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US20100276712A1 - Light emitting diode with thin multilayer phosphor film - Google Patents

Light emitting diode with thin multilayer phosphor film Download PDF

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Publication number
US20100276712A1
US20100276712A1 US12/611,364 US61136409A US2010276712A1 US 20100276712 A1 US20100276712 A1 US 20100276712A1 US 61136409 A US61136409 A US 61136409A US 2010276712 A1 US2010276712 A1 US 2010276712A1
Authority
US
United States
Prior art keywords
phosphor
light emitting
curable
mixture
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/611,364
Other languages
English (en)
Inventor
Alexander Shaikevitch
Rene Helbing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bridgelux Inc
Original Assignee
Bridgelux Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43029736&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20100276712(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bridgelux Inc filed Critical Bridgelux Inc
Priority to US12/611,364 priority Critical patent/US20100276712A1/en
Assigned to BRIDGELUX, INC. reassignment BRIDGELUX, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHAIKEVITCH, ALEXANDER, HELBING, RENE
Priority to US12/836,852 priority patent/US7973465B2/en
Priority to PCT/US2010/054966 priority patent/WO2011056751A1/en
Priority to TW099137605A priority patent/TWI599075B/zh
Publication of US20100276712A1 publication Critical patent/US20100276712A1/en
Assigned to WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT reassignment WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT SECURITY AGREEMENT Assignors: BRIDGELUX, INC.
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Definitions

  • the present disclosure relates to light emitting diodes with a thin phosphor layer.
  • LEDs solid state devices
  • LEDs have substantially higher light conversion efficiencies than incandescent lamps and longer lifetimes than both types of conventional light sources.
  • some types of LEDs now have higher conversion efficiencies than fluorescent light sources and still higher conversion efficiencies have been demonstrated in the laboratory.
  • LEDs require lower voltages than fluorescent lamps, and therefore, provide various power saving benefits.
  • LEDs produce light in a relatively narrow spectrum.
  • LED-based sources that produce broad-spectrum (e.g., white) light are needed.
  • One way to produce white light is to encapsulate blue or ultra-violet (UV) LEDs in a phosphor material.
  • the phosphor material converts monochromatic light emitted from the blue or UV LEDs to white light.
  • the phosphor material is generally formed by introducing a suspension of phosphor particles into a carrier (e.g., silicone), encapsulating the LEDs in the carrier, and curing the carrier to provide a solid layer of material in which the phosphor particles will remain suspended.
  • a carrier e.g., silicone
  • silicone is a poor thermal conductor, and when illuminated, phosphors generate heat.
  • the cured silicone may crack and/or have a reduced lifetime.
  • a method of manufacturing a film includes dispensing a mixture including phosphor and an uncurable fluid onto a surface, and at least partially drying the mixture.
  • a curable fluid is dispensed onto the at least partially dried mixture, and the curable fluid is cured.
  • an article of manufacture is prepared by a process including dispensing a mixture including phosphor and an uncurable fluid onto a surface, and at least partially drying the mixture.
  • a curable fluid is dispensed onto the at least partially dried mixture, and the curable fluid is cured.
  • an apparatus in yet another aspect of the disclosure, includes a phosphor bearing film including phosphor and a carrier, and a rigid film on the phosphor bearing film.
  • the phosphor bearing film is 60%-80% phosphor.
  • FIG. 1 is a flow chart illustrating an example of a process of manufacturing a film
  • FIG. 2 is a flow chart illustrating a detail of the process of FIGS. 1 ;
  • FIG. 3 is a schematic illustration showing a cross section of a light emitting device.
  • the film may include a phosphor bearing layer with phosphor.
  • the phosphor coating includes a suspension of phosphor particles in a silicone carrier, wherein the silicone carrier is cured to produce a solid layer in which the phosphor particles remain suspended.
  • the silicone carrier is cured to produce a solid layer in which the phosphor particles remain suspended.
  • a metallic package which may include a metal or any metal-like structure with high thermal conductivity, for example, aluminum or copper, mounted on a heat sink.
  • heat from the phosphor can travel downward, that is, through the LED die or directly through the package, to escape to the environment by way of the heat sink.
  • the poor thermal conductivity of the silicone can limit the effectiveness of this configuration.
  • a relatively thin phosphor layer may be created by suspending the phosphor within a low viscosity silicone (e.g., having a viscosity of 300-320 cP).
  • a low viscosity silicone e.g., having a viscosity of 300-320 cP.
  • the percentage of phosphor dispersed in this silicone is generally limited to 33-35%. Increases in phosphor concentration above this range may lead to difficulties in dispensing such as incomplete coverage of the die or dies, uneven surfaces, etc.
  • a further improvement to an apparatus having a thin phosphor layer may be achieved by utilizing a process such as electrophoresis, in which an electric field applied to the suspension of phosphor in the silicone creates motion of the phosphor toward the surfaces on which it is desired that they settle, allowing a portion of the phosphor to settle on the side walls of the die.
  • a process such as electrophoresis, in which an electric field applied to the suspension of phosphor in the silicone creates motion of the phosphor toward the surfaces on which it is desired that they settle, allowing a portion of the phosphor to settle on the side walls of the die.
  • this process utilizes specialized equipment and generally implies a high level of investment.
  • the process may result in an only partial sedimentation, wherein the clear silicone layer is relatively soft and/or flexible, and again, the thermal dissipation is less effective than desired.
  • a representative embodiment of the present invention provides a process for manufacturing a film.
  • Uncurable silicone 101 and treated silica 102 are combined to form mixture A 103 .
  • the uncurable silicone may be a silicone fluid having a low viscosity, which does not substantially harden when subjected to a curing process.
  • the uncurable fluid may be a fluid other than silicone that provides for a suitable viscosity and binding of the mixture.
  • Treated silica 102 may be a silica powder that has been treated with a coating of organic molecules that improve the dispersion of the silica in the silicone fluid.
  • the silica 102 may not be treated, and in some embodiments the silica 102 may be omitted in its entirety.
  • Phosphor 104 is added to mixture A 103 to produce mixture B 105 .
  • Phosphor 104 may be a powder or other phosphor particles.
  • Phosphor 104 may include one or more colors or types of phosphor generally adapted to emit visible light when excited by radiation from a device such as an LED.
  • an additional step includes adding a small amount of curable silicone to the phosphor bearing mixture to enable a degree of hardening of a phosphor carrier during the curing process, described later.
  • mixture B 105 is stabilized by performing a sonication process.
  • Sonication refers generally to the application of sound (e.g., ultrasound) energy to a composition, to agitate particles within the composition. This process stabilizes the mixture B 105 , resulting in a substantially homogeneous suspension of phosphor in the silicone fluid.
  • the stabilized mixture is dispensed onto a surface.
  • the surface may be portions of a packaged and wire-bonded light emitting device, including a top and side surfaces of an LED, and an inner surface of the package itself.
  • an inner surface may be an inside surface of a concave or enclosed package, or a top surface of a substantially flat package, etc.
  • the mixture may be substantially homogeneous, and with the addition of the treated silica to improve the viscosity and flow of the mixture, a uniform, concentrated phosphor bearing film is formed.
  • the phosphor bearing film may be of a uniform thickness on the top and side wall surfaces of the LED die, as well as other surfaces of the package.
  • the phosphor bearing film is at least partially dried. That is, heat and/or a partial vacuum may be applied to the film to evaporate at least a portion of at least one liquid constituent of the phosphor bearing film, such as the uncurable silicone 101 . In some embodiments, partially drying as in block 108 results in a thick (i.e., highly viscous), paste-like semisolid film.
  • FIG. 2 is an expanded flow chart illustrating further details of block 109 .
  • a curable silicone 901 is dispensed onto a surface of the partially dried phosphor bearing layer.
  • the curable silicone 901 may be any suitable fluid such as silicone, which hardens or becomes more rigid when subjected to a curing process.
  • the film, including the partially dried phosphor bearing film and the curable silicone film are subjected to a further drying process. That is, the partially dried phosphor bearing film is further dried by exposing the layers to a partial vacuum and/or a heightened temperature. In this way, at least one liquid constituent of the phosphor bearing film, such as the uncurable silicone, evaporates through the curable silicone film and the phosphor bearing film dries.
  • the film is subjected to a curing process, such that the curable silicone film hardens and forms a protective layer over the phosphor bearing film.
  • the cured silicone film thus provides mechanical strength and protects the phosphor bearing film, while substantially not hindering the transfer of heat from the phosphor bearing film downward through the die and/or package to a heat sink.
  • a process for manufacturing a film includes mixing 6.24 g of uncurable silicone fluid such as Dow Corning® OS-30 with 0.28 g of treated silica such as Cab-o-sil® TS-720 in a centrifugal mixer for 3 to 5 minutes at 1000 to 3000 RPM.
  • uncurable silicone fluid such as Dow Corning® OS-30
  • treated silica such as Cab-o-sil® TS-720
  • 1 g of phosphor is mixed into the mixture utilizing the same mixer.
  • curable silicone such as Dow Corning® JCR6122
  • a Hielscher® UP-400S at a power of 70 to 90 W.
  • An amount, for example, a predetermined amount of the composition is dispensed into the package that includes a wire bonded LED die affixed to the package utilizing epoxy.
  • the package is dried in a drying oven at 70 C and 10 inches Hg for 10-12 minutes, that is, until the phosphor-bearing composition acquires a thick, paste-like semisolid form.
  • the package is taken out of the drying oven, and a thin layer of curable silicone, such as JCR6122 is dispensed on top of the partially dried phosphor bearing layer.
  • the package is then returned to the drying oven, and further dried for 30 minutes at 30 inches Hg and 70 C.
  • the package may be inspected for cracks in the phosphor bearing layer in and around the die area (minor cracking at a periphery of the inner surface of the package, for example, where a rubber ring is placed, may be acceptable).
  • the package is then placed in a convection oven for 1 hour at 150 C to cure the curable silicone.
  • FIG. 3 is a schematic illustration of an exemplary apparatus, showing a cross-section of a light emitting device.
  • a light emitting diode 301 is coated with a film including a phosphor bearing layer 302 and a rigid layer 303 .
  • the light emitting diode may be a semiconductor device or any other suitable device for emitting light.
  • the phosphor bearing layer 302 may include a high concentration of phosphor (e.g., from 60% to 80% phosphor), and may include treated silica and an uncurable fluid such as uncurable silicone.
  • the phosphor bearing layer 301 is substantially dry, that is, substantial portions of the uncurable fluid have been removed from the layer.
  • the LED 301 may be attached to a package 305 utilizing an adhesive 304 .
  • the adhesive may be any suitable material for fastening the die 301 to the package 305 , such as epoxy.
  • the package 305 may be any suitable material for potting or enclosing the light emitting device.
  • the package 305 is a metallic material, that is, any material with metal-like properties including a high thermal conductivity, thus enabling the dissipation of heat from the device to a heat sink 306 .
  • the heat sink 306 may be a thermally conductive apparatus for transferring heat from the light emitting device to the environment.
  • portions of the phosphor bearing film 302 are on an inner surface 307 of the package 305 .
  • Heat generated by the phosphor bearing layer 302 easily passes to the package 305 either at a direct point of contact at an inner surface 307 of the package 305 , through the die 301 , or through intermediate layers such as the epoxy layer 304 .

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
US12/611,364 2009-11-03 2009-11-03 Light emitting diode with thin multilayer phosphor film Abandoned US20100276712A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/611,364 US20100276712A1 (en) 2009-11-03 2009-11-03 Light emitting diode with thin multilayer phosphor film
US12/836,852 US7973465B2 (en) 2009-11-03 2010-07-15 Light emitting diode with thin multilayer phosphor film
PCT/US2010/054966 WO2011056751A1 (en) 2009-11-03 2010-11-01 Light emitting diode with thin multilayer phosphor film
TW099137605A TWI599075B (zh) 2009-11-03 2010-11-02 具含螢光多層式薄膜之發光二極體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/611,364 US20100276712A1 (en) 2009-11-03 2009-11-03 Light emitting diode with thin multilayer phosphor film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/836,852 Division US7973465B2 (en) 2009-11-03 2010-07-15 Light emitting diode with thin multilayer phosphor film

Publications (1)

Publication Number Publication Date
US20100276712A1 true US20100276712A1 (en) 2010-11-04

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ID=43029736

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Application Number Title Priority Date Filing Date
US12/611,364 Abandoned US20100276712A1 (en) 2009-11-03 2009-11-03 Light emitting diode with thin multilayer phosphor film
US12/836,852 Active US7973465B2 (en) 2009-11-03 2010-07-15 Light emitting diode with thin multilayer phosphor film

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Application Number Title Priority Date Filing Date
US12/836,852 Active US7973465B2 (en) 2009-11-03 2010-07-15 Light emitting diode with thin multilayer phosphor film

Country Status (3)

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US (2) US20100276712A1 (zh)
TW (1) TWI599075B (zh)
WO (1) WO2011056751A1 (zh)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130234186A1 (en) * 2012-03-06 2013-09-12 Nitto Denko Corporation Encapsulating sheet, light emitting diode device, and producing method thereof
US8890199B2 (en) * 2013-03-05 2014-11-18 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing the same
EP2546898A3 (en) * 2011-06-16 2015-03-18 Nitto Denko Corporation Phosphor adhesive sheet, light emitting diode element including phosphor layer, light emitting diode device, and producing methods thereof
US20150179903A1 (en) * 2012-06-11 2015-06-25 Cree, Inc. Led package with multiple element light source and encapsulant having curved and/or planar surfaces
US20150270451A1 (en) * 2014-03-18 2015-09-24 GE Lighting Solutions, LLC Heavily phosphor loaded led packages having higher stability
WO2015179542A1 (en) * 2014-05-21 2015-11-26 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
US9590148B2 (en) 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
JP2017120802A (ja) * 2015-12-28 2017-07-06 日亜化学工業株式会社 発光装置およびその製造方法
US9818919B2 (en) 2012-06-11 2017-11-14 Cree, Inc. LED package with multiple element light source and encapsulant having planar surfaces
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US20180248086A1 (en) * 2015-03-18 2018-08-30 Qingdao Jason Electric Co., Ltd. Deep ultraviolet light source and packaging method therefor
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US10431568B2 (en) 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
CN110828640A (zh) * 2019-11-15 2020-02-21 江西维真显示科技有限公司 一种便携式3d-led模组及其封装方法
US10600939B2 (en) 2010-12-02 2020-03-24 Intematix, Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor
CN114566492A (zh) * 2022-01-19 2022-05-31 苏州工业园区客临和鑫电器有限公司 一种基于芯片级封装的可自调色温的led柔性灯丝制备方法

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US8956892B2 (en) * 2012-01-10 2015-02-17 Asm Technology Singapore Pte. Ltd. Method and apparatus for fabricating a light-emitting diode package
CN118630121B (zh) * 2024-08-10 2024-11-08 南通东升灯饰有限公司 一种led封装体

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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600939B2 (en) 2010-12-02 2020-03-24 Intematix, Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
EP2546898A3 (en) * 2011-06-16 2015-03-18 Nitto Denko Corporation Phosphor adhesive sheet, light emitting diode element including phosphor layer, light emitting diode device, and producing methods thereof
US20130234186A1 (en) * 2012-03-06 2013-09-12 Nitto Denko Corporation Encapsulating sheet, light emitting diode device, and producing method thereof
US20150087095A1 (en) * 2012-03-06 2015-03-26 Nitto Denko Corporation Encapsulating sheet, light emitting diode device, and producing method thereof
US8937329B2 (en) * 2012-03-06 2015-01-20 Nitto Denko Corporation Encapsulating sheet, light emitting diode device, and producing method thereof
US20150179903A1 (en) * 2012-06-11 2015-06-25 Cree, Inc. Led package with multiple element light source and encapsulant having curved and/or planar surfaces
US9865780B2 (en) 2012-06-11 2018-01-09 Cree, Inc. LED package with encapsulant having planar surfaces
US11424394B2 (en) 2012-06-11 2022-08-23 Creeled, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US10468565B2 (en) * 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US9818919B2 (en) 2012-06-11 2017-11-14 Cree, Inc. LED package with multiple element light source and encapsulant having planar surfaces
US8890199B2 (en) * 2013-03-05 2014-11-18 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing the same
US20150270451A1 (en) * 2014-03-18 2015-09-24 GE Lighting Solutions, LLC Heavily phosphor loaded led packages having higher stability
US9680067B2 (en) * 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
US9590148B2 (en) 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
CN106471598A (zh) * 2014-05-21 2017-03-01 英特曼帝克司公司 用于光致发光波长转换式固态发光装置及布置的材料
US9318670B2 (en) * 2014-05-21 2016-04-19 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
WO2015179542A1 (en) * 2014-05-21 2015-11-26 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
US10431568B2 (en) 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
US20180248086A1 (en) * 2015-03-18 2018-08-30 Qingdao Jason Electric Co., Ltd. Deep ultraviolet light source and packaging method therefor
JP2017120802A (ja) * 2015-12-28 2017-07-06 日亜化学工業株式会社 発光装置およびその製造方法
US10038125B2 (en) 2015-12-28 2018-07-31 Nichia Corporation Light-emitting device and method for manufacturing the same
CN110828640A (zh) * 2019-11-15 2020-02-21 江西维真显示科技有限公司 一种便携式3d-led模组及其封装方法
CN114566492A (zh) * 2022-01-19 2022-05-31 苏州工业园区客临和鑫电器有限公司 一种基于芯片级封装的可自调色温的led柔性灯丝制备方法

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