 are located between adjacent first fins 61 respectively, so as to be staggered with the first fins 61. Each second fin assembly 80 further includes an operating bar 84 mounted to corresponding sides of the plurality of second fins 82.
  • The operating bar 84 of each second fin assembly 80 can be operated to rotate the second fin assembly 80 relative to the corresponding second shaft 42 of the heat pipe 40. When the heat sink 10 needs to be packed and transported, the second fin assemblies 80 can be rotated to retract into the first fin assembly 60, to reduce volume of the heat sink 10 (shown as in FIGS. 1 and 2). When the heat sink 10 is required to dissipate heat for a heat generating device, the second fin assemblies 80 can be rotated to extend out of the first fin assembly 60, to increase volume of the heat sink 10 (shown as in FIG. 3).
  • In other embodiments, one of the second fin assembly 80 may be omitted.
  • In other embodiments, the rounded pivot holes of the second fins 82 of each second fin assembly 60 may instead be elongated guiding holes, while the round-shaped cross section of each second shaft 42 may instead be rectangular. Thus, the second fin assemblies 80 can be slid relative to the first fin assembly 60 via the second shafts 42 sliding along the corresponding guiding holes, so as to extend out of or retract into the first fin assembly 60.
  • It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (13)

1. A heat sink comprising:
a base for absorbing heat generated by a heat generating device;
a heat pipe connected to the base;
a first fin assembly fixed to the heat pipe, the first fin assembly comprising a plurality of parallel first fins; and
at least one second fin assembly rotatably mounted to the heat pipe, each of the at least one second fin assembly comprising a plurality of parallel second fins;
wherein the second fins are received between adjacent first fins respectively, and the second fins are able to be rotated out of the corresponding adjacent first fins via rotation of the at least one second fin assembly.
2. The heat sink of claim 1, wherein an operating bar is mounted to the second fin assembly, the second fin assembly able to be rotated via operating the operating bar.
3. The heat sink of claim 1, wherein the at least one second fin assembly comprises two, the heat pipe comprises a first shaft and two second shaft perpendicularly extending from opposite ends of the first shaft respectively, the first shaft is inserted into the base, the first fin assembly is fixed to the second shafts, and the second fin assemblies are mounted to the second shafts respectively.
4. The heat sink of claim 1, wherein a cross section of each of the second shafts is rounded.
5. A heat sink comprising:
a base for absorbing heat generated by a heat generating device;
a heat pipe connected to the base;
a first fin assembly fixed to the heat pipe; and
a second fin assembly movably mounted to the heat pipe;
wherein the first fin assembly comprises a plurality of first fins, the second fin assembly comprises a plurality of second fins, and the first fins and the second fins are staggered and parallel with each other;
wherein the second fin assembly is able to be move between a first position and a second position, in the first position the plurality of second fins are received among the plurality of first fins, and in the second position the plurality of second fins extend out of the plurality of first fins.
6. The heat sink of claim 5, wherein an operating bar is mounted to the second fin assembly, the second fin assembly able to be moved via operating the operating bar.
7. The heat sink of claim 5, wherein the heat pipe comprises a first shaft and a second shaft perpendicularly extending from the first shaft, the first shaft is inserted into the base, the first fin assembly is fixed to the second shaft, and the second fin assembly is movably mounted to the second shaft.
8. The heat sink of claim 7, wherein the second fin assembly is rotatably mounted to the second shaft.
9. The heat sink of claim 8, wherein a cross section of the second shaft is rounded.
10. A heat sink comprising:
a base for absorbing heat generated by a heat generating device;
a heat pipe comprising a first shaft and second shaft extending from the first shaft, the first shaft connected to the base;
a first fin assembly fixed to the second shaft, the first fin assembly comprising a plurality of parallel first fins; and
a second fin assembly movably mounted to the second shaft, each of the at least one second fin assembly comprising a plurality of parallel second fins;
wherein the second fins are received between adjacent first fins respectively, and the second fins are able to be moved out of the corresponding adjacent first fins via moving the at least one second fin assembly along a plane perpendicular with the second shaft.
11. The heat sink of claim 10, wherein an operating bar is mounted to the second fin assembly, the second fin assembly able to be moved via operating the operating bar.
12. The heat sink of claim 10, wherein the second fin assembly is rotatably mounted to the second shaft.
13. The heat sink of claim 12, wherein a cross section of the second shaft is rounded.
US12/507,094 2009-06-05 2009-07-22 Heat sink Abandoned US20100307718A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2009103029689A CN101908513B (en) 2009-06-05 2009-06-05 heat sink
CN200910302968.9 2009-06-05

Publications (1)

Publication Number Publication Date
US20100307718A1 true US20100307718A1 (en) 2010-12-09

Family

ID=43263928

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/507,094 Abandoned US20100307718A1 (en) 2009-06-05 2009-07-22 Heat sink

Country Status (2)

Country Link
US (1) US20100307718A1 (en)
CN (1) CN101908513B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140124173A1 (en) * 2009-10-29 2014-05-08 Wistron Corporation Heat dissipating device and heat dissipating fin
US20170307304A1 (en) * 2014-11-10 2017-10-26 Furukawa Electric Co., Ltd. Heat sink
US20210345519A1 (en) * 2020-06-29 2021-11-04 Intel Corporation Technologies for reconfigurable heat sinks
US11432432B2 (en) * 2017-04-28 2022-08-30 Huawei Technologies Co., Ltd. Heat dissipation apparatus, heat dissipator, electronic device, and heat dissipation control method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103874394B (en) * 2012-12-18 2017-01-04 国网山东省电力公司德州供电公司 Electronic installation and radiator module thereof
CN107247498A (en) * 2017-07-18 2017-10-13 宁波力泰电子科技有限公司 Composite heat dissipation device
CN107368165A (en) * 2017-07-18 2017-11-21 浦江县顺光科技有限公司 A kind of Simple radiator

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US399493A (en) * 1889-03-12 I-eat-absorbing plate for cooling-coils
US1521880A (en) * 1921-07-16 1925-01-06 Guarino Tommaso Radiator for motor vehicles
US1902350A (en) * 1931-01-31 1933-03-21 S R Dresser Mfg Co Heat exchanger
US4815525A (en) * 1985-12-23 1989-03-28 Sundstrand Corporation Deployable space radiator with condenser
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US20010001981A1 (en) * 1997-10-20 2001-05-31 William G. Kratz, Jr. Heat pipe type cooler
US20010023756A1 (en) * 1996-12-03 2001-09-27 Naoto Tanaka Assembled structure having an enlarged heat transfer area for heat radiation therefrom
US20040026073A1 (en) * 2002-08-09 2004-02-12 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US20050072562A1 (en) * 2003-10-02 2005-04-07 Hall Peter David Heat exchanger tube assembly
US20060102334A1 (en) * 2004-10-29 2006-05-18 3M Innovative Properties Company Variable position cooling apparatus
US7411791B2 (en) * 2005-07-08 2008-08-12 Asustek Computer Inc. Extendable heat dissipation apparatus

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US399493A (en) * 1889-03-12 I-eat-absorbing plate for cooling-coils
US1521880A (en) * 1921-07-16 1925-01-06 Guarino Tommaso Radiator for motor vehicles
US1902350A (en) * 1931-01-31 1933-03-21 S R Dresser Mfg Co Heat exchanger
US4815525A (en) * 1985-12-23 1989-03-28 Sundstrand Corporation Deployable space radiator with condenser
US20010023756A1 (en) * 1996-12-03 2001-09-27 Naoto Tanaka Assembled structure having an enlarged heat transfer area for heat radiation therefrom
US20010001981A1 (en) * 1997-10-20 2001-05-31 William G. Kratz, Jr. Heat pipe type cooler
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US20040026073A1 (en) * 2002-08-09 2004-02-12 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US20050072562A1 (en) * 2003-10-02 2005-04-07 Hall Peter David Heat exchanger tube assembly
US20060102334A1 (en) * 2004-10-29 2006-05-18 3M Innovative Properties Company Variable position cooling apparatus
US7411791B2 (en) * 2005-07-08 2008-08-12 Asustek Computer Inc. Extendable heat dissipation apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140124173A1 (en) * 2009-10-29 2014-05-08 Wistron Corporation Heat dissipating device and heat dissipating fin
US9562725B2 (en) * 2009-10-29 2017-02-07 Wistron Corporation Heat dissipating device and heat dissipating fin
US20170307304A1 (en) * 2014-11-10 2017-10-26 Furukawa Electric Co., Ltd. Heat sink
US11432432B2 (en) * 2017-04-28 2022-08-30 Huawei Technologies Co., Ltd. Heat dissipation apparatus, heat dissipator, electronic device, and heat dissipation control method
US20210345519A1 (en) * 2020-06-29 2021-11-04 Intel Corporation Technologies for reconfigurable heat sinks

Also Published As

Publication number Publication date
CN101908513B (en) 2012-05-30
CN101908513A (en) 2010-12-08

Similar Documents

Publication Publication Date Title
US20100307718A1 (en) Heat sink
US8002019B2 (en) Heat dissipation device
US7760501B2 (en) Heat dissipation apparatus
US7990699B2 (en) Heat dissipation device for memory module
US20080093056A1 (en) Thermal module
US7619888B2 (en) Flat heat column and heat dissipating apparatus thereof
US20100319880A1 (en) Heat dissipation device and manufacturing method thereof
US20110186269A1 (en) Thermal module
US20110171899A1 (en) Airflow guide
US20110127012A1 (en) Heat dissipation device
US6964295B1 (en) Heat dissipation device
US8724323B2 (en) Electronic device with heat dissipation apparatus
US20150043148A1 (en) Server and heat dissipating assembly thereof
US20110290455A1 (en) Heat dissipating apparatus
US6988536B2 (en) Tubular heat dissipation device
US20100149749A1 (en) Heat dissipation apparatus
US20120224329A1 (en) Portable electronic device with enhanced heat dissipation
US7688590B2 (en) Thermal module and electronic apparatus using the same
US20100053892A1 (en) Electronic device and heat sink thereof
CN102830772A (en) Radiating device
US20130170133A1 (en) Heat dissipating apparatus
US20070215319A1 (en) Heat dissipation device having a bracket
US20100264790A1 (en) Computer enclosure
US6968890B1 (en) Heat sink
US20140218864A1 (en) Electronic device with cooling assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, MING-KE;YE, ZHEN-XING;REEL/FRAME:022986/0346

Effective date: 20090626

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, MING-KE;YE, ZHEN-XING;REEL/FRAME:022986/0346

Effective date: 20090626

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION