US20100231429A1 - Direct capacitance-to-digital converter - Google Patents
Direct capacitance-to-digital converter Download PDFInfo
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- US20100231429A1 US20100231429A1 US12/401,621 US40162109A US2010231429A1 US 20100231429 A1 US20100231429 A1 US 20100231429A1 US 40162109 A US40162109 A US 40162109A US 2010231429 A1 US2010231429 A1 US 2010231429A1
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- 239000003990 capacitor Substances 0.000 claims abstract description 178
- 230000010354 integration Effects 0.000 claims description 10
- 230000001939 inductive effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M3/00—Conversion of analogue values to or from differential modulation
- H03M3/30—Delta-sigma modulation
- H03M3/38—Calibration
- H03M3/382—Calibration at one point of the transfer characteristic, i.e. by adjusting a single reference value, e.g. bias or gain error
- H03M3/384—Offset correction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M3/00—Conversion of analogue values to or from differential modulation
- H03M3/30—Delta-sigma modulation
- H03M3/39—Structural details of delta-sigma modulators, e.g. incremental delta-sigma modulators
- H03M3/412—Structural details of delta-sigma modulators, e.g. incremental delta-sigma modulators characterised by the number of quantisers and their type and resolution
- H03M3/422—Structural details of delta-sigma modulators, e.g. incremental delta-sigma modulators characterised by the number of quantisers and their type and resolution having one quantiser only
- H03M3/43—Structural details of delta-sigma modulators, e.g. incremental delta-sigma modulators characterised by the number of quantisers and their type and resolution having one quantiser only the quantiser being a single bit one
Definitions
- the present invention generally relates to a direct capacitance-to-digital converter, and more specifically to a converter able to directly sensing the capacitance and converting to precise digital signal without external amplifier.
- ADC analog-to-digital converters
- the analog electrical signal is usually generated by sensors, such as, voltage sensor, luminance sensor, temperature sensor, ultrasonic sensor, speed sensor or humidity sensor.
- MEMS Microelectro-mechanical System
- Wii Wii from Nintendo uses a MEMS-based three-axial acceleration sensor to work with wireless controller to achieve the highly creative entertainment.
- touch panel is another popular application.
- FIG. 1 shows a schematic view of a functional diagram of the conventional apparatus for converting inductive capacitance.
- an apparatus 1 for converting inductive capacitance includes a sensor 10 , a sensor amplifier 20 , a bias circuit 30 and ADC 40 , where sensor amplifier 20 amplifies the output signal from sensor 10 , and ADC 40 converts into digital signals.
- Bias circuitry 30 provides suitable bias voltage for sensor amplifier 20 and ADC 40 .
- FIG. 2 shows a detailed view of FIG. 1 .
- the electric model of sensor 10 shows a capacitor CS and equivalent input impedance R.
- Capacitor CS has a capacitance change ⁇ CS caused by the external environmental change.
- capacitor CS voltage change is ⁇ VCS, which is amplified by sensor amplifier 20 and input to ADC 40 .
- ADC 40 includes a first-stage converter circuit 41 and a comparator 45 , where first-stage converter circuit 41 further includes a subtracter 42 , an adder 43 , a delay relay 44 and a digital-to-analog converter (DAC) 46 .
- DAC digital-to-analog converter
- DAC 46 converts the digital output signal Vout from comparator 45 into analog signal.
- Subtracter 42 finds the difference between the output signal of sensor amplifier 20 and the output signal of DAC 46 .
- Adder 43 adds the output signal of delay relay 44 to the difference, and outputs to delay relay 44 so as to complete the entire ADC operation.
- ⁇ - ⁇ ADC is a commonly known technique, the above description is only to highlight the key points.
- stray capacitor C 2 is connected to capacitor CS and ground. Stray capacitor is an additional equivalent capacitor generated by errors in manufacturing process or circuit layout, and the capacitance of capacitor C 2 will vary with different manufacturing process and circuit.
- a structure with a plurality of serial stages is usually used. That is, the output signal of first-stage converter circuit 41 can be passed to the next stage converter circuit, and the last stage converter circuit is connected to the comparator.
- the conventional technique has the drawback of requiring a bias circuit able to generate a bias voltage and a first-stage amplifier so as to increase the sensing sensitivity.
- it is a difficult challenge for the general IC fabrication process to overcome the noise in the bias circuit, and also difficult to integrate into the other existing function blocks operating at low voltage.
- Another drawback of the conventional technique is requiring a high quality amplifier to amplify the low inductive voltage to the voltage range processable by ADC.
- the amplifier requires a large size chip area, the chip cost increases and the offset, gain and noise of the amplifier will also increase the signal error.
- the primary object of the present invention is to provide a direct capacitance-to-digital converter, by using a trigger unit to control a plurality of switches, combining with reference voltage outputted by reference voltage circuit to directly measure the to-be-measured capacitance change and directly convert into digital signal so as to improve the accuracy of the digital signal, as well as integrating plural switches, converter, reference voltage circuit, and controller into a single chip to form an integrated single-chip without the extra external high voltage bias circuit and high quality sensor amplifier.
- Another object of the present invention is to provide a direct capacitance-to-digital converter, by using a differential ADC having a differential integrator to convert the inductive capacitance of the to-be-measured element into digital signal in a differential manner so as to improve the anti-interference of noise.
- the direct capacitance-to-digital convert of the present invention can solve the drawbacks caused by the stray capacitance of the to-be-measured element.
- FIG. 1 shows a functional block diagram of a conventional apparatus for converting the inductive capacitance to voltage
- FIG. 2 shows a detailed schematic view of FIG. 1 ;
- FIG. 3 shows a functional block diagram of an ADC converter according to the present invention
- FIG. 4 shows a detailed schematic view of FIG. 3 ;
- FIG. 5 shows a schematic view of the first operation of the first embodiment of the present invention
- FIG. 6 shows the waveform of FIG. 5 ;
- FIG. 7 shows a schematic view of the second operation of the first embodiment of the present invention.
- FIG. 8 shows the waveform of FIG. 7 ;
- FIG. 9 shows a schematic view of the second embodiment of the first operation of the embodiment.
- FIG. 10 shows the waveform of FIG. 9 ;
- FIG. 11 shows a schematic view of the second embodiment of the present invention.
- FIG. 12 shows a schematic view of the second-stage integrator and the comparator of the second embodiment of the present invention.
- FIG. 3 shows a schematic view of the functional block diagram of the direct capacitance-to-digital converter of the present invention.
- a direct capacitance-to-digital converter 2 of the present invention includes an ADC 50 and a trigger unit 60 , for sensing the capacitance of to-be-measured capacitor C 1 , and stray capacitor C 2 being the stray capacitance generated by the manufacturing process and being related to capacitor C 1 , where ADC 50 includes a a first-stage integrator 51 , a second-stage integrator 53 and a comparator 55 .
- Trigger unit 60 controls a first end P 1 and a second end P 2 of to capacitor C 1 , where stray capacitor C 2 is connected to second end P 2 of to-be-measured capacitor C 1 , and trigger unit 60 controls first-stage integrator 51 of ADC 50 .
- Second-stage integrator 53 and comparator 55 can be implemented with general integrator and comparator. It is worth noting that second-stage integrator 53 can be plural serially-connected integrators to improve the resolution.
- FIG. 4 shows a detailed schematic view of FIG. 3 .
- FIG. 4 shows the circuit of first-stage integrator 51 .
- First-stage integrator 51 includes a DAC capacitor C 3 , an external compensation capacitor C 4 , an amplifier OP 1 , an integral capacitor CT, a first switch SW 1 , a second switch SW 2 , a third switch SW 3 , a fourth switch SW 4 , a fifth switch SW 5 , a sixth switch SW 6 , a seventh switch SW 7 , an eighth SW 8 and a ninth switch SW 9 , where all the switches SW 1 -SW 9 are controlled by a first switch signal ⁇ 1 , a second switch signal ⁇ 2 , a third switch signal ⁇ 3 , a third inverted switch signal ⁇ 3 B, a fourth switch signal ⁇ 4 and a fifth switch signal ⁇ 5 generated by trigger unit 60 , for performing charging and discharging on capacitor C 1 , stray capacitor C 2 , DAC capacitor C 3 and external compensation capacitor C 4 , while using
- Bias voltage Vbias of FIG. 4 is generated by a bias circuit (not shown), and first reference voltage V 1 , second reference voltage V 2 , third reference voltage V 3 , high level reference voltage VR+ and low level reference voltage VR ⁇ are generated by reference circuit (not shown), where third reference voltage V 3 is higher than second reference voltage V 2 , second reference voltage V 2 is higher than first reference voltage V 1 , and high level reference voltage VR+ is higher than low level reference voltage VR ⁇ .
- Bias circuit and reference circuit can be implemented with general technology, such as Wilson current mirror or Widlar current source as the bias circuit, and breakdown diode with temperature compensation circuit or bandgap reference circuit as the reference circuit. It is worth noting that the present invention is not limited to any specific implementation of the bias circuit or the reference circuit. Any implementation able to provide required bias voltage and reference voltage is within the scope of the present invention.
- trigger unit 60 is for generating the switch signals. Therefore, trigger unit 60 implemented by, such as, microprocessor with firmware or logic circuit, is also within the scope of the present invention.
- DAC capacitor C 3 uses high level reference voltage VR+ and low level reference voltage VR ⁇ to realize the DAC function. That is, when comparator 55 outputs a bit “ 1 ”, third switch signal ⁇ 3 or fifth switch signal ⁇ 5 generated by trigger unit 60 uses high level reference voltage VR+ to charge DAC capacitor C 3 . When comparator 55 outputs a bit “ 0 ”, third inverted switch signal ⁇ 3 B or fourth switch signal ⁇ 5 generated by trigger unit 60 uses low level reference voltage VR ⁇ to charge DAC capacitor C 3 . That is, the digital bit “ 1 ” is converted into analog high level reference voltage VR+ and digital bit “ 0 ” is converted into analog low level reference voltage VR ⁇ .
- External compensation capacitor C 4 is to compensate the parasitic capacitance, and can be implemented by using capacitor array and the internal circuit performing self-rectification of a plurality of bits, or using laser trimming or current trimming to perform the fine-tuning of a plurality of bits.
- the operation of direct capacitance-to-digital converter 2 of the present invention includes a first operation and a second operation, where the first operation is for sensing the stray capacitance C 2 and the second operation is to combine with the result of the first operation to perform conversion of the to-be-measured capacitor C 1 so as to generate accurate digital signal.
- FIG. 5 shows a schematic view of the first operation of the first embodiment of the present invention.
- first switch signal ⁇ 1 , second switch signal ⁇ 2 , third switch signal ⁇ 3 and third inverted switch signal ⁇ 3 B generated by trigger unit 60 are used to control switches SW 1 -SW 9 .
- the following description also refers to the waveform of FIG. 6 .
- the operation waveforms of first switch signal ⁇ 1 , second switch signal ⁇ 2 , third switch signal ⁇ 3 and third inverted switch signal ⁇ 3 B are divided into three steps, including reset operation, charge operation and integral operation for setting first end voltage VP 1 of first end P 1 to first reference voltage V 1 , third reference voltage V 3 or second reference voltage V 2 .
- first switch signal ⁇ 1 is at high level
- second switch signal ⁇ 2 and third switch signal ⁇ 3 are at low level
- third inverted switch signal ⁇ 3 B is at high level. Therefore, first end P 1 and second end P 2 are connected to first reference voltage V 1 to discharge capacitor C 1 and the cross-over voltage is 0V, while stray capacitor C 2 is also dicharged to 0V if select right voltage V 1 (note, the symbol “ground” in the schematic is a reference ground, it can be any voltage).
- second switch signal ⁇ 2 is at high level
- first switch signal ⁇ 1 and third switch signal ⁇ 3 are at low level
- third inverted switch signal ⁇ 3 B is at high level. Therefore, first end P 1 and second end P 2 are connected to third reference voltage V 3 so that the cross-over voltage of capacitor C 1 remains 0V, while stray capacitor C 2 is charged from first reference voltage V 1 to third reference voltage V 3 .
- third switch signal ⁇ 3 is at high level
- first switch signal ⁇ 1 , second switch signal ⁇ 2 and third inverted switch signal ⁇ 3 B are at low level. Therefore, first end P 1 is connected to second reference voltage V 2 , and second end P 2 is connected to inverted input end of amplifier OP 1 .
- the charge transfer to OP 1 is C 2 *(V 2 ⁇ V 3 ).
- DAC capacitor C 3 is switched from high level reference voltage VR+ to low level reference voltage VR ⁇ .
- External compensation capacitor C 4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP 1 .
- Amplifier OP 1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout 1 related to stray capacitor C 2 at the output end of amplifier OP 1 .
- the total time for the reset operation and the charge operation is T 1 /2, and the time for integral operation is T 1 /2, where T 1 is the first operation period.
- FIG. 7 shows a schematic view of the second operation of the first embodiment of the present invention.
- fourth switch signal ⁇ 4 and fifth switch signal ⁇ 5 generated by trigger unit 60 are used to control switches SW 1 -SW 9 .
- the following description also refers to the waveform of FIG. 8 .
- the operation waveforms of fourth switch signal ⁇ 4 and fifth switch signal ⁇ 5 are divided into two steps, including charge operation and integral operation.
- fourth switch signal ⁇ 4 is at high level
- fifth switch signal ⁇ 5 is at low level. Therefore, first end P 1 of capacitor C 1 is connected to second reference voltage V 2 , and second end P 2 is connected to first reference voltage V 1 so that the cross-over voltage of capacitor C 1 is V 1 -V 2 . Stray capacitor C 2 is charged to first reference voltage V 1 . (note, the ground symbol in the schematic is stand for reference ground level, it could be any voltage).
- First end of DAC capacitor C 3 and first end of external compensation capacitor C 4 are connected to second end P 2 of capacitor C 1 .
- Second end of DAC capacitor C 3 is connected to high level reference voltage VR+, and second end of external compensation capacitor C 4 is connected to bias voltage Vbias.
- the time for charge operation is T 2 /2, where T 2 is the second operation period.
- fifth switch signal ⁇ 5 is at high level
- fourth switch signal ⁇ 4 is at low level. Therefore, first end P 1 of capacitor C 1 is connected to first reference voltage V 1 , and second end P 2 is connected to inverted input end of amplifier OP 1 .
- DAC capacitor C 3 is switched from high level reference voltage VR+ to low level reference voltage VR ⁇ .
- External compensation capacitor C 4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP 1 .
- Amplifier OP 1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout 1 related to capacitor C 1 at the output end of amplifier OP 1 .
- the time for integral operation is T 2 /2, and therefore the time for charge operation is the same as the time for integral operation.
- the accurate digital signals can be obtained through first integrator output voltage Vout 1 generated by the aforementioned first and the second operations.
- the first operation of the present invention can also have different order and voltage to achieve the identical result.
- first switch signal ⁇ 1 , second switch signal ⁇ 2 , third switch signal ⁇ 3 and third inverted switch signal ⁇ 3 B generated by trigger unit 60 are used to control switches SW 1 -SW 9 .
- the following description also refers to the waveform of FIG. 10 .
- the operation waveforms of first switch signal ⁇ 1 , second switch signal ⁇ 2 , third switch signal ⁇ 3 and third inverted switch signal ⁇ 3 B are divided into two steps, including charge operation and integral operation.
- first switch signal ⁇ 1 is at high level
- second switch signal ⁇ 2 and third switch signal ⁇ 3 are at low level
- third inverted switch signal ⁇ 3 B is at high level. Therefore, first end P 1 and second end P 2 are connected to first reference voltage V 1 to discharge capacitor C 1 and the cross-over voltage is 0V, while stray capacitor C 2 is charged to first reference voltage V 1 .
- second switch signal ⁇ 2 and third switch signal ⁇ 3 are at high level, while first switch signal ⁇ 1 and third inverted switch signal ⁇ 3 B are at low level. Therefore, first end P 1 is connected to second reference voltage V 2 , and second end P 2 is connected to inverted input end of amplifier OP 1 .
- DAC capacitor C 3 is switched from high level reference voltage VR+ to low level reference voltage VR ⁇ .
- External compensation capacitor C 4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP 1 .
- Amplifier OP 1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout 1 related to stray capacitor C 2 at the output end of amplifier OP 1 .
- the “ground reference” symbol can be any voltage.
- the time for the charge operation is T 1 /2, and the time for integral operation is T 1 /2, where T 1 is the first operation period.
- FIG. 11 shows a schematic view of a second embodiment of the present invention.
- the second embodiment of the present invention uses differential amplifier to replace the single-ended amplifier of the first embodiment. That is, a differential amplifier OP 1 D is used to replace amplifier OP 1 of FIG. 4 .
- inverted integration capacitor CT 1 and non-inverted integration capacitor CT 2 are used to replace integration capacitor CT of FIG. 4 .
- the differential to-be-measure capacitor formed by inverted to-be-measured capacitor C 1 a and non-inverted to-be-measured capacitor C 1 b replaces to-be-measured capacitor C 1 , where the voltages at the two ends of inverted to-be-measured capacitor C 1 a and non-inverted to-be-measured capacitor C 1 b are controlled by trigger unit 60 .
- a differential stray capacitor formed by inverted stray capacitor C 2 a and non-inverted stray capacitor C 2 b replaces stray capacitor C 2
- a differential DAC capacitor formed by inverted DAC capacitor C 3 a and non-inverted DAC capacitor C 3 b replaces DAC capacitor C 3
- a differential external compensation capacitor formed by inverted external compensation capacitor C 4 a and non-inverted external compensation capacitor C 4 b replaces external compensation capacitor C 4 .
- FIG. 12 shows a schematic view of the second-stage integrator and the comparator of the second embodiment of the present invention.
- the second-stage integrator of the second embodiment includes a differential amplifier OP 2 D, an inverted integration capacitor C 7 a, and non-inverted integration capacitor C 7 b.
- Comparator Comp is a differential comparator.
- Inverted DAC capacitor C 6 a and non-inverted DAC capacitor C 6 b are to realize the function of DAC, as DAC capacitor C 3 of the first embodiment.
- the formed differential ADC has a better anti-noise capability and is applicable to the electrical environment difficult to rid of noise.
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Abstract
Description
- The present invention generally relates to a direct capacitance-to-digital converter, and more specifically to a converter able to directly sensing the capacitance and converting to precise digital signal without external amplifier.
- With the rapid progress of digital technology and the development of semiconductor manufacturing process, the electronic industry has developed highly integrated and powerful processor or graphic chips. However, these powerful digital chips can only operate with the digital input signal, while most of the electrical signals are analog. Therefore, many analog-to-digital converters (ADC) have been developed to meet different demands, such as, high speed or high resolution ADC. The analog electrical signal is usually generated by sensors, such as, voltage sensor, luminance sensor, temperature sensor, ultrasonic sensor, speed sensor or humidity sensor. In particular, the rapid development of sensors applied to Microelectro-mechanical System (MEMS) in recent years has gained popularity in many consumer electronic products. For example, Wii from Nintendo uses a MEMS-based three-axial acceleration sensor to work with wireless controller to achieve the highly creative entertainment. In addition, touch panel is another popular application.
- These applications use sensors and amplifier to connect to ADC. Among them, Σ-Δ (sigma-delta) ADC is a common choice of ADC.
-
FIG. 1 shows a schematic view of a functional diagram of the conventional apparatus for converting inductive capacitance. As shown inFIG. 1 , anapparatus 1 for converting inductive capacitance includes asensor 10, asensor amplifier 20, abias circuit 30 andADC 40, wheresensor amplifier 20 amplifies the output signal fromsensor 10, andADC 40 converts into digital signals.Bias circuitry 30 provides suitable bias voltage forsensor amplifier 20 andADC 40. -
FIG. 2 shows a detailed view ofFIG. 1 . As shown inFIG. 2 , the electric model ofsensor 10 shows a capacitor CS and equivalent input impedance R. Capacitor CS has a capacitance change ΔCS caused by the external environmental change. Under the condition of bias voltage Vbias, capacitor CS voltage change is ΔVCS, which is amplified bysensor amplifier 20 and input toADC 40. Take a one-stage Σ-Δ ADC as an example. ADC 40 includes a first-stage converter circuit 41 and acomparator 45, where first-stage converter circuit 41 further includes asubtracter 42, anadder 43, adelay relay 44 and a digital-to-analog converter (DAC) 46.DAC 46 converts the digital output signal Vout fromcomparator 45 into analog signal.Subtracter 42 finds the difference between the output signal ofsensor amplifier 20 and the output signal ofDAC 46.Adder 43 adds the output signal ofdelay relay 44 to the difference, and outputs to delayrelay 44 so as to complete the entire ADC operation. As Σ-Δ ADC is a commonly known technique, the above description is only to highlight the key points. - In
FIG. 2 , stray capacitor C2 is connected to capacitor CS and ground. Stray capacitor is an additional equivalent capacitor generated by errors in manufacturing process or circuit layout, and the capacitance of capacitor C2 will vary with different manufacturing process and circuit. - In addition, in a conventional Σ-Δ ADC structure, to improve the resolution of ADC, a structure with a plurality of serial stages is usually used. That is, the output signal of first-
stage converter circuit 41 can be passed to the next stage converter circuit, and the last stage converter circuit is connected to the comparator. - However, the conventional technique has the drawback of requiring a bias circuit able to generate a bias voltage and a first-stage amplifier so as to increase the sensing sensitivity. However, it is a difficult challenge for the general IC fabrication process to overcome the noise in the bias circuit, and also difficult to integrate into the other existing function blocks operating at low voltage.
- Another drawback of the conventional technique is requiring a high quality amplifier to amplify the low inductive voltage to the voltage range processable by ADC. As the amplifier requires a large size chip area, the chip cost increases and the offset, gain and noise of the amplifier will also increase the signal error.
- Yet another drawback of the convention technique is the accuracy of the overall ADC by the stray capacitor due to manufacturing errors or circuit layout, which also varies with the manufacturing process and circuit, leading to the unstable ADC.
- Hence, it is imperative to devise an apparatus able to directly convert the capacitance to digital signal, by using ADC to directly convert the low level output signal to digital signal to save the sensor amplifier and the bias circuit to facilitate a smaller-size chip area, as well as eliminating the unstable problem of ADC caused by stray capacitor and increasing the ADC accuracy.
- The primary object of the present invention is to provide a direct capacitance-to-digital converter, by using a trigger unit to control a plurality of switches, combining with reference voltage outputted by reference voltage circuit to directly measure the to-be-measured capacitance change and directly convert into digital signal so as to improve the accuracy of the digital signal, as well as integrating plural switches, converter, reference voltage circuit, and controller into a single chip to form an integrated single-chip without the extra external high voltage bias circuit and high quality sensor amplifier.
- Another object of the present invention is to provide a direct capacitance-to-digital converter, by using a differential ADC having a differential integrator to convert the inductive capacitance of the to-be-measured element into digital signal in a differential manner so as to improve the anti-interference of noise.
- Hence, the direct capacitance-to-digital convert of the present invention can solve the drawbacks caused by the stray capacitance of the to-be-measured element.
- The foregoing and other objects, features, aspects and advantages of the present invention will become better understood from a careful reading of a detailed description provided herein below with appropriate reference to the accompanying drawings.
- The present invention can be understood in more detail by reading the subsequent detailed description in conjunction with the examples and references made to the accompanying drawings, wherein:
-
FIG. 1 shows a functional block diagram of a conventional apparatus for converting the inductive capacitance to voltage; -
FIG. 2 shows a detailed schematic view ofFIG. 1 ; -
FIG. 3 shows a functional block diagram of an ADC converter according to the present invention; -
FIG. 4 shows a detailed schematic view ofFIG. 3 ; -
FIG. 5 shows a schematic view of the first operation of the first embodiment of the present invention; -
FIG. 6 shows the waveform ofFIG. 5 ; -
FIG. 7 shows a schematic view of the second operation of the first embodiment of the present invention; -
FIG. 8 shows the waveform ofFIG. 7 ; -
FIG. 9 shows a schematic view of the second embodiment of the first operation of the embodiment; -
FIG. 10 shows the waveform ofFIG. 9 ; -
FIG. 11 shows a schematic view of the second embodiment of the present invention; and -
FIG. 12 shows a schematic view of the second-stage integrator and the comparator of the second embodiment of the present invention. -
FIG. 3 shows a schematic view of the functional block diagram of the direct capacitance-to-digital converter of the present invention. As shown inFIG. 3 , a direct capacitance-to-digital converter 2 of the present invention includes anADC 50 and atrigger unit 60, for sensing the capacitance of to-be-measured capacitor C1, and stray capacitor C2 being the stray capacitance generated by the manufacturing process and being related to capacitor C1, where ADC 50 includes a a first-stage integrator 51, a second-stage integrator 53 and acomparator 55.Trigger unit 60 controls a first end P1 and a second end P2 of to capacitor C1, where stray capacitor C2 is connected to second end P2 of to-be-measured capacitor C1, andtrigger unit 60 controls first-stage integrator 51 ofADC 50. Second-stage integrator 53 andcomparator 55 can be implemented with general integrator and comparator. It is worth noting that second-stage integrator 53 can be plural serially-connected integrators to improve the resolution. -
FIG. 4 shows a detailed schematic view ofFIG. 3 .FIG. 4 shows the circuit of first-stage integrator 51. First-stage integrator 51 includes a DAC capacitor C3, an external compensation capacitor C4, an amplifier OP1, an integral capacitor CT, a first switch SW1, a second switch SW2, a third switch SW3, a fourth switch SW4, a fifth switch SW5, a sixth switch SW6, a seventh switch SW7, an eighth SW8 and a ninth switch SW9, where all the switches SW1-SW9 are controlled by a first switch signal φ1, a second switch signal φ2, a third switch signal φ3, a third inverted switch signal φ3B, a fourth switch signal φ4 and a fifth switch signal φ5 generated bytrigger unit 60, for performing charging and discharging on capacitor C1, stray capacitor C2, DAC capacitor C3 and external compensation capacitor C4, while using the integrator formed by amplifier OP1 and integral capacitor CT to perform integration to generate a first-stage integrator output voltage Vout1. - Bias voltage Vbias of
FIG. 4 is generated by a bias circuit (not shown), and first reference voltage V1, second reference voltage V2, third reference voltage V3, high level reference voltage VR+ and low level reference voltage VR− are generated by reference circuit (not shown), where third reference voltage V3 is higher than second reference voltage V2, second reference voltage V2 is higher than first reference voltage V1, and high level reference voltage VR+ is higher than low level reference voltage VR−. - Bias circuit and reference circuit can be implemented with general technology, such as Wilson current mirror or Widlar current source as the bias circuit, and breakdown diode with temperature compensation circuit or bandgap reference circuit as the reference circuit. It is worth noting that the present invention is not limited to any specific implementation of the bias circuit or the reference circuit. Any implementation able to provide required bias voltage and reference voltage is within the scope of the present invention. In addition,
trigger unit 60 is for generating the switch signals. Therefore,trigger unit 60 implemented by, such as, microprocessor with firmware or logic circuit, is also within the scope of the present invention. - DAC capacitor C3 uses high level reference voltage VR+ and low level reference voltage VR− to realize the DAC function. That is, when
comparator 55 outputs a bit “1”, third switch signal φ3 or fifth switch signal φ5 generated bytrigger unit 60 uses high level reference voltage VR+ to charge DAC capacitor C3. Whencomparator 55 outputs a bit “0”, third inverted switch signal φ3B or fourth switch signal φ5 generated bytrigger unit 60 uses low level reference voltage VR− to charge DAC capacitor C3. That is, the digital bit “1” is converted into analog high level reference voltage VR+ and digital bit “0” is converted into analog low level reference voltage VR−. - External compensation capacitor C4 is to compensate the parasitic capacitance, and can be implemented by using capacitor array and the internal circuit performing self-rectification of a plurality of bits, or using laser trimming or current trimming to perform the fine-tuning of a plurality of bits.
- The operation of direct capacitance-to-
digital converter 2 of the present invention includes a first operation and a second operation, where the first operation is for sensing the stray capacitance C2 and the second operation is to combine with the result of the first operation to perform conversion of the to-be-measured capacitor C1 so as to generate accurate digital signal. The following describes the first and the second operations. -
FIG. 5 shows a schematic view of the first operation of the first embodiment of the present invention. As shown inFIG. 5 , first switch signal φ1, second switch signal φ2, third switch signal φ3 and third inverted switch signal φ3B generated bytrigger unit 60 are used to control switches SW1-SW9. The following description also refers to the waveform ofFIG. 6 . InFIG. 6 , the operation waveforms of first switch signal φ1, second switch signal φ2, third switch signal φ3 and third inverted switch signal φ3B are divided into three steps, including reset operation, charge operation and integral operation for setting first end voltage VP1 of first end P1 to first reference voltage V1, third reference voltage V3 or second reference voltage V2. - In the reset operation, first switch signal φ1 is at high level, second switch signal φ2 and third switch signal φ3 are at low level, and third inverted switch signal φ3B is at high level. Therefore, first end P1 and second end P2 are connected to first reference voltage V1 to discharge capacitor C1 and the cross-over voltage is 0V, while stray capacitor C2 is also dicharged to 0V if select right voltage V1 (note, the symbol “ground” in the schematic is a reference ground, it can be any voltage).
- In the charge operation, second switch signal φ2 is at high level, first switch signal φ1 and third switch signal φ3 are at low level, and third inverted switch signal φ3B is at high level. Therefore, first end P1 and second end P2 are connected to third reference voltage V3 so that the cross-over voltage of capacitor C1 remains 0V, while stray capacitor C2 is charged from first reference voltage V1 to third reference voltage V3.
- In the integral operation, third switch signal φ3 is at high level, first switch signal φ1, second switch signal φ2 and third inverted switch signal φ3B are at low level. Therefore, first end P1 is connected to second reference voltage V2, and second end P2 is connected to inverted input end of amplifier OP1. The charge transfer to OP1 is C2*(V2−V3). In the mean time, DAC capacitor C3 is switched from high level reference voltage VR+ to low level reference voltage VR−. External compensation capacitor C4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP1. Amplifier OP1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout1 related to stray capacitor C2 at the output end of amplifier OP1.
- The total time for the reset operation and the charge operation is T1/2, and the time for integral operation is T1/2, where T1 is the first operation period.
-
FIG. 7 shows a schematic view of the second operation of the first embodiment of the present invention. As shown inFIG. 7 , fourth switch signal φ4 and fifth switch signal φ5 generated bytrigger unit 60 are used to control switches SW1-SW9. The following description also refers to the waveform ofFIG. 8 . InFIG. 8 , the operation waveforms of fourth switch signal φ4 and fifth switch signal φ5 are divided into two steps, including charge operation and integral operation. - In the charge operation, fourth switch signal φ4 is at high level, and fifth switch signal φ5 is at low level. Therefore, first end P1 of capacitor C1 is connected to second reference voltage V2, and second end P2 is connected to first reference voltage V1 so that the cross-over voltage of capacitor C1 is V1-V2. Stray capacitor C2 is charged to first reference voltage V1. (note, the ground symbol in the schematic is stand for reference ground level, it could be any voltage). First end of DAC capacitor C3 and first end of external compensation capacitor C4 are connected to second end P2 of capacitor C1. Second end of DAC capacitor C3 is connected to high level reference voltage VR+, and second end of external compensation capacitor C4 is connected to bias voltage Vbias. The time for charge operation is T2/2, where T2 is the second operation period.
- In the integral operation, fifth switch signal φ5 is at high level, and fourth switch signal φ4 is at low level. Therefore, first end P1 of capacitor C1 is connected to first reference voltage V1, and second end P2 is connected to inverted input end of amplifier OP1. In the mean time, DAC capacitor C3 is switched from high level reference voltage VR+ to low level reference voltage VR−. External compensation capacitor C4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP1. Amplifier OP1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout1 related to capacitor C1 at the output end of amplifier OP1. The time for integral operation is T2/2, and therefore the time for charge operation is the same as the time for integral operation.
- The accurate digital signals can be obtained through first integrator output voltage Vout1 generated by the aforementioned first and the second operations.
- Refer to
FIG. 9 . The first operation of the present invention can also have different order and voltage to achieve the identical result. - As shown in
FIG. 9 , first switch signal φ1, second switch signal φ2, third switch signal φ3 and third inverted switch signal φ3B generated bytrigger unit 60 are used to control switches SW1-SW9. The following description also refers to the waveform ofFIG. 10 . InFIG. 10 , the operation waveforms of first switch signal φ1, second switch signal φ2, third switch signal φ3 and third inverted switch signal φ3B are divided into two steps, including charge operation and integral operation. - In the charge operation, first switch signal φ1 is at high level, second switch signal φ2 and third switch signal φ3 are at low level, and third inverted switch signal φ3B is at high level. Therefore, first end P1 and second end P2 are connected to first reference voltage V1 to discharge capacitor C1 and the cross-over voltage is 0V, while stray capacitor C2 is charged to first reference voltage V1.
- In the integral operation, second switch signal φ2 and third switch signal φ3 are at high level, while first switch signal φ1 and third inverted switch signal φ3B are at low level. Therefore, first end P1 is connected to second reference voltage V2, and second end P2 is connected to inverted input end of amplifier OP1. In the mean time, DAC capacitor C3 is switched from high level reference voltage VR+ to low level reference voltage VR−. External compensation capacitor C4 is switched from bias voltage Vbias to high level reference voltage VR+ and the voltage difference is added to the inverted input end of amplifier OP1. Amplifier OP1 and integral capacitor CT perform integral operation on the signal at the inverted input end and generates a first integrator output voltage Vout1 related to stray capacitor C2 at the output end of amplifier OP1. Again, the “ground reference” symbol can be any voltage.
- The time for the charge operation is T1/2, and the time for integral operation is T1/2, where T1 is the first operation period.
-
FIG. 11 shows a schematic view of a second embodiment of the present invention. Compared to the first embodiment inFIG. 4 , the second embodiment of the present invention uses differential amplifier to replace the single-ended amplifier of the first embodiment. That is, a differential amplifier OP1D is used to replace amplifier OP1 ofFIG. 4 . In the mean time, inverted integration capacitor CT1 and non-inverted integration capacitor CT2 are used to replace integration capacitor CT ofFIG. 4 . In addition, the differential to-be-measure capacitor formed by inverted to-be-measured capacitor C1 a and non-inverted to-be-measured capacitor C1 b replaces to-be-measured capacitor C1, where the voltages at the two ends of inverted to-be-measured capacitor C1 a and non-inverted to-be-measured capacitor C1 b are controlled bytrigger unit 60. A differential stray capacitor formed by inverted stray capacitor C2 a and non-inverted stray capacitor C2 b replaces stray capacitor C2, a differential DAC capacitor formed by inverted DAC capacitor C3 a and non-inverted DAC capacitor C3 b replaces DAC capacitor C3, and a differential external compensation capacitor formed by inverted external compensation capacitor C4 a and non-inverted external compensation capacitor C4 b replaces external compensation capacitor C4. As the switch signals are the same as in the first embodiment and the overall operation of the circuit is identical, the description is omitted here. -
FIG. 12 shows a schematic view of the second-stage integrator and the comparator of the second embodiment of the present invention. As shown inFIG. 10 , the second-stage integrator of the second embodiment includes a differential amplifier OP2D, an inverted integration capacitor C7 a, and non-inverted integration capacitor C7 b. Comparator Comp is a differential comparator. Inverted DAC capacitor C6 a and non-inverted DAC capacitor C6 b are to realize the function of DAC, as DAC capacitor C3 of the first embodiment. Hence, combining the first-stage integrator ofFIG. 9 and the second-stage integrator and comparator ofFIG. 10 , the formed differential ADC has a better anti-noise capability and is applicable to the electrical environment difficult to rid of noise. - Although the present invention has been described with reference to the preferred embodiments, it will be understood that the invention is not limited to the details described thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (4)
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| US20140225759A1 (en) * | 2009-09-09 | 2014-08-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (mems), systems, and operating methods thereof |
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| US20140225759A1 (en) * | 2009-09-09 | 2014-08-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (mems), systems, and operating methods thereof |
| US9236877B2 (en) * | 2009-09-09 | 2016-01-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof |
| US20160118993A1 (en) * | 2009-09-09 | 2016-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (mems), apparatus, and operating methods thereof |
| US10014870B2 (en) * | 2009-09-09 | 2018-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro-electro-mechanical systems (MEMS), apparatus, and operating methods thereof |
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